MIC2810-4LSYML-TR

MIC2810 Digital Power Management IC 2 MHz, 600 mA DC/DC with Dual 300 mA/300 mA Low VIN LDOs Features General Description • • • • • The MIC2810 is a high performance power management IC, featuring three output voltages with independent enable control: a 2 MHz DC/DC converter and two 300 mA LDOs. The MIC2810 features a LOWQ mode, reducing the total current draw while in this mode to less than 30 µA. In LOWQ mode, the output noise of the DC/DC converter is 53 µVRMS, significantly lower than other converters that use a PFM light load mode that can interfere with sensitive RF circuitry.  2017 - 2022 Microchip Technology Inc. and its subsidiaries. Pin 15 Pin 14 Pin 13 EN EN1 CSET SGND VIN1 Pin 10 PGND LDO Pin 9 Pin 3 Pin 4 LDO2 Pin 11 BIAS Pin 8 LDO1 Pin 2 VIN2 Embedded MPU and MCU Power Portable and Wearable Applications Low-Power RF Systems Backup Power Systems Pin 12 LOWQ Pin 7 • • • • POR Pin 1 VIN Applications Pin 6 • MIC2810 16-Lead 3 mm x 3 mm QFN Pin 16 • • • Package Type EN2 • The LDOs operate with very small ceramic output capacitors for stability, therefore, reducing required board space and component cost. It is available in various output voltage options in the 16-pin 3 mm x 3 mm QFN leadless package. SW • The DC/DC converter uses small values of L and C to reduce board space but still retains high efficiency over a wide load range, while supporting load currents up to 600 mA. Pin 5 • 2.7V to 5.5V Input Voltage Range 2 MHz DC/DC Converter and Two LDOs Integrated Power-on Reset (POR) Adjustable POR Delay Time LOWQ Mode - 30 µA Total IQ When in LOWQ Mode DC/DC Converter - Up to 600 mA of Output Current in PWM Mode - LOWQ Mode: No Ripple Light Load Mode - 53 µVRMS Output Noise in LOWQ Mode - 2 MHz PWM Mode Operation - >90% Efficiency LDO1 - 1.65V to 5.5V Input Voltage Range - 300 mA Output Current - Output Voltage Down to 0.8V LDO2 - 2.7V to 5.5V Input Voltage Range - 300 mA Output Current - Output Voltage Down to 0.8V Thermal Shutdown Protection Current-Limit Protection Simple, Leakage-Free Interfacing to Host MPU in Applications with Backup Power Tiny 16-Pin 3 mm x 3 mm QFN Package DS20005910B-page 1 MIC2810 Typical Application Circuit (simplified) Functional Diagram VIN SW BIAS DC/DC LDO LDO1 LDO1 LDO2 LDO2 EN /LOWQ VIN1 EN1 VIN2 EN2 REFERENCE AND QUICK START PGND DS20005910B-page 2 SGND POR LOGIC POR CSET  2017 - 2022 Microchip Technology Inc. and its subsidiaries. MIC2810 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings † Supply Voltage (VIN, VIN1, VIN2)..................................................................................................................... 0V to +6.0V Enable Input Voltage (VEN, VEN1, VEN2)..............................................................................................................0V to VIN Power Dissipation (Note 1) .................................................................................................................... Internally Limited ESD Rating (Note 2) .................................................................................................................................................. 2 kV Operating Ratings ‡ Supply Voltage (VIN, VIN2)......................................................................................................................... +2.7V to +5.5V Supply Voltage (VIN1).............................................................................................................................. +1.65V to +5.5V Enable Input Voltage (VEN, VEN1, VEN2)........................................................................................................... 