MIC2025-2YM-TR

MIC2025/2075 Single-Channel Power Distribution Switch Features General Description • • • • • The MIC2025 and MIC2075 are high-side MOSFET switches optimized for general-purpose power distribution requiring circuit protection. • • • • • • • • 140 mΩ Maximum On-Resistance 2.7V to 5.5V Operating Range 500 mA Minimum Continuous Output Current Short-Circuit Protection with Thermal Shutdown Fault Status Flag with 3 ms Filter Eliminates False Assertions Undervoltage Lockout Reverse Current Flow Blocking (No “Body Diode”) Circuit Breaker Mode (MIC2075) Reduces Power Consumption Logic-Compatible Input Soft-Start Circuit Low Quiescent Current Pin Compatible with MIC2525 UL File #E179633 Applications • • • • • • USB Peripherals General Purpose Power Switching ACPI Power Distribution Notebook PCs PDAs PC Card Hot Swap The MIC2025/75 are internally current limited and have thermal shutdown that protects the device and load. The MIC2075 offers “smart” thermal shutdown that reduces current consumption in fault modes. When a thermal shutdown fault occurs, the output is latched off until the faulty load is removed. Removing the load or toggling the enable input will reset the device output. Both devices employ soft-start circuitry that minimizes inrush current in applications where highly capacitive loads are employed. A fault status output flag is provided that is asserted during overcurrent and thermal shutdown conditions. The MIC2025/75 are available in the 8-Pin MSOP and 8-Pin SOIC packages. Package Type MIC2025/2075 8-Pin SOIC (YM) 8-Pin MSOP(YMM) MIC2025/75  2018 Microchip Technology Inc. EN 1 8 OUT FLG 2 7 IN GND 3 6 OUT NC 4 5 NC DS20006030A-page 1 MIC2025/2075 Functional Block Diagram EN THERMAL SHUTDOWN OSC. 1.2V REFERENCE UVLO CHARGE PUMP IN CURRENT LIMIT GATE CONTROL FLAG RESPONSE DELAY OUT FLG GND Typical Application Circuit VCC 2.7V to 5.5V 10k Logic Controller VIN 1μF ON/OFF OVERCURRENT GND MIC2025/75 EN OUT FLG IN GND OUT NC Load NC 0.1μF DS20006030A-page 2  2018 Microchip Technology Inc. MIC2025/2075 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings † Supply Voltage (VIN) .................................................................................................................................... –0.3V to +6V Fault Flag Voltage (VFLG)............................................................................................................................................+6V Fault Flag Current (IFLG) .........................................................................................................................................25 mA Output Voltage (VOUT) ................................................................................................................................................+6V Output Current (IOUT)............................................................................................................................. Internally Limited Enable Input (IEN) ................................................................................................................................. –0.3V to VIN + 3V ESD Rating .......................................................................................................................................................... (Note 1) Operating Ratings ‡ Supply Voltage (VIN) ................................................................................................................................. +2.7V to +5.5V † Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended periods may affect device reliability. Specifications are for packaged product only. ‡ Notice: The device is not guaranteed to function outside