MIC2039
High-Accuracy, High-Side, Adjustable Current-Limit Power Switch
Features
General Description
• ±5% Current-Limit Accuracy
• Input Supply Range from 2.5V to 5.5V
• Low Quiescent Current: 100 µA Typical (Switch
ON)
• 75 mΩ Typical RDS(ON) at 5V
• 0.2A to 2.5A Adjustable Output Current
• Kickstart: Momentary Secondary Current-Limit
Threshold (120 ms period)
• Soft-Start Functionality
• Undervoltage Lockout (UVLO)
• Fast 10 µs Short-Circuit Response Time
(Non-Kickstart Options)
• Fault Status Output Flag
• Logic Controlled Enable (Active-High, Active-Low)
• Thermal Shutdown
• Pin Compatible with MIC2009/MIC2019
• 6-Pin 2 mm x 2 mm UDFN and 6-Pin SOT-23
Packages
• Junction Temperature Range from –40°C to
+125°C
The MIC2039 is a high-side MOSFET power
distribution switch that provides increased system
reliability by using 5% current-limit accuracy.
Applications
The MIC2039 is available in 6-pin SOT-23 and 6-pin
2 mm x 2 mm UDFN packages. The MIC2039 has an
operating junction temperature range of –40°C to
+125°C.
•
•
•
•
USB Peripherals and USB 2.0/3.0-Compatible
DTV/STB
Notebooks and Consumer Electronics
General Purpose Power Distribution
The MIC2039 has an operating input voltage range
from 2.5V to 5.5V, is internally current-limited, and has
thermal shutdown to protect the device and system.
The MIC2039 is offered with either active-high or
active-low logic level enable input controls. It has an
open drain fault status output flag with a built-in 32 ms
delay that asserts low during overcurrent or
thermal-shutdown conditions.
The MIC2039 features an adjustable output current
limit that is resistor-programmable from 0.2A to 2.5A.
The MIC2039 also offers a unique kickstart feature that
allows momentary high-current surges up to the
secondary current limit (ILIMIT_2nd) during startup or
while operating in steady-state. This is useful for
charging loads with high inrush currents, such as
capacitors. After an overcurrent condition is
established, these switches enter into a constant
current-limit mode unless the die temperature exceeds
the thermal-shutdown specification.
Package Types
MIC2039
SOT-23-6 (M6)
MIC2039
2x2 UDFN (MT) (Note 1)
VIN
1
6
VOUT
GND
2
5
ILIMIT
EN
3
4
VOUT
1
ILIMIT
2
FAULT/
3
EP
6
VIN
5
GND
4
EN
FAULT/
Note 1: UDFN ▲ = Pin 1 identifier.
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
DS20005540B-page 1
MIC2039
Typical Application Circuit
MIC2039
SOT-23-6
MIC2039-AYM6
VIN
5V
C1
47μF
6.3V
R1
1K
VIN
VOUT
EN
ILIMIT
FAULT/
VOUT
5V/1A
C2
100μF
6.3V
R2
287
GND
Functional Block Diagram
POWER FET
VIN
VOUT
SENSE FET
UVLO
THERMAL
SENSOR
CURRENT
LIMIT
DELAY
FAULT /
EN
CONTROL
REFERENCE
ILIMIT
DS20005540B-page 2
GND
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
MIC2039
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
VIN to GND................................................................................................................................................... –0.3V to +6V
VOUT to GND..................................................................................................................................................–0.3V to VIN
VILIMIT to GND.................................................................................................................................... –0.3V to VIN + 0.3V
VEN to GND....................................................................................................................................................–0.3V to VIN
VFAULT/ to GND .................................................................................................................................. –0.3V to VIN + 0.3V
FAULT/ Current (IFAULT/) .........................................................................................................................................25 mA
Maximum Power Dissipation (PD).......................................................................................................... Internally Limited
ESD Rating (HBM) (Note 1) ....................................................................................................................................... 3 kV
ESD Rating (MM) (Note 1) ........................................................................................................................................300V
Operating Ratings ‡
Supply Voltage (VIN) ................................................................................................................................. +2.5V to +5.5V
VEN .................................................................................................................................................................–0.3V to VIN
VFAULT/ ...................................................................................................................................................... –0.3V to +5.5V
VILIMIT, VOUT ..................................................................................................................................................–0.3V to VIN
† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at those or any other conditions above those indicated
in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended
periods may affect device reliability.
‡ Notice: The device is not guaranteed to function outside its operating ratings.
Note 1: Devices are ESD sensitive. Handling precautions are recommended. Human body model, 1.5 kΩ in series
with 100 pF.
