MIC2875
4.8A ISW, Synchronous Boost Regulator
with Bi-Directional Load Disconnect
Features
General Description
• Up to 95% Efficiency
• Input Voltage Range: 2.5V to 5.5V
• Fully-Integrated, High-Efficiency, 2 MHz
Synchronous Boost Regulator
• Bi-Directional True Load Disconnect
• Integrated Anti-Ringing Switch
• Minimum Switching Frequency of 45 kHz
• 5.0V.
MIC2875 (Adjustable Output)
* Two more 22 μF capacitors should be added in parallel with C2 for VIN > 5.0V.
Efficiency vs. Load Current
DS20005549B-page 2
2016 - 2022 Microchip Technology Inc.
MIC2875
Functional Block Diagrams
MIC2875 (Fixed Output)
MIC2875 (Adjustable Output)
2016 - 2022 Microchip Technology Inc.
DS20005549B-page 3
MIC2875
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
IN, EN, OUT, FB, /PG to PGND ................................................................................................................... –0.3V to +6V
AGND to PGND......................................................................................................................................... –0.3V to +0.3V
Power Dissipation.....................................................................................................................Internally Limited (Note 1)
ESD Rating (Note 2)................................................................................................................. ±1.5 kV HBM, ±200V MM
Operating Ratings ††
Supply Voltage (VIN) .............................................................................................................................. +2.5V to +5.5V
Output Voltage (VOUT).................................................................................................................................... Up to +5.5V
Enable Voltage (VEN) ....................................................................................................................................... 0V to +VIN
† Notice: Exceeding the absolute maximum ratings may damage the device.
†† Notice: The device is not guaranteed to function outside its operating ratings.
Note 1: The maximum allowable power dissipation of any TA (ambient temperature) is PD(max) = (TJ(max) – TA) / ϴJA.
Exceeding the maximum allowable power dissipation will result in excessive die temperature, and the regulator will go into thermal shutdown
2: Devices are ESD sensitive. Handling precautions are recommended. Human body model, 1.5 kΩ in series
with 100 pF.
DS20005549B-page 4
2016 - 2022 Microchip Technology Inc.
MIC2875
ELECTRICAL CHARACTERISTICS (Note 1)
Electrical Characteristics: VIN = 3.6V, VOUT = 5V, CIN = 4.7 µF, COUT = 22 µF, L = 1 µH TA = 25°C, bold values are
valid for –40°C TJ +125°C Unless otherwise indicated.
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Power Supply
Supply Voltage Range
VIN
2.5
—
5.5
V
—
UVLO Rising Threshold
VUVLOR
—
2.32
2.49
V
—
UVLO Hysteresis
VUVLOH
—
200
—
mV
—
Quiescent Current
IVIN
—
1
—
mA
Operating at minimum
switching frequency
VIN Shutdown Current
IVINSD
—
1
3
µA
VEN = 0V, VIN = 5.5V, VOUT =
0V
VOUT Shutdown Current
IVOUTSD
—
2
5
µA
VEN = 0V, VIN = 0.3V, VOUT =
5.5V
Output Voltage
VOUT
VIN
—
5.5
V
—
Feedback Voltage
VFB
0.8865
0.9
0.9135
V
Adjustable version, IOUT = 0A
Voltage Accuracy
—
–1.5
—
+1.5
%
Fixed version, IOUT = 0A
Line Regulation
—
—
0.3
—
%/V
2.5V < VIN < 4.5V, IOUT =
500 mA
Load Regulation
—
—
0.2
—
%/A
IOUT = 200 mA to 1200 mA
Maximum Duty Cycle
DMAX
—
92
—
%
—
Minimum Duty Cycle
DMIN
—
6.5
—
%
—
Low-side Switch Current
Limit
ILS
3.8
4.8
5.8
A
VIN = 2.5V
PMOS
—
79
—
mΩ
VIN = 3.0V, ISW = 200 mA,
VOUT = 5.0V
NMOS
—
82
—
mΩ
VIN = 3.0V, ISW = 200 mA,
VOUT = 5.0V
Switch Leakage Current
(Note 2)
ISW
—
0.2
5
µA
VEN = 0V, VIN = 5.5V
Minimum Switching
Frequency
FSWMIN
—
45
—
kHz
IOUT = 0 mA
Oscillator Frequency
FOSC
1.6
2
2.4
MHz
—
—
155
—
Switch On-Resistance
Overtemperature
Shutdown Threshold
Overtemperature
Shutdown Hysteresis
TSD
—
°C
—
15
—
—
1.1
—
—
Soft-Start
Soft-Start Time
Note 1:
2:
TSS
ms
VOUT = 5.0V
Specification for packaged product only.