its operating ratings. Note 1: Devices are ESD sensitive. Handling precautions are recommended. TABLE 1-1: ELECTRICAL CHARACTERISTICS Electrical Characteristics: VIN = +5V; TA = +25°C, Bold values indicate –40°C ≤ TA ≤ +85°C; unless otherwise specified. Parameter Supply Current Symbol Min. Typ. Max. Units — 0.75 5 µA MIC20x5-1, VEN ≤ 0.8V (switch off), OUT = open — 0.75 5 µA MIC20x5-2, VEN ≥ 2.4V (switch off), OUT = open — — 160 µA MIC20x5-1, VEN ≥ 2.4V (switch on), OUT = open — — 160 µA MIC20x5-2, VEN ≤ 0.8V (switch on), OUT = open IDD Conditions — 2.1 2.4 V Low-to-High Transition VEN 0.8 1.9 — V High-to-Low Transition — 200 — mV — Enable Input Current IEN –1 0.01 1 µA VEN = 0V to 5.5V Control Input Capacitance — — 1 — pF — — 90 140 mΩ VIN = 5V, IOUT = 500 mA Enable Input Voltage Enable Input Hysteresis Switch Resistance RDS(ON) — 100 160 mΩ VIN = 3.3V, IOUT = 500 mA Output Leakage Current — — — 10 µA MIC2025/2075 (output off) OFF Current in Latched Thermal Shutdown — — 50 — µA MIC2075 (during thermal shutdown state) Output Turn-On Delay tON 1 2.5 6 ms RL = 10Ω, CL = 1 µF, (see Timing Diagrams) tR 0.5 2.3 5.9 ms RL = 10Ω, CL = 1 µF, (see Timing Diagrams) tOFF — 50 100 µs RL = 10Ω, CL = 1 µF, (see Timing Diagrams) Output Turn-On Rise Time Output Turn-Off Delay  2018 Microchip Technology Inc. DS20006030A-page 3 MIC2025/2075 Electrical Characteristics: VIN = +5V; TA = +25°C, Bold values indicate –40°C ≤ TA ≤ +85°C; unless otherwise specified. Parameter Symbol Min. Typ. Max. Units tF — 50 100 µs RL = 10Ω, CL = 1 µF, (see Timing Diagrams) Short-Circuit Output Current ILIMIT 0.5 0.7 1.25 A VOUT = 0V, enabled into short-circuit Current-Limit Threshold (See Figure 2-22) — 0.60 0.85 1.25 A Ramped load applied to output Short-Circuit Response Time — — 24 — µs VOUT = 0V to IOUT = ILIMIT (short applied to output) 1.5 3 7 ms VIN = 5V, apply VOUT = 0V until FLG low 1.5 3 8 ms VIN = 3.3V, apply VOUT = 0V until FLG low 2.2 2.5 2.7 V 2.0 2.3 2.5 V VIN Falling — 8 25 Ω IL = 10 mA, VIN = 5V — 11 40 Ω IL = 10 mA, VIN = 3.3V — — 10 µA VFLAG = 5V Output Turn-Off Fall Time Overcurrent Flag Response Delay Undervoltage Lockout Threshold Error Flag Output Resistance Error Flag Off Current Overtemperature Threshold DS20006030A-page 4 tD Conditions VIN Rising — 140 — °C TJ increasing — 120 — °C TJ decreasing  2018 Microchip Technology Inc. MIC2025/2075 TEMPERATURE SPECIFICATIONS (Note 1) Parameters Sym. Min. Typ. Max. Units Conditions Storage Temperature Range TS –65 — +150 °C — Ambient Temperature Range TA –40 — +85 °C — Junction Temperature Range TJ — — — °C Internally Limited Thermal Resistance SOIC 8-LD JA — 160 — °C/W — Thermal Resistance MSOP 8-LD JA — 206 — °C/W — Temperature Ranges Package Thermal Resistances Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Test Circuit VOUT Device Under OUT Test IOUT RL FIGURE 1-1: CL MIC2025/2075 Test Circuit.  2018 Microchip Technology Inc. DS20006030A-page 5 MIC2025/2075 Timing Diagrams tR tF 90% 90% VOUT 10% FIGURE 1-2: 10% Output Rise and Fall Times. VEN 50% tOFF tON 90% VOUT 10% FIGURE 1-3: Active-Low Switch Delay Time (MIC20x5-2). VEN 50% tOFF tON VOUT 90% 10% FIGURE 1-4: DS20006030A-page 6 Active-High Switch Delay Times (MIC20x5-1).  2018 Microchip Technology Inc. MIC2025/2075 2.0 Note: TYPICAL PERFORMANCE CURVES The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. 180 200 160 120 5V CURRENT (PA) CURRENT (PA) 140 100 80 60 3.3V 40 150 -40qC 100 50 +25qC +85qC 20 0 -40 -20 0 20 40 60 80 100 TEMPERATURE (qC) FIGURE 2-1: Temperature. Supply On-Current vs. 0 2.5 FIGURE 2-4: Voltage. 