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MCP98242T-BE/MNY

MCP98242T-BE/MNY

  • 厂商:

    ACTEL(微芯科技)

  • 封装:

    WFDFN8_EP

  • 描述:

    IC MEMORY MOD TEMP SENSOR 8-DFN

  • 数据手册
  • 价格&库存
MCP98242T-BE/MNY 数据手册
MCP98242 Memory Module Temperature Sensor w/EEPROM for SPD Features: Description: • • • • • • Microchip Technology Inc.’s MCP98242 digital temperature sensor converts temperature from -40°C and +125°C to a digital word. This sensor meets JEDEC Specification JC42.4 Mobile Platform Memory Module Thermal Sensor Component. It provides an accuracy of ±0.5°C/±1°C (typical/maximum) from +75°C to +95°C. In addition, this device has an internal 256 Byte EEPROM which can be used to store memory module and vendor information. Temperature Sensor + 256 Byte Serial EEPROM EEPROM for Serial Presence Detect (SPD) Optimized for Voltage Range: 3.0V to 3.6V Shutdown/Standby Current: 3 µA (maximum) 2-wire Interface: I2C™/SMBus Compatible Available Packages: DFN-8, TDFN-8, UDFN-8, TSSOP-8 Temperature Sensor Features: • Temperature-to-Digital Converter • Operating Current: 200 µA (typical) • Accuracy: - ±0.5°C/±1°C (typ./max.)  +75°C to +95°C - ±1°C/±2°C (typ./max.)  +40°C to +125°C - ±2°C/±3°C (typ./max.)  -20°C to +125°C Serial EEPROM Features: • Operating Current: - Write 1.1 mA (typical) for 3.5 ms (typical) - Read 100 µA (typical) • Permanent and Reversible Software Write-Protect • Software Write Protection for the Lower 128 Bytes • Organized as 1 Block of 256 Bytes (256x8) Typical Applications: • DIMM Modules • Laptops, Personal Computers and Servers • Hard Disk Drives and Other PC Peripherals The MCP98242 digital temperature sensor comes with user-programmable registers that provide flexibility for DIMM temperature-sensing applications. The registers allow user-selectable settings such as Shutdown or Low-Power modes and the specification of temperature event and critical output boundaries. When the temperature changes beyond the specified boundary limits, the MCP98242 outputs an Event signal. The user has the option of setting the Event output signal polarity as either an active-low or active-high comparator output for thermostat operation, or as a temperature event interrupt output for microprocessor-based systems. The Event output can also be configured as a critical temperature output. The EEPROM is designed specifically for DRAM DIMMs (Dual In-line Memory Modules) Serial Presence Detect (SPD). The lower 128 bytes (address 00h to 7Fh) can be Permanent Write-Protected (PWP) or Software Reversible Write-Protected (SWP). This allows DRAM vendor and product information to be stored and write-protected. The upper 128 bytes (address 80h to FFh) can be used for general purpose data storage. These addresses are not write-protected. This sensor has an industry standard 2-wire, I2C/ SMBus compatible serial interface, allowing up to eight devices to be controlled in a single serial bus. To maintain interchangeability with the I2C/SMBus interface the electrical specifications are specified with the operating voltage of 3.0V to 3.6V. In addition, a 40 ms (typical) time out is implemented. DIMM MODULE Memory MCP98242 Temperature Sensor + EEPROM • ±0.5°C (typ.) Sensor • 256 Byte EEPROM for SPD Package Types MCP98242 8-Pin DFN/TDFN/UDFN (2x3) * 8-Pin TSSOP SDA SCL Event 8 VDD 8 VDD A1 2 7 Event A1 2 6 SCLK A2 3 7 Event 5 SDA GND 4 5 SDA A2 3 3.3VDD_SPD A0 1 A0 1 GND 4 EP 9 6 SCLK * Includes Exposed Thermal Pad (EP); see Table 3-1.  2010 Microchip Technology Inc. DS21996D-page 1 MCP98242 Notes: DS21996D-page 2  2010 Microchip Technology Inc. MCP98242 1.0 ELECTRICAL CHARACTERISTICS †Notice: Stresses above those listed under “Maximum ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Absolute Maximum Ratings † VDD.................................................................................. 6.0V Voltage at all Input/Output pins ............... GND – 0.3V to 6.0V Pin A0 ................................................... GND – 0.3V to 12.5V Storage temperature .....................................-65°C to +150°C Ambient temp. with power applied ................-40°C to +125°C Junction Temperature (TJ) .......................................... +150°C ESD protection on all pins (HBM:MM) ................. (4 kV:300V) Latch-Up Current at each pin (+25°C) ..................... ±200 mA DC CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, VDD = 3.0V to 3.6V, GND = Ground, SDA/SCL pulled-up to VDD, and TA = -20°C to +125°C. Parameters Sym Min Typ Max Unit Conditions VDD 3.0 — 3.6 V Temperature Sensor IDD — 200 500 µA EEPROM Inactive EEPROM write IDD — 1100 2000 µA Sensor in Shutdown mode (for tWC) Power Supply Operating Voltage Operating Current IDD — 100 500 µA Sensor in Shutdown mode Shutdown Current EEPROM read ISHDN — 1 3 µA EEPROM Inactive, Sensor in Shutdown mode Power-on-Reset (POR) Threshold VPOR — 2.3 — V Temperature Sensor (VDD falling) VPOR — 1.6 — V EEPROM (VDD falling) (see Section 5.4 “Summary of Temperature Sensor Power-on Default”) Power Supply Rejection, °C/VDD — ±0.4 — °C/V °C/VDD — ±0.15 — °C +75°C < TA  +95°C TACY -1.0 ±0.5 +1.0 °C +40°C < TA  +125°C TACY -2.0 ±1 +2.0 °C -20°C < TA  +125°C TACY -3.0 ±2 +3.0 °C TA -40°C TACY — -2 — °C tCONV — 65 125 ms 15 s/sec (typical) (See Section 5.2.3.3 “Temperature Resolution”) High-level Current (leakage) IOH — — 1 µA VOH = VDD Low-level Voltage VOL — — 0.4 V IOL= 3 mA tWC — 3 5 ms — 1M — — VHI_WP 8 — 12 TA = +25°C VDD = 3.0V to 3.6V VDD = 3.3V+150 mVPP AC (0 to 1 MHz) Temperature Sensor Accuracy Conversion Time 0.25°C/bit Event Output (Open-drain) EEPROM Write Cycle (byte/page) Endurance TA = +25°C Write-Protect High Voltage — cycles VDD = 5V, Note 1 V Applied at A0 pin, Note 1 Thermal Response Note 1: Characterized but not production tested.  2010 Microchip Technology Inc. DS21996D-page 3 MCP98242 DC CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, VDD = 3.0V to 3.6V, GND = Ground, SDA/SCL pulled-up to VDD, and TA = -20°C to +125°C. Parameters Sym Min Typ Max Unit DFN tRES — 0.7 — s TSSOP tRES — 1.4 — s Note 1: Conditions Time to 63% (89°C) 25°C (Air) to 125°C (oil bath) Characterized but not production tested. INPUT/OUTPUT PIN DC CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, VDD = 3.0V to 3.6V, GND = Ground and TA = -20°C to +125°C. Parameters Sym Min Typ Max Units V Conditions Serial Input/Output (SCL, SDA, A0, A1, A2) Input High-level Voltage VIH 2.1 — — Low-level Voltage VIL — — 0.8 V Input Current IIN — — ±5 µA Low-level Voltage VOL — — 0.4 V IOL= 3 mA High-level Current (leakage) IOH — — 1 µA VOH = VDD Low-level Current IOL 6 — — mA VOL = 0.6V CIN — 5 — pF VHYST — 0.5 — V Output (SDA) Capacitance SDA and SCL Inputs Hysteresis Note: The serial inputs do not load the serial bus for VDD range of 1.8V to 5.5V. GRAPHICAL SYMBOL DESCRIPTION Voltage VDD INPUT OUTPUT VDD Voltage VIH VOL VIL IOL Current Current IIN IOH time time TEMPERATURE CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, VDD = 3.0V to 3.6V, GND = Ground. Parameters Sym Min Typ Max Units Conditions Temperature Ranges Specified Temperature Range TA -20 — +125 °C Operating Temperature Range TA -40 — +125 °C Storage Temperature Range TA -65 — +150 °C (Note 1) Thermal Package Resistances Note 1: Operation in this range must not cause TJ to exceed Maximum Junction Temperature (+150°C). DS21996D-page 4  2010 Microchip Technology Inc. MCP98242 TEMPERATURE CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, VDD = 3.0V to 3.6V, GND = Ground. Sym Min Typ Max Units Thermal Resistance, 8L-DFN Parameters JA — 84.5 — °C/W Thermal Resistance, 8L-TDFN JA — 41 — °C/W Thermal Resistance, 8L-TSSOP JA — 139 — °C/W Note 1: Conditions Operation in this range must not cause TJ to exceed Maximum Junction Temperature (+150°C). 