MIC23451
3 MHz, 2A Triple Synchronous Buck Regulator with
HyperLight Load® and Power Good
Features
General Description
•
•
•
•
•
•
•
•
•
The MIC23451 is a high-efficiency, 3 MHz, triple 2A,
synchronous buck regulator with HyperLight Load®
mode. HyperLight Load provides very high efficiency at
light loads and ultra-fast transient response, which is
ideal for supplying processor core voltages. An
additional benefit of this proprietary architecture is very
low output ripple voltage throughout the entire load
range with the use of small output capacitors. The
4 mm x 4 mm FQFN package saves board space and
requires only five external components for each
channel.
2022 Microchip Technology Inc. and its subsidiaries
Package Type
SNS2
FB2
PG2
EN3
FB3
MIC23451
26-Lead 4 mm x 4 mm FQFN (FL)
(Top View)
EN2
20
19
18
17
16
15
14
EN1
21
1
13
PG3
SNS1
2
22
12
SNS3
FB1
3
23
11
AGND
AGND
4
24
10
PGND
PVIN1
25
9
AVIN3
SW1
26
6
8
PVIN3
EP1
3
4
5
PVIN2
6
7
SW3
2
AVIN2
1
SW2
EP2
AVIN1
Solid State Drives (SSD)
µC/µP, FPGA, and DSP Power
Test and Measurement Systems
Set-Top Boxes and DTV
High-Performance Servers
Security/Surveillance Cameras
5V POL Applications
The MIC23451 is available in a 26-lead 4 mm x 4 mm
FQFN package with an operating junction temperature
range from –40°C to +125°C.
PGND
•
•
•
•
•
•
•
The MIC23451 has a very low quiescent current of
24 µA each channel and achieves as high as 81%
efficiency at 1 mA. At higher loads, the MIC23451
provides a constant switching frequency around 3 MHz
while achieving peak efficiencies up to 93%.
PG1
Applications
The MIC23451 is designed for use with a very small
inductor, down to 0.47 µH, and an output capacitor as
small as 2.2 µF that enables a total solution size that is
less than 1 mm height.
PGND
•
•
•
•
•
•
2.7V to 5.5V Input Voltage
Three Independent 2A Outputs
Up to 93% Peak Efficiency
81% Typical Efficiency at 1 mA
Three Independent Power Good Indicators
24 µA Typical Quiescent Current (per Channel)
3 MHz PWM Operation in Continuous Mode
Ultra-Fast Transient Response
Low Voltage Output Ripple
- 30 mVPP Ripple in HyperLight Load Mode
- 5 mV Output Voltage Ripple in Full PWM
Mode
Fully Integrated MOSFET Switches
0.1 µA Shutdown Current (per Channel)
Thermal Shutdown and Current-Limit Protection
Output Voltage as Low as 1V
26-Lead 4 mm × 4 mm FQFN
–40°C to +125°C Junction Temperature Range
DS20006662A-page 1
MIC23451
Typical Application Circuit
2.7V to 5.5V
VIN
MIC23451-AAAYFL
PVIN1/2/3
SW1
AVIN1/2/3
SNS1
FB1
VOUT1
PG1
OFF
ON
EN1
SW2
4mm x 4mm
PG2
OFF
ON
EN2
SW3
PG3
OFF
ON
VOUT2
SNS2
FB2
EN3
PGND1,2,3
VOUT3
SNS3
FB3
AGND1,2
Functional Block Diagram
PVIN1/2/3
AVIN1/2/3
3
3
EN1/2/3
CONTROL
LOGIC
TIMER &
SOFT-START
UVLO
REFERENCE
ERROR
COMPARATOR
PG1/2/3
AGND
3
3
3
DS20006662A-page 2
GATE
DRIVE
CURRENT
LIMIT
ISENSE
ZERO
3
3
3
3
SW1/2/3
PGND1/2/3
SNS1/2/3
FB1/2/3
2022 Microchip Technology Inc. and its subsidiaries
MIC23451
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
Supply Voltage (PVIN, AVIN)......................................................................................................................... –0.3V to +6V
Sense (VSNS1, VSNS2, VSNS3)...................................................................................................................... –0.3V to +6V
Power Good (PG1, PG2, PG3) .................................................................................................................... –0.3V to +6V
Output Switch Voltage (VSW1, VSW2, VSW3) ................................................................................................ –0.3V to +6V
Enable Input Voltage (VEN1, VEN2, VEN3).......................................................................................................–0.3V to VIN
ESD Rating .............................................................................................................................................................Note 1
Operating Ratings ‡
Supply Voltage (VIN) ................................................................................................................................. +2.7V to +5.5V
Enable Input Voltage (VEN1, VEN2, VEN3)............................................................................................................0V to VIN
Output Voltage Range (VSNS1, VSNS2, VSNS3)............................................................................................. +1V to +3.3V
† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at those or any other conditions above those indicated
in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended
periods may affect device reliability.
‡ Notice: The device is not guaranteed to function outside its operating ratings.
Note 1: Devices are ESD sensitive; use proper handling precautions. Human body model, 1.5 kΩ in series with
100 pF.
ELECTRICAL CHARACTERISTICS
Electrical Characteristics: TA = +25°C; VIN = VEN1 = VEN2 = VEN3 = 3.6V; L1 = L2 = L3 = 1 µH; COUT1 = COUT2 =
COUT3 = 4.7 µF, unless otherwise specified. Bold values valid for –40°C ≤ TJ ≤ +125°C, unless noted. (Note 1)
Parameter
Symbol
Min.
Typ.
Max.
