MIC23031
4 MHz PWM 400 mA Buck Regulator with HyperLight Load®
Features
General Description
•
•
•
•
•
•
•
The MIC23031 is a high-efficiency, 4 MHz, 400 mA
synchronous buck regulator with HyperLight Load®
mode. HyperLight Load provides very high efficiency at
light loads and ultra-fast transient response that is
perfectly suited for supplying processor core voltages.
An additional benefit of this proprietary architecture is
the very low output ripple voltage throughout the entire
load range with the use of small output capacitors. The
tiny 1.6 mm x 1.6 mm TDFN package saves precious
board space and requires only three external
components.
•
•
•
•
Input Voltage: 2.7V to 5.5V
400 mA Output Current
Up to 93% Efficiency and 88% at 1 mA
21 µA Typical Quiescent Current
4 MHz PWM Operation in Continuous Mode
Ultra-Fast Transient Response
Low Voltage Output Ripple
- 20 mVPP Ripple in HyperLight Load® Mode
- 3 mV Output Voltage Ripple in Full PWM
Mode
0.01 µA Shutdown Current
MIC23031 Fixed and Adjustable Output Voltage
Options Available
1.6 mm x 1.6 mm 6-Lead TDFN Package
–40°C to +125°C Junction Temperature Range
Applications
•
•
•
•
•
•
•
•
Mobile Handsets
Portable Media/MP3 Players
Portable Navigation Devices (GPS)
WiFi/WiMax/WiBro Modules
Digital Cameras
Wireless LAN Cards
USB-Powered Devices
Portable Applications
The MIC23031 is designed for use with a very small
inductor, down to 0.47 µH, and an output capacitor as
small as 2.2 µF that enables a sub 1 mm height.
The MIC23031 has a very low quiescent current of
21 µA and achieves as high as 88% efficiency at 1 mA.
At higher loads, the MIC23031 provides a constant
switching frequency around 4 MHz while achieving
peak efficiencies up to 93%.
The MIC23031 is available in a 6-pin 1.6 mm x 1.6 mm
TDFN package with an operating junction temperature
range of –40°C to +125°C.
Typical Application Circuit
Efficiency VOUT = 2.5V
2021 Microchip Technology Inc.
DS20006538A-page 1
MIC23031
Package Types
MIC23031, Fixed
6-Lead TDFN (MT)
(Top View)
MIC23031, Adjustable
6-Lead TDFN (MT)
(Top View)
VIN
1
6
PGND
VIN
1
6
GND
SW
2
5
AGND
SW
2
5
FB
SNS
3
4
EN
SNS
3
4
EN
Functional Block Diagrams
MIC23031 Fixed Output
VIN
EN
CONTROL
LOGIC
Timer &
Softstart
UVLO
Gate
Drive
Reference
SW
Current
Limit
ERROR
COMPARATOR
ZERO 1
ISENSE
PGND
SNS
AGND
MIC23031 Adjustable Output
VIN
EN
CONTROL
LOGIC
Timer &
Softstart
UVLO
Gate
Drive
Reference
SW
Current
Limit
ERROR
COMPARATOR
ZERO 1
ISENSE
SNS
FB
GND
DS20006538A-page 2
2021 Microchip Technology Inc.
MIC23031
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
Supply Voltage (VIN) ...................................................................................................................................................+6V
Sense (VSNS) ..............................................................................................................................................................+6V
Output Switch Voltage.................................................................................................................................................+6V
Enable Input Voltage (VEN) ............................................................................................................................–0.3V to VIN
ESD Rating (Note 1) .................................................................................................................................. ESD Sensitive
Operating Ratings ‡
Supply Voltage (VIN) ................................................................................................................................. +2.7V to +5.5V
Enable Input Voltage (VEN) .................................................................................................................................0V to VIN
Output Voltage Range (VSNS) ................................................................................................................... +0.7V to +3.6V
† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at those or any other conditions above those indicated
in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended
periods may affect device reliability. Specifications are for packaged product only.
‡ Notice: The device is not guaranteed to function outside its operating ratings.
Note 1: Devices are ESD sensitive. Handling precautions are recommended. Human body model, 1.5 kΩ in series
with 100 pF.
