MIC23603YML-T5

MIC23603 4 MHz PWM 6A Buck Regulator with HyperLight Load® Features General Description • • • • • • • • • The MIC23603 is a high-efficiency 4 MHz 6A synchronous buck regulator with HyperLight Load® mode. HyperLight Load provides very high efficiency at light loads and ultra-fast transient response which is perfectly suited for supplying processor core voltages. An additional benefit of this proprietary architecture is very low output ripple voltage throughout the entire load range with the use of small output capacitors. The tiny 4 mm x 5 mm DFN package saves precious board space and requires few external components. • • • • • • Input Voltage: 2.7V to 5.5V 6A Output Current Up to 93% Efficiency and 81% at 1 mA 24 µA Typical Quiescent Current 4 MHz PWM Operation in Continuous Mode Ultra-Fast Transient Response Power Good Programmable Soft-Start Low Voltage Output Ripple - 14 mVPP Ripple in HyperLight Load Mode - 5 mV Output Voltage Ripple in Full PWM Mode Fully Integrated MOSFET Switches 0.01 µA Shutdown Current Thermal Shutdown and Current Limit Protection Output Voltage as Low as 0.65V 20-pin 4 mm x 5 mm DFN –40°C to +125°C Junction Temperature Range Applications • • • • • • • 5V POL Supplies µC/µP, FPGA and DSP Power Test and Measurement Systems Barcode Readers Set-Top Box, Modems, and DTV Distributed Power Systems Networking Systems DS20005636A-page 1 The MIC23603 is designed for use with a very small inductor, down to 0.33 µH, and an output capacitor as small as 47 µF that enables a sub-1 mm height. The MIC23603 has a very low quiescent current of 24 µA and achieves as high as 81% efficiency at 1 mA. At higher loads, the MIC23603 provides a constant switching frequency around 4 MHz while achieving peak efficiencies up to 93%. The MIC23603 is available in 20-pin 4 mm x 5mm DFN package with an operating junction temperature range from –40°C to +125°C. Package Type MIC23603 4 mm x 5 mm DFN SW 1 20 SW SW 2 19 SW PVIN 3 18 PVIN PG 4 17 AVIN EN 5 16 AGND SNS 6 15 SS FB 7 14 PVIN AGND 8 13 PVIN SW 9 12 SW SW 10 11 SW PGND  2017 Microchip Technology Inc. MIC23603 Typical Application Circuit MIC23603 4 mm x 5 mm DFN MIC23603YML 2.7V to 5.5V VIN PVIN 0.33μH SW Ÿ SNS NŸ VOUT 1.8V AVIN 10μF 1μF 4mm x 5mm FB ON OFF VOUT NŸ EN SS 2.2nF PGND 47μF NŸ PG AGND GND GND ADJUSTABLE OUTPUT VOLTAGE Simplified Functional Block Diagram AVIN PVIN EN UVLO CONTROL LOGIC TIMER & SOFT-START REFERENCE GATE DRIVE ERROR COMPARATOR SS SW COMPARATOR ZERO-I ISENSE PGND SNS PG FB AGND DS20005636A-page 2  2017 Microchip Technology Inc. MIC23603 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings † Supply Voltage (VIN) ...................................................................................................................................................+6V Sense (VSNS) ..............................................................................................................................................................+6V Output Switch Voltage.................................................................................................................................................+6V Enable Input Voltage (VEN) ........................................................................................................................... –0.3V to VIN ESD Rating (Note 1) .................................................................................................................................. ESD Sensitive Operating Ratings †† Supply Voltage (VIN) ................................................................................................................................. +2.7V to +5.5V Enable Input Voltage (VEN) ................................................................................................................................ 