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
DS20005540B-page 3
MIC2039
ELECTRICAL CHARACTERISTICS
Electrical Characteristics: VIN = VEN = 5V, CIN = 1 µF; TJ = +25°C, unless noted. Bold values indicate –40°C ≤ TJ
≤ +125°C. (Note 1).
Symbol
Parameters
Min.
Typ.
Max.
Units
Conditions
V
—
Power Supply Input
VIN
Input Voltage Range
2.5
—
5.5
VUVLO
Input Supply Undervoltage
Lockout Threshold
2.0
2.25
2.5
1.9
2.15
2.4
VUVLOHYS
Input Supply Undervoltage
Lockout Threshold Hysteresis
—
100
—
—
0.75
5
V
mV
µA
Supply Current
IDD
—
100
300
—
100
177
—
85
145
—
75
125
0.22
15
µA
VIN rising
VIN falling
VIN rising or VIN falling
Switch OFF; Active-High
Enable (A): VEN = 0V, VIN = 5V,
IOUT = 0A
Switch OFF; Active-Low
Enable (B): VEN = 1.5V, VIN =
5V, IOUT = 0A
Switch ON; Active-High Enable
(A): VEN = 1.5V, VIN = 5V,
IOUT = 0A
Switch ON; Active-Low Enable
(B): VEN = 0V, VIN = 5V,
IOUT = 0A
Power MOSFET
Switch On-Resistance
RDS(ON)
Output Leakage Current
ILKG
VIN = 2.5V, IOUT = 350 mA
mΩ
VIN = 3.3V, IOUT = 350 mA
VIN = 5V, IOUT = 350 mA
µA
Switch OFF, VOUT = 0V
Current Limit
ILIMIT
ILIMIT_2ND
Note 1:
2:
3:
Current Limit (Resistor Values
are Standard 0.1% Values)
Secondary Current Limit
(Kickstart parts only)
RLIMIT = 115Ω, VIN = 5V,
VOUT = 0.8V × VIN
2.35
2.5
2.65
1.90
2.0
2.10
0.95
1.0
1.05
RLIMIT = 287Ω, VIN = 5V,
VOUT = 0.8V × VIN
0.475
0.50
0.525
RLIMIT = 576Ω, VIN = 5V,
VOUT = 0.8V × VIN
0.19
0.20
0.21
RLIMIT = 1.45 kΩ, VIN = 5V,
VOUT = 0.8V × VIN
2.2
3.2
6.0
RLIMIT = 115Ω, VIN = 2.5V,
VOUT = 0V
A
A
RLIMIT = 145Ω, VIN = 5V,
VOUT = 0.8V × VIN
VOUT = 0V
Specification for packaged product only.
See Timing Diagrams.
For dynamic current loads faster than typically 30 mA/ms. Slower current loads will delay the deactivation
of VOUT and the current limitation, allowing FAULT/ to be asserted before these.
DS20005540B-page 4
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
MIC2039
ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Characteristics: VIN = VEN = 5V, CIN = 1 µF; TJ = +25°C, unless noted. Bold values indicate –40°C ≤ TJ
≤ +125°C. (Note 1).
Symbol
Parameters
Min.
Typ.
Max.
—
—
0.5
1.5
—
—
Units
Conditions
I/O
V
Logic-Low
VEN
Enable Voltage
IEN
Enable Input Current
—
1
—
µA
0V ≤ VEN ≤ 5V
RFAULT/
FAULT/ Output Resistance
—
—
25
Ω
IOUT = 10 mA
IFAULT/_OFF
FAULT/ Off Current
—
—
10
µA
VFAULT/ = VIN
Logic-High
Thermal Protection
TSD
Thermal Shutdown Threshold
—
157
—
°C
TJ rising
TSDHYS
Thermal Shutdown Hysteresis
—
15
—
°C
—
Timing Specifications (AC Parameters)
tRISE
Output Turn-On Rise Time
(Note 2)
—
700
—
µs
RLOAD = 10Ω; COUT = 1 µF
tFALL
Output Turn-Off Fall Time
(Note 2)
—
32
—
µs
VEN = OFF; RLOAD = 10Ω;
COUT = 1 µF
tON_DLY
Output Turn-On Delay (Note 2)
—
700
—
µs
RLOAD = 10Ω; COUT = 1 µF
tOFF_DLY
Output Turn-Off Delay (Note 2)
—
5
—
µs
RLOAD = 10Ω; COUT = 1 µF
tSC_RESP
Short Circuit Response Time
(Note 2, Note 3)
—
10
—
µs
VOUT = 0V (short-circuit)
tFAULT/
Overcurrent Fault Response
Delay Time (Note 2, Note 3)
16
32
49
ms
Non-kickstart parts.
tKICKSTART
Overcurrent Fault Response
Delay During Kickstart
(Note 2)
64
120
200
ms
Kickstart parts only.
Note 1:
2:
3:
Specification for packaged product only.
