MIC2033-10AYM6-T5

MIC2033 High-Accuracy, High-Side, Fixed Current-Limit Power Switch Features General Description • ±5% Current-Limit Accuracy • Input Supply Range from 2.5V to 5.5V • Low Quiescent Current: 100 µA Typical (Switch ON) • 75 mΩ Typical RDS(ON) at 5V • Current-Limit Options: 0.5A, 0.8A, 1A, and 1.2A • Soft-Start Control via an External Capacitor • Undervoltage Lockout (UVLO) • Fast Response Time (10 µs) to Short-Circuit Loads • Fault Status Output Flag • Logic Controlled Enable (Active-High, Active-Low) • Thermal Shutdown • Pin Compatible with MIC2005 • 6-Pin 2 mm x 2 mm Thin DFN and 6-Pin SOT-23 Packages • Junction Temperature Range from –40°C to +125°C The MIC2033 is a high-side MOSFET power distribution switch that provides increased system reliability, utilizing 5% current-limit accuracy. Applications • • • • The MIC2033 has an operating input voltage range from 2.5V to 5.5V, is internally current-limited and has thermal shutdown to protect the device and system. The MIC2033 is offered with either active-high or active-low logic level enable input controls, has an open-drain fault status output flag with a built-in 32 ms delay that asserts low during over current or thermal shutdown conditions. The MIC2033 is available in several different fixed current-limit options: 0.5A, 0.8A, 1A, and 1.2A. A capacitor-adjustable soft-start circuit minimizes inrush current in applications where high capacitive loads are used. The MIC2033 is offered in both 6-pin SOT-23 and 6-pin 2 mm x 2 mm thin DFN packages. The MIC2033 has an operating junction temperature range of –40°C to +125°C. USB Peripherals and USB 2.0/3.0-Compatible DTV/STB Notebooks and Consumer Electronics General Purpose Power Distribution Package Types MIC2033 SOT-23-6 (M6) MIC2033 2x2 TDFN (MT) (Note 1) VIN 1 6 VOUT GND 2 5 EN 3 4 VOUT 1 CSLEW CSLEW 2 FAULT/ FAULT/ 3 EP 6 VIN 5 GND 4 EN Note 1: Thin DFN ▲ = Pin 1 identifier.  2018 - 2022 Microchip Technology Inc. and its subsidiaries. DS20005539B-page 1 MIC2033 Typical Application Circuit MIC2033 2x2 TDFN VIN 5V 6 C1 47μF 6.3V R1 10Kȍ C3 0.1μF 4 3 2 VIN VOUT 1 VOUT 5.0V/1A C2 100μF 6.3V EN FAULT/ CSLEW GND 5 Functional Block Diagram POWER FET VIN UVLO THERMAL SENSOR VOUT SENSE FET CURRENT LIMIT DELAY FAULT/ EN CSLEW DS20005539B-page 2 CONTROL SLEW RATE CONTROL REFERENCE GND  2018 - 2022 Microchip Technology Inc. and its subsidiaries. MIC2033 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings † VIN to GND................................................................................................................................................... –0.3V to +6V VOUT to GND..................................................................................................................................................–0.3V to VIN VCSLEW to GND ................................................................................................................................. –0.3V to VIN + 0.3V VEN to GND.................................................................................................................................................. –0.3V to +6V VFAULT/ to GND .................................................................................................................................. –0.3V to VIN + 0.3V FAULT/ Current (IFAULT/) .........................................................................................................................................25 mA Maximum Power Dissipation (PD).......................................................................................................... Internally Limited ESD Rating (HBM) (Note 1) ....................................................................................................................................... 3 kV ESD Rating (MM) (Note 1) ........................................................................................................................................ 