MIC2810
Digital Power Management IC 2 MHz, 600 mA DC/DC with Dual
300 mA/300 mA Low VIN LDOs
Features
General Description
•
•
•
•
•
The MIC2810 is a high performance power
management IC, featuring three output voltages with
independent enable control: a 2 MHz DC/DC converter
and two 300 mA LDOs. The MIC2810 features a
LOWQ mode, reducing the total current draw while in
this mode to less than 30 µA. In LOWQ mode, the
output noise of the DC/DC converter is 53 µVRMS,
significantly lower than other converters that use a
PFM light load mode that can interfere with sensitive
RF circuitry.
2017 - 2022 Microchip Technology Inc. and its subsidiaries.
Pin 15
Pin 14
Pin 13
EN
EN1
CSET
SGND
VIN1
Pin 10
PGND
LDO
Pin 9
Pin 3
Pin 4
LDO2
Pin 11
BIAS
Pin 8
LDO1
Pin 2
VIN2
Embedded MPU and MCU Power
Portable and Wearable Applications
Low-Power RF Systems
Backup Power Systems
Pin 12
LOWQ
Pin 7
•
•
•
•
POR
Pin 1
VIN
Applications
Pin 6
•
MIC2810
16-Lead 3 mm x 3 mm QFN
Pin 16
•
•
•
Package Type
EN2
•
The LDOs operate with very small ceramic output
capacitors for stability, therefore, reducing required
board space and component cost. It is available in
various output voltage options in the 16-pin 3 mm x
3 mm QFN leadless package.
SW
•
The DC/DC converter uses small values of L and C to
reduce board space but still retains high efficiency over
a wide load range, while supporting load currents up to
600 mA.
Pin 5
•
2.7V to 5.5V Input Voltage Range
2 MHz DC/DC Converter and Two LDOs
Integrated Power-on Reset (POR)
Adjustable POR Delay Time
LOWQ Mode
- 30 µA Total IQ When in LOWQ Mode
DC/DC Converter
- Up to 600 mA of Output Current in PWM
Mode
- LOWQ Mode: No Ripple Light Load Mode
- 53 µVRMS Output Noise in LOWQ Mode
- 2 MHz PWM Mode Operation
- >90% Efficiency
LDO1
- 1.65V to 5.5V Input Voltage Range
- 300 mA Output Current
- Output Voltage Down to 0.8V
LDO2
- 2.7V to 5.5V Input Voltage Range
- 300 mA Output Current
- Output Voltage Down to 0.8V
Thermal Shutdown Protection
Current-Limit Protection
Simple, Leakage-Free Interfacing to Host MPU in
Applications with Backup Power
Tiny 16-Pin 3 mm x 3 mm QFN Package
DS20005910B-page 1
MIC2810
Typical Application Circuit (simplified)
Functional Diagram
VIN
SW
BIAS
DC/DC
LDO
LDO1
LDO1
LDO2
LDO2
EN
/LOWQ
VIN1
EN1
VIN2
EN2
REFERENCE AND
QUICK START
PGND
DS20005910B-page 2
SGND
POR
LOGIC
POR
CSET
2017 - 2022 Microchip Technology Inc. and its subsidiaries.
MIC2810
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
Supply Voltage (VIN, VIN1, VIN2)..................................................................................................................... 0V to +6.0V
Enable Input Voltage (VEN, VEN1, VEN2)..............................................................................................................0V to VIN
Power Dissipation (Note 1) .................................................................................................................... Internally Limited
ESD Rating (Note 2) .................................................................................................................................................. 2 kV
Operating Ratings ‡
Supply Voltage (VIN, VIN2)......................................................................................................................... +2.7V to +5.5V
Supply Voltage (VIN1).............................................................................................................................. +1.65V to +5.5V
Enable Input Voltage (VEN, VEN1, VEN2)........................................................................................................... 0V to +VIN
† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at those or any other conditions above those indicated
in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended
periods may affect device reliability.