See Timing Diagrams.
For dynamic current loads faster than typically 30 mA/ms. Slower current loads will delay the deactivation
of VOUT and the current limitation, allowing FAULT/ to be asserted before these.
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
DS20005540B-page 5
MIC2039
TEMPERATURE SPECIFICATIONS
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Junction Operating Temperature
Range
TJ
–40
—
+125
°C
Note 1
Storage Temperature Range
TS
–65
—
+150
°C
—
Lead Temperature
—
—
—
+260
°C
Soldering, 10s
Thermal Resistance SOT-23-6
JA
—
177.2
—
°C/W
—
Thermal Resistance 6-pin 2 mm x
2 mm UDFN
JA
—
90
—
°C/W
—
Temperature Ranges
Package Thermal Resistances
Note 1:
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.
DS20005540B-page 6
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
MIC2039
2.0
Note:
TYPICAL PERFORMANCE CURVES
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
FIGURE 2-1:
Temperature.
Input Supply Current vs.
FIGURE 2-4:
RDS(ON) vs. Temperature.
FIGURE 2-2:
Temperature.
VIN OFF Current vs.
FIGURE 2-5:
RDS(ON) vs. Temperature.
FIGURE 2-3:
Temperature.
Undervoltage Lockout vs.
FIGURE 2-6:
RDS(ON) vs. Output Current.
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
DS20005540B-page 7
MIC2039
FIGURE 2-7:
Temperature.
FAULT/ Response Time vs.
FIGURE 2-10:
Temperature.
Output Leakage Current vs.
FIGURE 2-8:
Temperature.
FAULT/ Response Time vs.
FIGURE 2-11:
Current.
VIN - VOUT vs. Output
FIGURE 2-9:
Output Current.
FAULT/ Response Time vs.
FIGURE 2-12:
Current Limit Set Resistor
vs. Output Current.
DS20005540B-page 8
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
MIC2039
VIN = 5V
ILOAD= 250mA
ILIMIT = 1A
COUT = 1μF
VIN
(2V/div)
VOUT
(2V/div)
VEN
(5V/div)
VOUT
(2V/div)
IIN
(100mA/div)
IIN
(500mA/div)
Time (2ms/div)
FIGURE 2-13:
Soft-Start Turn-On.
VIN = 5V
ILOAD= 250mA
ILIMIT = 1A
COUT = 1μF
MIC2039AYM6
Time (100μs/div)
FIGURE 2-16:
Enable Turn-Off.
VEN
(5V/div)
VOUT
(500mV/div)
VIN
(2V/div)
VOUT
(2V/div)
IIN
(500mA/div)
VIN = 5V
ILOAD= 250mA
ILIMIT = 1A
COUT = 1μF
VFAULT/
(5V/div)
IIN
(500mA/div)
Time (4ms/div)
FIGURE 2-14:
Soft-Start Turn-Off.
VEN
(5V/div)
VOUT
(2V/div)
VIN = 5V
ILOAD= 250mA
ILIMIT = 1A
COUT = 1μF
MIC2039AYM6
IIN
(200mA/div)
Time (4ms/div)
FIGURE 2-17:
VEN
(5V/div)
VOUT
(500mV/div)
VFAULT/
(5V/div)
Turn-On Into Short-Circuit.
VIN = 5V
ILOAD= Short Circuit
ILIMIT = 1A
CIN = 1μF
COUT = 1μF
MIC2039FYMT
IIN
(1A/div)
Time (200μs/div)
FIGURE 2-15:
VIN = 5V
ILOAD= Short Circuit
ILIMIT = 1A
COUT = 1μF
Enable Turn-On.
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
Time (40ms/div)
FIGURE 2-18:
(Kickstart).
Turn-On Into Short
DS20005540B-page 9
MIC2039
VFAULT/
(5V/div)
VOUT
(1V/div)
VIN
(2V/div)
IIN
(500mA/div)
VIN = 5V
ILOAD= MOSFET Load turned on such
that VOUT = (0.8 * VIN)
ILIMIT = 1A
COUT= 1μF
VOUT
(2V/div)
VFAULT/
(5V/div)
Current-Limit Response.
IIN
(500mA/div)
Time (20ms/div)
FIGURE 2-22:
(Kickstart).
VOUT
(2V/div)
VFAULT/
(5V/div)
VOUT
(2V/div)
VFAULT/
(5V/div)
VIN = 5V
ILOAD= 500mA to
S.C. to 500mA, 120ms pulse
ILIMIT = 1A
COUT = 1μF
IIN
(1A/div)
VOUT
(2V/div)
VFAULT/
(5V/div)
IIN
(1A/div)
Output Recovery from
FIGURE 2-23:
(Kickstart).