0V to VIN Output Voltage Range (VSNS) ................................................................................................................. +0.65V to +3.6V † Notice: Exceeding absolute maximum rating may cause damage to the device. †† Notice: The device is not guaranteed to function outside its operating rating. Note 1: Devices are ESD sensitive. Handling precautions are recommended. Human body model, 1.5 kΩ in series with 100 pF. ELECTRICAL CHARACTERISTICS (Note 1) Electrical Characteristics: Unless otherwise indicated, TA = +25°C; VIN = VEN = 3.6V; VOUT = 1.8V; L = 0.33 µH; COUT = 47 µF x 2 unless otherwise specified. Bold values indicate –40°C ≤ TJ ≤ +125°C. Parameters Min. Typ. Max. Units Supply Voltage Range 2.7 — 5.5 V — Undervoltage Lockout Threshold 2.2 2.5 2.8 V Turn-on Undervoltage Lockout Hysteresis — 270 — mV — Quiescent Current — 24 45 µA IOUT = 0 mA, SNS > 1.2 × VOUT Nominal Shutdown Current — 0.01 5 µA VEN = 0V, VIN = 5.5V Feedback Voltage 0.605 0.62 0.636 V — 6.5 12 16 A SNS = 0.9 × VOUTNOM Current Limit Output Voltage Line Regulation — — 0.3 0.3 — — %/V % Output Voltage Load Regulation PWM Switch ON-Resistance Note 1: — 0.7 — — 0.03 — — 0.025 — % Ω Conditions VIN = 3.6V to 5.5V if VOUTNOM < 2.5V, ILOAD = 20 mA VIN = 4.5V to 5.5V if VOUTNOM ≥ 2.5V, ILOAD = 20 mA 20 mA < ILOAD < 500 mA, VIN = 3.6V if VOUTNOM < 2.5V 20 mA < ILOAD < 500 mA, VIN = 5.0V if VOUTNOM ≥ 2.5V 20 mA < ILOAD < 1A, VIN = 3.6V if VOUTNOM < 2.5V 20 mA < ILOAD < 1A, VIN = 5.0V if VOUTNOM ≥ 2.5V ISW = 1000 mA PMOS ISW = –1000 mA NMOS Specification for packaged product only.  2017 Microchip Technology Inc. DS20005636A-page 3 MIC23603 ELECTRICAL CHARACTERISTICS (CONTINUED)(Note 1) Electrical Characteristics: Unless otherwise indicated, TA = +25°C; VIN = VEN = 3.6V; VOUT = 1.8V; L = 0.33 µH; COUT = 47 µF x 2 unless otherwise specified. Bold values indicate –40°C ≤ TJ ≤ +125°C. Parameters Min. Typ. Max. Units Maximum Frequency — 4 — MHz Soft Start Time — 1200 — µs VOUT = 90%, CSS = 2.2 nF Power Good Threshold 85 90 95 % % of VNOMINAL Power Good Hysteresis — 20 — % — Power Good Pull Down — 200 mV Enable Threshold 0.4 0.8 1.2 V Turn-On Enable Input Current — 0.1 2 µA — Overtemperature Shutdown — 160 — C — Overtemperature Shutdown Hysteresis — 20 — C — Note 1: Conditions IOUT = 300 mA VSNS = 90% VNOMINAL, IPG = 1 mA Specification for packaged product only. DS20005636A-page 4  2017 Microchip Technology Inc. MIC23603 TEMPERATURE SPECIFICATIONS (Note 1) Parameters Sym. Min. Typ. Max. Units Conditions Junction Operating Temperature TJ –40 — +125 °C — Storage Temperature Range TA –65 — +150 °C — JA — 44.1 — °C/W — Temperature Ranges Package Thermal Resistances Thermal Resistance, 4 x 5 DFN-20Ld Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.  2017 Microchip Technology Inc. DS20005636A-page 5 MIC23603 2.0 TYPICAL PERFORMANCE CURVES The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Note: 100 1.220 VOUT = 3.3V 90 OUTPUT VOLTAGE (V) EFFICIENCY (%) 80 VOUT 70 60 50 40 30 VIN = 5V L = 0.33μH COUT = 2x47μF 20 10 0 0.0001 0.001 0.01 0.1 1 1.215 1.210 LOAD = 4A 1.205 LOAD = 1.5A 1.200 L = 0.33μH COUT = 2x47μF 1.195 1.190 10 2.5 3 3.5 OUTPUT CURRENT (A) FIGURE 2-1: Current. 