MGC3140-I/MV

MGC3140 MGC3140 3D Tracking and Gesture Controller Data Sheet Introduction Microchip’s MGC3140 is a 3D gesture and motion tracking controller based on Microchip’s patented GestIC® technology – suitable for consumer, industrial and automotive applications. It enables robust user interfaces with natural hand and finger movements, utilizing the principles of electrical near-field sensing. Implemented as a low-power mixed-signal configurable controller, the MGC3140 provides a compelling set of smart functional features, such as gesture recognition while using adaptive working frequencies for robust performance in noisy environments. Microchip’s on-chip Colibri gesture suite removes the need for host post-processing and reduces system power consumption, resulting in a low-software development efforts for short time-to-market success. The MGC3140 represents a unique and high-performance single-chip gesture solution focusing on automotive applications. MGC3140 provides proximity, gesture detection and driver recognition, thus enabling modern and compelling user interfaces to be created. MGC3140 Applications • • • • • • • • • Automotive Applications Internet of Things (IoT) Audio Products Notebooks/Keyboards/PC Peripherals Home Automation White Goods Switches Medical Products Game Controllers Power Operation Modes Several Power Operation Modes, Including: • Processing mode: 29 mA, typical • Deep Sleep: 85 μA, typical Key Features • • • • • • • • Automotive Qualification AEC Q100 Grade 1 Recognition of 3D Hand Gestures and x, y, z Positional Data Proximity and Touch Sensing Built-in Colibri Gesture Suite (running on-chip) Advanced 3D Signal Processing Unit Detection Range: 0 to 10 cm, typical Position Rate: 200 positions/s Carrier Frequency: 42, 43, 44, 45, 100 kHz © 2018-2022 Microchip Technology Inc. and its subsidiaries Advance Information Datasheet DS40002037C-page 1 MGC3140 • • • • • • • • Channels Supported: – Five receive (Rx) channels – One transmit (Tx) channel On-chip Auto-Calibration Low-Noise Radiation Due to Low-Transmit Voltage and Slew Rate Control Noise Susceptibility Reduction: – On-chip analog filtering – On-chip digital filtering – Automatic frequency hopping Enables the Use of Low-Cost Electrode Material, Including: – Printed circuit board – Conductive paint – Conductive foil – Laser Direct Structuring (LDS) – Touch panel ITO structures Field Upgrade Capability Operating Voltage: VDD = 3.3V ± 5% Operating Temperature Range: -40°C to +125°C Peripheral Features • I2C for Configuration and Sensor Output Streaming I2C, Speed up to 400 kHz Packages Part Number Available Package Pins Contact/Lead Pitch Dimensions MGC3030 SSOP 28 0.65 7.8x10.2x1.9 MGC3130 QFN 28 0.5 5x5x0.9 MGC3140 UQFN 48 0.4 6x6x0.5 Note:  All dimensions are in millimeters (mm), unless specified. Part Number Gesture Recognition Position Tracking Raw Data Streaming Wake-Up-On-Approach Deep Sleep Rx Receive Electrodes I2C Ports AEC-Q100 Qualified (PPAP) Table 1. GestIC® Family Comparison MGC3030 Yes No Yes Yes Yes 5 1 No MGC3130 Yes Yes Yes Yes Yes 5 1 No MGC3140 Yes Yes Yes Yes Yes 5 1 Yes © 2018-2022 Microchip Technology Inc. and its subsidiaries Advance Information Datasheet DS40002037C-page 2 MGC3140 AEC-Q100 Qualified (PPAP) I2C Ports Rx Receive Electrodes Deep Sleep Wake-Up-On-Approach Raw Data Streaming Position Tracking Gesture Recognition Part Number ...........continued Notes:  1. MGC3030 recommended for new Industrial designs. 2. MGC3130 recommended for new Industrial designs. 3. MGC3140 recommended for Automotive designs. © 2018-2022 Microchip Technology Inc. and its subsidiaries Advance Information Datasheet DS40002037C-page 3 MGC3140 Table of Contents Introduction.....................................................................................................................................................1 MGC3140 Applications...................................................................................................................................1 Power Operation Modes.................................................................................................................................1 Key Features.................................................................................................................................................. 1 Peripheral Features........................................................................................................................................2 Packages........................................................................................................................................................2 1. Pin Diagram............................................................................................................................................ 6 2. 48-Pin Allocation and Pinout Description Table...................................................................................... 7 3. Theory of Operation: Electrical Near-Field (E-Field) Sensing................................................................. 9 3.1. 4. Feature Description............................................................................................................................... 11 4.1. 4.2. 5. I2C Client Mode.......................................................................................................................... 27 Application Architecture........................................................................................................................ 31 8.1. 8.2. 8.3. 8.4. 8.5. 8.6. 9. Reset.......................................................................................................................................... 20 Power Management Unit (PMU)................................................................................................ 22 Clocks.........................................................................................................................................23 Operation Modes........................................................................................................................23 Interface Description............................................................................................................................. 27 7.1. 8. MGC3140 Controller.................................................................................................................. 16 GestIC® Library.......................................................................................................................... 16 External Rx Electrodes...............................................................................................................17 Functional Description...........................................................................................................................20 6.1. 6.2. 6.3. 6.4. 7. Gesture Definition.......................................................................................................................11 GestIC® Library.......................................................................................................................... 11 System Architecture.............................................................................................................................. 16 5.1. 5.2. 5.3. 6. GestIC® Technology Benefits.....................................................................................................10 ESD Considerations................................................................................................................... 31 Power Noise Considerations...................................................................................................... 31 High-Frequency Noise Immunity................................................................................................ 31 RF Emission............................................................................................................................... 31 Reference Schematic................................................................................................................. 32 Layout Recommendation........................................................................................................... 32 Development Support........................................................................................................................... 33 9.1. 9.2. 9.3. 9.4. Aurea Software Package............................................................................................................33 MGC3140 Linux Driver...............................................................................................................33 GestIC® Hardware References.................................................................................................. 33 Evaluation and Demonstration Kits............................................................................................ 33 © 2018-2022 Microchip Technology Inc. and its subsidiaries Advance Information Datasheet DS40002037C-page 4 MGC3140 10. Electrical Specifications........................................................................................................................ 34 10.1. 10.2. 10.3. 10.4. 10.5. Absolute Maximum Ratings(†).................................................................................................... 34 Recommended Operating Conditions........................................................................................ 34 I/O Characteristics......................................................................................................................34 Current Consumption................................................................................................................. 35 Timing Characteristics................................................................................................................ 