MIC2874
1.2A High-Brightness Flash LED Driver with
Single-Wire Serial Interface
Features
General Description
• Up to 1.2A Flash LED Driving Current
• Highly Efficient Synchronous Boost Driver
• Control through Single-Wire Serial Interface or
External Control Pin
• Input Voltage Range: 2.7V to 5.5V
• True Load Disconnect
• Configurable Safety Time-Out Protection
• Output Overvoltage Protection (OVP)
• LED Short Detection and Protection
• 1 µA Shutdown Current
• Available in 9-Bump 1.30 mm x 1.30 mm WLCSP
Package
The MIC2874 is a high-current, high-efficiency Flash
LED driver. The LED driver current is generated by an
integrated inductive boost converter with a 4 MHz switching frequency, which allows for the use of a very small
inductor and output capacitor. These features make the
MIC2874 an ideal solution for high-resolution camera
phone LED Flash light driver applications.
MIC2874 operates in either Flash or Torch mode that can
be controlled through the single-wire serial interface
and/or external control pin. A robust single-wire serial
interface allows the host processor to control the LED
current and brightness. The MIC2874 is available in a
9-bump 1.30 mm x 1.30 mm WLCSP package.
Applications
• Camera Phones/Mobile Handsets
• Cell Phones/Smartphones
• LED Light for Image Capture/Auto-Focus/
White Balance
• Handset Video Light (Torch Light)
• Digital Cameras
• Portable Applications
2018 Microchip Technology Inc.
DS20006081A-page 1
MIC2874
Package Type
MIC2874
9-Bump 1.30 mm x 1.30 mm WLCSP (CS)
(Top View)
1
2
3
A
LED
DC
OUT
B
LGND
FEN
SW
C
AGND
VIN
PGND
Note: WLCSP Bump A1 identifier = “•”.
Typical Application Schematic
VBAT
VIN
AGND
SW
OUT
PGND
LGND
SINGLE-WIRE SERIAL I/F
FLASH ENABLE
DS20006081A-page 2
LED
DC
FEN
2018 Microchip Technology Inc.
MIC2874
Functional Block Diagram
SW
DIE TEMP
LBVD
VIN
2.53V/
2.35V
OTP
155°C/
140°C
UVLO
SAFETY
TIMER VIN
BODY
SWITCH
OUT
SYSTEM
CONTROL
LOGIC +
ANTI-CROSS
CONDUCTION
FEN
PGND
PGND
SINGLEWIRE
SERIAL
INTERFACE
DC
LED 1.7V
4 MHz
OSCILLATOR
AGND
LED SCP
4-BIT
OUT
Z
Z
OUT
SAFETY
TIMER
SAFETY
TIMER
DECODER
AGND
2018 Microchip Technology Inc.
LED
V/I
LGND
DS20006081A-page 3
MIC2874
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings†
Input Voltage (VIN)...................................................................................................................................... -0.3V to +6.0V
General I/O Voltage (VFEN) ............................................................................................................................ -0.3V to VIN
VOUT and VLED Voltage.............................................................................................................................. -0.3V to +6.0V
Single-Wire I/O Voltage (VDC) ........................................................................................................................ -0.3V to VIN
VSW Voltage ............................................................................................................................................... -0.3V to +6.0V
ESD Rating(1)
HBM .......................................................................................................................................................................2 kV
MM ........................................................................................................................................................................200V
†
Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This
is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for
extended periods may affect device reliability.
Note 1:
Devices are ESD-sensitive. Handling precautions are recommended. Human body model, 1.5 k in series
with 100 pF.
Operating Ratings(1)
Input Voltage (VIN)..................................................................................................................................... +2.7V to +5.5V
Enable Input Voltage (VFEN)............................................................................................................................... 0V to VIN
Single-Wire I/O Voltage (VDC) ............................................................................................................................ 0V to VIN
Power Dissipation (PD)....................................................................................................................... Internally Limited(2)
Note 1:
2:
The device is not ensured to function outside the operating range.
The maximum allowable power dissipation at any TA (ambient temperature) is PD(max) = (TJ(max) – TA)/JA.
Exceeding the maximum allowable power dissipation will result in excessive die temperature and the regulator
will go into thermal shutdown.
DS20006081A-page 4
2018 Microchip Technology Inc.
MIC2874
TABLE 1-1:
ELECTRICAL CHARACTERISTICS(Note 1)
Electrical Specifications: unless otherwise specified, VIN = 3.6V; L = 0.47 µH; COUT = 4.7 µF; IOUT = 100 mA;
TA = TJ = +25°C. Boldface values indicate -40°C TJ +125°C.
Parameter
Symbol
Min.
Typ.
Max.
Units
VIN
2.7
—
5.5
V
Test Conditions
Power Supply
Supply Voltage Range
UVLO Threshold (rising)
UVLO Hysteresis
VUVLO_R
2.41
2.53
2.68
V
—
VUVLO_HYS
—
180
—
mV
—
ISTB
150
185
220
µA
VDC = 3.6V, VFEN = 0V, boost
regulator and LED current
driver are both off
Standby Current
Shutdown Current
—
ISD
—
1
2
µA
VDC = 0V
Maximum Duty Cycle
DMAX
82
86
90
%
—
Minimum Duty Cycle
DMIN
—
6.4
—
%
—
Switch Current Limit
ISW
—
4.1
—
A
VIN = VOUT = 2.7V
RDS(ON)_P
—
RDS(ON)_N
—
Switch-On Resistance
Switch Leakage Current
125
—
—
m
ISW = 100 mA
ISW = 100 mA
ISW_LK
—
0.01
1
µA
Oscillator Frequency
FSW
3.6
4
4.4
MHz
Overtemperature Shutdown
Threshold
TSD
—
155
—
°C
Overtemperature Shutdown
Hysteresis
TSD_HYS
—
15
—
°C
Safety Time-out Shutdown
TTO
—
1.25
—
s
Safety Timer Current
Threshold
ITO
—
250
—
mA
Default current threshold setting
Low-Battery Voltage
Detection Threshold
VLBVD
—
3.0
—
V
Default LBVD threshold setting
Low-Battery Voltage
Detection Threshold
Accuracy
—
—
50
—
mV
LED Short-Circuit Detection
Voltage Threshold
VSHORT
1.55
1.7
1.85
V
LED Short-Circuit Detection
Test Current
ITEST
1.6
2
2.7
mA
-6
—
6
-8
—
8
VLED
—
250
—
FEN High-Level Voltage
VFEN_H
1.3
—
—
FEN Low-Level Voltage
VFEN_L
—
—
0.6
FEN Pull-Down Current
IFEN_PD
—
1.3
5
VDC = 0V, VSW = 5.5V
—
—
—
Default timer setting
All low-battery voltage detection threshold settings
VOUT – VLED
—
Current Sink Channel
Channel Current Accuracy
Current Sink Voltage
Dropout
—
%
mV
VOUT = 4.2V, ILED = 0.20A
VOUT = 4.2V, ILED = 1.0A
Boost mode
FEN Control Pin
Note 1:
V
µA
Flash is on
Flash is off
VFEN = 5.5V
Specification for packaged product only.