4 4.5 5 5.5 INPUT VOLTAGE (V) Efficiency vs. Output FIGURE 2-4: Voltage. Output Voltage vs. Input 1.220 100 90 1.215 OUTPUT VOLTAGE (V) EFFICIENCY (%) 80 70 VIN = 3.6V 60 50 VIN = 5V VIN = 2.9V 40 30 L = 0.33μH COU T= 2x47μF 20 10 0 0.0001 1.210 LOAD = 100mA 1.205 1.200 LOAD = 10mA 1.195 L = 0.33μH COUT = 2x47μF 1.190 0.001 0.01 0.1 1 2.5 10 3 3.5 4 4.5 5 5.5 INPUT VOLTAGE (V) OUTPUT CURRENT (A) FIGURE 2-2: Efficiency vs. Output Current VOUT = 1.8V. FIGURE 2-5: Voltage. Output Voltage vs. Input 1.220 100 OUTPUT VOLTAGE (V) 90 EFFICIENCY (%) 80 70 60 VIN = 3.6V 50 40 VIN = 5V VIN = 2.9V 30 20 0 0.0001 0.001 0.01 0.1 1 1.210 1.205 1.200 1.195 L = 0.33μH COUT = 2x47μF 10 1.215 10 1.190 0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 OUTPUT CURRENT (A) OUTPUT CURRENT (A) FIGURE 2-3: Efficiency vs. Output Current VOUT = 1.2V. DS20005636A-page 6 VIN = 3.6V L = 0.33μH COUT = 2x47μF FIGURE 2-6: Current (HLL). Output Voltage vs Output  2017 Microchip Technology Inc. MIC23603 2.60 1.220 UVLO ON 2.50 1.210 UVLO (V) OUTPUT VOLTAGE (V) 1.215 1.205 1.200 1.195 2.40 UVLO OFF 2.30 2.20 1.190 VIN = 3.6V L = 0.33μH COUT = 2x47μF 1.185 2.10 1.180 2.00 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 -40 -20 0 OUTPUT CURRENT (A) FIGURE 2-7: Current (CCM). Output Voltage vs Output FIGURE 2-10: Temperature. 40 60 80 100 120 Undervoltage Lockout vs. 45 PG RISING 40 0.95 ENABLE ON 0.90 35 PG DELAY (μs) ENABLE THRESHOLD (V) 1.00 0.85 0.80 ENABLE OFF 0.75 0.70 30 25 20 PG FALLING 15 10 VOUT = 1.2V LOAD = 150mA 0.65 VOUT = 1.2V 5 0.60 0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 2.5 3 FIGURE 2-8: Voltage. 3.5 4 4.5 5 5.5 INPUT VOLTAGE (V) INPUT VOLTAGE (V) Enable Thresholds vs. Input FIGURE 2-11: Input Voltage. PGOOD Delay Time vs. 95 1.00 PG RISING 0.95 PGOOD THRESHOLDS (%) ENABLE THRESHOLD (V) 20 TEMPERATURE (°C) 0.90 TURN ON 0.85 0.80 0.75 VIN = 3.6V VOUT = 1.2V LOAD = 150mA 0.70 0.65 TURN OFF 90 85 80 75 PG FALLING 70 VOUT = 1.2V 65 0.60 -40 -20 0 20 40 60 80 100 120 2.5 FIGURE 2-9: Temperature. Enable Thresholds vs.  2017 Microchip Technology Inc. 3 3.5 4 4.5 5 5.5 INPUT VOLTAGE (V) TEMPERATURE (°C) FIGURE 2-12: Input Voltage. PGOOD Thresholds vs. DS20005636A-page 7 MIC23603 25 1000000 24 23 QUIESCENT (μA) RISE TIME (μs) 100000 10000 1000 100 22 21 20 19 18 VOUT = 1.8V L = 0.33μH COUT = 2x47μF 17 10 16 VIN = 3.6V 15 1 1000 10000 100000 2.5 1000000 3.0 FIGURE 2-13: 3.5 VOUT Rise Time vs. CSS. FIGURE 2-16: Voltage. 4.5 5.0 5.5 Quiescent Current vs. Input 10000 1.210 1.208 VIN = 2.9V 1000 1.206 FREQUENCY (kHz) OUTPUT VOLTAGE (V) 4.0 INPUT VOLTAGE (V) CSS (pF) 1.204 1.202 1.200 1.198 1.196 100 1 VIN = 3.6 V LOAD = 20mA 1.194 VIN = 3.6V 10 VIN=5V VOUT = 1.8V L = 0.33μH COUT = 2x47μF 1.192 0.1 0.0001 1.190 -40 -20 0 20 40 60 80 100 120 TEMPERATURE (°C) FIGURE 2-14: Temperature. FIGURE 2-17: Load Current. Output Voltage vs. 0.01 0.1 1 10 LOAD CURRENT (A) Switching Frequency vs. 13 0.65 12 0.64 CURRENT LIMIT (A) FEEDBACK VOLTAGE (V) 0.001 0.63 0.62 0.61 11 10 9 8 VOUT = 1.8V 7 0.60 VOUT = 1.2V 6 0.59 -40 -20 0 20 40 60 80 100 120 2.5 DS20005636A-page 8 Feedback Voltage vs. 3.5 4.0 4.5 5.0 5.5 INPUT VOLTAGE (V) TEMPERATURE (°C) FIGURE 2-15: Temperature. 3.0 FIGURE 2-18: Voltage. Current Limit vs. Input  2017 Microchip Technology Inc. MIC23603 MAX OUPUT CURRENT (A) 6.50 6.00 IIN (5A/div) 1 VOUT (1V/div) 2 5.50 5.00 4.50 VIN = 3.6V VOUT = 1.8V 4.00 VIN (2V/div) 3.50 20 40 60 80 100 120 L = 0.33μH COUT = 2x47μF VOUT = 1.8V 3 140 Time (50μs/div) AMBIENT TEMPERATURE (°C) FIGURE 2-19: Maximum Output Current vs. Ambient Temperature. IIN (500mA/div) 1 VOUT (1V/div) 2 PGOOD (1V/div) ENABLE (2V/div) 3 PGOOD (1V/div) ENABLE (2V/div) VOUT (AC-COUPLED) (20mV/div) 1 IOUT (100mA/div) 2 Hot Plug Input Current. L = 0.33μH COUT = 2x47μF VOUT = 1.8V 4 Time (500μs/div) FIGURE 2-20: IIND (1A/div) VOUT (1V/div) VIN = 3.6V L = 0.33μH COUT = 2x47μF LOAD = 1.5A FIGURE 2-22: Turn-On Input Current. Time (20μs/div) FIGURE 2-23: 200 mA. VOUT (AC-COUPLED) (20mV/div) 1 IOUT (500mA/div) 2 Load Transmit 10 mA to L = 0.33μH COUT = 2x47μF VOUT = 1.8V 1 2 VIN = 3.6V L = 0.33μH COUT = 2x47μF LOAD = 1.5A 3 4 FIGURE 2-21: Time (500μs/div) Start-Up Inductor Current.  