Guaranteed by design and characterization.
2016 - 2022 Microchip Technology Inc.
DS20005549B-page 5
MIC2875
ELECTRICAL CHARACTERISTICS (Continued)(Note 1)
Electrical Characteristics: VIN = 3.6V, VOUT = 5V, CIN = 4.7 µF, COUT = 22 µF, L = 1 µH TA = 25°C, bold values are
valid for –40°C TJ +125°C Unless otherwise indicated.
Parameters
Sym.
Min.
Typ.
Max.
1.5
—
—
—
—
0.4
Units
Conditions
EN, /PG Control Pins
EN Threshold Voltage
VEN
V
Boost converter and chip logic
ON
Boost converter and chip logic
OFF
EN Pin Current
—
—
1.5
3
µA
VIN = VEN = 3.6V
Power-Good Threshold
(Rising)
V/PG-THR
—
0.90 ×
VOUT
—
V
—
Power-Good Threshold
(Falling)
V/PG-THF
—
0.83 ×
VOUT
—
V
—
Note 1:
2:
Specification for packaged product only.
Guaranteed by design and characterization.
DS20005549B-page 6
2016 - 2022 Microchip Technology Inc.
MIC2875
TEMPERATURE SPECIFICATIONS (Note 1)
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Lead Temperature
—
—
260
—
°C
Soldering 10s
Storage Temperature Range
TS
–65
—
+150
°C
—
Junction Operating Temperature
TJ
–40
—
+125
°C
—
JA
—
90
—
°C/W
—
Temperature Ranges
Package Thermal Resistances
Thermal Resistance, UDFN-2x2-8Ld
Note 1:
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.
2016 - 2022 Microchip Technology Inc.
DS20005549B-page 7
MIC2875
2.0
TYPICAL PERFORMANCE CURVES
100
OSCILLATOR FREQUENCY (MHz)
2.04
EFFICIENCY (%)
90
VIN = 3.6V
80
VIN = 3.0V
VIN = 2.5V
70
60
VOUT = 5.0V
L = 1μH
COUT = 22μF
2.02
2.00
VIN = 3.6V
VOUT = 5.0V
L = 1μH
COUT = 22μF
IOUT = 0A
1.98
1.96
50
0.001
0.010
0.100
-50
1.000
-25
0
25
LOAD CURRENT (A)
FIGURE 2-1:
Efficiency vs. Load Current.
FIGURE 2-4:
Temperature.
100
125
150
Oscillator Frequency vs.
5.05
SHUTDOWN CURRENT (μA)
ADJUSTABLE
R2 = 910k
R3 = 200k
VIN = 3.5V
VOUT = 5.0V
L = 1μH
COUT = 22μF
5.00
TA = 125Ԩ
4.95
TA = 25Ԩ
VEN = 0V
VIN = 0.3V
VOUT = 5.5V
3.50
3.00
2.50
2.00
ADJUSTABLE
R2 = 910k
R3 = 200k
1.50
TA = -40Ԩ
1.00
4.90
0.0
0.5
1.0
1.5
-50
2.0
-25
FIGURE 2-2:
Current.
0
25
50
75
100
125
150
TEMPERATURE (Ԩ)
LOAD CURRENT (A)
Output Voltage vs. Load
FIGURE 2-5:
vs. Temperature.
