MIC23158/9
3 MHz PWM Dual 2A Buck Regulator
with HyperLight Load and Power Good
Features
General Description
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The MIC23158/9 is a high efficiency, 3 MHz, dual, 2A
synchronous buck regulator with HyperLight Load®
mode, power good output indicator, and programmable
soft start.
2018 Microchip Technology Inc.
The MIC23158/9 is available in a 20-pin 3 mm x 4 mm
QFN package with an operating junction temperature
range from –40°C to +125°C.
Package Type
EN1
SNS1
MIC23158/9
20-Lead QFN (ML)
(Top View)
20
19
18
17
VIN1
1
16
PGND1
2
15
PG1
SW1
3
14
SS1
SW2
4
13
SS2
PGND2
5
12
PG2
VIN2
6
11
FB2
7
8
9
10
EN2
EP
SNS2
Solid State Drives (SSD)
Smartphones
Tablet PCs
Mobile Handsets
Portable Devices (PMP, PND, UMPC, GPS)
WiFi/WiMax/WiBro Applications
AGND1
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The MIC23158/9 has a very low quiescent current of
45 µA and achieves a peak efficiency of 94% in
continuous conduction mode. In discontinuous
conduction mode, the MIC23158/9 can achieve 83%
efficiency at 1 mA.
AVIN1
Applications
The MIC23158/9 is designed for use with a very small
inductor, down to 0.47 µH, and an output capacitor as
small as 2.2 µF that enables a total solution size, less
than 1 mm in height.
AVIN2
•
The MIC23159 also provides an auto-discharge
feature that switches in a 225Ω pull-down circuit on its
output to discharge the output capacitor when disabled.
HyperLight Load provides very high efficiency at light
loads and ultra-fast transient response which makes
the MIC23158/9 perfectly suited for supplying
processor core voltages. An additional benefit of this
proprietary architecture is very low output ripple voltage
throughout the entire load range with the use of small
output capacitors. The 20-pin 3 mm x 4 mm QFN
package saves precious board space and requires
seven external components for each channel.
AGND2
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2.7V to 5.5V Input Voltage
Adjustable Output Voltage (Down to 1.0V)
Two Independent 2A Outputs
Up to 94% Peak Efficiency
83% Typical Efficiency at 1 mA
Two Independent Power Good Indicators
Independent Programmable Soft-Start
45 µA Typical Quiescent Current
3 MHz PWM Operation in Continuous Conduction
Mode
Ultra-Fast Transient Response
Fully Integrated MOSFET Switches
Output Pre-Bias Safe
0.1 µA Shutdown Current
Thermal-Shutdown and Current-Limit Protection
20-Pin 3 mm x 4 mm QFN Package
Internal 225Ω Pull-Down Circuit on Output
(MIC23159)
