MIC2871
1.2A High-Brightness Flash LED Driver with
Single-Wire Serial Interface
Features
General Description
• Up to 1.2A Flash LED Driving Current
• Highly Efficient, Synchronous Boost Driver
(up to 94%)
• ±5% LED Current Accuracy
• Control through Single-Wire Serial Interface or
External Control Pins
• Input Voltage Range: 2.7V to 5.5V
• True Load Disconnect
• Configurable Safety Time-Out Protection
• Output Overvoltage Protection (OVP)
• LED Short Detection and Protection
• 1 µA Shutdown Current
• Available in 14-Pin 3 mm x 2 mm LDFN Package
The MIC2871 is a high-current, high-efficiency flash LED
driver. The LED driver current is generated by an integrated inductive boost converter with a 2 MHz switching
frequency, which allows the use of a very small inductor
and output capacitor. These features make the MIC2871
an ideal solution for high-resolution camera phone LED
flashlight driver applications.
Applications
• Camera Phones/Mobile Handsets
• Cell Phones/Smartphones
• LED Light for Image Capture/Auto-Focus/
White Balance
• Handset Video Light (Torch Light)
• Digital Cameras
• Portable Applications
2018 Microchip Technology Inc.
The MIC2871 operates in either Flash or Torch modes
that can be controlled through the single-wire serial interface and/or external control pins. Default flash and torch
brightness can be adjusted via an external resistor. A
robust single-wire serial interface allows simple control
by the host processor to support typical camera
functions. such as auto-focus, white balance, and image
capture (Flash mode).
The MIC2871 is available in a 14-pin 3 mm x 2 mm LDFN
package with a junction temperature range of –40°C to
+125°C.
DS20006079A-page 1
MIC2871
Package Type
MIC2871
14-Pin 3 mm x 2 mm LDFN (MK)
(Top View)
AGND1
1
14
FRSET
DC
2
13
PGND2
LED
3
12
NC
FEN1
4
11
FEN2
AGND2
5
10
SW
VIN
6
9
NC
PGND1
7
8
OUT
ePAD
(EP)
Typical Application Schematic
L1 1 μH
VBAT
GND
SINGLE-WIRE SERIAL I/F
C1
2.2 μF/10V
VIN
SW
AGND2
EPAD
AGND1
DC
FLASH ENABLE #1
FEN1
FLASH ENABLE #2
FEN2
OUT
LED
PGND1
PGND2
FRSET
LED1
FLASH
WHITE
LED
C4
4.7 μF
R4
20.5 k
AGND2
U1
MIC2871YMK
DS20006079A-page 2
2018 Microchip Technology Inc.
MIC2871
Functional Block Diagram
SW
DIE TEMP
LBVD
VIN
2.75V/
2.30V
155°C/
140°C
UVLO
FEN1
OTP
SAFETY
TIMER VIN
BODY
SWITCH
OUT
SYSTEM
CONTROL
LOGIC +
ANTI-CROSS
CONDUCTION
FEN2
PGND1
PGND
SINGLEWIRE
SERIAL
INTERFACE
DC
LED 1.7V
2MHz
OSCILLATOR
AGND
PGND2
LED SCP
OUT
Z
OUT
Z
OVP
5.37V/5.31V
LED
V/I
SAFETY TIMER
SAFETY
TIMER
AGND2
2018 Microchip Technology Inc.
FRSET
AGND1
DS20006079A-page 3
MIC2871
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings†
Input Voltage (VIN)...................................................................................................................................... -0.3V to +6.0V
General I/O Voltage (VFEN1, VFEN2)............................................................................................................... -0.3V to VIN
VOUT and VLED Voltage.............................................................................................................................. -0.3V to +6.0V
Single-Wire I/O Voltage (VDC) ........................................................................................................................ -0.3V to VIN
VFRSET Voltage .............................................................................................................................................. -0.3V to VIN
VSW Voltage ............................................................................................................................................... -0.3V to +6.0V
ESD Rating(1) ........................................................................................................................... 2 kV, HBM and 200V, MM
†
Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This
is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for
extended periods may affect device reliability.
Note 1:
Devices are ESD-sensitive. Handling precautions are recommended. Human body model, 1.5 k in series
with 100 pF.
Operating Ratings(1)
Input Voltage (VIN)..................................................................................................................................... +2.7V to +5.5V
Enable Input Voltage (VFEN1, VFEN2) ................................................................................................................. 0V to VIN
Single-Wire I/O Voltage (VDC) ............................................................................................................................ 0V to VIN
Power Dissipation (PD)....................................................................................................................... Internally Limited(2)
Note 1:
2:
The device is not ensured to function outside the operating range.
The maximum allowable power dissipation at any TA (ambient temperature) is PD(max) = (TJ(max) – TA)/JA.
TABLE 1-1:
ELECTRICAL CHARACTERISTICS(Note 1)
Electrical Specifications: unless otherwise specified, VIN = 3.6V; L = 1 µH; COUT = 4.7 µF; RFRSET = 20.5 k;
IOUT = 100 mA; TA = +25°C. Boldface values indicate -40°C TJ +125°C.
Parameter
Symbol
Min.
Typ.
Max.
Units
Test Conditions
Power Supply
Supply Voltage Range
VIN
2.7
—
5.5
V
—
Start-up Voltage
VSTART
—
2.65
2.95
V
—
UVLO Threshold (falling)
VUVLO_F
—
2.30
2.5
V
—
Standby Current
ISTB
—
230
—
µA
VDC = HIGH, boost regulator and LED current driver
are both off
Shutdown Current
ISD
—
1
2
µA
VDC = 0V
VOVP
5.2
5.37
5.55
V
—
VOVPHYS
—
60
—
mV
—
Overvoltage Protection (OVP)
Threshold
OVP Hysteresis
OVP Blanking Time
tBLANK_OVP
—
23
—
µs
—
DMAX
82
86
90
%
—
Switch Current Limit
ISW
3.5
4.5
5.5
A
VIN = VOUT = 2.7V
Minimum Duty Cycle
DMIN
4
6.4
9
%
—
—
100
—
m
Maximum Duty Cycle
Switch-On Resistance
Note 1:
RDS(ON)_P
RDS(ON)_N
ISW = 100 mA
ISW = 100 mA
Specification for packaged product only.
