MIC2215
High PSRR, Low Noise µCap Triple LDO
Features
General Description
•
•
•
•
The MIC2215 is a high performance, triple LDO voltage
regulator, with each regulator capable of providing
250 mA continuous output current.
•
•
•
•
•
•
•
Input Voltage Range: +2.25V to +5.5V
70 dB PSRR
Stable with Ceramic Output Capacitor
High Output Accuracy:
- ±1.0% Initial Accuracy
- ±2.0% over Temperature
Low Dropout Voltage of 100 mV @ 150 mA
Low Quiescent Current: 110 µA per Regulator
Fast Turn-On Time: 30 µs
Zero Off-Mode Current
Thermal Shutdown Protection
Current Limit Protection
Tiny 16-Pin 4 mm x 4 mm QFN Package
Applications
•
•
•
•
•
Cellular Phones
PCs and Peripherals
Wireless LAN Cards
PDAs
GPS
Ideal for battery-operated applications, the MIC2215
offers 1% initial accuracy, extremely low dropout
voltage (100 mV @ 150 mA), and low ground current at
light load (typically 110 µA per regulator). Equipped
with a noise bypass pin and featuring very high power
supply ripple rejection (PSRR) of up to 80 dB, the
MIC2215 provides the lowest noise and highest
efficiency solution for RF applications in portable
electronics such as cellular phones and wireless LAN
applications.
Equipped with TTL logic-compatible enable pins, each
of the regulators in the MIC2215 can be put into a zero
current off mode where the supply current is much less
than 1 µA when all the regulators are disabled. The
MIC2215 is a µCap design, which enables a stable
output with small ceramic output capacitors, reducing
both cost and required board space for output
bypassing.
The MIC2215 is available in the miniature 16-lead,
4 mm x 4 mm QFN package.
Package Types
MIC2215-AAA
16-Lead QFN (ML) (Adj.)
(Top View)
OUT1
NC
OUT3
OUT3
OUT1
ADJ1
ADJ3
OUT3
MIC2215-XXX
16-Lead QFN (ML) (Fixed)
(Top View)
16
15
14
13
16
15
14
13
VIN1
2
11
GND
VIN1
2
11
GND
VIN2
3
10
GND
VIN2
3
10
GND
OUT2
4
9
BYP
OUT2
4
9
BYP
5
6
7
8
5
6
7
8
EN3
VIN3
EN2
12
EN1
1
ADJ2
OUT1
EN3
VIN3
EN2
12
EN1
1
OUT2
OUT1
2019 - 2022 Microchip Technology Inc.
DS20006274B-page 1
MIC2215
Typical Application Circuit
MIC2215-xxx_ML
VIN1
VOUT1
Rx Chain
VIN2
VOUT2
Tx Chain
VIN3
VOUT3
OFF ON
EN1
OFF ON
EN2
OFF ON
EN3
Synth/TCXO/VCO
CBYP
GND
CIN = 1μF
Ceramic
COUT = 1μF
Ceramic
Functional Block Diagrams
MIC2215 ADJUSTABLE BLOCK DIAGRAM
MIC2215 FIXED BLOCK DIAGRAM
VIN1
VOUT1
EN1
VIN1
VOUT1
EN1
Current
Limit
Current
Limit
Error
Amp
Error
Amp
VIN2
VOUT2
Current
Limit
EN2
ADJ1
VOUT2
VIN2
Current
Limit
EN2
Error
Amp
Error
Amp
VIN3
VOUT3
Current
Limit
EN3
ADJ2
VOUT3
VIN3
Current
Limit
EN3
Error
Amp
Error
Amp
GND
GND
Thermal
Limit
DS20006274B-page 2
VREF
QuickStart
BYP
ADJ3
Thermal
Limit
VREF
QuickStart
BYP
2019 - 2022 Microchip Technology Inc.
MIC2215
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
Supply Voltage (VIN) ......................................................................................................................................... 0V to +7V
Enable Voltage (VEN) ........................................................................................................................................ 0V to +7V
Power Dissipation (Note 1) .................................................................................................................... Internally Limited
ESD Rating .............................................................................................................................................................Note 2
Operating Ratings ††
Supply Voltage (VIN1).............................................................................................................................. +2.25V to +5.5V
Supply Voltage (VIN2, VIN3) ........................................................................................................................ +2.25V to VIN1
Enable Voltage (VEN) ........................................................................................................................................ 0V to VIN1
† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at those or any other conditions above those indicated
in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended
periods may affect device reliability.
†† Notice: The device is not guaranteed to function outside its operating ratings.
Note 1: The maximum allowable power dissipation of any TA (ambient temperature) is PD(MAX) = (TJ(MAX) – TA) ÷
θJA. Exceeding the maximum allowable power dissipation will result in excessive die temperature, and the
regulator will go into thermal shutdown.
2: Devices are ESD sensitive. Handling precautions recommended.
ELECTRICAL CHARACTERISTICS
Electrical Characteristics: VIN1 = VIN2 = VIN3 = VOUT (highest nominal) +1.0V; COUT = 1.0 µF, IOUT = 100 µA; TJ =
+25°C, bold values indicate –40°C ≤ TJ ≤ +125°C unless noted. Note 1
Parameter
Sym.