300V Operating Ratings ‡ Supply Voltage (VIN) ................................................................................................................................. +2.5V to +5.5V VEN ............................................................................................................................................................ –0.3V to +5.5V VCSLEW, VOUT ................................................................................................................................................–0.3V to VIN † Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended periods may affect device reliability. ‡ Notice: The device is not guaranteed to function outside its operating ratings. Note 1: Devices are ESD sensitive. Handling precautions are recommended. Human body model, 1.5 kΩ in series with 100 pF.  2018 - 2022 Microchip Technology Inc. and its subsidiaries. DS20005539B-page 3 MIC2033 ELECTRICAL CHARACTERISTICS Electrical Characteristics: VIN = VEN = 5V, CIN = 1 µF, CCSLEW = OPEN, COUT = 1 µF; TJ = +25°C, unless noted. Bold values indicate –40°C ≤ TJ ≤ +125°C. (Note 1). Symbol Parameters Min. Typ. Max. Units Conditions V — Power Supply Input VIN Input Voltage Range 2.5 — 5.5 VUVLO Input Supply Undervoltage Lockout Threshold 2.0 2.25 2.5 1.9 2.15 2.4 VUVLOHYS Input Supply Undervoltage Lockout Threshold Hysteresis — 100 — — 0.75 5 V mV µA Supply Current IDD VIN rising VIN falling VIN rising or VIN falling Switch OFF; Active-High Enable (A): VEN = 0V, VIN = 5V, IOUT = 0A Switch OFF; Active-Low Enable (B): VEN = VIN = 5V, IOUT = 0A Switch ON; Active-High Enable (A): VEN = 1.5V, VIN = 5V, IOUT = 0A — 100 300 — 100 177 — 85 145 — 75 125 0.22 15 0.475 0.5 0.525 MIC2033-05xxxx, VOUT = 0.8*VIN 0.76 0.8 0.84 MIC2033-08xxxx, VOUT = 0.8*VIN 0.95 1.0 1.05 MIC2033-10xxxx, VOUT = 0.8*VIN 1.14 1.2 1.26 MIC2033-12xxxx, VOUT = 0.8*VIN — — 0.5 1.5 — — µA Switch ON; Active-Low Enable (B): VEN = 0V, VIN = 5V, IOUT = 0A Power MOSFET Switch On-Resistance RDS(ON) Output Leakage Current ILKG VIN = 2.5V, IOUT = 350 mA mΩ VIN = 3.3V, IOUT = 350 mA VIN = 5V, IOUT = 350 mA µA Switch OFF, VOUT = 0V Current-Limit ILIMIT Current-Limit Accuracy A I/O Enable Voltage IEN Enable Input Current — 1 — µA 0V ≤ VEN ≤ 5V RFLAG Fault Flag Output Resistance — — 25 Ω IOUT = 10 mA Note 1: 2: 3: 4: V Logic-Low VEN Logic-High Specification for packaged product only. See Timing Diagrams. CCSLEW values above 0.1 µF are not recommended. For dynamic current loads faster than typically 30 mA/ms. Slower current loads will delay the deactivation of VOUT and the current limitation, allowing FAULT/ to be asserted before these. DS20005539B-page 4  2018 - 2022 Microchip Technology Inc. and its subsidiaries. MIC2033 ELECTRICAL CHARACTERISTICS (CONTINUED) Electrical Characteristics: VIN = VEN = 5V, CIN = 1 µF, CCSLEW = OPEN, COUT = 1 µF; TJ = +25°C, unless noted. Bold values indicate –40°C ≤ TJ ≤ +125°C. (Note 1). Symbol Parameters Min. Typ. Max. Units Conditions IFLAG_OFF Fault Flag Off Current — — 10 µA VFLAG = VIN RFAULT/ FAULT/ Output Resistance — — 25 Ω IOUT = 10 mA IFAULT/_OFF FAULT/ Off Current — — 10 µA VFAULT/ = VIN ICSLEW CSLEW Input Current (Note 2) — 0.6 — µA VCSLEW = VIN Thermal Protection TTSD Thermal Shutdown Temperature — 157 — °C TJ rising TTSDHYS Thermal Shutdown Hysteresis — 15 — °C — Timing Specifications (AC Parameters) tRISE Output Turn-on Rise Time (Note 2) — 700 — µs RLOAD = 10Ω; COUT = 1 µF tFALL Output Turn-off Fall Time (Note 2) — 32 — µs VEN = OFF; RLOAD = 10Ω; COUT = 1 µF tON_DLY Output Turn-on Delay (Note 2) — 700 — µs RLOAD = 10Ω; COUT = 1 µF tOFF_DLY Output Turn-off Delay (Note 2) — 5 — µs RLOAD = 10Ω; COUT = 1 µF tSC_RESP Short Circuit Response Time (Note 2, Note 3) — 10 — ms VOUT = 0V (short-circuit); CCSLEW = 0.1 µF tSC_RESP Short Circuit Response Time (Note 2) — 10 — µs VOUT = 0V (short-circuit); CCSLEW = OPEN tFAULT/ Overcurrent Fault Response Delay Time (Note 2, Note 4) 16 32 49 ms — Note 1: 2: 3: 4: Specification for packaged product only. See Timing Diagrams. CCSLEW values above 0.1 µF are not recommended. For dynamic current loads faster than typically 30 mA/ms. Slower current loads will delay the deactivation of VOUT and the current limitation, allowing FAULT/ to be asserted before these.  