DS20006079A-page 4
2018 Microchip Technology Inc.
MIC2871
TABLE 1-1:
ELECTRICAL CHARACTERISTICS(Note 1) (CONTINUED)
Electrical Specifications: unless otherwise specified, VIN = 3.6V; L = 1 µH; COUT = 4.7 µF; RFRSET = 20.5 k;
IOUT = 100 mA; TA = +25°C. Boldface values indicate -40°C TJ +125°C.
Symbol
Min.
Typ.
Max.
Units
Switch Leakage Current
Parameter
ISW
—
0.01
1
µA
Oscillator Frequency
FSW
—
2
—
MHz
—
—
-10
—
10
%
—
Overtemperature Shutdown
Threshold
TSD
—
155
—
°C
—
Overtemperature Shutdown
Hysteresis
TSDHYS
—
15
—
°C
—
Safety Time-out Shutdown
TTO
—
1.25
—
µs
Default timer setting
Oscillator Frequency Variation
Test Conditions
VDC = 0V, VSW = 5.5V
Safety Timer Current
Threshold
ITO
—
250
—
mA
Default current threshold
setting
Safety Timer Current
Resolution
—
—
50
—
mA
—
Safety Timer Current
Threshold Accuracy
—
—
25
—
mA
—
Low-Battery Voltage Detection
Threshold
VLBVD
—
3.6
—
V
Low-Battery Voltage Detection
Threshold Accuracy
—
—
50
—
mV
LED Short-Circuit Detection
Voltage Threshold
VSHORT
—
1.7
—
V
LED Short-Circuit Detection
Test Current
ITEST
1
2
3
mA
Default LBVD threshold setting
—
VOUT – VLED
—
Current Sink Channels
Channel Current Accuracy
Current Sink Voltage Dropout
Note 1:
—
-5
—
5
%
3.5V < VIN < 4.2V, ILED = 1A
VLED
—
160
—
mV
Boost regulator on, ILED = 1A
Specification for packaged product only.
2018 Microchip Technology Inc.
DS20006079A-page 5
MIC2871
TABLE 1-1:
ELECTRICAL CHARACTERISTICS(Note 1) (CONTINUED)
Electrical Specifications: unless otherwise specified, VIN = 3.6V; L = 1 µH; COUT = 4.7 µF; RFRSET = 20.5 k;
IOUT = 100 mA; TA = +25°C. Boldface values indicate -40°C TJ +125°C.
Parameter
Symbol
Min.
Typ.
Max.
FEN1/FEN2 High-Level
Voltage
VFEN_H
1.5
—
—
FEN1/FEN2 Low-Level
Voltage
VFEN_L
—
—
0.4
FEN1/FEN2 Pull-Down
Current
IFEN_PD
—
1
5
Units
Test Conditions
FEN1, FEN2 Control Pins
Note 1:
Flash on
V
Flash off
µA
VFEN1 = VFEN2 = 5.5V
Specification for packaged product only.
TABLE 1-2:
ELECTRICAL CHARACTERISTICS – SINGLE-WIRE INTERFACE(1)
Electrical Specifications: unless otherwise specified, VIN = 3.6V; L = 1 µH; COUT = 4.7 µF; IOUT = 100 mA; TA = 25°C.
Boldface values indicate -40°C TJ +125°C.
Parameter
Symbol
Min.
Typ.
Max.
Units
Test Conditions
Low-Level Input Voltage
VL
—
—
0.4
V
High-Level Input Voltage
VH
1.5
—
—
V
—
IDC_PD
—
2.5
5
µA
VDC = 5.5V
On Time
TON
0.1
—
72
µs
—
Off Time
TOFF
0.1
—
72
µs
—
Latch Time
TLAT
97
—
324
µs
—
End Time
TEND
405
—
—
µs
—
DC Pull-Down Current
Note 1:
—
Design guidance only.
DS20006079A-page 6
2018 Microchip Technology Inc.
MIC2871
TEMPEARTURE SPECIFICATIONS (Note 1)
Parameters
Symbol
Min.
Typ.
Max.
Units
Conditions
Maximum Junction Temperature Range
TJ
–40
—
150
°C
—
Operating Junction Temperature
Range
TJ
–40
—
125
°C
—
Storage Temperature
TS
–40
—
150
°C
—
Lead Temperature
—
—
—
260
°C
Soldering, 10s
JA
—
65.83
—
θJC
—
38.9
—
Temperature Ranges
Package Thermal Resistance
Thermal Resistance 3x2 LDFN-14LD
Note 1:
°C/W
—
—
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +150°C rating. Sustained junction temperatures above +150°C can impact the device reliability.
2018 Microchip Technology Inc.
DS20006079A-page 7
MIC2871
2.0
Note:
TYPICAL PERFORMANCE CURVES
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
100
EFFICIENCY (%)
90
80
ILED = 1.0A
ILED = 1.2A
ILED = 640mA
70
ILED = 400mA
ILED = 250mA
60
ILED = 100mA
L = 1µH
COUT = 4.7µF
50
2.6
3.0
3.4
3.8
4.2
4.6
5.0
INPUT VOLTAGE (V)
Shutdown Current vs.
FIGURE 2-4:
Input Voltage.
TORCH MODE LED CURRENT (mA)
FIGURE 2-1:
Temperature.
WLED Power Efficiency vs.
270
265
260
255
250
245
240
L = 1µH
COUT = 4.7µF
ILED = 250mA
RFRSET
20k
FRSET ==20kO
235
230
-40
-20
0
20
40
60
80
100
120
TEMPERATURE (°C)
FIGURE 2-2:
Temperature.
Standby Current vs.
FIGURE 2-5:
Temperature.
Torch Mode LED Current vs.
FIGURE 2-3:
vs. Input Voltage.
Boost Switching Frequency
FIGURE 2-6:
Temperature.
Flash Mode LED Current vs.
DS20006079A-page 8
2018 Microchip Technology Inc.
MIC2871
TORCH MODE ILED(MAX) ACCURACY (%)
FLASH MODE ILED(MAX) (mA)
1200
1000
800
600
400
200
L = 1 µH
COUT = 4.7µF
0
0
10
20
30
40
50
60
0.4
0.2
0.0
RFRSET = 17k
RFRSET=17kO
-0.2
-0.4
R
RFRSET=20kO
FRSET = 20k
-0.6
RFRSET = 30k
RFRSET=30kO
-0.8
RFRSET = 39k
RFRSET=39kO
-1.0
RFRSET = 62k
RFRSET=62kO
-1.2
R
RFRSET=51kO
FRSET = 51k
-1.4
3.5
FRSET
) )
FRSETRESISTOR
RESISTOR(k(k?