Min.
Typ.
Max.
–1
—
1
–2
—
2
Output Voltage Accuracy
—
Output Voltage Temperature
Coefficient
—
—
40
Line Regulation
—
—
Load Regulation
—
Dropout Voltage
Ground Current
Quiescent Current
Note 1:
VDO
IGND
IQ
Units
Conditions
%
—
—
ppm/°C
—
0.015
0.3
%/V
—
0.3
0.5
—
—
0.7
—
2
—
IOUT = 100 µA
—
32
—
IOUT = 50 mA
—
63
—
—
100
150
IOUT = 150 mA
—
170
275
IOUT = 250 mA
—
280
400
IOUT1 = IOUT2 = IOUT3 = 100 µA
—
110
150
—
420
550
—
0.2
1
%
mV
µA
VIN = VOUT + 1V to 5.5V
IOUT = 100 µA to 250 mA
Valid only for VOUT = 1.8V
IOUT = 100 mA
IOUT1 = 100 µA; IOUT2/IOUT3 = off
IOUT1 = IOUT2 = IOUT3 = 250 mA
µA
VEN1 = VEN2 = VEN3 = 0V
Specification for packaged product only.
2019 - 2022 Microchip Technology Inc.
DS20006274B-page 3
MIC2215
ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Characteristics: VIN1 = VIN2 = VIN3 = VOUT (highest nominal) +1.0V; COUT = 1.0 µF, IOUT = 100 µA; TJ =
+25°C, bold values indicate –40°C ≤ TJ ≤ +125°C unless noted. Note 1
Parameter
Min.
Typ.
Max.
—
70
—
—
60
—
—
45
—
ILIM
350
700
—
mA
VOUT = 0V (All regulators)
Output Voltage Noise
—
—
30
—
µVRMS
CBYP = 0.1 µF, f = 10 Hz to
100 kHz
Turn-On Time
tON
—
30
100
µs
—
—
0.4
1.5
—
—
—
1.0
—
—
0.01
—
Ripple Rejection
Current Limit
Sym.
PSRR
Units
Conditions
VIN = VOUT + 1.0V; IOUT = 150 mA,
f = 0.1 kHz to 1 kHz, CBYP =
0.1 µF
dB
VIN = VOUT + 0.4V; IOUT = 150 mA,
f = 0.1 kHz to 1 kHz, CBYP =
0.1 µF
VIN = VOUT + 0.2V; IOUT = 150 mA,
f = 0.1 kHz to 1 kHz, CBYP =
0.1 µF
CBYP = 0.01 µF
Enable Input
Enable Input Voltage
VEN
Enable Input Current
IEN
Note 1:
V
µA
Logic Low (Regulator shutdown)
Logic High (Regulator enabled)
VIL < 0.4V (Regulator shutdown)
VIH > 1.5V (Regulator enabled)
Specification for packaged product only.
TEMPERATURE SPECIFICATIONS
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Operating Junction Temperature
Range
TJ
–40
—
+125
°C
Note 1
Storage Temperature Range
TS
–65
—
+150
°C
—
TLEAD
—
—
+260
°C
Soldering, 5 sec.
θJA
—
45
—
°C/W
Temperature Ranges
Lead Temperature
Package Thermal Resistance
Thermal Resistance, QFN 16-Ld
Note 1:
—
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.
DS20006274B-page 4
2019 - 2022 Microchip Technology Inc.
MIC2215
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
TA = +25°C, unless otherwise noted.
160
3.03
LOAD = 100mA
3.02
120
LOAD = 50mA
100
LOAD = 0mA
80
60
40
20
OUTPUT VOLTAGE (V)
GROUND CURRENT (P A)
140
0
-40 -20 0 20 40 60 80 100 120
TEMPERATURE (° C)
FIGURE 2-1:
Ground Current vs.
Temperature for LDO 1.
140
3.02
LOAD = 50mA
LOAD = 0mA
40
20
0
-40 -20 0 20 40 60 80 100 120
TEMPERATURE (° C)
FIGURE 2-2:
Ground Current vs.
Temperature for LDO 2.
3.00
2.99
2.98
FIGURE 2-5:
Output Voltage vs.
Temperature for LDO 2.
3.03
LOAD = 100mA
3.02
LOAD = 50mA
LOAD = 0mA
60
40
20
0
-40 -20 0 20 40 60 80 100 120
TEMPERATURE (° C)
FIGURE 2-3:
Ground Current vs.
Temperature for LDO 3.
2019 - 2022 Microchip Technology Inc.
OUTPUT VOLTAGE (V)
GROUND CURRENT (P A)
80
3.01
2.97
-40 -20 0 20 40 60 80 100 120
TEMPERATURE (° C)
120
100
2.98
3.03
LOAD = 100mA
60
140
2.99
FIGURE 2-4:
Output Voltage vs.
Temperature for LDO 1.