0 SENSOR AND EEPROM SERIAL INTERFACE TIMING SPECIFICATIONS Electrical Specifications: Unless otherwise indicated, VDD = 3.0V to 3.6V, GND = Ground, TA = -20°C to +125°C, CL = 80 pF, and all limits measured to 50% point. Parameters Sym Min Typ Max Units Conditions fSC 10 — 100 kHz Low Clock tLOW 4.7 — — µs High Clock tHIGH 4.0 — — µs Rise Time tR — — 1000 ns (VIL MAX - 0.15V) to (VIH MIN + 0.15V) Fall Time tF — — 300 ns (VIH MIN + 0.15V) to (VIL MAX 0.15V) tSU-DATA 250 — — ns Data Hold After SCLK Low tH-DATA 300 — — ns Start Condition Setup Time tSU-START 4.7 — — µs Start Condition Hold Time tH-START 4.0 — — µs Stop Condition Setup Time tSU-STOP 4.0 — — µs Bus Idle tB_FREE 4.7 — — µs Time Out tOUT 25 40 50 ms 2-Wire I2C™/SMBus-Compatible Interface Serial Port Frequency Data Setup Before SCLK High I2C™/SMBus Temp. Sensor Only (characterized but not production tested) P EE TO -F R tB U -S tS W tL tH O IG H -S U Start Condition  2010 Microchip Technology Inc. AT A -D tH tS U -D AT A tO U T tR ,t F SD A SC LK tS tH -S TA R T TA RT TIMING DIAGRAM Data Transmission Stop Condition DS21996D-page 5 MCP98242 NOTES: DS21996D-page 6  2010 Microchip Technology Inc. MCP98242 2.0 TYPICAL PERFORMANCE CURVES Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Note: Unless otherwise indicated, VDD = 3.0V to 3.6V, GND = Ground, SDA/SCL pulled-up to VDD, and TA = -20°C to +125°C. 10000 2.0 1000 1.0 Spec. Limits 0.0 -1.0 EEPROM Write (Sensor in Shutdown Mode) 100 Sensor (EEPROM Inactive) 10 -2.0 EEPROM Read (Sensor in Shutdown Mode) 1 -3.0 -40 -20 0 20 FIGURE 2-1: Accuracy. 40 60 TA (°C) 80 100 -40 120 50% 0 20 30% 20% 10% 120 Supply Current vs. 2.00 1.50 1.00 1.00 0.75 0.50 0.25 0.00 -0.25 -0.50 -0.75 -1.00 0.00 -40 -20 0 20 Temperature Accuracy (°C) FIGURE 2-2: Temperature Accuracy Histogram, TA = +95°C. FIGURE 2-5: Temperature. 70% 80 100 120 Shutdown Current vs. 2.5 VPOR (V) 40% 30% 20% 2 1.5 1 1.00 0.75 0.50 0.25 0 0.00 0% -0.25 0.5 -0.50 10% -0.75 40 60 TA (°C ) 3 TA = +75°C VDD = 3.3V 221 units -1.00 Occurrences 100 0.50 0% 50% 80 VDD = 3.0V to 3.6V 2.50 40% 60% 40 60 TA (°C) 3.00 TA = +95°C VDD = 3.3V 221 units ISHDN (µA) 60% -20 FIGURE 2-4: Temperature. Average Temperature 70% Occurrences VDD = 3.3V to 3.6V VDD= 3.0V to 3.6V IDD (µA) Temperature Accuracy (°C) 3.0 Temperature Accuracy (°C) FIGURE 2-3: Temperature Accuracy Histogram, TA = +75°C.  2010 Microchip Technology Inc. -40 -20 0 20 40 60 TA (°C) 80 100 120 FIGURE 2-6: Power-on Reset Threshold Voltage vs. Temperature. DS21996D-page 7 MCP98242 Note: Unless otherwise indicated, VDD = 3.0V to 3.6V, GND = Ground, SDA/SCL pulled-up to VDD, and TA = -20°C to +125°C. 48 VDD = 3.0V to 3.6V IOL = 3 mA 0.3 0.2 SDA 0.1 30 24 18 6 -20 0 FIGURE 2-7: Temperature. 125 20 40 60 TA (°C) 80 100 Event and SDA VOL vs. VDD = 3.0V to 3.6V 110 95 80 65 50 35 -40 -20 0 FIGURE 2-8: Temperature. 20 40 60 TA (°C) 80 -20 0 FIGURE 2-10: 20 40 60 TA (°C) 80 100 120 SDA IOL vs. Temperature. 3.0 2.0 VDD = 3.0V VDD = 3.6V 1.0 Δ°C/ΔVDD = 0.4°C/V 0.0 -1.0 -2.0 -3.0 -40 100 120 -20 0 FIGURE 2-11: VDD. Conversion Rate vs. 20 40 60 TA (°C) 80 100 120 Temperature Accuracy vs. Δ°C/ΔVDD, VDD = 3.3V + 150 mVPP (AC) TA = +25°C 0.5 0.0 -0.5 No decoupling capacitor 100 100 1,000 1k 1k 10,000 10k 10k 100,000 100k 100k 1M 1M 1,000,000 Thermal Response (%) 120% 1.0 -1.0 -40 120 Temperature Accuracy (°C) -40 tCONV (ms) 36 12 Event 0 Normalized Temp. Error (°C) VDD = 3.0V to 3.6V VOL = 0.6V 42 SDA I OL (mA) Event & SDA V OL (V) 0.4 100% 80% 60% TSSOP-8 DFN-8 40% 20% 22°C (Air) to 125°C (Oil bath) 0% -2 0 Frequency (Hz) FIGURE 2-9: Frequency. DS21996D-page 8 Power Supply Rejection vs. FIGURE 2-12: Response. 2 4 6 8 Time (s) 10 12 14 16 Package Thermal  2010 Microchip Technology Inc. MCP98242 3.0 PIN DESCRIPTION The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLES DFN/TDFN/ UDFN TSSOP Symbol 1 1 A0 Slave Address 2 2 A1 Slave Address 3 3 A2 Slave Address 4 4 GND Ground 5 5 SDA Serial Data Line 6 6 SCLK Serial Clock Line 7 7 Event 8 8 VDD Power Pin 9 — EP Exposed Thermal Pad (EP); must be connected to VSS. 3.1 Pin Function Package Type 8-Pin TSSOP A1 2 8 VDD 7 Event A2 3 6 SCLK A0 1 GND 4 5 SDA Temperature Alert Output Address Pins (A2, A1, A0) 3.4 These pins are device address input pins. Serial Clock Line (SCLK) The address pins correspond to the Least Significant bits (LSb) of address bits. The Most Significant bits (MSb) (A6, A5, A4, A3). This is shown in Table 3-2. The SCLK is a clock input pin. All communication and timing is relative to the signal on this pin. The clock is generated by the host or master controller on the bus. (See Section 4.0 “Serial Communication”). TABLE 3-2: 3.5 Device MCP98242 ADDRESS BYTE Address Code A6 A5 A4 A3 Sensor 0 0 1 1 EEPROM 1 0 1 0 EEPROM Write-Protect 0 1 1 0 Note: 3.2 Slave Address A2 A1 A0 X X X User-selectable address is shown by X. Ground Pin (GND) Open-Drain Temperature Alert Output (Event) The MCP98242 Event pin is an open-drain output. The device outputs a signal when the ambient temperature goes beyond the user-programmed temperature limit. (see Section 5.2.3 “Event Output Configuration”). 3.6 Power Pin (VDD) VDD is the power pin. The operating voltage range, as specified in the DC electrical specification table, is applied on this pin. The GND pin is the system ground pin. 3.7 3.3 There is an internal electrical connection between the Exposed Thermal Pad (EP) and the GND pin; they must be connected to the same potential on the Printed Circuit Board (PCB). Serial Data Line (SDA) SDA is a bidirectional input/output pin, used to serially transmit data to/from the host controller. This pin requires a pull-up resistor. (See Section 4.0 “Serial Communication”).  2010 Microchip Technology Inc. Exposed Thermal Pad (EP) DS21996D-page 9 MCP98242 NOTES: DS21996D-page 10  2010 Microchip Technology Inc. MCP98242 4.0 SERIAL COMMUNICATION 4.1.1 4.1 2-Wire SMBus/Standard Mode I2C™ Protocol-Compatible Interface Data transfers are initiated by a Start condition (Start), followed by a 7-bit device address and a read/write bit. An Acknowledge (ACK) from the slave confirms the reception of each byte. Each access must be terminated by a Stop condition (Stop). The MCP98242 serial clock input (SCLK) and the bidirectional serial data line (SDA) form a 2-wire bidirectional SMBus/Standard mode I2C compatible communication port (refer to the Input/Output Pin DC Characteristics Table and Sensor And EEPROM Serial Interface Timing Specifications Table). The following bus protocol has been defined: TABLE 4-1: Term Master Slave MCP98242 SERIAL BUS PROTOCOL DESCRIPTIONS Description The device that controls the serial bus, typically a microcontroller. The device addressed by the master, such as the MCP98242. Transmitter Device sending data to the bus. Receiver Device receiving data from the bus. Start A unique signal from master to initiate serial interface with a slave. Stop A unique signal from the master to terminate serial interface from a slave. Read/Write A read or write to the MCP98242 registers. ACK A receiver Acknowledges (ACK) the reception of each byte by polling the bus. NAK A receiver Not-Acknowledges (NAK) or releases the bus to show End-of-Data (EOD). Busy Communication is not possible because the bus is in use. Not Busy The bus is in the Idle state, both SDA and SCLK remain high. Data Valid SDA must remain stable before SCLK becomes high in order for a data bit to be considered valid. During normal data transfers, SDA only changes state while SCLK is low.  2010 Microchip Technology Inc. DATA TRANSFER Repeated communication is initiated after tB-FREE. This device does not support sequential register read/ write. Each register needs to be addressed using the Register Pointer. This device supports the Receive Protocol. The register can be specified using the pointer for the initial read. Each repeated read or receive begins with a Start condition and address byte. The MCP98242 retains the previously selected register. Therefore, it outputs data from the previously-specified register (repeated pointer specification is not necessary). 4.1.2 MASTER/SLAVE The bus is controlled by a master device (typically a microcontroller) that controls the bus access and generates the Start and Stop conditions. The MCP98242 is a slave device and does not control other devices in the bus. Both master and slave devices can operate as either transmitter or receiver. However, the master device determines which mode is activated. 4.1.3 START/STOP CONDITION A high-to-low transition of the SDA line (while SCLK is high) is the Start condition. All data transfers must be preceded by a Start condition from the master. If a Start condition is generated during data transfer, the MCP98242 resets and accepts the new Start condition. A low-to-high transition of the SDA line (while SCLK is high) signifies a Stop condition. If a Stop condition is introduced during data transmission, the MCP98242 releases the bus. All data transfers are ended by a Stop condition from the master. 