FIGURE 2-7:
FRSET Resistor.
3.7
3.9
4.1
4.3
Input Voltage (V)
Flash Mode ILED(MAX) vs.
FIGURE 2-10:
Torch Mode ILED(MAX)
Accuracy vs. Input Voltage.
TORCH MODE ILED(MAX) (mA)
300
VFEN1/VFEN2
(5V/div)
250
ILED = 1.0A
VIN = 3.0V
L = 1 µH
200
VOUT
(2V/div)
150
VLED
(1V/div)
100
50
ILED
(1A/div)
L = 1 µH
COUT = 4.7µF
0
0
10
FLASH MODE ILED(MAX) ACCURACY (%)
FIGURE 2-8:
FRSET Resistor.
3.5
3.0
20
30
40
FRSET
))
FRSET RESISTOR
RESISTOR (k
(k?
50
60
Torch Mode ILED(MAX) vs.
Time (100 µs/div)
FIGURE 2-11:
Flash Mode Turn-On
Sequence (Boost Mode).
RFRSET = 17k
RFRSET=17kO
ILED = 1.0A
VIN = 4.2V
L = 1 µH
VFEN1/VFEN2
(5V/div)
2.5
2.0
1.5
VOUT
(2V/div)
1.0
0.5
0.0
-0.5
-1.0
-1.5
VLED
(1V/div)
R
RFRSET=20kO
FRSET = 20k
RFRSET = 30k
RFRSET=30kO
RFRSET = 39k
RFRSET=39kO
ILED
(1A/div)
RFRSET = 51k
RFRSET=51kO
RFRSET = 62k
RFRSET=62kO
3.5
3.7
3.9
4.1
INPUT VOLTAGE (V)
FIGURE 2-9:
Flash Mode ILED(MAX)
Accuracy vs. Input Voltage.
2018 Microchip Technology Inc.
4.3
Time (100 µs/div)
FIGURE 2-12:
Flash Mode Turn-On
Sequence (Linear Mode).
DS20006079A-page 9
MIC2871
ILED = 1.0A
VIN = 3.6V
L = 1 µH
VFEN1/VFEN2
(5V/div)
VFEN1/VFEN2
(5V/div)
VOUT
(2V/div)
VLED
(1V/div)
VOUT
(2V/div)
VLED
(1V/div)
VOUT – VLED
(2V/div)
IL
(100 mA/div)
ILED
(1A/div)
Time (40 µs/div)
Time (200 ms/div)
FIGURE 2-13:
1250 ms.
VIN = 3.6V
L = 1 µH
LED IS SHORTED BY 620
Flash Safety Timer at
FIGURE 2-15:
Protection.
LED Short-Circuit
VFEN1/VFEN2
(5V/div)
FIGURE 2-14:
156 ms.
DS20006079A-page 10
Flash Safety Timer at
2018 Microchip Technology Inc.
MIC2871
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
MIC2871
Pin Number
Pin Name
1
AGND1
Analog Ground: LED current return path.
2
DC
Single-wire serial interface control input.
3
LED
LED Current Sink Pin: Connect the LED anode to OUT and cathode to this pin.
4
FEN1
5
AGND2
6
VIN
7
PGND1
8
OUT
Pin Function
Flash Mode Enable Pin: Toggling FEN1 from LOW to HIGH enables MIC2871 into the
Flash mode. FEN1 is logic-OR with FEN2. If this pin is left floating, it is pulled down
internally by a built-in 1 µA current source when the device is enabled.
Analog Ground: Reference ground of the FRSET pin.
Supply Input Pin: Connect a low-ESR ceramic capacitor of at least 2.2 µF to AGND2.
Power Ground: Inductor current return path.
Boost Converter Output Pin: This is connected to the anode of the LED. Connect a
low-ESR ceramic capacitor of at least 4.7 µF to PGND1.
9, 12
NC
No Connect: Connect this pin to AGND or leave it floating.
10
SW
Inductor Connection Pin: It is connected to the internal power MOSFETs.
11
FEN2
13
PGND2
Power Ground.
14
FRSET
Flash Mode Current-Level Programming Pin: Connect a resistor from this pin to AGND2
to set the maximum current in the Flash mode. This pin may be grounded if the default
Flash mode current (1A) is desired. This pin cannot be left floating and the
recommended resistance range is from 17 k to 60 k.
EP
ePAD
2018 Microchip Technology Inc.
Additional Flash Mode Enable Pin: FEN2 is logic-OR with FEN1. If this pin is left floating,
it is pulled down internally by a built-in 1 µA current source when the device is enabled.
Exposed Heat Sink Pad: Connect to ground for best thermal performance.
DS20006079A-page 11
MIC2871
4.0
FUNCTIONAL DESCRIPTION
4.7
4.1
VIN
This is the current sink pin for the LED. The LED anode
is connected to the OUT pin and the LED cathode is
connected to this pin.
The input supply provides power to the internal
MOSFETs’ gate drive and controls circuitry for the switch
mode regulator. The operating input voltage range is
from 2.7V to 5.5V. A 2.2 µF low-ESR ceramic input
capacitor should be connected from VIN to AGND2 as
close to the MIC2871 as possible to ensure a clean supply voltage for the device. The minimum voltage rating of
10V is recommended for the input capacitor.
4.2
SW
The MIC2871 has internal low-side and synchronous
MOSFET switches. The switch node (SW) between the
internal MOSFET switches connects directly to one
end of the inductor and provides the current paths
during switching cycles.
The other end of the inductor is connected to the input
supply voltage. Due to the high-speed switching on this
pin, the switch node should be routed away from
sensitive nodes wherever possible.
4.3
AGND1
This is the ground path of the LED current sink. It should
be connected to the AGND2, but not via an exposed pad
on the PCB. The current loop of the Analog Ground
should be separated from that of the Power Ground
(PGND1 and PGND2). AGND1 and AGND2 should be
connected to PGND1 and PGND2 at a single point.