2018 - 2022 Microchip Technology Inc. and its subsidiaries. DS20005539B-page 5 MIC2033 TEMPERATURE SPECIFICATIONS Parameters Sym. Min. Typ. Max. Units Conditions Junction Operating Temperature Range TJ –40 — +125 °C Note 1 Storage Temperature Range TS –65 — +150 °C — Lead Temperature — — — +260 °C Soldering, 10s Thermal Resistance SOT-23-6 JA — 177.2 — °C/W — Thermal Resistance 6-pin 2 mm x 2 mm DFN JA — 90 — °C/W — Temperature Ranges Package Thermal Resistances Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability. DS20005539B-page 6  2018 - 2022 Microchip Technology Inc. and its subsidiaries. MIC2033 2.0 Note: TYPICAL PERFORMANCE CURVES The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. FIGURE 2-1: Temperature. Input Supply Current vs. FIGURE 2-4: RDS(ON) vs. Temperature. FIGURE 2-2: Temperature. VIN OFF Current vs. FIGURE 2-5: RDS(ON) vs. Temperature. FIGURE 2-3: Temperature. Undervoltage Lockout vs. FIGURE 2-6: RDS(ON) vs. Output Current.  2018 - 2022 Microchip Technology Inc. and its subsidiaries. DS20005539B-page 7 MIC2033 FIGURE 2-7: RDS(ON) vs. Output Current. FIGURE 2-10: Temperature. Current Limit vs. FIGURE 2-8: RDS(ON) vs. Output Current. FIGURE 2-11: Temperature. Current Limit vs. FIGURE 2-9: RDS(ON) vs. Output Current. FIGURE 2-12: Temperature. Current Limit vs. DS20005539B-page 8  2018 - 2022 Microchip Technology Inc. and its subsidiaries. MIC2033 FIGURE 2-13: Temperature. Current Limit vs. FIGURE 2-16: Temperature. FAULT/ Pin Resistance vs. FIGURE 2-14: Current. VIN - VOUT vs. Output FIGURE 2-17: Temperature. FAULT/ Response Time vs. VIN (2V/div) VFAULT/ (2V/div) VIN = 3.3V ILOAD = 500mA CCSLEW = 0.1μF COUT = 1μF VOUT (2V/div) IIN (500mA/div) Time (4ms/div) FIGURE 2-15: Current. VIN - VOUT vs. Output  2018 - 2022 Microchip Technology Inc. and its subsidiaries. FIGURE 2-18: Soft-Start Turn-On. DS20005539B-page 9 MIC2033 VIN (2V/div) VFAULT/ (2V/div) VIN = 3.3V ILOAD = 500mA CCSLEW = 0.1μF COUT = 1μF VOUT (2V/div) VIN (2V/div) IIN (500mA/div) VOUT (2V/div) IIN (500mA/div) Time (2ms/div) FIGURE 2-19: Time (100μs/div) Soft-Start Turn-Off. VEN (5V/div) FIGURE 2-22: VOUT (2V/div) VFAULT/ (5V/div) VIN = 5V ILOAD = 500mA CCSLEW = 0.1μF COUT = 1μF MIC2033-05BYM6 VOUT (2V/div) VIN = 5V ILOAD = 500mA CCSLEW = 0.1μF COUT = 1μF MIC2033-05BYM6 DS20005539B-page 10 Time (20μs/div) MIC2033-05BYM6 FIGURE 2-23: Current-Limit Response, 400 mA Steady State Load. VFAULT/ (5V/div) VOUT (1V/div) VIN (2V/div) VOUT (2V/div) FIGURE 2-21: VIN = 3.3V ILOAD = 400mA (Steady State), Output short applied CCSLEW = 0.1μF COUT = 1μF Time (10ms/div) Enable Turn-On. VEN (5V/div) Turn-On into Short-Circuit. IIN (1A/div) Time (100μs/div) FIGURE 2-20: VIN = 5V ILOAD = Short Circut CCSLEW = 0.1μF CIN = 1μF COUT = 1μF MIC2033-12AYM6 Enable Turn-Off. IIN (500mA/div) FIGURE 2-24: VIN = 5V ILOAD = MOSFET load turned on such that VOUT = (0.8×VIN) CCSLEW = OPEN COUT = 1μF MIC2033-10AYM6 Time (4ms/div) Current-Limit Response.  2018 - 2022 Microchip Technology Inc. and its subsidiaries. MIC2033 VFAULT/ (5V/div) VIN = 5V ILOAD = 0A to S.C., 75ms pulse CCSLEW = 0.1μF COUT = 68μF MIC2033-12AYM6 VIN (2V/div) VOUT (2V/div) VOUT (2V/div) IIN (1A/div) VFAULT/ (5V/div) FIGURE 2-25: Short-Circuit. VIN (2V/div) VOUT (2V/div) IIN (200mA/div) Time (20ms/div) Output Recovery from VIN = 5V ILOAD = 0A to S.C. to 0A, 120ms pulse CCSLEW = 0.1μF COUT = 68μF Time (10ms/div) FIGURE 2-28: VOUT (2V/div) IIN (500mA/div) Time (20ms/div) FIGURE 2-26: VOUT Recovery from Thermal Shutdown. Turn-On into 50% Overload. VFAULT/ (5V/div) IIN (1A/div) VFAULT/ (5V/div) VIN = 5V ILOAD =750mA (RLOAD = 6.6Ÿ) CCSLEW = 0.1μF CIN = 1μF COUT = 1μF MIC2033-05BYM6 FIGURE 2-29: VIN = 5V ILOAD = 500mA to 1.5A overload CCSLEW = 0.1μF CIN = 1μF COUT = 1μF MIC2033-12AYM6 Time (40ms/div) 1.5A Overload Response. VFAULT/ (5V/div) VOUT (2V/div) IIN (200mA/div) FIGURE 2-27: Overload. VIN = 5V ILOAD = 580mA (RLOAD = 8.6Ÿ) CCSLEW = 0.1μF CIN = 1μF COUT = 1μF MIC2033-05BYM6 Time (10ms/div) Turn-On into Minimal  2018 - 2022 Microchip Technology Inc. and its subsidiaries. DS20005539B-page 11 MIC2033 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE Pin Number SOT-23-6L Pin Number Thin DFN Pin Name 1 6 VIN 2 5 GND 3 4 EN 4 3 FAULT/ Fault Status Flag (Output): Active-low, open-drain output. A logic-low state indicates an overcurrent or thermal shutdown condition. An overcurrent condition must last longer than tFAULT/ in order to assert FAULT/. A pull-up resistor (10 kΩ recommended) to an external supply is required. 5 2 CSLEW Slew Rate Control: Adjustable soft-start input. Adding a small value capacitor from CSLEW to VIN slows the turn-on time of the power MOSFET. 6 1 VOUT Switch Output: Power switch output. — EP ePad Exposed Pad: Exposed pad on bottom side of package. Connect to electrical ground for optimum thermal dissipation. DS20005539B-page 12 Description Input: Power switch and logic supply input. Ground: Input and output return pin. Enable (Input): Logic compatible, enable control input that allows turn-on/off of the switch. Do not leave the EN pin floating.  2018 - 2022 Microchip Technology Inc. and its subsidiaries. MIC2033 4.0 FUNCTIONAL DESCRIPTION The MIC2033 is a high-side MOSFET power distribution switch providing increased system reliability utilizing 5% current-limit accuracy. The MIC2033 has an operating input voltage range from 2.5V to 5.5V and is internally current-limited and has thermal shutdown that protects the device and system. 4.1 Soft-Start Soft-start reduces the power supply input surge current at startup by controlling the output voltage rise time. The input surge appears while the output capacitor is charged up. A slower output rise time will draw a lower input surge current. During soft-start, an internal current sink discharges the external capacitor at CSLEW to ground to control the ramp of the output voltage. The output voltage rise time is dependent upon the value of CCSLEW, the input voltage, output voltage, and the current limit. The value of the CSLEW external capacitor is recommended to be 0.1 µF. 4.2 Input Capacitor A 1 µF to 100 µF ceramic input capacitor is recommended for most applications. The input capacitor must be placed on the same side of the board and next to the MIC2033 to minimize the voltage ringing during transient and short circuit conditions. It is also recommended to use two vias for each end of the capacitor to connect to the power and ground plane. X7R or X5R dielectric ceramic capacitors are recommended because of their temperature performance. X7R-type capacitors change capacitance by 15% over their operating temperature range and are the most stable type of ceramic capacitors. Z5U and Y5V dielectric capacitors change value by as much as 50% and 60% respectively over their operating temperature ranges. To use a ceramic chip capacitor with Y5V dielectric, the value must be much higher than an X7R ceramic or a tantalum capacitor to ensure the same capacitance value over the operating temperature range. 4.3 Output Capacitor The output capacitor type and placement criteria are the same as the input capacitor. or shorts on VOUT can result in stresses beyond the device's absolute maximum ratings, even for short cables, which will damage the device. 