4.1.4 ADDRESS BYTE Following the Start condition, the host must transmit an 8-bit address byte to the MCP98242. The address for the MCP98242 Temperature Sensor is ‘0011,A2,A1,A0’ in binary, where the A2, A1 and A0 bits are set externally by connecting the corresponding pins to VDD ‘1’ or GND ‘0’. The 7-bit address transmitted in the serial bit stream must match the selected address for the MCP98242 to respond with an ACK. Bit 8 in the address byte is a read/write bit. Setting this bit to ‘1’ commands a read operation, while ‘0’ commands a write operation (see Figure 4-1). DS21996D-page 11 MCP98242 4.1.6 Address Byte 1 SCLK 2 0 SDA 0 3 1 4 5 6 7 8 9 A C K 1 A2 A1 A0 Start Address Code Slave Address R/W MCP98242 Response FIGURE 4-1: 4.1.5 Device Addressing. DATA VALID After the Start condition, each bit of data in transmission needs to be settled for a time specified by tSU-DATA before SCLK toggles from low-to-high (see “Sensor And EEPROM Serial Interface Timing Specifications” on Page 5). DS21996D-page 12 ACKNOWLEDGE (ACK) Each receiving device, when addressed, is obliged to generate an ACK bit after the reception of each byte. The master device must generate an extra clock pulse for ACK to be recognized. The acknowledging device pulls down the SDA line for tSU-DATA before the low-to-high transition of SCLK from the master. SDA also needs to remain pulled down for tH-DATA after a high-to-low transition of SCLK. During read, the master must signal an End-of-Data (EOD) to the slave by not generating an ACK bit (NAK) once the last bit has been clocked out of the slave. In this case, the slave will leave the data line released to enable the master to generate the Stop condition. 4.1.7 TIME OUT (MCP98242) If the SCLK stays low or high for time specified by tOUT, the MCP98242 temperature sensor resets the serial interface. This dictates the minimum clock speed as specified in the SMBus specification. However, the EEPROM does not reset the serial interface. Therefore, the master can hold the clock indefinitely to process data from the EEPROM.  2010 Microchip Technology Inc. MCP98242 5.0 FUNCTIONAL DESCRIPTION The MCP98242 temperature sensors consists of a band gap type temperature sensor, a Delta-Sigma Analog-to-Digital Converter ( ADC), user-programmable registers and a 2-wire I2C/SMBus protocol compatible serial interface. Figure 5-1 shows a block diagram of the register structure. Temperature Sensor EEPROM Hysteresis Shutdown Critical Trip Lock Alarm Win. Lock Bit HV Generator Clear Event Event Status Output Control WriteProtected Array (00h-7Fh) Critical Event only Event Polarity Event Comp/Int Band-Gap Temperature Sensor Address Decoder X Configuration Temperature  ADC Standard Array (80h-FFh) TUPPER TLOWER TCRIT Manufacturer ID 0.5°C/bit 0.25°C/bit 0.125°C/bit 0.0625°C/bit Memory Control Logic Device ID/Rev Resolution Write-Protect Circuitry Capability Selected Resolution Temp. Range Address Decoder Y Accuracy Output Feature Sense Amp R/W Control Register Pointer SMBus/Standard I2C™ Interface A0 A1 FIGURE 5-1: A2 Event SDA SCL VDD GND Functional Block Diagram.  2010 Microchip Technology Inc. DS21996D-page 13 MCP98242 5.1 Registers The MCP98242 has several registers that are user-accessible. These registers include the Capability register, Configuration register, Event Temperature Upper-Boundary and Lower-Boundary Trip registers, Critical Temperature Trip register, Temperature register, Manufacturer Identification register and Device Identification register. The Temperature register is read-only, used to access the ambient temperature data. The data is loaded in parallel to this register after tCONV. The Event Temperature Upper-Boundary and Lower-Boundary Trip registers are read/writes. If the ambient temperature drifts beyond the user-specified limits, the MCP98242 outputs a signal using the Event pin (refer to Section 5.2.3 “Event Output Configuration”). In addition, the Critical Temperature Trip register is used to provide an additional critical temperature limit. REGISTER 5-1: The Capability register is used to provide bits describing the MCP98242’s capability in measurement resolution, measurement range and device accuracy. The device Configuration register provides access to configure the MCP98242’s various features. These registers are described in further detail in the following sections. The registers are accessed by sending a Register Pointer to the MCP98242 using the serial interface. This is an 8-bit write-only pointer. However, the three Least Significant bits are used as pointers and all unused bits (bits 7-3) need to be cleared or set to ‘0’. Register 5-1 describes the pointer or the address of each register. REGISTER POINTER (WRITE ONLY) W-0 W-0 W-0 W-0 — — — — W-0 W-0 W-0 W-0 Pointer Bits bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-4 Writable Bits: Write ‘0’’ Bits 7-4 must always be cleared or written to ‘0’. This device has additional registers that are reserved for test and calibration. If these registers are accessed, the device may not perform according to the specification. bit 3-0 Pointer Bits: 0000 = Capability register 0001 = Configuration register (CONFIG) 0010 = Event Temperature Upper-Boundary Trip register (TUPPER) 0011 = Event Temperature Lower-Boundary Trip register (TLOWER) 0100 = Critical Temperature Trip register (TCRIT) 0101 = Temperature register (TA) 0110 = Manufacturer ID register 0111 = Device ID/Revision register 1000 = Resolution register 1XXX = Reserved DS21996D-page 14  2010 Microchip Technology Inc. MCP98242 TABLE 5-1: BIT ASSIGNMENT SUMMARY FOR ALL REGISTERS (SEE SECTION 5.4) Register Pointer (Hex) MSB/ LSB 7 6 5 4 0x00 MSB 0 0 0 0 LSB 0 0 0 0x01 Bit Assignment 3 0 Resolution MSB 0 0 0 0 0 LSB Crt Loc Win Loc Int Clr Evt Stat Evt Cnt 2 1 0 0 0 0 Range Accuracy Event Hysteresis SHDN Evt Sel Evt Pol Evt Pol 24°C MSB 0 0 0 SIGN 27°C 26°C 25°C LSB 23°C 22°C 21°C 20°C 2-1°C 2-2°C 0 0 0x03 MSB 0 0 0 SIGN 27°C 26°C 25°C 24°C LSB 23°C 22°C 21°C 20°C 2-1°C 2-2°C 0 0 0x04 MSB 0 0 0 SIGN 27°C 26°C 25°C 24°C LSB 23°C 22°C 21°C 20°C 2-1°C 2-2°C 0 0 0x05 MSB TA TCRIT TA TUPPER TA TLOWER SIGN 27°C 26°C 25°C 24°C LSB 23°C 22°C 21°C 20°C 2-1°C 2-2°C 0 0 0x06 MSB 0 0 0 0 0 0 0 0 LSB 0 1 0 1 0 1 0 0 0x07 MSB 0 0 1 0 0 0 0 0 LSB 0 0 0 0 0 0 0 1 0x08 LSB 0 0 0 0 0 0 0 1 0x02  2010 Microchip Technology Inc. DS21996D-page 15 MCP98242 5.1.1 CAPABILITY REGISTER This is a read-only register used to identify the temperature sensor capability. In this case, the MCP98242 is capable of providing temperature at 0.25°C resolution, measuring temperature below and above 0°C, providing ±1°C and ±2°C accuracy over the active and monitor temperature ranges (respectively) and providing user-programmable temperature event boundary trip limits. Register 5-2 describes the Capability register. These functions are described in further detail in the following sections. REGISTER 5-2: CAPABILITY REGISTER (READ-ONLY)  ADDRESS ‘0000 0000’b U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 15 bit 8 U-0 U-0 U-0 — — — R-0 R-1 Resolution R-1 R-1 R-1 Meas Range Accuracy Temp Alarm bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-5 Unimplemented: Read as ‘0’ bit 4-3 Resolution: 00 = 0.5°C 01 = 0.25°C (power-up default) 10 = 0.125°C 11 = 0.0625°C These bits reflect the selected resolution (see Section 5.2.3.3 “Temperature Resolution”) bit 2 Temperature Measurement Range (Meas. Range): 0 = TA 0 (decimal) for temperature below 0°C 1 = The part can measure temperature below 0°C (power-up default) bit 1 Accuracy: 0 = Accuracy ±2°C from +75°C to +95°C (Active Range) and ±3°C from +40°C to +125°C (Monitor Range) 1 = Accuracy ±1°C from +75°C to +95°C (Active Range) and ±2°C from +40°C to +125°C (Monitor Range) bit 0 Temperature Alarm: 0 = No defined function (This bit will never be cleared or set to ‘0’). 1 = The part has temperature boundary trip limits (TUPPER/TLOWER/TCRIT registers) and a temperautre event output (JC 42.4 required feature). DS21996D-page 16  2010 Microchip Technology Inc. MCP98242 1 2 3 4 5 6 7 8 0 0 1 1 A 2 A 1 A 0 W C K 1 2 3 4 5 6 7 8 0 0 0 0 0 0 0 0 SCLK SDA S A Address Byte A C K Capability Pointer MCP98242 MCP98242 1 2 3 4 5 6 7 8 1 2 3 4 5 6 7 8 0 0 1 1 A 2 A 1 A 0 R C 0 0 0 0 0 0 0 0 1 2 3 4 5 6 7 8 0 0 0 0 1 1 1 1 SCLK SDA S A K A C K MSB Data Address Byte MCP98242 N A P K LSB Data Master Master FIGURE 5-2: Timing Diagram for Reading the Capability Register (See Section 4.0 “Serial Communication”).  