5.5 Supply On-Current vs. Input 200 160 140 120 3.3V 100 5V 80 60 40 IOUT = 500mA RESISTANCE (m:) ON-RESISTANCE (m:) 3.0 3.5 4.0 4.5 5.0 INPUT VOLTAGE (V) +85qC 100 +25qC 50 -40qC IOUT = 500mA 20 0 2.5 0 -40 -20 0 20 40 60 80 100 TEMPERATURE (qC) FIGURE 2-2: Temperature. On-Resistance vs. VIN = 3.3V VIN = 5V RL=10: CL=1PF 1 0 -40 -20 0 20 40 60 80 100 TEMPERATURE (qC) FIGURE 2-3: Temperature. On-Resistance vs. Input 4.0 3 2 5.5 5.0 Turn-On rise Time vs.  2018 Microchip Technology Inc. RISE TIME (ms) 4 3.0 3.5 4.0 4.5 5.0 INPUT VOLTAGE (V) FIGURE 2-5: Voltage. 5 RISE TIME (ms) 150 +85qC 3.0 +25qC -40qC 2.0 1.0 0 2.5 FIGURE 2-6: Voltage. RL=10: CL=1PF 3.0 3.5 4.0 4.5 5.0 INPUT VOLTAGE (V) 5.5 Turn-On Rise Time vs. Input DS20006030A-page 7 MIC2025/2075 800 1000 +25qC 800 CURRENT LIMIT (mA) CURRENT LIMIT (mA) 700 VIN = 3.3V 600 400 VIN = 5V 200 600 +85qC 500 -40qC 400 300 200 100 0 2.5 0 -40 -20 0 20 40 60 80 100 TEMPERATURE (qC) Short-Circuit Current-Limit 1200 1000 VIN = 3.3V 800 600 VIN = 5V 400 200 0 -40 -20 0 20 40 60 80 100 TEMPERATURE (qC) FIGURE 2-8: Temperature. Current-Limit Threshold vs. FIGURE 2-10: vs. Input Voltage. CURRENT LIMIT THRESHOLD (mA) CURRENT LIMIT THRESHOLD (mA) FIGURE 2-7: vs. Temperature. FIGURE 2-11: Input Voltage. VEN RISING 1.5 VEN FALLING 1.0 0.5 VIN = 5V 0 -40 -20 0 20 40 60 80 100 TEMPERATURE (qC) Enable Threshold vs. ENABLE THRESHOLD (V) ENABLE THRESHOLD (V) 5.5 Current-Limit Threshold vs. 2.5 2.0 DS20006030A-page 8 5.5 Short-Circuit Current-Limit 1200 1100 1000 900 800 700 600 +85qC +25qC -40qC 500 400 300 200 100 0 2.5 3.0 3.5 4.0 4.5 5.0 INPUT VOLTAGE (V) 2.5 FIGURE 2-9: Temperature. 3.0 3.5 4.0 4.5 5.0 INPUT VOLTAGE (V) 2.0 VEN RISING 1.5 1.0 VEN FALLING 0.5 TA = 25qC 0 2.5 FIGURE 2-12: Voltage. 3.0 3.5 4.0 4.5 5.0 INPUT VOLTAGE (V) 5.5 Enable Threshold vs. Input  2018 Microchip Technology Inc. MIC2025/2075 VIN = 3.3V VIN VFLG (1V/div.) (1V/div.) 4 VIN = 5V 2 VOUT (2V/div.) 3 1 IOUT (100mA/div.) DELAY TIME (ms) 5 0 -40 -20 0 20 40 60 80 100 TEMPERATURE (qC) FIGURE 2-13: Flag Delay vs. Temperature. 2.5V VEN = VIN VIN = 5V CL = 57μF RL = 35 TIME (10ms/div.) FIGURE 2-16: (MIC2025-1). UVLO VIN Rising 3 VIN VFLG (2V/div.) (2V/div.) 4 +85qC +25qC 2 -40qC 1 0 2.5 FIGURE 2-14: Voltage. 2.3V VOUT IOUT (100mA/div.) (2V/div.) DELAY TIME (ms) 5 3.0 3.5 4.0 4.5 5.0 INPUT VOLTAGE (V) VEN = VIN VIN = 5V CL = 57μF RL = 35 5.5 Flag Delay vs. Input TIME (25ms/div.) FIGURE 2-17: (MIC2025-1). UVLO VIN Falling 2.0 VIN FALLING 1.5 1.0 IOUT (200mA/div.) UVLO THRESHOLD (V) VIN RISING 2.5 VEN VOUT VFLG (5V/div.) (5V/div.) (10V/div.) 3.0 0.5 0 -40 -20 0 20 40 60 80 100 TEMPERATURE (qC) FIGURE 2-15: Temperature. UVLO Threshold vs.  2018 Microchip Technology Inc. 640mA VIN = 5V CL = 147μF RL = 35 144mA TIME (1ms/div.) FIGURE 2-18: (MIC2025-1). Turn-On Response DS20006030A-page 9 VIN VFLG (5V/div.) (10V/div.) VIN = 5V CL = 47μF Short Removed VOUT (5V/div.) VIN = 5V CL = 147μF RL = 35 144mA IOUT (500mA/div.) IOUT (200mA/div.) VEN VOUT VFLG (5V/div.) (5V/div.) (10V/div.) MIC2025/2075 Short-Circuit Current (650mA) Current-Limit Threshold (780mA) Thermal Shutdown TIME (2.5ms/div.) FIGURE 2-19: (MIC2025-1). TIME (100ms/div.) Turn-Off Response FIGURE 2-22: Current-Limit Response (Ramped Load Into Short MIC2025-1). Load VIN = 5V RL = 35 CL = 310μF CL = 210μF VOUT (5V/div.) VFLG (5V/div.) VEN VFLG (5V/div.) (10V/div.) No Load VIN = 5V CL = 47μF IOUT (5A/div.) IOUT (200mA/div.) CL = 110μF CL = 10μF 640mA Short-Circuit Current TIME (500ms/div.) TIME (1ms/div.) VEN VFLG (5V/div.) (10V/div.) FIGURE 2-20: (MIC2025-1). In-Rush Current Response FIGURE 2-23: Current-Limit Transient Response (Enable Into Short MIC2025-1). No Load Load 3.1ms (tD) VIN = 5V CL = 47μF TIME (1ms/div.) FIGURE 2-21: (MIC2025-1). DS20006030A-page 10 Enable Into Short VOUT (5V/div.) 640mA Short-Circuit Current IOUT (5A/div.) VOUT IOUT (500mA/div.) (2V/div.) VIN = 5V 24μs 640mA Short-Circuit Current TIME (10ms/div.) FIGURE 2-24: Current-Limit Transient Response (MIC2025-1).  