OUTPUT VOLTAGE (V)
GROUND CURRENT (P A)
80
3.00
2.97
-40 -20 0 20 40 60 80 100 120
TEMPERATURE (° C)
120
100
3.01
3.01
3.00
2.99
2.98
2.97
-40 -20 0 20 40 60 80 100 120
TEMPERATURE (° C)
FIGURE 2-6:
Output Voltage vs.
Temperature for LDO 3.
DS20006274B-page 5
MIC2215
1.4
1.2
200
250mA LOAD
150
100
150mA LOAD
50 50mA LOAD
V OUT = 3V
ENABLE THRESHOLD (V)
DROPOUT VOLTAGE (mV)
250
FIGURE 2-7:
Dropout Voltage vs.
Temperature for LDO 1.
250mA LOAD
150
150mA LOAD
50 50mA LOAD
V OUT = 3V
ENABLE THRESHOLD (V)
DROPOUT VOLTAGE (mV)
0.4
0.2
1.2
3
3.75
4.5
SUPPLY VOLTAGE (V)
5.25
FIGURE 2-8:
Dropout Voltage vs.
Temperature for LDO 2.
E nable ON
1
0.8
E nable OF F
0.6
0.4
0.2
0
2.25
0
-40 -20 0 20 40 60 80 100 120
TEMPERATURE (° C)
3
3.75
4.5
SUPPLY VOLTAGE (V)
5.25
FIGURE 2-11:
Enable Threshold vs.
Supply Voltage for LDO 2.
1.4
250
1.2
200
250mA LOAD
150
150mA LOAD
100
50mA LOAD
V OUT = 3V
0
-40 -20 0 20 40 60 80 100 120
TEMPERATURE (° C)
FIGURE 2-9:
Dropout Voltage vs.
Temperature for LDO 3.
DS20006274B-page 6
ENABLE THRESHOLD (V)
DROPOUT VOLTAGE (mV)
E nable OF F
0.6
1.4
200
50
0.8
FIGURE 2-10:
Enable Threshold vs.
Supply Voltage for LDO 1.
250
100
1
0
2.25
0
-40 -20 0 20 40 60 80 100 120
TEMPERATURE (° C)
E nable ON
E nable ON
1
0.8
E nable OF F
0.6
0.4
0.2
0
2.25
3
3.75
4.5
SUPPLY VOLTAGE (V)
5.25
FIGURE 2-12:
Enable Threshold vs.
Supply Voltage for LDO 3.
2019 - 2022 Microchip Technology Inc.
50
160
45
40
140
35
30
5
0
2.25
FIGURE 2-13:
Voltage.
LDO 2
LDO 3
C B Y P = 0.1PF
3
3.75
4.5
SUPPLY VOLTAGE (V)
Enable Delay vs. Supply
100
80
60
40
20
3.020
140
3.015
120
3.010
100
80
60
40
20
50
100 150 200
OUTPUT CURRENT (mA)
3.000
2.995
2.990
2.985
140
3.015
120
3.010
OUTPUT VOLTAGE (V)
3.020
80
60
40
20
0
0
50
100 150 200
OUTPUT CURRENT (mA)
250
FIGURE 2-15:
Ground Current vs. Load
Current for LDO 2.
2019 - 2022 Microchip Technology Inc.
0
FIGURE 2-17:
160
100
250
3.005
2.980
250
FIGURE 2-14:
Ground Current vs. Load
Current for LDO 1.
50
100 150 200
OUTPUT CURRENT (mA)
FIGURE 2-16:
Ground Current vs. Load
Current for LDO 3.
160
0
0
GROUND CURRENT (P A)
120
0
0
5.25
OUTPUT VOLTAGE (V)
GROUND CURRENT (P A)
LDO 1
25
20
15
10
GROUND CURRENT (P A)
DELAY (P s)
MIC2215
50
100 150 200
OUTPUT CURRENT (mA)
250
Load Regulation LDO 1.
3.005
3.000
2.995
2.990
2.985
2.980
0
FIGURE 2-18:
50
100 150 200
OUTPUT CURRENT (mA)
250
Load Regulation LDO 2.
DS20006274B-page 7
3.020
180
3.015
160
3.010
140
DROPOUT VOLTAGE (mV)
OUTPUT VOLTAGE (V)
MIC2215
3.005
3.000
2.995
2.990
2.985
2.980
0
50
100 150 200
OUTPUT CURRENT (mA)
FIGURE 2-19:
120
100
GROUND CURRENT (P A)
DROPOUT VOLTAGE (mV)
160
120
100
80
60
40
20
0
0
50
100 150 200
OUTPUT CURRENT (mA)
250
FIGURE 2-20:
Dropout Voltage vs. Output
Current for LDO 1.
GROUND CURRENT (P A)
DROPOUT VOLTAGE (mV)
160
120
100
80
60
40
20
0
0
50
100 150 200
OUTPUT CURRENT (mA)
250
FIGURE 2-21:
Dropout Voltage vs. Output
Current for LDO 2.