–40°C to +125°C Junction Temperature Range
FB1
DS20006020A-page 1
MIC23158/9
Typical Application Circuit
MIC23158/9
VIN
C1
4.7μF/6.3V
L1 1μH
VOUT1
R5
10k
C3
4.7μF/
6.3V
R1
301k
AVIN2
VIN1
VIN2
SW1
SW2
SNS1
SNS2
FB1
R2
158k
EN1
PG1
C5
470pF
DS20006020A-page 2
AVIN1
U1
MIC23158/9
FB2
C2
4.7μF/6.3V
L2 1μH
VOUT2
R3
316k
R4
221k
C4
4.7μF/
6.3V
R6
10k
EN1
EN2
EN2
PG1
PG2
PG2
SS1
SS2
PGND1
AGND1
PGND2
AGND2
C6
470pF
2018 Microchip Technology Inc.
MIC23158/9
Functional Block Diagrams
Simplified MIC23158 Functional Block Diagram - Adjustable Output Voltage
VIN 1
EN 1
GATE
DRIVE
SW 1
CONTROL LOGIC:
TIMER AND
SOFT-START
ZERO X
CURRENT
LIMIT
ISENSE
PGND 1
AVIN 1
AVIN 2
EN 2
CONTROL LOGIC:
TIMER AND
SOFT-START
CURRENT
LIMIT
VIN 2
GATE
DRIVE
SW 2
ZERO X
ISENSE
PGND 2
SNS 1
SNS 2
UNDERVOLTAGE
LOCKOUT
UNDERVOLTAGE
LOCKOUT
REFERENCE
REFERENCE
ERROR
AMPLIFIER
ERROR
AMPLIFIER
SS 1
SS 2
PG 1
PG 2
AGND 1
FB 1
AGND 2
FB 2
Simplified MIC23159 Functional Block Diagram - Adjustable Output Voltage
VIN 1
EN 1
GATE
DRIVE
SW 1
CONTROL LOGIC:
TIMER AND
SOFT-START
ZERO X
ISENSE
PGND 1
AVIN 1
CURRENT
LIMIT
AVIN 2
EN 2
CONTROL LOGIC:
TIMER AND
SOFT-START
CURRENT
LIMIT
VIN 2
GATE
DRIVE
SW 2
ZERO X
ISENSE
PGND 2
SNS 2
SNS 1
UNDERVOLTAGE
LOCKOUT
UNDERVOLTAGE
LOCKOUT
REFERENCE
EN 1
REFERENCE
ERROR
AMPLIFIER
EN 2
ERROR
AMPLIFIER
SS 1
SS 2
PG 1
PG 2
FB 1
2018 Microchip Technology Inc.
AGND 1
AGND 2
FB 2
DS20006020A-page 3
MIC23158/9
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
Supply Voltage (AVIN1, AVIN2, VIN1, VIN2) .................................................................................................... –0.3V to +6V
Switch1 (VSW1), Sense1 (VSNS1) .................................................................................................................–0.3V to VIN1
Enable 1 (VEN1), Power Good (VPG1) ..........................................................................................................–0.3V to VIN1
Feedback1 (VFB1) ........................................................................................................................................–0.3V to VIN1
Switch2 (VSW2), Sense2 (VSNS2) .................................................................................................................–0.3V to VIN2
Enable2 (VEN2), Power Good2 (VPG2) .........................................................................................................–0.3V to VIN2
Feedback2 (VFB2) ........................................................................................................................................–0.3V to VIN2
Power Dissipation (TA = 70°C)...............................................................................................................Internally Limited
ESD Rating (Note 1)................................................................................................................................... ESD Sensitive
Operating Ratings ‡
Supply Voltage (AVIN1, VIN1) ..................................................................................................................... +2.7V to +5.5V
Supply Voltage (AVIN2, VIN2) ..................................................................................................................... +2.7V to +5.5V
Enable Input Voltage (VEN1, VEN2)................................................................................................................. 0V to VIN1,2
Output Voltage Range (VSNS1, VSNS2)...................................................................................................... +1.0V to +3.3V
† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at those or any other conditions above those indicated
in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended
periods may affect device reliability.
‡ Notice: The device is not guaranteed to function outside its operating ratings.
Note 1: Devices are ESD sensitive. Handling precautions are recommended. Human body model, 1.5 kΩ in series
with 100 pF.
TABLE 1-1:
ELECTRICAL CHARACTERISTICS
Electrical Characteristics: TA = +25°C; AVIN1,2 = VIN1,2 = VEN1,2 = 3.6V; L1,2 = 1.0 µH; COUT3,4 = 4.7 µF unless
otherwise specified. Bold values indicate –40°C ≤ TJ ≤ +125°C, unless noted. Note 1
Parameter
Min.
Typ.
Max.
Units
Supply Voltage Range
2.7
—
5.5
V
—
Undervoltage Lockout
Threshold
2.45
2.55
2.65
V
Rising
Undervoltage Lockout
Hysteresis
—
75
—
mV
—
Quiescent Current
—
45
90
µA
IOUT = 0 mA, SNS > 1.2 * VOUTNOM
(both outputs)
Shutdown Current
Feedback Regulation Voltage
Symbol
Conditions
ISHDN
—
0.1
5
µA
VEN = 0V; VIN = 5.5V (per output)
VFB
0.6045
0.62
0.6355
V
IOUT = 20 mA
Feedback Bias Current
IFB
—
0.01
—
µA
Per output
Current Limit
ILIM
2.2
4.3
—
A
SNS = 0.9 * VOUTNOM
—
0.45
—
—
0.45
—
VIN = 4.5V to 5.5V if VOUTNOM ≥
2.5V, IOUT = 20 mA
—
0.55
—
DCM, VIN = 3.6V if VOUTNOM < 2.5V
—
1.0
—
—
0.8
—
—
0.8
—
Output Voltage Line
Regulation
Output Voltage Load
Regulation
DS20006020A-page 4
%/V
%
VIN = 3.6V to 5.5V if VOUTNOM <
2.5V, IOUT = 20 mA
DCM, VIN = 5.0V if VOUTNOM ≥ 2.5V
CCM, VIN = 3.6V if VOUTNOM < 2.5V
CCM, VIN = 5.0V if VOUTNOM ≥ 2.5V
2018 Microchip Technology Inc.
MIC23158/9
TABLE 1-1:
ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Characteristics: TA = +25°C; AVIN1,2 = VIN1,2 = VEN1,2 = 3.6V; L1,2 = 1.0 µH; COUT3,4 = 4.7 µF unless
otherwise specified. Bold values indicate –40°C ≤ TJ ≤ +125°C, unless noted. Note 1
Parameter
Symbol
PWM Switch RDS(ON)
Min.
