MGC3130-I/MQ

MGC3030/3130 MGC3030/3130 3D Tracking and Gesture Controller Data Sheet Introduction Key Features Microchip’s MGC3X30 are 3D gesture recognition and motion tracking controller chips based on Microchip’s patented GestIC® technology. They enable usercommand input with natural hand and finger movements. Applying the principles of electrical nearfield sensing, the MGC3X30 contain all the building blocks to develop robust 3D gesture input sensing systems. Implemented as a low-power mixed-signal configurable controller, they provide a large set of smart functional features with integrated signal driver, a frequency adaptive input path for automatic noise suppression and a digital signal processing unit. Microchip’s on-chip Colibri Suite obsoletes processing needs at the host, reduces system power consumption resulting in low software development efforts for short time-to-market success. The MGC3XXX family represents a unique solution that provides gesture information of the human hand in real time. Dedicated chip family members add position data, touch or multitouch information to the free space gesture sensing. The MGC3XXX allow the realization of a new generation of user interfaces across various industry markets. • Recognition of 3D Hand Gestures and x, y, z Positional Data (MGC3130) • Proximity and Touch Sensing • Built-in Colibri Gesture Suite (running on chip) • Advanced 3D Signal Processing Unit • Detection Range: 0 to 10 cm • Receiver Sensitivity: West Flick North -> South Gesture Selection [0:2] Flick West -> East MGC3X30 Pins Events mapping Wake-up after Approach Detection EIO1,2,3,6,7 EventOutput 12 ... EventOutput 1 The Colibri Suite can generate up to twelve event outputs which can be mapped to any EIO (1, 2, 3, 6 or 7). It is also possible to map more than one event output by one EIO.  2012-2019 Microchip Technology Inc. Advance Information DS40001667F-page 27 MGC3030/3130 TABLE 5-3: COLIBRI SUITE EVENTS Gesture Port Mapping Parameter Description Gesture Selection Selects the gestures which will be used as event. Gesture Selection can be: • Flick West/East • Flick East/West • Flick North/South • Flick South/North • Circle Clockwise • Circle Counterclockwise • AirWheel Clockwise • AirWheel Counterclockwise Sensor Touch Selection Selects the sensor touch which will be used as event. Sensor Touch Selection can be: • Touch • Tap • Double Tap Electrode Selection Selects the electrode which will be used for Sensor Touch. Electrode Selection can be: • West • East • North • South • Center Event Input Selection Selects the event which will trigger an event output on the EIOs. Event Input Selection can be: • Gesture • Sensor Touch • Wake-up after Approach Detection Action Selection Selects the signal format which will be output on the EIOs. See Figure 5-2 and Table 5-4. Action Selection can be: • Permanent High • Permanent Low • Toggle • Pulse • High Active • Low Active  2012-2019 Microchip Technology Inc. Advance Information DS40001667F-page 28 MGC3030/3130 FIGURE 5-2: GESTURE PORT ACTION Event Permanent high Event Permanent low Event Pulse (100ms) Event Event Event Toggle Touch detected Touch released Touch detected Touch released High active Low active TABLE 5-4: GESTURE PORT MAPPING Action Event Permanent High Permanent Low Toggle Pulse X X X X X X Single Tap X X X X Double Tap X X X X Gesture Touch Approach AirWheel  2012-2019 Microchip Technology Inc. High Active Low Active X X X X X Advance Information DS40001667F-page 29 MGC3030/3130 5.5 Communication Interfaces The MGC3X30 offer an I2C interface for communicating with an application host. The I2C0 port offers: Slave mode Up to 400 kHz 7-bit Addressing mode Hardware state machine for basic protocol handling • Support for repeated start and clock stretching (Byte mode) • No multi-master support I2C Device Write ID Address A7 A6 A5 A4 A3 A2 A1 A0 1 0 0 0 0 1 IS2 0 • • • • I2C Device Read ID Address I C Hardware Interface A summary of the hardware interface pins is shown below in Table 5-5. I2C TABLE 5-5: MGC3X30 Pin I2C DEVICE READ ID ADDRESS (0x85 OR 0x87) TABLE 5-8: 2 A7 A6 A5 A4 A3 A2 A1 A0 1 0 0 0 0 1 IS2 1 PIN DESCRIPTION I2C Master Read Bit Timing Multiplexed Functions SCL Serial Clock to Master I2C SDA Serial Data to Master I2C Master read is to