0V to +VIN † Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended periods may affect device reliability. ‡ Notice: The device is not guaranteed to function outside its operating ratings. 1: The maximum allowable power dissipation of any TA (ambient temperature) is PD(max) = (TJ(max) – TA) / θJA. Exceeding the maximum allowable power dissipation will result in excessive die temperature, and the regulator will go into thermal shutdown. 2: Devices are ESD sensitive. Handling precautions recommended. Human body model, 1.5 kΩ in series with 100 pF.  2017 - 2022 Microchip Technology Inc. and its subsidiaries. DS20005910B-page 3 MIC2810 ELECTRICAL CHARACTERISTICS (Note 1) Electrical Characteristics: VIN = EN1 = EN2 = LOWQ = VOUT (Note 2) + 1V; COUTDC/DC = 2.2 µF, CLDO1 = CLDO2 = 2.2 µF; IOUTDC/DC = 100 mA; IOUTLDO1 = IOUTLDO2 = 100 µA; TJ = 25°C, bold values indicate –40°C ≤ TJ ≤ +125°C; unless noted. Parameter Symbol Min. Typ. Max. UVLO Threshold UVLOTH 2.45 2.55 2.65 V UVLO Hysteresis UVLOHYS — 100 — mV — 800 1100 — 55 85 — — 95 — 0.2 5 — 30 60 — — 80 — 20 70 TSD — 160 — °C — TSDHYS — 23 — °C — — — 0.2 V Logic Low 1.0 — — V Logic High — 0.1 1 µA — 0.1 1 VIL ≤ 0.2V µA VIH ≥ 1.0V Ground Pin Current Ground Pin Current in Shutdown Ground Pin Current (LOWQ mode) Overtemperature Shutdown Overtemperature Shutdown Hysteresis IGND IGND_SHDN IGND_LOWQ Units Conditions Rising input voltage during turn-on — VFB = GND (not switching) µA LDO1 or LDO2 (EN = GND; EN1 or EN2 = GND) µA EN = EN1 = EN2 = 0V µA All channels on, IDC/DC = ILDO1 = ILDO2 = 0 mA (LOWQ = GND) LDO1 or LDO2 (EN = GND; EN1 or EN2 = GND); IOUT = 0 mA (LOWQ = GND) Enable Inputs (EN; EN1; EN2; LOWQ) Enable Input Voltage Enable Input Current VIH VIL IENLK Turn-on Time Turn-on Time (LDO1 and LDO2) tTURN-ON — 240 500 µs — Turn-on Time (DC/DC) tTURN-ON — 83 350 µs (LOWQ = VIN; ILOAD = 300 mA); (LOWQ = GND; ILOAD = 10 mA) POR Threshold Voltage, Falling VTHLOW_POR 90 91 — % Low Threshold, % of nominal (VDC/DC or VLDO1 or VLDO2) (Flag ON) POR Threshold Voltage, Rising VTHIGH_POR — 96 99 % High Threshold, % of nominal (VDC/DC and VLDO1 and VLDO2) (Flag OFF) VOL VOLPOR — 10 100 mV POR Output Logic Low Voltage; IL = 250 µA IPOR ILEAKPOR — 0.01 1 µA Flag Leakage Current, Flag OFF ISET 0.75 1.25 1.75 µA VSET = 0V VTHSET — 1.25 — V POR = High POR Output SET INPUT SET Pin Current Source SET Pin Threshold Voltage Note 1: 2: Specification for packaged product only. VOUT denotes the highest of the three output voltages of DC/DC, LDO1 and LDO2. DS20005910B-page 4  2017 - 2022 Microchip Technology Inc. and its subsidiaries. MIC2810 ELECTRICAL CHARACTERISTICS - DC/DC CONVERTER Electrical Characteristics: VIN = VOUTDC/DC + 1V; EN1 = VIN; EN2 = GND; IOUTDC/DC = 100 mA; L = 2.2 µH; COUTDC/DC = 2.2 µF; TJ = 25°C, bold values indicate –40°C to + 125°C; unless noted. Parameter Symbol Min. Typ. Max. –2 — 2 –3 — 3 Units Conditions LOWQ = High (Full Power Mode) Output Voltage Accuracy VOUT % Nominal VOUT tolerance VOUT > 2.4V; VIN = VOUT + 300 mV to 5.5V, ILOAD= 100 mA VOUT < 2.4V; VIN = 2.7V to 5.5V, ILOAD= 100 mA Output Voltage Line Regulation (∆VOUT/VOUT) /∆VIN — 0.2 — %/V Output Voltage Load Regulation ∆VOUT/VOUT — 0.1 — % 20 mA < ILOAD < 600 mA Maximum Duty Cycle DCMAX 100 — — % VFB ≤ 0.4V — 0.5 — Ω ISW = 150 mA, VFB = 0.7VFB_NOM PMOS — 0.6 — Ω ISW = –150 mA, VFB = 1.1VFB_NOM NMOS PWM Switch ON-Resistance — Oscillator Frequency fosc 1.8 2 2.2 MHz Current Limit in PWM Mode — 0.75 1 1.6 A –2 — 2 –3 — 3 — VFB = 0.9 * VNOM LOWQ = Low (Light Load Mode) Output Voltage Accuracy VOUT Line Regulation (∆VOUT/VOUT) /∆VIN — 0.02 0.3 — — 0.6 Load Regulation ∆VOUT/VOUT — 0.4 1.5 Ripple Rejection Current Limit Output Voltage Noise % Variation from nominal VOUT Variation from nominal