Typ.
Max.
—
0.20
—
Units
Ω
—
0.19
—
fSW
—
3
—
MHz
Soft-Start Time
tSS
—
300
—
µs
Soft-Start Current
ISS
Switching Frequency
Conditions
ISW1,2 = 100 mA PMOS
ISW1,2 = –100 mA NMOS
IOUT = 180 mA
VOUT = 90%, CSS = 470 pF
—
2.7
—
µA
VSS = 0V
Power Good Threshold
86
92
96
%
Rising
Power Good Threshold
Hysteresis
—
7
—
%
—
Power Good Delay Time
—
68
—
µs
Rising
Power Good Pull-Down
Resistance
—
95
—
Ω
—
—
—
0.4
1.2
—
—
Enable Input Current
—
0.1
2
µA
—
Output Discharge Resistance
—
225
—
Ω
MIC23159 Only; EN = 0V,
IOUT = 250 µA
Overtemperature Shutdown
—
160
—
°C
—
Shutdown Hysteresis
—
20
—
°C
—
Enable Input Voltage
Note 1:
V
Logic low
Logic high
Specification for packaged product only.
2018 Microchip Technology Inc.
DS20006020A-page 5
MIC23158/9
TEMPERATURE SPECIFICATIONS (Note 1)
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Storage Temperature Range
TS
–65
—
+150
°C
—
Operating Junction Temperature Range
TJ
–40
—
+125
°C
—
Lead Temperature
—
—
—
+260
°C
Soldering, 10s
JA
—
53
—
°C/W
Temperature Ranges
Package Thermal Resistances
Thermal Resistance 3 mm x 4 mm QFN-20
Note 1:
—
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.
DS20006020A-page 6
2018 Microchip Technology Inc.
MIC23158/9
2.0
Note:
TYPICAL PERFORMANCE CURVES
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
FIGURE 2-1:
Output Current.
Efficiency (VOUT = 3.3V) vs.
FIGURE 2-4:
Output Current.
Efficiency (VOUT = 1.5V) vs.
FIGURE 2-2:
Output Current.
Efficiency (VOUT = 2.5V) vs.
FIGURE 2-5:
VOUT Rise Time vs. CSS.
FIGURE 2-3:
Output Current.
Efficiency (VOUT = 1.8V) vs.
FIGURE 2-6:
Voltage.
Current-Limit vs. Input
2018 Microchip Technology Inc.
DS20006020A-page 7
MIC23158/9
FIGURE 2-7:
Voltage.
Quiescent Current vs. Input
FIGURE 2-10:
Line Regulation (HLL).
FIGURE 2-8:
Voltage.
Shutdown Current vs. Input
FIGURE 2-11:
Load Regulation (CCM).
FIGURE 2-9:
Line Regulation (CCM).
FIGURE 2-12:
Load Regulation (HLL).
DS20006020A-page 8
2018 Microchip Technology Inc.
MIC23158/9
VOUT
AC-Coupled
(20mV/div)
SWNODE
(2V/div)
IL
(200mA/div)
FIGURE 2-13:
vs. Input Voltage.
Maximum Output Voltage
VIN = 3.6V
VOUT = 1.8V
COUT = 4.7μF
L = 1μH
Time (40μS/div)
FIGURE 2-16:
Switching Waveform
Discontinuous Mode (1 mA).
VOUT
AC-Coupled
(20mV/div)
SWNODE
(2V/div)
IL
(200mA/div)
FIGURE 2-14:
Temperature.
Feedback Voltage vs.
VIN = 3.6V
VOUT = 1.8V
COUT = 4.7μF
L = 1μH
Time (1μS/div)
FIGURE 2-17:
Switching Waveform
Discontinuous Mode (50 mA).
VOUT
AC-Coupled
(10mV/div)
SWNODE
(2V/div)
IL
(500mA/div)
FIGURE 2-15:
Temperature.
Switching Frequency vs.