4.4 Enable The MIC2033 offers either an active-high or active-low enable input (EN) that allows ON/OFF control of the switch output. The current through the device reduces to near zero when the device is shutdown, with only microamperes of leakage current. The EN input may be directly tied to VIN or driven by a voltage that is equal to or less than VIN, but do not leave this pin floating. Care should be taken to ensure that the EN pin does not exceed VIN by more than 500 mV at any time. This includes at power-up and during load transients. Whenever possible, it is recommended to tie EN to VIN through a pull-up resistor and use an open-drain or open-collector device to change the state. 4.5 Current Limit The MIC2033 is available with four fixed current-limit settings: 0.5A, 0.8A, 1A, and 1.2A. If the output current exceeds the set current limit, then the MIC2033 switch will enter constant current-limit mode. The maximum allowable current limit may be less than the full specified and/or expected current if the MIC2033 is not mounted on a circuit board with sufficiently low thermal resistance. The MIC2033 responds within 10 µs to short-circuits to limit the output current and also provides an output fault flag that will assert (low) for an overcurrent condition that lasts longer than 32 ms. 4.6 Thermal Design To help reduce the thermal resistance, the ePad (underneath the IC) should be soldered to the PCB ground and the placement of thermal vias either underneath or near the ePad is highly recommended. Thermal design requires the following application-specific parameters: • • • • Maximum ambient temperature (TA) Output current (IOUT) Input voltage (VIN) Current Limit (ILIMIT) Care must be taken when choosing the output capacitance for inductive loads. Without sufficient capacitance or clamping devices, sudden disconnects When the MIC2033 is in constant current-limit mode, it may exceed the overtemperature threshold. If this occurs, the overtemperature condition will shut down the MIC2033 switch and the fault status flag will go active (assert low). After the switch cools down, it will turn on again. The MIC2033 power dissipation can be maximized by either lowering the thermal resistance on the exposed pad (only the DFN package has an exposed pad) on the printed circuit board, or by limiting the maximum allowable ambient temperature.  2018 - 2022 Microchip Technology Inc. and its subsidiaries. DS20005539B-page 13 The exact amount of capacitance depends upon the specific application. For example, USB applications will typically use 150 µF, whereas local consumers, such as microcontrollers, may require as little as 1 µF. MIC2033 4.7 Thermal Measurements It is always wise to measure the IC’s case temperature to make sure that it is within its operating limits. Although this might seem like a very elementary task, it is very easy to get erroneous results. The most common mistake is to use the standard thermal couple that comes with the thermal voltage meter. This thermal couple wire gauge is large, typically 22 gauge, and behaves like a heatsink, resulting in a lower case measurement. There are two suggested methods for measuring the IC case temperature: a thermal couple or an infrared thermometer. If a thermal couple is used, it must be constructed of 36 gauge wire or higher to minimize the wire heatsinking effect. In addition, the thermal couple tip must be covered in either thermal grease or thermal glue to make sure that the thermal couple junction is making good contact to the case of the IC. This thermal couple from Omega (5SC-TT-K-36-36) is adequate for most applications. To avoid this messy thermal couple grease or glue, an infrared thermometer is recommended. Most infrared thermometers’ spot size is too large for an accurate reading on small form factor ICs. However, an IR thermometer from Optris has a 1 mm spot size, which makes it ideal for the 2 mm x 2 mm DFN package. Also, get the optional stand. The stand makes it easy to hold the beam on the IC for long periods of time. DS20005539B-page 14  2018 - 2022 Microchip Technology Inc. and its subsidiaries. MIC2033 5.0 TIMING DIAGRAMS V EN 0 tFALL tRISE 90% VOUT 90% 10% 10% 0 t FIGURE 5-1: Output Rise/Fall Time. V EN 50% 50% 0 tON_DLY tOFF_DLY 90% VOUT 10% 0 t FIGURE 5-2: Turn-On/Off Delay.  