MIC23156
1.5A, 3 MHz Synchronous Buck Regulator with HyperLight Load®
and I2C Control for Dynamic Voltage Scaling
Features
General Description
• Input Voltage: 2.7V to 5.5V
• Up to 1.5A Output Current
• 1 MHz I2C Controlled Adjustable Output:
- VOUT = 0.7 to 2.4V in 10 mV Steps
• High Output Voltage Accuracy
(±1.5% over Temperature)
• Fast Pin-Selectable Output Voltage
• Programmable Soft-Start Using External Capacitor
• Ultra-Low Quiescent Current of 30 µA when
Not Switching
• Thermal Shutdown and Current-Limit Protection
• Safe Start-Up into Pre-Biased Output
• Stable with 1 µH Output Inductor and
2.2 µF Ceramic Capacitor
• Up to 93% Peak Efficiency
• –40°C to +125°C Junction Temperature Range
• Available in 16-ball, 0.4 mm pitch, 1.81 mm x
1.71 mm Wafer Level Chip-Scale (WLCSP) and
17-pin, 2.8 mm x 2.5 mm QFN Packages
The MIC23156 is a high-efficiency, 1.5A synchronous
buck regulator with HyperLight Load® mode and
dynamic voltage scaling control through I2C. HyperLight
Load provides very high efficiency at light loads and
ultra-fast transient response. The ability to dynamically
change the output voltage and maintain high output voltage accuracy make the MIC23156 perfectly suited for
supplying processor core voltages. An additional benefit
of this proprietary architecture is very low output ripple
voltage, throughout the entire load range, with the use of
small output capacitors. Fast mode plus I2C provides
output voltage and chip enable/disable control from a
standard I2C bus with I2C clock rates of 100 kHz,
400 kHz, and 1 MHz.
The MIC23156 is designed for use with 1 µH, and an
output capacitor as small as 2.2 µF, that enables a total
solution size less than 1 mm in height.
Package Types
16-Ball 1.81 mm x 1.71 mm WLCSP (CS)
(Top View)
1
2
3
4
A
SCL
SDA
SNS
SS
B
VI2C
VSEL
PGOOD
AVIN
C
SW
SW
PVIN
AGND
D
PGND
PGND
PVIN
EN
Applications
•
•
•
•
Mobile Handsets
Solid-State Drives (SSD)
WiFi/WiMx/WiBro Modules
Portable Applications
2017 Microchip Technology Inc.
SW
SW
17-Pin 2.5 mm x 2.8 mm QFN (ML)
(Top View)
17
16
PGND
SCL
14
PGND
SDA
3
13
PVIN
SNS
4
12
PVIN
SS
5
11
VSEL
NC
6
10
EN
7
8
9
AGND
15
2
AVIN
1
PGOOD
VI2C
DS20005919A-page 1
MIC23156
Typical Application Schematic
U1
MIC23156
VIN
PVIN
APPLICATIONS
PROCESSOR
CORE
SUPPLY
SW
SNS
AVIN
EN
PGOOD
EN
SS
PGND
POR
VSEL
VSEL
VI2C
SCL
VI2C
I2C HIGH-SPEED
MODE BUS
SDA
AGND
Efficiency (VOUT = 2.4V) vs. Output Current
100
90
EFFICIENCY (%)
80
VIN = 3.6V
70
VIN = 5V
60
VIN = 4.2V
50
40
30
20
COUT = 2.2 µF
L = 1 µH
10
0
10
100
1000
10000
OUTPUT CURRENT (mA)
DS20005919A-page 2
2017 Microchip Technology Inc.
MIC23156
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings†
Input Supply Voltage (AVIN, PVIN, VI2C)....................................................................................................... –0.3V to +6V
Switch Voltage (SW) ....................................................................................................................................–0.3V to AVIN
Logic Voltage (EN, PGOOD)........................................................................................................................–0.3V to AVIN
Logic Voltage (VSEL, SCL, SDA) .................................................................................................................. –0.3V to VI2C
Analog Input Voltage (SNS, SS) ..................................................................................................................–0.3V to AVIN
Power Dissipation (TA = +70°C)............................................................................................................. Internally Limited
ESD Rating(1) ............................................................................................................................................................. 2 kV
†
Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This
is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for
extended periods may affect device reliability.
Note 1:
Devices are ESD-sensitive. Handling precautions are recommended. Human body model, 1.5 k in series
with 100 pF.
Operating Ratings(1)
Input Supply Voltage (AVIN, PVIN, VI2C).................................................................................................... +2.7V to +5.5V
Switch Voltage (SW) .........................................................................................................................................0V to AVIN
Logic Voltage (EN, PGOOD).............................................................................................................................0V to AVIN
Logic Voltage (VSEL, SCL, SDA) ....................................................................................................................... 0V to VI2C
Analog Input Voltage (SNS, SS) .......................................................................................................................0V to AVIN
Note 1:
The device is not ensured to function outside the operating range.
2017 Microchip Technology Inc.
DS20005919A-page 3
MIC23156
TABLE 1-1:
ELECTRICAL CHARACTERISTICS(1)
Electrical Specifications: unless otherwise specified, TA = +25°C; AVIN = PVIN = VEN = VVI2C = 3.6V; L = 1.0 µH; COUT = 2.2
µF. Boldface values indicate –40°C TJ +125°C.
Symbol
Parameter
Min.
Typ.
Max.