2018 Microchip Technology Inc.
DS20006081A-page 5
MIC2874
TABLE 1-2:
ELECTRICAL CHARACTERISTICS – SINGLE-WIRE INTERFACE
(ENSURED BY DESIGN)
Electrical Specifications: unless otherwise specified, VIN = 3.6V; L = 0.47 µH; COUT = 4.7 µF; IOUT = 100 mA;
TA = TJ = +25°C. Boldface values indicate -40°C TJ +125°C.
Parameter
Low-Level Input Voltage
High-Level Input Voltage
Symbol
Min.
Typ.
Max.
VL
—
—
0.4
VH
—
Units
V
Test Conditions
—
1.3
—
IDC_PD
—
2.8
5
µA
VDC = 5.5V
On Time
TON
0.1
—
72
µs
—
Off Time
TOFF
0.1
—
72
µs
—
Latch Time
TLAT
97
—
324
µs
—
End Time
TEND
405
—
—
µs
—
DC Pull-Down Current
DS20006081A-page 6
—
2018 Microchip Technology Inc.
MIC2874
TEMPERATURE SPECIFICATIONS (Note 1)
Parameters
Symbol
Min.
Typ.
Max.
Units
Conditions
TJ
–40
—
150
°C
Operating Junction Temperature Range
TJ
–40
—
125
°C
—
Operating Ambient Temperature
TA
–40
—
85
°C
—
Storage Temperature
TS
–40
—
150
°C
—
Lead Temperature
—
—
—
260
°C
Soldering, 10s
JA
—
84
—
°C/W
Temperature Ranges
Maximum Junction Temperature Range
—
Package Thermal Resistance
Thermal Resistance 1.3x1.3 WLCSP-9BL
Note 1:
—
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +150°C rating. Sustained junction temperatures above +150°C can impact the device reliability.
2018 Microchip Technology Inc.
DS20006081A-page 7
MIC2874
2.0
Note:
TYPICAL CHARACTERISTIC CURVES
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
FIGURE 2-1:
Temperature.
Shutdown Current vs.
FIGURE 2-4:
Temperature.
Switching Frequency vs.
FIGURE 2-2:
Temperature.
Standby Current vs.
FIGURE 2-5:
Temperature.
Maximum Duty Cycle vs.
FIGURE 2-3:
Temperature.
UVLO Thresholds vs.
FIGURE 2-6:
LED Short Threshold
Voltage vs. Temperature.
DS20006081A-page 8
2018 Microchip Technology Inc.
MIC2874
FIGURE 2-7:
Temperature.
LED Short Test Current vs.
FIGURE 2-10:
WLED Power Efficiency vs.
Input Voltage (VF = 3.8V).
FIGURE 2-8:
vs. Input Voltage.
Boost Switching Frequency
FIGURE 2-11:
vs. Input Voltage.
Full Torch ILED Accuracy
FIGURE 2-9:
WLED Power Efficiency vs.
Input Voltage (VF = 3.4V).
FIGURE 2-12:
vs. Input Voltage.
Full Flash ILED Accuracy
2018 Microchip Technology Inc.
DS20006081A-page 9
MIC2874
Torch Mode Turn On Sequence
(Linear Mode)
(Boost Mode)
VFEN
(5V/div)
VDC
(5V/div)
VOUT
(2V/div)
VLED
(2V/div)
VOUT-VLED
(2V/div)
ILED
(500mA/div)
ILED = 300mA
VIN = 4.0V
L = 0.47μH
VOUT
(2V/div)
VLED
(2V/div)
ILED = 1.2A
VIN = 3.0V
L = 0.47μH
Time (100μs/div)
FIGURE 2-13:
Flash Mode Turn-On
Sequence (Boost Mode).
VOUT-VLED
(2V/div)
ILED
(200mA/div)
Time (200μs/div)
FIGURE 2-16:
Torch Mode Turn-On
Sequence (Linear Mode).
q
(Linear Mode)
VDC
(5V/div)
VFEN
(5V/div)
VOUT
(2V/div)
VLED
(2V/div)
VOUT
(2V/div)
VLED
(2V/div)
VOUT-VLED
(2V/div)
ILED
(500mA/div)
ILED = 1.2A
VIN = 4.5V
L = 0.47μH
Time (100μs/div)
FIGURE 2-14:
Flash Mode Turn-On
Sequence (Linear Mode).
ILED = 1.2A
VIN = 4.2V
L = 0.47μH
ILED
(500mA/div)
FIGURE 2-17:
1250 ms.
Time (200ms/div)
Flash Safety Timer at
(Boost Mode)
VDC
(5V/div)
VDC
(5V/div)
VOUT
(2V/div)
VLED
(2V/div)
ILED = 300mA
VIN = 3.0V
L = 0.47μH
VOUT
(2V/div)
VLED
(2V/div)
VOUT-VLED
(2V/div)
ILED
(200mA/div)
ILED = 1.2A
VIN = 4.2V
L = 0.47μH
Time (200μs/div)
FIGURE 2-15:
Torch Mode Turn-On
Sequence (Boost Mode).