Units
Supply Voltage Range
VIN
2.7
—
5.5
V
—
Undervoltage Lockout
Threshold
UVLOTH
2.45
2.55
2.65
V
Turn-On
Undervoltage Lockout
Hysteresis
UVLOHYS
—
75
—
mV
—
IQ
—
65
120
µA
IOUT = 0 mA,
VSNS > 1.2 x VOUT(NOM)
ISHDN
—
0.1
5
µA
VEN1, VEN2, VEN3 = 0V;
VIN = 5.5V
–2.5
—
+2.5
–2.5
—
+2.5
Quiescent Current
Per Channel Shutdown Current
Output Voltage Accuracy
—
%
Conditions
VIN = 3.6V if VOUT(NOM) < 2.5V,
ILOAD = 20 mA
VIN = 4.5V if VOUT(NOM) ≥ 2.5V,
ILOAD = 20 mA
Feedback Voltage
VFBx
0.604
0.62
0.635
V
—
Peak Current Limit
ILIM(PK)
2.2
4.1
—
A
SNS1, SNS2, SNS3 = 0.9 x
VOUT(NOM)
ILIM
—
2.3
—
A
—
—
0.3
—
—
0.3
—
Foldback Current Limit
Output Voltage Line Regulation
(VOUT1, VOUT2, VOUT3)
—
%/V
2022 Microchip Technology Inc. and its subsidiaries
VIN = 3.6V to 5.5V if VOUT(NOM)1,2,3
< 2.5V, ILOAD = 20 mA
VIN = 4.5V to 5.5V if VOUT(NOM)1,2,3
≥ 2.5V, ILOAD = 20 mA
DS20006662A-page 3
MIC23451
ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Characteristics: TA = +25°C; VIN = VEN1 = VEN2 = VEN3 = 3.6V; L1 = L2 = L3 = 1 µH; COUT1 = COUT2 =
COUT3 = 4.7 µF, unless otherwise specified. Bold values valid for –40°C ≤ TJ ≤ +125°C, unless noted. (Note 1)
Parameter
Symbol
Min.
Typ.
Max.
—
0.2
—
DCM: 20 mA < ILOAD < 130 mA,
VIN = 3.6V if VOUT(NOM) < 2.5V
—
0.4
—
DCM: 20 mA < ILOAD < 130 mA,
VIN = 5.0V if VOUT(NOM) > 2.5V
—
0.6
—
CCM: 200 mA < ILOAD < 500 mA,
VIN = 3.6V if VOUT(NOM) < 2.5V
—
0.3
—
CCM: 200 mA < ILOAD < 1A,
VIN = 5.0V if VOUT(NOM) > 2.5V
RDS(ON)
—
0.217
—
Ω
fMAX
—
—
3
MHz
Output Voltage Load
Regulation
(VOUT1, VOUT2, VOUT3)
PWM Switch ON-Resistance
(RSW1, RSW2, RSW3)
—
Maximum Frequency
Units
%
Conditions
ISW1, ISW2, ISW3 = +100 mA
(PMOS)
IOUT1, IOUT2, IOUT3 = 120 mA
tSS
—
150
—
µs
VOUT1, VOUT2, VOUT3 = 90%
Power Good Threshold
PGTH
83
90
96
%
% of VNOM
Power Good Hysteresis
PGHYS
—
10
—
%
—
Power Good Pull-Down
PGPD
—
—
200
mV
Soft-Start Time
VSNS = 90% VNOM, IPG = 1 mA
Enable Threshold
VEN
0.5
0.9
1.2
V
Turn-On
Enable Input Current
IEN
—
0.1
1
µA
—
Overtemperature Shutdown
TSHDN
—
160
—
°C
—
Overtemperature Shutdown
Hysteresis
TSHDN(HYS)
—
20
—
°C
—
Note 1:
Specifications are for packaged products only.
TEMPERATURE SPECIFICATIONS
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Junction Temperature Range
TJ
–40
—
+125
°C
Note 1
Storage Temperature Range
TS
–65
—
+150
°C
—
JA
—
20
—
°C/W
—
JC
—
10
—
°C/W
—
Temperature Ranges
Package Thermal Resistances
Thermal Resistance, FQFN 26-Ld
Note 1:
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.
DS20006662A-page 4
2022 Microchip Technology Inc. and its subsidiaries
MIC23451
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
180
SUPPLY CURRENT (nA)
160
140
120
100
80
60
40
20
0
2
3
4
5
6
INPUT VOLTAGE (V)
FIGURE 2-1:
Efficiency vs. Output
Current, VOUT = 2.5V.
FIGURE 2-4:
Voltage.
Shutdown Current vs. Input
OUTPUT VOLTAGE (V)
1.90
1.85
IOUT = 80mA
IOUT = 20mA
1.80
IOUT = 1mA
1.75
1.70
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
INPUT VOLTAGE (V)
FIGURE 2-2:
Efficiency vs. Output
Current, VOUT = 1.8V.
FIGURE 2-5:
Loads).
Line Regulation (Low
FIGURE 2-6:
Loads).
Line Regulation (High
5.0
PEAK CURRENT LIMIT (A)
4.8
4.6
CH1 = 2.5V
4.4
4.2
4.0
CH3 = 1.2V
3.8
3.6
CH2 = 1.8V
3.4
3.2
3.0
2
3
4
5
6
INPUT VOLTAGE (V)
FIGURE 2-3:
Voltage.
Current Limit vs. Input
2022 Microchip Technology Inc. and its subsidiaries
DS20006662A-page 5
MIC23451
100
1.90
80
1.86
1.84
VIN = 5V
PG DELAY (μs)
OUTPUT VOLTAGE (V)
1.88
VIN = 3.6V
1.82
1.80
1.78
VIN = 3V
1.76
1.74
PG RISING
60
40
20
1.72
PG FALLING
VOUT = 1.8V
1.70
0
0
0.03
0.06
0.09
0.12
0.15
0.18
2
3
LOAD CURRENT (A)
FIGURE 2-7:
Current (HLL).
Output Voltage vs. Output
4
5
6
INPUT VOLTAGE (V)
FIGURE 2-10:
Input Voltage.