VOUT
(2V/div)
VIN = 3.3V
ILOAD= 500mA to S.C.
to 500mA, 120ms pulse
ILIMIT = 1A
COUT = 1μF
MIC2039FYMT
DS20005540B-page 10
VIN = 3.3V
ILOAD = 0A to 2A
overload (MOSFET,
160ms Stepped Load)
ILIMIT = 1A
COUT = 1μF
MIC2039FYMT
160 ms Stepped Load Pulse
VIN = 5V
ILOAD= 500mA to S.C. to 500mA
(MOSFET, 320ms Stepped Load)
ILIMIT = 1A
COUT = 1μF
VFAULT/
(5V/div)
IIN
(500mA/div)
Time (40ms/div)
Time (40ms/div)
FIGURE 2-21:
Output Recovery from
Short-Circuit (Kickstart).
85 ms Stepped Load Pulse
Time (40ms/div)
Time (20ms/div)
FIGURE 2-20:
Short-Circuit.
ILIMIT = 1A
COUT = 1μF
MIC2039FYMT
IIN
(1A/div)
Time (4ms/div)
FIGURE 2-19:
VIN = 3.3V
ILOAD= 0A to 2A overload
(MOSFET, 85ms Stepped Load)
FIGURE 2-24:
and Recovery.
Output Thermal Shutdown
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
MIC2039
VOUT
(2V/div)
VFAULT/
(5V/div)
IIN
(1A/div)
VFAULT/
(5V/div)
VIN = 3.3V
ILOAD = 0A to 3A
overload (MOSFET,
500ms Stepped Load)
ILIMIT = 1A
COUT = 1μF
MIC2039FYMT
VOUT
(2V/div)
IIN
(500mA/div)
Time (4ms/div)
Time (100ms/div)
FIGURE 2-25:
Output Thermal Shutdown
and Recovery (Kickstart).
FIGURE 2-28:
- 500 mA ILIMIT.
VFAULT/
(5V/div)
VOUT
(2V/div)
VIN = 5V
ILOAD = 500mA
to 1.5A overload
ILIMIT = 1A
COUT = 1μF
IIN
(500mA/div)
IIN
(500mA/div)
IIN
(1A/div)
1.5A Overload Response.
FIGURE 2-29:
- 1A ILIMIT.
Turn-On into 25% Overload
VFAULT/
(5V/div)
VIN = 3.3V
ILOAD = 0A to 3A
overload (MOSFET,
160ms Stepped Load)
ILIMIT = 1A
COUT = 1μF
MIC2039FYMT
Time (20ms/div)
FIGURE 2-27:
(Kickstart).
VIN = 5V
ILOAD = 1.25A (RLOAD = 4.0Ω)
ILIMIT = 1A
CIN = COUT = 1μF
Time (4ms/div)
Time (10ms/div)
VOUT
(2V/div)
VFAULT/
(5V/div)
Turn-On into 12% Overload
VFAULT/
(5V/div)
VOUT
(2V/div)
FIGURE 2-26:
VIN = 5V
ILOAD = 560mA
(RLOAD = 8.9Ω)
ILIMIT = 1A
COUT = 1μF
3A Overload Response
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
VOUT
(2V/div)
IIN
(500mA/div)
VIN = 5V
ILOAD= 1.58A (RLOAD = 3.15Ω)
ILIMIT = 1.5A
CIN = COUT = 1μF
Time (4ms/div)
FIGURE 2-30:
Turn-On into Minimal
Overload - 1.5A ILIMIT.
DS20005540B-page 11
MIC2039
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
Pin Number
SOT-23-6L
Pin Number
UDFN
Pin Name
1
6
VIN
2
5
GND
3
4
EN
4
3
FAULT/
5
2
ILIMIT
6
1
VOUT
Switch Output: Power switch output.
—
EP
ePad
Exposed Pad: Exposed pad on bottom side of package. Connect to
electrical ground for optimum thermal dissipation.
DS20005540B-page 12
Description
Input: Power switch and logic supply input.
Ground: Input and output return pin.
Enable (Input): Logic compatible, enable control input that allows
turn-on/off of the switch. Do not leave the EN pin floating.
Fault Status Flag (Output): Active-low, open-drain output. A
logic-low state indicates an overcurrent or thermal shutdown
condition. An overcurrent condition must last longer than tFAULT/ in
order to assert FAULT/. A pull-up resistor (10 kΩ recommended) to
an external supply is required.
Current Limit Set: Current limit adjust setting. Connect a resistor
from this pin to GND to set the current limit, but do not leave the
ILIMIT pin floating.
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
MIC2039
4.0
FUNCTIONAL DESCRIPTION
The MIC2039 is a high-side MOSFET power
distribution switch that provides increased system
reliability by using 5% current-limit accuracy. The
MIC2039 is internally current-limited and has thermal
shutdown, which protects the device and system.