ELECTRICAL CHARACTERISTICS
Electrical Characteristics: TA = 25°C, L = 1.0 µH, VIN = VEN = 3.6V; COUT = 4.7 µF; Bold values indicate –40°C ≤ TJ
≤ +125°C; unless otherwise specified. Specification for packaged product only.
Parameter
Symbol
Min.
Typ.
Max.
Units
Supply Voltage Range
VIN
2.7
—
5.5
V
—
Undervoltage Lockout
Threshold
VUVLO
2.45
2.55
2.65
V
Turn-On
IQ
—
21
35
µA
IOUT = 0 mA, VSNS > 1.2 * VOUT(NOM)
ISD
—
0.01
4
µA
VEN = 0V; VIN = 5.5V
VOUT
–2.5
—
+2.5
%
VIN = 3.6V; ILOAD = 20 mA
Quiescent Current
Shutdown Current
Output Voltage Accuracy
Conditions
Feedback Voltage
VFB
—
0.62
—
V
Adjustable Option Only
Current Limit
ILIM
0.41
0.7
1
A
VSNS = 0.9 * VOUT(NOM)
Output Voltage Line
Regulation
LINE_REG
—
0.3
—
%/V
Output Voltage Load
Regulation
LOAD_REG
—
0.7
—
%
—
0.65
—
PWM Switch On-Resistance
Maximum Frequency
RDS(ON)
FMAX
Ω
—
0.8
—
—
4
—
MHz
VIN = 3.0V to 5.5V, VOUT = 1.2V,
ILOAD = 20 mA,
20 mA < ILOAD < 400 mA,
VOUT = 1.2V, VIN = 3.6V
ISW = 100 mA PMOS
ISW = –100 mA NMOS
IOUT = 120 mA
Soft-Start Time
tSS
—
100
—
µs
VOUT = 90%
Enable Threshold
VEN
0.5
0.9
1.2
V
—
Enable Input Current
IEN
—
0.1
2
µA
—
Overtemperature Shutdown
TSD
—
160
—
°C
—
Overtemperature Shutdown
Hysteresis
TSD_HYS
—
20
—
°C
—
2021 Microchip Technology Inc.
DS20006538A-page 3
MIC23031
TEMPERATURE SPECIFICATIONS (Note 1)
Parameters
Symbol
Min.
Typ.
Max.
Units
Conditions
Junction Operating Temperature Range
TJ
–40
—
+125
°C
—
Storage Temperature Range
TS
–65
—
+150
°C
—
JA
—
92.4
—
°C/W
—
Temperature Ranges
Package Thermal Resistances
Thermal Resistance TDFN 1.6 mm x 1.6 mm
Note 1:
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.
DS20006538A-page 4
2021 Microchip Technology Inc.
MIC23031
2.0
Note:
TYPICAL PERFORMANCE CURVES
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
FIGURE 2-1:
Efficiency (VOUT = 2.5V).
FIGURE 2-4:
Inductors.
Efficiency with Various
FIGURE 2-2:
Efficiency (VOUT = 1.8V).
FIGURE 2-5:
Voltage.
Quiescent Current vs. Input
FIGURE 2-3:
Efficiency (VOUT = 1.2V)
FIGURE 2-6:
Voltage.
Output Voltage vs. Input
2021 Microchip Technology Inc.
DS20006538A-page 5
MIC23031
FIGURE 2-7:
Current.
Output Voltage vs. Output
FIGURE 2-10:
Output Current.
Switching Frequency vs.
FIGURE 2-8:
Temperature.
Output Voltage vs.
FIGURE 2-11:
Output Current.
Switching Frequency vs.
FIGURE 2-9:
Frequency vs. Temperature.
FIGURE 2-12:
Voltage.
Enable Threshold vs. Input
DS20006538A-page 6
2021 Microchip Technology Inc.
MIC23031
FIGURE 2-13:
Temperature.
Enable Threshold vs.
FIGURE 2-16:
Switching Waveform Discontinuous Mode.
FIGURE 2-14:
Voltage.
Current-Limit vs. Input
FIGURE 2-17:
Switching Waveform Discontinuous Mode.
FIGURE 2-15:
Switching Waveform Discontinuous Mode.
FIGURE 2-18:
Switching Waveform Continuous Mode.