‡ Notice: The device is not guaranteed to function outside its operating ratings.
1: The maximum allowable power dissipation of any TA (ambient temperature) is PD(max) = (TJ(max) – TA) / θJA.
Exceeding the maximum allowable power dissipation will result in excessive die temperature, and the
regulator will go into thermal shutdown.
2: Devices are ESD sensitive. Handling precautions recommended. Human body model, 1.5 kΩ in series with
100 pF.
2017 - 2022 Microchip Technology Inc. and its subsidiaries.
DS20005910B-page 3
MIC2810
ELECTRICAL CHARACTERISTICS (Note 1)
Electrical Characteristics: VIN = EN1 = EN2 = LOWQ = VOUT (Note 2) + 1V; COUTDC/DC = 2.2 µF, CLDO1 = CLDO2 =
2.2 µF; IOUTDC/DC = 100 mA; IOUTLDO1 = IOUTLDO2 = 100 µA; TJ = 25°C, bold values indicate –40°C ≤ TJ ≤ +125°C;
unless noted.
Parameter
Symbol
Min.
Typ.
Max.
UVLO Threshold
UVLOTH
2.45
2.55
2.65
V
UVLO Hysteresis
UVLOHYS
—
100
—
mV
—
800
1100
—
55
85
—
—
95
—
0.2
5
—
30
60
—
—
80
—
20
70
TSD
—
160
—
°C
—
TSDHYS
—
23
—
°C
—
—
—
0.2
V
Logic Low
1.0
—
—
V
Logic High
—
0.1
1
µA
—
0.1
1
VIL ≤ 0.2V
µA
VIH ≥ 1.0V
Ground Pin Current
Ground Pin Current in
Shutdown
Ground Pin Current
(LOWQ mode)
Overtemperature
Shutdown
Overtemperature
Shutdown Hysteresis
IGND
IGND_SHDN
IGND_LOWQ
Units
Conditions
Rising input voltage during turn-on
—
VFB = GND (not switching)
µA
LDO1 or LDO2 (EN = GND; EN1 or
EN2 = GND)
µA
EN = EN1 = EN2 = 0V
µA
All channels on, IDC/DC = ILDO1 =
ILDO2 = 0 mA (LOWQ = GND)
LDO1 or LDO2 (EN = GND; EN1 or
EN2 = GND);
IOUT = 0 mA (LOWQ = GND)
Enable Inputs (EN; EN1; EN2; LOWQ)
Enable Input Voltage
Enable Input Current
VIH
VIL
IENLK
Turn-on Time
Turn-on Time
(LDO1 and LDO2)
tTURN-ON
—
240
500
µs
—
Turn-on Time (DC/DC)
tTURN-ON
—
83
350
µs
(LOWQ = VIN; ILOAD = 300 mA);
(LOWQ = GND; ILOAD = 10 mA)
POR Threshold Voltage,
Falling
VTHLOW_POR
90
91
—
%
Low Threshold, % of nominal
(VDC/DC or VLDO1 or VLDO2) (Flag
ON)
POR Threshold Voltage,
Rising
VTHIGH_POR
—
96
99
%
High Threshold, % of nominal
(VDC/DC and VLDO1 and VLDO2)
(Flag OFF)
VOL
VOLPOR
—
10
100
mV
POR Output Logic Low Voltage; IL =
250 µA
IPOR
ILEAKPOR
—
0.01
1
µA
Flag Leakage Current, Flag OFF
ISET
0.75
1.25
1.75
µA
VSET = 0V
VTHSET
—
1.25
—
V
POR = High
POR Output
SET INPUT
SET Pin Current Source
SET Pin Threshold
Voltage
Note 1:
2:
Specification for packaged product only.
VOUT denotes the highest of the three output voltages of DC/DC, LDO1 and LDO2.
DS20005910B-page 4
2017 - 2022 Microchip Technology Inc. and its subsidiaries.