Power Good Delay Time vs.
PG THRESHOLD (% of VREF)
0.91
0.90
PG RISING
0.89
0.88
0.87
0.86
0.85
PG FALLING
0.84
0.83
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
INPUT VOLTAGE (V)
FIGURE 2-8:
Current (CCM).
Output Voltage vs. Output
FIGURE 2-11:
Input Voltage.
Power Good Thresholds vs.
2.57
1.84
VIN = 5.5V
VIN = 3.6V
1.80
1.78
VIN = 2.7V
1.76
UVLO THRESHOLD (V)
OUTPUT VOLTAGE (V)
UVLO RISING
1.82
2.55
2.53
2.51
UVLO FALLING
2.49
2.47
1.74
-60 -40 -20
0
20
40
60
80 100 120 140
-60 -40 -20
FIGURE 2-9:
Temperature.
DS20006662A-page 6
Output Voltage vs.
0
20
40
60
80 100 120 140
TEMPERATURE (°C)
TEMPERATURE (°C)
FIGURE 2-12:
Temperature.
UVLO Threshold vs.
2022 Microchip Technology Inc. and its subsidiaries
1.2
0.640
1.1
0.635
0.630
1.0
VFB (V)
ENABLE THRESHOLD (V)
MIC23451
0.9
0.8
VIN = 5.5V
0.625
0.620
0.615
0.7
VIN = 3.6V
VIN=2.7V
0.610
0.6
0.605
TAMB = 25°C
0.600
0.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
-60 -40 -20
FIGURE 2-13:
Voltage.
0
20
40
60
80 100 120 140
TEMPERATURE (°C)
INPUT VOLTAGE (V)
Enable Threshold vs. Input
FIGURE 2-16:
Temperature.
Feedback Voltage vs.
ENABLE THRESHOLD (V)
1.0
0.9
0.8
0.7
0.6
VIN = 3.6V
0.5
-60
-40
-20
0
20
40
60
80
100 120
TEMPERATURE (°C)
FIGURE 2-14:
Temperature.
Enable Threshold vs.
FIGURE 2-17:
Maximum Output Current
per O/P vs. Temperature (1 O/P).
10000
FREQUENCY (kHz)
1000
VIN = 3.6V
100
VIN = 3V
VIN = 5V
10
1
VOUT = 1.8V
0.1
0.0001
0.001
0.01
0.1
1
10
OUTPUT CURRENT (A)
FIGURE 2-15:
Load Current.
Switching Frequency vs.
2022 Microchip Technology Inc. and its subsidiaries
FIGURE 2-18:
Maximum Output Current
per O/P vs. Temperature (2 O/Ps).
DS20006662A-page 7
MIC23451
FIGURE 2-19:
Maximum Output Current
per O/P vs. Temperature (3 O/Ps).
FIGURE 2-22:
Switching Waveform
Discontinuous Mode (1 mA).
FIGURE 2-20:
Power Dissipation vs. Load
Current (per Channel).
FIGURE 2-23:
Switching Waveform
Discontinuous Mode (50 mA).
POWER DISSIPATION (W)
7
6
5
4
3
2
1
0
0
20
40
60
80
100
120
AMBIENT TEMPERATURE (°C)
FIGURE 2-21:
Maximum Package
Dissipation vs. Ambient Temperature.
DS20006662A-page 8
FIGURE 2-24:
Switching Waveform
Continuous Mode (150 mA).
2022 Microchip Technology Inc. and its subsidiaries
MIC23451
FIGURE 2-25:
Switching Waveform
Continuous Mode (500 mA).
FIGURE 2-28:
1A).
Load Transient (50 mA to
FIGURE 2-26:
200 mA).
Load Transient (10 mA to
FIGURE 2-29:
1A).
Load Transient (200 mA to
FIGURE 2-27:
500 mA).
Load Transient (10 mA to
FIGURE 2-30:
at 1A Load).
Line Transient (3.6V to 5.5V
2022 Microchip Technology Inc. and its subsidiaries
DS20006662A-page 9
MIC23451
FIGURE 2-31:
at 20 mA Load).
Line Transient (3.6V to 5.5V
FIGURE 2-34:
Shutdown and Power Good
Waveform – Sequenced (EN = EN1, PG1 = EN2,
PG2 = EN3).
FIGURE 2-32:
Waveform.
Start-Up and Power Good
FIGURE 2-35:
Switching Waveform (All
Channels in Continuous Mode).
FIGURE 2-33:
Start-Up and Power Good
Waveform – Sequenced (EN = EN1, PG1 = EN2,
PG2 = EN3).
DS20006662A-page 10
FIGURE 2-36:
Transient Cross Regulation
(IOUT3 = 20 mA to 1A; IOUT1, IOUT2 = 20 mA).
2022 Microchip Technology Inc. and its subsidiaries
MIC23451
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
Pin Number
Pin Name
26, 4, 7
SW1, 2, 3
Switch (Output). Internal power MOSFET output switches for output 1/2/3.
21, 19, 15
EN1, 2, 3
Enable (Input). Logic high enables operation of regulator 1/2/3. Logic low will shut
down the device. Do not leave floating.
22, 18, 12
SNS1, 2, 3
23, 17, 14
FB1, 2, 3
Feedback. Connect a resistor divider from output 1/2/3 to ground to set the output
voltage.
20, 16, 13
PG1, 2, 3
Power Good. Open-drain output for the power good indicator for output 1/2/3. Place
a resistor between this pin and a voltage source to detect a power good condition.
EP1, 24, 11
AGND
Analog Ground. Connect to quiet ground point away from high-current paths, for
example, COUT, for best operation. Must be connected externally to PGND.
25, 5, 8
PVIN1, 2, 3
Power Input Voltage. Connect a capacitor to PGND to localize loop currents and
decouple switching noise.