DS20006274B-page 8
20
50
100 150 200
OUTPUT CURRENT (mA)
250
200
180
160
140
120
100
80
60
40
20
0
0
250mA
150mA
100PA
V OUT = 3V
1
2
3
4
SUPPLY VOLTAGE (V)
5
FIGURE 2-23:
Ground Current vs. Supply
Voltage for LDO 1.
180
140
40
FIGURE 2-22:
Dropout Voltage vs. Output
Current for LDO 3.
180
140
60
0
0
250
Load Regulation LDO 3.
80
200
180
160
140
120
100
80
60
40
20
0
0
250mA
150mA
100PA
V OUT = 3V
1
2
3
4
SUPPLY VOLTAGE (V)
5
FIGURE 2-24:
Ground Current vs. Supply
Voltage for LDO 2.
2019 - 2022 Microchip Technology Inc.
MIC2215
3.5
250mA
180
160
3
140
120
150mA
100
80
100PA
60
40
20
0
0
OUTPUT VOLTAGE (V)
GROUND CURRENT (P A)
200
V OUT = 3V
1
2
3
4
SUPPLY VOLTAGE (V)
2.5
2 100PA
1.5
1
0.5
0
5
FIGURE 2-25:
Ground Current vs. Supply
Voltage for LDO 3.
10mA
250mA
-90
3
-80
100PA
1.5
1
10mA
0.5
400mV V '
1
2
3
4
SUPPLY VOLTAGE (V)
-40
3
80
70
2.5
10K 100K
1K
FREQUENCY (Hz)
PSRR (dB)
1.5
10mA
250mA
Power Supply Rejection
C B Y P = 1PF
C B Y P = 0.1PF
C B Y P = 10nF
50
40 C B Y P = 1nF
C BYP = 0
30
20
10
0
1M
60
100PA
0.5
C B Y P = 0.1PF
V IN = V OUT + 'V
I LOAD = 150mA
FIGURE 2-29:
Ratio, 3VOUT.
90
1
200mV '
0
100
5
3.5
2
1.2V V '
2V V ' 600mV '
-30
-10
FIGURE 2-26:
Output Voltage vs. Supply
Voltage for LDO 1.
1.0V V '
400mV '
-50 200mV V '
-20
250mA
0
0
OUTPUT VOLTAGE (V)
1V '
-60
PSRR (dB)
OUTPUT VOLTAGE (V)
-70
2.5
2
5
FIGURE 2-28:
Output Voltage vs. Supply
Voltage for LDO 3.
3.5
0
1
2
3
4
SUPPLY VOLTAGE (V)
0
1
2
3
4
SUPPLY VOLTAGE (V)
5
FIGURE 2-27:
Output Voltage vs. Supply
Voltage for LDO 2.
2019 - 2022 Microchip Technology Inc.
0
100
V IN = V OUT +1V
I LOAD = 150mA
1K
10K 100K 1M
FREQUENCY (Hz)
FIGURE 2-30:
Power Supply Rejection
Ratio vs. CBYPASS.
DS20006274B-page 9
MIC2215
80
PSRR (dB)
70
60 LDO 1
LDO 2
50
LDO 3
40
30
V IN = V OUT + 1V
C B Y P = 0.1PF
I LOAD = 150mA
20
10
0
100
1K
10K
100K
FREQUENCY (Hz)
FIGURE 2-31:
Ratio.
DS20006274B-page 10
1M
Power Supply Rejection
2019 - 2022 Microchip Technology Inc.
MIC2215
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
Pin Number
Pin Name
1
VOUT1
2
VIN1
Supply input of regulator 1 (highest input voltage required for common circuitry).
3
VIN2
Supply input of regulator 2.
4
VOUT2
Output voltage of regulator 2 (250 mA). For fixed output device, connect pins 4 and 5
externally.
VOUT2
(Fixed)
Output voltage of regulator 2 (250 mA). For fixed output device, connect pins 4 and 5
externally.
5
Description
Output voltage of regulator 1 (250 mA). Connect externally to pin 16.
ADJ2
(Adj.)
Adjust Input. Feedback input for regulator 2.
6
EN1
Enable input to regulator 1. Enables regulator 1 output. Active-high input.
High = on, low = off.
7
EN2
Enable input to regulator 2. Enables regulator 2 output. Active-high input.
High = on, low = off.
8
EN3
Enable input to regulator 3. Enables regulator 3 output. Active-high input.
High = on, low = off.
9
CBYP
Reference Bypass: Connect external 0.01 µF to GND to reduce output noise. May be
left open.
10
GND
Ground.
11
GND
Ground.
12
VIN3
13
14
15
Supply input of regulator 3.
VOUT3
Output voltage of regulator 3 (250 mA). For fixed output device, connect pins 13 and
14 externally.
VOUT3
(Fixed)
Output voltage of regulator 3 (250 mA). For fixed output device, connect pins 13 and
14 externally.
ADJ3
(Adj.)
NC
(Fixed)
ADJ1
(Adj.)
16
VOUT1
EP
GND
Adjust Input. Feedback input for regulator 3.
No Connect. Not internally connected.
Adjust Input. Feedback input for regulator 1.
Output voltage of regulator 1 (250 mA). Connect externally to pin 1.
Ground.