DS20006081A-page 10
ILED
(500mA/div)
FIGURE 2-18:
156 ms.
Time (200ms/div)
Flash Safety Timer at
2018 Microchip Technology Inc.
MIC2874
LED Short Circuit Protection
(LED is Shorted by 0)
(VIN = 5.0V)
VDC
(5V/div)
VFEN
(5V/div)
VOUT
(2V/div)
VLED
(2V/div)
VIN = 3.6V
L = 0.47μH
LED IS SHORTED
BY 0ȍ
VOUT-VLED
(2V/div)
IL
(100mA/div)
ILED = 1.2A
VIN = 5.0V
L = 0.47μH
VFEN = 3.6V
VOUT
(2V/div)
VLED
(2V/div)
ILED
(500mA/div)
Time (40μs/div)
FIGURE 2-19:
LED Short-Circuit Protection
(LED is Shorted by 0).
Time (200ms/div)
FIGURE 2-22:
Load Disconnect at
Shutdown (VIN = 5.0V).
(Over-voltage during Start-up)
(LED is Shorted by 620)
VFEN
(5V/div)
VOUT
(2V/div)
VLED
(2V/div)
VIN = 3.6V
L = 0.47μH
LED IS SHORTED
BY 620ȍ
VOUT-VLED
(2V/div)
IL
(100mA/div)
VOUT
(2V/div)
VSW
(2V/div)
VLED
(2V/div)
IL
(1A/div)
Time (40μs/div)
FIGURE 2-20:
LED Short-Circuit Protection
(LED is Shorted by 620).
Time (40μs/div)
FIGURE 2-23:
VOUT Overvoltage
Protection (Overvoltage during Start-up).
(VIN = 2.7V)
VDC
(5V/div)
VIN = 3.6V
L = 0.47μH
(Over-voltage after Start-up)
ILED = 1.2A
VIN = 2.7V
L = 0.47μH
VFEN = 0V
VOUT
(2V/div)
VLED
(2V/div)
VOUT
(2V/div)
VSW
(2V/div)
ILED
(500mA/div)
VLED
(2V/div)
IL
(1A/div)
Time (200ms/div)
FIGURE 2-21:
Load Disconnect at
Shutdown (VIN = 2.7V).
2018 Microchip Technology Inc.
ILED = 1.2A
VIN = 3.6V
L = 0.47μH
Time (2μs/div)
FIGURE 2-24:
VOUT Overvoltage
Protection (Overvoltage after Start-up).
DS20006081A-page 11
MIC2874
(VIN Changes from 5.5V to 2.7V)
(Torch 63mA to Flash 1.2A)
VOUT
(2V/div)
VLED
(2V/div)
VLED
VIN
(1V/div)
VOUT-VLED
(2V/div)
ILED
(500mA/div)
VIN = 3.6V
L = 0.47μH
Time (100μs/div)
FIGURE 2-25:
Load Transient
(Torch 63 mA to Flash 1.2A).
VVOUT
IN
(1V/div)
VV
OUT
LED
(1V/div)
ILED
(500mA/div)
VIN = 5.5V to 2.7V
ILED = 1.2A
L = 0.47μH
Time (100μs/div)
FIGURE 2-28:
Line Transient (VIN Changes
from 5.5V to 2.7V).
(Flash 1.2A to Torch 63mA)
VIN
(2V/div)
VOUT
(2V/div)
VLED
(2V/div)
VIN = 3.6V
L = 0.47μH
VOUT-VLED
(2V/div)
ILED
(500mA/div)
Time (40μs/div)
FIGURE 2-26:
to Torch 63 mA).
Load Transient (Flash 1.2A
VOUT
(2V/div)
VSW
(2V/div)
IL
(1A/div)
VIN = 3.6V
VOUT = 5.2V
L = 0.47μH
FIGURE 2-29:
Time (400ns/div)
Switch Current Limit.
(VIN Changes from 2.7V to 5.5V)
VLED
VIN
(1V/div)
VVOUT
IN
(1V/div)
VV
OUT
LED
(1V/div)
ILED
(500mA/div)
VIN = 2.7V to 5.5V
ILED = 1.2A
L = 0.47μH
Time (10μs/div)
FIGURE 2-27:
Line Transient (VIN Changes
from 2.7V to 5.5V).
DS20006081A-page 12
2018 Microchip Technology Inc.
MIC2874
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
MIC2874
Pin Number
Pin Name
A1
LED
LED Current Sink Pin: Connect the LED anode to OUT and the cathode to this pin.
A2
DC
Single-Wire Interface: Serial control input.
A3
OUT
B1
LGND
B2
FEN
Flash Mode Enable Pin: Asserting this pin high enables the MIC2874 to enter Flash
mode. If this pin is left floating, it is pulled down internally by a built-in 1 µA current
source when the device is enabled.
Inductor Connection Pin: It is connected to the internal power MOSFETs.
B3
SW
C1
AGND
C2
VIN
C3
PGND
2018 Microchip Technology Inc.
Pin Function
Boost Converter Output Pin: To be connected to the anode of the LED. Connect a
low-ESR ceramic capacitor of at least 4.7 µF at this pin to PGND.
Linear Ground: LED current return path.
Analog Ground.
Supply Input Pin: Connect a low-ESR ceramic capacitor of at least 4.7 µF at this pin to
AGND.
Power Ground: Inductor current return path.
DS20006081A-page 13
MIC2874
4.0
FUNCTIONAL DESCRIPTION
4.7
4.1
VIN
This is the current sink pin for the LED. The LED anode
is connected to the OUT pin and the LED cathode is
connected to this pin.
The input supply provides power to the internal
MOSFETs’ gate drive and controls circuitry for the
Switch mode regulator. The operating input voltage
range is from 2.7V to 5.5V. A 4.7 µF low-ESR ceramic
input capacitor should be connected from VIN to AGND,
as close to MIC2874 as possible, to ensure a clean
supply voltage for the device. The minimum voltage
rating of 10V is recommended for the input capacitor.