receive position data, gesture reports and command responses from the MGC3X30. The timing diagram is shown in Figure 5-4. • SCL Pin - The SCL (Serial Clock) pin is electrically open-drain and requires a pull-up resistor of typically 1.8 kΩ (for a maximum bus load capacitance of 200 pF), from SCL to VDD. - SCL Idle state is high. • SDA Pin - The SDA (Serial Data) pin is electrically open-drain and requires a pull-up resistor of typically 1.8 kΩ (for a maximum bus load capacitance of 200 pF), from SDA to VDD. - SDA Idle state is high. - Master write data is latched in on SCL rising edges. - Master read data is latched out on SCL falling edges to ensure it is valid during the subsequent SCL high time. I2C Addressing: The MGC3X30 Device ID 7-bit address is: 0x42 (0b1000010) or 0x43 (0b1000011) depending on the interface selection pin configuration (IS2+IS1). Refer to Table 5-6. TABLE 5-6: I2C DEVICE WRITE ID ADDRESS (0x84 OR 0x86) TABLE 5-7: I2C 5.5.1 I2C DEVICE ID ADDRESS • Address bits are latched into the MGC3X30 on the rising edges of SCL. • Data bits are latched out of the MGC3X30 on the rising edges of SCL. • ACK bit: - MGC3X30 presents the ACK bit on the ninth clock for address acknowledgment - I2C master presents the ACK bit on the ninth clock for data acknowledgment • The I2C master must monitor the SCL pin prior to asserting another clock pulse, as the MGC3X30 may be holding off the I2C master by stretching the clock. I2C Communication Steps 1. 2. 3. 4. Device ID Address, 7-bit A6 A5 A4 A3 A2 A1 A0 1 0 0 0 0 1 IS2  2012-2019 Microchip Technology Inc. 5. SCL and SDA lines are Idle high. I2C master presents Start bit to the MGC3X30 by taking SDA high-to-low, followed by taking SCL high-to-low. I2C master presents 7-bit address, followed by a R/W = 1 (Read mode) bit to the MGC3X30 on SDA, at the rising edge of eight master clock (SCL) cycles. MGC3X30 compares the received address to its Device ID. If they match, the MGC3X30 acknowledges (ACK) the master sent address by presenting a low on SDA, followed by a lowhigh-low on SCL. I2C master monitors SCL, as the MGC3X30 may be clock stretching, holding SCL low to indicate that the I2C master should wait. Advance Information DS40001667F-page 30 MGC3030/3130 I2C master receives eight data bits (MSB first) presented on SDA by the MGC3X30, at eight sequential I2C master clock (SCL) cycles. The data is latched out on SCL falling edges to ensure it is valid during the subsequent SCL high time. 7. If data transfer is not complete, then: - I2C master acknowledges (ACK) reception of the eight data bits by presenting a low on SDA, followed by a low-high-low on SCL. - Go to step 5. 8. If data transfer is complete, then: - I2C master acknowledges (ACK) reception of the eight data bits and a completed data transfer by presenting a high on SDA, followed by a low-high-low on SCL. 6. I2C Communication Steps 1. 2. 3. 4. 5. I2C Master Write Bit Timing I2C master write is to send supported commands to the MGC3X30. The timing diagram is shown in Figure 5-5. • Address bits are latched into the MGC3X30 on the rising edges of SCL. • Data bits are latched into the MGC3X30 on the rising edges of SCL. • ACK bit: - MGC3X30 presents the ACK bit on the ninth clock for address acknowledgment - I2C master presents the ACK bit on the ninth clock for data acknowledgment • The master must monitor the SCL pin prior to asserting another clock pulse, as the MGC3X30 may be holding off the master by stretching the clock. 6. 7. 8. 9. SCL and SDA lines are Idle high. I2C master presents Start bit to the MGC3X30 by taking SDA high-to-low, followed by taking SCL high-to-low. I2C master presents 7-bit address, followed by a R/W = 0 (Write mode) bit to the MGC3X30 on SDA, at the rising edge of eight master clock (SCL) cycles. MGC3X30 compares the received address to its Device ID. If they match, the MGC3X30 acknowledges (ACK) the I2C master sent address by presenting a low on SDA, followed by a low-high-low on SCL. I2C master monitors SCL, as the MGC3X30 may be clock stretching, holding SCL low to indicate the I2C master should wait. I2C master presents eight data bits (MSB first) to the MGC3X30 on SDA, at the rising edge of eight master clock (SCL) cycles. MGC3X30 acknowledges (ACK) receipt of the eight data bits by