2021 Microchip Technology Inc.
DS20006538A-page 7
MIC23031
FIGURE 2-19:
Switching Waveform Continuous Mode.
FIGURE 2-22:
Start-Up Waveform.
FIGURE 2-20:
Switching Waveform Continuous Mode.
FIGURE 2-23:
Load Transient.
FIGURE 2-21:
FIGURE 2-24:
Load Transient.
DS20006538A-page 8
Start-Up Waveform.
2021 Microchip Technology Inc.
MIC23031
FIGURE 2-25:
Load Transient.
FIGURE 2-26:
Load Transient.
FIGURE 2-27:
Line Transient.
2021 Microchip Technology Inc.
DS20006538A-page 9
MIC23031
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
Pin Number
(Fixed)
Pin Number
(Adjustable)
Pin
Name
1
1
VIN
Input Voltage: Connect a capacitor to ground to decouple the noise.
2
2
SW
Switch (Output): Internal power MOSFET output switches.
3
3
SNS
Sense: Connect to VOUT as close to output capacitor as possible to
sense output voltage.
4
4
EN
Enable (Input): Logic-high enables operation of the regulator. Logic-low
will shut down the device. Do not leave floating.
5
—
AGND
Analog Ground: Connect to central ground point where all high-current
paths meet (CIN, COUT, PGND) for best operation.
—
5
FB
Feedback (Input): Connect resistor divider at this node to set output
voltage. Resistors should be selected based on a nominal VFB of 0.62V.
6
—
PGND
—
6
GND
ePAD
ePAD
DS20006538A-page 10
Description
Power Ground.
Ground.
HS PAD Connect to PGND or AGND.
2021 Microchip Technology Inc.
MIC23031
4.0
FUNCTIONAL DESCRIPTION
4.1
VIN
The input supply (VIN) provides power to the internal
MOSFETs for the switch mode regulator along with the
internal control circuitry. The VIN operating range is
2.7V to 5.5V, so an input capacitor with a minimum
voltage rating of 6.3V is recommended. Due to the high
switching speed, a minimum 2.2 µF bypass capacitor
placed close to VIN and the power ground (PGND) pin
is required.
4.2
4.6
FB (Adjustable Output Only)
The feedback pin (FB) allows the regulated output
voltage to be set by applying an external resistor
network. The internal reference voltage is 0.62V and
the recommended value of R2 is 200 kΩ. The output
voltage is calculated using Equation 4-1.
EQUATION 4-1:
R1 + 1
V OUT = 0.62V ---------------
200k
EN
A logic high signal on the enable pin activates the
output voltage of the device. A logic low signal on the
enable pin deactivates the output and reduces supply
current to 0.01 µA. The MIC23031 features built-in
soft-start circuitry that reduces in-rush current and
prevents the output voltage from overshooting at start
up. Do not leave the enable pin floating.
MIC23031
VIN
VIN
SW
C1
4.3
SW
The switch (SW) connects directly to one end of the
inductor and provides the current path during switching
cycles. The other end of the inductor is connected to
the load, SNS pin and output capacitor. Because of the
high speed switching on this pin, the switch node
should be routed away from sensitive nodes whenever
possible.
4.4
SNS
The sense (SNS) pin is connected to the output of the
device to provide feedback to the control circuitry. The
SNS connection should be placed close to the output
capacitor.
4.5
SNS
EN
EN
VOUT
L1
R1
FB
GND
R2
GND
GND
FIGURE 4-1:
Schematic.
4.7
C2
MIC23031-AYMT
PGND/GND
The power ground pin is the ground path for the high
current in PWM mode. The current loop for the power
ground should be as small as possible and separate
from the analog ground (AGND) loop as applicable.
AGND (Fixed Output Only)
The analog ground (AGND) is the ground path for the
biasing and control circuitry. The current loop for the
signal ground should be separate from the power
ground (PGND) loop.
2021 Microchip Technology Inc.
DS20006538A-page 11
MIC23031
5.0
APPLICATION INFORMATION
The MIC23031 is a high-performance DC/DC
step-down regulator that offers a small solution size.
Supporting an output current up to 400 mA inside a tiny
1.6 mm x 1.6 mm TDFN package and requiring only
three external components, the MIC23031 meets
today’s miniature portable electronic device needs.