2018 Microchip Technology Inc. VOUT (5V/div.) VEN VFLG (5V/div.) (10V/div.) MIC2025/2075 Output Latched Off IOUT (500mA/div.) Ramped Load to a Short Output is Reset (Load Removed) Thermal Shutdown VIN = 5V TIME (100ms/div.) VIN = 5V Enable Reset Output Reset IOUT (500mA/div.) VOUT (5V/div.) VEN VFLG (5V/div.) (10V/div.) FIGURE 2-25: Thermal Shutdown Response (Output Reset By Removing Load MIC2075-1). Ramped Load to a Short RL = 35 Thermal Shutdown RL = 35 TIME (100ms/div.) FIGURE 2-26: Thermal Shutdown Response (Output Reset By Toggling Enable MIC2075-1).  2018 Microchip Technology Inc. DS20006030A-page 11 MIC2025/2075 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE Pin Number Pin Name 1 EN Switch Enable (Input): Active-high (-1) or Active-low (-2). 2 FLG Fault Flag (Output): Active-low, open-drain output. Indicates overcurrent or thermal shutdown conditions. Overcurrent condition must exceed tD in order to assert FLG. 3 GND 4 NC 5 NC 6, 8 OUT 7 IN DS20006030A-page 12 Description Ground. Not internally connected. Not internally connected. Supply (Output): Pins must be connected together. Supply voltage (Input).  2018 Microchip Technology Inc. MIC2025/2075 4.0 FUNCTIONAL DESCRIPTION 4.1 Input and Output IN is the power supply connection to the logic circuitry and the drain of the output MOSFET. OUT is the source of the output MOSFET. In a typical circuit, current flows from IN to OUT toward the load. If VOUT is greater than VIN, current will flow from OUT to IN, since the switch is bidirectional when enabled. The output MOSFET and driver circuitry are also designed to allow the MOSFET source to be externally forced to a higher voltage than the drain (VOUT > VIN) when the switch is disabled. In this situation, the MIC2025/75 prevents undesirable current flow from OUT to IN. 4.2 Thermal Shutdown Thermal shutdown is employed to protect the device from damage should the die temperature exceed safe margins due mainly to short circuit faults. Thermal shutdown shuts off the output MOSFET and asserts the FLG output if the die temperature reaches 140°C. The MIC2025 will automatically reset its output should the die temperature cool down to 120°C. The MIC2025 output and FLG signal will continue to cycle on and off until the device is disabled or the fault is removed. Figure 4-2 depicts typical timing. If the MIC2075 goes into thermal shutdown, its output will latch off and a pull-up current source is activated. This allows the output latch to automatically reset when the load (such as a USB device) is removed. The output can also be reset by toggling EN. Refer to Figure 4-1 for details. Depending on PCB layout, package, ambient temperature, etc., it may take several hundred milliseconds from the incidence of the fault to the output MOSFET being shut off. The worst-case scenario of thermal shutdown is that of a short-circuit fault and is shown in Figure 2-25 and Figure 2-26. Load Removed (Output Reset) VE N Short-Circuit Faul t VOUT ID C Load/Fault Removed VOUT ILIMIT IDC IOUT Thermal Shutdown Reached VF L G tD FIGURE 4-2: 4.3 MIC2025-2 Timing. Power Dissipation The device’s junction temperature depends on several factors such as the load, PCB layout, ambient temperature, and package type. Equations that can be used to calculate power dissipation and junction temperature are found in Equation 4-1 and Equation 4-2. EQUATION 4-1: P D = R DS  on   I OUT2 EQUATION 4-2: T J = P D   JA + T A Where: TJ = Junction Temperature TA = Ambient Temperature JA = The Thermal Resistance of the Package ILIMIT IOUT Short-Circuit Faul t VE N Thermal Shutdown Reached VF L G tD FIGURE 4-1: MIC2075-2 Timing: Output Reset by Removing Load. 4.4 Current Sensing and Limiting The current-limit threshold is preset internally. The preset level prevents damage to the device and external load but still allows a minimum current of 500 mA to be delivered to the load. The current-limit circuit senses a portion of the output MOSFET switch current. The current-sense resistor shown in the Functional Block Diagram is virtual and has no voltage drop. The reaction to an overcurrent condition varies with three scenarios:  2018 Microchip Technology Inc. DS20006030A-page 13 MIC2025/2075 4.4.1 SWITCH ENABLED INTO SHORT-CIRCUIT If a switch is enabled into a heavy load or short-circuit, the switch immediately enters into a constant-current mode, reducing the output voltage. The FLG signal is asserted indicating an overcurrent condition. See Figure 2-21. 4.4.2 SHORT-CIRCUIT APPLIED TO ENABLED OUTPUT When a heavy load or short-circuit is applied to an enabled switch, a large transient current may flow until the current-limit circuitry responds. Once this occurs, the device limits current to less than the short-circuit current limit specification. See Figure 2-23. 4.4.3 CURRENT-LIMIT RESPONSE RAMPED LOAD The MIC2025/75 current-limit profile exhibits a small foldback effect of about 200 mA. Once this current-limit threshold is exceeded the device switches into a constant current mode. It is important to note that the device will supply current until the current-limit threshold is exceeded. See Figure 2-22. DS20006030A-page 14 4.5 Fault Flag The FLG signal is an N-channel open-drain MOSFET output. FLG is asserted (active-low) when either an overcurrent or thermal shutdown condition occurs. In the case of an overcurrent condition, FLG will be asserted only after the flag response delay time, tD, has elapsed. This ensures that FLG is asserted only upon valid overcurrent conditions and that erroneous error reporting is eliminated. For example, false overcurrent conditions can occur during hot plug events when a highly capacitive load is connected and causes a high transient inrush current that exceeds the current-limit threshold. The FLG response delay time tD is typically 3 ms. 4.6 Undervoltage Lockout Undervoltage lockout (UVLO) prevents the output MOSFET from turning on until VIN exceeds approximately 2.5V. Undervoltage detection functions only when the switch is enabled.  2018 Microchip Technology Inc. MIC2025/2075 5.0 APPLICATION INFORMATION 5.1 Supply Filtering A 0.1 µF to 1 µF bypass capacitor positioned close to VIN and GND of the device is strongly recommended to control supply transients. Without a bypass capacitor, an output short may cause sufficient ringing on the input (from supply lead inductance) to damage internal control circuitry. 5.2 Printed Circuit Board Hot-Plug VBUS, soft-start is necessary. Although the hub can consume up to 500 mA from the upstream bus, the hub must consume only 100 mA max at start-up, until it enumerates with the host prior to requesting more power. The same requirements apply for bus-powered peripherals that have no downstream ports. Equation 5-4 shows a bus-powered hub. MIC2025-2 1 VC C 2 The MIC2025/75 are ideal inrush current-limiters for hot plug applications. Due to their integrated charge pumps, the MIC2025/75 present a high impedance when off and slowly become a low impedance as their integrated charge pumps turn on. This soft-start feature effectively isolates power supplies from highly capacitive loads by