MD1711
High-Speed Integrated Ultrasound Driver IC
Features
General Description
•
•
•
•
•
•
•
•
•
•
The MD1711 is a two-channel logic controller circuit
with low-impedance MOSFET gate drivers. It is
intended to be used with external FETs as a five-level
high-voltage and high-speed transmitter. The MD1711
is designed for medical ultrasound imaging
applications but can also be used for metal flaw
detection, NDT and for driving piezoelectric
transducers.
Drives Two Ultrasound Transducer Channels
Generates a Five-Level Waveform
Drives 12 High-Voltage MOSFETs
±2A Source-and-Sink Peak Currents
Up to 20 MHz Output Frequency
12 V/ns Slew Rate
±3 ns Matched Delay Times
Less than –40 dB Second Harmonic
Two Separate Gate Drive Voltages
1.8V to 3.3V CMOS Logic Interface
Applications
•
•
•
•
•
Medical Ultrasound Imaging
Piezoelectric Transducer Drivers
Non-Destructive Testing (NDT)
Metal Flaw Detection
Sonar Transmitter
The MD1711 has two sets of control logic inputs, one
for Channel A and one for Channel B. Each channel
consists of three pairs of MOSFET gate drivers. These
drivers are designed to match the drive requirements of
the TC6320. One MD1711 drives six TC6320s. Each
driver consists of an N-channel and a P-channel
MOSFET. They are designed to have the same
impedance and can provide peak currents of 2 amps.
Package Types
48-lead LQFP
(Top view)
48-lead QFN
(Top view)
48
1
48
1
See Table 2-1 for pin information.
2019 Microchip Technology Inc.
DS20005740A-page 1
MD1711
Functional Block Diagram
+100V
1.0µF
DV DD 2
10nF
DVDD1
DV DD 2
DVDD2
10nF
-100V
AVDD1
1.0µF
+100V
DV DD 1
Piezoelectric
Transducer A
1.0µF
10nF
DV DD 1
POSA/POS1A
10nF
-100V
NEGA/NEG1A
1.0µF
HVEN1A/POS2A
HVEN2A/NEG2A
CLAMPA
VSS
DV DD 1
VLL
SEL
EN
Control
Logic
and
Level
Translate
+100V
1.0µF
DV DD 2
10nF
DV DD 2
POSB/POS1B
10nF
-100V
NEGB/NEG1B
1.0µF
HVEN1B/POS2B
HVEN2B/NEG2B
+100V
DV DD 1
Piezoelectric
Transducer B
1.0µF
CLAMP
10nF
DV DD 1
10nF
-100V
1.0µF
AVSS
DVSS
AGND
DGND
VSS
DV DD 1
MD1711
DS20005740A-page 2
TC6320
2019 Microchip Technology Inc.
MD1711
Typical Application Circuit
+10V
+5.0V
0.22µF
0.22µF
+10V
-10V
0.22µF
+10V
0.22µF
40
33
35
45
43
DVDD2 DVDD2 DGND DVDD1 DVSS
DGND
FB
6
36
SEL
POSA / POS1A
HVEN1A / POS2A
ClampA
+3.3V
Control Logic
& Level
Translator
1
3
HVEN2A / NEG2A
OUTPA1
39
47
2
VPP1
1µF
DVDD2
13
NEGA / NEG1A
+100V
DVDD1 DVDD1 30
DGND
AVDD1
0.1µF
EN
0.22µF
31
42
10nF
DVDD2
OUTNA1
37
10nF
VNN1
1µF
-100V
+50V
VPP2
4
1µF
DVDD1
5
46
OUTPA2
MD1711
VLL
41
(1/2 of I/O)