2017 Microchip Technology Inc. Time (20μs/div) FIGURE 2-24: 500 mA. Load Transmit 10 mA to DS20005636A-page 9 MIC23603 VOUT (AC-COUPLED) (20mV/div) 1 VOUT (AC-COUPLED) (50mV/div) 1 IOUT (500mA/div) 2 L = 0.33μH COUT = 2x47μF VOUT = 1.8V L = 0.33μH COUT = 2x47μF VOUT = 1.8V IOUT (500mA/div) 2 Time (20μs/div) Time (20μs/div) FIGURE 2-25: VOUT (AC-COUPLED) (50mV/div) Load Transient 50 mA to 1A. 1 L = 0.33μH COUT = 2x47μF VOUT = 1.8V IOUT (1A/div) 2 FIGURE 2-28: 1A. VOUT (AC-COUPLED) (50mV/div) 1 IOUT (1A/div) 2 Load Transient 200 mA to L = 0.33μH COUT = 2x47μF VOUT = 1.8V Time (20μs/div) FIGURE 2-26: Time (20μs/div) Load Transient 50 mA to 2A. FIGURE 2-29: 3A. VOUT (AC-COUPLED) (50mV/div) IOUT (200mA/div) Load Transient 200 mA to 1 L = 0.33μH COUT = 2x47μF VOUT = 1.8V VOUT (AC-COUPLED) (50mV/div) 1 IOUT (2A/div) 2 L = 0.33μH COUT = 2x47μF VOUT = 1.8V 2 Time (20μs/div) FIGURE 2-27: 600 mA. Load Transient 200 mA to Time (50μs/div) FIGURE 2-30: 6A. DS20005636A-page 10 Load Transient 200 mA to  2017 Microchip Technology Inc. MIC23603 L = 0.33μH COUT = 2x47μF VOUT = 1.8V VOUT (AC-COUPLED) (50mV/div) VIN (1V/div) (3.6V OFFSET) VOUT (20mV/div) (AC-COUPLED) 1 VSW (2V/div) 2 1 5V 2 L = 0.33μH COUT = 2x47μF 3.6V IIND (1A/div) 3 Time (500μs/div) FIGURE 2-31: Load. Time (50μs/div) Line Transient 100 mA L = 0.33μH COUT = 2x47μF VOUT = 1.8V VOUT (AC-COUPLED) (50mV/div) VIN (1V/div) (3.6V OFFSET) FIGURE 2-34: Switching Waveform Discontinuous Mode (10 mA). VOUT (20mV/div) (AC-COUPLED) 1 VSW (2V/div) 2 1 5V L = 0.33μH COUT = 2x47μF 3.6V 2 IIND (1A/div) 3 Time (500μs/div) FIGURE 2-32: VOUT (20mV/div) (AC-COUPLED) Time (10μs/div) Line Transient 6A Load. 1 FIGURE 2-35: Switching Waveform Discontinuous Mode (50 mA). VOUT (20mV/div) (AC-COUPLED) 1 VSW (2V/div) 2 IIND (1A/div) 3 L = 0.33μH COUT = 2x47μF VSW (2V/div) 2 IIND (1A/div) 3 Time (200μs/div) FIGURE 2-33: Switching Waveform Discontinuous Mode (1 mA).  2017 Microchip Technology Inc. L = 0.33μH COUT = 2x47μF Time (200ns/div) FIGURE 2-36: Switching Waveform Continuous Mode (800 mA). DS20005636A-page 11 MIC23603 VOUT (20mV/div) (AC-COUPLED) 1 VSW (2V/div) 2 IIND (1A/div) 3 L = 0.33μH COUT = 2x47μF Time (200ns/div) FIGURE 2-37: Switching Waveform Continuous Mode (2A). DS20005636A-page 12  2017 Microchip Technology Inc. MIC23603 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE Pin Number Pin Name 1, 2, 9, 10, 11, 12, 19, 20 SW Switch output. Internal power MOSFET output switches. 3, 13, 14, 18 PVIN Input voltage. Connect a capacitor to ground to decouple the noise. 4 PG Power good. Connect an external resistor to a voltage source to supply a power good indicator. 5 EN Enable input. Logic high enables operation of the regulator. Logic low shuts down the device. Do not leave floating. 6 SNS 7 FB Feedback input. Connect an external divider between VOUT and ground to program the output voltage. 8,16 AGND Analog ground. Connect to central ground point where all high current paths meet (CIN, COUT, PGND) for best operation. 15 SS Soft Start. Place a capacitor from this pin to ground to program the soft start time. Do not leave floating, 2.2 nF minimum CSS is required. 17 AVIN EP PGND  2017 Microchip Technology Inc. Description Sense input. Connect to VOUT as close to output capacitor as possible to sense output voltage. Supply voltage. Analog control circuitry. Connect to VIN through a 10Ω resistor. Power Ground. DS20005636A-page 13 MIC23603 4.0 FUNCTIONAL DESCRIPTION 4.1 PVIN The input supply (PVIN) provides power to the internal MOSFETs for the switch mode regulator and the driver circuitry. The PVIN operating range is 2.7V to 5.5V, so an input capacitor, with a minimum voltage rating of 6.3V, is recommended. Because of the high switching speed, a minimum 10 µF bypass capacitor placed close to VIN and the power ground (PGND) pin is required. 