presenting a low on SDA, followed by a low-high-low on SCL. If data transfer is not complete, then go to step 5. Master presents a Stop bit to the MGC3X30 by taking SCL low-high, followed by taking SDA low-to-high. 5.5.2 TRANSFER STATUS LINE MGC3X30 requires a dedicated Transfer Status line (TS) which features a data transfer status function. It is used by both I2C master and slave to control data flow. The TS (Transfer Status) line is electrically open-drain and requires a pull-up resistor of typically 10 k, from TS to VDD. TS Idle state is high. The MGC3X30 (I2C slave) uses this line to inform the host controller (I2C master) that there is data available which can be transferred. The host controller uses the TS line to indicate that data is being transferred and prevents MGC3X30 from updating its data buffer. Table 5-9 shows how the TS line is used in the different states of communication.  2012-2019 Microchip Technology Inc. Advance Information DS40001667F-page 31 MGC3030/3130 TABLE 5-9: USAGE OF TRANSFER STATUS LINE MGC3X30 Host Controller TS Line Status Released (H) Released (H) High Host finished reading data (Transfer end). No more data to be transferred to the host. MGC3X30 is allowed to update the data buffer. Asserted (L) Released (H) Low Data from MGC3X30 is available to be sent, but the host has not yet started reading. If the host is busy and did not start reading before the next data update (5 ms), the MGC3X30 will assert the TS line high while updating the data buffer. Asserted (L) Asserted (L) Low Host starts reading. MGC3X30 data buffer will not be updated until the end of transfer (host releases TS high). Released (H) Asserted (L) Low MGC3X30 is ready to update the data buffer, but the host is still reading the previous data. MGC3X30 is allowed to update the data only when the host releases the TS high. MGC3X30 can update the I2C buffer only when the TS is released by both chips and a data transfer can only be started when MGC3X30 pulls the TS low. This procedure secures that: • the host is always informed when new sensor data is available • buffer updates in MGC3X30 are always completed before data is sent to the I2C bus Figure 5-3 protocol. shows FIGURE 5-3: the complete communication MGC3X30 COMMUNICATION PROTOCOL Transfer Status (TS) MGC3130 buffer can be updated MGC3130 buffer can be updated I2CTM Bus MGC3130 Related Transfer TS line pulled by MGC3130 to request a data transfer TS line pulled low by master when transfer is started TS line released by master and MGC3130 when transfer is finished Note 1: The Stop condition after an I2C data transmission is generated by the host controller (I2C master) after the data transfer is completed. Thus, it is recommended to verify the amount of bytes to be read in the message header (Size field). Non MGC3130 related transfer or Bus Idle TS line pulled by MGC3130 to request a data transfer MGC3130 Related Transfer TS line pulled low by master when transfer is started TS line released by master and MGC3130 when transfer is finished In addition to the standard I2C interface, the communication between MGC3X30 and the host controller requires a proper handling of the Transfer Status. 2: Transfer Status is only needed for data transfer from MGC3X30 to the host controller. Writing to MGC3X30 does not require the additional TS signal.  2012-2019 Microchip Technology Inc. Advance Information DS40001667F-page 32  2012-2019 Microchip Technology Inc. I2C MASTER READ BIT TIMING DIAGRAM FIGURE 5-4: Address SDA R/W A7 A6 A5 A4 A3 A2 A1 1 2 3 4 5 6 7 ACK Data 1 ACK D7 D6 D5 D4 D3 D2 D1 D0 1 2 3 4 5 6 7 8 Data ACK D7 D6 D5 D4 D3 D2 D1 D0 1 2 3 4 5 6 7 8 SCL S 8 9 9 9 P Address Bits Latched in Start Bit Data Bits Valid Out Data Bits Valid Out SCL may be stretched Stop Bit SCL may be stretched Advance Information I2C MASTER WRITE BIT TIMING DIAGRAM FIGURE 5-5: Address SDA R/W A7 A6 A5 A4 A3 A2 A1 1 2 3 4 5 6 7 ACK 0 Data ACK D7 D6 D5 D4 D3 D2 D1 D0 1 2 3 4 5 6 7 8 Data ACK D7 D6 D5 D4 D3 D2 D1 D0 1 2 3 4 5 6 7 8 SCL S Start Bit 8 9 9 9 P Address Bits Latched in Data Bits Valid Out SCL may be stretched Data Bits Valid Out SCL may be stretched Stop Bit MGC3030/3130 DS40001667F-page 33 MGC3030/3130 6.0 APPLICATION ARCHITECTURE The standard MGC3X30 implementation is a singlezone