0.1µF
OUTNA2
34
48
10nF
DVDD1
10nF
VNN2
AVSS
-50V
0.1µF
1µF
Transducer
0V
0.1µF
14
15
AVSS
SUB
OUTPA3
AVSS
44
VSS
DVDD1
OUTNA3
32
-10V
AGND
DGND
DVDD1 DVSS DVDD2 DVDD1 DGND DVDD2
18
7
19
16
21
28
0
26
TC6320
0.22µF
+10V
2019 Microchip Technology Inc.
0V
25
0
-10V
+10V
+5.0V
DS20005740A-page 3
MD1711
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings†
Logic Supply Voltage, VLL ....................................................................................................................... –0.5V to +5.5V
Positive Gate Drive Supply, AVDD1, DVDD1, DVDD2 ..................................................................................–0.5V to +15V
Negative Gate Drive Supply, AVSS, DVSS .................................................................................................–15V to +0.5V
Operating Junction Temperature, TJ ........................................................................................................ 0°C to +125°C
Storage Temperature, TS ..................................................................................................................... –65°C to +150°C
Power Dissipation (48-lead LQFP) ....................................................................................................................... 1.92W
Power Dissipation (48-lead QFN) ......................................................................................................................... 5.55W
† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only, and functional operation of the device at those or any other conditions above those
indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for
extended periods may affect device reliability.
OPERATING SUPPLY VOLTAGES AND CURRENTS
Electrical Specifications: Over operating conditions unless otherwise specified, AVDD1 = DVDD1 = DVDD2 = 10V,
AVSS = DVSS = –10V, VLL = 3.3V, TA = 25°C.
Parameter
Sym.
Min.
Typ.
VLL
1.8
3.3
5
V
Positive Drive Bias Supply
AVDD1
8
10
12.6
V
Positive Gate Drive Supply
DVDD1
4.75
—
12.6
V
Positive Gate Drive Supply
DVDD2
4.75
—
12.6
V
Logic Supply
Max.
Unit
Conditions
AVSS, DVSS
–12
–10
–8
V
Logic Supply Current
IVLL
—
2
—
mA
Positive Bias Current
IAVDD1
—
5
—
mA
IAVSS, IDVSS
—
20
—
All channels on at 5 MHz,
mA no load
Positive Drive Current 1
IDVDD1
—
55
—
mA
Positive Drive Current 2
IDVDD2
—
13
—
mA
VAVDD1 Quiescent Current
IAVDD1Q
—
2
—
mA
Negative Gate Drive and Bias Supply
Negative Drive and Bias Supply
Currents
VAVSS Quiescent Current
IAVSSQ
—
0.75
—
mA
VDVDD1 Quiescent Current
IDVDD1Q
—
—
10
µA
VDVDD2 Quiescent Current
IDVDD2Q
—
—
10
µA
IVLLQ
—
1
—
mA
Logic Supply Current
DS20005740A-page 4
All channels on at 5 MHz,
DVDD2 = 5V, no load
EN = low, all inputs low or
high
2019 Microchip Technology Inc.
MD1711
DC ELECTRICAL CHARACTERISTICS
Electrical Specifications: Over operating conditions unless otherwise specified, AVDD1 = DVDD1 = DVDD2 = 10V,
AVSS = DVSS = –10V, VLL = 3.3V, TA = 0°C to 70°C.
Parameter
Sym.
Min.
Typ.
Max.
Unit
Conditions
—
6
Ω
ISINK = 100 mA
P-CHANNEL AND N-CHANNEL GATE DRIVER OUTPUTS
Output Sink Resistance
Output Source resistance
Peak Output Sink Current
Peak Output Source Current
P-Channel
N-Channel
P-Channel
N-Channel
P-Channel
N-Channel
P-Channel
N-Channel
RSINK
RSOURCE
ISINK
ISOURCE
—
—
—
10
Ω
ISINK = 100 mA
—
—
6
Ω
ISOURCE = 100 mA
ISOURCE = 100 mA
—
—
10
Ω
—
2
—
A
—
1.5
—
A
—
2
—
A
—
1.5
—
A
LOGIC INPUTS
Input Logic High Voltage
VIH
0.8 VLL
—
VLL
V
Input Logic Low Voltage
VIL
0
—
0.2 VLL
V
Input Logic High Current
IIH
—
—
1
µA
Input Logic Low Current
IIL
–1
—
—
µA
AC ELECTRICAL CHARACTERISTICS
Electrical Specifications: Over operating conditions unless otherwise specified, AVDD1 = DVDD1 = DVDD2 = 10V,
AVSS = DVSS = –10V, VLL = 3.3V, TA = 0°C to 70°C.
Parameter
Sym.
Min.
Typ.
Max.
Unit
Conditions
Output Frequency Range
fOUT
—
—
20
MHz
Propagation Delay when Output
is from Low to High
tPH
—
19
—
ns
No load
(See Timing Waveforms.)
Propagation Delay when Output
is from High to Low
tPL
—
19
—
ns
No load
(See Timing Waveforms.)
Output Rise Time
tr
—
8
—
ns
1000 pF load
(See Timing Waveforms.)
Output Fall Time
tf
—
8
—
ns
1000 pF load
(See Timing Waveforms.)
ΔtDM
—
—
±3
ns
No load, from device to
device
ΔtDLAY
—
30
—
ps
Standard deviation of tD
samples (1 kHz)
SR
—
12
—
HD2
—
–40
—
Delay Time Matching
Output Jitter
Output Slew Rate
Second Harmonic Distortion
2019 Microchip Technology Inc.
V/ns Measured at TC6320 outdB put with 100Ω load
DS20005740A-page 5
MD1711
TEMPERATURE SPECIFICATIONS
Parameter
Sym.
Min.
Typ.
Max.
Unit
Operating Junction Temperature
TJ
0
—
+125
°C
Storage Temperature
TS
–65
—
+150
°C
48-lead LQFP
JA
—
52
—
°C/W
48-lead QFN
JA
—
18
—
°C/W
Conditions
TEMPERATURE RANGE
PACKAGE THERMAL RESISTANCE
DS20005740A-page 6
2019 Microchip Technology Inc.
MD1711
Timing Waveforms
VLL
HVEN1A/POS2A
0V
VLL
HVEN2A/NEG2A
0V
VLL
POSA/POS1A
0V
VLL
NEGA/NEG1A
0V
fOUT
VPP1
VPP2
HVOUTA 0V
VNN2
VNN1
tr1, rise time from
0.9VNN1 to 0.9VPP1
tf1, fall time from
0.9VPP1 to 0.9VNN1
tr2, rise time from
0.9VNN2 to 0.9VPP2
tf2, fall time from
0.9VPP2 to 0.9VNN2
3.3V
50%
IN
0V
50%
tPH
tPL
10V
90%
90%
OUT
0V
2019 Microchip Technology Inc.
10%
10%
tr
t
DS20005740A-page 7
MD1711
2.0
PIN DESCRIPTION
Functional descriptions for the pins are listed in
Table 2-1. See Package Types for the location of pins.
TABLE 2-1:
PIN FUNCTION TABLE
Pin Number
Pin Name
1
POSA/POS1A
Logic input control for Channel A. When SEL = L, the pin is POSA.
When SEL = H, the pin is POS1A.
2
NEGA/NEG1A
Logic input control for Channel A. When SEL = L, the pin is NEGA.
When SEL = H, the pin is NEG1A.
3
HVEN1A/POS2A
Logic input control for Channel A. When SEL = L, the pin is HVEN1A.
When SEL = H, the pin is POS2A.
4
HVEN2A/NEG2A
Logic input control for Channel A. When SEL = L, the pin is HVEN2A.
When SEL = H, the pin is NEG2A.
5
CLAMPA
Used with SEL = H. Logic input control for OUT–PA3 and OUT–NA3. Connect to
ground when SEL = L.
6
AVDD1
Supplies analog circuitry portion of the gate driver. Should be at the same potential as DVDD1.
7
AGND
Analog Ground
8
CLAMPB
Used with SEL = H. Logic input control for OUT–PB3 and OUT–NB3.
Connect to ground when SEL = L.
9
HVEN2B/NEG2B
Logic input control for Channel B. When SEL = L, the pin is HVEN2B.
When SEL = H, the pin is NEG2B.
10
HVEN1B/POS2B
Logic input control for Channel B. When SEL = L, the pin is HVEN1B.
When SEL = H, the pin is POS2B.
11
NEGB/NEG1B
Logic input control for Channel B. When SEL = L, the pin is NEGB.
When SEL = H, the pin is NEG1B.