4.4
AGND2
This is the ground path for the internal biasing and control circuitry. AGND2 should be connected to the PCB
pad for the package exposed pad. AGND2 should be
connected to the AGND1 directly without going through
the exposed pad. The current loop of the analog ground
should be separated from that of the Power Ground
(PGND1 and PGND2). The AGND2 and AGND1 should
be connected to PGND1 and PGND2 at a single point.
4.5
PGND1 and PGND2
The Power Ground pins are the ground path for the
high current in the boost switch and they are internally
connected together. The current loop for the Power
Ground should be as small as possible and separate
from the Analog Ground (AGND) loop as applicable.
4.6
OUT
This is the boost converter output pin which is connected to the anode of the LED. A low-ESR ceramic
capacitor of 4.7 µF or larger should be connected from
OUT to PGND1, as close as possible to the MIC2871.
The minimum voltage rating of 10V is recommended
for the output capacitor.
DS20006079A-page 12
4.8
LED
DC
The DC is a single multiplexed device enable, and
serial data control pin used for functional control and
communication in GPIO limited applications. When the
DC pin is used as a hardware device enable pin, a logic
high signal on the DC pin enables the device, and a
logic low signal on the DC pin disables the device.
When the DC pin is used as the single-wire serial interface digital control pin, a combination of bit edges and
the period between edges is used to communicate a
variable length data word across the single wire. Each
word is transmitted as a series of pulses, each pulse
incrementing an internal data counter. A stop sequence
consisting of an inactive period is used to latch the data
word internally. The data word received is then used to
set the value of the corresponding register for
controlling the specific function. The MIC2871 supports
five writable registers for controlling Flash mode, Torch
mode, safety timer duration, safety timer threshold
current and low-battery threshold.
An address/data frame is used to improve protection
against erroneous writes where communications are in
error. When the DC is in a low state and no data is
detected for an extended period of time, the MIC2871
will automatically go into a low-power Shutdown state,
simultaneously resetting all internal registers to their
default states.
4.9
FEN1 and FEN2
FEN1 and FEN2 are hardware enable pins for Flash
mode. FEN1 is logic-OR with FEN2. A logic low-to-high
transition on either the FEN1 pin or FEN2 pin can
initiate the MIC2871 in Flash mode. If FEN1 or FEN2 is
left floating, it is pulled down internally by a built-in 1 µA
current source when the device is enabled. Flash mode
is terminated when both FEN1 and FEN2 are pulled
low or left floating, and the Flash register is cleared.
4.10
FRSET
The Flash mode maximum LED current level is
programmed through the FRSET pin. A resistor
connected from the FRSET pin to AGND2 sets the
maximum current in the Flash mode. This pin can be
grounded if the default Flash mode current of 1A is
desired. For the best current accuracy, a 0.1% or smaller
tolerance resistor for setting the maximum Flash mode
LED current is recommended. This pin cannot be left
floating and the minimum resistance is limited to 17 k.
The maximum Flash mode current to maximum Torch
mode current ratio is internally fixed as 4 to1.
2018 Microchip Technology Inc.
MIC2871
5.0
APPLICATION INFORMATION
The MIC2871 can drive a high-current Flash WLED in
either Flash mode or Torch mode.
5.1
Boost Converter
The internal boost converter is turned on/off automatically when the LED driver is activated/deactivated
without any exception.
The boost converter is an internally compensated
Current mode PWM boost converter running at 2 MHz.
It is for stepping up the supply voltage to a high enough
value at the OUT pin to drive the LED current. If the
supply voltage is high enough, the synchronous switch
of the converter is then fully turned on. In this case, all
the excessive voltage is dropped over the linear LED
driver.
5.2
The maximum current level in the Flash mode is 1.2A.
This current level can be adjusted through an external
resistor connected to the FRSET pin according to
Equation 5-1:
CURRENT LEVEL
ADJUSTMENT
ILED(MAX) =
20500
RFRSET
Alternatively, the default value of 1A is used when the
FRSET pin is grounded.
The Flash mode current can be initiated at this preset
FRSET brightness level by asserting the FEN1 or
FEN2 pin high, or by setting the Flash Control register
(Address 1) for the desired Flash duration, subjected to
the safety time-out setting. The Flash mode current is
terminated when the FEN1 and FEN2 pins are brought
low and the Flash register is cleared.
Flash mode current can be adjusted to a fraction of the
maximum Flash mode current level by selecting the
desired percentage in the Flash Control register
through the single-wire serial interface. The Flash
current is the product of the maximum Flash current
setting and the percentage selected in the Flash
register.
5.3
The torch current is the product of the maximum torch
current setting and the percentage selected in the
Torch register.
5.4
Torch Mode
By default, the maximum Torch mode level is
one-fourth (1/4) of the maximum Flash mode current.
The Torch mode operation is activated by setting the
Torch Control register (Address 2) for the desired duration. The Torch mode current is terminated when the
Torch register is cleared or when the configurable
safety timer expires.
2018 Microchip Technology Inc.
Configurable Safety Timer
The Flash safety time-out feature automatically shuts
down the LED current, after the safety timer duration is
expired, if the programmed LED current exceeds a
certain current threshold. Both the current threshold
and the timer duration are programmable via the Safety
Timer registers (Addresses 3 and 5).
5.5
Flash Mode
EQUATION 5-1:
Like the Flash mode current, the Torch mode current
can be tuned to a fraction of the maximum Torch mode
level by selecting the desired torch current level percentage in the Torch Control register (Address 2)
through the single-wire serial interface.
Low-Battery Voltage Detection
(LBVD)
When the VIN voltage drops below the LBVD threshold
(default = 3.6V) in flash or torch mode, the LED current
driver is disabled. The LED driver can be resumed by
toggling the corresponding input control signal. The
LBVD threshold is adjustable through the LBVD Control register (Address 4).
5.6
Overvoltage Protection
When the output voltage rises above the over voltage
protection threshold (OVP), MIC2871 is latched off
automatically to avoid permanent damage to the IC. To
clear the latched off condition, either power cycle the
MIC2871 or assert the DC pin low.