Using the HyperLight Load® switching scheme, the
MIC23031 is able to maintain high efficiency
throughout the entire load range while providing
ultra-fast load transient response. The following
sections provide additional device application
information.
5.1
Input Capacitor
A 2.2 µF ceramic capacitor or greater should be placed
close to the VIN pin and PGND pin for bypassing. A
TDK C1608X7S0J475K080AC, size 0603, 4.7 µF
ceramic capacitor is recommended based upon
performance, size, and cost. A X5R or X7R
temperature rating is recommended for the input
capacitor. Y5V temperature rating capacitors, aside
from losing most of their capacitance over temperature,
can also become resistive at high frequencies. This
reduces their ability to filter out high frequency noise.
5.2
Output Capacitor
The MIC23031 is designed for use with a 2.2 µF or
greater ceramic output capacitor. Increasing the output
capacitance will lower output ripple and improve load
transient response but could increase solution size or
cost. A low equivalent series resistance (ESR) ceramic
output capacitor such as the TDK C1608X5R0J475K,
size 0603, 4.7 µF ceramic capacitor is recommended
based upon performance, size and cost. Both the X7R
or X5R temperature rating capacitors are
recommended. The Y5V and Z5U temperature rating
capacitors are not recommended due to their wide
variation in capacitance over temperature and
increased resistance at high frequencies.
5.3
Inductor Selection
When selecting an inductor, it is important to consider
the following factors (not necessarily in the order of
importance):
•
•
•
•
Inductance
Rated Current Value
Size Requirements
DC Resistance (DCR)
DS20006538A-page 12
The MIC23031 was designed for use with an
inductance range from 0.47 µH to 4.7 µH. Typically, a
1 µH inductor is recommended for a balance of
transient response, efficiency, and output ripple. For
faster transient response, a 0.47 µH inductor will yield
the best result. For lower output ripple, a 4.7 µH
inductor is recommended.
Maximum current ratings of the inductor are generally
given in two methods; permissible DC current and
saturation current. Permissible DC current can be rated
either for a 40°C temperature rise or a 10% to 20% loss
in inductance. Ensure the inductor selected can handle
the maximum operating current. When saturation
current is specified, make sure that there is enough
margin so that the peak current does not cause the
inductor to saturate. Peak current can be calculated as
follows:
EQUATION 5-1:
1 – V OUT V IN
I PEAK = I OUT + V OUT -----------------------------------
2fL
As shown by the calculation above, the peak inductor
current is inversely proportional to the switching
frequency and the inductance; the lower the switching
frequency or the inductance, the higher the peak
current. As input voltage increases, the peak current
also increases.
The size of the inductor depends on the requirements
of the application. DC resistance (DCR) is also
important. While DCR is inversely proportional to size,
DCR can represent a significant efficiency loss. Refer
to the Efficiency Considerations section.
5.4
Compensation
The MIC23031 is designed to be stable with a 0.47 µH
to 4.7 µH inductor with a minimum of 2.2 µF ceramic
(X5R) output capacitor.
5.5
Duty Cycle
The typical maximum duty cycle of the MIC23031 is
80%.
5.6
Efficiency Considerations
Efficiency is defined as the amount of useful output
power, divided by the amount of power supplied.
2021 Microchip Technology Inc.
MIC23031
EQUATION 5-2:
The DCR losses can be calculated by using
Equation 5-3:
V OUT I OUT
= -------------------------------- 100
V IN I IN
EQUATION 5-3:
2
LPd = I OUT DCR
Maintaining high efficiency serves two purposes. It
reduces power dissipation in the power supply,
reducing the need for heat sinks and thermal design
considerations and it reduces consumption of current
for battery powered applications. Reduced current
draw from a battery increases the devices operating
time which is critical in hand held devices.
There are two types of losses in switching converters;
DC losses and switching losses. DC losses are simply
the power dissipation of I2R. Power is dissipated in the
high-side switch during the on cycle. Power loss is
equal to the high-side MOSFET RDS(ON) multiplied by
the switch current squared. During the off cycle, the
low-side N-channel MOSFET conducts, also
dissipating power. Device operating current also
reduces efficiency. The product of the quiescent
(operating) current and the supply voltage represents
another DC loss. The current required driving the gates
on and off at a constant 4 MHz frequency and the
switching transitions make up the switching losses.