12
POSB/POS1B
Logic input control for Channel B. When SEL = L, the pin is POSB.
When SEL = H, the pin is POS1B.
13
SEL
14
Description
Logic input select. See Table 3-2 for SEL = L and Table 3-3 for SEL = H.
AVSS
Negative driver supply for OUT–PA3, OUT–PB3 and bias circuits. It is also connected to the IC substrate. It should be connected to the most negative potential.
16
DVSS
Gate drive supply voltage for OUT–PA3 and OUT–PB3. Supplies digital circuitry
portion and the main output stage. Should be at the same potential as AVSS.
17
OUT-PB3
18
DGND
Digital Ground
19
DVDD1
Gate drive supply voltage. Supplies digital circuitry portion of the gate driver and
the main output stage for OUT–PA2, OUT–NA2, OUT–NA3, OUT–PB2,
OUT–NB2 and OUT–NB3. Should be at the same potential as AVDD1.
20
Out-PB2
Output P-channel gate driver for Channel B
21
DVDD2
Gate drive supply voltage. Supplies digital circuitry portion of the gate driver and
the main output stage for OUT–PA1, OUT–NA1, OUT–PB1 and OUT–NB1.
Can be at a different potential compared to DVDD1.
22
Out-PB1
Output P-channel gate driver for Channel B
23
N/C
24
Out-NB1
15
DS20005740A-page 8
Output P-channel gate driver for Channel B
No connect
Output N-channel gate driver for Channel B
2019 Microchip Technology Inc.
MD1711
TABLE 2-1:
PIN FUNCTION TABLE
Pin Number
Pin Name
Description
25
DVDD2
Gate drive supply voltage. Supplies digital circuitry portion of the gate driver and
the main output stage for OUT–PA1, OUT–NA1, OUT–PB1 and OUT–NB1. Can
be at a different potential compared to DVDD1.
26
DGND
Digital Ground
27
Out-NB2
Output N-channel gate driver for Channel B
28
DVDD1
Gate drive supply voltage. Supplies digital circuitry portion of the gate driver and
the main output stage for OUT–PA2, OUT–NA2, OUT–NA3, OUT–PB2,
OUT–NB2 and OUT–NB3. Should be at the same potential as AVDD1.
29
Out-NB3
Output N-channel gate driver for Channel B
30
DGND
Digital Ground
31
DVDD1
Gate drive supply voltage. Supplies digital circuitry portion of the gate driver and
the main output stage for OUT–PA2, OUT–NA2, OUT–NA3, OUT–PB2,
OUT–NB2 and OUT–NB3. Should be at the same potential as AVDD1.
32
OUT-NA3
33
DVDD1
Gate drive supply voltage. Supplies digital circuitry portion of the gate driver and
the main output stage for OUT–PA2, OUT–NA2, OUT–NA3, OUT–PB2,
OUT–NB2 and OUT–NB3. Should be at the same potential as AVDD1.
34
Out-NA2
Output N-Channel gate drivers for Channel A
35
DGND
Digital Ground
36
DVDD2
Gate drive supply voltage. Supplies digital circuitry portion of the gate driver and
the main output stage for OUT–PA1, OUT–NA1, OUT–PB1 and OUT–NB1. Can
be at a different potential compared to DVDD1.
37
Out-NA1
Output N-channel gate drivers for Channel A
38
N/C
39
Out-PA1
Output P-channel gate drivers for Channel A
40
DVDD2
Gate drive supply voltage. Supplies digital circuitry portion of the gate driver and
the main output stage for OUT–PA1, OUT–NA1, OUT–PB1 and OUT–NB1. Can
be at a different potential compared to DVDD1.
41
OUT-PA2
42
DVDD1
Gate drive supply voltage. Supplies digital circuitry portion of the gate driver and
the main output stage for OUT–PA2, OUT–NA2, OUT–NA3, OUT–PB2,
OUT–NB2 and OUT–NB3. Should be at the same potential as AVDD1.
43
DGND
Digital Ground
44
Out-PA3
45
DVSS
46
VLL
Logic supply voltage
47
EN
Logic input enable control. When EN = L, all P-channel output drivers are high
and all N-channel output drivers are low.