The MIC2039 has a soft-start circuit that minimizes
inrush current by slowing the turn-on time. Additionally,
the MIC2039 has an optional kickstart feature, which
momentarily overrides the normal current-limiting
function to allow higher inrush and/or transient
currents.
4.1
Soft-Start
Soft-start reduces the power supply input surge current
at startup by controlling the output voltage rise time.
The input surge appears while the output capacitor is
charged up. A slower output rise time draws a lower
input surge current.
4.2
Kickstart Inrush Overcurrent Filter
The MIC2039EYxx and MIC2039FYxx are equipped
with a secondary current-limit that allows high inrush
current transients to pass for a set period before the
primary current-limit circuitry becomes active. The
FAULT/ status flag does not assert during the kickstart
period (typically 120 ms), which eliminates any false
(FAULT/) assertions. The kickstart function is active
during initial startup or while operating in steady state.
4.3
Input Capacitor
A 1 µF to 100 µF ceramic input capacitor is
recommended for most applications. Place the input
capacitor on the same side of the board and next to the
MIC2039 to minimize the voltage ringing during
transient and short-circuit conditions. Using two vias for
each end of the capacitor to connect to the power and
ground plane is also recommended.
An X7R or X5R dielectric ceramic capacitors is
recommended because of their temperature
performance. X7R-type capacitors change capacitance
by 15% over their operating temperature range and are
the most stable type of ceramic capacitors. Z5U and
Y5V dielectric capacitors change value by as much as
50% and 60%, respectively, over their operating
temperature ranges. To use a ceramic chip capacitor
with Y5V dielectric, the value must be much higher than
an X7R ceramic or a tantalum capacitor to ensure the
same capacitance value over the operating
temperature range.
4.4
Output Capacitor
The output capacitor type and placement criteria are
the same as the input capacitor.
The exact amount of capacitance depends upon the
specific application. For example, USB applications will
typically use 150 µF, whereas local consumers, such
as microcontrollers, may require as little as 1 µF.
Care must be taken when choosing the output
capacitance for inductive loads. Without sufficient
capacitance or clamping devices, sudden disconnects
or shorts on VOUT can result in stresses beyond the
device's absolute maximum ratings, even for short
cables, which will damage the device.
4.5
Enable
The MIC2039 offers either an active-high or active-low
enable input (EN) that allows ON/OFF control of the
switch output. The current through the device reduces
to near zero when the device is shut down, with only
microamperes of leakage current. The EN input can be
directly tied to VIN or driven by a voltage that is equal to
or less than VIN. Do not leave this pin floating.
Care should be taken to ensure that the EN pin does
not exceed VIN by more than 500 mV at any time. This
includes at power-up and during load transients.
Whenever possible, it is recommended to tie EN to VIN
through a pull-up resistor and use an open-drain or
open-collector device to change the state.
4.6
Adjustable Current-Limit
The MIC2039 current-limit is adjustable from 0.2A to
2.5A by connecting a resistor from the ILIMIT pin to
GND. The following equation determines the resistor:
EQUATION 4-1:
289
R LIMIT --------------I LIMIT
Where:
Typical current-limit from
Electrical Characteristics table.
ILIMIT
If the output current exceeds the set current-limit, the
MIC2039 switch enters constant current-limit mode.
The maximum allowable current-limit can be less than
the full specified and/or expected current if the
MIC2039 is not mounted on a circuit board with
sufficiently low thermal resistance. Table 4-1 shows
resistor values (1%) for select current-limit settings.
TABLE 4-1:
ILIMIT
0.2A
RLIMIT 1.45 kΩ
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
RESISTOR SELECTION FOR
ADJUSTABLE
CURRENT-LIMIT
0.5A
1.0A
2.0A
2.5A
576Ω
287Ω
145Ω
115Ω
DS20005540B-page 13
MIC2039
4.7
Thermal Design
To help reduce the thermal resistance, the ePad
(underneath the IC) should be soldered to the PCB
ground. The placement of thermal vias either
underneath or near the ePad is highly recommended.
Thermal
design
requires
the
following
application-specific parameters:
•
•
•
•
Maximum ambient temperature (TA)
Output current (IOUT)
Input voltage (VIN)
Current Limit (ILIMIT)
When the MIC2039 is in constant current-limit mode, it
may exceed the overtemperature threshold. If this
occurs, the overtemperature condition will shut down
the MIC2039 switch and the fault status flag will go
active (assert low). After the switch cools down, it will
turn on again. The user can maximize the MIC2039
power dissipation by either lowering the thermal
resistance on the exposed pad (only the DFN package
has an exposed pad) on the printed circuit board, or by
limiting the maximum allowable ambient temperature.