2010 Microchip Technology Inc. DS21996D-page 17 MCP98242 5.1.2 SENSOR CONFIGURATION REGISTER (CONFIG) The MCP98242 has a 16-bit Configuration register (CONFIG) that allows the user to set various functions for a robust temperature monitoring system. Bits 10 thru 0 are used to select Event output boundary hysteresis, device Shutdown or Low-Power mode, temperature boundary and critical temperature lock, temperature Event output enable/disable. In addition, the user can select the Event output condition (output set for TUPPER and TLOWER temperature boundary or TCRIT only), read Event output status and set Event output polarity and mode (Comparator Output or Interrupt Output mode). The Continuous Conversion or Shutdown mode is selected using bit 8. In Shutdown mode, the band gap temperature sensor circuit stops converting temperature and the Ambient Temperature register (TA) holds the previous successfully converted temperature data (see Section 5.2.1 “Shutdown Mode”). Bits 7 and 6 are used to lock the user-specified boundaries TUPPER, TLOWER and TCRIT to prevent an accidental rewrite. Bits 5 thru 0 are used to configure the temperature Event output pin. All functions are described in Register 5-3 (see Section 5.2.3 “Event Output Configuration”). The temperature hysteresis bits 10 and 9 can be used to prevent output chatter when the ambient temperature gradually changes beyond the user-specified temperature boundary (see Section 5.2.2 “Temperature Hysteresis (THYST)”. CONFIGURATION REGISTER (CONFIG)  ADDRESS ‘0000 0001’b REGISTER 5-3: U-0 U-0 U-0 U-0 U-0 — — — — — R/W-0 R/W-0 R/W-0 SHDN THYST bit 15 bit 8 R/W-0 R/W-0 R/W-0 R-0 R/W-0 R/W-0 R/W-0 R/W-0 Crit. Lock Win. Lock Int. Clear Event Stat. Event Cnt. Event Sel. Event Pol. Event Mod. bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 15-11 Unimplements: Read as ‘0’ bit 10-9 TUPPER and TLOWER Limit Hysteresis (THYST): 00 = 0°C (power-up default) 01 = 1.5°C 10 = 3.0°C 11 = 6.0°C x = Bit is unknown This bit cannot be altered when either of the lock bits are set (bit 6 and bit 7), refer to Section 5.2.3 “Event Output Configuration”. bit 8 Shutdown Mode (SHDN): 0 = Continuous Conversion (power-up default) 1 = Shutdown (Low-Power mode) In shutdown, all power-consuming activities are disabled, though all registers can be written to or read. This bit cannot be set ‘1’ when either of the lock bits is set (bit 6 and bit 7). However, it can be cleared ‘0’ for Continuous Conversion while locked. (Refer to Section 5.2.1 “Shutdown Mode”) DS21996D-page 18  2010 Microchip Technology Inc. MCP98242 REGISTER 5-3: bit 7 CONFIGURATION REGISTER (CONFIG)  ADDRESS ‘0000 0001’b TCRIT Lock Bit (Crit. Lock): 0 = Unlocked. TCRIT register can be written. (power-up default) 1 = Locked. TCRIT register cannot be written When enabled, this bit remains set ‘1’ or locked until cleared by internal Reset (Section 5.4 “Summary of Temperature Sensor Power-on Default”). This bit does not require a double-write. bit 6 TUPPER and TLOWER Window Lock Bit (Win. Lock): 0 = Unlocked. TUPPER and TLOWER registers can be written. (power-up default) 1 = Locked. TUPPER and TLOWER registers cannot be written When enabled, this bit remains set ‘1’ or locked until cleared by internal Reset (Section 5.4 “Summary of Temperature Sensor Power-on Default”). This bit does not require a double-write. bit 5 Interrupt Clear (Int. Clear) Bit: 0 = No effect (power-up default) 1 = Clear interrupt output. When read this bit returns ‘0’ bit 4 Event Output Status (Event Stat.) Bit: 0 = Event output is not asserted by the device (power-up default) 1 = Event output is asserted as a comparator/Interrupt or critical temperature output bit 3 Event Output Control (Event Cnt.) Bit: 0 = Disabled (power-up default) 1 = Enabled This bit cannot be altered when either of the lock bits is set (bit 6 and bit 7). bit 2 Event Output Select (Event Sel.) Bit: 0 = Event output for TUPPER, TLOWER and TCRIT (power-up default) 1 = TA > TCRIT only. (TUPPER and TLOWER temperature boundaries are disabled.) When the Alarm Window Lock bit is set, this bit cannot be altered until unlocked (bit 6). bit 1 Event Output Polarity (Event Pol.) Bit: 0 = Active-low (power-up default) 1 = Active-high This bit cannot be altered when either of the lock bits is set (bit 6 and bit 7). bit 0 Event Output Mode (Event Mod.) Bit: 0 = Comparator output (power-up default) 1 = Interrupt output This bit cannot be altered when either of the lock bits is set (bit 6 and bit 7).  2010 Microchip Technology Inc. DS21996D-page 19 MCP98242 • Writing to the CONFIG Register to Enable the Event Output pin b. 1 2 3 4 5 6 7 8 0 0 1 1 A 2 A 1 A 0 W C 1 2 3 4 5 6 7 8 0 0 0 0 0 0 0 1 SCLK SDA S A K Address Byte A C K Configuration Pointer MCP98242 MCP98242 1 2 3 4 5 6 7 8 0 0 0 0 0 0 0 0 A C K 1 2 3 4 5 6 7 8 0 0 0 0 1 0 0 0 MSB Data A C K P LSB Data MCP98242 MCP98242 • Reading the CONFIG Register. 1 2 3 4 5 6 7 8 1 2 3 4 5 6 7 8 Note: SCLK SDA S 0 0 1 A 2 1 A 1 A A 0 W C K Address Byte 0 0 0 0 0 0 0 It is not necessary to select the Register Pointer if it was set from the previous read/ write. A C K 1 Configuration Pointer MCP98242 MCP98242 1 2 3 4 5 6 7 8 0 0 1 1 A 2 A 1 A 0 R C 1 2 3 4 5 6 7 8 0 0 0 0 0 0 0 0 1 2 3 4 5 6 7 8 0 0 0 0 1 0 0 0 SCLK SDA S A K Address Byte A C K P LSB Data MSB Data MCP98242 N A K Master Master FIGURE 5-3: Timing Diagram for Writing and Reading from the Configuration Register (See Section 4.0 “Serial Communication”). DS21996D-page 20  2010 Microchip Technology Inc. MCP98242 5.1.3 UPPER/LOWER/CRITICAL TEMPERATURE LIMIT REGISTERS (TUPPER/TLOWER/TCRIT) The MCP98242 has a 16-bit read/write Event output Temperature Upper-Boundary Trip register (TUPPER), a 16-bit Lower-Boundary Trip register (TLOWER) and a 16-bit Critical Boundary Trip register (TCRIT) that contains 11-bit data in two’s complement format (0.25 °C). This data represents the maximum and minimum temperature boundary or temperature window that can be used to monitor ambient temperature. If this feature is enabled (Section 5.1.2 “Sensor Configuration Register (CONFIG)”) and the ambient temperature exceeds the specified boundary or window, the MCP98242 asserts an Event output. (Refer to Section 5.2.3 “Event Output Configuration”). REGISTER 5-4: U-0 UPPER/LOWER/CRITICAL TEMPERATURE LIMIT REGISTER (TUPPER/TLOWER/ TCRIT)  ADDRESS ‘0000 0010’b/‘0000 0011’b‘0000 0100’b U-0 — U-0 — — R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 Sign 27°C 26°C 25°C 24°C bit 15 bit 8 R/W-0 2 3°C R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0 U-0 22°C 21°C 20°C 2-1°C 2-2°C — — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 15-13 Unimplemented: Read as ‘0’ bit 12 Sign: 0 = TA 0°C 1 = TA  0°C bit 11-2 TUPPER/TLOWER/TCRIT: Temperature boundary trip data in two’s complement format. bit 1-0 Unimplemented: Read as ‘0’ Note: x = Bit is unknown This table shows two 16-bit registers for TUPPER, TLOWER and TCRIT located at ‘0000 0010b’, ‘0000 0011b’ and ‘0000 0100b’, respectively.  2010 Microchip Technology Inc. DS21996D-page 21 MCP98242 • Writing 90°C to the TUPPER Register b. 1 2 3 4 5 6 7 8 0 0 1 1 A 2 A 1 A 0 W C 1 2 3 4 5 6 7 8 0 0 0 0 0 0 1 0 SCLK SDA S A K Address Byte A C K TUPPER Pointer MCP98242 MCP98242 1 2 3 4 5 6 7 8 0 0 0 0 0 1 0 1 A C K 1 2 3 4 5 6 7 8 1 0 1 0 0 0 0 0 MSB Data A C K P LSB Data MCP98242 MCP98242 • Reading from the TUPPER Register. 