48
AVSS
Negative driver supply for OUT–PA3, OUT–PB3 and bias circuits. It is also connected to the IC substrate. It should be connected to the most negative potential.
Center Pad
AVSS
For the QFN package, the center pad is at AVSS potential. It should be externally
connected to AVSS.
2019 Microchip Technology Inc.
Output N-channel gate drivers for Channel A
No connect
Output P-channel gate drivers for Channel A
Output P-channel gate drivers for Channel A
Gate drive supply voltage for OUT–PA3 and OUT–PB3. Supplies digital circuitry
portion and the main output stage. Should be at the same potential as AVSS.
DS20005740A-page 9
MD1711
3.0
DETAILED DESCRIPTION
TABLE 3-1:
POWER-UP SEQUENCE
Step
Connection
1
AVSS, DVSS
2
VLL, AVDD1, DVDD1 and DVDD2
Description
Negative gate drive supply and substrate bias
Logic supply, positive gate drive supply and bias
1/2 of MD1711
3x TC6320
DVDD2
OUT-PA1
10nF
+100V
VPP1
GPA1
+10V AVDD1
HVOUTPA1
+10V DVDD1
DVDD2
+10VDVDD2
OUT-NA1
10nF
GNA1
HVOUTA
RLOAD
100
HVOUTNA1
+3.3V VLL
VNN1
-100V
EN
+50V
POSA/POS1A
NEGA/NEG1A
HVEN1A/POS2A
HVEN2A/NEG2A
Channel A
Control
Logic and
Level
Translation
DVDD1
OUT-PA2
10nF
VPP2
GPA2
HVOUTPA2
DVDD1
OUT-NA2
10nF
GNA2
CLAMPA
HVOUTNA2
VNN2
SEL
-50V
AGND
VPP3
DGND
OUT-PA3
AVSS
GPA3
HVOUTPA3
DVSS
DVDD1
DVSS
-10V
OUT-NA3
GNA3
HVOUTNA3
VNN3
FIGURE 3-1:
DS20005740A-page 10
Test Circuit for Channel A.
2019 Microchip Technology Inc.
MD1711
TABLE 3-2:
TRUTH FUNCTION TABLE FOR CHANNELS A AND B (FOR SEL = L)
VPP1 to VNN1
Output
Logic Control Inputs
SEL
EN
HVEN1/
POS2
HVEN2/
NEG2
Clamp
POS/
POS1
NEG/
NEG1
0
1
0
0
0
0
0
0
1
0
0
0
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
X
2019 Microchip Technology Inc.
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
X
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
X
0
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
X
HVOUTP1
1
VPP2 to VNN2
Output
HVOUTN1 HVOUTP2
OFF
VPP3 to VNN3
Output
HVOUTN2 HVOUTP3
OFF
1
HVOUTN3
ON
ON
ON
ON
ON
ON
OFF
OFF
0
1
OFF
0
OFF
1
0
OFF
1
OFF
0
1
OFF
OFF
ON
ON
OFF
ON
OFF
OFF
ON
OFF
OFF
OFF
OFF
OFF
OFF
OFF
0
1
OFF
0
1
0
OFF
0
OFF
OFF
1
OFF
ON
ON
OFF
1
OFF
OFF
OFF
OFF
ON
ON
OFF
OFF
OFF
OFF
OFF
OFF
0
1
0
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
1
0
1
0
1
0
1
0
1
X
DS20005740A-page 11
MD1711
TABLE 3-3:
TRUTH FUNCTION TABLE FOR CHANNELS A AND B (FOR SEL = H)
VPP1 to VNN1
Output
Logic Control Inputs
SEL
EN
HVEN1/
POS2
HVEN2/
NEG2
Clamp
POS/
POS1
NEG/
NEG1
HVOUTP1
1
1
0
0
0
0
0
OFF
OFF
ON
1
1
0
0
0
1
0
ON
OFF
ON
ON
1
1
0
0
1
0
0
OFF
OFF
OFF
ON
1