5.7
Short-Circuit Detection
Each time before enabling the LED driver, the MIC2871
performs the short-circuit test by driving the Flash LED
with a small (2 mA typical) current for 200 µs. If (VOUT –
VLED) < 1.7V at the end of the short-circuit test, the
LED is considered to be shorted and MIC2871 will
ignore the Flash and/or Torch mode command. Note
that the short-circuit test is carried out every time prior
to Flash and Torch mode, but the result is not latched.
5.8
Thermal Shutdown
When the internal die temperature of MIC2871 reaches
+155°C, the LED driver is disabled until the die
temperature falls below +140°C.
DS20006079A-page 13
MIC2871
5.9
Single-Wire Interface
The single-wire interface allows the use of a single
multiplexed enable and data pin (DC) for control, and
communication in GPIO limited applications. The
interface is implemented using a simple mechanism,
allowing any open-drain or directly driven GPIO to
control the MIC2871.
The MIC2871 uses the single-wire interface for simple
command and control functions. The interface provides
fast access to write-only registers with protection
features to avoid potentially erroneous data writes and
improve robustness. When the DC is in a low state and
no data is detected for an extended period of time, the
MIC2871 will automatically go into a low-power shutdown state, simultaneously resetting internal registers
to their default states.
5.10
Shutdown mode can be entered at any time by pulling
down DC for TEND, discarding any current communication and resetting the internal registers. If a
communication is received before the shutdown period,
but after the TLAT period, the communication is discarded. This state is also used to create an internal
error state to avoid erroneously latching data where the
communication process cannot be serviced in time.
Additionally, each register has a maximum value
associated with it. If the number of bits clocked in
exceeds the maximum value for the register, the data is
assumed to be in error and the data is discarded.
Overview
The single-wire interface relies on a combination of bit
edges, and the period between edges, in order to
communicate across a single wire. Each word is
transmitted as a series of pulses, with each pulse
incrementing an internal data counter. A stop sequence
consisting of an inactive period is used to latch the data
word internally. An address and data framing format is
used to improve protection against erroneous writes by
enforcing address and data field lengths, as well as the
timing duration between them.
Timing is designed such that when communicating with
a device using a low-cost on-chip oscillator, the
worst-case minimum and maximum conditions can be
easily met within the wide operating range of the
oscillator. Using this method ensures that the device
can always detect the delay introduced by the
communication master.
5.11
Idle mode is entered automatically at the end of a communication frame by holding DC high for TEND, by
enabling the device by bringing DC high when in
shutdown mode, or when an error is detected by the
single-wire interface logic.
Idle States and Error Conditions
In Shutdown mode, the MIC2871 is in a Reset condition, with all functions off, while consuming minimal
power. Register settings are reset to their default state
when coming out of Shutdown state. In Idle mode, all
register settings persist and all MIC2871 functions
continue in their current state. Table 5-1 summarizes
the difference between the two IDLE modes:
TABLE 5-1:
TLAT.
To send register write commands, the address and
data are entered in series as two data words using the
above pattern, with the second word starting after the
first latch period has expired. After the second word is
entered, the IDLE command should be issued by
leaving the DC pins high for TEND.
MIC2871 Registers
The MIC2871 supports five writable registers for controlling the Torch and Flash modes of operation, as
shown in Table 5-2. Note that register addressing starts
at 1. Writing any value above the maximum value
shown for each register will cause an invalid data error
and the frame will be discarded.
TABLE 5-2:
FIVE WRITABLE REGISTERS
OF MIC2871
Address
Name
Max.
Value
Description
1
FEN/FCUR
31
Flash Enable/Current
2
TEN/TCUR
31
Touch Enable/Current
3
STDUR
7
Safety Timer Duration
4
LB_TH
9
Low-Battery Voltage
Detection Threshold
5
ST_TH
5
Safety Timer
Threshold
After receiving the stop sequence, the internal registers’ decode and update cycle is started, with the
Shadow register values being transferred to the
decoder. Figure 5-3 shows an example of entering a
write of Data 5 to Address 3.
ADDRESS/DATA FRAME
START
LATCH
START
TLAT
0 1 2 3
< TEND
LATCH
END
REGISTER
WRITE
TLAT
0 1 2 3 4 5
> TEND
FIGURE 5-3:
Communication Timing
Example of Entering Write for Data 5 to
Address 3.
2018 Microchip Technology Inc.
DS20006079A-page 15
MIC2871
5.13.1
FLASH CURRENT REGISTER
(FEN/FCUR: DEFAULT 0)
The Flash Current register enables and sets the Flash
mode current level. Valid values are 0 to 31; Values 0-15
will set the Flash current without enabling the Flash (such
that it can be triggered externally), Values 16-31 will set
the Flash current and enable the Flash. The Flash
Current register maps into the internal FEN and FCUR
registers, as shown in Table 5-3. Table 5-3 describes the
relationship between the Flash current, as a percentage
of maximum current, and the FCUR register setting.
TABLE 5-3: FLASH CURRENT REGISTER
MAPPING INTO INTERNAL
FEN/FCUR REGISTERS AND
RELATIONSHIP BETWEEN
FLASH CURRENT AS % OF
MAX. CURRENT AND FCUR
REGISTER SETTING
Value
FEN/FCUR
Dec.
Binary
FEN
FCUR % of IMAX
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
00000
00001
00010
00011
00100
00101
00110
00111
01000
01001
01010
01011
01100
01101
01110
01111
10000
10001
10010
10011
10100
10101
10110
10111
11000
11001
11010
11011
11100
11101
11110
11111
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
100.00
88.96
79.04
70.72
63.04
56.00
49.92
44.64
39.68
35.52
31.68
28.16
25.12
22.40
20.00
17.92
100.00
88.96
79.04
70.72
63.04
56.00
49.92
44.64
39.68
35.52
31.68
28.16
25.12
22.40
20.00
17.92
DS20006079A-page 16
5.13.2
TORCH CURRENT REGISTER
(TEN/TCUR: DEFAULT 0)
The Torch Current register enables and sets the Torch
mode current level. Valid values are 0 to 31; Values 0-15
will set the torch current without enabling the torch (such
that it can be triggered by setting the internal TEN register
value to 1), Values 16-31 will set the torch current and
enable the torch. A value of 0 at the internal TEN register
will disable the torch. The Torch Current register maps
into the internal TEN and TCUR registers, as shown in
Table 5-4. The table also describes the relationship
between the torch current as a percentage of maximum
current, and the TCUR register setting.