DS20005540B-page 14
4.8
Thermal Measurements
It is always wise to measure the IC’s case temperature
to make sure that it is within its operating limits.
Although this might seem like an elementary task, it is
very easy to get false results. The most common
mistake is to use the standard thermal couple that
comes with the thermal voltage meter. This thermal
couple wire gauge is large, typically 22 gauge, and
behaves like a heatsink, resulting in a lower case
measurement.
There are two suggested methods for measuring the IC
case temperature: a thermal couple or an infrared
thermometer. If a thermal couple is used, it must be
constructed of 36 gauge wire or higher to minimize the
wire heatsinking effect. In addition, the thermal couple
tip must be covered in either thermal grease or thermal
glue to make sure that the thermal couple junction is
making good contact to the case of the IC. Thermal
couple 5SC TT-K-36-36 from Omega is adequate for
most applications.
To avoid using messy thermal couple grease or glue,
an infrared thermometer is recommended. Most
infrared thermometers’ spot size is too large for an
accurate reading on small form factor ICs. However, an
IR thermometer from Optris has a 1 mm spot size,
which makes it ideal for the 2 mm x 2 mm UDFN
package. Also, get the optional stand. The stand makes
it easy to hold the beam on the IC for long periods of
time.
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
MIC2039
5.0
TIMING DIAGRAMS
V
EN
0
tFALL
tRISE
90%
VOUT
90%
10%
10%
0
t
FIGURE 5-1:
Output Rise/Fall Time.
V
50%
50%
EN
0
tON_DLY
tOFF_DELAY
90%
10%
VOUT
0
t
FIGURE 5-2:
Turn-On/Off Delay.
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
DS20005540B-page 15
MIC2039
V
FAULT/
0
tFAULT/
VOUT
0
tSC_RESP
ILIMIT
IOUT
0
FIGURE 5-3:
t
Short-Circuit Response Time and Overcurrent Fault Flag Delay (Non-Kickstart).
V
FAULT/
0
VOUT
0
tKICKSTART
ILIMIT
IOUT
0
FIGURE 5-4:
DS20005540B-page 16
t
Overcurrent Fault Flag Delay (Kickstart).
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
MIC2039
6.0
PACKAGING INFORMATION
6.1
Package Marking Information
6-Lead SOT-23*
Example
XXXX
39AF
6-Lead UDFN*
Example
XXX
NNN
Legend: XX...X
Y
YY
WW
NNN
e3
*
F39
722
Product code or customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle
mark).
Note:
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information. Package may or may not include
the corporate logo.
Underbar (_) and/or Overbar (‾) symbol may not be to scale.
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
DS20005540B-page 17
MIC2039
6-Lead UDFN 2 mm x 2 mm Package Outline and Recommended Land Pattern
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
A
B
N
(DATUM A)
(DATUM B)
E
NOTE 1
2X
0.05 C
1
2X
2
TOP VIEW
0.05 C
0.05 C
C
A
A1
SEATING
PLANE
6X
(A3)
SIDE VIEW
0.05
0.08 C
C A B
D2
1
2
NOTE 1
0.05
R0.10
C A B
E2
L
K
N
6X b
e
BOTTOM VIEW
0.10
0.05
C A B
C
Microchip Technology Drawing C04-1156-HSA Rev A Sheet 1 of 2
DS20005540B-page 18
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
MIC2039
6-Lead Ultra Thin Plastic Dual Flat, No Lead Package (HSA) - 2x2x0.6 mm Body [UDFN]
Micrel Legacy Package TDFN22-6LD-PL-1
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Notes:
Units
Dimension Limits
Number of Terminals
N
e
Pitch
A
Overall Height
Standoff
A1
Terminal Thickness
A3
Overall Length
D
Exposed Pad Length
D2
Overall Width
E
Exposed Pad Width
E2
b
Terminal Width
Terminal Length
L
Terminal-to-Exposed-Pad
K
MIN
0.50
0.00
1.35
0.75
0.20
0.30
0.20
MILLIMETERS
NOM
6
0.65 BSC
0.55
0.02
0.152 REF
2.00 BSC
1.40
2.00 BSC
0.80
0.25
0.35
-
MAX
0.60
0.05
1.45
0.85
0.30
0.40
-
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-1156-HSA Rev A Sheet 2 of 2
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
DS20005540B-page 19
MIC2039
6-Lead Ultra Thin Plastic Dual Flat, No Lead Package (HSA) - 2x2x0.6 mm Body [UDFN]
Micrel Legacy Package TDFN22-6LD-PL-1
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
X2
ØV
C Y2
G
Y1
SILK SCREEN
X1
E
RECOMMENDED LAND PATTERN
Units
Dimension Limits
Contact Pitch
E
Center Pad Width
X2
Center Pad Length
Y2
Contact Pad Spacing
C
Contact Pad Width (X6)
X1
Contact Pad Length (X6)
Y1
Contact Pad to Center Pad (X6)
G
Thermal Via Diameter
V
MIN
MILLIMETERS
NOM
0.65 BSC
MAX
1.32
0.82
1.80
0.20
0.40
0.29
0.33
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
2. For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
Microchip Technology Drawing C04-3156-HSA Rev A
DS20005540B-page 20
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
MIC2039
6-Lead SOT-23 Package Outline and Recommended Land Pattern
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
DS20005540B-page 21
MIC2039
NOTES:
DS20005540B-page 22
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
MIC2039
APPENDIX A:
REVISION HISTORY
Revision A (March 2018)
• Converted Micrel document MIC2039 to Microchip data sheet DS20005540A.