2018 - 2022 Microchip Technology Inc. and its subsidiaries. DS20005539B-page 15 MIC2033 V FAULT/ 0 tFAULT/ VOUT 0 tSC_RESP ILIMIT IOUT 0 FIGURE 5-3: DS20005539B-page 16 t Short-Circuit Response Time and Overcurrent Fault Flag Delay.  2018 - 2022 Microchip Technology Inc. and its subsidiaries. MIC2033 6.0 PACKAGING INFORMATION 6.1 Package Marking Information 6-Lead SOT-23* XXX 6-Lead TDFN* XXX NNN Legend: XX...X Y YY WW NNN e3 * Example 36A Example 3A5 722 Product code or customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC® designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. ●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle mark). Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. Package may or may not include the corporate logo. Underbar (_) and/or Overbar (‾) symbol may not be to scale.  2018 - 2022 Microchip Technology Inc. and its subsidiaries. DS20005539B-page 17 MIC2033 6-Lead TDFN 2 mm x 2 mm Package Outline and Recommended Land Pattern Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS20005539B-page 18  2018 - 2022 Microchip Technology Inc. and its subsidiaries. MIC2033 6-Lead SOT-23 Package Outline and Recommended Land Pattern Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2018 - 2022 Microchip Technology Inc. and its subsidiaries. DS20005539B-page 19 MIC2033 NOTES: DS20005539B-page 20  2018 - 2022 Microchip Technology Inc. and its subsidiaries. MIC2033 APPENDIX A: REVISION HISTORY Revision A (March 2018) • Converted Micrel document MIC2033 to Microchip data sheet DS20005539A. • Minor text changes throughout. • Value of C1 updated in Typical Application Circuit. • Maximum value of input capacitor corrected in Input Capacitor section. • VEN to GND corrected maximum value in Absolute Maximum Ratings †. • VEN and VFAULT/ combined in Operating Ratings ‡. • CCSLEW value corrected to OPEN in Figure 2-24. • CSLEW external capacitor value in the Soft-Start section corrected to 0.1 µF. Revision B (January 2022) • Updated package marking drawing in Section 6.1, Package Marking Information.  2018 - 2022 Microchip Technology Inc. and its subsidiaries. DS20005539B-page 21 MIC2033 NOTES: DS20005539B-page 22  2018 - 2022 Microchip Technology Inc. and its subsidiaries. MIC2033 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office. PART NO. Device – X XX X XX Current Enable Temperature Package Limit Device: MIC2033: Current Limit: 05 55 08 10 12 Enable: A B = = Active-High Active-Low Temperature: Y = –40°C to +125°C Package: M6 = MT = SOT-23-6L 6-Lead 2 mm x 2 mm TDFN (Note 1) T5 TR 500/Reel 3,000/Reel Media Type: Note 1: = = = = = = = – XX Examples: a) MIC2033-05AYM6-T5: High-Accuracy, High-Side, b) MIC2033-55AYMT-TR: High-Accuracy, High-Side, c) MIC2033-08BYM6-TR: d) MIC2033-10BYMT-T5: High-Accuracy, High-Side, e) MIC2033-12AYM6-T5: High-Accuracy, High-Side, f) MIC2033-12BYMT-TR: High-Accuracy, High-Side, Fixed Current-Limit Power Switch, 0.5A Current Limit, Active-High Enable, –40°C to +125°C Temp. Range, SOT-23-6L Package, 500/ Reel Media Type High-Accuracy, High-Side, Fixed CurrentLimit Power Switch 0.5A 0.55A 0.8A 1.0A 1.2A Fixed Current-Limit Power Switch, 0.55A Current Limit Active-High Enable, –40°C to +125°C Temp. Range, 6-Pin 2 mm x 2 mm TDFN Package, 3,000/Reel Fixed Current-Limit Power Switch, 1.0A Current Limit Active-Low Enable, –40°C to +125°C Temp. Range, 6-Pin 2 mm x 2 mm TDFN Package, 500/Reel Thin DFN is a GREEN RoHS-compliant package. Lead finish is NiPdAu. Mold compound is Halogen Free. Fixed Current-Limit Power Switch, 1.2A Current Limit, Active-High Enable, –40°C to +125°C Temp. Range, SOT-23-6L Package, 500/ Reel Note 1:  2018 - 2022 Microchip Technology Inc. and its subsidiaries. High-Accuracy, High-Side, Fixed Current-Limit Power Switch, 0.8A Current Limit, Active-Low Enable, –40°C to +125°C Temp. Range, SOT-23-6L Package, 3,000/Reel Fixed Current-Limit Power Switch, 