36 11. Packaging Information.......................................................................................................................... 37 11.1. Package Details......................................................................................................................... 37 12. Revision History.................................................................................................................................... 41 The Microchip Website.................................................................................................................................42 Product Change Notification Service............................................................................................................42 Customer Support........................................................................................................................................ 42 Product Identification System.......................................................................................................................43 Microchip Devices Code Protection Feature................................................................................................ 43 Legal Notice................................................................................................................................................. 44 Trademarks.................................................................................................................................................. 44 Quality Management System....................................................................................................................... 45 Worldwide Sales and Service.......................................................................................................................46 © 2018-2022 Microchip Technology Inc. and its subsidiaries Advance Information Datasheet DS40002037C-page 5 MGC3140 Pin Diagram Pin Diagram GP4 GP3 GP2 GP1 Vcorecap DNC DNC RX0 DNC DNC PGC PGD 48 47 46 45 44 43 42 41 40 39 38 37 Figure 1-1. MGC3140 48L Diagram UQFN GP5 1 36 DNC SYNC 2 35 DNC DNC 3 34 VSS RX1 4 33 TS DNC 5 32 MODE DNC 6 31 VDD MCLR 7 30 SCL VSS 8 29 SDA VDD 9 28 TX4 IS1 10 27 TX3 IS2 11 26 TX2 RX2 12 25 TX1 15 16 17 18 19 20 21 22 23 24 VSS VANA DNC RX3 DNC DNC RX4 DNC TX0 14 DNC AVDD 13 MGC3140-E/MV DNC 1. Related Links 2. 48-Pin Allocation and Pinout Description Table © 2018-2022 Microchip Technology Inc. and its subsidiaries Advance Information Datasheet DS40002037C-page 6 MGC3140 48-Pin Allocation and Pinout Description T... 2. 48-Pin Allocation and Pinout Description Table Pin Name Pin Number Pin Type Buffer Type GP5 1 O — SYNC 2 O — DNC 3 — — Description Reserved. Do not connect. Gesture device synchronization pulse (every 1 ms) Reserved. Do not connect. Analog GestIC® input channel 1: Receive electrode connection. RX1 4 I Analog DNC DNC 5 6 — — — — MCLR 7 I — Reserved. Do not connect. Reserved. Do not connect. Master Clear (Reset) input. This pin is an active-low Reset to the device. VSS 8 P — Ground reference for logic and I/O pins. This pin must be connected at all times. VDD IS1 IS2 9 10 11 P I I — ST ST RX2 12 I Analog DNC DNC 13 14 — — — — AVDD 15 P — VSS VANA DNC 16 17 18 P P — — — — RX3 19 I Analog DNC DNC 20 21 — — — — RX4 22 I Analog DNC TX0 TX1 TX2 TX3 TX4 SDA SCL VDD 23 24 25 26 27 28 29 30 31 — O O O O O I/O I/O P — — — — — — ST ST — MODE 32 I ST TS 33 O — © 2018-2022 Microchip Technology Inc. and its subsidiaries Positive supply for peripheral logic and I/O pins Reserved. Must be connected to VSS. Reserved. Must be connected to VSS. Analog GestIC input channel 2: Receive electrode connection. Reserved. Do not connect. Reserved. Do not connect. Positive supply for analog modules. This pin must be connected at all times. Ground reference for analog modules Positive supply for analog front end Not connected Analog GestIC input channel 3: Receive electrode connection. Reserved. Do not connect. Reserved. Do not connect. Analog GestIC input channel 4: Receive electrode connection. Reserved. Do not connect. GestIC Transmit electrode connection 0 GestIC Transmit electrode connection 1 GestIC Transmit electrode connection 2 GestIC Transmit electrode connection 3 GestIC Transmit electrode connection 4 Synchronous serial data input/output for I2C Synchronous serial clock input/output for I2C Positive supply for peripheral logic and I/O pins Gesture Devices Scan mode: High: 2D touch device measuring; Low: gesture device measuring. Transfer Status. GestIC message ready interrupt. Advance Information Datasheet DS40002037C-page 7 MGC3140 48-Pin Allocation and Pinout Description T... ...........continued Pin Name Pin Number Pin Type Buffer Type Description Ground reference for analog modules. This pin must be connected at all times. VSS 34 P — DNC DNC PGD PGC DNC DNC 35 36 37 38 39 40 — — I/O I/O — — — — ST ST — — RX0 41 I Analog Reserved. Do not connect. Reserved. Do not connect. Programming Data line, connect to test pin in application Programming Clock line, connect to test pin in application Reserved. Do not connect. Reserved. Do not connect. Analog GestIC input channel 0: Receive electrode connection. DNC DNC 42 43 44 45 46 47 48 — — P O O O O — — — — — — — Reserved. Do not connect. Reserved. Do not connect. Capacitor for Internal Voltage Regulator Reserved. Do not connect. Reserved. Do not connect. Reserved. Do not connect. Reserved. Do not connect. VCORECAP GP1 GP2 GP3 GP4 Legend: Analog = Analog input P = Power ST = Schmitt Trigger input with CMOS levels I = Input O = Output I/O = Input/Output — = N/A Important:  Exposed pad must be connected to VSS. Related Links 1. Pin Diagram © 2018-2022 Microchip Technology Inc. and its subsidiaries Advance Information Datasheet DS40002037C-page 8 MGC3140 Theory of Operation: Electrical Near-Field (E-Fiel... 3. Theory of Operation: Electrical Near-Field (E-Field) Sensing Microchip’s GestIC technology is a 3D sensor technology which utilizes an electric field (E-field) for advanced proximity sensing. It allows realization of new user interface applications by detection, tracking and classification of a user’s hand gestures in free space. E-fields are generated by electrical charges and propagate three-dimensionally around the surface, carrying the electrical charge. Applying direct voltages (DC) to an electrode results in a constant electric field. Applying alternating voltages (AC) makes the charges vary over time and, thus, the field. When the charge varies sinusoidally with frequency ‘f’, the resulting electromagnetic wave is characterized by wavelength λ = c/f, where ‘c’ is the wave propagation velocity — in vacuum, the speed of light. In cases where the wavelength is much larger than the electrode geometry, the magnetic component is practically zero and no wave propagation takes place. The result is quasi-static electrical near field that can be used for sensing conductive objects such as the human body. Microchip’s GestIC technology uses five transmit (Tx) frequencies, 42, 43, 44, 45 and 100 kHz, with wavelengths of at least three kilometers. This wavelength is much larger than the typical range of electrode dimensions between 5 mm and 20 mm. GestIC systems work without wave propagation. In case a person’s hand or finger intrudes the electrical field, the field becomes distorted. The field lines are drawn to the hand due to the conductivity of the human body itself and shunted to ground. The 3D electric field decreases locally. Microchip’s GestIC technology uses a minimum number of four receiver (Rx) electrodes to detect the E-field variations at different positions to measure the origin of the electric field distortion from the varying signals received. The information is used to calculate the position, track movements and classify movement patterns (gestures). The two following figures show the influence of an earth-grounded body to the electric field. The proximity of the body causes a compression of the equipotential lines and shifts the Rx electrode signal levels to a lower potential which is measured. Figure 3-1. Equipotential Lines of an Undistorted E-Field © 2018-2022 Microchip Technology Inc. and its subsidiaries Advance Information Datasheet DS40002037C-page 9 MGC3140 Theory of Operation: Electrical Near-Field (E-Fiel... Figure 3-2. Equipotential Lines of a Distorted E-Field 3.1 GestIC® Technology Benefits • • • • • • • • • • GestIC E-field sensors are not impacted by ambient influences such as light or sound, which have a negative impact to the majority of other 3D technologies. GestIC technology allows gesture/position tracking processing on-chip – no host processing needed. Algorithms are included in the Colibri Gesture Suite which runs on-chip and is provided by Microchip. The GestIC technology has a high immunity to noise, provides high update rates and resolution, low latency and is also not affected by clothing, surface texture or reflectivity. Five carrier frequencies of 42, 43, 44, 45 and 100 kHz are utilized by the GestIC with minimal impact on the regulated radio frequency range. Usage of thin low-cost materials as electrodes allow low-system cost at slim industrial designs. The further use of existing capacitive sensor structures, such as a touch panel’s ITO coating, allows additional cost savings and ease the integration of the technology. Electrodes are invisible to the user’s eye since they are implemented underneath the housing surface or integrated into a touch panel’s ITO structure. GestIC works centrically over the full sensing space. Thus, it provides full surface coverage without any detection blind spots. Only one GestIC transmitter electrode is used for E-field generations. The benefit is an overall low-power consumption and low-radiated EMC noise. Since GestIC is basically processing raw electrode signals and computing them in real time into preprocessed gestures and x, y, z positional data, it provides a highly-flexible user interface technology for any kind of electronic devices. © 2018-2022 Microchip Technology Inc. and its subsidiaries Advance Information Datasheet DS40002037C-page 10 MGC3140 Feature Description 4. 