2018 Microchip Technology Inc.
VIN = 3.6V
VOUT = 1.8V
COUT = 4.7μF
L = 1μH
Time (100nS/div)
FIGURE 2-18:
Switching Waveform
Continuous Mode (500 mA).
DS20006020A-page 9
MIC23158/9
VOUT
AC-Coupled
(20mV/div)
VOUT
AC-Coupled
(50mV/div)
SWNODE
(2V/div)
IL
(1A/div)
VIN = 3.6V
VOUT = 1.8V
COUT = 4.7μF
L = 1μH
VIN = 3.6V
VOUT = 1.8V
COUT = 4.7μF
L = 1μH
IOUT
(200mA/div)
3
Time (40μS/div)
Time (100nS/div)
FIGURE 2-19:
Switching Waveform
Continuous Mode (1.5A).
FIGURE 2-22:
600 mA).
Load Transient (200 mA to
VOUT
AC-Coupled
(50mV/div)
VOUT
AC-Coupled
(50mV/div)
VIN = 3.6V
VOUT = 1.8V
COUT = 4.7μF
L = 1μH
VIN = 3.6V
VOUT = 1.8V
COUT = 4.7μF
L = 1μH
IOUT
(500mA/div)
IOUT
(200mA/div)
Time (40μS/div)
Time (40μS/div)
FIGURE 2-20:
750 mA).
Load Transient (50 mA to
FIGURE 2-23:
1A).
Load Transient (200 mA to
VOUT
AC-Coupled
(100mV/div)
VOUT
AC-Coupled
(100mV/div)
VIN = 3.6V
VOUT = 1.8V
COUT = 4.7μF
L = 1μH
VIN = 3.6V
VOUT = 1.8V
COUT = 4.7μF
L = 1μH
IOUT
(500mA/div)
IOUT
(500mA/div)
Time (40μS/div)
Time (40μS/div)
FIGURE 2-21:
1A).
DS20006020A-page 10
Load Transient (50 mA to
FIGURE 2-24:
1.5A).
Load Transient (200 mA to
2018 Microchip Technology Inc.
MIC23158/9
VIN = 3.6V
VOUT = 1.8V
COUT = 4.7μF
L = 1μH
CSS = 470pF
VEN
(2V/div)
VIN
(2V/div)
VIN = 3.6V to 5.5V
VOUT = 1.8V
COUT = 4.7μF
L = 1μH
VOUT
AC-Coupled
(50mV/div)
VOUT
(1V/div)
PGOOD
(1V/div)
Time (200μS/div)
Time (100μS/div)
FIGURE 2-25:
at 1.5A).
Line Transient (3.6V to 5.5V
VOUT
AC-Coupled
(100mV/div)
Power Good During Startup.
VEN
(2V/div)
VIN = 3.6V
VOUT = 1.8V
COUT = 4.7μF
L = 1μH
PGOOD
(1V/div)
IOUT
(500mA/div)
VIN = 3.6V
VOUT = 1.8V
COUT = 4.7μF
IOUT = 0mA
CSS = 470pF
VOUT
(1V/div)
PGOOD
(1V/div)
Time (1mS/div)
Time (40μS/div)
FIGURE 2-26:
(200 mA to 1.5A).
FIGURE 2-28:
Power Good Load Transient
FIGURE 2-29:
Power Good During
Shutdown (MIC23159).
VIN = 3.6V to 5.5V
VOUT = 1.8V
COUT = 4.7μF
L = 1μH
VIN
(2V/div)
VOUT
AC-Coupled
(50mV/div)
PGOOD
(2V/div)
Time (100μS/div)
FIGURE 2-27:
Power Good During Line
Transient (3.6V to 5.5V at 1.5A).
2018 Microchip Technology Inc.
DS20006020A-page 11
MIC23158/9
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
Pin Number
(Adjustable)
Pin Name
Description
1
VIN1
Power Input Voltage for Regulator 1. Connect a capacitor to ground to decouple noise
and switching transients.
2
PGND1
3
SW1
Switch (Output): Internal power MOSFET output switches for regulator 1.
4
SW2
Switch (Output): Internal power MOSFET output switches for regulator 2.
5
PGND2
6
VIN2
Power Input Voltage for Regulator 2. Connect a capacitor to ground to decouple noise
and switching transients.
7
AVIN2
Analog Input Voltage for Regulator 2. Tie to VIN2 and connect a capacitor to ground
to decouple noise.
8
AGND2
9
EN2
10
SNS2
11
FB2
Feedback Input for Regulator 2. Connect a resistor divider from the output of regulator
2 to ground to set the output voltage.