FIGURE 5-1:
Efficiency under Load.
Figure 5-1 shows an efficiency curve. From no load to
100 mA, efficiency losses are dominated by quiescent
current losses, gate drive and transition losses. By
using the HyperLight Load mode, the MIC23031 is able
to maintain high efficiency at low output currents.
Over 100 mA, efficiency loss is dominated by MOSFET
RDS(ON) and inductor losses. Higher input supply
voltages will increase the gate to source threshold on
the internal MOSFETs, thereby reducing the internal
RDS(ON). This improves efficiency by reducing DC
losses in the device. All but the inductor losses are
inherent to the device. In which case, inductor selection
becomes increasingly critical in efficiency calculations.
As the inductors are reduced in size, the DC resistance
(DCR) can become quite significant.
2021 Microchip Technology Inc.
From that, the loss in efficiency due to inductor
resistance can be calculated by using Equation 5-4:
EQUATION 5-4:
V OUT I OUT
EfficiencyLoss = 1 – ---------------------------------------------------- 100
V OUT I OUT + P DCR
Efficiency loss due to DCR is minimal at light loads and
gains significance as the load is increased. Inductor
selection becomes a trade-off between efficiency and
size in this case.
5.7
HyperLight Load® Mode
MIC23031 uses a minimum on-time and off-time
proprietary control loop. When the output voltage falls
below the regulation threshold, the error comparator
begins a switching cycle that turns the PMOS on and
keeps it on for the duration of the minimum on-time.
This increases the output voltage. If the output voltage
is over the regulation threshold, then the error
comparator turns the PMOS off for a minimum off-time
until the output drops below the threshold. The NMOS
acts as an ideal rectifier that conducts when the PMOS
is off. Using a NMOS switch instead of a diode allows
for lower voltage drop across the switching device
when it is on. The asynchronous switching combination
between the PMOS and the NMOS allows the control
loop to work in discontinuous mode for light load
operations. In discontinuous mode, the MIC23031
works in pulse frequency modulation (PFM) to regulate
the output. As the output current increases, the off-time
decreases, thus provides more energy to the output.
This switching scheme improves the efficiency of
MIC23031 during light load currents by only switching
when it is needed. As the load current increases, the
MIC23031 goes into continuous conduction mode
(CCM) and switches at a frequency centered at 4 MHz.
The equation to calculate the load when the MIC23031
goes into continuous conduction mode may be
approximated by the following Equation 5-5:
DS20006538A-page 13
MIC23031
EQUATION 5-5:
V IN – V OUT D
I LOAD -------------------------------------------2L f
As shown in Equation 5-5, the load at which MIC23031
transitions from HyperLight Load mode to PWM mode
is a function of the input voltage (VIN), output voltage
(VOUT), duty cycle (D), inductance (L), and frequency
(f). Because the inductance range of MIC23031 is from
0.47 µH to 4.7 µH, the device may then be tailored to
enter HyperLight Load mode or PWM mode at a
specific load current by selecting the appropriate
inductance. For example, in the graph below, when the
inductance is 4.7 µH the MIC23031 will transition into
PWM mode at a load of approximately 4 mA. Under the
same condition, when the inductance is 1 µH, the
MIC23031 will transition into PWM mode at
approximately 70 mA.
FIGURE 5-2:
Inductance.
DS20006538A-page 14
Switching Frequency vs.
2021 Microchip Technology Inc.
MIC23031
6.0
MIC23031 TYPICAL APPLICATION CIRCUITS
6.1
Fixed 1.8V
U1 MIC23031
VIN
2.7 to 5.5V
1
VIN
SW 2
EN
SNS 3
C1
EN
GND
VOUT
L1
C2
4
AGND
5
PGND
6
GND
Bill of Materials
TABLE 6-1:
Item
FIXED 1.8V BILL OF MATERIALS
Part Number
C1, C2 C1608X5R0J475K
L1
U1
Note 1:
2:
3:
4:
Manufacturer
TDK( 1)
Description
Qty.