Units
Test Conditions
VIN
Supply Input Voltage Range
2.7
—
5.5
V
—
ENLOW
Enable Logic Pin Low Threshold
—
—
0.5
V
Logic low
ENHIGH
Enable Logic Pin High Threshold
1.2
—
—
V
Logic high
IVSEL_LO
VSEL Logic Pin Low Threshold
—
—
0.3 x VI2C
V
Logic low
IVSEL_HI
VSEL Logic Pin High Threshold
0.7 x VI2C
—
—
V
Logic high
IEN
Logic Pin Input Current
—
0.1
2
µA
Pins: EN and VSEL
UVLO
Undervoltage Lockout
Threshold
2.45
2.55
2.65
V
Rising
UVLO_HYS
Undervoltage Lockout
Hysteresis
—
75
—
mV
Falling
TSHD
Shutdown Temperature
(Threshold)
—
160
—
°C
—
TSHD_HYST
Shutdown Temperature
Hysteresis
—
20
—
°C
—
ISHDN
Shutdown Supply Current
—
0.1
5
µA
VEN = 0V
DC-to-DC Converter
VOUT
Output Voltage Accuracy
–1.5
—
+1.5
%
VOUT = 1V, IOUT = 10 mA
IQ
Quiescent Supply Current
—
30
50
µA
IOUT = 0 mA,
VFB > 1.2 * VOUT
VOUT
Output Voltage Range
0.7
—
2.4
V
VOUT/VOUT
Output Voltage Line Regulation
—
0.02
—
%/V
VOUT/VOUT
Output Voltage Load Regulation
—
0.04
—
%
—
0.17
—
ISW = +100 mA, high-side
switch PMOS (QFN)
—
0.15
—
ISW = +100 mA, high-side
switch PMOS (WLCSP)
—
0.15
—
ISW = –100 mA, low-side
switch NMOS (QFN)
—
0.13
—
ISW = –100 mA, low-side
switch NMOS (WLCSP)
1.7
2.9
5.1
A
RSWON
Switch-On Resistance
3.0V < VAVIN < 4.5V,
ILOAD = 10 mA
20 mA < IOUT < 1A
Ω
ILIM
Current Limit (DC Value)
fSW
Oscillator Switching Frequency
—
3
—
MHz
DMAX
Maximum Duty Cycle
80
—
—
%
—
DVS Step-Size
—
19
—
mV
—
tSS
Soft Start Time
—
250
—
µs
VOUT = 90%,
CSS = 120 pF
Note 1:
VOUT = 1V
—
Frequency = 3 MHz
Specifications are for packaged product only.
DS20005919A-page 4
2017 Microchip Technology Inc.
MIC23156
TABLE 1-1:
ELECTRICAL CHARACTERISTICS(1) (CONTINUED)
Electrical Specifications: unless otherwise specified, TA = +25°C; AVIN = PVIN = VEN = VVI2C = 3.6V; L = 1.0 µH; COUT = 2.2
µF. Boldface values indicate –40°C TJ +125°C.
Symbol
Parameter
Min.
Typ.
Max.
Units
Test Conditions
2
I C Interface (Assuming 550 pF Total Bus Capacitance
10110111, 0xB7
I2C Address
—
10110110, 0xB6
Read (Binary, Hex)
Write (Binary, Hex)
VIL
Low-Level Input Voltage
—
—
0.3 x VI2C
V
VIH
High-Level Input Voltage
0.7 x VI2C
—
—
V
SCL, SDA
RSDA_PD
SDA Pull-Down Resistance
SCL, SDA
—
20
—
W
Open-drain pull-down on
SDA during read back,
ISDA = 500 µA
Power Good (PG)
VPG_LOW
PGOOD Output Low
—
100
—
mV
VOUT < 80% VNOM,
IPGOOD = -500 µA
IPG_LEAK
PGOOD Output Leakage
—
—
5
µA
VOUT = VNOM
VPG_TH
PGOOD Threshold
(% of VOUT < VNOM)
86
—
96
%
VOUT ramping up
VPG_HYS
PGOOD Hysteresis
—
5
—
%
—
Note 1:
Specifications are for packaged product only.
2017 Microchip Technology Inc.
DS20005919A-page 5
MIC23156
TEMPERATURE SPECIFICATIONS (Note 1)
Parameters
Symbol
Min.
Typ.
Max.
Units
TS
–65
—
+150
°C
Conditions
Temperature Ranges
Storage Temperature
—
Lead Temperature
—
—
—
+260
°C
Soldering, 10 sec.
Junction Temperature Range
TJ
–40
—
+125
°C
—
Thermal Resistance WLCSP 16-Ball
JA
—
150
—
°C/W
—
Thermal Resistance QFN-17
JA
—
89
—
°C/W
—
Package Thermal Resistances
Note 1:
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.
DS20005919A-page 6
2017 Microchip Technology Inc.
MIC23156
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
100
10000000
90
1000000
RISE TIME (µs)
EFFICIENCY (%)
80
VIN = 3.6V
70
VIN = 5V
60
VIN = 4.2V
50
40
30
100000
10000
1000
20
100
COUT = 2.2 µF
L = 1 µH
10
VOUT = 1.0V
COUT = 2.2 µF
10
0
10
100
1000
100
10000
1000
FIGURE 2-1:
Output Current.
Efficiency (VOUT = 2.4V) vs.
FIGURE 2-4:
100
1000000
VOUT Rise Time vs. CSS.
VIN = 5V
70
VIN = 4.2V
VIN = 3.6V
60
VIN = 2.7V
50
40
30
20
CURRENT LIMIT (A)
3.1
80
EFFICIENCY (%)
100000
3.2
90
0
10
100
1000
3.0
2.9
2.8
2.7
2.6
COUT = 2.2 µF
L = 1 µH
10
TA = 25\ C
VOUT = 1.0V
2.5
10000
2.5
3
3.5
OUTPUT CURRENT (mA)
4
4.5
5
5.5
INPUT VOLTAGE (V)
Efficiency (VOUT = 1.8V) vs.
FIGURE 2-2:
Output Current.
FIGURE 2-5:
Voltage.
Current Limit vs. Input
3.2
100
90
3.1
CURRENT LIMIT (A)
80
EFFICIENCY (%)
10000
CSS (pF)
OUTPUT CURRENT (mA)
70
60
VIN = 5V
50
VIN = 3.6V
VIN = 2.7V
40
30
20
COUT = 2.2 µF
L = 1 µH
10
0
10
100
1000
10000
3.0
2.9
2.8
2.7
2.6
VIN = 3.6V
VOUT = 1.0V
2.5
-40
Efficiency (VOUT = 1.0V) vs.
2017 Microchip Technology Inc.
0
20
40
60
80
100
120
TEMPERATURE (°C)
OUTPUT CURRENT (mA)
FIGURE 2-3:
Output Current.