5.20
Output Shutdown Current
0.904
VOUT = 5.0V
L = 1μH
COUT = 22μF
IOUT = 500mA
5.10
FEEDBACK VOLTAGE (V)
OUTPUT VOLTAGE (V)
75
4.00
5.10
OUTPUT VOLTAGE (V)
50
TEMPERATURE (Ԩ)
5.00
TA = 125Ԩ
4.90
ADJUSTABLE
R2 = 910k
R3 = 200k
TA = 25Ԩ
TA = -40Ԩ
0.902
0.900
0.898
ADJUSTABLE
VOUT = 5.0V
R2 = 910k
R3 = 200k
0.896
4.80
2.5
3.0
3.5
4.0
4.5
5.0
-50
FIGURE 2-3:
Voltage.
DS20005549B-page 8
Output Voltage vs. Input
-25
0
25
50
75
100
125
150
TEMPERATURE (Ԩ)
INPUT VOLTAGE(V)
FIGURE 2-6:
Temperature.
Feedback Voltage vs.
2016 - 2022 Microchip Technology Inc.
MIC2875
2.40
INPUT VOLTAGE (V)
RISING
VSW
(5V/div)
V/PG
(2V/div)
2.30
2.20
VOUT
(1V/div)
(AC-COUPLED)
FALLING
2.10
IOUT
(1A/div)
2.00
-50
-25
0
25
50
75
100
125
150
Time (100μs/div)
TEMPERATURE (Ԩ)
FIGURE 2-7:
Temperature.
VIN = 3.5V, VOUT = 5.0V
L = 1μH, IOUT = 0A TO 1.2A
FIGURE 2-10:
UVLO Threshold vs.
Load Transient (0A to 1.2A).
.
(
)
ENABLE THRESHOLD VOLTAGE (V)
1.20
VSW
(5V/div)
V/PG
(2V/div)
RISING
1.00
VOUT
(1V/div)
(AC-COUPLED)
0.80
FALLING
IOUT
(1A/div)
0.60
-50
-25
0
25
50
75
100
125
150
Time (100μs/div)
TEMPERATURE (Ԩ)
FIGURE 2-8:
Temperature.
Enable Threshold vs.
FIGURE 2-11:
.
POWER GOOD THRESHOLD VOLTAGE (V)
VIN = 3.5V, VOUT = 5.0V
L = 1μH, IOUT = 1.2A TO 0A
Load Transient (1.2A to 0A).
(
)
4.80
4.60
RISING
VIN
(2V/div)
VOUT
(500mV/div)
(AC-COUPLED)
ADJUSTABLE
R2 = 910kё
R3 = 200k
VOUT = 5.0V
4.40
4.20
VOUT
(5V/div)
FALLING
4.00
3.80
-50
-25
0
25
50
75
100
125
150
TEMPERATURE (Ԩ)
FIGURE 2-9:
Temperature.
Power Good Threshold vs.
2016 - 2022 Microchip Technology Inc.
VIN = 2.5V TO 3.5V
VOUT = 5.0V
L = 1μH
IOUT = 1A
IL
(2A/div)
Time (100μs/div)
FIGURE 2-12:
3.5V).
Line Transient (2.5V to
DS20005549B-page 9
MIC2875
.
(
VIN
(2V/div)
VOUT
(500mV/div)
(AC-COUPLED)
(
)
pp g
VSW
(2V/div)
VIN = 3.5V TO 2.5V, VOUT = 5.0V
L = 1μH, IOUT = 1A
VOUT
(50mV/div)
(AC-COUPLED)
VOUT
(5V/div)
PULSE SKIPPING MODE
VIN = 3.5V, VOUT = 5.0V, IOUT = 50mA
IL
(200mA/div)
IL
(2A/div)
Time (100μs/div)
FIGURE 2-13:
2.5V).
.
)
Line Transient (3.5V to
(
FIGURE 2-16:
Output Ripple (Pulse Skipping
Mode).
(
)
VIN = 2.5V TO 5.5V
VOUT = 5.0V
L = 1μH
IOUT = 1A
VIN
(2V/div)
VOUT
(2V/div)
(AC-COUPLED)
Time (4μs/div)
)
VSW
(5V/div)
VOUT
(50mV/div)
(AC-COUPLED)
VOUT
(5V/div)
IL
(5A/div)
IL
(1A/div)
PWM MODE
VIN = 3.5V, VOUT = 5.0V, IOUT = 1.2A
Time (200ns/div)
Time (100μs/div)
FIGURE 2-14:
5.5V).