VOUT; –40°C to +125°C %/V VIN = VOUT + 1V to 5.5V; IOUT = 100 µA % IOUT = 100 µA to 50 mA PSRR — 45 — dB f = up to 1 kHz ILIM_LOWQ 80 120 190 mA VOUT = 0V VN — 53 — µVRMS 10 Hz to 100 kHz ELECTRICAL CHARACTERISTICS - LDO1/LDO2 Electrical Characteristics: VIN1 = VIN2 = VOUTLDO1 + 1.0V or VIN1 = VIN2 = VOUTLDO2 + 1.0V; EN = GND; EN1 = EN2 = VIN1 = VIN2; CLDO1 = CLDO2 = 2.2 µF; IOUTLDO1 = 100 µA; TJ = 25°C, bold values indicate –40°C ≤ TJ ≤ +125°C; unless noted. Parameter Symbol Min. Typ. Max. –2 — 2 Units Conditions LOWQ = High (Full Power Mode) Output Voltage Accuracy VOUT Line Regulation — Load Regulation ∆VOUT/VOUT –3 — 3 — 0.02 0.3 — — 0.6 — 0.20 — — 0.25 — — 0.40 1.5  2017 - 2022 Microchip Technology Inc. and its subsidiaries. % %/V Variation from nominal VOUT Variation from nominal VOUT; –40°C to +125°C VIN = VOUT +1V to 5.5V IOUT = 100 µA to 150 mA % IOUT = 100 µA to 200 mA IOUT = 100 µA to 300 mA DS20005910B-page 5 MIC2810 ELECTRICAL CHARACTERISTICS - LDO1/LDO2 (CONTINUED) Electrical Characteristics: VIN1 = VIN2 = VOUTLDO1 + 1.0V or VIN1 = VIN2 = VOUTLDO2 + 1.0V; EN = GND; EN1 = EN2 = VIN1 = VIN2; CLDO1 = CLDO2 = 2.2 µF; IOUTLDO1 = 100 µA; TJ = 25°C, bold values indicate –40°C ≤ TJ ≤ +125°C; unless noted. Parameter Symbol Min. Typ. Max. — 70 — Dropout Voltage VDO — 94 — — 142 300 Ripple Rejection PSRR — 35 — Current Limit ILIM 400 600 Output Voltage Noise VN — 91 –3 — 3 VOUT Line Regulation — Load Regulation ∆VOUT/VOUT –4 — mA VOUT = 0V µVRMS 0.3 0.6 — 0.2 1.0 — 22 35 — — 50 50 85 PSRR — 35 Ripple Rejection DS20005910B-page 6 4 — ILIM IOUT = 300 mA — 0.02 Current Limit IOUT = 200 mA 850 — VDO IOUT = 150 mA mV f = up to 1 kHz — Dropout Voltage Conditions dB LOWQ = Low (Light Load Mode) Output Voltage Accuracy Units % 10 Hz to 100 kHz Variation from nominal VOUT Variation from nominal VOUT; –40°C to +125°C %/V VIN = VOUT +1V to 5.5V % IOUT = 100 µA to 10 mA mV IOUT = 10 mA 125 mA VIN = 2.7V; VOUT = 0V — dB f = up to 1 kHz  2017 - 2022 Microchip Technology Inc. and its subsidiaries. MIC2810 TEMPERATURE SPECIFICATIONS (Note 1) Parameters Sym. Min. Typ. Max. Units Conditions TS –65 — +150 °C — Temperature Ranges Storage Temperature Range Lead Temperature — — — +260 °C Soldering, 10 sec. Junction Temperature TJ –40 — +125 °C — θJA — 56 — °C/W — Package Thermal Resistance 16-Ld QFN Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.  2017 - 2022 Microchip Technology Inc. and its subsidiaries. DS20005910B-page 7 MIC2810 2.0 Note: TYPICAL PERFORMANCE CURVES The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. For this page only, DC/DC Normal Mode (LOWQ = VIN) FIGURE 2-1: 1.2VOUT Efficiency. FIGURE 2-4: Load Regulation. FIGURE 2-2: Input Voltage. Switching Frequency vs. FIGURE 2-5: Line Regulation. FIGURE 2-3: Temperature. Switching Frequency vs. FIGURE 2-6: Voltage. Current Limit vs. Input DS20005910B-page 8  2017 - 2022 Microchip Technology Inc. and its subsidiaries. MIC2810 For this page only, DC/DC LOWQ Mode (LOWQ = GND) FIGURE 2-7: Ratio. Power Supply Rejection FIGURE 2-10: Voltage. Current Limit vs. Input FIGURE 2-8: Load Regulation. FIGURE 2-11: Density. Output Noise Spectral FIGURE 2-9: Line Regulation.  2017 - 2022 Microchip Technology Inc. and its subsidiaries. DS20005910B-page 9 MIC2810 FIGURE 2-12: Power Supply Rejection Ratio LDO1 (LOWQ Mode). FIGURE 2-15: Power Supply Rejection Ratio LDO2 (LOWQ Mode). FIGURE 2-13: Power Supply Rejection Ratio LDO1 (Normal Mode). FIGURE 2-16: Power Supply Rejection Ratio LDO2 (Normal Mode). FIGURE 2-14: FIGURE 2-17: DS20005910B-page 10 LDO1 Line Regulation. LDO2 Load Regulation.  