4.2 AVIN Analog VIN (AVIN) provides power to the internal control and analog circuitry. AVIN and PVIN must be tied together through a 10Ω resistor to minimize noise coupling from PVIN. Consider the layout carefully to reduce high frequency switching noise caused by VIN before reaching AVIN. Place a 1 µF capacitor as close to AVIN as possible. 4.7 AGND The analog ground (AGND) is the ground path for the biasing and control circuitry. The current loop for the signal ground should be separate from the power ground (PGND) loop. Placing a 3Ω resistor between AGND and PGND reduces ground noise. 4.8 PGND The power ground pin is the ground return path for the inductor current during the freewheeling stage. The current loop for the power ground should be as small as possible and separate from the analog ground (AGND) loop as applicable. 4.9 SS The soft-start (SS) pin is used to control the output voltage ramp up time. The approximate equation for the ramp time in seconds is: EQUATION 4-1: 3 4.3 A logic high signal on the enable pin activates the device’s output voltage. A logic low signal on the enable pin deactivates the output and reduces supply current to 0.01 µA. The MIC23603 features built-in soft-start circuitry that reduces inrush current and prevents the output voltage from overshooting at start-up. Do not leave EN floating. 4.4 SW The switch (SW) connects directly to one end of the inductor and provides the current path during switching cycles. The other end of the inductor is connected to the load, SNS pin, and output capacitor. Because of the high speed switching on this pin, route the switch node away from sensitive nodes whenever possible. 4.5 For example, for CSS = 2.2 nF, TRISE ~ 1.26 ms. See the Typical Performance Curves for a graphical guide. The minimum recommended value for CSS is 2.2 nF. 4.10 FB The feedback (FB) pin is provided for the adjustable voltage option (no internal connection for fixed options). This is the control input for programming the output voltage. A resistor divider network is connected to this pin from the output and is compared to the internal 0.62V reference within the regulation loop. Use Equation 4-2 to program the output voltage between 0.65V and 3.6V: EQUATION 4-2: SNS The sense (SNS) pin is connected to the device’s output to provide feedback to the control circuitry. Place the SNS connection close to the output capacitor. 4.6 250  10  L  10   C SS EN PG The power good (PG) pin is an open-drain output that indicates logic high when the output voltage is typically above 90% of its steady state voltage. A pull-up resistor of more than 5 kΩ should be connected from PG to VOUT. DS20005636A-page 14 Where: TABLE 4-1: V OUT = V REF   1 + R3 -------  R4 R3 is the top resistor, R4 is the bottom resistor. EXAMPLE FEEDBACK RESISTOR VALUES VOUT R3 R4 1.2V 274 kΩ 294 kΩ 1.5V 316 kΩ 221 kΩ 1.8V 560 kΩ 294 kΩ 2.5V 324 kΩ 107 kΩ 3.3V 464 kΩ 107 kΩ  2017 Microchip Technology Inc. MIC23603 5.0 APPLICATION INFORMATION The MIC23603 is a high-performance DC/DC step-down regulator offering a small solution size. Because it supports an output current up to 6A inside a tiny 4 mm x 5 mm DFN package and requires only three external components, the MIC23603 meets today’s miniature portable electronic device needs. Using the HyperLight Load switching scheme, the MIC23603 maintains high efficiency throughout the entire load range while providing ultra-fast load transient response. The following sections provide additional device application information. 