1 2 3 4 5 6 7 8 1 2 3 4 5 6 7 8 Note: SCLK SDA S 0 0 1 1 A 2 A 1 A A 0 W C K 0 Address Byte 0 0 0 0 0 1 0 It is not necessary to select the Register Pointer if it was set from the previous read/write. A C K TUPPER Pointer MCP98242 MCP98242 1 2 3 4 5 6 7 8 0 0 1 1 A 2 A 1 A 0 R C 1 2 3 4 5 6 7 8 0 0 0 0 0 1 0 1 1 2 3 4 5 6 7 8 1 0 1 0 0 0 0 0 SCLK SDA S A K Address Byte A C K P LSB Data MSB Data MCP98242 N A K Master Master FIGURE 5-4: Timing Diagram for Writing and Reading from the TUPPER Register (See Section 4.0 “Serial Communication”). DS21996D-page 22  2010 Microchip Technology Inc. MCP98242 5.1.4 EQUATION 5-1: AMBIENT TEMPERATURE REGISTER (TA) The MCP98242 uses a band gap temperature sensor circuit to output analog voltage proportional to absolute temperature. An internal  ADC is used to convert the analog voltage to a digital word. The converter resolution is set to 0.25 °C + sign (11-bit data). The digital word is loaded to a 16-bit read-only Ambient Temperature register (TA) that contains 11-bit temperature data in two’s complement format. The TA register bits (bits 12 thru 0) are double-buffered. Therefore, the user can access the register while, in the background, the MCP98242 performs an analog-todigital conversion. The temperature data from the  ADC is loaded in parallel to the TA register at tCONV refresh rate. The TA magnitude in decimal to ambient temperature conversion is shown in Equation 5-1: DECIMAL CODE TO TEMPERATURE CONVERSION T A = Code  2 –4 Where: TA = Ambient Temperature (°C) Code = MCP98242 temperature output magnitude in decimal (bits 0-11) In addition, the TA register uses three bits (bits 15, 14 and 13) to reflect the Event pin state. This allows the user to identify the cause of the Event output trigger (see Section 5.2.3 “Event Output Configuration”); bit 15 is set to ‘1’ if TA is greater than or equal to TCRIT, bit 14 is set to ‘1’ if TA is greater than TUPPER and bit 13 is set to ‘1’ if TA is less than TLOWER. The TA register bit assignment and boundary conditions are described in Register 5-5. REGISTER 5-5: R-0 AMBIENT TEMPERATURE REGISTER (TA)  ADDRESS ‘0000 0101’b R-0 R-0 TA vs. TCRIT TA vs. TUPPER TA vs. TLOWER R-0 R-0 R-0 R-0 R-0 SIGN 27 °C 26 °C 25 °C 24 °C bit 15 bit 8 R-0 2 3 °C R-0 R-0 R-0 R-0 R-0 R-0 R-0 22 °C 21 °C 20 °C 2-1 °C 2-2 °C — — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 TA vs. TCRIT ( 1) Bit: 0 = TA TCRIT 1 = TA TCRIT bit 14 TA vs. TUPPER ( 1) Bit: 0 = TA TUPPER 1 = TA TUPPER bit 13 TA vs. TLOWER ( 1) Bit: 0 = TA TLOWER 1 = TA TLOWER bit 12 SIGN Bit: 0 = TA 0°C 1 = TA  0°C bit 11-2 Ambient Temperature (TA) Bits: 10-bit Ambient Temperature data in two’s complement format. bit 1-0 TA: Data in 2’s complement format. Depending on the status of the Resolution Register (Register 5-8), these bits may display 2-3°C (0.125°C) and 2-4°C (0.0625°C), respectively. Note 1: Not affected by the status of the Event output Configuration (bits 5 to 0 of CONFIG), Register 5-3.  2010 Microchip Technology Inc. DS21996D-page 23 MCP98242 1 2 3 4 5 6 7 8 1 2 3 4 5 6 7 8 Note: SCLK SDA S 0 0 1 A 2 1 A 1 A A 0 W C K 0 0 0 Address Byte 0 0 1 0 It is not necessary to select the Register Pointer if it was set from the previous read/ write. A C K 1 TA Pointer MCP98242 MCP98242 1 2 3 4 5 6 7 8 0 0 1 1 A 2 A 1 A 0 R C 1 2 3 4 5 6 7 8 0 0 0 0 0 0 0 1 1 2 3 4 5 6 7 8 1 0 0 1 0 1 0 0 SCLK SDA S A K Address Byte A C K P LSB Data MSB Data MCP98242 N A K Master Master FIGURE 5-5: Timing Diagram for Reading +25.25°C Temperature from the TA Register (See Section 4.0 “Serial Communication”). DS21996D-page 24  2010 Microchip Technology Inc. MCP98242 5.1.5 MANUFACTURER ID REGISTER This register is used to identify the manufacturer of the device in order to perform manufacturer specific operation. The Manufacturer ID for the MCP98242 is 0x0054 (hexadecimal). MANUFACTURER ID REGISTER (READ-ONLY)  ADDRESS ‘0000 0110’b REGISTER 5-6: R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 Manufacturer ID bit 15 bit 8 R-0 R-1 R-0 R-1 R-0 R-1 R-0 R-0 Manufacturer ID bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown Device Manufacturer Identification Number bit 15-0 . 1 2 3 4 5 6 7 8 0 0 1 1 A 2 A 1 A 0 W C K 1 2 3 4 5 6 7 8 0 0 0 0 0 1 1 0 Note: SCLK SDA S A Address Byte It is not necessary to select the Register Pointer if it was set from the previous read/ write. A C K Manuf. ID Pointer MCP98242 MCP98242 1 2 3 4 5 6 7 8 0 0 1 1 A 2 A 1 A 0 R C 1 2 3 4 5 6 7 8 0 0 0 0 0 0 0 0 1 2 3 4 5 6 7 8 0 1 0 1 0 1 0 0 SCLK SDA S A K Address Byte A C K P LSB Data MSB Data MCP98242 N A K Master Master FIGURE 5-6: Timing Diagram for Reading the Manufacturer ID Register (See Section 4.0 “Serial Communication”).  2010 Microchip Technology Inc. DS21996D-page 25 MCP98242 5.1.6 DEVICE ID AND REVISION REGISTER The upper byte of this register is used to specify the device identification and the lower byte is used to specify device revision. The device ID for the MCP98242 is 0x21 (hex). The revision begins with 0x00 (hex) for the first release, with the number being incremented as revised versions are released. DEVICE ID AND DEVICE REVISION (READ-ONLY)  ADDRESS ‘0000 0111’b REGISTER 5-7: R-0 R-0 R-1 R-0 R-0 R-0 R-0 R-0 Device ID bit 15 bit 8 R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-1 Device Revision bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 15-8 Device ID: Bit 15 to bit 8 are used for device ID bit 7-0 Device Revision: Bit 7 to bit 0 are used for device revision 1 2 3 4 5 6 7 8 1 2 3 4 5 6 7 x = Bit is unknown 8 Note: SCLK SDA S 0 0 1 1 A 2 A 1 A A 0 W C K 0 Address Byte 0 0 0 0 1 1 1 It is not necessary to select the Register Pointer if it was set from the previous read/ write. A C K Device ID Pointer MCP98242 MCP98242 1 2 3 4 5 6 7 8 0 0 1 1 A 2 A 1 A 0 R C 1 2 3 4 5 6 7 8 0 0 1 0 0 0 0 0 1 2 3 4 5 6 7 8 0 0 0 0 0 0 0 0 SCLK SDA S A K Address Byte A C K P LSB Data MSB Data MCP98242 N A K Master Master FIGURE 5-7: Timing Diagram for Reading Device ID and Device Revision Register (See Section 4.0 “Serial Communication”). DS21996D-page 26  2010 Microchip Technology Inc. MCP98242 5.1.7 RESOLUTION REGISTER This register allows the user to change the sensor resolution (see Section 5.2.3.3 “Temperature Resolution”). The POR default resolution is 0.25°C. The selected resolution is also reflected in the Capability register (see Register 5-2). RESOLUTION  ADDRESS ‘0000 1000’b REGISTER 5-8: U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — R/W-0 R/W-0 Resolution bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-2 Unimplemented: Read as ‘0’ bit 1-0 Resolution: 00 = LSB = 0.5°C (tCONV = 30 ms typical) 01 = LSB = 0.25°C (power-up default, tCONV = 65 ms typical) 10 = LSB = 0.125°C (tCONV = 130 ms typical) 11 = LSB = 0.0625°C (tCONV = 260 ms typical) 1 2 3 4 5 6 7 8 0 0 1 1 A 2 A 1 A 0 W C 1 2 3 4 5 6 7 8 0 0 0 0 1 0 0 0 1 2 3 4 5 6 7 8 0 0 0 0 0 0 1 1 SCLK SDA S Address Byte A K A C K Resolution Pointer MCP98242 A C K P Data MCP98242 MCP98242 FIGURE 5-8: Timing Diagram for Changing TA Resolution to 0.0625°C b (See Section 4.0 “Serial Communication”).  2010 Microchip Technology Inc. DS21996D-page 27 MCP98242 5.2 5.2.1 SENSOR FEATURE DESCRIPTION SHUTDOWN MODE Shutdown mode disables all power-consuming activities (including temperature sampling operations) while leaving the serial interface active. This mode is selected by setting bit 8 of CONFIG to ‘1’. In this mode, the device consumes ISHDN. It remains in this mode until bit 8 is cleared ‘0’ to enable Continuous Conversion mode, or until power is recycled. The Shutdown bit (bit 8) cannot be set to ‘1’ while bits 6 and 7 of CONFIG (Lock bits) are set to ‘1’. However, it can be cleared ‘0’ or returned to Continuous Conversion while locked. In Shutdown mode, all registers can be read or written. However, the serial bus activity increases the shutdown current. In addition, if the device is shutdown while the Event pin is asserted as active-low or deasserted active-low (see Section 5.2.3.1 “Comparator Mode”), the device will retain the active-low state. This increases the shutdown current due to the additional Event output pull-down current. 5.2.2 TEMPERATURE HYSTERESIS (THYST) A hysteresis of 0°C, 1.5°C, 3°C or 6°C can be selected for the TUPPER, TLOWER and TCRIT temperate boundaries using bits 10 and 9 of CONFIG. The hysteresis applies for decreasing temperature only (hot to cold), or as temperature drifts below the specified limit. The TUPPER, TLOWER and TCRIT boundary conditions are described graphically in Figure 5-2. 5.2.3 EVENT OUTPUT CONFIGURATION The Event output can be enabled using bit 3 of CONFIG (Event output control bit) and can be configured as either a comparator output or as Interrupt Output mode using bit 0 of CONFIG (Event mode). The polarity can also be specified as an active-high or active-low using bit 1 of CONFIG (Event polarity). When the ambient temperature increases above the critical temperature limit, the Event output is forced to a comparator output (regardless of bit 0 of CONFIG). When the temperature drifts below the critical temperature limit minus hysteresis, the Event output automatically returns to the state specified by bit 0 of CONFIG. The status of the Event output can be read using bit 4 of CONFIG (Event status). Bit 7 and 6 of the CONFIG register can be used to lock the TUPPER, TLOWER and TCRIT registers. The bits prevent false triggers at the Event output due to an accidental rewrite to these registers. DS21996D-page 28 The Event output can also be used as a critical temperature output using bit 2 of CONFIG (critical output only). When this feature is selected, the Event output becomes a comparator output. In this mode, the interrupt output configuration (bit 0 of CONFIG) is ignored. 