4.1 Feature Description Gesture Definition A hand gesture is the movement of the hand to express an idea or meaning. The GestIC technology accurately allows sensing of a user’s free space hand motion for contact free position tracking, as well as 3D gesture recognition based on classified movement patterns. 4.2 GestIC® Library MGC3140 is being provided with a GestIC Library loader (bootloader) which is stored on the chip’s Flash memory. Using this loader, a GestIC Library can be flashed on the MGC3140 via I2C using, for example, an embedded host controller or Microchip's Aurea GUI. The GestIC Library includes: • Colibri Suite: Digital Signal Processing (DSP) algorithms and feature implementations • System Control: MGC3140 hardware control Related Links 9.1. Aurea Software Package 4.2.1 Colibri Suite The Colibri Suite combines data acquisition, digital signal processing, and interpretation. The Colibri Suite functional features are illustrated below and described in the following sections. Figure 4-1. Colibri Suite Core Elements Colibri Suite Digital Signal Processing Presence Detection 4.2.1.1 Position Tracking Gesture Recognition Position Tracking The Colibri Suite’s Position Tracking feature provides 3D hand position over time and area. The absolute position data is provided according to the defined origin of the Cartesian coordinate system (x, y, z). Position Tracking data is continuously acquired in parallel to Gesture Recognition. 4.2.1.2 Gesture Recognition The Colibri Suite’s gesture recognition model detects and classifies hand movement patterns performed inside the sensing area. Using advanced random classification based on Hidden Markov Model (HMM), industry best gesture recognition rate is being achieved. © 2018-2022 Microchip Technology Inc. and its subsidiaries Advance Information Datasheet DS40002037C-page 11 MGC3140 Feature Description The Colibri Suite includes a set of predefined hand gestures which contains Flick, Circular and Symbol gestures as the ones outlined below: Flick Gestures Figure 4-2. Flick Gestures A Flick gesture is a unidirectional gesture in a quick flicking motion. An example may be a hand movement from West to East within the sensing area, from South to North, etc. Circular Gestures Figure 4-3. Circle Gestures A circular gesture is a round-shaped hand movement defined by direction (clockwise/counterclockwise) without any specific start position of the user’s hand. Two types of circular gestures are distinguished by GestIC technology: 1. AirWheel – An AirWheel is the recognition of continuously-performed rotations inside the sensing area and provides information about the rotational movement in real time. It provides continuously counter information which increments/decrements according to the movement’s direction (clockwise/counterclockwise). The AirWheel can be adjusted for convenient usage in various applications (e.g., volume control, sensitivity adjustment or light dimming). 2. Discrete Circles – Discrete Circles are recognized after performing a hand movement inside the sensing area. The recognition result (direction: clockwise/counterclockwise) is provided after the hand movement stops or the hand exits the detection area. The Discrete Circles are typically used as dedicated application control commands. Hold and Presence Gestures Hold/Presence gestures are recognized through the detection of a hand within a configurable detection area. After the hand is detected as being present in this area, a timer will be started. If the hand stays within the detection area until a certain timer value is reached, the Presence gesture is detected. The timer value is configurable. The Presence gesture is typically used for lighting up backlights as if the hand is in the detection area and does not move; a second timer is started. Presence and Hold gestures are triggered upon a time-out in a defined Status flag. If a Status flag is active during a certain amount of time, after its last rising edge, the corresponding gesture is triggered. © 2018-2022 Microchip Technology Inc. and its subsidiaries Advance Information Datasheet DS40002037C-page 12 MGC3140 Feature Description The Status flags that can trigger one of these gestures are: • Hand Presence flag is active while the user's hand is in the sensing space. • Hand Inside flag is active while the user's hand is in the sensing space approximately centered above the sensor. • Hand Hold flag is active while the hand is not moving and one of the above Status flags is active, the selection depends on ActiveOutside. The behavior of the Status flags and corresponding gestures can be adjusted to suit a specific application. The Gesture and Presence/Hold state visualization windows offer immediate feedback upon adjustment. The adjustable parameters are: 1. ActiveOutside – Chooses if Hand Hold flag and Presence gesture can be active when the user is outside the sensor, but still in sensing space. • ActiveOutside checked (default) means that Hand Presence is required to set Hand Hold and that Presence Duration starts counting on the rising edge of Hand Presence Status flag; • ActiveOutside unchecked means that Hand Inside is required to set Hand Hold and that Presence Duration starts counting on the rising edge of Hand Inside Status flag. 2. Presence Duration – This is the time during which the selected Status flag must be active to trigger a Presence gesture. This time starts counting on the last rising edge of the selected Status flag. The gesture is only triggered once for each rising edge of the flag. 3. Hold Duration – This is the time during which the Holding Hand flag must be active to trigger a Hold gesture. This time starts counting on the last rising edge of the Holding Hand flag. The gesture is only triggered once for each rising edge of the flag. 4. Hold Tremble Threshold – This value specifies how much the hand can move and still be considered as holding. For high values, the hand can move while the Hand Hold flag is still high. For low values, only a slight movement is necessary to clear the Hand Hold flag. Sensor Touch Gestures Figure 4-4. Sensor Touch A Sensor Touch is a multi-zone gesture that reports up to five concurrently-performed touches on the system’s electrodes. The Sensor Touch provides information about touch and tapping: 1. The Sensor Touch indicates an event during which a GestIC electrode is touched. This allows distinction between short and long touches. 2. The Tap and Double Tap signalize short taps and double taps on each system electrode. The tap length and double tap interval are adjustable. – Single Tap Delay: A single tap is detected when touching the surface of an electrode first and after the hand is pulled out of the touch area. The Single Tap is only detected when the timing between the touch and the release of the touch event is smaller than the adjusted delay. Increasing the time allows the user more time to perform the tap. The range for the adjusted delay can range between 0s and 1s. © 2018-2022 Microchip Technology Inc. and its subsidiaries Advance Information Datasheet DS40002037C-page 13 MGC3140 Feature Description – Double Tap Delay: The double tap is detected when two taps are performed within the adjusted delay. The range for the adjusted delay can range between 0s and 1s. The smaller the selected delay is, the faster the two taps have to be executed. Figure 4-5. Sensor Touch Diagram Touch det ected Touch Max Tap Duration 0s-1s Tap det ected Tap Max Tap Duration 0s-1s Max Double Tap Duration 0s-1s Tap det ected Double Tap det ected Double Tap 4.2.1.3 Approach Detection Figure 4-6. Approach Detection Approach Detection is an embedded power-saving feature of Microchip’s Colibri Suite. It sends MGC3140 to Sleep mode and scans periodically the sensing area to detect the presence of a human hand. Utilizing the built-in Self Wake-up mode, Approach Detection alternates between Sleep and Scan phase. During the Scan phase, the approach of a human hand can be detected while very low power is consumed. A detected approach of a user exceeding configured threshold criteria will alternate the MGC3140 from Self Wake-up to Processing mode or even the application host in the overall system. © 2018-2022 Microchip Technology Inc. and its subsidiaries Advance Information Datasheet DS40002037C-page 14 MGC3140 Feature Description Within the Approach Detection sequence, the following scans are performed: • Approach Scan – An Approach scan is performed during the scan phase of the device’s Self Wake-up mode. Typically, one Rx channel is active but more channels can be activated via the GestIC Library. The time interval (scan interval) between two consecutive Approach scans is configurable. For typical applications, the scan cycle is in a range of 20 ms to 150 ms. During the Approach scan, the activated Rx channels are monitored for signal changes which are caused by, for example, an approaching human hand and exceeding the defined threshold. This allows an autonomous wake-up of the MGC3140 and host applications at very low-power consumption. • AFA Scan – During Wake-up-on-Approach, periodic Automatic Frequency Adaptation (AFA) scans are performed. During this scan, the environmental noise is measured and a new Tx frequency will be selected from the five preset frequencies available, if necessary. The AFA scan is usually performed in configurable intervals from 120s to 600s (120s typical). The timing sequence of the Approach Detection feature is illustrated below: Figure 4-7. Approach Detection Sequence Perio d ic A p p ro ach Scan s A FA S c a n Perio d ic A p p ro ach Scan s A FA S c a n Perio d ic