5.1 Input Capacitor Place a 10 µF ceramic capacitor or greater close to the VIN pin and PGND/GND pin for bypassing. The TDK C1608X5R0J106K, size 0603, 10 µF ceramic capacitor is recommended based upon performance, size, and cost. An X5R or X7R temperature rating is recommended for the input capacitor. Y5V temperature rating capacitors, aside from losing most of their capacitance over temperature, can also become resistive at high frequencies. This reduces their ability to filter out high frequency noise. 5.2 Output Capacitor The MIC23603 was designed for use with a 47 µF or greater ceramic output capacitor. Increasing the output capacitance lowers output ripple and improves load transient response, but could increase solution size or cost. A low equivalent series resistance (ESR) ceramic output capacitor such as the TDK C3216X6S1A476M, size 1206, 47 µF ceramic capacitor is recommended based upon performance, size and cost. Both the X7R or X5R temperature rating capacitors are recommended. The Y5V and Z5U temperature rating capacitors are not recommended because of their wide variation in capacitance over temperature and increased resistance at high frequencies. 5.3 Inductor Selection When selecting an inductor, consider the following factors (not necessarily in order of importance): • • • • Inductance Rated current value Size requirements DC resistance (DCR) The MIC23603 was designed for use with a 0.33 µH to 1 µH inductor. For faster transient response, a 0.33 µH inductor yields the best result. For lower output ripple, a 1 µH inductor is recommended. Maximum current ratings of the inductor are generally given in two methods: permissible DC current and saturation current. Permissible DC current can be rated  2017 Microchip Technology Inc. either for a 40°C temperature rise or a 10% to 20% loss in inductance. Make sure that the inductor selected can handle the maximum operating current. When saturation current is specified, make sure that there is enough margin so that the peak current does not cause the inductor to saturate. Peak current can be calculated using Equation 5-1. EQUATION 5-1: 1 – V OUT  V IN I PEAK = I OUT + V OUT  ----------------------------------- 2fL As Equation 5-1 shows, the peak inductor current is inversely proportional to the switching frequency and the inductance; the lower the switching frequency or the inductance, the higher the peak current. As input voltage increases, the peak current also increases. The size of the inductor depends on the requirements of the application. DC resistance (DCR) is also important. While DCR is inversely proportional to size, it can represent a significant efficiency loss. See Efficiency Considerations for information. 5.4 Compensation The MIC23603 is designed to be stable with a 0.33 µH to 1 µH inductor with a minimum of 47 µF ceramic (X5R) output capacitor. A feed-forward capacitor (CFF) in the range of 33 pF to 68 pF is recommended across the top feedback resistor to reduce the effects of parasitic capacitance and improve transient performance. 5.5 Duty Cycle The typical maximum duty cycle of the MIC23603 is 80%. 5.6 Efficiency Considerations Efficiency is defined as the amount of useful output power, divided by the amount of power supplied. EQUATION 5-2: V OUT  I OUT Efficiency =  --------------------------------  100  V IN  I IN  Maintaining high efficiency serves two purposes. It reduces power dissipation in the power supply, reducing the need for heat sinks and thermal design considerations, and it reduces current consumption for battery powered applications. Reduced current draw from a battery increases the device’s operating time and is critical in hand-held