5.2.3.1 Comparator Mode Comparator mode is selected using bit 0 of CONFIG. In this mode, the Event output is asserted as active-high or active-low using bit 1 of CONFIG. Figure 5-2 shows the conditions that toggle the Event output. If the device enters Shutdown mode with asserted Event output, the output remains asserted during Shutdown. The device must be operating in Continuous Conversion mode for tCONV; the TA vs. TUPPER, TLOWER and TCRIT boundary conditions need to be satisfied in order for the Event output to deassert. Comparator mode is useful for thermostat-type applications, such as turning on a cooling fan or triggering a system shutdown when the temperature exceeds a safe operating range. 5.2.3.2 Interrupt Mode In the Interrupt mode, the Event output is asserted as active-high or active-low (depending on the polarity configuration) when TA drifts above or below TUPPER and TLOWER limits. The output is deasserted by setting bit 5 (Interrupt Clear) of CONFIG. Note that when switching from Comparator mode to Interrupt mode, it is recommended to send interrupt clear command (set bit 5) to reset the interrupt flag. Shutting down the device will not reset or deassert the Event output. This mode cannot be selected when the Event output is used as critical temperature output only, using bit 2 of CONFIG. This mode is designed for interrupt driven microcontroller-based systems. The microcontroller receiving the interrupt will have to acknowledge the interrupt by setting bit 5 of CONFIG register from the MCP98242. 5.2.3.3 Temperature Resolution The MCP98242 is capable of providing a temperature data with 0.5°C to 0.0625°C resolution. The Resolution can be selected using the Resolution register (Register 5-8) which is located in address ‘00001000’b. This address location is not specified in JEDEC Standard JC42.4. However, it provides additional flexibility while being functionally compatible with JC42.4 and provide a 0.25°C resolution at 125 ms (maximum). The selected resolution can be read by user using bit 4 and bit 3 of the Capability register (Register 5-2). A 0.25°C resolution is set as POR default by factory.  2010 Microchip Technology Inc. MCP98242 TABLE 5-2: TEMPERATURE CONVERSION TIME Resolution tCONV (ms) Samples/sec (typical) 0.5°C 30 33 0.25°C (POR default) 65 15 0.125°C 130 8 0.0625°C 260 4 TCRIT - THYST TCRIT TUPPER - THYST TUPPER - THYST TUPPER TA TLOWER -THYST TLOWER TLOWER -THYST (Active-Low) Event Output Comparator Interrupt S/w Int. Clear Critical Only Note: 1 1 3 2 3 5 * 4 6 4 2 TA Bits Event Output Note Event Output Boundary Conditions Comparator Interrupt Critical 15 14 13 1 TA  TLOWER H L H 0 0 0 2 TA  TLOWER - THYST L L H 0 0 1 3 TA  TUPPER L L H 0 1 0 4 TA  TUPPER - THYST H L H 0 0 0 5 TA  TCRIT TA  TCRIT - THYST L L L 1 1 0 L H H 0 1 0 6 * FIGURE 5-9: When TA  TCRIT and TA  TCRIT - THYST the Event output is Comparator mode and bits 0 of CONFIG (Event output mode) is ignored. Event Output Condition.  2010 Microchip Technology Inc. DS21996D-page 29 MCP98242 5.3 EEPROM FEATURE DESCRIPTION 5.3.1 BYTE WRITE To write a byte in the MCP98242 EEPROM, the master has to specify the memory location or address. Once the address byte is transmitted correctly followed by a word address, the word address is stored in the EEPROM Address Pointer. The following byte is data to be stored in the specified memory location. Figure 5-10 shows the timing diagram. 1 2 3 4 5 6 7 8 1 0 1 0 A 2 A 1 A 0 W C 1 2 3 4 5 6 7 8 X X X X X X X X 1 2 3 4 5 6 7 8 X X X X X X X X SCLK SDA S A K Address Byte Word Address MCP98242 FIGURE 5-10: DS21996D-page 30 A C K A C K P Data MCP98242 MCP98242 Timing Diagram for Byte Write (See Section 4.0 “Serial Communication”).  2010 Microchip Technology Inc. MCP98242 5.3.2 PAGE WRITE Note: The write Address Byte, word address and the first data byte are transmitted to the MCP98242 in the same way as in a byte write. Instead of generating a Stop condition, the master transmits up to 15 additional data bytes to the MCP98242, which are temporarily stored in the on-chip page buffer and will be written into the memory after the master has transmitted a Stop condition. Upon receipt of each word, the four lower order Address Pointer bits are internally incremented by one. The higher order four bits of the word address remain constant. If the master should transmit more than 16 bytes prior to generating the Stop condition, the address counter will roll over and the previously received data will be overwritten. As with the byte write operation, once the Stop condition is received, an internal write cycle will begin (Figure 5-11). 1 2 3 4 5 6 7 8 1 0 1 0 A 2 A 1 A 0 W C Page write operations are limited to writing bytes within a single physical page, regardless of the number of bytes actually being written. Physical page boundaries start at addresses that are integer multiples of the page buffer size (or ‘page size’) and end at addresses that are integer multiples of [page size - 1]. If a Page Write command attempts to write across a physical page boundary, the result is that the data wraps around to the beginning of the current page (overwriting data previously stored there), instead of being written to the next page, as might be expected. It is therefore necessary for the application software to prevent page write operations that would attempt to cross a page boundary. 1 2 3 4 5 6 7 8 X X X X X X X X SCLK SDA S A K Address Byte Word Address (n) MCP98242 MCP98242 1 2 3 4 5 6 7 8 X X X X X X X X A C K 1 2 3 4 5 6 7 8 X X X X X X X X Data at (n) Note: FIGURE 5-11: A C K X Data at (n+1) MCP98242 A C K X X X X X A C K P Data at (n+15) MCP98242 MCP98242 ‘n’ is the initial address for a page. Timing Diagram for Page Write (See Section 4.0 “Serial Communication”).  2010 Microchip Technology Inc. DS21996D-page 31 MCP98242 5.3.3 WRITE PROTECTION To access write protection, the device address code of the Address Byte is set to ‘0110’ instead of ‘1010’. The ‘1010’ Address code is used to access the memory area and the ‘0110’ address code is used to access the write protection. Once the device is writeprotected it will not acknowledge certain commands. Table 5-3 shows the corresponding Address Bytes for the write-protect feature. The MCP98242 has a Software Write-Protect (SWP) feature that allows the lower half array (addresses 00h - 7Fh) to be write-protected or permanently write-protected (PWP). The write-protected area can be cleared by sending Clear Write-Protect (CWP) command. However, once the PWP is executed the protected memory can not be cleared. The device will not respond to the CWP command. TABLE 5-3: WRITE-PROTECT DEVICE ADDRESSING Address Pins EEPROM SWP Operation WRITE A2 A1 Address Byte A0 Address Code GND GND VHI_A0 0110 Slave Address A2 A1 A0 0 0 1 R/W 0 READ CWP WRITE 1 GND VDD VHI_A0 0110 0 1 1 0 READ PWP (Note) WRITE 1 X X X 0110 X X X 0 READ Note: 1 The address pins are ‘X’ or don’t cares. However, the slave address bits need to match the address pins. TABLE 5-4: DEVICE RESPONSE WHEN WRITING DATA OR ACCESSING SWP/CWP/PWP Status Command ACK Address ACK Data Byte ACK Write Cycle Not Protected SWP/CWP/PWP ACK X ACK X ACK Yes Page/byte write ACK Address ACK Data ACK Yes Protected with SWP SWP NoACK X NoACK X NoACK No Permanently Protected Note: CWP ACK X ACK X ACK Yes PWP ACK X ACK X ACK Yes Page/byte write lower 128 bytes ACK Address ACK Data NoACK No SWP/CWP/PWP NoACK X NoACK X NoACK No Page/byte write lower 128 bytes ACK Address ACK Data NoACK No X is defined as ‘don’t care’. DS21996D-page 32  2010 Microchip Technology Inc. MCP98242 5.3.3.1 Software Write-Protect (SWP) The Slave Address bits need to correspond to the address pin logic configuration. For SWP, a high voltage VHI_WP needs to be applied to the A0 pin and the corresponding slave address needs to be set to ‘1’, as shown in Table 5-3. Both A2 and A1 pins are grounded and the corresponding slave address bits are set to ‘0’. The SWP feature is invoked by writing to the write-protect register. This is done by sending an Address Byte similar to a normal Write command. Figure 5-14 shows the timing diagram. SWP can be cleared using the CWP command. See Section 5.3.3.2 “Clear Write-Protect (CWP)”. The device response in this mode is shown in Table 5-4 and Table 5-5. 