3, 6, 9
AVIN1, 2, 3 Analog Input Voltage. Connect a capacitor to AGND to decouple noise.
EP2, 10, 2, 1
PGND
Description
Sense. Connect to VOUT1,2,3 as close to output capacitor as possible to sense output
voltage.
Power Ground.
2022 Microchip Technology Inc. and its subsidiaries
DS20006662A-page 11
MIC23451
4.0
FUNCTIONAL DESCRIPTION
4.1
PVIN
The input supply (PVIN) provides power to the internal
MOSFETs for the switch mode regulator. The VIN
operating range is 2.7V to 5.5V, so an input capacitor,
with a minimum voltage rating of 6.3V is
recommended. Because of the high di/dt switching
speeds, a minimum 2.2 µF or 4.7 µF recommended
bypass capacitor, placed close to PVIN and the power
ground (PGND) pin, is required. Refer to the PCB
Layout Recommendations section for details.
4.2
AVIN
The input supply (AVIN) provides power to the internal
control circuitry. Because the high di/dt switching
speeds on PVIN cause small voltage spikes, a 50Ω RC
filter and a minimum 100 nF decoupling capacitor,
placed close to the AVIN and signal ground (AGND)
pin, is required.
4.3
EN
A logic high signal on the enable pin (EN) activates the
output voltage of the device. A logic low signal on the
enable pin deactivates the output and reduces supply
current to 0.01 µA. The MIC23451 features internal
soft-start circuitry that reduces inrush current and
prevents the output voltage from overshooting at
start-up. Do not leave the EN pin floating.
4.4
SW
The switch (SW) connects directly to one end of the
inductor and provides the current path during switching
cycles. The other end of the inductor is connected to
the load, SNS pin, and output capacitor. Because of the
high-speed switching on this pin, the switch node
should be routed away from sensitive nodes.
4.5
SNS
The sense (SNS) pin is connected to the output of the
device to provide feedback to the control circuitry. The
SNS connection should be placed close to the output
capacitor. Refer to the PCB Layout Recommendations
section for more details.
4.6
4.7
PGND
The power ground pin is the ground path for the high
current in PWM mode. The current loop for the power
ground should be as short and wide as possible and
separate from the analog ground (AGND) loop as
applicable.
Refer
to
the
PCB
Layout
Recommendations section for more details.
4.8
PG
The power good (PG) pin is an open-drain output that
indicates logic high when the output voltage is typically
above 90% of its steady state voltage. A pull-up resistor
of more than 5 kΩ should be connected from PG to
VOUT.
4.9
FB
The feedback (FB) pin is the control input for
programming the output voltage. A resistor divider
network is connected to this pin from the output and is
compared to the internal 0.62V reference within the
regulation loop.
The output voltage can be programmed between 1V
and 3.3V using Equation 4-1:
EQUATION 4-1:
R1
V OUT = V REF 1 + -------
R2
Where:
R1 = The top, VOUT-connected resistor.
R2 = The bottom, AGND-connected resistor.
Table 4-1 shows example feedback resistor values.
TABLE 4-1:
FEEDBACK RESISTOR
VALUES
VOUT
R1
R2
1.2V
274 kΩ
294 kΩ
1.5V
316 kΩ
221 kΩ
1.8V
301 kΩ
158 kΩ
2.5V
324 kΩ
107 kΩ
3.3V
309 kΩ
71.5 kΩ
AGND
The analog ground (AGND) is the ground path for the
biasing and control circuitry. The current loop for the
signal ground should be separate from the power
ground (PGND) loop. Refer to the PCB Layout
Recommendations section for more details.
DS20006662A-page 12
2022 Microchip Technology Inc. and its subsidiaries
MIC23451
5.0
APPLICATIONS INFORMATION
The MIC23451 is a triple high performance DC-to-DC
step down regulator that offers a small solution size.
Supporting three outputs with currents up to 2A inside
a 4 mm × 4 mm FQFN package, the IC requires only
five external components per channel while meeting
today’s miniature portable electronic device needs.
Using the HyperLight Load® switching scheme, the
MIC23451 can maintain high efficiency throughout the
entire load range while providing ultra-fast load
transient response. The following sections provide
additional device application information.
5.1
Input Capacitor
A 2.2 µF or greater ceramic capacitor should be placed
close to the PVIN pin for each channel and its
corresponding PGND pin for bypassing. For example,
the Murata GRM188R61E475KE11D, size 0603,
4.7 µF ceramic capacitor is ideal, based on
performance, size, and cost. An X5R or X7R
temperature rating is recommended for the input
capacitor. Y5V temperature rating capacitors, in
addition to losing most of their capacitance over
temperature, can also become resistive at high
frequencies. This reduces their ability to filter out
high-frequency noise.
5.2
Output Capacitor
The MIC23451 is designed for use with a 2.2 µF or
greater ceramic output capacitor. Increasing the output
capacitance lowers output ripple and improves load
transient response, but could also increase solution
size or cost. A low equivalent series resistance (ESR)
ceramic output capacitor, such as the Murata
GRM188R61E475KE11D, size 0603, 4.7 µF ceramic
capacitor, is recommended based on performance,
size, and cost. Both the X7R or X5R temperature rating
capacitors are recommended. The Y5V and Z5U
temperature rating capacitors are not recommended
due to their wide variation in capacitance over
temperature and increased resistance at high
frequencies.
5.3
Inductor Selection
When selecting an inductor, it is important to consider
the following factors (not necessarily in order of
importance):
•
•
•
•
Inductance
Rated current value
Size requirements
DC resistance (DCR)
The MIC23451 is designed for use with a 0.47 µH to
2.2 µH inductor. For faster transient response, a
0.47 µH inductor yields the best result. On the other
2022 Microchip Technology Inc. and its subsidiaries
hand, a 2.2 µH inductor yields lower output voltage
ripple. For the best compromise of these, a 1 µH is
generally recommended.