-20
FIGURE 2-6:
Temperature.
Current Limit vs.
DS20005919A-page 7
MIC23156
1.9
40
1.875
125°C
125\
C
OUTPUT VOLTAGE (V)
QUIESCENT CURRENT (µA)
45
25\ C
25°C
35
30
25
-40\
C
-40°C
20
NO SWITCHING
VOUT > VOUTNOM * 1.2
COUT = 2.2 µF
15
3.0
3.5
4.0
4.5
5.0
IOUT = 20 mA
1.825
1.8
1.775
IOUT = 120 mA
1.75
VOUTNOM = 1.8V
COUT = 2.2 µF
1.725
10
2.5
IOUT = 1 mA
1.85
1.7
5.5
2.5
3
3.5
INPUT VOLTAGE (V)
FIGURE 2-7:
Voltage.
Quiescent Current vs. Input
FIGURE 2-10:
5
5.5
Line Regulation (HLL).
1.875
25
OUTPUT VOLTAGE (V)
SHUTDOWN CURRENT (nA)
4.5
1.9
30
20
15
10
5
2.5
3
3.5
4
4.5
5
1.85
1.825
1.8
1.775
1.75
VIN = 3.6V
VOUTNOM = 1.8V
COUT = 2.2 µF
1.725
VOUT = 0V
COUT = 2.2 µF
1.7
0
0
5.5
250
FIGURE 2-8:
Voltage.
Shutdown Current vs. Input
FIGURE 2-11:
1.020
1.875
1.015
OUTPUT VOLTAGE (V)
1.9
1.85
IOUT = 1.5A
1.825
IOUT = 1A
1.8
1.775
IOUT = 300 mA
1.75
VOUTNOM = 1.8V
COUT = 2.2 µF
1.725
500
750
1000
1250
1500
OUTPUT CURRENT (mA)
INPUT VOLTAGE (V)
OUTPUT VOLTAGE (V)
4
INPUT VOLTAGE (V)
Load Regulation.
1.010
1.005
1.000
0.995
0.990
VIN = 3.6V
VOUT = 1.0V
IOUT = 10 mA
0.985
0.980
1.7
2.5
3
3.5
4
4.5
5
5.5
-40
FIGURE 2-9:
DS20005919A-page 8
Line Regulation (CCM).
-20
0
20
40
60
80
100
120
TEMPERATURE (°C)
INPUT VOLTAGE (V)
FIGURE 2-12:
Temperature.
Output Voltage vs.
2017 Microchip Technology Inc.
MIC23156
11
1.1
OUTPUT VOLTAGE (mV)
ENABLE THRESHOLD (V)
1.2
ENABLE RISING
1
0.9
ENABLE FALLING
0.8
0.7
0.6
10.5
10
9.5
IOUT = 250 mA
COUT = 2.2 µF
0.5
2.5
3
3.5
4
4.5
5
9
5.5
0
25
50
INPUT VOLTAGE (V)
FIGURE 2-13:
Voltage.
Enable Threshold vs. Input
125
150
175
5
SWITCHING FREQUENCY (MHz)
PGOOD THRESHOLD (%)
100
Output Voltage vs. DAC
FIGURE 2-16:
DNL.
100%
95%
PGOOD RISING
90%
85%
PGOOD FALLING
80%
75%
70%
2.5
3
3.5
4
4.5
5
4
3
2
VIN = 3.6V
VOUTNOM = 1.0V
COUT = 2.2 µF
1
0
5.5
-40
-20
INPUT VOLTAGE (V)
FIGURE 2-14:
Voltage.
0
20
40
60
80
100
120
TEMPERATURE (°C)
PGOOD Threshold vs. Input
FIGURE 2-17:
Temperature.
Switching Frequency vs.
4.0
2.2
1.8
1.4
1
IOUT = 250 mA
COUT = 2.2 µF
SWITCHING FREQUENCY (MHz)
2.6
OUTPUT VOLTAGE (V)
75
DAC VOLTAGE CODE
3.5
3.0
2.5
1.0 µH
2.0
2.2 µH
1.5
1.0
VOUT = 1.8V
COUT = 2.2 µF
0.5
0.0
0.6
0
25
50
75
100
125
150
175
10
DAC VOLTAGE CODE
FIGURE 2-15:
Linearity.
Output Voltage vs. DAC
2017 Microchip Technology Inc.
100
1000
10000
OUTPUT CURRENT (mA)
FIGURE 2-18:
Output Current.
Switching Frequency vs.
DS20005919A-page 9
MIC23156
VOUT
(AC-COUPLED)
(50 mV/div)
VIN = 3.6V, VOUT = 1.8V
COUT = 2.2 μF, L = 1 μH
VOUT
(AC-COUPLED)
(10 mV/div)
SW
(2V/div)
SW
(2V/div)
IL
(500 mA/div)
IL
(1A/div)
Time (100 ns/div)
Time (40 μs/div)
FIGURE 2-19:
Switching Waveform
Discontinuous Mode (1 mA).
VOUT
(AC-COUPLED)
(50 mV/div)
VIN = 3.6V, VOUT = 1.8V
COUT = 2.2 μF, L = 1 μH
FIGURE 2-22:
Switching Waveform
Continuous Mode (1.5A).
VOUT
(AC-COUPLED)
(50 mV/div)
SW
(2V/div)
IL
(500 mA/div)
IOUT
(200 mA/div)
Time (1 μs/div)
FIGURE 2-20:
Switching Waveform
Discontinuous Mode (50 mA).
FIGURE 2-23:
to 750 mA).
SW
(2V/div)
IL
(500 mA/div)
VIN = 3.6V, VOUT = 1.8V
COUT = 2.2 μF, L = 1 μH
DS20005919A-page 10
Load Transient (50 mA
VIN = 3.6V
VOUT = 1.8V
COUT = 2.2 μF
L = 1 μH
IOUT
(500 mA/div)
Time (40 μs/div)
Time (100 ns/div)
FIGURE 2-21:
Switching Waveform
Continuous Mode (500 mA).