1 2 3 4 5 6 7 8 0 1 1 0 0 0 1 W 1 2 3 4 5 6 7 8 X X X X X X X X 1 2 3 4 5 6 7 8 X X X X X X X X SCLK SDA S A C K Address Byte Word Address A C K P Data MCP98242 MCP98242 Note: A C K MCP98242 Apply VHI_WP at A0 pin and connect GND to A1 and A2 pins to initiate SWP cycle. FIGURE 5-12: Timing Diagram for Setting Software Write-Protect (See Section 4.0 “Serial Communication”). 5.3.3.2 The Slave Address bits need to correspond to the address pin logic configuration. For CWP, a high voltage VHI_WP needs to be applied to the A0 pin and the corresponding slave address needs to be set to ‘1’. The A1 pin is set to VDD and the corresponding slave address bit is set to ‘1’. And A2 pin is set to ground and the corresponding slave address bits are set to ‘0’. Table 5-3 shows the bit configuration. The device response in this mode is shown in Table 5-4 and Table 5-5. Clear Write-Protect (CWP) The CWP feature is invoked by writing to the clear write-protect register. This is done by sending an Address Byte similar to a normal Write command. Figure 5-14 shows the timing diagram. CWP clears SWP only. PWP can not be cleared using this command. 1 2 3 4 5 6 7 8 0 1 1 0 0 1 1 W 1 2 3 4 5 6 7 8 X X X X X X X X 1 2 3 4 5 6 7 8 X X X X X X X X SCLK SDA S A C K Address Byte Word Address MCP98242 Note: A C K A C K P Data MCP98242 MCP98242 Apply VHI_WP at A0 pin, apply VDD at A1 pin, connect A2 pin to GND to initiate CWP cycle. FIGURE 5-13: Timing Diagram for Setting Clear Write-Protect (See Section 4.0 “Serial Communication”).  2010 Microchip Technology Inc. DS21996D-page 33 MCP98242 5.3.3.3 PWP (Permanent Write-Protect) Note: Once the PWP register is written, the lower half of the memory will be permanent protected and the device will not acknowledge any command. The protected area of the memory can not be cleared, reversed, or re-written. If a write is attempted to the protected area, the device will acknowledge the address byte and word address but not the data byte. (See Table 5-4 and Table 5-5). 1 2 3 4 5 6 7 8 0 1 1 0 A 2 A 1 A 0 W C Once the Permanent Write-Protect is executed, it cannot be reversed, even if the device power is cycled. Unlike SWP and CWP, a VHI_WP is not applied on the A0 pin to execute PWP. The state of A2, A1, and A0 is user selectable. However, the address pin states need to match the slave address bits, as shown in Table 5-3. 1 2 3 4 5 6 7 8 X X X X X X X X 1 2 3 4 5 6 7 8 X X X X X X X X SCLK SDA S A K Address Byte Word Address MCP98242 Note: A C K A C K P Data MCP98242 MCP98242 Unlike SWP and CWP, a VHI_WP is not applied on the A0 pin to execute PWP. FIGURE 5-14: Timing Diagram for Setting Permanently Write-Protect (See Section 4.0 “Serial Communication”). DS21996D-page 34  2010 Microchip Technology Inc. MCP98242 5.3.4 READ OPERATION Read operations are initiated in the same way as write operations, with the exception that the R/W bit of the slave address is set to ‘1’. There are three basic types of read operations: current address read, random read, and sequential read. TABLE 5-5: DEVICE RESPONSE WHEN READING SWP/CWP/PWP Status Command ACK Address ACK Not Protected SWP/CWP/PWP ACK X NoACK X NoACK SWP NoACK X NoACK X NoACK Protected with SWP CWP ACK X NoACK X NoACK PWP ACK X NoACK X NoACK Permanently Protected SWP/CWP/PWP NoACK X NoACK X NoACK Note: X is defined as ‘don’t care’. 5.3.4.1 Current Address Read Data Byte ACK The MCP98242 contains an address counter that maintains the address of the last word accessed, internally incremented by ‘1’. Therefore, if the previous access (either a read or write operation) was to address n, the next current address read operation would access data from address n+1. Upon receipt of the slave address with R/W bit set to ‘1’, the MCP98242 issues an Acknowledge and transmits the 8-bit data word. The master will not acknowledge (NAK) the transfer but does generate a Stop condition and the MCP98242 discontinues transmission (Figure 5-15). 1 2 3 4 5 6 7 8 1 0 1 0 A 2 A 1 A 0 R C 1 2 3 4 5 6 7 8 0 0 0 0 0 0 0 0 SCLK SDA S Address Byte A K FIGURE 5-15: P Current Word Address MCP98242 Note: N A K Master In this example, the current word address is the previously accessed address location n plus 1. Reading Current Word Address (See Section 4.0 “Serial Communication”).  2010 Microchip Technology Inc. DS21996D-page 35 MCP98242 5.3.4.2 Random Read Random read operations allow the master to access any memory location in a random manner. To perform this type of read operation, the word address must first be set. This is done by sending the word address to the MCP98242 as part of a write operation. Once the word address is sent, the master generates a Start condition following the Acknowledge. This terminates the write operation, but not before the internal Address Pointer is set. The master then issues the Address Byte again, but with the R/W bit set to a ‘1’. The MCP98242 then issues an Acknowledge and transmits the 8-bit data word. The master will not acknowledge the transfer but does generate a Stop condition and the MCP98242 discontinues transmission (Figure 5-16). 1 2 3 4 5 6 7 8 1 0 1 0 A 2 A 1 A 0 W C K 1 2 3 4 5 6 7 8 0 0 0 0 0 0 0 0 SCLK SDA S A Address Byte A C K Word Address (n) MCP98242 MCP98242 1 2 3 4 5 6 7 8 1 0 1 0 A 2 A 1 A 0 R C 1 2 3 4 5 6 7 8 X X X X X X X X SCLK SDA S A K Address Byte P Data at (n) MCP98242 Note: N A K Master In this example, ‘n’ is the current Address Word which ‘00’h and the data is the byte at address ‘n’. FIGURE 5-16: DS21996D-page 36 Timing Diagram for Random Read (See Section 4.0 “Serial Communication”).  2010 Microchip Technology Inc. MCP98242 5.3.4.3 Sequential Read To provide sequential reads, the MCP98242 contains an internal Address Pointer, which is incremented by one at the completion of each operation. This Address Pointer allows the entire memory contents to be serially read during one operation. Sequential reads are initiated in the same way as a random read, with the exception that after the MCP98242 transmits the first data byte, the master issues an Acknowledge, as opposed to a Stop condition in a random read. This directs the MCP98242 to transmit the next sequentially addressed 8-bit word (Figure 5-17). 1 2 3 4 5 6 7 8 1 0 1 0 A 2 A 1 A 0 R 1 2 3 4 5 6 7 8 X X X X X X X X SCLK SDA S A C K Data (n)1 Address Byte MCP98242 MCP98242 1 2 3 4 5 6 7 8 X X X X X X X X A C K A C K 1 2 3 4 5 6 7 8 X X X X X X X X Data at (n+1) A C K X X X X X N A K P Data at (n+m)(1) Data at (n+2) MCP98242 X MCP98242 Master Note 1: ‘n’ is the initial address location and ‘m’ is the final address location (‘n+m’ < 256). FIGURE 5-17: 5.3.5 Timing Diagram for Sequential Read (See Section 4.0 “Serial Communication”). STANDBY MODE The design will incorporate a low-power Standby mode (ISHDN). Standby mode will be entered after a normal termination of any operation and after all internal functions are complete. This would include any error conditions occurring, such as improper number of clock cycles or improper instruction byte as defined previously.  