design. This configuration is based on one MGC3X30 connected to an application host via I2C with MGC3X30 being slave and Application Host being master. The following lines are needed for full I2C communication (see Figure 6-1). Data reporting and flow-control scenarios described below for I2C communication: 6.4 Reference Schematic (3.3V VDD  3.465V) The reference application schematic for the MGC3X30 is depicted below in Figure 6-2. are • SDA • SCL • EIO0 (Transfer Status Line) is toggled indicating that new data is available and checking whether the host has already started data reading or not. FIGURE 6-1: APPLICATION CIRCUITRY 10kΩ 10kΩ 1.8kΩ 1.8kΩ Vcc SDA0 SCL0 SDA SCL SDA SCL EIO0 TS GPIO MCLR MCLR X MGC3x30 6.1 GPIO Host Controller ESD Considerations The MGC3X30 provides Electrostatic Discharge (ESD) voltage protection up to 2 kV (HBM). Additional ESD countermeasures may be implemented individually to meet application-specific requirements. 6.2 Power Noise Considerations MGC3X30 filtering capacitors are included in the reference design schematic (Refer to Figure 6-2). 6.3 Irradiated High-Frequency Noise In order to suppress irradiated high-frequency signals, the five Rx channels of the chip are connected to the electrodes via serial 10 k resistors, as close as possible to MGC3X30. The 10 k resistor and the MGC3X30 input capacitance are building a low-pass filter with a corner frequency of 3 MHz. An Additional ferrite bead is recommended to suppress the coupling of RF noise to the Tx channel (e.g., 600  at 100 MHz). An additional ferrite bead is recommended to suppress the coupling of RF noise to the Tx channel (e.g., 600  at 100 MHz).  2012-2019 Microchip Technology Inc. Advance Information DS40001667F-page 34 MGC3030/3130 FIGURE 6-2: REFERENCE SCHEMATIC FOR MGC3X30 VDD R11 (10 kΩ) R12 (10 kΩ) South Electrode NC SI1 MGC3x30 RX2 10 kΩ NC EIO7 EIO6 SI0 RX1 EIO0 RX3 NC RX4 NC VSS2 IS2 SDA HOST GPIO/IRQ 10 kΩ R4 EXP1 VDD IS2 4.7 µF VCAPA C2 VSS3 4.7 µF VCAPD VINDS VCAPS C3 2.2 µF VDD VSS1 100 nF C4 C1 R7 (n.p) VDD 10 kΩ 10 kΩ R5 (n.p) VDD RESET SCL R13 (10 kΩ) VDD IS1 IS2 EIO7 EIO6 EIO3 1 Exposed Pad on QFN housing only (MGC3130) EIO2 n.p: not populated EIO1 10 kΩ R8 10 kΩ Gesture Port R6 Interface Selection EIO3 RX0 1.8 kΩ Center Electrode MCLR R2 East Electrode WestElectrode R9 (10 kΩ) R10 (10 kΩ) VDD TXD 1.8 kΩ R3 North Electrode EIO2 EIO1 R1 IS1 NOTE: R5 and R7 are not populated  2012-2019 Microchip Technology Inc. Advance Information DS40001667F-page 35 MGC3030/3130 TABLE 6-1: BILL OF MATERIALS Label Qty Value Description R1, R4, R5, R6, R7, R8 3 10 k Res Thick Film 10 k C1 1 100 nF Capacitor – Ceramic, 0.1 µF, 10%, 6.3V C2 1 4.7 µF Capacitor – Ceramic, 4.7 µF, 10%, 6.3V C3 1 4.7 µF Capacitor – Ceramic, 4.7 µF, 10%, 6.3V C4 1 2.2 µF Capacitor – Ceramic, 2.2 µF, 10%, 6.3V R2, R3 2 1.8 k Res Thick Film 1.8 k 1% R9, R10, R11, R12, R13 5 10 k Res Thick Film 10 k1% 6.5 Layout Recommendation This section will provide a brief description of layout hints for a proper system design. The PCB layout requirements for MGC3X30 follow the general rules for a mixed signal design. In addition, there are certain requirements to be considered for the sensor signals and electrode feeding lines. The chip should be placed as close as possible to the electrodes to keep their feeding lines as short as possible. Furthermore, it is recommended to keep MGC3X30 away from electrical and thermal sources within the system. Analog and digital signals should be separated from each other during PCB layout in order to minimize crosstalk. The individual electrode feeding lines should be kept as far apart as possible from each other. VDD lines should be routed as wide as possible. C1 and C4 have to be placed close to the VDD pin. MGC3X30 requires a proper ground connection on all VSS pins, including the exposed pad (pin 29).  