4.7µF Ceramic Capacitor, 6.3V, X5R, Size 0603
LQM21PN1R0M00
Murata( 2)
1µH, 0.8A, 190mΩ, L2mm x W1.25mm x H0.5mm
LQH32CN1R0M33
Murata( 2)
1µH, 1A, 60mΩ, L3.2mm x W2.5mm x H2.0mm
LQM31PN1R0M00
Murata( 2)
1µH, 1.2A, 120mΩ, L3.2mm x W1.6mm x H0.95mm
GLF251812T1R0M
TDK( 1)
1µH, 0.8A, 100mΩ, L2.5mm x W1.8mm x H1.35mm
LQM31PNR47M00
Murata( 2)
2
1
0.47µH, 1.4A, 80mΩ, L3.2mm x W1.6mm x H0.85mm
MIPF2520D1R5
FDK( 3)
1.5µH, 1.5A, 70mΩ, L2.5mm x W2mm x H1.0mm
MIC23031-xYMT
Microchip( 4)
4 MHz 400 mA Buck Regulator with HyperLight
Load® Mode
1
TDK: www.tdk.com
Murata: www.murata.com
FDK: www.fdk.jp.co
Microchip Technology Inc: www.microchip.com
2021 Microchip Technology Inc.
DS20006538A-page 15
MIC23031
6.2
Adjustable 1.8V
U1 - MIC23031
VIN
1
VIN
SW
C1
EN
4
VOUT
2
L1
R1
383k
SNS 3
FB 5
EN
GND
6
GND
R2
200k
C2
GND
Bill of Materials
TABLE 6-2:
Item
ADJUSTABLE 1.8V BILL OF MATERIALS
Part Number
C1, C2 C1608X5R0J475K
Manufacturer
TDK( 1)
Description
Qty.
4.7µF Ceramic Capacitor, 6.3V, X5R, Size 0603
2
R1
CRCW06033833FT1
Vishay( 2)
383kΩ, 1%, Size 0603
1
R2
CRCW06032003FT1
Vishay( 2)
200kΩ, 1%, Size 0603
1
LQM21PN1R0M00
Murata( 3)
1µH, 0.8A, 190mΩ, L2mm x W1.25mm x H0.5mm
LQH32CN1R0M33
Murata( 3)
1µH, 1A, 60mΩ, L3.2mm x W2.5mm x H2.0mm
LQM31PN1R0M00
Murata( 3)
1µH, 1.2A, 120mΩ, L3.2mm x W1.6mm x H0.95mm
GLF251812T1R0M
TDK( 1)
1µH, 0.8A, 100mΩ, L2.5mm x W1.8mm x H1.35mm
LQM31PNR47M00
Murata( 3)
L1
U1
Note 1:
2:
3:
4:
5:
1
0.47µH, 1.4A, 80mΩ, L3.2mm x W1.6mm x H0.85mm
MIPF2520D1R5
FDK( 4)
1.5µH, 1.5A, 70mΩ, L2.5mm x W2mm x H1.0mm
MIC23031-xYMT
Microchip( 5)
4 MHz 400 mA Buck Regulator with HyperLight
Load® Mode
1
TDK: www.tdk.com
Vishay: www.vishay.com
Murata: www.murata.com
FDK: www.fdk.jp.co
Microchip Technology Inc: www.microchip.com
DS20006538A-page 16
2021 Microchip Technology Inc.
MIC23031
7.0
PCB LAYOUT RECOMMENDATIONS
7.1
Fixed
FIGURE 7-1:
Fixed Top Layer.
FIGURE 7-2:
Fixed Bottom Layer.
2021 Microchip Technology Inc.
DS20006538A-page 17
MIC23031
7.2
Adjustable
FIGURE 7-3:
Adjustable Top Layer.
FIGURE 7-4:
Adjustable Bottom Layer.
DS20006538A-page 18
2021 Microchip Technology Inc.
MIC23031
8.0
PACKAGING INFORMATION
8.1
Package Marking Information
TABLE 8-1:
6-Lead TDFN*
Example
XXX
GE4
MIC23031 PACKAGE MARKING CODES
Part Number
Output Voltage
Marking Code
MIC23031-AYMT
Adjustable
GEA
MIC23031-GYMT
1.8V
GEG
MIC23031-FYMY
1.5V
GEF
MIC23031-4YMT
1.2V
GE4
MIC23031-CYMT
1.0V
GEC
Legend: XX...X
Y
YY
WW
NNN
e3
*
Product code or customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle
mark).