A p p ro ach Scan s A FA S c a n Perio d ic A p p ro ach Scan s C u rre n t N on -user ac ti vi ty ti m eout 2s- 255 s 20 m s-150 m s 2s -10 s 120 s -600 s I5 CH S CA N = 29 m A I S LE EP = 62 µA I 5 CH S CA N: I S LE EP: Sca n Pha s e w ith 5 a ctive RX cha nnels : Ca libration Sca n Sle e p Pha se tim e Related Links 6.4.3. Wake-up-on-Approach Mode © 2018-2022 Microchip Technology Inc. and its subsidiaries Advance Information Datasheet DS40002037C-page 15 MGC3140 System Architecture 5. System Architecture MGC3140 is a mixed-signal configurable controller. The entire system solution is composed of the following main building blocks (see diagram below): • MGC3140 Controller • GestIC Library • External Electrodes Figure 5-1. MGC3140 Controller System Architecture MGC3140 To Application Host Communications Interface Signal Processing Unit GestIC® Library 5 Rx External Electrodes Analog Front End 5 Tx 5.1 MGC3140 Controller The MGC3140 features the following main building blocks: • Low-Noise Analog Front End (AFE) • Digital Signal Processing Unit (SPU) • Communication Interfaces The MGC3140 provides a transmit signal to generate the E-field, conditions the analog signals from the receiving electrodes and processes these data digitally on the SPU. Data exchange between the MGC3140 and a host is conducted via the controller’s I2C interface. Related Links 6. Functional Description 5.2 GestIC® Library The embedded GestIC Library is optimized to ensure continuous and Real-Time Free-Space gesture recognition and motion tracking concurrently. It is fully-configurable and allows required parametrization for individual application and external electrodes. © 2018-2022 Microchip Technology Inc. and its subsidiaries Advance Information Datasheet DS40002037C-page 16 MGC3140 System Architecture 5.3 External Rx Electrodes Rx electrodes are connected to the MGC3140. An electrode needs to be individually designed following the guide lines from the "GestIC Design Guide” (DS40001716), for optimal E-field distribution and detection of E-field variations inflicted by a user. 5.3.1 Electrode Equivalent Circuit The hand position tracking and gesture recognition capabilities of a GestIC system depend on the electrode design and their material characteristics. A simplified equivalent circuit model of a generic GestIC electrode system is illustrated in the following figure: Figure 5-2. Electrodes Capacitive Equivalent Circuitry Earth Grounded External Electrodes E-field Electrode signal eRx VR X CRXTX Transmitter signal VTX eTx CTXG System Ground CRXG CH System ground Earth ground VTx Tx electrode voltage VRxBuf MGC3140 Rx input voltage CH Capacitance between receive electrode and hand (earth ground). The user’s hand can always be considered as earth-grounded due to the comparable large size of the human body. CRxTx Capacitance between receive and transmit electrodes CRxG Capacitance of the receive (Rx) electrode to system ground + input capacitance of the MGC3140 receiver circuit CTxG Capacitance of the transmit (Tx) electrode to system ground eRx Rx electrode eTx Tx electrode The Rx and Tx electrodes in a GestIC electrode system build a capacitance voltage divider with the capacitances CRxTx and CRxG which are determined by the electrode design. CTxG represents the Tx electrode capacitance to system ground driven by the Tx signal. The Rx electrode measures the potential of the generated E-field. If a conductive object (e.g., a hand) approaches the Rx electrode, CH changes its capacitance. Femtofarad changes are detected by the MGC3140 receiver. The equivalent circuit formula for the earth-grounded circuitry is described in the following equation: Equation 5-1. Electrodes Equivalent Circuit CRxTx VRxBuf = VTx × CRxTx + CRxG + CH A common example of an earth-grounded device is a notebook, even with no ground connection via power supply or Ethernet connection. Due to its larger form factor, it presents a high earth-ground capacitance in the range of 50 pF © 2018-2022 Microchip Technology Inc. and its subsidiaries Advance Information Datasheet DS40002037C-page 17 MGC3140 System Architecture and, thus, it can be assumed as an earth-grounded GestIC system. For further information on sensor designs with earth-grounded as well as nonearth-grounded devices, see "GestIC Design Guide” (DS40001716). A brief overview of the typical values of the electrode capacitances is summarized in the table below: Table 5-1. Electrode Capacitances Typical Values Capacity Typical Value CRxTx 10...30 pF CTxG 10...1000 pF CRxG 10...30 pF CH < 1 pF Important:  Ideal designs have low CRxTx and CRxG to ensure higher sensitivity of the electrode system. Optimal results are achieved with CRxTx and CRxG values being in the same range. 5.3.2 Standard Electrode Design The MGC3140 electrode system is typically a double-layer design with a Tx transmit electrode at the bottom layer to shield against device ground and, thus, ensure high-receive sensitivity. Up to five comparably smaller Rx electrodes are placed above the Tx layer providing the spatial resolution of the GestIC system. Tx and Rx are separated by a thin isolating layer. The Rx electrodes are typically arranged in a frame configuration as shown in the figure below. The frame defines the inside sensing area. Larger dimensions yield in higher sensitivity of the system. For more information on sensor design as well as the function of the center electrode, see "GestIC Design Guide" (DS40001716). The electrode shapes can be designed solid or structured. In addition to the distance and the material between the Rx and Tx electrodes, the shape structure density also controls the capacitance CRxTx and thus, the sensitivity of the system. © 2018-2022 Microchip Technology Inc. and its subsidiaries Advance Information Datasheet DS40002037C-page 18 MGC3140 System Architecture Figure 5-3. Frame Shape Electrodes Centre EAST West NORTH SOUTH Transmit Elect rode - Bot tom Layer Edge Receive Elect rodes - Top Layer Centre Receive Elect rode - Top Layer © 2018-2022 Microchip Technology Inc. and its subsidiaries Advance Information Datasheet DS40002037C-page 19 MGC3140 Functional Description 6. Functional Description Microchip’s GestIC technology utilizes electrical near-field (E-field) sensing. The chip is connected to electrodes that are sensing the E-field variance. The GestIC device then calculates the user’s hand motion relatively to the sensing area in x, y, z position data, and classifies the movement pattern into gestures in real time. In addition, by utilizing the principles of E-field sensing, the GestIC system is immune to ambient influences such as light or sound, which have a negative impact on the majority of other 3D technologies. Also, it allows a full-surface coverage of the electrode area with no detection blind spots of a user’s action. Microchip’s MGC3140 is a configurable controller. Featuring a Signal Processing Unit (SPU), a wide range of 3D gesture applications are being processed on the MGC3140, which allows short development cycles. Always-on 3D sensing is enabled, even for battery-driven devices, by the chip’s low-power design and the variety of programmable power modes. GestIC sensing electrodes are driven by a low-voltage signal with frequencies of 42, 43, 44, 45, and 100 kHz, allowing their electrical conductive structure to be made of any low-cost material. Figure 6-1 provides an overview of the main building blocks of MGC3140. Figure 6-1. MGC3140 Block Diagram Tx Electrode Tx Signal Generation MGC3140 Internal System Clock Communication Diagnostics Signal Processing Unit External Sensor Electrodes 5 Rx Rx Electrodes Measurement Electrodes I2C (SPU) Host Gesture Recognition Position Data Raw Data Power Management Unit (PMU) Operation Modes: - Full Mode - Deep Sleep Reset Block 6.1 Reset The Reset block combines all Reset sources. It controls the device system’s Reset signal (SYSRST). The following is a list of device Reset sources: • MCLR: Master Clear Reset pin • SWR: Software Reset available through GestIC Library Loader • Power-on Reset (POR) • Brown-out Reset (BOR) • Watchdog Timer Reset (WDTR) A simplified block diagram of the Reset block is illustrated in the following figure. A pull-up resistor of 10 kΩ must be connected at all times to the MCLR pin. © 2018-2022 Microchip Technology Inc. and its subsidiaries Advance Information Datasheet DS40002037C-page 20 PIC16(L)F18325/18345 MGC3140 Functional Description FIGURE 5-4: Reset SIMPLIFIED BLOCK DIAGRAM OF ON-CHIP RESET CIRCUIT Figure 6-2. System Block Diagram MCLR MCLR Glitch Filter WDTR Deep Sleep WDT Time-out VDD Voltage Regulator Enabled Power-up Timer POR Brown-out Reset BOR SYSRST VDD Rise Detect Software Reset SWR Timing Diagrams for POR and BOR are shown below: Figure 6-3. Power-on Reset Timing VDD VPOR (TSYSDLY) Power-up Sequence (Note 2) CPU Starts Fetching Code (TPU) (Note 1) Notes:  1. The power-up period will be extended if the power-up sequence completes before the device exits from BOR (VDD < VDDMIN). 2. Includes interval voltage regulator stabilization delay. DS40000000A-page 74 © 2018-2022 Microchip Technology Inc. and its subsidiaries Preliminary Advance Information Datasheet  2017 Microchip Technology Inc. DS40002037C-page 21 MGC3140 Functional Description Figure 6-4. Brown-out Reset Timing MCLR TMCLR BOR BOR voltage = 2.25V to 2.45V TBOR (TSYSDLY) Reset Sequence CPU Starts Fetching Code 6.2 Power Management Unit (PMU) 6.2.1 Basic Connection Requirements The device requires a nominal 3.3V supply voltage. The following pins need to be connected: • • • • All VDD and VSS pins need connection to the supply voltage and decoupling capacitors VCORECAP: The devices’ core and digital logic are designed to operate at a nominal 1.8V, which is provided by an on-chip regulator. The required core logic voltage is derived from VDD and is outputted on the VCORECAP pin. A low-ESR capacitor (such as tantalum or ceramic) must be connected to the VCORECAP pin. This helps to maintain the stability of the regulator. AVDD: Analog voltage references for the ADC needs to be connected to the supply voltage and a decoupling capacitor VANA: Analog supply for GestIC analog front end must be connected to the supply voltage Figure 6-5. Connections for VCORE Regulator (1) 3.3V VDD (2,3 ) CEFC (10 uF typ) © 2018-2022 Microchip Technology Inc. and its subsidiaries VCORECAP VSS Advance Information Datasheet DS40002037C-page 22 MGC3140 Functional Description Notes:  1. These are typical operating voltages. 