2012-2019 Microchip Technology Inc. Advance Information DS40001667F-page 36 MGC3030/3130 7.0 DEVELOPMENT SUPPORT Microchip provides software and development tools for the MGC3X30: hardware • Software: - Aurea Software Package - MGC3030/3130 Software Development Kit - MGC3030/3130 Host Reference Code • Schematics: - GestIC® Hardware References • Evaluation and Development Kits: - MGC3130 Hillstar Development Kit (DM160218) - MGC3030 Woodstar Development Kit (DM160226) 7.1 7.4 GestIC Hardware References The GestIC Hardware Reference package contains the PCB Layouts (Gerber files) for the MGC development kits (Hillstar and Woodstar) and a collection of electrode reference designs fitting both kits. In addition, the package includes designs, parameter files and host code of various demonstrators which represent complete systems for embedded or PC-based applications. New designs will be added to the package once they are available. The GestIC Hardware Reference package can be downloaded from Microchip’s website via www.microchip.com/ GestICResources. Aurea Software Package The Aurea evaluation software demonstrates Microchip’s GestIC technology and its features and applications. Aurea provides visualization of the MGC3X30 generated data and access to GestIC Library controls and configuration parameters. That contains the following: • • • • • • • • Visualization of hand position and user gestures Visualization of sensor data Real-time control of sensor features MGC3X30 GestIC Library update Analog front end parameterization Colibri parameterization Electrode capacitance measurement Logging of sensor values and storage in a log file 7.2 MGC3030/3130 Software Development Kit Microchip provides a standard C reference code with a Software Development Kit. The code will support developers to integrate the MGC3X30 solution into the target application. 7.3 MGC3030/3130 PIC18 Host Reference Code Microchip provides a reference code for PIC18F14K50, including GestIC Library I2C code and basic message decoding.  2012-2019 Microchip Technology Inc. Advance Information DS40001667F-page 37 MGC3030/3130 7.5 Evaluation and Demonstration Kits A variety of demonstration, development and evaluation boards allow quick application development on fully-functional systems. The demonstration and development boards can be used in teaching environments, for prototyping custom circuits and for learning about various GestIC MGC3130 applications. The first development board is the Hillstar Development Kit. It is designed to support an easy integration of Microchip’s MGC3130 3D Tracking and Gesture Controller into the customer’s applications. It provides MGC3130 system hardware modules and a set of electrode reference designs which can be used by customers to develop their own GestIC system. Aurea Visualization and Control Software provides full support of the Hillstar Development Kit and an easy parameterization of the customer’s applications. The Woodstar Development Kit is a development platform to support an easy integration of Microchip's MGC3030. It provides MGC3030 system hardware modules and a set of electrode reference designs which can be used by customers to develop their own GestIC system. Aurea Visualization and Control Software provides full support of the Woodstar Development Kit and an easy parameterization of the customer’s applications. 7.6 The MGC3X30 devices are manufactured with a builtin Library Loader (bootloader) only. There will be no GestIC Library on it. The library loader contains the I2C interface and basic device programming operations so that a GestIC Library can be uploaded to the MGC3X30 Flash memory. The latest GestIC Library can be found in the package 'Aurea Software Package’ which can be downloaded from the GestIC homepage. There are several ways to upload the library to the MGC3X30: 1. 2. Woodstar and Hillstar offer the same interface (hardware as well as software). The electrodes, the I2C-to-USB bridge as well as Aurea software can both be used for the Hillstar and Woodstar development kits. For the complete list of demonstration, development and evaluation kits, refer to the Microchip website (http://www.microchip.com/GestICGettingStarted). 3. 4.  