reducing inrush current. Equation 5-1 shows how the MIC2075 may be used in a card hot-plug application. In cases of extremely large capacitive loads (>400 µF), the length of the transient due to inrush current may exceed the delay provided by the integrated filter. Since this inrush current exceeds the current-limit delay specification, FLG will be asserted during this time. To prevent the logic controller from responding to FLG being asserted, an external RC filter, as shown in Equation 5-2, can be used to filter out transient FLG assertion. The value of the RC time constant should be selected to match the length of the transient, less tD(min) of the MIC2025/75. 5.3 to "Hot" Receptacle 0.1 μF 3 4 EN OUT FLG IN GND OUT NC NC 8 7 Backend Function 6 5 CB U L K GND Adaptor Card FIGURE 5-1: Hot-Plug Application. V+ Logic Controller MIC2025 10k 1 OVERCURRENT R C 2 3 4 FIGURE 5-2: EN OUT FLG IN GND OUT NC NC 8 7 6 5 Transient Filter. Universal Serial Bus (USB) Power Distribution The MIC2025/75 are ideally suited for USB (Universal Serial Bus) power distribution applications. The USB specification defines power distribution for USB host systems such as PCs and USB hubs. Hubs can either be self-powered or bus-powered (that is, powered from the bus). Equation 5-3 shows a typical USB Host application that may be suited for mobile PC applications employing USB. The requirement for USB host systems is that the port must supply a minimum of 500 mA at an output voltage of 5V ±5%. In addition, the output power delivered must be limited to below 25 VA. Upon an overcurrent condition, the host must also be notified. To support hot-plug events, the hub must have a minimum of 120 µF of bulk capacitance, preferably low ESR electrolytic or tantalum. Please refer to Application Note 17 for more details on designing compliant USB hub and host systems. For bus-powered hubs, USB requires that each downstream port be switched on or off under control by the host. Up to four downstream ports each capable of supplying 100 mA at 4.4V minimum are allowed. In addition, to reduce voltage droop on the upstream  2018 Microchip Technology Inc. DS20006030A-page 15 MIC2025/2075 VC C 5.0V 4.50V to 5.25V Upstream VB U S 100mA max. VB U S 10k 3.3V MIC5203-3.3 IN D+ 1μF D– 3.3V USB Controller VIN OUT 1μF GND Ferrite Beads MIC2025/75 ON/OFF EN OVERCURRENT GND GND FLG IN GND OUT NC VB U S OUT D+ 0.01μF 120μF D– USB Port GND NC 0.1μF Data Data FIGURE 5-3: USB Host Application. 1.5k 3.3V USB Upstream Connector MIC5203-3.3 (LDO) VB U S IN D+ D– OUT USB Logic Controller VIN GND GND ON/OFF OVERCURRENT GND 0.1μF 0.1μF 1.5K DS20006030A-page 16 EN IN GND OUT NC VB U S OUT FLG D+ 120μF 0.01μF D– GND NC USB Downstream Connector (Up to four ganaged ports) 0.1μF Data Data FIGURE 5-4: Ferrite Beads MIC2025/75 USB Bus-Powered Hub.  2018 Microchip Technology Inc. MIC2025/2075 6.0 PACKAGING INFORMATION 6.1 Package Marking Information 8-Lead SOIC* XXXX -XXX WNNN 8-Lead MSOP* XXXX -XXXX Legend: XX...X Y YY WW NNN e3 * Example 2025 -2YM 3031 Example 2025 -1YMM Product code or customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC® designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. ●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle mark). Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. Package may or may not include the corporate logo. Underbar (_) and/or Overbar (‾) symbol may not be to scale.  