TABLE 5-4: TORCH CURRENT REGISTER
MAPPING INTO INTERNAL
TEN/TCUR REGISTERS AND
RELATIONSHIP BETWEEN
TORCH CURRENT AS % OF
MAX. CURRENT AND TCUR
REGISTER SETTING
Value
TEN/TCUR
Dec.
Binary
TEN
TCUR % of IMAX
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
00000
00001
00010
00011
00100
00101
00110
00111
01000
01001
01010
01011
01100
01101
01110
01111
10000
10001
10010
10011
10100
10101
10110
10111
11000
11001
11010
11011
11100
11101
11110
11111
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
100.00
88.96
79.04
70.72
63.04
56.00
49.92
44.64
39.68
35.52
31.68
28.16
25.12
22.40
20.00
17.92
100.00
88.96
79.04
70.72
63.04
56.00
49.92
44.64
39.68
35.52
31.68
28.16
25.12
22.40
20.00
17.92
2018 Microchip Technology Inc.
MIC2871
5.13.3
SAFETY TIMER DURATION
REGISTER (STDUR: DEFAULT 7)
The Safety Timer Duration register sets the duration of
the Flash and Torch modes when the LED current
exceeds the programmed threshold current. Valid
values are 0 for the minimum timer duration to 7 for the
maximum duration.
TABLE 5-5: SAFETY TIMER DURATION
REGISTER SETTING AND
SAFETY TIMER DURATION
Value
Dec.
Binary
STDUR
(binary)
0
000
000
156.25
1
001
001
312.5
2
010
010
468.75
3
011
011
625
4
100
100
781.25
5
101
101
937.5
6
110
110
1093.75
7
111
111
1250
5.13.4
Time-out (ms)
LOW-BATTERY THRESHOLD
REGISTER (LB_TH: DEFAULT 7)
5.13.5
SAFETY TIMER THRESHOLD
CURRENT REGISTER (ST_TH:
DEFAULT 4)
The Safety Timer Threshold Current register determines the amount of LED current flowing through the
external LED before the internal LED safety timer is
activated. Setting ST_TH to 0 disables the safety timer
function, and setting the register to Values 1 to 5 set the
safety time threshold current to 100 mA to 300 mA in
50 mA steps.
TABLE 5-7: SAFETY TIMER THRESHOLD
CURRENT REGISTER SETTING
AND SAFETY TIMER
THRESHOLD CURRENT
Value
ST_TH
Safety Timer
Threshold
Current (mA)
Dec.
Binary
0
000
000
Disabled
1
001
001
100 mA
2
010
010
150 mA
3
011
011
200 mA
4
100
100
250 mA
5
101
101
300 mA
The LB_TH register sets the supply threshold voltage
below which the internal low-battery flag is asserted
and Flash functions are inhibited. Table 5-6 shows the
threshold values that correspond to the register settings. Setting 0 is reserved for disabling the function,
and settings between 1 and 9 inclusively enable and
set the LB_TH value, between 3.0V and 3.8V with
100 mV resolution.
TABLE 5-6: LOW-BATTERY THRESHOLD
REGISTER SETTING AND
SUPPLY THRESHOLD VOLTAGE
Value
LB_TH
VBAT Threshold
(V)
0000
0000
Disabled
1
0001
0001
3.0
2
0010
0010
3.1
3
0011
0011
3.2
4
0100
0100
3.3
5
0101
0101
3.4
6
0110
0110
3.5
7
0111
0111
3.6
8
1000
1000
3.7
9
1001
1001
3.8
Dec.
Binary
0
2018 Microchip Technology Inc.
DS20006079A-page 17
MIC2871
6.0
COMPONENT SELECTION
6.1
Inductor
Inductor selection is a balance between efficiency,
stability, cost, size, and rated current. Because the
boost converter is compensated internally, the recommended inductance of L is limited from 1 µH to 2.2 µH
to ensure system stability. It is usually a good balance
between these considerations.
A large inductance value reduces the peak-to-peak
inductor ripple current; hence, the output ripple voltage
and the LED ripple current. This also reduces both the
DC loss and the transition loss at the same inductor’s
DC Resistance (DCR). However, the DCR of an
inductor usually increases with the inductance in the
same package size. This is due to the longer windings
required for an increase in inductance. Because the
majority of the input current passes through the inductor, the higher the DCR, the lower the efficiency is, and
more significantly, at higher load currents. On the other
hand, an inductor with a smaller DCR, but the same
inductance, usually has a larger size. The saturation
current rating of the selected inductor must be higher
than the maximum peak inductor current to be encountered and should be at least 20% to 30% higher than
the average inductor current at maximum output current.
6.2
6.3
Output Capacitor
Output capacitor selection is also a trade-off between
performance, size and cost. Increasing the output
capacitor will lead to an improved transient response,
however, the size and cost also increase. The output
capacitor is preferred in the range of 2.2 µF to 10 µF,
with ESR from 10 m to 50 m. X5R or X7R type
ceramic capacitors are recommended for better
tolerance over temperature.
The Y5V and Z5U type ceramic capacitors are not
recommended due to their wide variation in capacitance over temperature and increased resistance at
high frequencies. The rated voltage of the output
capacitor should be at least 20% higher than the
maximum operating output voltage over the operating
temperature range.
6.4
FRSET Resistor
Because the FRSET resistor is used for setting the
maximum LED current, a resistor type with 0.1% tolerance is recommended for a more accurate maximum
LED current setting.
Input Capacitor
A ceramic capacitor of 2.2 µF or larger with low-ESR is
recommended to reduce the input voltage ripple to
ensure a clean supply voltage for the device. The input
capacitor should be placed as close as possible to the
MIC2871 VIN pin with a short trace for good noise
performance. X5R or X7R type ceramic capacitors are
recommended for better tolerance over temperature.
The Y5V and Z5U type temperature rating ceramic
capacitors are not recommended due to their large
reduction in capacitance over temperature and
increased resistance at high frequencies. These
reduce their ability to filter out high-frequency noise.
The rated voltage of the input capacitor should be at
least 20% higher than the maximum operating input
voltage over the operating temperature range.