2. It is important that the low-ESR capacitor is placed as close as possible to the VCAP pin. 3. The typical voltage on the VCAP is 1.8V. 6.2.2 Decoupling Capacitors The use of decoupling capacitors on power supply pins, such as VDD, VSS and AVDD is required. Consider the following criteria when using decoupling capacitors: • Value and type of capacitor: SMD X7R ceramic capacitors with the value indicated in ‘Reference Schematic’ section and nominal voltage of 10...25V X7R are recommended. The capacitors will be a low Equivalent Series Resistance (low-ESR) capacitor and have resonance frequency of 20 MHz or higher. • Placement on the printed circuit board: The decoupling capacitors will be placed as close to the pins as possible. It is recommended that the capacitors be placed on the same side of the board as the device. If space is constricted, the capacitor can be placed on another layer on the PCB using a "via"; however, ensure that the trace length from the pin to the capacitor is within 6 mm in length. • Handling high-frequency noise: If the board is experiencing high-frequency noise, upward of tens of MHz, add a second ceramic-type capacitor in parallel to the above described decoupling capacitor. The value of the second capacitor can be in the range of 0.01 μF to 0.001 μF. Place this second capacitor next to the primary decoupling capacitor. In high-speed circuit designs, consider implementing a decade pair of capacitances as close as possible to the power and ground pins. For example, 0.1 μF in parallel with 0.001 μF. • Maximizing performance: On the board layout from the power supply circuit, run the power and return traces to the decoupling capacitors first and then to the device pins. This ensures that the decoupling capacitors are first in the power chain. Equally important is to keep the trace length between the capacitor and the power pins to a minimum, thereby reducing PCB track inductance. Related Links 8.5. Reference Schematic 6.3 Clocks The MGC3140 is embedding two internal oscillators, high speed and low speed. The High-Speed Oscillator (HSO) is factory-trimmed, achieving high accuracy. • • 6.4 High-Speed Oscillator (HSO): The MGC3140 is clocked by an internal HSO running at 40 MHz (+/- 2%). This clock is used to generate the Tx signal, to trigger the ADC conversions and to run the SPU. During Deep Sleep mode, the HSO clock is switched off. Low-Speed Oscillator (LSO): This low-speed and ultra-low-power oscillator is typically 32 kHz (+/- 15%). It is used during power-saving modes. Operation Modes MGC3140 offers three operation modes that allow the user to balance power consumption with device functionality. In all of the modes described in this section, power saving is configured by GestIC Library messages. A summary of the operation modes, as well as their respective current consumption values are given in the table below: Table 6-1. Operation Modes Summary Mode Entry Exit Comments Processing I2C/Approach/MCLR/ WDTR/SW Reset GestIC® Library Message/ NonActivity Time-out/ WDTR Processing mode with up to five electrodes continuously running Full positioning and Gesture Recognition capabilities © 2018-2022 Microchip Technology Inc. and its subsidiaries Advance Information Datasheet DS40002037C-page 23 MGC3140 Functional Description ...........continued Mode Wake-up on Approach Deep Sleep Entry Exit Hand not present Time-out/GestIC® Library Message GestIC® Library Message Comments Scan phase with a configurable number of Rx active channels, wake-up timer is used to resume the I2C Message/ system MCLR/WDTR/Hand Approach detection capability Detected Fast wake-up time Very low-power consumption SPU halted, Watchdog OFF No positioning or gesture detection I2C Message/MCLR Extreme low-power consumption: Needs trigger from application host to switch into Wake-up on Approach or Processing mode Figure 6-6. Operation Mode Flow Power off Power on MCLR or WDTR Processing mode Hand detected or I2C message or MCLR or WDTR 2 I C message or MCLR Approach timeout or GestIC® library enable Approach mode message GestIC® library enable Deep Sleep mode message Wake-up on Approach mode © 2018-2022 Microchip Technology Inc. and its subsidiaries Deep Sleep mode Advance Information Datasheet DS40002037C-page 24 MGC3140 Functional Description 6.4.1 Processing Mode In this mode, all power domains are enabled and the SPU is running continuously. All peripheral digital blocks are active. Gesture recognition and position tracking require the Processing Operation mode. 6.4.2 Deep Sleep Mode The Deep Sleep mode includes the following characteristics: • The SPU is halted • The High-Speed Oscillator is shut down • The Low-Speed Oscillator is running • The Watchdog is switched off • Host interface pins are active for wake-up This leads to the lowest possible power consumption of MGC3140. The device will resume from Deep Sleep if one of the following events occurs: • I2C Start bit detection • On MCLR Reset The Deep Sleep mode can be enabled by GestIC Library messages. 6.4.3 Wake-up-on-Approach Mode The Wake-up-on-Approach mode is a low-power mode allowing an autonomous wake-up of the MGC3140 and application host. In this mode, the MGC3140 is automatically and periodically alternating between Deep Sleep and scan phases. During the approach scan phase, the sensor will be able to detect an approach of the human hand and change to Processing mode accordingly. The MGC3140’s fast wake-up, typically below 1 ms, allows the performance of scans in very efficient periods and to maximize the Sleep phase. Additionally, the sensor will perform periodic AFA scans in which the sensor will scan through all available Tx frequencies and select an optimal frequency depending on the signals’ noise level. The periodic wake-up sequence is triggered by a programmable wake-up timer running at the low-speed Oscillator 32 kHz frequency. The repetition rate of the scan can be adjusted via the host, affecting the sensitivity and current consumption during Wake-up-on-Approach. The MGC3140 enters the Self Wake-up mode by a GestIC Library message or by a non-activity time-out. Non-activity means no user detection within the sensing area. The MGC3140 will resume from Self Wake-up on one of the following events: • Detection of a human hand approaching the sensor • I2C Start bit detection • On MCLR or WDTR 6.4.4 Transmit Signal Generation The Tx signal generation block provides five bandwidth limited square wave signals for the transmit electrode. The five Tx signals are combined through a resistive network to provide a single Tx signal to the Tx electrode. This provides slew control to the rising and falling Tx signal edges in order to reduce radiated emissions. Frequency hopping automatically adjusts the Tx carrier frequency choosing one of the five transmit frequencies, depending on the environmental noise conditions. GestIC Library automatically selects the lowest noise working frequency in case the sensor signal is compromised. Frequencies can be enabled/disabled via the GestIC Library. 6.4.5 Receive (Rx) Channels There are five identical Rx channels that can be used for five respective receive electrodes. Four receive electrodes are required for Position Tracking and Gesture Recognition. A fifth electrode can be used for touch detection and for approach detection in Wake-up-on-Approach mode. Every Rx input pin is connected to its own dedicated ADC. The Rx input signal is sampled at a sampling rate equal to double the Tx frequency, providing a high and low ADC sample. © 2018-2022 Microchip Technology Inc. and its subsidiaries Advance Information Datasheet DS40002037C-page 25 MGC3140 Functional Description The electrodes can be connected in any order to the external electrodes. The channel assignment is then done in a parameterization step in Aurea GUI or alliteratively using I2C commands. Important:  It is recommended to assign Rx channels 1 to 4 in most application designs, only using RX0 if a fifth Rx electrode is required. 6.4.6 Analog-to-Digital Converter (ADC) As outlined in the previous section, each Rx channel features a dedicated ADC with a trigger derived from the internal clock. ADC samples are synchronous with twice the Tx transmit frequency. 6.4.7 Signal Processing Unit (SPU) The MGC3140 features a Signal Processing Unit (SPU) to control the hardware blocks and process the advanced DSP algorithms included in the GestIC Library. It provides filtered sensor data, continuous position information and recognized gestures to the application host. The host combines the information and controls its application. 6.4.8 Parameters Storage The MGC3140 provides an embedded 128 kB Flash memory which is dedicated for the GestIC Library and storage of the individual configuration parameters. These parameters have to be set according to the individual electrode design and application. The GestIC Library and parameters are loaded into MGC3140 with the provided software tools or, alternatively, via GestIC Library messages by the application host. Related Links 9. Development Support © 2018-2022 Microchip Technology Inc. and its subsidiaries Advance Information Datasheet DS40002037C-page 26 MGC3140 Interface Description 7. Interface Description The MGC3140 supports an I2C interface in Client mode. For further information on the I2C interface as well as a list of the I2C commands, see ”MGC3140/MXG3141 - GestIC Library Interface Description User’s Guide” (DS40001875). 