2018 Microchip Technology Inc. DS20006030A-page 17 MIC2025/2075 8-Lead SOIC-8 Package Outline and Recommended Land Pattern Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging. DS20006030A-page 18  2018 Microchip Technology Inc. MIC2025/2075 8-Lead MSOP-8 Package Outline and Recommended Land Pattern Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging.  2018 Microchip Technology Inc. DS20006030A-page 19 MIC2025/2075 DS20006030A-page 20  2018 Microchip Technology Inc. MIC2025/2075 APPENDIX A: REVISION HISTORY Revision A (June 2018) • Converted Micrel document MIC2025/2075 to Microchip data sheet DS20006030A. • Minor text changes throughout.  2018 Microchip Technology Inc. DS20006030A-page 21 MIC2025/2075 NOTES: DS20006030A-page 22  2018 Microchip Technology Inc. MIC2025/2075 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office. PART NO. Device –X X Control/ Enable XX –XX Package Media Type Junction Temperature Range Examples: a) MIC2025-1YM: Single Channel Power Distribution Switch, Active-High Control Enable, –40°C to +85°C Temp. Range, 8-Lead SOIC Package, 95/Tube Device: MIC2025: Single Channel Power Distribution Switch MIC2075: Single Channel Power Distribution Switch with Circuit Breaker Mode b) MIC2025-2YMM: Single Channel Power Distribution Switch, Active-Low Control Enable, –40°C to +85°C Temp. Range, 8-Lead MSOP Package, 100/Tube Control/Enable: 1 2 = = Active-High Active-Low c) MIC2025-1YM-TR: Junction Temperature Range: Y = –40°C to +85°C (RoHs Compliant, PbFree, Halogen Free) Single Channel Power Distribution Switch, Active-High Control Enable, –40°C to +85°C Temp. Range, 8-Lead SOIC Package, 2,500/Reel d) MIC2025-2YMM-TR: Package: M = MM = 8-Lead SOIC 8-Lead MSOP Single Channel Power Distribution Switch, Active-Low Control Enable, –40°C to +85°C Temp. Range, 8-Lead MSOP Package, 2,500/ Reel Media Type: Blank = Blank = TR = 95/Tube 100/Tube 2,500/Reel e) MIC2075-1YM Single Channel Power Distribution Switch with Circuit Breaker Mode, Active-High Control Enable, –40°C to +85°C Temp. Range, 8-Lead SOIC Package, 95/Tube f) MIC2075-1YM-TR: Single Channel Power Distribution Switch with Circuit Breaker Mode, Active-High Control Enable, –40°C to +85°C Temp. Range, 8-Lead SOIC Package, 2,500/Reel g) MIC2075-2YMM-TR: Single Channel Power Distribution Switch with Circuit Breaker Mode, Active-Low Control Enable, –40°C to +85°C Temp. Range,8-Lead MSOP Package, 2,500/Reel Note 1:  2018 Microchip Technology Inc. Tape and Reel identifier only appears in the catalog part number description. This identifier is used for ordering purposes and is not printed on the device package. Check with your Microchip Sales Office for package availability with the Tape and Reel option. DS20006030A-page 23 MIC2025/2075 DS20006030A-page 24  2018 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV Trademarks The Microchip name and logo, the Microchip logo, AnyRate, AVR, AVR logo, AVR Freaks, BeaconThings, BitCloud, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KEELOQ, KEELOQ logo, Kleer, LANCheck, LINK MD, maXStylus, maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip Designer, QTouch, RightTouch, SAM-BA, SpyNIC, SST, SST Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. ClockWorks, The Embedded Control Solutions Company, EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS, mTouch, Precision Edge, and Quiet-Wire are registered trademarks of Microchip Technology Incorporated in the U.S.A. Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo, CodeGuard, CryptoAuthentication, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, Mindi, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PureSilicon, QMatrix, RightTouch logo, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2018, Microchip Technology Incorporated, All Rights Reserved. ISBN: 978-1-5224-3276-0 == ISO/TS 16949 ==  2018 Microchip Technology Inc. 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