VIN = 3.6V
VOUT = 1.8V
COUT = 2.2 μF
L = 1 μH
Time (40 μs/div)
VOUT
(AC-COUPLED)
(50 mV/div)
VOUT
(AC-COUPLED)
(10 mV/div)
VIN = 3.6V, VOUT = 1.8V
COUT = 2.2 μF, L = 1 μH
FIGURE 2-24:
Load Transient (50 mA to 1A).
2017 Microchip Technology Inc.
MIC23156
VOUT
(AC-COUPLED)
(50 mV/div)
VIN = 3.6V
VOUT = 1.8V
COUT = 2.2 μF
L = 1 μH
IOUT
(200 mA/div)
VIN
(2V/div)
VOUT
(AC-COUPLED)
(50 mV/div)
Time (40 μs/div)
FIGURE 2-25:
to 600 mA).
Load Transient (200 mA
Time (100 μs/div)
FIGURE 2-28:
5.5V @ 1.5A).
VIN = 3.6V
VOUT = 1.8V
COUT = 2.2 μF
L = 1 μH
IOUT
(500 mA/div)
PGOOD
(500 mV/div)
IOUT
(500 mA/div)
Time (40 μs/div)
Load Transient (200 mA
VIN = 3.6V
VOUT = 1.8V
COUT = 2.2 μF
L = 1 μH
IOUT
(500 mA/div)
Time (40 μs/div)
Load Transient (200 mA
2017 Microchip Technology Inc.
VIN = 3.6V
VOUT = 1.8V
COUT = 2.2 μF
L = 1 μH
Time (100 μs/div)
FIGURE 2-29:
Power Good During Load
Transient (200 mA to 1.5A).
VOUT
(AC-COUPLED)
(50 mV/div)
FIGURE 2-27:
to 1.5A).
Line Transient (3.6V to
VOUT
(AC-COUPLED)
(100 mV/div)
VOUT
(AC-COUPLED)
(50 mV/div)
FIGURE 2-26:
to 1.5A).
VIN = 3.6V TO 5.5V
VOUT = 1.8V
COUT = 2.2 μF
L = 1 μH
VIN
(2V/div)
VOUT
(AC-COUPLED)
(50 mV/div)
VIN = 3.6V TO 5.5V
VOUT = 1.8V
COUT = 2.2 μF
L = 1 μH
PGOOD
(2V/div)
Time (100 μs/div)
FIGURE 2-30:
Power Good During Line
Transient (3.6V to 5.5V @ 1.5A).
DS20005919A-page 11
MIC23156
VSEL
(5V/div)
VEN
(2V/div)
VOUT
(500 mV/div)
PGOOD
(500 mV/div)
VIN = 3.6V , VOUT = 1.0V
COUT = 2.2 μF, IOUT = 20 mA
CSS = 120 pF
VOUT
(400 mV/div)
PGOOD
(400 mV/div)
IIN
(50 mA/div)
Time (200 μs/div)
FIGURE 2-31:
Power Good During Start-up.
VIN = VI2C = 3.6V
COUT = 2.2 μF, IOUT = 250 mA
CSS = 120 pF
Time (1 ms/div)
FIGURE 2-33:
VOUT During VSEL Transition.
VIN = 3.6V , VOUT = 1.0V
COUT = 2.2 μF, IOUT = 20 mA
CSS = 120 pF
VEN
(2V/div)
VOUT
(500 mV/div)
PGOOD
(500 mV/div)
Time (20 μs/div)
FIGURE 2-32:
Shutdown.
DS20005919A-page 12
Power Good During
2017 Microchip Technology Inc.
MIC23156
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
Ball
Number
Pin
Number
WLCSP
QFN
A1
2
SCL
Fast Mode Plus 1 MHz I2C Clock Input Pin.
A2
3
SDA
Fast Mode Plus 1 MHz I2C Data Input/Output Pin.
A3
4
SNS
Sense: Connect to VOUT, close to output capacitor to sense VOUT.
A4
5
SS
Programmable Soft Start: Connect capacitor to AGND.
B1
1
VI2C
Power Connection for I2C Bus Voltage: Connect this pin to the voltage domain of
the I2C bus supply. Do not leave floating.
B2
11
VSEL
Pin Selectable: Output voltage of either of two I2C Voltage registers. Do not leave
floating.
B3
7
Pin
Name
Pin Function
PGOOD Power Good Indicator: Use an external pull-up resistor to supply.
B4
8
AVIN
Input Voltage to Power Analog Functions: Connect decoupling capacitor to ground.
C1, C2
16, 17
SW
Switch Connection: Internal power MOSFET output switches.
C3, D3
12, 13
PVIN
Input Voltage to Power Switches: Connect decoupling capacitor to ground.
C4
9
AGND
Analog Ground: Connect to central ground point where all high-current paths meet
(CIN, COUT, and PGND) for best operation.
D1, D2
14, 15
PGND
Power Ground Connection.
D4
10
EN
Enable: Logic high enables operation of voltage regulator. Logic low shuts down
the device. Do not leave floating.
—
6
NC
No Connect.
2017 Microchip Technology Inc.
DS20005919A-page 13
MIC23156
4.0
FUNCTIONAL DESCRIPTION
PVIN
SW
SNS
PGND
DRIVER/
CURRENT LIMIT
ERROR
AMPLIFIER
tON/tOFF
TIMER
EN
AVIN
VREF
VI2C
SDA
SCL
CONTROL LOGIC:
I2C AND DAC
VSEL
SS
PGOOD
AGND
FIGURE 4-1:
4.1
Functional Block Diagram.
PVIN
The Power Input Supply (PVIN) pin provides power to
the internal MOSFETs for the Switch mode regulator
section. The PVIN operating range is 2.7V to 5.5V, so an
input capacitor with a minimum voltage rating of 6.3V is
recommended. Due to the high switching speed, a minimum 2.2 µF bypass capacitor, placed close to PVIN and
the Power Ground (PGND) pin, is required.
4.4
The Switch (SW) pin connects directly to one end of the
inductor and provides the current path during switching
cycles. The other end of the inductor is connected to the
SNS pin, output capacitor and the load. Due to the
high-speed switching on this pin, the Switch node should
be routed away from sensitive nodes whenever possible.