MIC2810
ELECTRICAL CHARACTERISTICS - DC/DC CONVERTER
Electrical Characteristics: VIN = VOUTDC/DC + 1V; EN1 = VIN; EN2 = GND; IOUTDC/DC = 100 mA; L = 2.2 µH;
COUTDC/DC = 2.2 µF; TJ = 25°C, bold values indicate –40°C to + 125°C; unless noted.
Parameter
Symbol
Min.
Typ.
Max.
–2
—
2
–3
—
3
Units
Conditions
LOWQ = High (Full Power Mode)
Output Voltage Accuracy
VOUT
%
Nominal VOUT tolerance
VOUT > 2.4V; VIN = VOUT + 300 mV
to 5.5V, ILOAD= 100 mA
VOUT < 2.4V; VIN = 2.7V to 5.5V,
ILOAD= 100 mA
Output Voltage Line
Regulation
(∆VOUT/VOUT)
/∆VIN
—
0.2
—
%/V
Output Voltage Load
Regulation
∆VOUT/VOUT
—
0.1
—
%
20 mA < ILOAD < 600 mA
Maximum Duty Cycle
DCMAX
100
—
—
%
VFB ≤ 0.4V
—
0.5
—
Ω
ISW = 150 mA, VFB = 0.7VFB_NOM
PMOS
—
0.6
—
Ω
ISW = –150 mA, VFB = 1.1VFB_NOM
NMOS
PWM Switch
ON-Resistance
—
Oscillator Frequency
fosc
1.8
2
2.2
MHz
Current Limit in PWM
Mode
—
0.75
1
1.6
A
–2
—
2
–3
—
3
—
VFB = 0.9 * VNOM
LOWQ = Low (Light Load Mode)
Output Voltage Accuracy
VOUT
Line Regulation
(∆VOUT/VOUT)
/∆VIN
—
0.02
0.3
—
—
0.6
Load Regulation
∆VOUT/VOUT
—
0.4
1.5
Ripple Rejection
Current Limit
Output Voltage Noise
%
Variation from nominal VOUT
Variation from nominal VOUT;
–40°C to +125°C
%/V
VIN = VOUT + 1V to 5.5V;
IOUT = 100 µA
%
IOUT = 100 µA to 50 mA
PSRR
—
45
—
dB
f = up to 1 kHz
ILIM_LOWQ
80
120
190
mA
VOUT = 0V
VN
—
53
—
µVRMS
10 Hz to 100 kHz
ELECTRICAL CHARACTERISTICS - LDO1/LDO2
Electrical Characteristics: VIN1 = VIN2 = VOUTLDO1 + 1.0V or VIN1 = VIN2 = VOUTLDO2 + 1.0V; EN = GND; EN1 =
EN2 = VIN1 = VIN2; CLDO1 = CLDO2 = 2.2 µF; IOUTLDO1 = 100 µA; TJ = 25°C, bold values indicate
–40°C ≤ TJ ≤ +125°C; unless noted.
Parameter
Symbol
Min.
Typ.
Max.
–2
—
2
Units
Conditions
LOWQ = High (Full Power Mode)
Output Voltage Accuracy
VOUT
Line Regulation
—
Load Regulation
∆VOUT/VOUT
–3
—
3
—
0.02
0.3
—
—
0.6
—
0.20
—
—
0.25
—
—
0.40
1.5
2017 - 2022 Microchip Technology Inc. and its subsidiaries.
%
%/V
Variation from nominal VOUT
Variation from nominal VOUT;
–40°C to +125°C
VIN = VOUT +1V to 5.5V
IOUT = 100 µA to 150 mA
%
IOUT = 100 µA to 200 mA
IOUT = 100 µA to 300 mA
DS20005910B-page 5
MIC2810
ELECTRICAL CHARACTERISTICS - LDO1/LDO2 (CONTINUED)
Electrical Characteristics: VIN1 = VIN2 = VOUTLDO1 + 1.0V or VIN1 = VIN2 = VOUTLDO2 + 1.0V; EN = GND; EN1 =
EN2 = VIN1 = VIN2; CLDO1 = CLDO2 = 2.2 µF; IOUTLDO1 = 100 µA; TJ = 25°C, bold values indicate
–40°C ≤ TJ ≤ +125°C; unless noted.