1
0
0
1
1
0
ON
OFF
ON
ON
1
1
0
1
0
0
0
OFF
OFF
OFF
ON
1
1
0
1
0
1
0
ON
OFF
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
1
1
0
0
1
1
0
0
0
1
0
1
0
1
1
1
1
1
1
1
HVOUTN1 HVOUTP2
ON
ON
1
0
1
1
0
0
OFF
OFF
OFF
ON
1
1
0
1
1
1
0
ON
OFF
1
1
1
1
1
1
0
0
0
1
1
1
0
0
0
0
1
ON
ON
0
OFF
OFF
OFF
ON
0
ON
OFF
1
0
0
1
1
1
1
0
1
0
1
1
1
1
1
1
1
1
0
0
OFF
OFF
ON
0
ON
OFF
ON
ON
0
OFF
OFF
OFF
ON
0
ON
OFF
1
0
0
1
1
1
1
1
1
ON
OFF
1
1
1
1
ON
0
1
1
1
1
0
1
1
1
1
0
1
1
0
1
1
1
1
1
1
1
0
1
1
1
1
0
1
1
1
1
1
1
0
1
0
0
0
0
1
1
1
ON
ON
1
1
1
1
1
0
0
OFF
OFF
OFF
ON
1
1
1
1
1
1
0
ON
OFF
ON
ON
X
X
X
X
OFF
OFF
1
1
1
1
1
0
DS20005740A-page 12
1
1
X
1
1
1
1
0
1
1
1
VPP3 to VNN3
Output
HVOUTN2 HVOUTP3
HVOUTN3
OFF
1
1
VPP2 to VNN2
Output
OFF
OFF
OFF
OFF
ON
OFF
ON
OFF
OFF
ON
ON
OFF
OFF
OFF
ON
OFF
ON
ON
ON
OFF
ON
ON
ON
ON
OFF
OFF
OFF
2019 Microchip Technology Inc.
MD1711
4.0
PACKAGING INFORMATION
4.1
Package Marking Information
48-lead LQFP
XXXXXX
XXXXXXX
e3 YYWW
NNN
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
Example
MD
1711FG
e3 1930
525
48-lead QFN
Example
XXXXXXXX
e3 YYWWNNN
MD1711K6
e3 1914325
Product Code or Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available characters
for product code or customer-specific information. Package may or not include
the corporate logo.
2019 Microchip Technology Inc.
DS20005740A-page 13
MD1711
48-Lead LQFP Package Outline (FG)
7.00x7.00mm body, 1.60mm height (max), 0.50mm pitch
D
D1
E1 E
Note 1
(Index Area
D1/4 x E1/4)
48
1
e
b
Top View
View B
L2
A A2
Seating
Plane
L
L1
A1
θ
Gauge
Plane
Seating
Plane
View B
Side View
Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging.
Note:
1. $3LQLGHQWL¿HUPXVWEHORFDWHGLQWKHLQGH[DUHDLQGLFDWHG7KH3LQLGHQWL¿HUFDQEH DPROGHGPDUNLGHQWL¿HU DQHPEHGGHGPHWDOPDUNHU RU
a printed indicator.
Symbol
A
A1
A2
b
D
D1
E
E1
MIN
Dimension
NOM
(mm)
MAX
1.40*
0.05
1.35
0.17
8.80*
6.80*
8.80*
6.80*
-
-
1.40
0.22
9.00
7.00
9.00
7.00
1.60
0.15
1.45
0.27
9.20*
7.20*
9.20*
7.20*
e
L
L1
L2
1.00
REF
0.25
BSC
0O
0.45
0.50
BSC
0.60
0.75
ș
3.5O
7O
JEDEC Registration MS-026, Variation BBC, Issue D, Jan. 2001.
7KLVGLPHQVLRQLVQRWVSHFL¿HGLQWKH-('(&GUDZLQJ
Drawings are not to scale.
S
# S
Q
G
DS20005740A-page 14
2019 Microchip Technology Inc.
MD1711
48-Lead QFN Package Outline (K6)
7.00x7.00mm body, 1.00mm height (max), 0.50mm pitch
D2
D
48
48
Note 1
(Index Area
D/2 x E/2)
1
1
Note 1
(Index Area
D/2 x E/2)
e
E
E2
b
View B
Top View
Bottom View
Note 3
θ
A3
A
L
Seating
Plane
L1
Note 2
A1
View B
Side View
Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging.