4.5
4.2
AVIN
Analog VIN (AVIN) pin provides power to the internal
control and analog supply circuitry. AVIN must be tied to
PVIN through a 10 RC filter. Careful layout should be
considered to ensure that any high-frequency switching noise caused by PVIN is reduced before reaching
AVIN. A 2.2 µF capacitor, as close to AVIN as possible,
is recommended.
4.3
EN
A logic high signal on the Enable pin activates the output voltage of the device. A logic low signal on the
Enable pin deactivates the output and reduces supply
current to 0.1 µA. Do not leave the EN pin floating.
MIC23156 features external soft start circuitry via the
Soft Start (SS) pin that reduces inrush current and
prevents the output voltage from overshooting when
EN is driven logic high. Do not leave the EN pin floating.
DS20005919A-page 14
SW
SNS
The Sense (SNS) pin is connected to the output of the
device to provide feedback to the control circuitry. The
SNS connection should be placed close to the output
capacitor.
4.6
AGND
The Analog Ground (AGND) pin is the ground path for
the biasing and control circuitry. The current loop for
the signal ground should be separate from the Power
Ground (PGND) loop.
4.7
PGND
The Power Ground (PGND) pin is the ground path for
the high current in PWM mode. The current loop for
the power ground should be as small as possible and
separate from the Analog Ground (AGND) loop, as
applicable.
2017 Microchip Technology Inc.
MIC23156
4.8
PGOOD
4.11
VSEL
The Power Good (PGOOD) pin is an open-drain output, which indicates logic high when the output voltage
is typically above 90% of its steady state voltage. A
pull-up resistor of more than 5 k should be connected
from PGOOD to VOUT.
Selectable Output Voltage pin of either of two I2C
Voltage registers. A logic low selects Buck Register 1
and logic high selects Buck Register 2. If no I2C programming is used, the output voltages will be as per the
default Voltage register values. Do not leave floating.
4.9
4.12
SS
The Soft Start (SS) pin is used to control the output
voltage ramp-up time. The approximate equation for
the ramp time in seconds is: 820 x 103 x ln(10) x CSS.
For example, for CSS = 120 pF, tRISE 230 µs. Refer to
the Figure 2-4 graph in Section 2.0 “Typical Performance Curves”. The minimum recommended value
for CSS is 120 pF.
4.10
VI2C
Power Connection pin for the I2C bus voltage. Connect
this pin to the voltage domain of the I2C bus supply.
2017 Microchip Technology Inc.
SCL
2
The I C Clock Input pin provides a reference clock for
clocking in the data signal. This is a Fast mode plus
1 MHz input pin and requires a 4.7 kΩ pull-up resistor.
4.13
SDA
2
The I C Data Input/Output pin allows for data to be
written to and read from the MIC23156. This is a Fast
mode plus 1 MHz I2C pin and requires a 4.7 kΩ pull-up
resistor.
DS20005919A-page 15
MIC23156
5.0
APPLICATION INFORMATION
The MIC23156 is a high-performance, DC-to-DC
step-down regulator offering a small solution size and
supporting up to 1.5A. The device is available in a
2.8 mm x 2.5 mm QFN and a 1.81 mm x 1.71 mm
WLCSP package. Using the HyperLight Load® switching scheme, the MIC23156 is able to maintain high
efficiency and exceptional voltage accuracy throughout
the entire load range, while providing ultra-fast load transient response. Another beneficial feature is the ability to
dynamically change the output voltage in steps of
10 mV. The following subsections provide additional
device application information.
5.1
Input Capacitor
A 2.2 µF (or larger) ceramic capacitor should be placed
as close as possible to the PVIN and AVIN pins with a
short trace for good noise performance. X5R or X7R
type ceramic capacitors are recommended for better
tolerance over temperature. The Y5V and Z5U type
temperature rating ceramic capacitors are not recommended due to their large reduction in capacitance
over temperature, and increased resistance at high
frequencies. These issues reduce their ability to filter
out high-frequency noise. The rated voltage of the input
capacitor should be at least 20% higher than the
maximum operating input voltage over the operating
temperature range.
5.2
Output Capacitor
Output capacitor selection is also a trade-off between
performance, size and cost. Increasing the output
capacitor will lead to an improved transient response,
however, the size and cost also increase. The
MIC23156 is designed for use with a 2.2 µF or greater
ceramic output capacitor. A low-Equivalent Series
Resistance (low-ESR) ceramic output capacitor is
recommended, based upon performance, size and
cost. Both the X7R and X5R temperature rating capacitors are recommended. Refer to Table 5-1 for
additional information.
5.3
Inductor Selection
Inductor selection is a balance between efficiency,
stability, cost, size and rated current. Since the
MIC23156 is compensated internally, the recommended
inductance of L is limited from 0.47 µH to 2.2 µH to
ensure system stability.
For faster transient response, a 0.47 µH inductor will
yield the best result. For lower output ripple, a 2.2 µH
inductor is recommended.
Ensure the inductor selected can handle the maximum
operating current. When saturation current is specified,
make sure that there is enough margin so that the peak
current does not cause the inductor to saturate. Peak
current can be calculated as noted in Equation 5-1:
EQUATION 5-1:
CALCULATING PEAK
CURRENT
1 – VOUT/VIN
IPEAK = IOUT + VOUT
2fL
[
]
As shown by Equation 5-1, the peak inductor current is
inversely proportional to the switching frequency and
the inductance. The lower the switching frequency or
the inductance, the higher the peak current. As input
voltage increases, the peak current also increases.
The size of the inductor depends upon the requirements
of the application. Refer to the “Typical Application
Schematic” section for details.
DC Resistance (DCR) is also important. While DCR is
inversely proportional to size, it can represent a significant efficiency loss. Refer to Section 5.6 “Efficiency
Considerations”.
The transition between Continuous Conduction Mode
(CCM) to HyperLight Load mode is determined by the
inductor ripple current and the load current.
Figure 5-1 shows the signals for the High-Side Drive
(HSD) switch for tON control, the inductor current and
the Low-Side Drive (LSD) switch for tOFF control.