Note:
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information. Package may or may not include
the corporate logo.
Underbar (_) and/or Overbar (‾) symbol may not be to scale.
2021 Microchip Technology Inc.
DS20006538A-page 19
MIC23031
6-Lead TDFN 1.6 mm x 1.6 mm Package Outline and Recommended Land Pattern
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
DS20006538A-page 20
2021 Microchip Technology Inc.
MIC23031
APPENDIX A:
REVISION HISTORY
Revision A (May 2021)
• Converted Micrel document MIC23031 to Microchip data sheet DS20006538A.
• Minor text changes throughout.
2021 Microchip Technology Inc.
DS20006538A-page 21
MIC23031
NOTES:
DS20006538A-page 22
2021 Microchip Technology Inc.
MIC23031
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
PART NO.
-X
X
XX
–XX
Device
Output
Voltage
Junction
Temperature
Range
Package
Option
Media Type
Device:
Output Voltage:
MIC23031: 4 MHz PWM 400 mA Buck Regulator with
HyperLight Load®
A = Adjustable
G = 1.8V
F = 1.5V
4 = 1.2V
C = 1.0V
Junction
Temperature Range:
Y
Package:
MT =
Media Type:
TR
=
Examples:
a) MIC23031-AYMT-TR:
4 MHz PWM 400 mA Buck
Regulator with HyperLight Load®,
Adjustable Output Voltage,
–40°C to +125°C Junction
Temperature Range, 6-Lead TDFN
Package, 5000/Reel
b) MIC23031-GYMT-TR:
4 MHz PWM 400 mA Buck
Regulator with HyperLight Load®,
1.8V Fixed Output Voltage,
–40°C to +125°C Junction
Temperature Range, 6-Lead TDFN
Package, 5000/Reel
c) MIC23031-FYMT-TR:
4 MHz PWM 400 mA Buck
Regulator with HyperLight Load®,
1.5V Fixed Output Voltage,
–40°C to +125°C Junction
Temperature Range, 6-Lead TDFN
Package, 5000/Reel
d) MIC23031-4YMT-TR:
4 MHz PWM 400 mA Buck
Regulator with HyperLight Load®,
1.2V Fixed Output Voltage,
–40°C to +125°C Junction
Temperature Range, 6-Lead TDFN
Package, 5000/Reel
e) MIC23031-CYMT-TR
4 MHz PWM 400 mA Buck
Regulator with HyperLight Load®,
1.0V Fixed Output Voltage,
–40°C to +125°C Junction
Temperature Range, 6-Lead TDFN
Package, 5000/Reel
–40°C to +125°C
6-Lead 1.6 mm x 1.6 mm TDFN
= 5000/Reel
Note: Other voltages available. Contact Factory for details.
Note 1:
2021 Microchip Technology Inc.
Tape and Reel identifier only appears in the
catalog part number description. This identifier is
used for ordering purposes and is not printed on
the device package. Check with your Microchip
Sales Office for package availability with the
Tape and Reel option.
DS20006538A-page 23
MIC23031
NOTES:
DS20006538A-page 24
2021 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specifications contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is secure when used in the intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods being used in attempts to breach the code protection features of the Microchip
devices. We believe that these methods require using the Microchip products in a manner outside the operating specifications
contained in Microchip's Data Sheets. Attempts to breach these code protection features, most likely, cannot be accomplished
without violating Microchip's intellectual property rights.
•
Microchip is willing to work with any customer who is concerned about the integrity of its code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code. Code protection does not
mean that we are guaranteeing the product is "unbreakable." Code protection is constantly evolving. We at Microchip are
committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection
feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or
other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication is provided for the sole
purpose of designing with and using Microchip products. Information regarding device applications and the like is provided
only for your convenience and may be superseded by updates.
It is your responsibility to ensure that your application meets
with your specifications.
THIS INFORMATION IS PROVIDED BY MICROCHIP "AS IS".
MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED,
WRITTEN OR ORAL, STATUTORY OR OTHERWISE,
RELATED TO THE INFORMATION INCLUDING BUT NOT
LIMITED TO ANY IMPLIED WARRANTIES OF NONINFRINGEMENT, MERCHANTABILITY, AND FITNESS FOR A
PARTICULAR PURPOSE OR WARRANTIES RELATED TO
ITS CONDITION, QUALITY, OR PERFORMANCE.
IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT, SPECIAL, PUNITIVE, INCIDENTAL OR CONSEQUENTIAL LOSS, DAMAGE, COST OR EXPENSE OF ANY KIND
WHATSOEVER RELATED TO THE INFORMATION OR ITS
USE, HOWEVER CAUSED, EVEN IF MICROCHIP HAS
BEEN ADVISED OF THE POSSIBILITY OR THE DAMAGES
ARE FORESEEABLE. TO THE FULLEST EXTENT
ALLOWED BY LAW, MICROCHIP'S TOTAL LIABILITY ON
ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION
OR ITS USE WILL NOT EXCEED THE AMOUNT OF FEES, IF
ANY, THAT YOU HAVE PAID DIRECTLY TO MICROCHIP
FOR THE INFORMATION. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and
the buyer agrees to defend, indemnify and hold harmless
Microchip from any and all damages, claims, suits, or expenses
resulting from such use. No licenses are conveyed, implicitly or
otherwise, under any Microchip intellectual property rights
unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, Adaptec,
AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud, chipKIT,
chipKIT logo, CryptoMemory, CryptoRF, dsPIC, FlashFlex,
flexPWR, HELDO, IGLOO, JukeBlox, KeeLoq, Kleer, LANCheck,
LinkMD, maXStylus, maXTouch, MediaLB, megaAVR, Microsemi,
Microsemi logo, MOST, MOST logo, MPLAB, OptoLyzer,
PackeTime, PIC, picoPower, PICSTART, PIC32 logo, PolarFire,
Prochip Designer, QTouch, SAM-BA, SenGenuity, SpyNIC, SST,
SST Logo, SuperFlash, Symmetricom, SyncServer, Tachyon,
TimeSource, tinyAVR, UNI/O, Vectron, and XMEGA are registered
trademarks of Microchip Technology Incorporated in the U.S.A. and
other countries.
AgileSwitch, APT, ClockWorks, The Embedded Control Solutions
Company, EtherSynch, FlashTec, Hyper Speed Control, HyperLight
Load, IntelliMOS, Libero, motorBench, mTouch, Powermite 3,
Precision Edge, ProASIC, ProASIC Plus, ProASIC Plus logo, QuietWire, SmartFusion, SyncWorld, Temux, TimeCesium, TimeHub,
TimePictra, TimeProvider, WinPath, and ZL are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, Augmented Switching, BlueSky,
BodyCom, CodeGuard, CryptoAuthentication, CryptoAutomotive,
CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net,
Dynamic Average Matching, DAM, ECAN, Espresso T1S,
EtherGREEN, IdealBridge, In-Circuit Serial Programming, ICSP,
INICnet, Intelligent Paralleling, Inter-Chip Connectivity,
JitterBlocker, maxCrypto, maxView, memBrain, Mindi, MiWi,
MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK,
NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net,
PICkit, PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE,
Ripple Blocker, RTAX, RTG4, SAM-ICE, Serial Quad I/O,
simpleMAP, SimpliPHY, SmartBuffer, SMART-I.S., storClad, SQI,
SuperSwitcher, SuperSwitcher II, Switchtec, SynchroPHY, Total
Endurance, TSHARC, USBCheck, VariSense, VectorBlox, VeriPHY,
ViewSpan, WiperLock, XpressConnect, and ZENA are trademarks
of Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
The Adaptec logo, Frequency on Demand, Silicon Storage
Technology, and Symmcom are registered trademarks of Microchip
Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology Germany
II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in
other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2021, Microchip Technology Incorporated, All Rights Reserved.
For information regarding Microchip’s Quality Management Systems,
please visit www.microchip.com/quality.
2021 Microchip Technology Inc.
ISBN: 978-1-5224-8229-1
DS20006538A-page 25
Worldwide Sales and Service
AMERICAS
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Tel: 408-436-4270
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Fax: 905-695-2078
DS20006538A-page 26
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Fax: 44-118-921-5820
2021 Microchip Technology Inc.
02/28/20
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