Notes:
1. $3LQLGHQWL¿HUPXVWEHORFDWHGLQWKHLQGH[DUHDLQGLFDWHG7KH3LQLGHQWL¿HUFDQEH DPROGHGPDUNLGHQWL¿HU DQHPEHGGHGPHWDOPDUNHU RU
a printed indicator.
2. 'HSHQGLQJRQWKHPHWKRGRIPDQXIDFWXULQJDPD[LPXPRIPPSXOOEDFN / PD\EHSUHVHQW
3. 7KHLQQHUWLSRIWKHOHDGPD\EHHLWKHUURXQGHGRUVTXDUH
Symbol
Dimension
(mm)
A
A1
MIN
0.80
0.00
NOM
0.90
0.02
MAX
1.00
0.05
A3
0.20
REF
b
D
D2
E
E2
0.18
6.85*
1.25
6.85*
1.25
0.25
7.00
-
7.00
-
0.30
7.15*
5.45
7.15*
5.45
e
0.50
BSC
L
L1
ș
0.30†
0.00
0O
0.40†
-
-
0.50†
0.15
14O
JEDEC Registration MO-220, Variation VKKD-6, Issue K, June 2006.
7KLVGLPHQVLRQLVQRWVSHFL¿HGLQWKH-('(&GUDZLQJ
7KLVGLPHQVLRQGLIIHUVIURPWKH-('(&GUDZLQJ
Drawings are not to scale.
2019 Microchip Technology Inc.
DS20005740A-page 15
MD1711
NOTES:
DS20005740A-page 16
2019 Microchip Technology Inc.
MD1711
APPENDIX A:
REVISION HISTORY
Revision A (April 2019)
• Converted Supertex Doc# DSFP-MD1711 to
Microchip DS20005740A
• Changed package marking formats
• Changed the quantity of the 48-lead LQFP FG
M931 media type from 3000/Reel to 1000/Reel
• Changed the quantity of the 48-lead VQFN K6
package from 250/Tray to 260/Tray
• Changed the quantity of the 48-lead VQFN K6
M933 media type from 2000/Reel to 3000/Reel
• Made minor text changes throughout the document
2019 Microchip Technology Inc.
DS20005740A-page 17
MD1711
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
XX
PART NO.
-
Package
Options
Device
X
-
Environmental
X
Media Type
Device:
MD1711
=
High-Speed Integrated Ultrasound Driver IC
Packages:
FG
=
48-lead LQFP
K6
=
48-lead VQFN
Environmental:
G
=
Lead (Pb)-free/RoHS-compliant Package
Media Types:
(blank)
=
250/Tray for an FG Package
=
260/Tray for a K6 Package
M931
=
1000/Reel for an FG Package
M933
=
3000/Reel for a K6 Package
DS20005740A-page 18
Examples:
a) MD1711FG-G:
High-Speed Integrated
Ultrasound Driver IC,
48-lead LQFP, 250/Tray
b) MD1711FG-G-M931:
High-Speed Integrated
Ultrasound Driver IC,
48-lead LQFP, 1000/Reel
c) MD1711K6-G:
High-Speed Integrated
Ultrasound Driver IC,
48-lead VQFN, 260/Tray
d) MD1711K6-G-M933:
High-Speed Integrated
Ultrasound Driver IC,
48-lead VQFN, 3000/Reel
2019 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
The Microchip name and logo, the Microchip logo, AnyRate, AVR,
AVR logo, AVR Freaks, BitCloud, chipKIT, chipKIT logo,
CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo,
JukeBlox, KeeLoq, Kleer, LANCheck, LINK MD, maXStylus,
maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip
Designer, QTouch, SAM-BA, SpyNIC, SST, SST Logo,
SuperFlash, tinyAVR, UNI/O, and XMEGA are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
and other countries.