12
PG2
Power Good Output for Regulator 2. Open drain output for the power good indicator
for output 2. Use a pull-up resistor between this pin and VOUT2 to indicate a power
good condition.
13
SS2
Soft-Start for Regulator 2. Connect a minimum of 200 pF capacitor to ground to set
the turn-on time of regulator 2. Do not leave floating.
14
SS1
Soft-Start for Regulator 1. Connect a minimum of 200 pF capacitor to ground to set
the turn-on time of regulator 1. Do not leave floating.
15
PG1
Power Good Output for Regulator 1. Open drain output for the power good indicator
for output 1. Use a pull-up resistor between this pin and VOUT1 to indicate a power
good condition.
16
FB1
Feedback Input for Regulator 1. Connect a resistor divider from the output of regulator
1 to ground to set the output voltage.
17
SNS1
18
EN1
19
AGND1
20
AVIN1
Analog Input Voltage for Regulator 1. Tie to VIN1 and connect a capacitor to ground
to decouple noise.
EP
ePAD
Exposed Heat Sink Pad. Connect to PGND.
DS20006020A-page 12
Power Ground for Regulator 1.
Power Ground for Regulator 2.
Analog Ground for Regulator 2. Connect to a central ground point where all high
current paths meet (CIN, COUT, PGND2) for best operation.
Enable Input for Regulator 2. Logic high enables operation of regulator 2. Logic low
will shut down regulator 2. Do not leave floating.
Sense Input for Regulator 2. Connect to the output of regulator 2 as close to the
output capacitor as possible to accurately sense the output voltage.
Sense Input for Regulator 1. Connect to the output of regulator 1 as close to the
output capacitor as possible to accurately sense the output voltage.
Enable Input for Regulator 1. Logic high enables operation of regulator 1. Logic low
will shut down regulator 1. Do not leave floating.
Analog Ground for Regulator 1. Connect to a central ground point where all high
current paths meet (CIN, COUT, PGND1) for best operation.
2018 Microchip Technology Inc.
MIC23158/9
4.0
FUNCTIONAL DESCRIPTION
4.1
VIN
The input supply (VIN) provides power to the internal
MOSFETs for the switch mode regulator section. The
VIN operating range is 2.7V to 5.5V. An input capacitor
with a minimum voltage rating of 6.3V is
recommended. Due to the high switching speed, a
minimum 2.2 µF bypass capacitor placed close to VIN
and the power ground (PGND) pin is required. Refer to
the PCB Layout Recommendations for details.
4.2
AVIN
Analog VIN (AVIN) provides power to the internal
control and analog supply circuitry. AVIN and VIN must
be tied together. Careful layout should be considered to
ensure high frequency switching noise caused by VIN
is reduced before reaching AVIN. A 1 µF capacitor as
close to AVIN as possible is recommended. Refer to
the PCB Layout Recommendations for details.
4.3
EN
A logic high signal on the enable pin activates the
output voltage of the device. A logic low signal on the
enable pin deactivates the output and reduces supply
current to 0.1 µA. Do not leave the EN pin floating.
When disabled, the MIC23159 switches in a 225Ω load
from the SNS pin to AGND to discharge the output
capacitor.
4.4
SW
4.7
PGND
The power ground pin is the ground path for the high
current in PWM mode. The current loop for the power
ground should be as small as possible and separate
from the analog ground (AGND) loop as applicable.
Refer to the layout recommendations for more details.
4.8
PG
The power good (PG) pin is an open-drain output that
indicates when the output voltage is within regulation.
This is indicated by a logic high signal when the output
voltage is above the PG threshold. Connect a pull-up
resistor greater than 5 kΩ from PG to VOUT.
4.9
SS
An external soft-start circuitry set by a capacitor on the
SS pin reduces inrush current and prevents the output
voltage from overshooting at start-up. The SS pin is
used to control the output voltage ramp up time and the
approximate equation for the ramp time in milliseconds
is 296 x 103 x ln(10) x CSS. For example, for a CSS =
470 pF, tRISE ≈ 300 µs. Refer to the “VOUT Rise Time
vs. CSS” graph in the Typical Characteristics section.
The minimum recommended value for CSS is 200 pF.
4.10
FB
The feedback (FB) pin is provided for the adjustable
voltage option. This is the control input for setting the
output voltage. A resistor divider network is connected
to this pin from the output and is compared to the
internal 0.62V reference within the regulation loop.
The switch (SW) connects directly to one end of the
inductor and provides the current path during switching
cycles. The other end of the inductor is connected to
the load, SNS pin, and output capacitor. Due to the high
speed switching on this pin, the switch node should be
routed away from sensitive nodes whenever possible.