4.2
SW
The MIC2874 has internal low-side and synchronous
MOSFET switches. The switch node (SW) between the
internal MOSFET switches connects directly to one end
of the inductor and provides the current paths during
switching cycles.
The other end of the inductor is connected to the input
supply voltage. Due to the high-speed switching on this
pin, the switch node should be routed away from
sensitive nodes wherever possible.
4.3
LGND
This is the ground path of the LED current sink. It should
be connected to the AGND on the PCB. The current loop
of the Analog Ground should be separated from that of
the Power Ground (PGND). LGND and AGND should be
connected to PGND at a single point.
4.4
AGND
This is the ground path for the internal biasing and control circuitry. AGND should be connected to the LGND
directly. The current loop of the Analog Ground should
be separated from that of the Power Ground (PGND).
The AGND and LGND should be connected to PGND at
a single point.
4.5
PGND
The Power Ground pin is the ground path for the high
current in the boost switch. The current loop for the
Power Ground should be as small as possible and
separate from the Analog Ground (AGND) loop as
applicable.
4.6
4.8
LED
DC
The DC is a single multiplexed device enable and serial
data control pin used for functional control, and communication in GPIO limited applications. When the DC
pin is used as a hardware device enable pin, a logic
high signal on the DC pin enables the device and a
logic low signal on the DC pin disables the device.
When the DC pin is used as the single-wire serial
interface Digital Control pin, a combination of bit edges
and the period between edges is used to communicate
a variable length data word across the single wire.
Each word is transmitted as a series of pulses, with
each pulse incrementing an internal data counter. A stop
sequence, consisting of an inactive period, is used to
latch the data word internally. Two data words in series
received are then used to set a specific register with a
specific value for controlling a specific function. The
MIC2874 supports five writable registers for controlling
Flash mode, Torch mode, safety timer duration, safety
timer threshold current and low-battery threshold.
An address/data frame is used to improve protection
against erroneous writes where communications are in
error. When the DC is in a low state, and no data is
detected for longer than 405 µs, the MIC2874 will
automatically go into a low-power Shutdown state,
simultaneously resetting all internal registers to their
default states.
4.9
FEN
FEN is the hardware enable pin for Flash mode. A logic
low-to-high transition on the FEN pin can initiate the
MIC2874 in Flash mode. If FEN is left floating, it is pulled
down internally by a built-in 1 µA current source when
the device is enabled. Flash mode is terminated when
FEN is pulled low or left floating and the Flash register is
cleared.
OUT
This is the boost converter output pin, which is connected to the anode of the LED. A low-ESR ceramic
capacitor of 4.7 µF or larger should be connected from
OUT to PGND, as close as possible to the MIC2874.
The minimum voltage rating of 10V is recommended for
the output capacitor.
DS20006081A-page 14
2018 Microchip Technology Inc.
MIC2874
5.0
APPLICATION INFORMATION
The MIC2874 can drive a high-current Flash WLED in
either Flash mode or Torch mode.
5.1
Boost Converter
The internal boost converter is turned on/off automatically
when the LED driver is activated/deactivated without any
exception.
The boost converter is an internally compensated Current
mode PWM boost converter running at 4 MHz. It is for
stepping up the supply voltage to a high enough value at
the OUT pin to drive the LED current. If the supply voltage
is high enough, the synchronous switch of the converter
is then fully turned on. In this case, all the excessive
voltage is dropped over the linear LED driver.
5.2
Flash Mode
The maximum and default current levels in the Flash
mode are 1.2A and 1A, respectively. The Flash mode current can be initiated by asserting the FEN pin high or by
setting the Flash Control register (Address 1) for the
desired Flash duration, subjected to the safety time-out
setting. The Flash mode current is terminated when the
FEN pin is brought low and the Flash register is cleared or
when the configurable safety timer expires.
Flash mode current can be adjusted to a fraction of the
maximum Flash mode current level by selecting the
desired value in the Flash Control register through the
single-wire serial interface.
5.3
Torch Mode
By default, the maximum Torch mode level is 300 mA.
The Torch mode operation is activated by setting the
Torch Control register (Address 2) for the desired duration. The Torch mode current is terminated when the
Torch register is cleared or when the configurable safety
timer expires.
Like the Flash mode current, the Torch mode current can
be set to a fraction of the maximum Torch mode current
level by selecting the desired torch current in the Torch
Control register (Address 2) via the single-wire serial
interface.
5.4
Configurable Safety Timer
The Flash safety time-out feature automatically shuts
down the LED current, after the safety timer duration is
expired, if the programmed LED current exceeds a certain
current threshold. Both the current threshold and the timer
duration are programmable via the Safety Timer registers
(Addresses 3 and 5).
2018 Microchip Technology Inc.
5.5
Low-Battery Voltage Detection
(LBVD)
When the VIN voltage drops below the LBVD threshold
(default = 3.0V) in Flash or Torch mode, the LED current
driver is disabled. The LED driver can be resumed by raising the VIN above the LBVD threshold and toggling the
corresponding Flash or torch command. The LBVD
threshold is adjustable through the LBVD Control register
(Address 4).
5.6
Overvoltage Protection
When the output voltage rises above an internal overvoltage protection (OVP) threshold, MIC2874 is latched off
automatically to avoid permanent damage to the IC. To
clear the latched off condition, either power cycle the
MIC2874 or assert the DC pin low.
5.7
Short-Circuit Detection
Each time, before enabling the LED driver, the
MIC2874 performs the short-circuit test by driving the
Flash LED with a small (2 mA typical) current for
200 µs. If (VOUT – VLED) is less than 1.7V at the end of
the short-circuit test, then the LED is considered to be
shorted and MIC2874 will ignore the Flash and/or Torch
mode command. Note that the short-circuit test is
carried out every time, prior to Flash and Torch mode,
but the result is not latched.
5.8
Thermal Shutdown
When the internal die temperature of MIC2874 reaches
155°C, the LED driver is disabled until the die temperature falls below 140°C and either the FEN pin, FEN
register, TEN register or VIN is toggled.
5.9
Single-Wire Interface
The single-wire interface allows the use of a single
multiplexed enable and data pin (DC) for control and
communication in GPIO limited applications. The interface is implemented using a simple mechanism, allowing
any open-drain or directly driven GPIO to control the
MIC2874.