2019 - 2022 Microchip Technology Inc.
DS20006274B-page 11
MIC2215
4.0
FUNCTIONAL DESCRIPTION
The MIC2215 is a triple, low-noise CMOS LDO.
Designed specifically for noise-critical applications in
handheld or battery-powered devices, the MIC2215
comes equipped with a noise reduction feature to filter
the output noise via an external capacitor. Other
features of the MIC2215 include a separate logic
compatible enable pin for each channel, current limit,
thermal shutdown, and ultra-fast transient response, all
within a small QFN package.
The MIC2215 is specifically designed to work with
low-ESR ceramic capacitors, reducing the amount of
board space necessary for power applications, which is
critical in handheld wireless devices.
5.0
APPLICATION INFORMATION
5.1
Enable/Shutdown
The MIC2215 comes with three active-high enable pins
that allow each individual regulator to be either
disabled or enabled. Forcing the enable pin low
disables the respective regulator and sends it into a
zero off-mode current state. In this state, current
consumed by the individual regulator goes nearly to
zero. This is true for both regulators 2 and 3. Regulator
1’s input supply pin is also used to power the internal
reference. When any regulator, either 1, 2, or 3, is
enabled, an additional 20 µA for the reference will be
drawn through VIN1. All three must be disabled to enter
the zero current off-mode state. Forcing the enable pin
high enables each respective output voltage. This part
is CMOS and none of the enable pins can be left
floating; a floating enable pin may cause an
indeterminate state on the output.
5.2
Input Capacitor
The MIC2215 is a high performance, high bandwidth
device. Therefore, it requires a well-bypassed input
supply for optimal performance. A small 0.1 µF
capacitor placed close to the input is recommended to
aid in noise performance. Low-ESR ceramic capacitors
provide optimal performance at a minimum of space.
Additional high-frequency capacitors, such as small
valued NPO dielectric type capacitors, help to filter out
high frequency noise and are good practice in any
RF-based circuit.
5.3
Output Capacitor
The MIC2215 requires an output capacitor for stability.
The design requires 1 µF or greater on the output to
maintain stability. The design is optimized for use with
low-ESR ceramic chip capacitors. X7R/X5R
dielectric-type ceramic capacitors are recommended
because of their temperature performance. X7R-type
capacitors change capacitance by 15% over their
DS20006274B-page 12
operating temperature range and are the most stable
type of ceramic capacitors. Z5U and Y5V dielectric
capacitors change value by as much as 50% and 60%,
respectively, over their operating temperature ranges.
To use a ceramic chip capacitor with Y5V dielectric, the
value must be much higher than an X7R ceramic
capacitor to ensure the same minimum capacitance
over the equivalent operating temperature range.
5.4
Bypass Pin
A capacitor can be placed from the noise bypass pin to
ground to reduce output voltage noise. The capacitor
bypasses the internal reference. There is one single
internal reference shared by each output, therefore the
bypassing affects each regulator. A 0.1 µF capacitor is
recommended for applications that require low-noise
outputs. The bypass capacitor can be increased,
further reducing noise and improving PSRR. Turn-on
time increases slightly with respect to bypass
capacitance.
5.5
Internal Reference
The internal band gap, or reference, is powered from
the VIN1 input. Due to some of the input noise (PSRR)
contributions being imposed on the band gap, it is
important to make VIN1 as clean as possible with good
bypassing close to the input.
5.6
Multiple Input Supplies
The MIC2215 can be used with multiple input supplies
when desired. The only requirement, aside from
maintaining the voltages within the operating ranges, is
that VIN1 always remains the highest voltage potential.
5.7
No-Load Stability
The MIC2215 will remain stable and in regulation with
no load, unlike many other voltage regulators. This is
especially important in CMOS RAM keep-alive
applications.
5.8
Thermal Considerations
The MIC2215 is designed to provide up to 250 mA of
current per channel in a very small package. Maximum
power dissipation can be calculated based on the
output current and the voltage drop across the part. To
determine the maximum power dissipation of the
package, use the junction-to-ambient thermal
resistance of the device and the following basic
equation:
EQUATION 5-1:
P D MAX = T J MAX – T A JA
2019 - 2022 Microchip Technology Inc.
MIC2215
The maximum junction temperature of the die (TJ(MAX))
is +125° and is also the ambient operating temperature
(TA). θJA is layout dependent; the junction-to-ambient
thermal resistance for the MIC2215 can be found in the
Temperature Specifications section.
practice to calculate the maximum ambient
temperature for a 125°C junction temperature.
Calculating maximum ambient temperature follows:
EQUATION 5-5:
The actual power dissipation of the regulator circuit can
be determined using the following equation:
T A MAX = T J MAX – P D JA
T A MAX = 125C – 540mW 43C/W
EQUATION 5-2:
P DTOTAL = P DLDO1 + P DLDO2 + P DLDO3
Where:
PDLDO1 = (VIN1 – VOUT1) x IOUT1
PDLDO2 = (VIN2 – VOUT2) x IOUT2
PDLDO3 = (VIN3 – VOUT3) x IOUT3
Substituting PD(MAX) for PD and solving for the
operating conditions that are critical to the application
will give the maximum operating conditions for the
regulator circuit. For example, when operating the
MIC2215 at 60°C with a minimum footprint layout, the
maximum load currents can be calculated as follows:
EQUATION 5-3:
P D MAX = 125C – 60C 43C/W = 1.511W
The junction-to-ambient thermal resistance for the
minimum footprint is 43°C/W. The maximum power
dissipation must not be exceeded for proper operation.