7.1 I2C Client Mode 7.1.1 I2C Hardware Interface A summary of the hardware interface pins is shown below: Table 7-1. Interface Pins Pin Function SCL Serial Clock to Host I2C SDA Serial Data to Host I2C TS Transfer Status Line The MGC3140 requires a dedicated Transfer Status line (TS). The MGC3140 (I2C Client) uses this line to inform the host controller (I2C Host) that there is data available which can be transferred. The TS line is electrically open-drain and requires a pull-up resistor of typically 10 kΩ from the TS line to VDD. The TS Idle state is high. The MGC3140 uses an internal I2C message buffer. If after a read operation there are remaining messages in the buffer, the TS will only go high for a short-time period and then be driven low again. Table 7-2. Usage of TS Line Device TS Line Status Released (H) High No new pending message from the device Asserted (L) Low New message from device available; Host can start reading I2C message © 2018-2022 Microchip Technology Inc. and its subsidiaries Advance Information Datasheet DS40002037C-page 27 MGC3140 Interface Description Figure 7-1. Example for TS Line Indication and Following Read Operation TS SCL SDA Note:  The TS line handling of the MGC3140 is different to MGC3x30 devices. With the MGC3140, there is no need for the host to assert the TS line. Important:  Usage of TS line is compulsory. Trying to read the MGC3140 internal message buffer without waiting for TS signal, as specified above, may lead to corrupted data and abnormal interface behavior. Consequently, an appropriate dedicated input port must be planned on the host processor. 7.1.2 I2C Message Buffer The MGC3140 has an internal First-In First-Out (FIFO) I2C message buffer for a total of five messages. After a I2C message read process is started by the host, the message will be deleted from the buffer. Also, if the I2C transfer of a message is read by the host and the transfer is interrupted, the message will be deleted. For further information, refer to “MGC3140/MXG3141 - GestIC Library Interface Description User’s Guide” (DS40001875). 7.1.3 I2C Addressing The MGC3140 Device ID 7-bit address is: 0x42 (0b1000010). Refer to the table below: Device ID Address, 7-bit 7.1.4 Address offset A7 A6 A5 A4 A3 A2 A1 0x42 1 0 0 0 0 1 0 Timing Descriptions I2C Clock - The I2C clock operates up to 400 kHz. I2C Host Read Bit Timing Host read is to receive gesture reports and command responses from the MGC3140. The timing diagram is shown below: © 2018-2022 Microchip Technology Inc. and its subsidiaries Advance Information Datasheet DS40002037C-page 28 MGC3140 Interface Description Figure 7-2. I2C Host Read Bit Timing Diagram Address SDA R/W A7 A6 A5 A4 A3 A2 A1 1 2 3 4 5 6 7 ACK 1 Data D7 D6 D5 1 2 3 ACK D4 D3 D2 D1 D0 4 5 6 7 8 Data D7 D6 D5 1 2 3 ACK D4 D3 D2 D1 D0 4 5 6 7 8 SCL S 8 9 9 Start Bit Data Bits Valid Out Data Bits Valid Out SCL may be stretched • • • • 9 P Address Bits Latched in Stop Bit SCL may be stretched Address bits are latched into the MGC3140 on the rising edges of SCL. Data bits are latched out of the MGC3140 on the rising edges of SCL. ACK bit: – MGC3140 presents the ACK bit on the ninth clock for address acknowledgment – I2C host presents the ACK bit on the ninth clock for data acknowledgment The I2C host must monitor the SCL pin prior to asserting another clock pulse, as the MGC3140 may be holding off the I2C host by stretching the clock. I2C Communication Steps 1. SCL and SDA lines are Idle high. 2. I2C host presents Start bit to the MGC3140 by taking SDA high-to-low, followed by taking SCL high-to-low. 3. I2C host presents 7-bit address, followed by a R/W = 1 (Read mode) bit to the MGC3140 on SDA, at the rising edge of eight host clock (SCL) cycles. 4. MGC3140 compares the received address to its Device ID. If they match, the MGC3140 acknowledges (ACK) the host sent address by presenting a low on SDA, followed by a low-high-low on SCL. 5. MGC3140 host monitors SCL, as the MGC3140 may be clock-stretching, holding SCL low to indicate that the I2C host should wait. 6. I2C host receives eight data bits (MSB first) presented on SDA by the MGC3140, at eight sequential I2C host clock (SCL) cycles. The data is latched out on SCL falling edges to ensure it is valid during the subsequent SCL high time. 7. If data transfer is not complete, then: – I2C host acknowledges (ACK) reception of the eight data bits by presenting a low on SDA, followed by a low-high-low on SCL. – Go to Step 5. 8. If data transfer is complete, then: – I2C host NACK’s reception of the eight data bits and a completed data transfer by presenting a high on SDA, followed by a low-high-low on SCL. I2C Host Write Bit Timing I2C host write is to send supported commands to the MGC3140. The timing diagram is shown below: Figure 7-3. I2C Host Write Bit Timing Diagram Address SDA R/W A7 A6 A5 A4 A3 A2 A1 1 2 3 4 5 6 7 ACK 0 Data D7 D6 D5 1 2 3 ACK D4 D3 D2 D1 D0 4 5 6 7 8 Data D7 D6 D5 1 2 3 ACK D4 D3 D2 D1 D0 4 5 6 7 8 SCL S Start Bit 8 9 Data Bits Valid Out SCL may be stretched • • • 9 9 P Address Bits Latched in Data Bits Valid Out SCL may be stretched Stop Bit Address bits are latched into the MGC3140 on the rising edges of SCL. Data bits are latched into the MGC3140 on the rising edges of SCL. ACK bit: – MGC3140 presents the ACK bit on the ninth clock for address acknowledgment © 2018-2022 Microchip Technology Inc. and its subsidiaries Advance Information Datasheet DS40002037C-page 29 MGC3140 Interface Description • – MGC3140 presents the ACK bit on the ninth clock for data acknowledgment The host must monitor the SCL pin prior to asserting another clock pulse, as the MGC3140 may be holding off the host by stretching the clock. I2C Communication Steps 1. SCL and SDA lines are Idle high. 2. I2C host presents Start bit to the MGC3140 by taking SDA high-to-low, followed by taking SCL high-to-low. 3. I2C host presents 7-bit address, followed by a R/W = 0 (Write mode) bit to the MGC3140 on SDA, at the rising edge of eight host clock (SCL) cycles. 4. MGC3140 compares the received address to its Device ID. If they match, the MGC3140 acknowledges (ACK) the I2C host sent address by presenting a low on SDA, followed by a low-high-low on SCL. 5. I2C host monitors SCL, as the MGC3140 may be clock stretching, holding SCL low to indicate the I2C host should wait. 6. I2C host presents eight data bits (MSB first) to the MGC3140 on SDA, at the rising edge of eight host clock (SCL) cycles. 7. MGC3140 acknowledges (ACK) receipt of the eight data bits by presenting a low on SDA, followed by a low-high-low on SCL. 8. If data transfer is not complete, then go to Step 5. 9. Host presents a Stop bit to the MGC3140 by taking SCL low-high, followed by taking SDA low-to-high. Important:  The Stop condition after an I2C data transmission is generated by the host controller after the data transfer is completed. Thus, it is recommended to verify the number of bytes to be read in the message header (Size field). Host must send the Stop condition as soon as the exact number of bytes specified in the message header has been received. Failing to do so may result in abnormal interface operation. © 2018-2022 Microchip Technology Inc. and its subsidiaries Advance Information Datasheet DS40002037C-page 30 MGC3140 Application Architecture 8. Application Architecture The standard MGC3140 application architecture consists of a MGC3140 controller connected to external electrodes and an application host. For further information on the electrode design, refer to “GestIC Design Guide” (DS40001716). Details on the I2C interface can be found in “MGC3140 - GestIC Library Interface Description User’s Guide” (DS40001875). 8.1 ESD Considerations The MGC3140 provides Electrostatic Discharge (ESD) voltage protection up to 4 kV (HBM) and Charge Device Model (CDM) 750V on corner pins; 500V on all other pins. Additional ESD countermeasures may be implemented individually to meet application-specific requirements. 8.2 Power Noise Considerations MGC3140 filtering capacitors are included in the reference design schematic. 8.3 High-Frequency Noise Immunity In order to suppress irradiated high-frequency signals, the five Rx channels of the chip are connected to the electrodes via serial 10 kΩ resistors, as close as possible to MGC3140. The 10 kΩ resistor and the MGC3140 input capacitance are building a low-pass filter with a corner frequency of 3 MHz. An additional ferrite bead is recommended to suppress the coupling of RF noise to the Tx channel (e.g., 600Ω at 100 MHz). 8.4 RF Emission The Tx pins are used to shape the Tx signal and reduce emission in relevant frequency bands. The slope of the Tx signal is randomized using dithering techniques while the sampling point is kept constant for further reduction of emission. In addition, a RC network on the Tx output will reduce the emission even further. For further support on reduction of RF emission, contact a local Microchip representative. © 2018-2022 Microchip Technology Inc. and its subsidiaries Advance Information Datasheet DS40002037C-page 31 MGC3140 Application Architecture 8.5 Reference Schematic NC NC NC NC R1 = 4.7K ) 10 μF 1 DNC DNC RX0 DNC DNC PGC PGD GP4 GP3 GP2 GP1 North Electrode SYNC 10 KΩ East Electrode WestElectrode Center Electrode NC VDD VDD MCLR South Electrode IS1 IS2 1 2 3 4 5 6 7 8 9 10 11 12 DNC DNC VSS TS GP5 SYNC DNC RX1 DNC DNC MCLR VSS VDD IS1 IS2 RX2 MODE VDD SCL SDA TX4 TX3 TX2 TX1 MGC3140-E/MV 36 35 34 33 32 31 30 29 28 27 26 25 VDD VDD 10 KΩ TX Electrode TX4 R4 = 1K 1) VDD 1.8 KΩ 2) C1 = 470pF 1) 1.8 KΩ 2) R3 = 1K 1) CORECAP TX3 C1 1) R2 = 4.7K 1) 48 47 46 45 44 43 42 41 40 39 38 37 10 KΩ TX2 0.1 μF R0 = 4.7K 1) TX1 0.1 μF Test Point 0.1 μF 10 KΩ Decoupling Caps VDD TX0 MCLR VDD MODE GPIO/IRQ SCL RESET CONTROL SDA HOST TX4 TX3 TX2 TX1 VDD 10 kΩ n.p. VDD n.p. VDD 10 kΩ 10 μF 10 KΩ TX0 10 KΩ 13 14 15 16 17 18 19 20 21 22 23 24 DNC DNC AVDD VSS VANA DNC RX3 DNC DNC RX4 DNC TX0 10 KΩ IS1 10 kΩ 10 kΩ IS2 n.p: not populated Notes:  1. Specific values should be reviewed with a Microchip representative. 