2017 - 2022 Microchip Technology Inc. and its subsidiaries. MIC2810 FIGURE 2-18: Output Current. LDO2 Ground Current vs. FIGURE 2-21: Temperature. LDO2 Dropout Voltage vs. FIGURE 2-19: Temperature. LDO2 Ground Current vs. FIGURE 2-22: Density. LDO2 Output Noise Spectral FIGURE 2-20: Output Current. LDO2 Dropout Voltage vs. FIGURE 2-23: Transient. LDO2 (LOWQ Mode) Load  2017 - 2022 Microchip Technology Inc. and its subsidiaries. DS20005910B-page 11 MIC2810 FIGURE 2-24: Transient. LDO2 (Normal Mode) Load FIGURE 2-27: DC/DC PWM Waveforms. FIGURE 2-25: Transient. DC/DC (LOWQ Mode) Load FIGURE 2-28: DC/DC Load Transient. FIGURE 2-29: Waveforms. DC/DC Start-Up FIGURE 2-26: DC/DC (LOWQ Mode) Start-Up Waveform. DS20005910B-page 12  2017 - 2022 Microchip Technology Inc. and its subsidiaries. MIC2810 FIGURE 2-30: POR Behavior; EN1 = EN2 = High, Low-to-High Transition on EN. FIGURE 2-33: Sequencing. CSET Pin Voltage for Correct FIGURE 2-31: POR Behavior; EN = EN2 = High, Low-to-High Transition on EN1. FIGURE 2-34: Sequencing. POR Behavior for Correct FIGURE 2-32: POR Behavior; EN = EN1 = High, Low-to-High Transition on EN2.  2017 - 2022 Microchip Technology Inc. and its subsidiaries. DS20005910B-page 13 MIC2810 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE Pin Number Pin Name 1 LOWQ 2 BIAS 3 SGND Signal ground. 4 PGND Power ground. 5 SW Switch (Output): Internal power MOSFET output switches. 6 VIN Supply Input – DC/DC and other circuitry shared with LDO1 and LDO2. Must be connected to Pin 7. 7 VIN2 Supply Input – LDO2. Must be connected to Pin 6. 8 LDO2 Output of LDO regulator 2. 9 LDO LDO Output: Connect to VOUT of the DC/DC for LOWQ mode operation. 3.1 Description LOWQ Mode. Active Low Input. Logic High = Full Power Mode; Logic Low = LOWQ Mode; Do not leave floating. Internal circuit bias supply. It must be decoupled to signal ground with a 0.1 µF capacitor and should not be loaded. Supply Input – LDO1. 10 VIN1 11 LDO1 Output of LDO regulator 1. 12 POR Power-on Reset Output: Open-drain output. Active low indicates an output undervoltage condition on either one of the three regulated outputs. 13 CSET Delay Set Input: Connect external capacitor to GND to set the internal delay for the POR output. When left open, there is a minimum delay. This pin cannot be grounded. 14 EN1 Enable Input (LDO1). Active High Input. Logic high = On; Logic low = Off; do not leave floating. 15 EN Enable Input (DC/DC). Active High Input. Logic High = On; Logic Low = Off; Do not leave floating. 16 EN2 Enable Input (LDO2). Active High Input. Logic high = On; Logic low = Off; do not leave floating. LOWQ 3.2 BIAS The LOWQ pin provides a logic level control between the internal PWM switching regulator mode, and the low noise linear regulator mode. With LOWQ pulled low (≤ 0.2V), quiescent current of the device is greatly reduced by switching to a low noise linear regulator mode that has a typical supply current of 38 µA. In linear (LDO) mode, the output can deliver 60 mA of current to the output. By placing LOWQ high (≥ 1V), the device transitions into a constant frequency PWM step-down regulator mode. This allows the device the ability to efficiently deliver up to 600 mA of output current at the same output voltage. The BIAS pin supplies the power to the internal control and reference circuitry. The bias is powered from VIN through an internal 6Ω resistor. A small 0.1 µF capacitor is required for bypassing. LOWQ mode also limits the output load of both LDO1 and LDO2 to less than 50 mA. Power ground (PGND) is the ground path for the high current PWM mode. The current loop for the power ground should be as small as possible. DS20005910B-page 14 3.3 SGND Signal ground (SGND) is the ground path for the biasing and control circuitry. The current loop for the signal ground should be as small as possible. 