Maximum current ratings of the inductor are generally
given in two forms: permissible DC current and
saturation current. Permissible DC current can be rated
either for a 40°C temperature rise or a 10% to 20% loss
in inductance. Make sure the inductor selected can
handle the maximum operating current. When
saturation current is specified, make sure that there is
enough margin, so that the peak current does not
cause the inductor to saturate. Peak current can be
calculated as shown in Equation 5-1:
EQUATION 5-1:
1 – V OUT V IN
I PEAK = I OUT + V OUT -----------------------------------
2fL
As this equation shows, the peak inductor current is
inversely proportional to the switching frequency and
the inductance; the lower the switching frequency or
the inductance the higher the peak current. As input
voltage increases, the peak current also increases.
The size of the inductor depends on the requirements
of the application. Refer to the Typical Application
Schematic and Bill of Materials sections for details.
DC resistance (DCR) is also important. While DCR is
inversely proportional to size, DCR can represent a
significant efficiency loss. Refer to the Efficiency
Considerations section.
The transition between high loads (CCM) to HyperLight
Load® (HLL) mode is determined by the inductor ripple
current and the load current, as shown in Figure 5-1.
HSD
IN HLL MODE
(TON FIXED, TOFF VARIABLE) IINDUCTOR
–50mA
IOUT
LOAD INCREASING
LSD
TDL
IN CCM MODE
(TON VARIABLE, TOFF FIXED)
HSD
IOUT
IINDUCTOR
LSD
FIGURE 5-1:
Transition between CCM
Mode and HLL Mode.
The diagram shows the signals for high-side switch
drive (HSD) for tON control, the inductor current, and
the low-side switch drive (LSD) for tOFF control.
DS20006662A-page 13
MIC23451
In HLL mode, the inductor is charged with a fixed tON
pulse on the high-side switch (HSD). After this, the LSD
is switched on and current falls at a rate of VOUT/L. The
controller remains in HLL mode while the inductor
falling current is detected to cross approximately
–50 mA. When the LSD (or tOFF) time reaches its
minimum and the inductor falling current is no longer
able to reach this –50 mA threshold, the part is in CCM
mode and switching at a virtually constant frequency.
(operating) current and the supply voltage represents
another DC loss. The current required to drive the
gates on and off at a constant 4 MHz frequency, and
the switching transitions, make up the switching losses.
Once in CCM mode, the tOFF time does not vary.
Therefore, it is important to note that if L is large
enough, the HLL transition level will not be triggered.
That inductor is:
EQUATION 5-2:
V OUT 135ns
L MAX = ---------------------------------2 50mA
5.4
Compensation
The MIC23451 is designed to be stable with a 0.47 µH
to 2.2 µH inductor with a 4.7 µF ceramic (X5R) output
capacitor.
5.5
Duty Cycle
The typical maximum duty cycle of the MIC23451 is
80%.
5.6
Efficiency Considerations
Efficiency is defined as the amount of useful output
power, divided by the amount of power supplied.
EQUATION 5-3:
V OUT I OUT
Efficiency % = ------------------------------- 100
V IN I IN
Maintaining high efficiency serves two purposes. It
reduces power dissipation in the power supply,
reducing the need for heat sinks and thermal design
considerations, and it reduces current consumption for
battery-powered applications. Reduced current draw
from a battery increases the device’s operating time
and is critical in hand-held devices.
There are two types of losses in switching converters:
DC losses and switching losses. DC losses are the
power dissipation of I2R. Power is dissipated in the
high-side switch during the on cycle. Power loss is
equal to the high-side MOSFET RDS(ON) multiplied by
the switch current squared. During the off cycle, the
low-side N-channel MOSFET conducts, also
dissipating power. Device operating current also
reduces efficiency. The product of the quiescent
DS20006662A-page 14
FIGURE 5-2:
Efficiency Under Load.
Figure 5-2 shows an efficiency curve. From no load to
100 mA, efficiency losses are dominated by quiescent
current losses, gate drive, and transition losses. By
using the HyperLight Load mode, the MIC23451 can
maintain high efficiency at low output currents.
Over 100 mA, efficiency loss is dominated by MOSFET
RDS(ON) and inductor losses. Higher input supply
voltages will increase the gate-to-source voltage on the
internal MOSFETs, thereby reducing the internal
RDS(ON). This improves efficiency by reducing DC
losses in the device. All but the inductor losses are
inherent to the device. Because of this, inductor
selection becomes increasingly critical in efficiency
calculations. As the inductors are reduced in size, the
DC resistance (DCR) can become very significant. The
DCR losses can be calculated as shown in
Equation 5-4.
EQUATION 5-4:
2
P DCR = I OUT DCR
From that, the loss in efficiency caused by inductor
resistance can be calculated as shown in Equation 5-5.
EQUATION 5-5:
V OUT I OUT
Efficiency Loss = 1 – --------------------------------------------------- 100
V OUT I OUT + P DCR
2022 Microchip Technology Inc. and its subsidiaries
MIC23451
Efficiency loss caused by DCR is minimal at light loads
and gains significance as the load is increased.
Inductor selection becomes a trade-off between
efficiency and size in this case.
5.7
Thermal Considerations
Most applications will not require 2A continuous current
from all outputs at all times, so it is useful to know what
the thermal limits are for various loading profiles.
The allowable overall package dissipation is limited by
the intrinsic thermal resistance of the package (Rθ(JC))
and the area of copper used to spread heat from the
package case to the ambient surrounding temperature
(Rθ(CA)). The composite of these two thermal
resistances is Rθ(JA), which represents the package
thermal resistance with at least 1 square inch of copper
ground plane. From this figure, which for the MIC23451
is 20°C/W, we can calculate maximum internal power
dissipation, as shown in Equation 5-6:
To arrive at the internal package dissipation PDISS,
remove the inductor loss PDCR, which is not dissipated
within the package. This does not give a worst case
figure because efficiency is typically measured on a
nominal part at nominal temperatures. The IOUT to
PDISS function used in this case is a synthesized PDISS,
which accounts for worst case values at maximum
operating temperature, as shown in Equation 5-8.