The MIC2874 uses the single-wire interface for simple
command and control functions. The interface provides
fast access to write-only registers with protection features
to avoid potentially erroneous data writes and improve
robustness. When the DC is in a low state and no data is
detected for longer than 405 µs, the MIC2874 will
automatically go into a low-power Shutdown state, simultaneously resetting the internal registers to their default
states.
DS20006081A-page 15
MIC2874
5.10
Overview
The single-wire interface relies on a combination of bit
edges and the period between edges in order to communicate across a single wire. Each word is transmitted as a
series of pulses, with each pulse incrementing an internal
data counter. A stop sequence, consisting of an inactive
period of the DC pin remaining high, is used to latch the
data word internally. An address and data framing format
is used to improve protection against erroneous writes by
enforcing address and data field lengths, as well as the
timing duration between them.
Timing is designed such that when communicating with a
device using a low-cost on-chip oscillator, the worst-case
minimum and maximum conditions can be easily met
within the wide operating range of the oscillator. Using this
method ensures that the device can always detect the
delay introduced by the communication master.
IDLE
< TEND – TLAT
VH
VL
TLAT
TEND
VH
VL
TLAT
TEND
SHUTDOWN
IDLE
VH
VL
TLAT
TEND
5.11
Idle States and Error Conditions
In Shutdown mode, the MIC2874 is in a Reset condition,
with all functions off, while consuming minimal power.
Register settings are reset to a default state when coming
out of a Shutdown state. In Idle mode, all register settings
persist and all MIC2874 functions continue in their current
state. Table 5-1 summarizes the difference between the
two Idle modes:
TABLE 5-1:
DIFFERENCES BETWEEN
IDLE MODES
Mode
VDC
ISUPPLY (all functions off)
Shutdown
Idle
Low
High
1 µA
230 µA
Register State
Default
Persist
Start-up Time
1 µs
100 ns
Idle mode is entered automatically at the end of a communication frame by holding DC high for TEND, by enabling
the device by bringing DC high when in Shutdown mode
or when an error is detected by the single-wire interface
logic.
Shutdown mode can be entered at any time by pulling
down DC for TEND, discarding any current communication and resetting the internal registers. If a
communication is received before the shutdown period,
but after the TLAT period, the communication is
discarded. This state is also used to create an internal
error state to avoid erroneously latching data when the
communication process cannot be serviced in time.
Additionally, each register has a maximum value associated with it. If the number of bits clocked in exceeds
the maximum value for the register, the data is
assumed to be in error and the data is discarded.
DS20006081A-page 16
IDLE
FIGURE 5-1:
Abort, Shutdown and Idle
Timing Waveforms.
5.12
Communication Details
The serial interface requires delimiters to indicate the
Start-of-Frame (SOF), data as a series of pulses and
End-of-Frame (EOF), indicated by a lack of activity for
longer than TLAT. The Start-of-Frame is the first
high-to-low transition of DC when in Idle mode. The first
rising edge resets the internal data counter to 0.
END-OFFRAME
1 COUNT
VH
VL
TOFF
START
TON
TON + TOFF < TLAT
FIGURE 5-2:
TLAT
AUTOMATIC LATCH
AFTER TLAT EXPIRES
Data Word Pulse Timing.
A pulse is delimited by the signal first going below VL, and
then above VH, within the Latch Time-out, TLAT. During
this transition, the minimum on (TON) and off (TOFF)
periods are observed to improve tolerance to glitches.
Each rising edge increments the internal Data register.
Data is automatically latched into the internal shadow
address or Data registers after an inactivity period of the
DC remaining high for longer than TLAT.
To send register write commands, the address and data
are entered in series as two data words, using the above
pattern, with the second word starting after the first latch
period has expired. After the second word is entered, the
IDLE command should be issued by leaving the DC pin
high for TEND to indicate the stop sequence of the
address/data words frame.
2018 Microchip Technology Inc.
MIC2874
After receiving the stop sequence, the internal registers’
decode and update cycle is started, with the Shadow
register values being transferred to the decoder.
Figure 5-3 shows an example of entering a write of Data 5
to Address 3.
TABLE 5-3:
FEN/FCUR Value
ADDRESS/DATA FRAME
START
LATCH
START
LATCH
TLAT
0
1
2
T LAT
< T END
3
END
REGISTER
WRITE
0
1
2
3
4
5
> T END
FIGURE 5-3:
Communication Timing
Example of Entering Write for Data 5 to Address 3.
Only a correctly formatted address/data combination will
be treated as a valid frame and processed by the
MIC2874. Any other input, such as a single data word
followed by TEND or three successive data words, will be
discarded by the target hardware as an erroneous entry.
Additionally, any register write to either an invalid register
or with invalid register data will also be discarded.
5.13
MIC2874 Registers
The MIC2874 supports five writable registers for
controlling the Torch and the Flash modes of operation, as
shown in Table 5-2. Note that register addressing starts
at 1. Writing any value above the maximum value shown
for each register will cause an invalid data error and the
frame will be discarded.
TABLE 5-2:
FIVE WRITABLE REGISTERS
OF MIC2874
FLASH CURRENT REGISTER
MAPPING INTO INTERNAL
FEN/FCUR REGISTERS AND
RELATIONSHIP BETWEEN
FLASH CURRENT AND FCUR
REGISTER SETTING
Dec. Binary FEN FCUR
IFLASH (A)
0
00000
0
0000
1.200
1
00001
0
0001
1.150
2
00010
0
0010
1.100
3
00011
0
0011
1.050
4
00100
0
0100
1.000
5
00101
0
0101
0.950
6
00110
0
0110
0.900
7
00111
0
0111
0.850
8
01000
0
1000
0.800
9
01001
0
1001
0.750
10
01010
0
1010
0.700
11
01011
0
1011
0.650
12
01100
0
1100
0.600
13
01101
0
1101
0.550
14
01110
0
1110
0.400
15
01111
0
1111
0.250
16
10000
1
0000
1.200
17
10001
1
0001
1.150
18
10010
1
0010
1.100
19
10011
1
0011
1.050
20
10100
1
0100
1.000
Address
Name
Max.