1.2A Current Limit Active-Low Enable, –40°C to +125°C Temp. Range, 6-Pin 2 mm x 2 mm TDFN Package, 3,000/Reel Tape and Reel identifier only appears in the catalog part number description. This identifier is used for ordering purposes and is not printed on the device package. Check with your Microchip Sales Office for package availability with the Tape and Reel option. DS20005539B-page 23 MIC2033 NOTES: DS20005539B-page 24  2018 - 2022 Microchip Technology Inc. and its subsidiaries. Note the following details of the code protection feature on Microchip products: • Microchip products meet the specifications contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is secure when used in the intended manner, within operating specifications, and under normal conditions. • Microchip values and aggressively protects its intellectual property rights. Attempts to breach the code protection features of Microchip product is strictly prohibited and may violate the Digital Millennium Copyright Act. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code. Code protection does not mean that we are guaranteeing the product is “unbreakable”. Code protection is constantly evolving. Microchip is committed to continuously improving the code protection features of our products. This publication and the information herein may be used only with Microchip products, including to design, test, and integrate Microchip products with your application. Use of this information in any other manner violates these terms. Information regarding device applications is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. Contact your local Microchip sales office for additional support or, obtain additional support at https:// www.microchip.com/en-us/support/design-help/client-supportservices. THIS INFORMATION IS PROVIDED BY MICROCHIP "AS IS". MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIED WARRANTIES OF NONINFRINGEMENT, MERCHANTABILITY, AND FITNESS FOR A PARTICULAR PURPOSE, OR WARRANTIES RELATED TO ITS CONDITION, QUALITY, OR PERFORMANCE. IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT, SPECIAL, PUNITIVE, INCIDENTAL, OR CONSEQUENTIAL LOSS, DAMAGE, COST, OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THE INFORMATION OR ITS USE, HOWEVER CAUSED, EVEN IF MICROCHIP HAS BEEN ADVISED OF THE POSSIBILITY OR THE DAMAGES ARE FORESEEABLE. TO THE FULLEST EXTENT ALLOWED BY LAW, MICROCHIP'S TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USE WILL NOT EXCEED THE AMOUNT OF FEES, IF ANY, THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FOR THE INFORMATION. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Trademarks The Microchip name and logo, the Microchip logo, Adaptec, AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud, CryptoMemory, CryptoRF, dsPIC, flexPWR, HELDO, IGLOO, JukeBlox, KeeLoq, Kleer, LANCheck, LinkMD, maXStylus, maXTouch, MediaLB, megaAVR, Microsemi, Microsemi logo, MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, PolarFire, Prochip Designer, QTouch, SAM-BA, SenGenuity, SpyNIC, SST, SST Logo, SuperFlash, Symmetricom, SyncServer, Tachyon, TimeSource, tinyAVR, UNI/O, Vectron, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AgileSwitch, APT, ClockWorks, The Embedded Control Solutions Company, EtherSynch, Flashtec, Hyper Speed Control, HyperLight Load, IntelliMOS, Libero, motorBench, mTouch, Powermite 3, Precision Edge, ProASIC, ProASIC Plus, ProASIC Plus logo, QuietWire, SmartFusion, SyncWorld, Temux, TimeCesium, TimeHub, TimePictra, TimeProvider, TrueTime, WinPath, and ZL are registered trademarks of Microchip Technology Incorporated in the U.S.A. Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, Augmented Switching, BlueSky, BodyCom, CodeGuard, CryptoAuthentication, CryptoAutomotive, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, Espresso T1S, EtherGREEN, GridTime, IdealBridge, In-Circuit Serial Programming, ICSP, INICnet, Intelligent Paralleling, Inter-Chip Connectivity, JitterBlocker, Knob-on-Display, maxCrypto, maxView, memBrain, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, NVM Express, NVMe, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple Blocker, RTAX, RTG4, SAM-ICE, Serial Quad I/O, simpleMAP, SimpliPHY, SmartBuffer, SmartHLS, SMART-I.S., storClad, SQI, SuperSwitcher, SuperSwitcher II, Switchtec, SynchroPHY, Total Endurance, TSHARC, USBCheck, VariSense, VectorBlox, VeriPHY, ViewSpan, WiperLock, XpressConnect, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. The Adaptec logo, Frequency on Demand, Silicon Storage Technology, Symmcom, and Trusted Time are registered trademarks of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2018 - 2022, Microchip Technology Incorporated and its subsidiaries. All Rights Reserved. For information regarding Microchip’s Quality Management Systems, please visit www.microchip.com/quality.  2018 - 2022 Microchip Technology Inc. and its subsidiaries. ISBN: 978-1-5224-9574-1 DS20005539B-page 25 Worldwide Sales and Service AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://www.microchip.com/ support Web Address: www.microchip.com Australia - Sydney Tel: 61-2-9868-6733 India - Bangalore Tel: 91-80-3090-4444 China - Beijing Tel: 86-10-8569-7000 India - New Delhi Tel: 91-11-4160-8631 Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 China - Chengdu Tel: 86-28-8665-5511 India - Pune Tel: 91-20-4121-0141 China - Chongqing Tel: 86-23-8980-9588 Japan - Osaka Tel: 81-6-6152-7160 China - Dongguan Tel: 86-769-8702-9880 Japan - Tokyo Tel: 81-3-6880- 3770 China - Guangzhou Tel: 86-20-8755-8029 Korea - Daegu Tel: 82-53-744-4301 China - Hangzhou Tel: 86-571-8792-8115 Korea - Seoul Tel: 82-2-554-7200 China - Hong Kong SAR Tel: 852-2943-5100 Malaysia - Kuala Lumpur Tel: 60-3-7651-7906 China - Nanjing Tel: 86-25-8473-2460 Malaysia - Penang Tel: 60-4-227-8870 China - Qingdao Tel: 86-532-8502-7355 Philippines - Manila Tel: 63-2-634-9065 China - Shanghai Tel: 86-21-3326-8000 Singapore Tel: 65-6334-8870 China - Shenyang Tel: 86-24-2334-2829 Taiwan - Hsin Chu Tel: 886-3-577-8366 China - Shenzhen Tel: 86-755-8864-2200 Taiwan - Kaohsiung Tel: 886-7-213-7830 China - Suzhou Tel: 86-186-6233-1526 Taiwan - Taipei Tel: 886-2-2508-8600 China - Wuhan Tel: 86-27-5980-5300 Thailand - Bangkok Tel: 66-2-694-1351 China - Xian Tel: 86-29-8833-7252 Vietnam - Ho Chi Minh Tel: 84-28-5448-2100 Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Austin, TX Tel: 512-257-3370 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Novi, MI Tel: 248-848-4000 Houston, TX Tel: 281-894-5983 Indianapolis Noblesville, IN Tel: 317-773-8323 Fax: 317-773-5453 Tel: 317-536-2380 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 Tel: 951-273-7800 Raleigh, NC Tel: 919-844-7510 New York, NY Tel: 631-435-6000 San Jose, CA Tel: 408-735-9110 Tel: 408-436-4270 Canada - Toronto Tel: 905-695-1980 Fax: 905-695-2078 DS20005539B-page 26 China - Xiamen Tel: 86-592-2388138 China - Zhuhai Tel: 86-756-3210040 Denmark - Copenhagen Tel: 45-4485-5910 Fax: 45-4485-2829 Finland - Espoo Tel: 358-9-4520-820 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany - Garching Tel: 49-8931-9700 Germany - Haan Tel: 49-2129-3766400 Germany - Heilbronn Tel: 49-7131-72400 Germany - Karlsruhe Tel: 49-721-625370 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Germany - Rosenheim Tel: 49-8031-354-560 Israel - Ra’anana Tel: 972-9-744-7705 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Italy - Padova Tel: 39-049-7625286 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Norway - Trondheim Tel: 47-7288-4388 Poland - Warsaw Tel: 48-22-3325737 Romania - Bucharest Tel: 40-21-407-87-50 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 Sweden - Gothenberg Tel: 46-31-704-60-40 Sweden - Stockholm Tel: 46-8-5090-4654 UK - Wokingham Tel: 44-118-921-5800 Fax: 44-118-921-5820  2018 - 2022 Microchip Technology Inc. and its subsidiaries. 09/14/21