• Minor text changes throughout.
• Value for C1 corrected in Typical Application Circuit.
Revision B (May 2022)
• Updated package marking drawing in Section 6.1,
Package Marking Information.
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
DS20005540B-page 21
MIC2039
NOTES:
DS20005540B-page 22
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
MIC2039
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
PART NO.
Device
X
X
XX
Enable Temperature Package
–XX
MIC2039:
Enable:
A
B
E
F
=
=
=
=
Active-High
Active-Low
Active-High with Kickstart
Active-Low with Kickstart
Temperature:
Y
=
–40°C to +125°C
Package:
M6 =
MT =
SOT-23-6L
6-Lead 2 mm x 2 mm UDFN (Note 1)
Media Type:
T5
TR
TR
500/Reel
3,000/Reel (M6 only)
5,000/Reel (MT only)
Note 1:
a)
MIC2039AYM6-T5:
High-Accuracy, High-Side,
Adjustable Current-Limit
Power Switch, Active-High
Enable, –40°C to +125°C
Temp. Range, SOT-23-6L
Package, 500/Reel
b)
MIC2039BYM6-TR:
High-Accuracy,
High-Side,
Adjustable
Current-Limit
Power Switch, Active-Low
Enable, –40°C to +125°C
Temp. Range, SOT-23-6L
Package, 3,000/Reel
c)
MIC2039AYMT-TR:
High-Accuracy,
High-Side,
Adjustable
Current-Limit
Power Switch, Active-High
Enable, –40°C to +125°C
Temp. Range, 6-Lead UDFN
Package, 5,000/Reel
d)
MIC2039BYMT-T5:
High-Accuracy,
High-Side,
Adjustable
Current-Limit
Power Switch, Active-Low
Enable, –40°C to +125°C
Temp. Range, 6-Lead UDFN
Package, 500/Reel
e)
MIC2039EYM6-T5:
High-Accuracy,
High-Side,
Adjustable
Current-Limit
Power Switch, Active-High
Enable with Kickstart, –40°C
to +125°C Temp. Range,
SOT-23-6L Package, 500/
Reel
f)
MIC2039FYM6-TR:
High-Accuracy,
High-Side,
Adjustable
Current-Limit
Power Switch, Active-Low
Enable with Kickstart, –40°C
to +125°C Temp. Range,
SOT-23-6L Package, 3,000/
Reel
g)
MIC2039EYMT-TR:
High-Accuracy,
High-Side,
Adjustable
Current-Limit
Power Switch, Active-High
Enable with Kickstart, –40°C
to +125°C Temp. Range,
6-Lead UDFN Package,
5,000/Reel
h)
MIC2039FYMT-T5:
High-Accuracy,
High-Side,
Adjustable
Current-Limit
Power Switch, Active-Low
Enable with Kickstart, –40°C
to +125°C Temp. Range,
6-Lead UDFN Package, 500/
Reel
Media
Type
Device:
=
=
=
Examples:
High-Accuracy, High-Side, Adjustable Current-Limit Power Switch
UDFN is a GREEN RoHS-compliant package. Lead finish is
NiPdAu. Mold compound is Halogen Free.
Note 1:
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
Tape and Reel identifier only appears in the
catalog part number description. This identifier is
used for ordering purposes and is not printed on
the device package. Check with your Microchip
Sales Office for package availability with the
Tape and Reel option.
DS20005540B-page 23
MIC2039
NOTES:
DS20005540B-page 24
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
Note the following details of the code protection feature on Microchip products:
•
Microchip products meet the specifications contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is secure when used in the intended manner, within operating specifications, and
under normal conditions.
•
Microchip values and aggressively protects its intellectual property rights. Attempts to breach the code protection features of
Microchip product is strictly prohibited and may violate the Digital Millennium Copyright Act.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code. Code protection does not
mean that we are guaranteeing the product is “unbreakable”. Code protection is constantly evolving. Microchip is committed to
continuously improving the code protection features of our products.