2. The values of pull-up resistors need to be chosen to ensure that SCL and SDA rise and fall times meet the I2C specification. The value required will depend on the amount of capacitance loading on the lines. 8.6 Layout Recommendation This section provides a brief description of layout hints for a proper system design. The PCB layout requirements for MGC3140 follow the general rules for a mixed signal design. In addition, there are certain requirements to be considered for the sensor signals and electrode feeding lines. The chip must be placed as close as possible to the electrodes to keep their feeding lines as short as possible. Furthermore, it is recommended to keep MGC3140 away from electrical and thermal sources within the system. A two-layer PCB layout is sufficient to enable analog and digital signals to be separated from each other to minimize crosstalk. The individual electrode feeding lines must be kept as far as possible apart from each other. VDD lines must be routed as wide as possible. MGC3140 requires a proper ground connection on all VSS pins which can be connected together. © 2018-2022 Microchip Technology Inc. and its subsidiaries Advance Information Datasheet DS40002037C-page 32 MGC3140 Development Support 9. Development Support Microchip provides software and hardware development tools for the MGC3140: • Software: – Aurea Software Package – MGC3140 Linux Driver • Schematics: – GestIC Hardware References 9.1 Aurea Software Package The Aurea evaluation software demonstrates Microchip’s GestIC technology and its features and applications. Aurea provides visualization of the MGC3140 generated data and access to GestIC Library controls and configuration parameters. That contains the following: • Visualization of hand position and user gestures • Visualization of sensor data • Real-time control of sensor features • MGC3140 GestIC Library update • Analog front-end parameterization • Advanced sensor parameterization • Logging of sensor values and storage in a log file 9.2 MGC3140 Linux Driver Microchip provides a reference Linux driver which is available on: github.com/MicrochipTech/linux-at91-Gestic. 9.3 GestIC® Hardware References The GestIC Hardware References package contains the PCB Layouts (Gerber files) for the MGC development kits (Emerald, Hillstar and Woodstar) and a collection of electrode reference designs fitting all kits. In addition, the package includes designs, parameter files and host code of various demonstrators which represent complete systems for embedded or PC-based applications. The GestIC Hardware Reference package can be downloaded from Microchip’s website via www.microchip.com/GestICResources. 9.4 Evaluation and Demonstration Kits For the complete list of demonstration, development and evaluation kits, refer to the Microchip website. © 2018-2022 Microchip Technology Inc. and its subsidiaries Advance Information Datasheet DS40002037C-page 33 MGC3140 Electrical Specifications 10. Electrical Specifications 10.1 Absolute Maximum Ratings(†) Parameter Ambient temperature Storage temperature Voltage on VDD with respect to VSS Voltage on non I2C pins with respect to VSS Voltage on I2C pins relative to VSS CAUTION CAUTION 10.2 Notice:  (†) Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure above maximum rating conditions for extended periods may affect device reliability. Notice:  (†) This device is sensitive to ESD damage and must be handled appropriately. Failure to properly handle and protect the device in an application may cause partial to complete failure of the device. Recommended Operating Conditions Parameter Operating temperature Storage temperature VDD VANA AVDD 10.3 Rating -40°C to +125°C -65°C to +150°C 4V -0.3V to +3.6V -0.3V to +5.5V Rating -40°C to +125°C -65°C to +150°C 3.3V ± 5% 3.3V ± 5% 3.3V ± 5% I/O Characteristics DC Input Characteristics Characteristic Symbol Pin Function Rx pins Input low voltage VIL SDA, SCL Rx pins Input high voltage VIH SDA, SCL Rx pins Input leakage IIL current MCLR Operating temperature: -40°C ≤ TA ≤ 125°C Min Max Units Conditions VSS 0.2 VDD V VSS 0.3 VDD V 0.65 VDD VDD V 0.65 VDD 5.5 V ±1 uA VSS ≤ Vpin ≤ VDD ±1 uA VSS ≤ Vpin ≤ VDD Note:  Parameters are characterized, but not tested. © 2018-2022 Microchip Technology Inc. and its subsidiaries Advance Information Datasheet DS40002037C-page 34 MGC3140 Electrical Specifications DC Output Characteristics Characteristic Symbol Pin Function Output low Tx, SDA, SCL, VIL voltage SYNC Output high voltage VIH Tx, SDA, SCL, SYNC Min Operating temperature: -40°C ≤ TA ≤ 125°C Max Units Conditions 0.4 1.5(1) 2.0(1) 2.4(1) 3.0(1) V IOL ≤ 10 mA VDD = 3.3V V V uA uA IOH ≥ -14 mA VDD = 3.3V IOH ≥ -12 mA VDD = 3.3V IOH ≥ -10 mA VDD = 3.3V IOH ≥ -7 mA VDD = 3.3V Note:  1. Parameters are characterized, but not tested. 10.4 Current Consumption Current Consumption mA Typical 29 0.23-2.4(1) 0.085 Operating Mode Processing mode Approach mode Deep Sleep mode Note:  1. Approach mode current consumption is dependent on the Approach mode scan time. The figure below shows the variation of current consumption with scan period. 10.4.1 Approach Scan Current Consumption Figure 10-1. MGC3140 Power Consumption vs Approach Scan Period © 2018-2022 Microchip Technology Inc. and its subsidiaries Advance Information Datasheet DS40002037C-page 35 MGC3140 Electrical Specifications 10.5 Timing Characteristics 10.5.1 Power-on and Reset Timing Table 10-1. Power-on and Reset Parameters Characteristic(1) Power-up period: Internal voltage regulator enabled System delay period: Time required to reload device configuration fuses plus clock delay before first instruction is fetched MCLR minimum pulse width BOR pulse width Parameter Symbol Operating temperature: -40°C ≤ TA ≤ 125°C Min Typical(2) Max Units TPU TSYSDLY TMCLR TBOR — 400 600 us — 1.2 — us 2 — — 1 — — us us Notes:  1. These parameters are characterized, but not tested in manufacture. 2. Data in Typical column is at 3.3V, 25°C, unless otherwise stated. Figure 10-2. Power-on Timings MGC3140 will respond to I2C messages after the Firmware Version message has been transmitted to the host VDD Power on to “Firmware Version" message TS goes high TS line low for duration of transfer 470 ms 600 ms TS 2 ms SDA/SCL 4.9 ms 1.1 ms “Firmware Version” message “SensorDataOutput” messages every 5 ms Note:  Indicated timings are typical values and may vary depending on installed firmware and actual configuration. Timings after release of MCLR are similar to above. Bootloader mode can be entered in the first 600 ms after Reset and will be aborted about 400 ms after the latest message not recognized by bootloader itself (see the document 40001875C – "MGC3140/MGX3141 Library Interface Guide" for a description of commands available in Bootloader mode. © 2018-2022 Microchip Technology Inc. and its subsidiaries Advance Information Datasheet DS40002037C-page 36 MGC3140 Packaging Information 11. Packaging Information Package Marking Information Legend: XX...X Y YY WW NNN e3 Note: Customer-specific information or Microchip part number Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC® designator for Matte Tin (Sn) In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. Rev. 30-009048A 9/04/2017 48-Lead UQFN (6x6x0.5 mm) PIN 1 Example PIN 1 XXXXXXXX XXXXXXXX YYWWNNN 11.1 Package Details The following sections give the technical details of the packages. © 2018-2022 Microchip Technology Inc. and its subsidiaries Advance Information Datasheet DS40002037C-page 37 MMGC3140 Packaging Diagrams and Parameters Packaging Information Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2009 Microchip Technology Inc. © 2018-2022 Microchip Technology Inc. and its subsidiaries DS00049BC-page 95 Advance Information Datasheet DS40002037C-page 38 M Note: MGC3140 Packaging Diagrams and Parameters Packaging Information For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2009 Microchip Technology Inc. DS00049BC-page 94 © 2018-2022 Microchip Technology Inc. and its subsidiaries Advance Information Datasheet DS40002037C-page 39 MGC3140 Packaging Information © 2018-2022 Microchip Technology Inc. and its subsidiaries Advance Information Datasheet DS40002037C-page 40 MGC3140 Revision History 12. Revision History Revision Date Description C 03/2022 Corrected Figure 1-1 for 40 and 41 pin names; other minor corrections. B 01/2021 Added note on TS line usage; updated clarification note on Stop condition usage; updated reference schematics; added note to Figure 10-2 and removed Figure 10-3; updated various pin names and descriptions; removed erroneous references to I2C Address 0x43; removed references to Gesture Port; corrected typographical errors, terminology, and other minor errors A 05/2018 Initial document release © 2018-2022 Microchip Technology Inc. and its subsidiaries Advance Information Datasheet DS40002037C-page 41 MGC3140 The Microchip Website Microchip provides online support via our website at www.microchip.com/. This website is used to make files and information easily available to customers. Some of the content available includes: • • • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software General Technical Support – Frequently Asked Questions (FAQs), technical support requests, online discussion groups, Microchip design partner program member listing Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives Product Change Notification Service Microchip’s product change notification service helps keep customers current on Microchip products. Subscribers will receive email notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, go