Value
21
10101
1
0101
0.950
1
FEN/FCUR
31
Flash Enable/Current
22
10110
1
0110
0.900
2
TEN/TCUR
31
Torch Enable/Current
23
10111
1
0111
0.850
3
STDUR
7
Safety Timer Duration
24
11000
1
1000
0.800
4
LB_TH
9
Low-Battery Voltage
Detection Threshold
25
11001
1
1001
0.750
5
ST_TH
5
Safety Timer Threshold
26
11010
1
1010
0.700
27
11011
1
1011
0.650
28
11100
1
1100
0.600
29
11101
1
1101
0.550
30
11110
1
1110
0.400
31
11111
1
1111
0.250
5.13.1
Description
FLASH CURRENT REGISTER
(FEN/FCUR: DEFAULT 4)
The Flash Current register enables and sets the Flash
mode current level. Valid values are 0 to 31. Values 0-15
will set the Flash current without enabling the Flash (such
that it can be triggered externally). Values 16-31 will set
the Flash current and enable the Flash. The Flash current
register maps into the internal FEN and FCUR registers,
as shown in the following table below. Table 5-3 describes
the relationship between the Flash current and the FCUR
register setting.
2018 Microchip Technology Inc.
DS20006081A-page 17
MIC2874
5.13.2
TORCH CURRENT REGISTER
(TEN/TCUR: DEFAULT 4)
The Torch Current register enables and sets the Torch
mode current level. Valid values are 0 to 31. Values 0-15
will set the torch current without enabling the torch (such
that it can be triggered by setting the internal TEN register
value to 1). Values 16-31 will set the torch current and
enable the torch. A value of 0 at the internal TEN register
will disable the torch. The Torch Current register maps
into the internal TEN and TCUR registers, as shown in
Table 5-4. The table also describes the relationship
between the torch current and the TCUR register setting.
TABLE 5-4:
TORCH CURRENT REGISTER
MAPPING INTO INTERNAL
TEN/TCUR REGISTERS AND
RELATIONSHIP BETWEEN
TORCH CURRENT AND TCUR
REGISTER SETTING
TEN/TCUR Value
Dec. Binary TEN TCUR
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
00000
00001
00010
00011
00100
00101
00110
00111
01000
01001
01010
01011
01100
01101
01110
01111
10000
10001
10010
10011
10100
10101
10110
10111
11000
11001
11010
11011
11100
11101
11110
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
DS20006081A-page 18
0000
0001
0010
0011
0100
0101
0110
0111
1000
1001
1010
1011
1100
1101
1110
1111
0000
0001
0010
0011
0100
0101
0110
0111
1000
1001
1010
1011
1100
1101
1110
ITORCH (mA)
300.0
287.5
275.0
262.5
250.0
237.5
225.0
212.5
200.0
187.5
175.0
162.5
150.0
137.5
100.0
62.5
300.0
287.5
275.0
262.5
250.0
237.5
225.0
212.5
200.0
187.5
175.0
162.5
150.0
137.5
100.0
TEN/TCUR Value
Dec. Binary TEN TCUR
31
11111
5.13.3
1
ITORCH (mA)
62.5
1111
SAFETY TIMER DURATION
REGISTER (STDUR: DEFAULT 7)
The Safety Timer Duration register sets the duration of the
Flash and Torch mode when the LED current exceeds the
programmed threshold current. Valid values are 0 for the
minimum timer duration to 7 for the maximum duration.
TABLE 5-5:
Value
Dec. Binary
SAFETY TIMER DURATION
REGISTER SETTING AND
SAFETY TIMER DURATION
STDUR
(Binary)
Time-out (ms)
156.25
0
000
000
1
001
001
312.5
2
010
010
468.75
3
011
011
625
4
100
100
781.25
5
101
101
937.5
6
110
110
1093.75
7
111
111
1250
5.13.4
LOW-BATTERY THRESHOLD
REGISTER (LB_TH: DEFAULT 1)
The LB_TH register sets the supply threshold voltage,
below which the internal low-battery flag is asserted and
the LED current driver is disabled. Table 5-6 shows the
threshold values that correspond to the register settings.
Setting 0 is reserved for disabling the function, and
settings between 1 and 9 inclusively enable and set the
LB_TH value, between 3.0V and 3.8V, with 100 mV
resolution.
TABLE 5-6:
Value
Dec. Binary
LOW-BATTERY THRESHOLD
REGISTER SETTING AND
SUPPLY THRESHOLD
VOLTAGE
LB_TH
VBAT Threshold (V)
0
0000
0000
Disabled
1
0001
0001
3.0
2
0010
0010
3.1
3
0011
0011
3.2
4
0100
0100
3.3
5
0101
0101
3.4
6
0110
0110
3.5
2018 Microchip Technology Inc.
MIC2874
TABLE 5-7:
Value
Dec. Binary
LB_TH
VBAT Threshold (V)
7
0111
0111
3.6
8
1000
1000
3.7
9
1001
1001
3.8
5.13.5
SAFETY TIMER THRESHOLD
CURRENT REGISTER
(ST_TH: DEFAULT 4)
The Safety Timer Threshold Current register determines
the amount of LED current flowing through the external
LED before the internal LED safety timer is activated. Setting ST_TH to 0 disables the safety timer function, and
setting the register to Values 1-5 sets the safety timer
threshold current to 100 mA to 300 mA in 50 mA steps.
2018 Microchip Technology Inc.
SAFETY TIMER THRESHOLD
CURRENT REGISTER
SETTING AND SAFETY TIMER
THRESHOLD CURRENT
Value
Dec. Binary
ST_TH
Safety Timer
Threshold Current
(mA)
0
000
000
Disabled
1
001
001
100
2
010
010
150
3
011
011
200
4
100
100
250
5
101
101
300
DS20006081A-page 19
MIC2874
6.0
COMPONENT SELECTION
6.1
Inductor
Inductor selection should strike a balance between
efficiency, stability, cost, size, and rated current. Because
the boost converter is compensated internally, the recommended inductance of L is limited from 0.47 µH to 1 µH to
ensure system stability, and a 0.47 µH inductor is typically
recommended. It is usually a good balance between
these considerations.