2012-2019 Microchip Technology Inc. GestIC Library Update Upload via Aurea Visualization and Control Software: The Aurea Graphical User Interface (GUI) can be used to perform the update. For this option, USB connectivity to a PC with Aurea Graphical User Interface (GUI) will be needed (e.g., using the I2C-to-USB bridge of Hillstar Development Kit or Woodstar Development Kit). Refer to “Aurea Graphical User Interface” (DS40001681), MGC3130 Hillstar Development Kit User’s Guide (DS40001721) and MGC3030 Woodstar Development Kit User’s Guide (DS40001777) for additional information. Upload via embedded host controller: this option will require an embedded host controller which performs the upload using the GestIC I2C commands. The GestIC Library is hereby stored in the host’s memory. Refer to “MGC3030/3130 GestIC Library Interface Description” (DS40001718) for more details. Microchip Programming Center Preprogrammed MGC3X30 parts can be ordered through Microchip Programming Center. Go to www.microchipdirect.com/programming/ for further information. Quick Time Programming (QTP): for larger quantities of preprogrammed parts with unique part number, see your local Microchip sales office. Advance Information DS40001667F-page 38 MGC3030/3130 8.0 ELECTRICAL SPECIFICATIONS 8.1 Absolute Maximum Ratings(†) Ambient temperature under bias......................................................................................................... -20°C to +85°C Storage temperature ........................................................................................................................ -55°C to +125°C Voltage on pins with respect to VSS on VDD pin ............................................................................................................................ -0.3V to +3.465V on all other pins .............................................................................................................. -0.3V to (VDD + 0.3V) † NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. † NOTICE: This device is sensitive to ESD damage and must be handled appropriately. Failure to properly handle and protect the device in an application may cause partial to complete failure of the device. † NOTICE: -20°C temperature operation is characterized but not tested.  2012-2019 Microchip Technology Inc. Advance Information DS40001667F-page 39 MGC3030/3130 9.0 PACKAGING INFORMATION 9.1 Package Marking Information 28-Lead QFN (5x5x0.9 mm) PIN 1 Example PIN 1 28-Lead SSOP (5.30 mm) MGC3130 MQ e3 1318017 Example MGC3030 SS e3 1318017 Legend: XX...X Y YY WW NNN e3 * Note: Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC® designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information.  2012-2019 Microchip Technology Inc. Advance Information DS40001667F-page 40 MGC3030/3130 9.2 Package Details The following sections give the technical details of the packages. 28-Lead Plastic Quad Flat, No Lead Package (MQ) – 5x5x0.9 mm Body [QFN or VQFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D A B N NOTE 1 1 2 E (DATUM B) (DATUM A) 2X 0.10 C 2X TOP VIEW 0.10 C 0.10 C C SEATING PLANE A1 A 28X A3 SIDE VIEW 0.08 C 0.10 C A B D2 0.10 C A B E2 28X K 2 1 NOTE 1 N 28X L e BOTTOM VIEW 28X b 0.10 0.05 C A B C Microchip Technology Drawing C04-140C Sheet 1 of 2  2012-2019 Microchip Technology Inc. Advance Information DS40001667F-page 41 MGC3030/3130 28-Lead Plastic Quad Flat, No Lead Package (MQ) – 5x5x0.9 mm Body [QFN or VQFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units Dimension Limits Number of Pins N e Pitch Overall Height A Standoff A1 A3 Contact Thickness Overall Width E Exposed Pad Width E2 Overall Length D Exposed Pad Length D2 b Contact Width Contact Length L Contact-to-Exposed Pad K MIN 0.80 0.00 3.15 3.15 0.18 0.35 0.20 MILLIMETERS NOM 28 0.50 BSC 0.90 0.02 0.20 REF 5.00 BSC 3.25 5.00 BSC 3.25 0.25 0.40 - MAX 1.00 0.05 3.35 3.35 0.30 0.45 - Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Package is saw singulated. 3. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-140C Sheet 2 of 2  2012-2019 Microchip Technology Inc. Advance Information DS40001667F-page 42 MGC3030/3130 28-Lead Plastic Quad Flat, No Lead Package (MQ) – 5x5 mm Body [QFN] Land Pattern With 0.55 mm Contact Length Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Microchip Technology Drawing C04-2140A  2012-2019 Microchip Technology Inc. Advance Information DS40001667F-page 43 MGC3030/3130 /HDG3ODVWLF6KULQN6PDOO2XWOLQH66PP%RG\>6623@ 1RWH )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW KWWSZZZPLFURFKLSFRPSDFNDJLQJ ' $ % 1 '$780$ '$780% ( (   ;E  H & $ % 7239,(: $ $ & $ $ 6($7,1* 3/$1( ;  & 6,'(9,(: $ + F / / 9,(:$$ 0LFURFKLS7HFKQRORJ\'UDZLQJ&5HY&6KHHWRI  2012-2019 Microchip Technology Inc. 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