This publication and the information herein may be used only
with Microchip products, including to design, test, and integrate
Microchip products with your application. Use of this information in any other manner violates these terms. Information
regarding device applications is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your
specifications. Contact your local Microchip sales office for
additional support or, obtain additional support at https://
www.microchip.com/en-us/support/design-help/client-supportservices.
THIS INFORMATION IS PROVIDED BY MICROCHIP "AS IS".
MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED,
WRITTEN OR ORAL, STATUTORY OR OTHERWISE,
RELATED TO THE INFORMATION INCLUDING BUT NOT
LIMITED TO ANY IMPLIED WARRANTIES OF NONINFRINGEMENT, MERCHANTABILITY, AND FITNESS FOR A
PARTICULAR PURPOSE, OR WARRANTIES RELATED TO
ITS CONDITION, QUALITY, OR PERFORMANCE.
IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT, SPECIAL, PUNITIVE, INCIDENTAL, OR CONSEQUENTIAL LOSS, DAMAGE, COST, OR EXPENSE OF ANY
KIND WHATSOEVER RELATED TO THE INFORMATION OR
ITS USE, HOWEVER CAUSED, EVEN IF MICROCHIP HAS
BEEN ADVISED OF THE POSSIBILITY OR THE DAMAGES
ARE FORESEEABLE. TO THE FULLEST EXTENT
ALLOWED BY LAW, MICROCHIP'S TOTAL LIABILITY ON
ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION
OR ITS USE WILL NOT EXCEED THE AMOUNT OF FEES, IF
ANY, THAT YOU HAVE PAID DIRECTLY TO MICROCHIP
FOR THE INFORMATION.
Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to
defend, indemnify and hold harmless Microchip from any and
all damages, claims, suits, or expenses resulting from such
use. No licenses are conveyed, implicitly or otherwise, under
any Microchip intellectual property rights unless otherwise
stated.
Trademarks
The Microchip name and logo, the Microchip logo, Adaptec,
AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud,
CryptoMemory, CryptoRF, dsPIC, flexPWR, HELDO, IGLOO,
JukeBlox, KeeLoq, Kleer, LANCheck, LinkMD, maXStylus,
maXTouch, MediaLB, megaAVR, Microsemi, Microsemi logo,
MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower,
PICSTART, PIC32 logo, PolarFire, Prochip Designer, QTouch,
SAM-BA, SenGenuity, SpyNIC, SST, SST Logo, SuperFlash,
Symmetricom, SyncServer, Tachyon, TimeSource, tinyAVR, UNI/O,
Vectron, and XMEGA are registered trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
AgileSwitch, APT, ClockWorks, The Embedded Control Solutions
Company, EtherSynch, Flashtec, Hyper Speed Control, HyperLight
Load, IntelliMOS, Libero, motorBench, mTouch, Powermite 3,
Precision Edge, ProASIC, ProASIC Plus, ProASIC Plus logo, QuietWire, SmartFusion, SyncWorld, Temux, TimeCesium, TimeHub,
TimePictra, TimeProvider, TrueTime, WinPath, and ZL are
registered trademarks of Microchip Technology Incorporated in the
U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, Augmented Switching, BlueSky,
BodyCom, CodeGuard, CryptoAuthentication, CryptoAutomotive,
CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net,
Dynamic Average Matching, DAM, ECAN, Espresso T1S,
EtherGREEN, GridTime, IdealBridge, In-Circuit Serial
Programming, ICSP, INICnet, Intelligent Paralleling, Inter-Chip
Connectivity, JitterBlocker, Knob-on-Display, maxCrypto, maxView,
memBrain, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo,
MPLIB, MPLINK, MultiTRAK, NetDetach, NVM Express, NVMe,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple
Blocker, RTAX, RTG4, SAM-ICE, Serial Quad I/O, simpleMAP,
SimpliPHY, SmartBuffer, SmartHLS, SMART-I.S., storClad, SQI,
SuperSwitcher, SuperSwitcher II, Switchtec, SynchroPHY, Total
Endurance, TSHARC, USBCheck, VariSense, VectorBlox, VeriPHY,
ViewSpan, WiperLock, XpressConnect, and ZENA are trademarks
of Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
The Adaptec logo, Frequency on Demand, Silicon Storage
Technology, Symmcom, and Trusted Time are registered
trademarks of Microchip Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology Germany
II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in
other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2018 - 2022, Microchip Technology Incorporated and its subsidiaries.
All Rights Reserved.
For information regarding Microchip’s Quality Management Systems,
please visit www.microchip.com/quality.
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
ISBN: 978-1-6683-0385-6
DS20005540B-page 25
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
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Tel: 61-2-9868-6733
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DS20005540B-page 26
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09/14/21
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