The output voltage
Equation 4-1:
4.5
Where:
SNS
The sense (SNS) pin is connected to the output of the
device to provide feedback to the control circuitry. The
SNS connection should be placed close to the output
capacitor. Refer to the layout recommendations for
more details. The SNS pin also provides the output
active discharge circuit path to pull down the output
voltage when the device is disabled.
4.6
AGND
The analog ground (AGND) is the ground path for the
biasing and control circuitry. The current loop for the
signal ground should be separate from the power
ground (PGND) loop. Refer to the PCB Layout
Recommendations for details.
2018 Microchip Technology Inc.
can
be
calculated
using
EQUATION 4-1:
R1
V OUT = V REF 1 + -------
R2
VREF = 0.62V
TABLE 4-1:
RECOMMENDED FB
RESISTOR VALUES
VOUT
R1
R2
1.2V
274 kΩ
294 kΩ
1.5V
316 kΩ
221 kΩ
1.8V
301 kΩ
158 kΩ
2.5V
324 kΩ
107 kΩ
3.3V
309 kΩ
71.5 kΩ
DS20006020A-page 13
MIC23158/9
5.0
APPLICATION INFORMATION
The MIC23158/9 are high-performance DC/DC step
down regulators offering a small solution size.
Supporting two outputs of up to 2A each in a 3 mm x
4 mm QFN package. Using the HyperLight Load
switching scheme, the MIC23158/9 are able to
maintain high efficiency throughout the entire load
range while providing ultra fast load transient response.
The following sections provide additional device
application information.
5.1
Input Capacitor
A 2.2 µF ceramic capacitor or greater should be placed
close to the VIN pin and PGND pin for bypassing. A
Murata GRM188R60J475KE19D, size 0603, 4.7 µF
ceramic capacitor is recommended based upon
performance, size and cost. A X5R or X7R temperature
rating is recommended for the input capacitor.
5.2
EQUATION 5-1:
1 – V OUT V IN
I PEAK = I OUT + V OUT --------------------------------------
2fL
As shown by the calculation above, the peak inductor
current is inversely proportional to the switching
frequency and the inductance. The lower the switching
frequency or inductance, the higher the peak current.
As input voltage increases, the peak current also
increases.
The size of the inductor depends on the requirements
of the application. Refer to the Typical Application
Circuit for details.
Output Capacitor
The MIC23158/9 are designed for use with a 2.2 µF or
greater ceramic output capacitor. Increasing the output
capacitance will lower output ripple and improve load
transient response but could also increase solution size
or cost. A low equivalent series resistance (ESR)
ceramic output capacitor such as the Murata
GRM188R60J475KE19D, size 0603, 4.7 µF ceramic
capacitor is recommended based upon performance,
size and cost. Both the X7R or X5R temperature rating
capacitors are recommended.
5.3
Peak current can be calculated in Equation 5-1:
Inductor Selection
HSD
IN HLL MODE
tON FIXED, tOFF
VARIABLE
IOUT
IINDUCTOR
~ -50mA
LSD
LOAD INCREASING
tDL
HSD
IN CCM MODE
tON VARIABLE, tOFF
FIXED
IOUT
IINDUCTOR
LSD
When selecting an inductor, it is important to consider
the following factors:
FIGURE 5-1:
Transition Between CCM
Mode and HLL Mode.
•
•
•
•
DC resistance (DCR) is also important. While DCR is
inversely proportional to size, DCR can represent a
significant efficiency loss. Refer to the Efficiency
Considerations subsection.
Inductance
Rated current value
Size requirements
DC resistance (DCR)
The MIC23158/9 are designed for use with a 0.47 µH
to 2.2 µH inductor. For faster transient response, a
0.47 µH inductor will yield the best result. For lower
output ripple, a 2.2 µH inductor is recommended.
Maximum current ratings of the inductor are generally
given in two methods: permissible DC current and
saturation current. Permissible DC current can be rated
either for a 40°C temperature rise or a 10% to 20% loss
in inductance. Ensure the inductor selected can handle
the maximum operating current. When saturation
current is specified, make sure that there is enough
margin so that the peak current does not cause the
inductor to saturate.
The transition between continuous conduction mode
(CCM) to HyperLight Load mode is determined by the
inductor ripple current and the load current.
The diagram shows the signals for high-side switch
drive (HSD) for tON control, the inductor current, and
the low-side switch drive (LSD) for tOFF control.