2010 Microchip Technology Inc. DS21996D-page 37 MCP98242 5.4 Summary of Temperature Sensor Power-on Default The MCP98242 temperature sensor has an internal Power-on Reset (POR) circuit. If the power supply voltage VDD glitches down to the VPOR threshold, the device resets the registers to the power-on default settings. Table 5-6 shows the power-on default summary. TABLE 5-6: POWER-ON DEFAULTS Registers Address (Hexadecimal) 0x00 Register Label Capability Default Register Data (Hexadecimal) Power-up Default Register Description 0x000F 0.25° Measures temperature below 0°C ±1°C accuracy over active range Temperature event output 0x01 CONFIG 0x0000 Comparator mode Active-Low output Event and critical output Output disabled Event not asserted Interrupt cleared Event limits unlocked Critical limit unlocked Continuous conversion 0°C Hysteresis 0x02 TUPPER 0x0000 0°C 0x03 TLOWER 0x0000 0°C 0x04 TCRIT 0x0000 0°C 0x05 TA 0x0000 0°C 0x06 Manufacturer ID 0x0054 0x0054 (hex) 0x07 Device ID/ Device Revision 0x2001 0x2001 (hex) 0x08 Resolution 0x01 0x01 (hex) DS21996D-page 38  2010 Microchip Technology Inc. MCP98242 6.0 APPLICATIONS INFORMATION 6.1 Connecting to the Serial Bus The SDA and SCLK serial interface pins are open-drain pins that require pull-up resistors. This configuration is shown in Figure 6-1. Microcontroller VDD R R FIGURE 6-1: Interface. Layout Considerations The MCP98242 does not require any additional components besides the master controller in order to measure temperature. However, it is recommended that a decoupling capacitor of 0.1 µF to 1 µF be used between the VDD and GND pins. A high-frequency ceramic capacitor is recommended. It is necessary for the capacitor to be located as close as possible to the power and ground pins of the device in order to provide effective noise protection. MCP98242 6.3 SDA SCLK Event A potential for self-heating errors can exist if the MCP98242 SDA, SCLK and Event lines are heavily loaded with pull-ups (high current). Typically, the self-heating error is negligible because of the relatively small current consumption of the MCP98242. A temperature accuracy error of approximately 0.5°C could result from self-heating if the communication pins sink/source the maximum current specified. R Master 6.2 Slave Pull-up Resistors On Serial The number of devices connected to the bus is limited only by the maximum rise and fall times of the SDA and SCLK lines. Unlike I2C specifications, SMBus does not specify a maximum bus capacitance value. Rather, the SMBus specification requires that the maximum current through the pull-up resistor be 350 µA and minimum 100 µA. Because of this, the value of the pull-up resistors will vary depending on the system’s bias voltage (VDD). The pull-up resistor values for a 3.3 V system ranges 9 k to 33 k. Minimizing bus capacitance is still very important as it directly affects the rise and fall times of the SDA and SCLK lines. Although SMBus specifications only require the SDA and SCLK lines to pull-down 350 µA, with a maximum voltage drop of 0.4 V, the MCP98242 is designed to meet a maximum voltage drop of 0.4 V, with 3 mA of current. This allows lower pull-up resistor values to be used, allowing the MCP98242 to handle higher bus capacitance. In such applications, all devices on the bus must meet the same pull-down current requirements. A possible configuration using multiple devices on the SMBus is shown in Figure 6-2. Thermal Considerations For example, if the Event output is loaded to maximum IOL, Equation 6-1 can be used to determine the effect of self-heating. EQUATION 6-1: EFFECT OF SELF-HEATING T  =  JA  V DD  I DD + V OL_Event  I OL_Event + V OL_SDA  I OL_SDA  Where: T = TJ - TA TJ = Junction Temperature TA = Ambient Temperature JA = Package Thermal Resistance VOL_Event, SDA = Event and SDA Output VOL (0.4 Vmax) IOL_Event, SDA = Event and SDA Output IOL (3 mAmax) At room temperature (TA = +25°C) with maximum IDD = 500 µA and VDD = 3.6V, the self-heating due to power dissipation T is 0.2°C for the DFN-8 package and 0.5°C for the TSSOP-8 package. SDA SCLK MCP98242 24LCS52 Temperature Sensor FIGURE 6-2: SMBus. EEPROM Multiple Devices on DIMM  2010 Microchip Technology Inc. DS21996D-page 39 MCP98242 NOTES: DS21996D-page 40  2010 Microchip Technology Inc. MCP98242 7.0 PACKAGING INFORMATION 7.1 Package Marking Information 8-Lead DFN (MC) ABJ 010 25 XXX YWW NN 8-Lead TDFN (MNY) Example: ABX 010 25 XXX YWW NN 8-Lead UDFN (MUY) Example: ABX 010 25 XXX YWW NN 8-Lead TSSOP (ST) Example: XXXX 242B YYWW E010 NNN 256 Legend: XX...X Y YY WW NNN e3 * Note: Example: Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information.  2010 Microchip Technology Inc. DS21996D-page 41 MCP98242        !""#$%&  ' 2% & %! % * " ) '   %   *   $ % % " % %% 133)))& &3 *  e D b N N L K E2 E EXPOSED PAD NOTE 1 NOTE 1 2 1 1 2 D2 BOTTOM VIEW TOP VIEW A A3 A1 NOTE 2 4% &  5&% 6!&( $ 55,, 6 6 67 8 9 % 7  :  %  9   % "$$    . 0% %* + ,2 7  5  %  /0 7  ;"% , ,#  " "5  %  + < ,#  " ";"% , . < . (  . + 0% %5  % 5 +  . 0% % % ,#  " " =  < < 0% %;"% ./0 +/0 ..   '   ! " #$ %! &  '(!%&! %(  % ")%%  % "     * &    &  #  "% (   % "  +  *   )  ! % "  &    "%    ,-. /01 / &    %  # % !  ))%!%%    ,21  $   &  '! ! )%!%%   '$$& % !        ) 0 +0 DS21996D-page 42  2010 Microchip Technology Inc. MCP98242        !""#$%&  ' 2% & %! % * " ) '   %   *   $ % % " % %% 133)))& &3 *   2010 Microchip Technology Inc. DS21996D-page 43 MCP98242 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS21996D-page 44  2010 Microchip Technology Inc. MCP98242 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2010 Microchip Technology Inc. DS21996D-page 45 MCP98242        ()""#$%*&  ' 2% & %! % * " ) '   %   *   $ % % " % %% 133)))& &3 *  DS21996D-page 46  2010 Microchip Technology Inc. MCP98242       + )""#$%+&  ' 2% & %! % * " ) '   %   *   $ % % " % %% 133)))& &3 *   2010 Microchip Technology Inc. DS21996D-page 47 MCP98242       + )""#$%+&  ' 2% & %! % * " ) '   %   *   $ % % " % %% 133)))& &3 *  DS21996D-page 48  2010 Microchip Technology Inc. MCP98242   *, -.,/ -." 0 -.*1 1""#$%*..0 &  ' 2% & %! % * " ) '   %   *   $ % % " % %% 133)))& &3 *  D N E E1 NOTE 1 1 2 b e c A φ A2 A1 L L1 4% &  5&% 6!&( $ 55,, 6 6 67 8 9 % 7  :  %  < O./0 < " " * *  9  . % "$$  . < .  7  ;"% , " " * ;"% , + O/0  " " * 5  %   + + 2%5  % 5 . O . 2% % 5 . ,2 2%   Q < 9Q 5 "*   <  5 ";"% (  < +   '   ! " #$ %! &  '(!%&! %(  % ")%%  % "    &    ","%!" &"$  %!  "$  %!    % # ".&&  "  + &    "%    ,-. /01 / &    %  # % !  ))%!%%    ,21  $   &  '! ! )%!%%   '$$& % !        ) 0 9O/  2010 Microchip Technology Inc. DS21996D-page 49 MCP98242 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS21996D-page 50  2010 Microchip Technology Inc. MCP98242 APPENDIX A: REVISION HISTORY Revision D (October 2010) The following is the list of modifications: 1. Added the UDFN package. Revision C (July 2009) The following is the list of modifications: 1. 2. 3. 4. 5. 6. 7. Updated the DFN/TDFN package throughout document. Updated Table 5-1 and Table 5-6. Updated Register 5-3, Register 5-5, Register 57 and Register 5-8. Updated Section 5.1.6 “Device ID and Revision Register”. Added Section 5.2.3.2 “Interrupt Mode”. Updated Figure 5-9. Section 7.0 “Packaging Information”: Updated package outline drawings. Revision B (February 2008) The following is the list of modifications: 1. Added TDFN package throughout document. Revision A (September 2006) • Original Release of this Document.  2010 Microchip Technology Inc. DS21996D-page 51 MCP98242 NOTES: DS21996D-page 52  2010 Microchip Technology Inc. MCP98242 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. –X X /XXX Device Grade Temperature Range Package Device: MCP98242: Digital Temperature Sensor MCP98242T: Digital Temperature Sensor (Tape and Reel) Grade: B B B = ±1°C (max.) from +75°C to +95°C, ±2°C (max.) from +40°C to +125°C, and ±3°C (max.) from -20°C to +125°C Temperature Range: E = -40°C to +125°C Package: MC = Dual Flat No Lead (2x3 mm Body), 8-lead, MCBAC(1) = Dual Flat No Lead (2x3 mm Body), 8-lead, MUY(2) = Dual Flat No Lead (2x3 mm Body), 8-lead, MNY(2) = Dual Flat No Lead (2x3 mm Body), 8-lead, MNYBAC(1,2) = Dual Flat No Lead (2x3 mm Body), 8-lead, ST = Plastic Thin Shrink Small Outline (4x4 mm Body), 8-lead Examples: a) b) c) d) Note 1: “Y” is Nickel Palladium Gold manufacturing designator. Only available on the TDFN and UDFN packages for this family of products. 2: “BAC” is a non-standard reel manufacturing designator. It designates parts in 8 mm wide by 4 mm wide pitch (Tape and Reel) on a 13 inch reel with 11k base quantity.  2010 Microchip Technology Inc. e) f) MCP98242-BE/MC: Extended Temp., 8LD DFN pkg. MCP98242T-BE/MC: Tape and Reel, Extended Temp., 8LD DFN pkg. MCP98242-BE/ST: Extended Temp., 8LD TSSOP pkg. MCP98242T-BE/ST: Tape and Reel, Extended Temp., 8LD TSSOP pkg. MCP98242-BE/MNY: Extended Temp., 8LD TDFN (nickel palladium gold) pkg. MCP98242-BE/MUY: Extended Temp., 8LD UDFN (nickel palladium gold) pkg. DS21996D-page 53 MCP98242 NOTES: DS21996D-page 54  2010 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2010, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 978-1-60932-688-3 Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.  2010 Microchip Technology Inc. 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