devices. DS20005636A-page 15 MIC23603 There are two types of losses in switching converters: DC losses and switching losses. DC losses are simply the power dissipation of I2R. Power is dissipated in the high side switch during the on cycle. Power loss is equal to the high side MOSFET RDSON multiplied by the switch current squared. During the off cycle, the low side N channel MOSFET conducts, also dissipating power. Device operating current also reduces efficiency. The product of the quiescent (operating) current and the supply voltage represents another DC loss. The current needed to drive the gates on and off at a constant 4 MHz frequency and the switching transitions make up the switching losses. 100 90 EFFICIENCY (%) 80 70 60 50 40 30 VIN = 5V L = 0.33μH COUT = 2x47μF 10 0 0.0001 0.001 0.01 0.1 1 10 OUTPUT CURRENT (A) FIGURE 5-1: Efficiency Under Load. Figure 5-1 shows an efficiency curve, from no load to 300 mA. Efficiency losses are dominated by quiescent current losses, gate drive, and transition losses. By using the HyperLight Load mode, the MIC23603 can maintain high efficiency at low output currents. Over 300 mA, efficiency loss is dominated by MOSFET RDSON and inductor losses. Higher input supply voltages will increase the gate-to-source drive voltage on the internal MOSFETs, which reduces the internal RDSON. This improves efficiency by reducing DC losses in the device. All but the inductor losses are inherent to the device. In this case, inductor selection becomes increasingly critical in efficiency calculations. As the inductors get smaller, the DC resistance (DCR) can become quite significant. The DCR losses can be calculated in Equation 5-3. EQUATION 5-3: 2 P DCR = I OUT  DCR From that, the loss in efficiency due to inductor resistance can be calculated Equation 5-5. DS20005636A-page 16 V OUT  I OUT Efficiency Loss = 1 –  ----------------------------------------------------  100  V OUT  I OUT + P DCR Efficiency loss caused by DCR is minimal at light loads and gains significance as the load is increased. Inductor selection becomes a trade-off between efficiency and size. 5.7 Efficiency vs. Output Current VOUT = 2.5V 20 EQUATION 5-4: HyperLight Load Mode MIC23603 uses a minimum on and off time proprietary control loop. When the output voltage falls below the regulation threshold, the error comparator begins a switching cycle that turns the PMOS on and keeps it on for the duration of the minimum-on-time. This increases the output voltage. If the output voltage is over the regulation threshold, then the error comparator turns the PMOS off for a minimum-off-time until the output drops below the threshold. The NMOS acts as an ideal rectifier that conducts when the PMOS is off. Using an NMOS switch instead of a diode allows for lower voltage drop across the switching device when it is on. The asynchronous switching combination between the PMOS and the NMOS allows the control loop to work in discontinuous mode for light load operations. In discontinuous mode, the MIC23603 works in pulse frequency modulation (PFM) to regulate the output. As the output current increases, the off-time decreases, which provides more energy to the output. This switching scheme improves the efficiency of MIC23603 during light load currents by switching only when needed. As the load current increases, the MIC23603 goes into continuous conduction mode (CCM) and switches at a frequency centered at 4 MHz. The load when the MIC23603 goes into continuous conduction mode may be approximated by the formula in Equation 5-5. EQUATION 5-5:  V IN – V OUT   D I LOAD   -------------------------------------------- 2L  f As shown in the previous equation, the load at which