to www.microchip.com/pcn and follow the registration instructions. Customer Support Users of Microchip products can receive assistance through several channels: • • • • Distributor or Representative Local Sales Office Embedded Solutions Engineer (ESE) Technical Support Customers should contact their distributor, representative or ESE for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in this document. Technical support is available through the website at: www.microchip.com/support © 2018-2022 Microchip Technology Inc. and its subsidiaries Advance Information Datasheet DS40002037C-page 42 MGC3140 Product Identification System To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device [X](1) –X /XX Tape Temperature and Reel Range Device: Package MGC3140 Blank = Tube T = Tape & Reel I = -40°C to +85°C (Industrial) E = -40°C to +125°C (Extended) Package MV = 48-lead UQFN 6x6x0.5mm Pattern QTP, SQTP, Code or Special Requirements (blank otherwise) Tape & Reel Option: Temperature Range: Orderable Part Number Firmware Revision Industrial/ Automotive Description MGC3140-E/MV (supplied in tubes) Industrial 48-pin UQFN48 6x6x0.5 RoHS compliant MGC3140-I/MV (supplied in tubes) Industrial Industrial grade, PPAP requests are not supported MGC3140T-E/MV (supplied in tape and reel) Industrial MGC3140T-I/MV (supplied in tape and reel) Industrial MGC3140-E/MVVAO (supplied in tubes) 3.0.04 Automotive 48-pin UQFN48 6x6x0.5 RoHS compliant MGC3140-I/MVVAO (supplied in tubes) Automotive Automotive grade; suitable for automotive characterization, PPAP requests are supported MGC3140T-E/MVVAO (supplied in tape and reel) Automotive MGC3140T-I/MVVAO (supplied in tape and reel) Automotive Examples: • MGC3140-E/MV: Extended temperature, UQFN package. • MGC3140-I/MV: Industrial temperature, UQFN package Note:  1. Tape and Reel identifier only appears in the catalog part number description. This identifier is used for ordering purposes and is not printed on the device package. Check with your Microchip Sales Office for package availability with the Tape and Reel option. Microchip Devices Code Protection Feature Note the following details of the code protection feature on Microchip products: © 2018-2022 Microchip Technology Inc. and its subsidiaries Advance Information Datasheet DS40002037C-page 43 MGC3140 • • • • Microchip products meet the specifications contained in their particular Microchip Data Sheet. Microchip believes that its family of products is secure when used in the intended manner, within operating specifications, and under normal conditions. Microchip values and aggressively protects its intellectual property rights. Attempts to breach the code protection features of Microchip product is strictly prohibited and may violate the Digital Millennium Copyright Act. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code. Code protection does not mean that we are guaranteeing the product is “unbreakable”. Code protection is constantly evolving. Microchip is committed to continuously improving the code protection features of our products. Legal Notice This publication and the information herein may be used only with Microchip products, including to design, test, and integrate Microchip products with your application. Use of this information in any other manner violates these terms. Information regarding device applications is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. Contact your local Microchip sales office for additional support or, obtain additional support at www.microchip.com/en-us/support/ design-help/client-support-services. THIS INFORMATION IS PROVIDED BY MICROCHIP "AS IS". MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIED WARRANTIES OF NON-INFRINGEMENT, MERCHANTABILITY, AND FITNESS FOR A PARTICULAR PURPOSE, OR WARRANTIES RELATED TO ITS CONDITION, QUALITY, OR PERFORMANCE. IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT, SPECIAL, PUNITIVE, INCIDENTAL, OR CONSEQUENTIAL LOSS, DAMAGE, COST, OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THE INFORMATION OR ITS USE, HOWEVER CAUSED, EVEN IF MICROCHIP HAS BEEN ADVISED OF THE POSSIBILITY OR THE DAMAGES ARE FORESEEABLE. TO THE FULLEST EXTENT ALLOWED BY LAW, MICROCHIP'S TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USE WILL NOT EXCEED THE AMOUNT OF FEES, IF ANY, THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FOR THE INFORMATION. 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Trademarks The Microchip name and logo, the Microchip logo, Adaptec, AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud, CryptoMemory, CryptoRF, dsPIC, flexPWR, HELDO, IGLOO, JukeBlox, KeeLoq, Kleer, LANCheck, LinkMD, maXStylus, maXTouch, MediaLB, megaAVR, Microsemi, Microsemi logo, MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, PolarFire, Prochip Designer, QTouch, SAM-BA, SenGenuity, SpyNIC, SST, SST Logo, SuperFlash, Symmetricom, SyncServer, Tachyon, TimeSource, tinyAVR, UNI/O, Vectron, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AgileSwitch, APT, ClockWorks, The Embedded Control Solutions Company, EtherSynch, Flashtec, Hyper Speed Control, HyperLight Load, IntelliMOS, Libero, motorBench, mTouch, Powermite 3, Precision Edge, ProASIC, ProASIC Plus, ProASIC Plus logo, Quiet- Wire, SmartFusion, SyncWorld, Temux, TimeCesium, TimeHub, TimePictra, TimeProvider, TrueTime, WinPath, and ZL are registered trademarks of Microchip Technology Incorporated in the U.S.A. Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, Augmented Switching, BlueSky, BodyCom, CodeGuard, CryptoAuthentication, CryptoAutomotive, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, Espresso T1S, EtherGREEN, GridTime, IdealBridge, In-Circuit Serial Programming, ICSP, INICnet, Intelligent Paralleling, Inter-Chip Connectivity, JitterBlocker, Knob-on-Display, maxCrypto, maxView, memBrain, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, NVM Express, NVMe, Omniscient Code Generation, PICDEM, © 2018-2022 Microchip Technology Inc. and its subsidiaries Advance Information Datasheet DS40002037C-page 44 MGC3140 PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple Blocker, RTAX, RTG4, SAMICE, Serial Quad I/O, simpleMAP, SimpliPHY, SmartBuffer, SmartHLS, SMART-I.S., storClad, SQI, SuperSwitcher, SuperSwitcher II, Switchtec, SynchroPHY, Total Endurance, TSHARC, USBCheck, VariSense, VectorBlox, VeriPHY, ViewSpan, WiperLock, XpressConnect, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. The Adaptec logo, Frequency on Demand, Silicon Storage Technology, Symmcom, and Trusted Time are registered trademarks of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2018-2022, Microchip Technology Incorporated and its subsidiaries. All Rights Reserved. ISBN: 978-1-6683-0031-2 Quality Management System For information regarding Microchip’s Quality Management Systems, please visit www.microchip.com/quality. © 2018-2022 Microchip Technology Inc. and its subsidiaries Advance Information Datasheet DS40002037C-page 45 Worldwide Sales and Service AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: www.microchip.com/support Web Address: www.microchip.com Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Austin, TX Tel: 512-257-3370 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Novi, MI Tel: 248-848-4000 Houston, TX Tel: 281-894-5983 Indianapolis Noblesville, IN Tel: 317-773-8323 Fax: 317-773-5453 Tel: 317-536-2380 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 Tel: 951-273-7800 Raleigh, NC Tel: 919-844-7510 New York, NY Tel: 631-435-6000 San Jose, CA Tel: 408-735-9110 Tel: 408-436-4270 Canada - Toronto Tel: 905-695-1980 Fax: 905-695-2078 Australia - Sydney Tel: 61-2-9868-6733 China - Beijing Tel: 86-10-8569-7000 China - Chengdu Tel: 86-28-8665-5511 China - Chongqing Tel: 86-23-8980-9588 China - Dongguan Tel: 86-769-8702-9880 China - Guangzhou Tel: 86-20-8755-8029 China - Hangzhou Tel: 86-571-8792-8115 China - Hong Kong SAR Tel: 852-2943-5100 China - Nanjing Tel: 86-25-8473-2460 China - Qingdao Tel: 86-532-8502-7355 China - Shanghai Tel: 86-21-3326-8000 China - Shenyang Tel: 86-24-2334-2829 China - Shenzhen Tel: 86-755-8864-2200 China - Suzhou Tel: 86-186-6233-1526 China - Wuhan Tel: 86-27-5980-5300 China - Xian Tel: 86-29-8833-7252 China - Xiamen Tel: 86-592-2388138 China - Zhuhai Tel: 86-756-3210040 India - Bangalore Tel: 91-80-3090-4444 India - New Delhi Tel: 91-11-4160-8631 India - Pune Tel: 91-20-4121-0141 Japan - Osaka Tel: 81-6-6152-7160 Japan - Tokyo Tel: 81-3-6880- 3770 Korea - Daegu Tel: 82-53-744-4301 Korea - Seoul Tel: 82-2-554-7200 Malaysia - Kuala Lumpur Tel: 60-3-7651-7906 Malaysia - Penang Tel: 60-4-227-8870 Philippines - Manila Tel: 63-2-634-9065 Singapore Tel: 65-6334-8870 Taiwan - Hsin Chu Tel: 886-3-577-8366 Taiwan - Kaohsiung Tel: 886-7-213-7830 Taiwan - Taipei Tel: 886-2-2508-8600 Thailand - Bangkok Tel: 66-2-694-1351 Vietnam - Ho Chi Minh Tel: 84-28-5448-2100 Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4485-5910 Fax: 45-4485-2829 Finland - Espoo Tel: 358-9-4520-820 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany - Garching Tel: 49-8931-9700 Germany - Haan Tel: 49-2129-3766400 Germany - Heilbronn Tel: 49-7131-72400 Germany - Karlsruhe Tel: 49-721-625370 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Germany - Rosenheim Tel: 49-8031-354-560 Israel - Ra’anana Tel: 972-9-744-7705 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Italy - Padova Tel: 39-049-7625286 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Norway - Trondheim Tel: 47-72884388 Poland - Warsaw Tel: 48-22-3325737 Romania - Bucharest Tel: 40-21-407-87-50 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 Sweden - Gothenberg Tel: 46-31-704-60-40 Sweden - Stockholm Tel: 46-8-5090-4654 UK - Wokingham Tel: 44-118-921-5800 Fax: 44-118-921-5820 © 2018-2022 Microchip Technology Inc. and its subsidiaries Advance Information Datasheet DS40002037C-page 46