EQUATION 5-8:
V OUT
V OUT
2
P DISS = I OUT R DSON_P ------------- + R DSON_N 1 – -----------
V IN
V IN
Where:
RDSON_P = Max. RDS(ON) of the high-side P-channel
switch at TJMAX
RDSON_N = Max. RDS(ON) of the low-side N-channel
switch at TJMAX
VOUT = Output voltage
VIN = Input voltage
EQUATION 5-6:
T JMAX – T A
PD MAX = --------------------------R JA
Where:
TJMAX = Max. junction temperature (125°C)
TA = Ambient temperature
Rθ(JA) = 20°C/W
The allowable dissipation tends towards zero as the
ambient temperature increases towards the maximum
operating junction temperature.
The graph of PDMAX vs. ambient temperature could be
drawn quite simply using this equation. However, a
more useful measure is the maximum output current
per regulator vs. ambient temperature. This requires
creating an ‘exchange rate’ between power dissipation
per regulator (PDISS) and its output current (IOUT).
An accurate measure of this function can use the
efficiency curve, as illustrated in Equation 5-7:
EQUATION 5-7:
P OUT
= ---------------------------------P OUT + P LOSS
P OUT 1 –
P LOSS = -----------------------------------
Where:
η = Efficiency
POUT = IOUT x VOUT
2022 Microchip Technology Inc. and its subsidiaries
Because ripple current and switching losses are small
with respect to resistive losses at maximum output
current, they can be considered negligible for the
purpose of this method, but could be included if
required.
Using the function describing PDISS in terms of IOUT,
substitute PDISS with Equation 5-6 to form the function
of maximum output current IOUTMAX vs. ambient
temperature TA (Equation 5-9):
EQUATION 5-9:
I OUTMAX =
T JMAX – T A
---------------------------R JA
-------------------------------------------------------------------------------------------------------V OUT
V OUT
R DSON_P ------------- + R DSON_N 1 – -----------
V IN
V
IN
The curves shown in the Typical Performance Curves
section are plots of this function adjusted to account for
1, 2, or 3 regulators running simultaneously.
5.8
HyperLight Load Mode
Each regulator in the MIC23451 uses a minimum on
and off time proprietary control loop (patented by
Microchip). When the output voltage falls below the
regulation threshold, the error comparator begins a
switching cycle that turns the PMOS on and keeps it on
for the duration of the minimum-on-time. This increases
the output voltage. If the output voltage is over the
regulation threshold, then the error comparator turns
the PMOS off for a minimum-off-time until the output
drops below the threshold. The NMOS acts as an ideal
rectifier that conducts when the PMOS is off. Using an
NMOS switch instead of a diode allows for lower
voltage drop across the switching device when it is on.
DS20006662A-page 15
MIC23451
The asynchronous switching combination between the
PMOS and the NMOS allows the control loop to work
in discontinuous mode for light load operations. In
discontinuous mode, the MIC23451 works in
pulse-frequency modulation (PFM) to regulate the
output. As the output current increases, the off-time
decreases, which provides more energy to the output.
This switching scheme improves the efficiency of
MIC23451 during light load currents by switching only
when it is needed. As the load current increases, the
MIC23451 goes into continuous conduction mode
(CCM) and switches at a frequency centered at 3 MHz.
The equation to calculate the load when the MIC23451
goes into continuous conduction mode is approximated
in Equation 5-10.
5.9
Multiple Sources
The MIC23451 provides all the pins necessary to
operate the three regulators from independent
sources. This can be useful in partitioning power within
a multi-rail system. For example, two supplies may be
available within a system: 3.3V and 5V. The MIC23451
can be connected to use the 3.3V supply to provide
two, low-voltage outputs (for example, 1.2V and 1.8V)
and use the 5V rail to provide a higher output (for
example, 2.5V), resulting in the power blocks shown in
Figure 5-4.
5V
2.5V
CH1
EQUATION 5-10:
3.3V
V IN – V OUT D
I LOAD ------------------------------------------2L f
1.8V
CH2
As shown in that equation, the load at which the
MIC23451 transitions from HyperLight Load mode to
PWM mode is a function of the input voltage (VIN),
output voltage (VOUT), duty cycle (D), inductance (L),
and frequency (f). Figure 5-3 shows that as the output
current increases, the switching frequency also
increases until the MIC23451 goes from HyperLight
Load mode to PWM mode at approximately 120 mA.
The MIC23451 will switch at a relatively constant
frequency around 3 MHz after the output current is over
120 mA.
1.2V
CH3
FIGURE 5-4:
Diagram.
Multi-Source Power Block
10000
FREQUENCY (kHz)
1000
VIN = 3.6V
100
VIN = 3V
VIN = 5V
10
1
VOUT = 1.8V
0.1
0.0001
0.001
0.01
0.1
1
10
OUTPUT CURRENT (A)
FIGURE 5-3:
Output Current.
DS20006662A-page 16
Switching Frequency vs.