DS20006079A-page 18
2018 Microchip Technology Inc.
MIC2871
7.0
POWER DISSIPATION
CONSIDERATION
As with all power devices, the ultimate current rating of
the output is limited by the thermal properties of the
device package and the PCB on which the device is
mounted. There is a simple ’s law type relationship
between thermal resistance, power dissipation and
temperature, which are analogous to an electrical
circuit:
RXY
VX
VY
RYZ
Now replacing the variables in Equation 7-1, we can
find the Junction Temperature (TJ) from the power dissipation, ambient temperature, and the known thermal
resistance of the PCB (CA) and the package (JC).
EQUATION 7-2:
TJ = PDISS (JC + CA) + TA
As can be seen in the diagram, the total thermal
resistance is: JA = JC + CA. Hence, this can also be
written as in Equation 7-3:
VZ
EQUATION 7-3:
ISOURCE
FINDING THE JUNCTION
TEMPERATURE (TJ)
VZ
TOTAL THERMAL
RESISTANCE
TJ = PDISS (JA) + TA
Where:
FIGURE 7-1:
Circuit.
Series Electrical Resistance
From this simple circuit, we can calculate VX if we know
the ISOURCE, VZ and resistor values, RXY and RYZ,
using Equation 7-1:
EQUATION 7-1:
CALCULATING VX
VX = ISOURCE (RXY + RYZ) + VZ
ĬJC
TC
PDISS
FIGURE 7-2:
Circuit.
ĬCA
Because effectively all of the power losses (minus the
inductor losses) in the converter are dissipated within
the MIC2871 package, PDISS can be calculated thus:
EQUATION 7-4:
Thermal circuits can be considered using this same
rule and can be drawn similarly by replacing current
sources with power dissipation (in watts), resistance
with thermal resistance (in °C/W) and voltage sources
with temperature (in °C).
TJ
θJA = Thermal resistance between junction and ambient,
which is typically 65.83°C/W for 3 mm x 2 mm LDFN
package
CALCULATING PDISS
Linear Mode: PDISS = [POUT 1 – 1 ] – IOUT2 DCR
I
Boost Mode: PDISS = [POUT 1 – 1 ] – OUT 2 DCR
1 – D
Duty Cycle in Boost Mode: D =
VOUT – VIN
VOUT
Where:
= Efficiency taken from efficiency curves
DCR = Inductor DCR
TA
TA
Series Thermal Resistance
2018 Microchip Technology Inc.
DS20006079A-page 19
MIC2871
Where the real board area differs from 1" square, CA
(the PCB thermal resistance) values for various PCB
copper areas can be taken from Figure 7-3. Figure 7-3
is taken from “Designing with Low Dropout Voltage
Regulators” available from the Microchip web site
(“LDO Application Hints”).
Figure 7-3 shows the total area of a round or square
pad, centered on the device. The solid trace represents
the area of a square, single-sided, horizontal,
solder-masked, copper PC board trace heat sink,
measured in square millimeters. No airflow is assumed.
The dashed line shows PC board’s trace heat sink
covered in black oil-based paint and with 1.3m/sec
(250 feet per minute) airflow. This approaches a “best
case” pad heat sink. Conservative design dictates
using the solid trace data, which indicates a maximum
pad size of 5000 mm2 is needed. This is a pad that is
71 mm by 71 mm (2.8 inches per side).
FIGURE 7-3:
Graph to Determine PC
Board Area for a Given PCB Thermal
Resistance.
DS20006079A-page 20
2018 Microchip Technology Inc.
MIC2871
8.0
PCB LAYOUT GUIDELINES
PCB layout is critical to achieve reliable, stable and
efficient performance. A ground plane is required to
control EMI and minimize the inductance in power and
signal return paths. The following guidelines should be
followed to ensure proper operation of the device:
8.1
IC (Integrated Circuit)
• Place the IC close to the point-of-load (in this
case, the flash LED).
• Use fat traces to route the input and output power
lines.
• Analog grounds (AGND1 and AGND2) and power
grounds (PGND1 and PGND2) should be kept
separate and connected at a single location.
• The exposed pad (ePAD) on the bottom of the IC
must be connected to the analog ground AGND2
of the IC.
• 8 to 12 thermal vias must be placed on the PCB
pad for exposed pad and connected it to the
ground plane to ensure a good PCB thermal
resistance can be achieved.
8.2
8.4
Output Capacitor
• Use wide and short traces to connect the output
capacitor to the OUT and PGND1 pins.
• Place several vias to the ground plane close to
the output capacitor ground terminal.
• Use either X5R or X7R temperature rating
ceramic capacitors. Do not use Y5V or Z5U type
ceramic capacitors.
8.5
Flash LED
• Use wide and short trace to connect the LED
anode to the OUT pin.
• Use wide and short trace to connect the LED
cathode to the LED pin.
• Make sure that the LED’s PCB land pattern can
provide sufficient PCB pad heat sink to the flash
LED.
8.6
FRSET Resistor
The FRSET resistor should be placed close to the
FRSET pin and connected to AGND2.
VIN Decoupling Capacitor
• The VIN decoupling capacitor must be placed
close to the VIN pin of the IC and preferably connected directly to the pin and not through any via.
The capacitor must be located right at the IC.
• The VIN decoupling capacitor should be
connected to analog ground (AGND2).
• The VIN terminal is noise sensitive and the
placement of capacitor is very critical.
8.3
Inductor
• Keep both the inductor connections to the switch
node (SW) and input power line short and wide
enough to handle the switching current. Keep the
areas of the switching current loops small to
minimize the EMI problem.
• Do not route any digital lines underneath or close
to the inductor.
• Keep the switch node (SW) away from the noise
sensitive pins.
• To minimize noise, place a ground plane underneath the inductor.
2018 Microchip Technology Inc.
DS20006079A-page 21
MIC2871
9.0
PACKAGING INFORMATION
9.1
Package Marking Information
14-Lead LDFN*
Example
XXXX
NNN
2871
017
Legend: XX...X
Y
YY
WW
NNN
e3
*
Product code or customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
●, ▲, ▼ Pin one index is identified by a dot, delta up or delta down (triangle
mark).
Note:
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information. Package may or may not include
the corporate logo.
Underbar (_) and/or Overbar (‾) symbol may not be to scale.
DS20006079A-page 22
2018 Microchip Technology Inc.
MIC2871
9.2
Package Details
The following sections give the technical details of the packages.