A large inductance value reduces the peak-to-peak
inductor ripple current, hence the output ripple voltage
and the LED ripple current. This also reduces both the
DC loss and the transition loss at the same inductor’s
DC Resistance (DCR). However, the DCR of an inductor
usually increases with the inductance in the same package size. This is due to the longer windings required for
an increase in inductance. Because the majority of the
input current passes through the inductor, the higher the
DCR, the lower the efficiency is, and more significantly,
at higher load currents. On the other hand, an inductor
with a smaller DCR, but the same inductance, usually
has a larger size. The saturation current rating of the
selected inductor must be higher than the maximum
peak inductor current to be encountered and should be
at least 20% to 30% higher than the average inductor
current at maximum output current.
6.2
Input Capacitor
A ceramic capacitor of 4.7 µF or larger with low-ESR is
recommended to reduce the input voltage ripple to
ensure a clean supply voltage for the device. The input
capacitor should be placed as close as possible to the
MIC2874 VIN pin with a short trace for good noise
performance. X5R or X7R type ceramic capacitors are
recommended for better tolerance over temperature.
The Y5V and Z5U type temperature rating ceramic
capacitors are not recommended due to their large
reduction in capacitance over temperature and
increased resistance at high frequencies. These reduce
their ability to filter out high-frequency noise. The rated
voltage of the input capacitor should be at least 20%
higher than the maximum operating input voltage over
the operating temperature range.
6.3
Output Capacitor
Output capacitor selection is also a trade-off between
performance, size and cost. Increasing output
capacitance will lead to an improved transient
response; however, the size and cost also increase.
The output capacitor’s preferable range of 2.2 µF to
10 µF with ESR from 10 m to 50 m, and a 4.7 µF
ceramic capacitor is typically recommended. X5R or
X7R type ceramic capacitors are recommended for
better tolerance over temperature. The Y5V and Z5U
type ceramic capacitors are not recommended due to
their wide variation in capacitance over temperature
and increased resistance at high frequencies. The
rated voltage of the output capacitor should be at least
20% higher than the maximum operating output
voltage over the operating temperature range.
7.0
POWER DISSIPATION
CONSIDERATION
As with all power devices, the ultimate current rating of the
output is limited by the thermal properties of the device
package and the PCB on which the device is mounted.
There is a simple Ohm’s law type relationship between
thermal resistance, power dissipation and temperature,
which are analogous to an electrical circuit:
RXY
VX
VY
RYZ
VZ
+
VZ
ISOURCE
FIGURE 7-1:
Circuit.
Series Electrical Resistance
From this simple circuit, we can calculate VX if we know
ISOURCE, VZ and the resistor values, RXY and RYZ, using
Equation 7-1:
EQUATION 7-1:
CALCULATING VX
VX = ISOURCE (RXY + RYZ) = VZ
DS20006081A-page 20
2018 Microchip Technology Inc.
MIC2874
Thermal circuits can be considered using this same
rule and can be drawn similarly by replacing current
sources with power dissipation (in watts), resistance
with thermal resistance (in °C/W) and voltage sources
with temperature (in °C).
ĬJC
TJ
TC
ĬCA
TA
+
TA
PDISS
FIGURE 7-2:
Circuit.
EQUATION 7-4:
CALCULATING PDISS
Linear Mode:
PDISS = [POUT – 1 ] – IOUT2 DCR
Boost Mode:
I
PDISS = [POUT – 1 ] – OUT 2 DCR
1 – D
Duty Cycle in Boost Mode:
VOUT – VIN
D=
VOUT
Where:
= Efficiency taken from efficiency curves
DCR = Inductor DCR
Series Thermal Resistance
Now replacing the variables in the equation for VX, we
can find the Junction Temperature (TJ) from the power
dissipation, ambient temperature and the known thermal
resistance of the PCB (CA) and the package (JC).
EQUATION 7-2:
Where the real board area differs from 1 inch square,
CA (the PCB thermal resistance) values for various
PCB copper areas can be taken from Figure 7-3.
Figure 7-3 is taken from “Designing with Low Dropout
Voltage Regulators” available from the Microchip
web site (“LDO Application Hints”).
CALCULATING JUNCTION
TEMPERATURE
TJ = PDISS (JC + CA) + TA
As seen in Figure 7-2, the total thermal resistance is:
JA = JC + CA. Hence, this can also be written as in
Equation 7-3:
EQUATION 7-3:
CALCULATING THERMAL
RESISTANCE
TJ = PDISS (JA) + TA
Where:
θJA = Thermal resistance between junction and ambient,
which is typically 84°C/W for 1.3 mm x 1.3 mm
WLCSP package
Since effectively all of the power losses (minus the
inductor losses) in the converter are dissipated within
the MIC2874 package, PDISS can be calculated thus:
FIGURE 7-3:
Graph to Determine PC
Board Area for a Given PCB Thermal Resistance.
Figure 7-3 shows the total area of a round or square
pad, centered on the device. The solid trace represents
the area of a square, single-sided, horizontal orientation, solder masked, copper PC board trace heat sink,
measured in square millimeters. No airflow is assumed.
The dashed line shows the PC board’s trace heat sink
covered in black oil-based paint and with 1.3m/sec
(250 feet per minute) airflow. This approaches a
“best case” pad heat sink. Conservative design
dictates using the solid trace data, which indicates that
a maximum pad size of 5000 mm2 is needed. This is a
pad that is 71 mm by 71 mm (2.8 inches per side).
2018 Microchip Technology Inc.
DS20006081A-page 21
MIC2874
8.0
PCB LAYOUT GUIDELINES
PCB layout is critical to achieve reliable, stable and
efficient performance. A ground plane is required to
control EMI and minimize the inductance in power and
signal return paths. The following guidelines should be
followed to ensure proper operation of the device.
8.1
IC (Integrated Circuit)
• Place the IC close to the point-of-load (in this
case, the flash LED).