Parameter
Symbol
Min.
Typ.
Max.
—
70
—
Dropout Voltage
VDO
—
94
—
—
142
300
Ripple Rejection
PSRR
—
35
—
Current Limit
ILIM
400
600
Output Voltage Noise
VN
—
91
–3
—
3
VOUT
Line Regulation
—
Load Regulation
∆VOUT/VOUT
–4
—
mA
VOUT = 0V
µVRMS
0.3
0.6
—
0.2
1.0
—
22
35
—
—
50
50
85
PSRR
—
35
Ripple Rejection
DS20005910B-page 6
4
—
ILIM
IOUT = 300 mA
—
0.02
Current Limit
IOUT = 200 mA
850
—
VDO
IOUT = 150 mA
mV
f = up to 1 kHz
—
Dropout Voltage
Conditions
dB
LOWQ = Low (Light Load Mode)
Output Voltage Accuracy
Units
%
10 Hz to 100 kHz
Variation from nominal VOUT
Variation from nominal VOUT;
–40°C to +125°C
%/V
VIN = VOUT +1V to 5.5V
%
IOUT = 100 µA to 10 mA
mV
IOUT = 10 mA
125
mA
VIN = 2.7V; VOUT = 0V
—
dB
f = up to 1 kHz
2017 - 2022 Microchip Technology Inc. and its subsidiaries.
MIC2810
TEMPERATURE SPECIFICATIONS (Note 1)
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
TS
–65
—
+150
°C
—
Temperature Ranges
Storage Temperature Range
Lead Temperature
—
—
—
+260
°C
Soldering, 10 sec.
Junction Temperature
TJ
–40
—
+125
°C
—
θJA
—
56
—
°C/W
—
Package Thermal Resistance
16-Ld QFN
Note 1:
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.
2017 - 2022 Microchip Technology Inc. and its subsidiaries.
DS20005910B-page 7
MIC2810
2.0
Note:
TYPICAL PERFORMANCE CURVES
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
For this page only, DC/DC Normal Mode (LOWQ = VIN)
FIGURE 2-1:
1.2VOUT Efficiency.
FIGURE 2-4:
Load Regulation.
FIGURE 2-2:
Input Voltage.
Switching Frequency vs.
FIGURE 2-5:
Line Regulation.
FIGURE 2-3:
Temperature.
Switching Frequency vs.
FIGURE 2-6:
Voltage.
Current Limit vs. Input
DS20005910B-page 8
2017 - 2022 Microchip Technology Inc. and its subsidiaries.
MIC2810
For this page only, DC/DC LOWQ Mode (LOWQ = GND)
FIGURE 2-7:
Ratio.
Power Supply Rejection
FIGURE 2-10:
Voltage.
Current Limit vs. Input
FIGURE 2-8:
Load Regulation.
FIGURE 2-11:
Density.
Output Noise Spectral
FIGURE 2-9:
Line Regulation.
2017 - 2022 Microchip Technology Inc. and its subsidiaries.
DS20005910B-page 9
MIC2810
FIGURE 2-12:
Power Supply Rejection
Ratio LDO1 (LOWQ Mode).
FIGURE 2-15:
Power Supply Rejection
Ratio LDO2 (LOWQ Mode).
FIGURE 2-13:
Power Supply Rejection
Ratio LDO1 (Normal Mode).
FIGURE 2-16:
Power Supply Rejection
Ratio LDO2 (Normal Mode).
FIGURE 2-14:
FIGURE 2-17:
DS20005910B-page 10
LDO1 Line Regulation.
LDO2 Load Regulation.
2017 - 2022 Microchip Technology Inc. and its subsidiaries.
MIC2810
FIGURE 2-18:
Output Current.
LDO2 Ground Current vs.
FIGURE 2-21:
Temperature.
LDO2 Dropout Voltage vs.