Using a lithium-ion battery as the supply voltage
(2.8V/250 mA for channel 1, 3V/100 mA for channel 2,
and 2.8V/50 mA for channel 3), maximum power can
be calculated as follows:
T A MAX = 101C
For more information, please refer to the Designing
with Low-Dropout Voltage Regulators Handbook.
5.9
Adjustable Regulator Application
Adjustable regulators use the ratio of two resistors to
multiply the reference voltage to produce the desired
output voltage. The MIC2215 can be adjusted from
1.25V to 5.5V, the maximum VDROPOUT, by using two
external resistors (Figure 5-1). The resistors set the
output voltage based on the following equation:
EQUATION 5-6:
V OUT = V REF 1 + R1
-------
R2
Where:
VREF = 1.25V
MIC2215-AAA_ML
OUT1
EQUATION 5-4:
R1
P DLDO1 = 4.2V – 2.8V 250mA
ADJ1
P DLDO1 = 350mW
R2
P DLDO2 = 4.2V – 3.0V 100mA
P DLDO2 = 120mW
P DLDO3 = 4.2V – 2.8V 50mA
P DLDO3 = 70mW
FIGURE 5-1:
Adjustable Output.
P DTOTAL = 350mW + 120mW + 70mW
P DTOTAL = 540mW
The calculation shows that the device is well below the
maximum allowable power dissipation of 1.511W for a
60°C ambient temperature. After the maximum power
dissipation has been calculated, it is always good
2019 - 2022 Microchip Technology Inc.
DS20006274B-page 13
MIC2215
6.0
PACKAGING INFORMATION
6.1
Package Marking Information
16-Lead QFN*
XXXX
XXXXXX
WNNN
Legend: XX...X
Y
YY
WW
NNN
e3
*
Example
2215
PMMYML
7084
Product code or customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle
mark).
Note:
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information. Package may or may not include
the corporate logo.
Underbar (_) and/or Overbar (‾) symbol may not be to scale.
Note:
If the full seven-character YYWWNNN code cannot fit on the package, the following truncated codes
are used based on the available marking space:
6 Characters = YWWNNN; 5 Characters = WWNNN; 4 Characters = WNNN; 3 Characters = NNN;
2 Characters = NN; 1 Character = N
DS20006274B-page 14
2019 - 2022 Microchip Technology Inc.
MIC2215
16-Lead 4 mm x 4 mm QFN Package Outline and Recommended Land Pattern
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
2019 - 2022 Microchip Technology Inc.
DS20006274B-page 15
MIC2215
NOTES:
DS20006274B-page 16
2019 - 2022 Microchip Technology Inc.
MIC2215
APPENDIX A:
REVISION HISTORY
Revision A (November 2019)
• Converted Micrel document MIC2215 to Microchip data sheet template DS20006247A.
• Minor grammatical text changes throughout.
• Added additional value and condition for Load
Regulation in the Electrical Characteristics table.
Revision B (March 2022)
• Added new required note below the legend (for
APID and some other former Micrel BUs) in
Section 6.1, Package Marking Information to help
clarify the marking codes.
2019 - 2022 Microchip Technology Inc.
DS20006274B-page 17
MIC2215
NOTES:
DS20006274B-page 18
2019 - 2022 Microchip Technology Inc.
MIC2215
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
Device
-X
X
X
X
XX
-XX
Part No.
VOUT1
VOUT2
VOUT3
Junction
Temp.
Range
Package
Media
Type
Device:
MIC2215:
VOUT1, VOUT2,
VOUT3 Options:
A
F
W
G
D
Y
H
E
J
K
I
L
M
N
O
P
Q
R
S
T
U
V
=
=
=
=
=
=
=
=
=
=
=
=
=
=
=
=
=
=
=
=
=
=
Adjustable
1.5V
1.6V
1.8V
1.85V
1.9V
2.0V
2.1V
2.5V
2.6V
2.65V
2.7V
2.8V
2.85V
2.9V
3.0V
3.1V
3.2V
3.3V
3.4V
3.5V
3.6V
Junction
Temperature
Range:
Y
=
–40°C to +125°C, RoHS-Compliant
Package:
ML
=
16-Lead 4 mm x 4 mm QFN
Media Type:
TR
=
5,000/Reel
High PSRR, Low Noise µCap Triple LDO
Examples:
a) MIC2215-AAAYML-TR:MIC2215, Adjustable Output
Voltages, –40°C to +125°C
Temperature Range,
16-Lead QFN, 5,000/Reel
b) MIC2215-MMGYML-TR:MIC2215, 2.8V/2.8V/1.8V
Output Voltages,
–40°C to +125°C
Temperature Range,
16-Lead QFN, 5,000/Reel
c) MIC2215-MMMYML-TR:MIC2215, 2.8V/2.8V/2.8V
Output Voltages,
–40°C to +125°C
Temperature Range,
16-Lead QFN, 5,000/Reel
d) MIC2215-PMMYML-TR:MIC2215, 3.0V/2.8V/2.8V
Output Voltages,
–40°C to +125°C
Temperature Range,
16-Lead QFN, 5,000/Reel
e) MIC2215-PPGYML-TR:MIC2215, 3.0V/3.0V/1.8V
Output Voltages,
–40°C to +125°C
Temperature Range,
16-Lead QFN, 5,000/Reel
f) MIC2215-PPMYML-TR:MIC2215, 3.0V/3.0V/2.8V
Output Voltages,
–40°C to +125°C
Temperature Range,
16-Lead QFN, 5,000/Reel
g) MIC2215-PPPYML-TR:MIC2215, 3.0V/3.0V/3.0V
Output Voltages,
–40°C to +125°C
Temperature Range,
16-Lead QFN, 5,000/Reel
Note 1:
2019 - 2022 Microchip Technology Inc.