MIC23603 transitions from HyperLight Load mode to PWM mode is a function of the input voltage (VIN), output voltage (VOUT), duty cycle (D), inductance (L), and frequency (f). As shown in Figure 5-2, as the Output Current increases, the switching frequency also increases, until the MIC23603 goes from HyperLight Load mode to PWM mode at approximately 300 mA. The MIC23603 switches a relatively constant frequency around 4 MHz after the output current is over 300 mA.  2017 Microchip Technology Inc. MIC23603 Switching Frequency vs. Load Current 10000 VIN = 2.9V FREQUENCY (kHz) 1000 100 VIN = 3.6V 10 1 VIN=5V 0.1 0.0001 0.001 0.01 VOUT = 1.8V L = 0.33μH COUT = 2x47μF 0.1 1 10 LOAD CURRENT (A) FIGURE 5-2: Current. SW Frequency vs. Load  2017 Microchip Technology Inc. DS20005636A-page 17 MIC23603 6.0 PACKAGING INFORMATION 6.1 Package Marking Information 20-lead DFN* XXXXX XXX YYWW Legend: XX...X Y YY WW NNN e3 * Example 23603 YML 1215 Product code or customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC® designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. ●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle mark). Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. Package may or may not include the corporate logo. Underbar (_) symbol may not be to scale. DS20005636A-page 18  2017 Microchip Technology Inc. MIC23603 20-Lead 4.0 mm x 5.0 mm DFN Package Outline and Recommended Land Pattern Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging.  2017 Microchip Technology Inc. DS20005636A-page 19 MIC23603 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging. DS20005636A-page 20  2017 Microchip Technology Inc. MIC23603 APPENDIX A: REVISION HISTORY Revision A (July 2017) • Converted Micrel document MIC23603 to Microchip data sheet template DS2005636A. • Minor text changes throughout.  2017 Microchip Technology Inc. DS20005636A-page 21 MIC23603 NOTES: DS20005636A-page 22  2017 Microchip Technology Inc. MIC23603 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office. Device: PART NO. X Device Junction Temperature Range MIC23603: XX Package a) MIC23603YML: 4 MHz PWM 6A Buck Regulator with HyperLight Load®, –40°C to +85°C (Pb-Free), 20-lead 4 mm x 5 mm DFN 4 MHz PWM 6A Buck Regulator with HyperLight Load® Junction Temperature Range: Y = –40C to +85C (Pb-Free) Packages: ML = 20-lead 4 mm x 5 mm DFN Note 1: Examples: 1.DFN is GREEN RoHS-compliant package. Lead finish is NiPdAu. Mold compound is Halogen Free.  2017 Microchip Technology Inc. DS20005636A-page 23 MIC23603 NOTES: DS20005636A-page 24  2017 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV Trademarks The Microchip name and logo, the Microchip logo, AnyRate, AVR, AVR logo, AVR Freaks, BeaconThings, BitCloud, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KEELOQ, KEELOQ logo, Kleer, LANCheck, LINK MD, maXStylus, maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip Designer, QTouch, RightTouch, SAM-BA, SpyNIC, SST, SST Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. ClockWorks, The Embedded Control Solutions Company, EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS, mTouch, Precision Edge, and Quiet-Wire are registered trademarks of Microchip Technology Incorporated in the U.S.A. Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo, CodeGuard, CryptoAuthentication, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, Mindi, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PureSilicon, QMatrix, RightTouch logo, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2017, Microchip Technology Incorporated, All Rights Reserved. ISBN: 978-1-5224-1961-7 == ISO/TS 16949 ==  2017 Microchip Technology Inc. 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