ClockWorks, The Embedded Control Solutions Company,
EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS,
mTouch, Precision Edge, and Quiet-Wire are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, BodyCom, CodeGuard,
CryptoAuthentication, CryptoAutomotive, CryptoCompanion,
CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average
Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial
Programming, ICSP, INICnet, Inter-Chip Connectivity,
JitterBlocker, KleerNet, KleerNet logo, memBrain, Mindi, MiWi,
motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB,
MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation,
PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon,
QMatrix, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O,
SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total
Endurance, TSHARC, USBCheck, VariSense, ViewSpan,
WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
Silicon Storage Technology is a registered trademark of Microchip
Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2019, Microchip Technology Incorporated, All Rights Reserved.
ISBN: 978-1-5224-4413-8
== ISO/TS 16949 ==
2019 Microchip Technology Inc.
DS20005740A-page 19
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
Australia - Sydney
Tel: 61-2-9868-6733
India - Bangalore
Tel: 91-80-3090-4444
China - Beijing
Tel: 86-10-8569-7000
India - New Delhi
Tel: 91-11-4160-8631
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
China - Chengdu
Tel: 86-28-8665-5511
India - Pune
Tel: 91-20-4121-0141
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
China - Chongqing
Tel: 86-23-8980-9588
Japan - Osaka
Tel: 81-6-6152-7160
Finland - Espoo
Tel: 358-9-4520-820
China - Dongguan
Tel: 86-769-8702-9880
Japan - Tokyo
Tel: 81-3-6880- 3770
China - Guangzhou
Tel: 86-20-8755-8029
Korea - Daegu
Tel: 82-53-744-4301
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
China - Hangzhou
Tel: 86-571-8792-8115
Korea - Seoul
Tel: 82-2-554-7200
China - Hong Kong SAR
Tel: 852-2943-5100
Malaysia - Kuala Lumpur
Tel: 60-3-7651-7906
China - Nanjing
Tel: 86-25-8473-2460
Malaysia - Penang
Tel: 60-4-227-8870
China - Qingdao
Tel: 86-532-8502-7355
Philippines - Manila
Tel: 63-2-634-9065
China - Shanghai
Tel: 86-21-3326-8000
Singapore
Tel: 65-6334-8870
China - Shenyang
Tel: 86-24-2334-2829
Taiwan - Hsin Chu
Tel: 886-3-577-8366
China - Shenzhen
Tel: 86-755-8864-2200
Taiwan - Kaohsiung
Tel: 886-7-213-7830
China - Suzhou
Tel: 86-186-6233-1526
Taiwan - Taipei
Tel: 886-2-2508-8600
China - Wuhan
Tel: 86-27-5980-5300
Thailand - Bangkok
Tel: 66-2-694-1351
China - Xian
Tel: 86-29-8833-7252
Vietnam - Ho Chi Minh
Tel: 84-28-5448-2100
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Austin, TX
Tel: 512-257-3370
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Novi, MI
Tel: 248-848-4000
Houston, TX
Tel: 281-894-5983
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Tel: 317-536-2380
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Tel: 951-273-7800
Raleigh, NC
Tel: 919-844-7510
New York, NY
Tel: 631-435-6000
San Jose, CA
Tel: 408-735-9110
Tel: 408-436-4270
Canada - Toronto
Tel: 905-695-1980
Fax: 905-695-2078
DS20005740A-page 20
China - Xiamen
Tel: 86-592-2388138
China - Zhuhai
Tel: 86-756-3210040
Germany - Garching
Tel: 49-8931-9700
Germany - Haan
Tel: 49-2129-3766400
Germany - Heilbronn
Tel: 49-7131-67-3636
Germany - Karlsruhe
Tel: 49-721-625370
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Germany - Rosenheim
Tel: 49-8031-354-560
Israel - Ra’anana
Tel: 972-9-744-7705
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Italy - Padova
Tel: 39-049-7625286
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Norway - Trondheim
Tel: 47-7288-4388
Poland - Warsaw
Tel: 48-22-3325737
Romania - Bucharest
Tel: 40-21-407-87-50
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Sweden - Gothenberg
Tel: 46-31-704-60-40
Sweden - Stockholm
Tel: 46-8-5090-4654
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
2019 Microchip Technology Inc.
08/15/18