In HLL mode, the inductor is charged with a fixed tON
pulse on the high side switch. After this, the low side
switch is turned on and current falls at a rate of VOUT/L.
The controller remains in HLL mode while the inductor
falling current is detected to cross approximately
–50 mA. When the LSD (or tOFF) time reaches its
minimum, and the inductor falling current is no longer
able to reach the threshold, the part is in CCM mode.
Once in CCM mode, the tOFF time will not vary.
Therefore, it is important to note that if L is large
enough, the HLL transition level will not be triggered.
DS20006020A-page 14
2018 Microchip Technology Inc.
MIC23158/9
That inductor is illustrated in Figure 5-1.
EQUATION 5-2:
V OUT – 135ns
L MAX = ----------------------------------2 – 50mA
5.4
Duty Cycle
The typical maximum duty cycle of the MIC23158/9 is
80%.
5.5
Efficiency Considerations
Efficiency is defined as the amount of useful output
power, divided by the amount of power supplied.
Figure 5-2 shows an efficiency curve. From 1 mA load
to 2A, efficiency losses are dominated by quiescent
current losses, gate drive and transition losses. By
using the HyperLight Load mode, the MIC23158/9 are
able to maintain high efficiency at low output currents.
Over 180 mA, efficiency loss is dominated by MOSFET
RDSON and inductor losses. Higher input supply
voltages will increase the gate-to-source threshold on
the internal MOSFETs, thereby reducing the internal
RDSON. This improves efficiency by reducing DC
losses in the device. All but the inductor losses are
inherent to the device. In which case, inductor selection
becomes increasingly critical in efficiency calculations.
As the inductors are reduced in size, the DC resistance
(DCR) can become quite significant. The DCR losses
can be calculated as in Equation 5-4:
EQUATION 5-4:
EQUATION 5-3:
2
P DCR = I OUT DCR
V OUT I OUT
Efficiency = -------------------------------- 100
V IN I IN
There are two types of losses in switching converters;
DC losses and switching losses. DC losses are simply
the power dissipation of I2R. Power is dissipated in the
high-side switch during the on cycle. Power loss is
equal to the high-side MOSFET RDSON multiplied by
the switch current squared. During the off cycle, the
low-side N-channel MOSFET conducts, also
dissipating power. Device operating current also
reduces efficiency. The product of the quiescent
(operating) current and the supply voltage represents
another DC loss. The current required driving the gates
on and off at a constant 3 MHz frequency and the
switching transitions make up the switching losses.
From that, the loss in efficiency due to inductor
resistance can be calculated as in Equation 5-5:
EQUATION 5-5:
V OUT I OUT
Eff Loss = 1 – ---------------------------------------------------- 100
V OUT I OUT + P DCR
Efficiency loss due to DCR is minimal at light loads and
gains significance as the load is increased. Inductor
selection becomes a trade off between efficiency and
size in this case.
5.6
FIGURE 5-2:
Efficiency Under Load.
2018 Microchip Technology Inc.
HyperLight Load Mode
The MIC23158/9 use a minimum on and off time
proprietary control loop. When the output voltage falls
below the regulation threshold, the error comparator
begins a switching cycle that turns the PMOS on and
keeps it on for the duration of the minimum-on-time.
This increases the output voltage. If the output voltage
is over the regulation threshold, then the error
comparator turns the PMOS off for a minimum-off-time
until the output drops below the threshold. The NMOS
acts as an ideal rectifier that conducts when the PMOS
is off. Using an NMOS switch instead of a diode allows
for lower voltage drop across the switching device
when it is on. The synchronous switching combination
between the PMOS and the NMOS allows the control
loop to work in discontinuous mode for light load
operations. In discontinuous mode, the MIC23158/9
DS20006020A-page 15
MIC23158/9
work in HyperLight Load to regulate the output. As the
output current increases, the off time decreases, thus
provides more energy to the output. This switching
scheme improves the efficiency of MIC23158/9 during
light load currents by only switching when it is needed.
As the load current increases, the MIC23158/9 go into
continuous conduction mode (CCM) and switches at a
frequency centered at 3 MHz. The equation to
calculate the load when the MIC23158/9 goes into
continuous conduction mode may be approximated by
the following formula:
EQUATION 5-6:
V IN – V OUT D
I LOAD -------------------------------------------2L f
As shown in Equation 5-6, the load at which the
MIC23158/9 transition from HyperLight Load mode to
PWM mode is a function of the input voltage (VIN),
output voltage (VOUT), duty cycle (D), inductance (L)
and frequency (f). As shown in Figure 5-3, as the
output current increases, the switching frequency also
increases until the MIC23158/9 go from HyperLight
Load mode to PWM mode at approximately 180 mA.