FIGURE 2-19:
Temperature.
LDO2 Ground Current vs.
FIGURE 2-22:
Density.
LDO2 Output Noise Spectral
FIGURE 2-20:
Output Current.
LDO2 Dropout Voltage vs.
FIGURE 2-23:
Transient.
LDO2 (LOWQ Mode) Load
2017 - 2022 Microchip Technology Inc. and its subsidiaries.
DS20005910B-page 11
MIC2810
FIGURE 2-24:
Transient.
LDO2 (Normal Mode) Load
FIGURE 2-27:
DC/DC PWM Waveforms.
FIGURE 2-25:
Transient.
DC/DC (LOWQ Mode) Load
FIGURE 2-28:
DC/DC Load Transient.
FIGURE 2-29:
Waveforms.
DC/DC Start-Up
FIGURE 2-26:
DC/DC (LOWQ Mode)
Start-Up Waveform.
DS20005910B-page 12
2017 - 2022 Microchip Technology Inc. and its subsidiaries.
MIC2810
FIGURE 2-30:
POR Behavior; EN1 = EN2
= High, Low-to-High Transition on EN.
FIGURE 2-33:
Sequencing.
CSET Pin Voltage for Correct
FIGURE 2-31:
POR Behavior; EN = EN2 =
High, Low-to-High Transition on EN1.
FIGURE 2-34:
Sequencing.
POR Behavior for Correct
FIGURE 2-32:
POR Behavior; EN = EN1 =
High, Low-to-High Transition on EN2.
2017 - 2022 Microchip Technology Inc. and its subsidiaries.
DS20005910B-page 13
MIC2810
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
Pin Number
Pin Name
1
LOWQ
2
BIAS
3
SGND
Signal ground.
4
PGND
Power ground.
5
SW
Switch (Output): Internal power MOSFET output switches.
6
VIN
Supply Input – DC/DC and other circuitry shared with LDO1 and LDO2. Must be
connected to Pin 7.
7
VIN2
Supply Input – LDO2. Must be connected to Pin 6.
8
LDO2
Output of LDO regulator 2.
9
LDO
LDO Output: Connect to VOUT of the DC/DC for LOWQ mode operation.
3.1
Description
LOWQ Mode. Active Low Input. Logic High = Full Power Mode; Logic Low = LOWQ
Mode; Do not leave floating.
Internal circuit bias supply. It must be decoupled to signal ground with a 0.1 µF
capacitor and should not be loaded.
Supply Input – LDO1.
10
VIN1
11
LDO1
Output of LDO regulator 1.
12
POR
Power-on Reset Output: Open-drain output. Active low indicates an output
undervoltage condition on either one of the three regulated outputs.
13
CSET
Delay Set Input: Connect external capacitor to GND to set the internal delay for the
POR output. When left open, there is a minimum delay. This pin cannot be grounded.
14
EN1
Enable Input (LDO1). Active High Input. Logic high = On; Logic low = Off; do not leave
floating.
15
EN
Enable Input (DC/DC). Active High Input. Logic High = On; Logic Low = Off; Do not
leave floating.
16
EN2
Enable Input (LDO2). Active High Input. Logic high = On; Logic low = Off; do not leave
floating.
LOWQ
3.2
BIAS
The LOWQ pin provides a logic level control between
the internal PWM switching regulator mode, and the
low noise linear regulator mode. With LOWQ pulled low
(≤ 0.2V), quiescent current of the device is greatly
reduced by switching to a low noise linear regulator
mode that has a typical supply current of 38 µA. In
linear (LDO) mode, the output can deliver 60 mA of
current to the output. By placing LOWQ high (≥ 1V), the
device transitions into a constant frequency PWM
step-down regulator mode. This allows the device the
ability to efficiently deliver up to 600 mA of output
current at the same output voltage.
The BIAS pin supplies the power to the internal control
and reference circuitry. The bias is powered from VIN
through an internal 6Ω resistor. A small 0.1 µF
capacitor is required for bypassing.