2022 Microchip Technology Inc. and its subsidiaries
MIC23451
TYPICAL APPLICATION SCHEMATIC
J1
C2
10μF
C3
10μF
R13
100
R2
10k
J10
EN1
VOUT2
16
19
R5
10k
J13
PG3
J14
EN3
SW2
EN1
FB2
PG2
SW3
SNS3
L1
1μH, 3A
R7
301k
22
R8
23
L2
1μH, 3A
4
17
12
331k
1μH, 3A
R11
294k
15
EN3
C5
4.7μF, 6.3V
VOUT3
J3
J7
J4
J8
VOUT1
GND1
VOUT2
GND2
VOUT3
C6
4.7μF, 6.3V
J5
R12
274k
13 PG3
R6
10k
VOUT2
L3
14
C4
4.7μF, 6.3V
J6
158k
R9
316k
R10
18
7
VOUT1
EN2
FB3
VOUT3
6.1
21
R4
10k
J12
EN2
PG1
SNS2
R3
10k
J11
PG2
FIGURE 6-1:
20
FB1
AGND
J9
SNS1
26
GND3
EP1
PG1
SW1
AGND
VOUT1
C7
4.7μF, 6.3V
R1
10k
PVIN1
PVIN2
PVIN3
AVIN1
AVIN2
AVIN3
24
220μF, 6.3V C8
J2 6SVPC220MV
GND
C1
10μF, 6.3V
IC1
MIC23451-AAAYFL
11
VIN
25
5
8
3
6
9
1 EP2
PGND
2
PGND
10
PGND
6.0
MIC23451 Typical Application Schematic.
Recommended Bill of Materials
TABLE 6-1:
Item
BILL OF MATERIALS
Part Number
C1, C2, C3 GRM188R60J106ME47J
C4, C5,
C6, C7
C8
CGB3B3X5R0J475K055AB
GRM188R61E475KE11D
EEU-FR1A221B
Manufacturer
Murata
TDK
Murata
Panasonic
Description
Qty.
Capacitor, 10 µF, Size 0603
3
Capacitor, 4.7 µF, Size 0603
4
Electrolytic Capacitor, 220 µF, 10V, Size 6.3 mm
1
R1, R2,
R3, R4,
R5, R6
CRCW060310K0FKEA
Vishay
Resistor, 10 kΩ, Size 0603
6
R7
CRCW0603301K0FKEA
Vishay
Resistor, 301 kΩ, Size 0603
1
R8
CRCW0603158K0FKEA
Vishay
Resistor, 158 kΩ, Size 0603
1
R9
CRCW0603316K0FKEA
Vishay
Resistor, 316Ω, Size 0603
1
R10
CRCW0603331K0FKEA
Vishay
Resistor, 331 kΩ, Size 0603
1
R11
CRCW0603294K0FKEA
Vishay
Resistor, 294 kΩ, Size 0603
1
R12
CRCW0603274K0FKEA
Vishay
Resistor, 274 kΩ, Size 0603
1
TDK
1 µH, 2A, 60 mΩ,
L3.0 mm x W3.0 mm x H1.0 mm
LQH44PN1R0NJ0
Murata
1 µH, 2.8A, 50 mΩ,
L4.0 mm x W4.0 mm x H1.2 mm
MIC23451-AAAYFL
Microchip
VLS3012HBX-1R0M
L1, L2, L3
U1
2022 Microchip Technology Inc. and its subsidiaries
3 MHz PWM 2A Buck Regulator with
HyperLight® Load
3
1
DS20006662A-page 17
MIC23451
7.0
PCB LAYOUT RECOMMENDATIONS
1
2
1
1
2
1
2
1
1
1
2
1
1
1
1
1
2
2
2
1
1
2
1
2
1
1
2
2
1
2
1
2
2
1
1
20 19 18 17 16 15 14
2
1
1
1
13
12
23
11
24
1
25
1
1
21
22
2
11
10
9
26
8
1
2
3
4
5
6
1
7
2
1
2
2
2
1
1
1
2
2
2
1
1
1
2
2
1
1
FIGURE 7-1:
1
1
Top Layer.
1
1
1
1
1
1
1
1
1
1
1
2
1
FIGURE 7-2:
DS20006662A-page 18
1
1
Mid Layer 1.
2022 Microchip Technology Inc. and its subsidiaries
MIC23451
1
1
1
1
1
1
1
1
1
1
1
2
1
1
FIGURE 7-3:
1
Mid Layer 2.
1
1
1
1
1
1
1
1
1
1
1
2
1
FIGURE 7-4:
1
1
Bottom Layer.
2022 Microchip Technology Inc. and its subsidiaries
DS20006662A-page 19
MIC23451
8.0
PACKAGING INFORMATION
8.1
Package Marking Information
26-Lead FQFN*
XXX
XXXXX
WNNN
Legend: XX...X
Y
YY
WW
NNN
e3
*
Example
AAA
23451
4PR7
Product code or customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle
mark).
Note:
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information. Package may or may not include
the corporate logo.
Underbar (_) symbol may not be to scale.
Note:
If the full seven-character YYWWNNN code cannot fit on the package, the following truncated codes are
used based on the available marking space:
6 Characters = YWWNNN; 5 Characters = WWNNN; 4 Characters = WNNN; 3 Characters = NNN;
2 Characters = NN; 1 Character = N
DS20006662A-page 20
2022 Microchip Technology Inc. and its subsidiaries
MIC23451
26-Lead 4 mm x 4 mm FQFN Package Outline and Recommended Land Pattern
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
2022 Microchip Technology Inc. and its subsidiaries
DS20006662A-page 21
MIC23451
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
DS20006662A-page 22
2022 Microchip Technology Inc. and its subsidiaries
MIC23451
APPENDIX A:
REVISION HISTORY
Revision A (April 2022)
• Converted Micrel document MIC23451 to Microchip data sheet DS20006662A.
• Minor text changes throughout.
2022 Microchip Technology Inc. and its subsidiaries
DS20006662A-page 23
MIC23451
NOTES:
DS20006662A-page 24
2022 Microchip Technology Inc. and its subsidiaries
MIC23451
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
Part Number
-XXX
X
XX
-XX
Device
Output
Voltage
Temp.