Tape and Reel identifier only appears in the
catalog part number description. This identifier is
used for ordering purposes and is not printed on
the device package. Check with your Microchip
Sales Office for package availability with the
Tape and Reel option.
DS20006274B-page 19
MIC2215
NOTES:
DS20006274B-page 20
2019 - 2022 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip products:
•
Microchip products meet the specifications contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is secure when used in the intended manner, within operating specifications, and
under normal conditions.
•
Microchip values and aggressively protects its intellectual property rights. Attempts to breach the code protection features of
Microchip product is strictly prohibited and may violate the Digital Millennium Copyright Act.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code. Code protection does not
mean that we are guaranteeing the product is “unbreakable”. Code protection is constantly evolving. Microchip is committed to
continuously improving the code protection features of our products.
This publication and the information herein may be used only
with Microchip products, including to design, test, and integrate
Microchip products with your application. Use of this information in any other manner violates these terms. Information
regarding device applications is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your
specifications. Contact your local Microchip sales office for
additional support or, obtain additional support at https://
www.microchip.com/en-us/support/design-help/client-supportservices.
THIS INFORMATION IS PROVIDED BY MICROCHIP "AS IS".
MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED,
WRITTEN OR ORAL, STATUTORY OR OTHERWISE,
RELATED TO THE INFORMATION INCLUDING BUT NOT
LIMITED TO ANY IMPLIED WARRANTIES OF NONINFRINGEMENT, MERCHANTABILITY, AND FITNESS FOR A
PARTICULAR PURPOSE, OR WARRANTIES RELATED TO
ITS CONDITION, QUALITY, OR PERFORMANCE.
IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT, SPECIAL, PUNITIVE, INCIDENTAL, OR CONSEQUENTIAL LOSS, DAMAGE, COST, OR EXPENSE OF ANY
KIND WHATSOEVER RELATED TO THE INFORMATION OR
ITS USE, HOWEVER CAUSED, EVEN IF MICROCHIP HAS
BEEN ADVISED OF THE POSSIBILITY OR THE DAMAGES
ARE FORESEEABLE. TO THE FULLEST EXTENT
ALLOWED BY LAW, MICROCHIP'S TOTAL LIABILITY ON
ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION
OR ITS USE WILL NOT EXCEED THE AMOUNT OF FEES, IF
ANY, THAT YOU HAVE PAID DIRECTLY TO MICROCHIP
FOR THE INFORMATION.
Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to
defend, indemnify and hold harmless Microchip from any and
all damages, claims, suits, or expenses resulting from such
use. No licenses are conveyed, implicitly or otherwise, under
any Microchip intellectual property rights unless otherwise
stated.