HSD
IN HLL MODE
TON FIXED,
TOFF VARIABLE
IOUT
IINDUCTOR
-50 mA
LSD
LOAD
INCREASING
TDL
IN CCM MODE
TON VARIABLE,
TOFF FIXED
HSD
IINDUCTOR
IOUT
LSD
FIGURE 5-1:
HSD Signals for tON Control,
Inductor Current and LSD for tOFF Control.
Maximum current ratings of the inductor are generally
given in two methods; permissible DC current and saturation current. Permissible DC current can be rated
either for a +40°C temperature rise or a 10% to 30%
loss in inductance.
DS20005919A-page 16
2017 Microchip Technology Inc.
MIC23156
Table 5-1 optimizes the inductor to output capacitor
combination for maintaining a minimum phase margin
of 45°.
Efficiency (VOUT = 1.8V) vs.
Output Current
100
90
80
EFFICIENCY (%)
In HLL mode, the inductor is charged with a fixed tON
pulse on the High-Side Drive (HSD) switch. After this,
the LSD is switched on and current falls at a rate of
VOUT/L. The controller remains in HLL mode while the
inductor falling current is detected to cross at approximately 200 mA. When the LSD (or tOFF) time reaches
its minimum, and the inductor falling current is no
longer able to reach this 200 mA threshold, the part is
in CCM mode and switching at a virtually constant
frequency.
VIN = 5V
70
VIN = 4.2V
MAXIMUM COUT vs. INDUCTOR
Minimum Recommended
Inductor
COUT
COUT
40
30
20
COUT = 2.2 µF
L = 1 µH
10000
15 µF
6.8 µF
Figure 5-2 shows an efficiency curve. From a 10 mA
load to 1.5A, efficiency losses are dominated by quiescent current losses, gate drive and transition losses. By
using the HyperLight Load mode, the MIC23156 is able
to maintain high efficiency at low-output currents.
2.2 µF
2.2 µH
2.2 µF
Duty Cycle
The typical maximum duty cycle of the MIC23156 is
80%.
Thermal Shutdown
When the internal die temperature of MIC23156
reaches 160°C, the internal driver is disabled until the
die temperature falls below 140°C.
Efficiency Considerations
Efficiency is defined as the amount of useful output
power, divided by the amount of power supplied, as
shown in Equation 5-2:
EFFICIENCY
CALCULATION
Efficiency % =
1000
2.2 µF
1.0 µH
EQUATION 5-2:
100
OUTPUT CURRENT (mA)
2.2 µF
4.7 µF
5.6
10
FIGURE 5-2:
2.2 µF
5.5
0
25 µF
0.47 µH
5.4
Maximum
COUT
VIN = 2.7V
50
10
TABLE 5-1:
VIN = 3.6V
60
VOUT IOUT 100
VIN IIN
There are two types of losses in switching converters:
DC losses and switching losses. DC losses are simply
the power dissipation of I2R. Power is dissipated in the
high-side switch during the on cycle. Power loss is equal
to the high-side MOSFET RDSON, multiplied by the
switch current squared. During the off cycle, the low-side
N-channel MOSFET conducts, also dissipating power.
Device operating current also reduces efficiency. The
product of the quiescent (operating) current and the
supply voltage represents another DC loss. The current
required in driving the gates on and off at a constant
3 MHz frequency, and the switching transitions, make up
the switching losses.
2017 Microchip Technology Inc.
Efficiency Under Load.
Over 200 mA efficiency loss is dominated by MOSFET
RDSON and inductor losses. Higher input supply
voltages will increase the gate-to-source threshold on
the internal MOSFETs, thereby reducing the internal
RDSON. This improves efficiency by reducing DC
losses in the device. All but the inductor losses are
inherent to the device. In which case, inductor selection
becomes increasingly critical in efficiency calculations.
As the inductors are reduced in size, the DC Resistance (DCR) can become quite significant. The DCR
losses can be calculated as shown in Equation 5-3:
EQUATION 5-3:
CALCULATING DCR
LOSSES
PDCR = IOUT2 DCR
From that, the loss in efficiency due to inductor
resistance can be calculated as in Equation 5-4:
EQUATION 5-4:
LOSS IN EFFICIENCY DUE
TO INDUCTOR
RESISTANCE
[
Efficiency Loss = 1 –
VOUT IOUT 100
VOUT IOUT PDCR
]
Efficiency loss due to DCR is minimal at light loads and
gains significance as the load is increased. Inductor
selection becomes a trade-off between efficiency and
size in this case.
DS20005919A-page 17
MIC23156
HyperLight Load Mode
The MIC23156 uses a minimum on and off-time proprietary control loop. When the output voltage falls below
the regulation threshold, the error comparator begins a
switching cycle that turns the PMOS on and keeps it on
for the duration of the minimum on-time; this increases
the output voltage. If the output voltage is over the
regulation threshold, then the error comparator turns
the PMOS off for a minimum off-time until the output
drops below the threshold. The NMOS acts as an ideal
rectifier that conducts when the PMOS is off. Using a
NMOS switch instead of a diode allows for a lower
voltage drop across the switching device when it is on.
The synchronous switching combination between the
PMOS and the NMOS allows the control loop to work
in Discontinuous mode for light load operations. In Discontinuous mode, the MIC23156 works in HyperLight
Load to regulate the output. As the output current
increases, the off-time decreases, thus providing more
energy to the output. This switching scheme improves
the efficiency of MIC23156 during light load currents by
only switching when it is needed. As the load current
increases, the MIC23156 goes into Continuous
Conduction Mode (CCM) and switches at a frequency
centered at 3 MHz. The equation to calculate the load
when the MIC23156 goes into Continuous Conduction
Mode may be approximated by Equation 5-5:
EQUATION 5-5:
ILOAD >
CALCULATING LOAD
WHEN IN CONTINUOUS
CONDUCTION MODE
(VIN – VOUT) D
2L f
As shown in Equation 5-5, the load at which the
MIC23156 transitions from HyperLight Load mode to
PWM mode is a function of the Input Voltage (VIN), Output Voltage (VOUT), Duty Cycle (D), Inductance (L) and
frequency (f). As shown in Figure 5-3, as the output
current increases, the switching frequency also
increases until the MIC23156 goes from HyperLight
Load mode to PWM mode, at approximately 200 mA.