LOWQ mode also limits the output load of both LDO1
and LDO2 to less than 50 mA.
Power ground (PGND) is the ground path for the high
current PWM mode. The current loop for the power
ground should be as small as possible.
DS20005910B-page 14
3.3
SGND
Signal ground (SGND) is the ground path for the
biasing and control circuitry. The current loop for the
signal ground should be as small as possible.
3.4
PGND
2017 - 2022 Microchip Technology Inc. and its subsidiaries.
MIC2810
3.5
SW
The switch (SW) pin connects directly to the inductor
and provides the switching current necessary to
operate in PWM mode. Due to the high speed
switching on this pin, the switch node should be routed
away from sensitive nodes.
3.6
VIN/VIN1/VIN2
Three input voltage pins provide power to the switch
mode regulator, LDO1, and LDO2. VIN provides power
to the control circuitry of the DC/DC converter and
voltage reference circuitry shared by all the regulators
in the MIC2810. LDO1’s input voltage (VIN1) can go
down to 1.65V, but LDO2 and the DC/DC converter
input voltages are limited to 2.7V minimum.
For the switch mode regulator, VIN provides power to
the MOSFET along with current limiting sense circuitry.
Due to the high switching speeds, a 4.7 µF capacitor is
recommended close to VIN and the power ground
(PGND) pin for bypassing. Please refer to the PCB
layout section for an example of an appropriate circuit
layout.
3.7
LDO2
Regulated output voltage of LDO2. Power is provided
by VIN2. The minimum recommended output
capacitance is 2.2 µF.
3.8
LDO1
Regulated output voltage of LDO1. Input power is
provided by VIN1. The minimum recommended output
capacitance is 2.2 µF.
3.10
The ESD protection of the POR pin is free from
clamping diodes to the input supply rails. Therefore, the
POR signal can be asserted to host I/Os under backup
power domains or pulled up to backup power sources
without the risk of parasitic leakage, even if the main
power to the MIC2810 is removed.
3.11
Power-on Reset (POR)
The power-on reset output is an open-drain N-Channel
device, requiring a pull-up resistor to either the input
voltage or output voltage for proper voltage levels. The
POR output has a delay time that is programmable with
a capacitor from the CSET pin to ground. The delay
time can be programmed to be as long as 1 second. In
steady-state conditions, the POR output is high if at
least one channel (DC/DC, LDO1, and LDO2) is
enabled and has reached regulation. This is equivalent
to performing a logic OR operation on the status of the
output voltages.
2017 - 2022 Microchip Technology Inc. and its subsidiaries.
CSET
The CSET pin is a current source output that charges
a capacitor that sets the delay time for the power-on
reset output from low to high. The delay for POR high
to low (detecting an undervoltage on any of the outputs)
is always minimal. The current source of 1.25µA
charges a capacitor up from 0V. When the capacitor
reaches 1.25V, the output of the POR is allowed to go
high. The delay time in microseconds is equal to the
CSET in picofarads.
EQUATION 3-1:
PORDelay s = C SET pF
LDO
The LDO pin is the output of the linear regulator and
should be connected to the output of the step-down
PWM regulator. In LOWQ mode (LOWQ < 0.2V), the
LDO provides the output voltage of the DC/DC
regulator.
3.9
If any of the outputs are subsequently pulled out of
regulation (e.g., due to a momentary overload), the
POR signal goes low and it remains low as long as the
affected output is out of regulation. If the affected
output returns within regulation, POR is asserted high
after the delay time programmed with the capacitor at
the CSET pin.
3.12
EN/EN1/EN2
All enable inputs are active high, requiring 1.0V for
guaranteed operation. EN provides logic control for the
DC/DC regulator. EN2 provides logic control for LDO2,
and EN1 provides logic control for LDO1. The enable
inputs are CMOS logic and cannot be left floating.
The enable pins provide logic level control of the
specified outputs. When all enable pins are in the off
state, supply current of the device is greatly reduced
(typically
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