Trademarks
The Microchip name and logo, the Microchip logo, Adaptec,
AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud,
CryptoMemory, CryptoRF, dsPIC, flexPWR, HELDO, IGLOO,
JukeBlox, KeeLoq, Kleer, LANCheck, LinkMD, maXStylus,
maXTouch, MediaLB, megaAVR, Microsemi, Microsemi logo,
MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower,
PICSTART, PIC32 logo, PolarFire, Prochip Designer, QTouch,
SAM-BA, SenGenuity, SpyNIC, SST, SST Logo, SuperFlash,
Symmetricom, SyncServer, Tachyon, TimeSource, tinyAVR, UNI/O,
Vectron, and XMEGA are registered trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
AgileSwitch, APT, ClockWorks, The Embedded Control Solutions
Company, EtherSynch, Flashtec, Hyper Speed Control, HyperLight
Load, IntelliMOS, Libero, motorBench, mTouch, Powermite 3,
Precision Edge, ProASIC, ProASIC Plus, ProASIC Plus logo, QuietWire, SmartFusion, SyncWorld, Temux, TimeCesium, TimeHub,
TimePictra, TimeProvider, TrueTime, WinPath, and ZL are
registered trademarks of Microchip Technology Incorporated in the
U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, Augmented Switching, BlueSky,
BodyCom, CodeGuard, CryptoAuthentication, CryptoAutomotive,
CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net,
Dynamic Average Matching, DAM, ECAN, Espresso T1S,
EtherGREEN, GridTime, IdealBridge, In-Circuit Serial
Programming, ICSP, INICnet, Intelligent Paralleling, Inter-Chip
Connectivity, JitterBlocker, Knob-on-Display, maxCrypto, maxView,
memBrain, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo,
MPLIB, MPLINK, MultiTRAK, NetDetach, NVM Express, NVMe,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple
Blocker, RTAX, RTG4, SAM-ICE, Serial Quad I/O, simpleMAP,
SimpliPHY, SmartBuffer, SmartHLS, SMART-I.S., storClad, SQI,
SuperSwitcher, SuperSwitcher II, Switchtec, SynchroPHY, Total
Endurance, TSHARC, USBCheck, VariSense, VectorBlox, VeriPHY,
ViewSpan, WiperLock, XpressConnect, and ZENA are trademarks
of Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
The Adaptec logo, Frequency on Demand, Silicon Storage
Technology, Symmcom, and Trusted Time are registered
trademarks of Microchip Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology Germany
II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in
other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2019 - 2022, Microchip Technology Incorporated and its subsidiaries.
All Rights Reserved.
For information regarding Microchip’s Quality Management Systems,
please visit www.microchip.com/quality.
2019 - 2022 Microchip Technology Inc. and its subsidiaries.
ISBN: 978-1-6683-0062-6
DS20006274B-page 21
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
Australia - Sydney
Tel: 61-2-9868-6733
India - Bangalore
Tel: 91-80-3090-4444
China - Beijing
Tel: 86-10-8569-7000
India - New Delhi
Tel: 91-11-4160-8631
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
China - Chengdu
Tel: 86-28-8665-5511
India - Pune
Tel: 91-20-4121-0141
China - Chongqing
Tel: 86-23-8980-9588
Japan - Osaka
Tel: 81-6-6152-7160
China - Dongguan
Tel: 86-769-8702-9880
Japan - Tokyo
Tel: 81-3-6880- 3770
China - Guangzhou
Tel: 86-20-8755-8029
Korea - Daegu
Tel: 82-53-744-4301
China - Hangzhou
Tel: 86-571-8792-8115
Korea - Seoul
Tel: 82-2-554-7200
China - Hong Kong SAR
Tel: 852-2943-5100
Malaysia - Kuala Lumpur
Tel: 60-3-7651-7906
China - Nanjing
Tel: 86-25-8473-2460
Malaysia - Penang
Tel: 60-4-227-8870
China - Qingdao
Tel: 86-532-8502-7355
Philippines - Manila
Tel: 63-2-634-9065
China - Shanghai
Tel: 86-21-3326-8000
Singapore
Tel: 65-6334-8870
China - Shenyang
Tel: 86-24-2334-2829
Taiwan - Hsin Chu
Tel: 886-3-577-8366
China - Shenzhen
Tel: 86-755-8864-2200
Taiwan - Kaohsiung
Tel: 886-7-213-7830
China - Suzhou
Tel: 86-186-6233-1526
Taiwan - Taipei
Tel: 886-2-2508-8600
China - Wuhan
Tel: 86-27-5980-5300
Thailand - Bangkok
Tel: 66-2-694-1351
China - Xian
Tel: 86-29-8833-7252
Vietnam - Ho Chi Minh
Tel: 84-28-5448-2100
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Austin, TX
Tel: 512-257-3370
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Novi, MI
Tel: 248-848-4000
Houston, TX
Tel: 281-894-5983
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Tel: 317-536-2380
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Tel: 951-273-7800
Raleigh, NC
Tel: 919-844-7510
New York, NY
Tel: 631-435-6000
San Jose, CA
Tel: 408-735-9110
Tel: 408-436-4270
Canada - Toronto
Tel: 905-695-1980
Fax: 905-695-2078
DS20006274B-page 22
China - Xiamen
Tel: 86-592-2388138
China - Zhuhai
Tel: 86-756-3210040
Denmark - Copenhagen
Tel: 45-4485-5910
Fax: 45-4485-2829
Finland - Espoo
Tel: 358-9-4520-820
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Germany - Garching
Tel: 49-8931-9700
Germany - Haan
Tel: 49-2129-3766400
Germany - Heilbronn
Tel: 49-7131-72400
Germany - Karlsruhe
Tel: 49-721-625370
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Germany - Rosenheim
Tel: 49-8031-354-560
Israel - Ra’anana
Tel: 972-9-744-7705
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Italy - Padova
Tel: 39-049-7625286
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Norway - Trondheim
Tel: 47-7288-4388
Poland - Warsaw
Tel: 48-22-3325737
Romania - Bucharest
Tel: 40-21-407-87-50
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Sweden - Gothenberg
Tel: 46-31-704-60-40
Sweden - Stockholm
Tel: 46-8-5090-4654
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
2019 - 2022 Microchip Technology Inc. and its subsidiaries.
09/14/21