The MIC23156 will switch at a relatively constant
frequency, around 3 MHz, once the output current is
over 200 mA.
DS20005919A-page 18
Switching Frequency vs.
Output Current
4.0
SWITCHING FREQUENCY (MHz)
5.7
3.5
3.0
2.5
1.0 µH
2.0
2.2 µH
1.5
1.0
VOUT = 1.8V
COUT = 2.2 µF
0.5
0.0
10
100
1000
10000
OUTPUT CURRENT (mA)
FIGURE 5-3:
Current.
5.8
SW Frequency vs. Output
Output Voltage Setting
The MIC23156 features dynamic voltage scaling and
setting hardware that allow the output voltage of the
buck regulator to be changed on-the-fly, in increments
of 10 mV. The output voltage is set according to one of
two registers that behave identically: BUCK_OUT1
when VSEL = 0 and BUCK_OUT2 when VSEL = 1. If the
BUCK_OUT value is changed while the VSEL is selected
and the regulator is enabled, then the output voltage will
immediately change to the new value using Dynamic
Voltage Scaling (DVS). Equation 5-6 describes the
relationship between the register value and the output
voltage:
EQUATION 5-6:
REGISTER VALUE AND
OUTPUT VOLTAGE
RELATIONSHIP
VOUT = 0.7 + (0.01 REGBUCK_OUT)
Note that the maximum output voltage is 2.4V, corresponding to a register setting of 170 (0b10101010,
0xAA). An example of this calculation is demonstrated
in Section 5.13 “Calculating DAC Voltage Code”.
2017 Microchip Technology Inc.
MIC23156
5.9
I2C Interface
5.10
Figure 5-4 shows the communications required for
write and read operations via the I2C interface. The
black lines show master communications and the red
lines show the slave communications. During a write
operation, the master must drive SDA and SCL for all
stages, except the Acknowledgment (A) stage shown
in red, which are provided by the slave (MIC23156).
The read operation begins first with a dataless write to
select the register address from which to read. A restart
sequence is issued, followed by a read command and
a data read.
I2C Register Summary
There are three I2C Read/Write registers that are 8 bits
in length. All registers are reset to a zero state whenever EN 0.5V and set (reset) to their default values on
the transition of EN 1.5V. All registers are accessible
by I2C.
TABLE 5-2:
REGISTER BIT FIELD MAP
Reg.
D7
D6
D5
D4
1
—
TSD
UVLO
PGOOD
2
BUCK_OUT1
3
BUCK_OUT2
The MIC23156 responds to a slave address of Hex 0xB6
and 0xB7 for write and read operations, respectively,
or binary 1011011x (where ‘x’ is the read/write bit,
0 = write, 1 = read).
Reg.
D3
D2
D1
D0
1
—
—
SSL
BUCK_EN
The register address is eight bits wide and carries the
address of the MIC23156 register to be operated upon.
Only the lower three bits are used.
2
BUCK_OUT1
3
BUCK_OUT2
5.11
WRITE PROTOCOL
SLAVE
ADDRESS
REGISTER
ADDRESS
The Enable/Status register is written to enable the output regulator (BUCK_EN) and Soft Start Extension
mode (SSL). It is read to interrogate the status of Thermal Shutdown (TSD), Undervoltage Lockout (UVLO)
and Power Good (PGOOD) status of the regulator. See
Register 5-1 for additional information.
DATA
SDA
1011011 0 0
0
0
WA
A
A
SCL
S
P
5.12
READ PROTOCOL
SLAVE
ADDRESS
SLAVE
ADDRESS
REGISTER
ADDRESS
DATA
SDA
1011011 0 0
0
WA
A
1011011 1 0
0
R A
A
SCL
S
Sr
P
S = START
Sr = RESTART
R = READ
W = WRITE
A = ACKNOWLEDGE P = STOP
FIGURE 5-4:
Required Communications
for Read/Write Operations via I2C Interface.
2017 Microchip Technology Inc.
Enable/Status Register (001b/01h)
Buck Register 1 (010b/02h) and
Buck Register 2 (011b/03h)
These registers are written to set the output voltage to
any one of 170 levels in 10 mV steps. Values above
decimal 170 are equivalent to setting the register
to 170. The two registers correspond to one of two
states, which is selectable by the VSEL input pin. This
allows the regulator to be quickly switched between
two voltage levels (e.g., enabled and standby). When
VSEL = 0, the output voltage is controlled by BUCK_OUT1
(REG2). When VSEL = 1, then the output voltage is
controlled by BUCK_OUT2 (REG3). See Register 5-2
and Register 5-3 for additional information.
DS20005919A-page 19
MIC23156
REGISTER 5-1:
REG1: ENABLE AND STATUS REGISTER
r-0
R-0
R-0
R-0
r-0
r-0
R/W-0
R/W-1
—
TSD
UVLO
PGOOD
—
—
SSL
BUCK_EN
bit 7
bit 0
Legend:
r = Reserved bit
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 7
Reserved: Not used
bit 6
TSD: Thermal Shutdown Status bit
This register bit will be set by internal hardware if a thermal shutdown event is triggered by the die
temperature which exceeds the shutdown temperature.
bit 5
UVLO: Undervoltage Lockout Status bit
This register bit will be set by internal hardware when the undervoltage lockout circuit is active and
cleared when VIN exceeds the UVLO threshold.
bit 4
PGOOD: Power Good Status bit
This register bit will be set when the buck regulator output voltage is > nominally 10% of the output
voltage set points, as specified by VSEL, BUCK_OUT1 and BUCK_OUT2. This regulator has the same
function as the PGOOD output pin.
bit 3-2
Reserved: Not used
bit 1
SSL: Long Soft Start Enable bit
If this bit is set, then the internal soft start resistor is increased and the soft start time will be extended.
bit 0
BUCK_EN: Buck Regulator Enable bit
Setting this bit will enable and turn on the buck regulator output. Clearing this bit will disable the buck
regulator output.