• Use fat traces to route the input and output power
lines.
• Analog grounds (LGND and AGND) and power
ground (PGND) should be kept separate and connected at a single location.
• 6 to 12 thermal vias must be placed on the PCB
top layer PGND copper from the PGND pin and
connected it to the ground plane to ensure a good
PCB thermal resistance can be achieved.
• Since all the top copper areas connected directly
to the CSP package bumps are used as the
immediate PCB heat sink, these top copper areas
should be spread out from the bumps in funnel-shape to maximize the top copper PCB heat
sink areas.
8.2
8.4
Output Capacitor
• The output capacitor must be placed close to the
OUT pin and PGND pin of the IC and preferably
connected directly and closely to the OUT pin and
PGND pin without going through any via to minimize the switching current loop during the main
switch off-cycle, and the switching noise.
• Use wide and short traces to connect the output
capacitor to the OUT and PGND pins.
• Place several vias to the ground plane close to
the output capacitor ground terminal.
• Use either X5R or X7R temperature rating
ceramic capacitors. Do not use Y5V or Z5U type
ceramic capacitors.
8.5
Flash LED
• Use wide and short trace to connect the LED
anode to the OUT pin.
• Use wide and short trace to connect the LED
cathode to the LED pin.
• Make sure that the LED’s PCB land pattern can
provide sufficient PCB pad heat sink to the flash
LED, such as sufficient copper areas and thermal
vias.
VIN Decoupling Capacitor
• The VIN decoupling capacitor must be placed
close to the VIN pin of the IC and preferably connected directly to the pin and not through any via.
The capacitor must be located right at the IC.
• The VIN decoupling capacitor should be connected to analog ground (AGND).
• The VIN terminal is noise sensitive and the placement of capacitor is very critical.
8.3
Inductor
• Keep both the inductor connections to the switch
node (SW) and input power line short and wide
enough to handle the switching current. Keep the
areas of the switching current loops small to minimize the EMI problem.
• Do not route any digital lines underneath or close
to the inductor.
• Keep the switch node (SW) away from the noise
sensitive pins.
• To minimize noise, place a ground plane underneath the inductor.
DS20006081A-page 22
2018 Microchip Technology Inc.
MIC2874
9.0
PACKAGING INFORMATION
9.1
Package Marking Information
9-Bump WLCSP*
XXX
NNN
Legend: XX...X
Y
YY
WW
NNN
e3
*
Example
74A
007
Product code or customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
●, ▲, ▼ Pin one index is identified by a dot, delta up or delta down (triangle
mark).
Note:
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information. Package may or may not include
the corporate logo.
Underbar (_) and/or Overbar (‾) symbol may not be to scale.
2018 Microchip Technology Inc.
DS20006081A-page 23
MIC2874
9.2
Package Details
The following sections give the technical details of the packages.
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
DS20006081A-page 24
2018 Microchip Technology Inc.
MIC2874
APPENDIX A:
REVISION HISTORY
Revision A (October 2018)
• Converted Micrel document MIC2874 to
Microchip data sheet DS20006081A.
• Minor text changes throughout document.
2018 Microchip Technology Inc.
DS20006081A-page 25
MIC2874
NOTES:
DS20006081A-page 26
2018 Microchip Technology Inc.
MIC2874
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
PART NO.
Device
XX
X
–
Temperature Package
XX
Examples:
a)
MIC2874YCS-T5:
MIC2874,
-40°C to +125°C Temp. Range,
9-Bump WLCSP, 500/Reel
b)
MIC2874YCS-TR:
MIC2874,
-40°C to +125°C Temp. Range,
9-Bump WLCSP, 5,000/Reel
Media
Type
Device:
MIC2874:
1.2A High-Brightness Flash LED Driver
with Single-Wire Serial Interface
Temperature:
Y
=
-40°C to +125°C
Package:
CS
=
9-bump 1.30 mm x 1.30 mm WLCSP
Media Type:
T5
TR
=
=
500/Reel
5,000/Reel
2018 Microchip Technology Inc.
Note 1:
Tape and Reel identifier only appears in the
catalog part number description. This identifier is
used for ordering purposes and is not printed on
the device package. Check with your Microchip
Sales Office for package availability with the
Tape and Reel option.
DS20006081A-page 27
MIC2874
NOTES:
DS20006081A-page 28
2018 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
The Microchip name and logo, the Microchip logo, AnyRate, AVR,
AVR logo, AVR Freaks, BitCloud, chipKIT, chipKIT logo,
CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo,
JukeBlox, KeeLoq, Kleer, LANCheck, LINK MD, maXStylus,
maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip
Designer, QTouch, SAM-BA, SpyNIC, SST, SST Logo,
SuperFlash, tinyAVR, UNI/O, and XMEGA are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
and other countries.
ClockWorks, The Embedded Control Solutions Company,
EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS,
mTouch, Precision Edge, and Quiet-Wire are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, BodyCom, CodeGuard,
CryptoAuthentication, CryptoAutomotive, CryptoCompanion,
CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average
Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial
Programming, ICSP, INICnet, Inter-Chip Connectivity,
JitterBlocker, KleerNet, KleerNet logo, memBrain, Mindi, MiWi,
motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB,
MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation,
PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon,
QMatrix, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O,
SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total
Endurance, TSHARC, USBCheck, VariSense, ViewSpan,
WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
Silicon Storage Technology is a registered trademark of Microchip
Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2018, Microchip Technology Incorporated, All Rights Reserved.
ISBN: 978-1-5224-3693-5
== ISO/TS 16949 ==
2018 Microchip Technology Inc.
DS20006081A-page 29
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
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Technical Support:
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Web Address:
www.microchip.com
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Canada - Toronto
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Fax: 905-695-2078
DS20006081A-page 30
China - Xiamen
Tel: 86-592-2388138
China - Zhuhai
Tel: 86-756-3210040
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Norway - Trondheim
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Poland - Warsaw
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Romania - Bucharest
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Spain - Madrid
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Sweden - Stockholm
Tel: 46-8-5090-4654
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
2018 Microchip Technology Inc.
08/15/18
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