3.4 PGND  2017 - 2022 Microchip Technology Inc. and its subsidiaries. MIC2810 3.5 SW The switch (SW) pin connects directly to the inductor and provides the switching current necessary to operate in PWM mode. Due to the high speed switching on this pin, the switch node should be routed away from sensitive nodes. 3.6 VIN/VIN1/VIN2 Three input voltage pins provide power to the switch mode regulator, LDO1, and LDO2. VIN provides power to the control circuitry of the DC/DC converter and voltage reference circuitry shared by all the regulators in the MIC2810. LDO1’s input voltage (VIN1) can go down to 1.65V, but LDO2 and the DC/DC converter input voltages are limited to 2.7V minimum. For the switch mode regulator, VIN provides power to the MOSFET along with current limiting sense circuitry. Due to the high switching speeds, a 4.7 µF capacitor is recommended close to VIN and the power ground (PGND) pin for bypassing. Please refer to the PCB layout section for an example of an appropriate circuit layout. 3.7 LDO2 Regulated output voltage of LDO2. Power is provided by VIN2. The minimum recommended output capacitance is 2.2 µF. 3.8 LDO1 Regulated output voltage of LDO1. Input power is provided by VIN1. The minimum recommended output capacitance is 2.2 µF. 3.10 The ESD protection of the POR pin is free from clamping diodes to the input supply rails. Therefore, the POR signal can be asserted to host I/Os under backup power domains or pulled up to backup power sources without the risk of parasitic leakage, even if the main power to the MIC2810 is removed. 3.11 Power-on Reset (POR) The power-on reset output is an open-drain N-Channel device, requiring a pull-up resistor to either the input voltage or output voltage for proper voltage levels. The POR output has a delay time that is programmable with a capacitor from the CSET pin to ground. The delay time can be programmed to be as long as 1 second. In steady-state conditions, the POR output is high if at least one channel (DC/DC, LDO1, and LDO2) is enabled and has reached regulation. This is equivalent to performing a logic OR operation on the status of the output voltages.  2017 - 2022 Microchip Technology Inc. and its subsidiaries. CSET The CSET pin is a current source output that charges a capacitor that sets the delay time for the power-on reset output from low to high. The delay for POR high to low (detecting an undervoltage on any of the outputs) is always minimal. The current source of 1.25µA charges a capacitor up from 0V. When the capacitor reaches 1.25V, the output of the POR is allowed to go high. The delay time in microseconds is equal to the CSET in picofarads. EQUATION 3-1: PORDelay   s  = C SET  pF  LDO The LDO pin is the output of the linear regulator and should be connected to the output of the step-down PWM regulator. In LOWQ mode (LOWQ < 0.2V), the LDO provides the output voltage of the DC/DC regulator. 3.9 If any of the outputs are subsequently pulled out of regulation (e.g., due to a momentary overload), the POR signal goes low and it remains low as long as the affected output is out of regulation. If the affected output returns within regulation, POR is asserted high after the delay time programmed with the capacitor at the CSET pin. 3.12 EN/EN1/EN2 All enable inputs are active high, requiring 1.0V for guaranteed operation. EN provides logic control for the DC/DC regulator. EN2 provides logic control for LDO2, and EN1 provides logic control for LDO1. The enable inputs are CMOS logic and cannot be left floating. The enable pins provide logic level control of the specified outputs. When all enable pins are in the off state, supply current of the device is greatly reduced (typically