DS20005919A-page 20
2017 Microchip Technology Inc.
MIC23156
REGISTER 5-2:
R/W-0x1E
REG2: BUCK_OUT1 REGISTER
R/W-0x1E
R/W-0x1E
R/W-0x1E
R/W-0x1E
R/W-0x1E
R/W-0x1E
R/W-0x1E
BUCK_OUT1
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-0
x = Bit is unknown
BUCK_OUT1: Buck Output Voltage 1 bits (setting for VSEL = 0)
Setting this register value will change the output regulation point for the buck regulator when VSEL = 0.
If the buck is enabled and VSEL = 0, changing the value will immediately cause the output voltage to
transition to the new set point.
REGISTER 5-3:
R/W-0x0A
REG3: BUCK_OUT2 REGISTER
R/W-0x0A
R/W-0x0A
R/W-0x0A
R/W-0x0A
R/W-0x0A
R/W-0x0A
R/W-0x0A
BUCK_OUT2
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-0
x = Bit is unknown
BUCK_OUT2: Buck Output Voltage 2 bits (setting for VSEL = 1)
Setting this register value will change the output regulation point for the buck regulator when VSEL = 1.
If the buck is enabled and VSEL = 1, changing the value will immediately cause the output voltage to
transition to the new set point.
2017 Microchip Technology Inc.
DS20005919A-page 21
MIC23156
5.13
Calculating DAC Voltage Code
If the desired output voltage is 1.8V, then using Equation 5-7:
EQUATION 5-7:
CALCULATING DAC VOLTAGE
VOUT = 0.7 + (0.01 REGBUCK_OUT) REGBUCK_OUT =
(1.8 – 0.7)
0.01
Note: REGBUCK_OUT = 110 in decimal, 6E in Hex or ‘0110 1110’ in binary.
DS20005919A-page 22
2017 Microchip Technology Inc.
MIC23156
6.0
PACKAGING INFORMATION
6.1
Package Marking Information
17-Lead QFN*
XXX
NNN
16-Ball WLCSP*
XX
YYWW
NNN
Legend: XX...X
Y
YY
WW
NNN
e3
*
Example
JQA
371
Example
J5
1722
943
Product code or customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle
mark).
Note:
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information. Package may or may not include
the corporate logo.
Underbar (_) and/or Overbar (⎯) symbol may not be to scale.
2017 Microchip Technology Inc.
DS20005919A-page 23
MIC23156
6.2
Package Details
The following sections give the technical details of the packages.
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
DS20005919A-page 24
2017 Microchip Technology Inc.
MIC23156
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
2017 Microchip Technology Inc.
DS20005919A-page 25
MIC23156
NOTES:
DS20005919A-page 26
2017 Microchip Technology Inc.
MIC23156
APPENDIX A:
REVISION HISTORY
Revision A (December 2017)
• Converted Micrel document MIC23156 to
Microchip data sheet DS20005919A.
• Minor text changes throughout document.
2017 Microchip Technology Inc.
DS20005919A-page 27
MIC23156
NOTES:
DS20005919A-page 28
2017 Microchip Technology Inc.
MIC23156
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
–
PART NO.
Device
X
X
XX
–
Default
Junction Temp. Package
Output Voltage
Range
MIC23156:
XX
a) MIC23156-0YCS-TR: MIC23156, 1.0V/0.8V Default
Output Voltage, –40°C to +125°C
Junction Temp. Range,
Media
Type
1.5A, 3 MHz Synchronous Buck Regulator
with HyperLight Load® and I2C Control for
Dynamic Voltage Scaling
Device:
Examples:
16-Ball WLCSP, 3,000/Reel
b) MIC23156-0YML-TR: MIC23156, 1.0V/0.8V Default
Output Voltage, –40°C to +125°C
Junction Temp. Range,
17-Lead CQFN, 5,000/Reel
Output Voltage:
Junction
Temperature
Range:
0
=
1.0V (VSEL = Low), 0.8V (VSEL = High)
c) MIC23156-0YML-T5: MIC23156, 1.0V/0.8V Default
Output Voltage, –40°C to +125°C
Junction Temp. Range,
Y
=
17-Lead CQFN, 500/Reel
–40°C to +125°C
Note 1:
Package:
CS
ML
=
=
16-Ball 1.81 mm x 1.71 mm WLCSP
17-Lead 2.5 mm x 2.8 mm CQFN
Media Type:
T5
TR
TR
=
=
=
500/Reel (ML Package only)
5,000/Reel (ML Package only)
3,000/Reel (CS Package only)
2017 Microchip Technology Inc.
Tape and Reel identifier only appears in the
catalog part number description. This identifier is
used for ordering purposes and is not printed on
the device package. Check with your Microchip
Sales Office for package availability with the
Tape and Reel option.
DS20005919A-page 29
MIC23156
NOTES:
DS20005919A-page 30
2017 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate, AVR,
AVR logo, AVR Freaks, BeaconThings, BitCloud, CryptoMemory,
CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KEELOQ,
KEELOQ logo, Kleer, LANCheck, LINK MD, maXStylus,
maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip
Designer, QTouch, RightTouch, SAM-BA, SpyNIC, SST, SST
Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
and other countries.
ClockWorks, The Embedded Control Solutions Company,
EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS,
mTouch, Precision Edge, and Quiet-Wire are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo,
CodeGuard, CryptoAuthentication, CryptoCompanion,
CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average
Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial
Programming, ICSP, Inter-Chip Connectivity, JitterBlocker,
KleerNet, KleerNet logo, Mindi, MiWi, motorBench, MPASM, MPF,
MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, PureSilicon, QMatrix, RightTouch logo, REAL ICE, Ripple
Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI,
SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC,
USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and
ZENA are trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
Silicon Storage Technology is a registered trademark of Microchip
Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip Technology
Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2017, Microchip Technology Incorporated, All Rights Reserved.
ISBN: 978-1-5224-2478-9
== ISO/TS 16949 ==
2017 Microchip Technology Inc.
DS20005919A-page 31
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DS20005919A-page 32
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2017 Microchip Technology Inc.
10/25/17
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