Range
Package
Media Type
Device:
Output Voltage:
MIC23451:
AAA
=
3 MHz, 2A Triple Synchronous Buck Regulator with HyperLight Load® and Power
Good
Examples:
a) MIC23451-AAAYFL-TR:
MIC23451, Triple Adj. Output
Voltage, –40°C to +125°C
Temp. Range, 26-Lead
FQFN, 5,000/Reel
b) MIC23451-AAAYFL-T5:
MIC23451, Triple Adj. Output
Voltage, –40°C to +125°C
Temp. Range, 26-Lead
FQFN, 500/Reel
Adjustable/Adjustable/Adjustable
Note 1:
Temperature
Range:
Y
=
–40°C to +125°C
Package:
FL
=
26-Lead FQFN
Media Type:
TR
T5
=
=
5,000/Reel
500/Reel
2022 Microchip Technology Inc. and its subsidiaries
Tape and Reel identifier only appears in the
catalog part number description. This identifier is
used for ordering purposes and is not printed on
the device package. Check with your Microchip
Sales Office for package availability with the Tape
and Reel option.
DS20006662A-page 25
MIC23451
NOTES:
DS20006662A-page 26
2022 Microchip Technology Inc. and its subsidiaries
Note the following details of the code protection feature on Microchip products:
•
Microchip products meet the specifications contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is secure when used in the intended manner, within operating specifications, and
under normal conditions.
•
Microchip values and aggressively protects its intellectual property rights. Attempts to breach the code protection features of
Microchip product is strictly prohibited and may violate the Digital Millennium Copyright Act.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code. Code protection does not
mean that we are guaranteeing the product is “unbreakable”. Code protection is constantly evolving. Microchip is committed to
continuously improving the code protection features of our products.
This publication and the information herein may be used only
with Microchip products, including to design, test, and integrate
Microchip products with your application. Use of this information in any other manner violates these terms. Information
regarding device applications is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your
specifications. Contact your local Microchip sales office for
additional support or, obtain additional support at https://
www.microchip.com/en-us/support/design-help/client-supportservices.
THIS INFORMATION IS PROVIDED BY MICROCHIP "AS IS".
MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED,
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RELATED TO THE INFORMATION INCLUDING BUT NOT
LIMITED TO ANY IMPLIED WARRANTIES OF NONINFRINGEMENT, MERCHANTABILITY, AND FITNESS FOR A
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IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT, SPECIAL, PUNITIVE, INCIDENTAL, OR CONSEQUENTIAL LOSS, DAMAGE, COST, OR EXPENSE OF ANY
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© 2022, Microchip Technology Incorporated and its subsidiaries.
All Rights Reserved.
For information regarding Microchip’s Quality Management Systems,
please visit www.microchip.com/quality.
2022 Microchip Technology Inc. and its subsidiaries
ISBN: 978-1-6683-0195-1
DS20006662A-page 27
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India - Pune
Tel: 91-20-4121-0141
China - Chongqing
Tel: 86-23-8980-9588
Japan - Osaka
Tel: 81-6-6152-7160
China - Dongguan
Tel: 86-769-8702-9880
Japan - Tokyo
Tel: 81-3-6880- 3770
China - Guangzhou
Tel: 86-20-8755-8029
Korea - Daegu
Tel: 82-53-744-4301
China - Hangzhou
Tel: 86-571-8792-8115
Korea - Seoul
Tel: 82-2-554-7200
China - Hong Kong SAR
Tel: 852-2943-5100
Malaysia - Kuala Lumpur
Tel: 60-3-7651-7906
China - Nanjing
Tel: 86-25-8473-2460
Malaysia - Penang
Tel: 60-4-227-8870
China - Qingdao
Tel: 86-532-8502-7355
Philippines - Manila
Tel: 63-2-634-9065
China - Shanghai
Tel: 86-21-3326-8000
Singapore
Tel: 65-6334-8870
China - Shenyang
Tel: 86-24-2334-2829
Taiwan - Hsin Chu
Tel: 886-3-577-8366
China - Shenzhen
Tel: 86-755-8864-2200
Taiwan - Kaohsiung
Tel: 886-7-213-7830
China - Suzhou
Tel: 86-186-6233-1526
Taiwan - Taipei
Tel: 886-2-2508-8600
China - Wuhan
Tel: 86-27-5980-5300
Thailand - Bangkok
Tel: 66-2-694-1351
China - Xian
Tel: 86-29-8833-7252
Vietnam - Ho Chi Minh
Tel: 84-28-5448-2100
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Austin, TX
Tel: 512-257-3370
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Novi, MI
Tel: 248-848-4000
Houston, TX
Tel: 281-894-5983
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Tel: 317-536-2380
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Tel: 951-273-7800
Raleigh, NC
Tel: 919-844-7510
New York, NY
Tel: 631-435-6000
San Jose, CA
Tel: 408-735-9110
Tel: 408-436-4270
Canada - Toronto
Tel: 905-695-1980
Fax: 905-695-2078
DS20006662A-page 28
China - Xiamen
Tel: 86-592-2388138
China - Zhuhai
Tel: 86-756-3210040
Denmark - Copenhagen
Tel: 45-4485-5910
Fax: 45-4485-2829
Finland - Espoo
Tel: 358-9-4520-820
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Germany - Garching
Tel: 49-8931-9700
Germany - Haan
Tel: 49-2129-3766400
Germany - Heilbronn
Tel: 49-7131-72400
Germany - Karlsruhe
Tel: 49-721-625370
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Germany - Rosenheim
Tel: 49-8031-354-560
Israel - Ra’anana
Tel: 972-9-744-7705
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Italy - Padova
Tel: 39-049-7625286
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Norway - Trondheim
Tel: 47-7288-4388
Poland - Warsaw
Tel: 48-22-3325737
Romania - Bucharest
Tel: 40-21-407-87-50
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Sweden - Gothenberg
Tel: 46-31-704-60-40
Sweden - Stockholm
Tel: 46-8-5090-4654
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
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09/14/21
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