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
2018 Microchip Technology Inc.
DS20006079A-page 23
MIC2871
NOTES:
DS20006079A-page 24
2018 Microchip Technology Inc.
MIC2871
APPENDIX A:
REVISION HISTORY
Revision A (October 2018)
• Converted Micrel document MIC2871 to
Microchip data sheet DS20006079A.
• Minor text changes throughout document.
2018 Microchip Technology Inc.
DS20006079A-page 25
MIC2871
NOTES:
DS20006079A-page 26
2018 Microchip Technology Inc.
MIC2871
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
PART NO.
Device
XX
X
–
Temperature Package
XX
MIC2871:
Temperature:
Y
Package:
MK =
14-Pin 3 mm x 2 mm LDFN
Media Type:
T5
TR
500/Reel
5,000/Reel
=
=
a)
MIC2871YMK-T5:
MIC2871,
-40°C to +125°C Temp. Range,
14-Pin LDFN, 500/Reel
b)
MIC2871YMK-TR:
MIC2871,
-40°C to +125°C Temp. Range,
14-Pin LDFN, 5,000/Reel
Media
Type
Device:
=
Examples:
1.2A High-Brightness Flash LED Driver
with Single-Wire Serial Interface
-40°C to +125°C
2018 Microchip Technology Inc.
Note 1:
Tape and Reel identifier only appears in the
catalog part number description. This identifier is
used for ordering purposes and is not printed on
the device package. Check with your Microchip
Sales Office for package availability with the
Tape and Reel option.
DS20006079A-page 27
MIC2871
NOTES:
DS20006079A-page 28
2018 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
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headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
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CERTIFIED BY DNV
The Microchip name and logo, the Microchip logo, AnyRate, AVR,
AVR logo, AVR Freaks, BitCloud, chipKIT, chipKIT logo,
CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo,
JukeBlox, KeeLoq, Kleer, LANCheck, LINK MD, maXStylus,
maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip
Designer, QTouch, SAM-BA, SpyNIC, SST, SST Logo,
SuperFlash, tinyAVR, UNI/O, and XMEGA are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
and other countries.
ClockWorks, The Embedded Control Solutions Company,
EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS,
mTouch, Precision Edge, and Quiet-Wire are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, BodyCom, CodeGuard,
CryptoAuthentication, CryptoAutomotive, CryptoCompanion,
CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average
Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial
Programming, ICSP, INICnet, Inter-Chip Connectivity,
JitterBlocker, KleerNet, KleerNet logo, memBrain, Mindi, MiWi,
motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB,
MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation,
PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon,
QMatrix, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O,
SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total
Endurance, TSHARC, USBCheck, VariSense, ViewSpan,
WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
Silicon Storage Technology is a registered trademark of Microchip
Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2018, Microchip Technology Incorporated, All Rights Reserved.
ISBN: 978-1-5224-3692-8
== ISO/TS 16949 ==
2018 Microchip Technology Inc.
DS20006079A-page 29
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
Australia - Sydney
Tel: 61-2-9868-6733
India - Bangalore
Tel: 91-80-3090-4444
China - Beijing
Tel: 86-10-8569-7000
India - New Delhi
Tel: 91-11-4160-8631
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
China - Chengdu
Tel: 86-28-8665-5511
India - Pune
Tel: 91-20-4121-0141
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
China - Chongqing
Tel: 86-23-8980-9588
Japan - Osaka
Tel: 81-6-6152-7160
Finland - Espoo
Tel: 358-9-4520-820
China - Dongguan
Tel: 86-769-8702-9880
Japan - Tokyo
Tel: 81-3-6880- 3770
China - Guangzhou
Tel: 86-20-8755-8029
Korea - Daegu
Tel: 82-53-744-4301
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
China - Hangzhou
Tel: 86-571-8792-8115
Korea - Seoul
Tel: 82-2-554-7200
China - Hong Kong SAR
Tel: 852-2943-5100
Malaysia - Kuala Lumpur
Tel: 60-3-7651-7906
China - Nanjing
Tel: 86-25-8473-2460
Malaysia - Penang
Tel: 60-4-227-8870
China - Qingdao
Tel: 86-532-8502-7355
Philippines - Manila
Tel: 63-2-634-9065
China - Shanghai
Tel: 86-21-3326-8000
Singapore
Tel: 65-6334-8870
China - Shenyang
Tel: 86-24-2334-2829
Taiwan - Hsin Chu
Tel: 886-3-577-8366
China - Shenzhen
Tel: 86-755-8864-2200
Taiwan - Kaohsiung
Tel: 886-7-213-7830
Israel - Ra’anana
Tel: 972-9-744-7705
China - Suzhou
Tel: 86-186-6233-1526
Taiwan - Taipei
Tel: 886-2-2508-8600
China - Wuhan
Tel: 86-27-5980-5300
Thailand - Bangkok
Tel: 66-2-694-1351
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
China - Xian
Tel: 86-29-8833-7252
Vietnam - Ho Chi Minh
Tel: 84-28-5448-2100
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Austin, TX
Tel: 512-257-3370
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Novi, MI
Tel: 248-848-4000
Houston, TX
Tel: 281-894-5983
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Tel: 317-536-2380
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Tel: 951-273-7800
Raleigh, NC
Tel: 919-844-7510
New York, NY
Tel: 631-435-6000
San Jose, CA
Tel: 408-735-9110
Tel: 408-436-4270
Canada - Toronto
Tel: 905-695-1980
Fax: 905-695-2078
DS20006079A-page 30
China - Xiamen
Tel: 86-592-2388138
China - Zhuhai
Tel: 86-756-3210040
Germany - Garching
Tel: 49-8931-9700
Germany - Haan
Tel: 49-2129-3766400
Germany - Heilbronn
Tel: 49-7131-67-3636
Germany - Karlsruhe
Tel: 49-721-625370
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Germany - Rosenheim
Tel: 49-8031-354-560
Italy - Padova
Tel: 39-049-7625286
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Norway - Trondheim
Tel: 47-7288-4388
Poland - Warsaw
Tel: 48-22-3325737
Romania - Bucharest
Tel: 40-21-407-87-50
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Sweden - Gothenberg
Tel: 46-31-704-60-40
Sweden - Stockholm
Tel: 46-8-5090-4654
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
2018 Microchip Technology Inc.
08/15/18