The MIC23158/9 will switch at a relatively constant
frequency around 3 MHz once the output current is
over 180 mA.
FIGURE 5-3:
Output Current.
DS20006020A-page 16
Switching Frequency vs.
2018 Microchip Technology Inc.
MIC23158/9
6.0
PACKAGING INFORMATION
6.1
Package Marking Information
20-Lead QFN*
XXXXX
XXX
WNNN
Legend: XX...X
Y
YY
WW
NNN
e3
*
Example
23158
YML
8790
Product code or customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle
mark).
Note:
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information. Package may or may not include
the corporate logo.
Underbar (_) and/or Overbar (⎯) symbol may not be to scale.
2018 Microchip Technology Inc.
DS20006020A-page 17
MIC23158/9
20-Lead QFN 3 mm x 4 mm Package Outline and Recommended Land Pattern
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
DS20006020A-page 18
2018 Microchip Technology Inc.
MIC23158/9
APPENDIX A:
REVISION HISTORY
Revision A (May 2018)
• Converted Micrel document MIC23158/9 to Microchip data sheet DS20006020A.
• Minor text changes throughout.
• COUT1,2 corrected to COUT3,4 in Table 1-1.
• Added VREF qualifier in Equation 4-1.
2018 Microchip Technology Inc.
DS20006020A-page 19
MIC23158/9
NOTES:
DS20006020A-page 20
2018 Microchip Technology Inc.
MIC23158/9
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
Examples:
Device
X
XX
-XX
Part No.
Junction
Temp. Range
Package
Media Type
MIC23158:
3 MHz PWM Dual 2A Buck Regulator with
HyperLight Load and Power Good
3 MHz PWM Dual 2A Buck Regulator with
HyperLight Load and Power Good with
Auto-Discharge
Device:
MIC23159:
Junction
Temperature
Range:
Y
=
–40°C to +125°C, RoHS-Compliant
Package:
ML
=
20-Lead 3 mm x 4 mm QFN
Media Type:
T5
TR
=
=
500/Reel
5,000/Reel
a) MIC23158YML-T5:
MIC23158, –40°C to +125°C
Temperature Range, 20-Lead
QFN, 500/Reel
b) MIC23158YML-TR:
MIC23158, –40°C to +125°C
Temperature Range, 20-Lead
QFN, 5,000/Reel
c) MIC23159YML-T5:
MIC23159, Auto-Discharge
Feature, –40°C to +125°C
Temperature Range, 20-Lead
QFN, 500/Reel
d) MIC23159YML-TR:
MIC23159, Auto-Discharge
Feature, –40°C to +125°C
Temperature Range, 20-Lead
QFN, 5,000/Reel
Note 1:
2018 Microchip Technology Inc.
Tape and Reel identifier only appears in the
catalog part number description. This identifier is
used for ordering purposes and is not printed on
the device package. Check with your Microchip
Sales Office for package availability with the
Tape and Reel option.
DS20006020A-page 21
MIC23158/9
NOTES:
DS20006020A-page 22
2018 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate, AVR,
AVR logo, AVR Freaks, BeaconThings, BitCloud, CryptoMemory,
CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KEELOQ,
KEELOQ logo, Kleer, LANCheck, LINK MD, maXStylus,
maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip
Designer, QTouch, RightTouch, SAM-BA, SpyNIC, SST, SST
Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
and other countries.
ClockWorks, The Embedded Control Solutions Company,
EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS,
mTouch, Precision Edge, and Quiet-Wire are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo,
CodeGuard, CryptoAuthentication, CryptoCompanion,
CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average
Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial
Programming, ICSP, Inter-Chip Connectivity, JitterBlocker,
KleerNet, KleerNet logo, Mindi, MiWi, motorBench, MPASM, MPF,
MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, PureSilicon, QMatrix, RightTouch logo, REAL ICE, Ripple
Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI,
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ZENA are trademarks of Microchip Technology Incorporated in the
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SQTP is a service mark of Microchip Technology Incorporated in
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Silicon Storage Technology is a registered trademark of Microchip
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GestIC is a registered trademark of Microchip Technology
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Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2018, Microchip Technology Incorporated, All Rights Reserved.
ISBN: 978-1-5224-3067-4
== ISO/TS 16949 ==
2018 Microchip Technology Inc.
DS20006020A-page 23
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