Line Transient (2.5V to
(
VIN
(2V/div)
VOUT
(2V/div)
(AC-COUPLED)
FIGURE 2-17:
(
)
VIN = 5.5V TO 2.5V
VOUT = 5.0V, L = 1μH
IOUT = 1A
IL
(5A/div)
BOOST MODE
VIN = 3.5V
VOUT = 5.0V
IOUT = 500mA
VEN
(2V/div)
V/PG
(2V/div)
IL
(1A/div)
Time (400μs/div)
Time (100μs/div)
DS20005549B-page 10
)
VOUT
(5V/div)
VOUT
(5V/div)
FIGURE 2-15:
2.5V).
Output Ripple (PWM Mode).
Line Transient (5.5V to
FIGURE 2-18:
Soft–Start (Boost Mode).
2016 - 2022 Microchip Technology Inc.
MIC2875
BYPASS MODE
VIN = 5.5V
VOUT = 5.0V
IOUT = 500mA
VEN
(2V/div)
V/PG
(5V/div)
VOUT = 5.0V
BYPASS MODE – VIN > 5.0V
VOUT = VIN
VOUT
(5V/div)
VIN
(1V/div)
IL
(1A/div)
IOUT = 0A
Time (1s/div)
Time (400μs/div)
FIGURE 2-19:
Soft–Start Bypass Mode.
FIGURE 2-22:
Bypass Mode.
VOUT = 5.0V
VSW
(2V/div)
VOUT = 5.0V
VOUT
(1V/div)
VOUT = 5.0V
VOUT
(1V/div)
VIN = 3.5V, FSWMIN = 45kHz, IOUT = 0A
BYPASS MODE – VIN > 5.0V
VOUT = VIN
IL
(200mA/div)
VIN
(1V/div)
Time (1s/div)
Time (20μs/div)
FIGURE 2-20:
Minimum Switching.
(
VSW
(2V/div)
IOUT = 500mA
FIGURE 2-23:
Bypass Mode.
)
VIN = 3.5V
FSWMIN = 45kHz
IOUT = 0A
IL
(200mA/div)
Time (400ns/div)
FIGURE 2-21:
(Zoom–In).
Minimum Switching
2016 - 2022 Microchip Technology Inc.
DS20005549B-page 11
MIC2875
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
Pin Number
Fixed Output
Pin Number
Adj. Output
Pin Name
1
1
SW
Boost Converter Switch Node: Connect the inductor between
IN and SW pins.
2
2
PGND
Power Ground: The power ground for the synchronous boost
DC/DC converter power stage.
3
3
IN
4
4
AGND
Analog Ground: The analog ground for the regulator control
loop.
5
—
OUTS
Output Voltage Sense Pin: For output voltage regulation in fixed
voltage version. Connect to the boost converter output.
—
5
FB
Feedback Pin: For output voltage regulation in adjustable
version. Connect to the feedback resistor divider.
6
6
EN
Boost Converter Enable: When this pin is driven low, the IC
enters shutdown mode. The EN pin has an internal 2.5 MΩ
pull-down resistor. The output is disabled when this pin is left
floating.
7
7
/PG
Open Drain Power Good Output (Active Low): The /PG pin is
high impedance when the output voltage is below the power
good threshold and becomes low once the output is above the
power good threshold. The /PG pin has a typical RDS(ON) = 90Ω
and requires a pull up resistor of 1 MΩ. Connect /PG pin to
AGND when the /PG signal is not used.
Description
Supply Input: Connect at least 1 µF ceramic capacitor between
IN and AGND pins.
8
8
OUT
Boost Converter Output.
EP
EP
ePad
Exposed Heat Sink Pad. Connect to AGND for best thermal
performance.
DS20005549B-page 12
2016 - 2022 Microchip Technology Inc.
MIC2875
4.0
FUNCTIONAL DESCRIPTION
4.1
Input (IN)
The input supply provides power to the internal
MOSFETs gate drivers and control circuitry for the
boost regulator. The operating input voltage range is
from 2.5V to 5.5V. A 1 µF low-ESR ceramic input
capacitor should be connected from IN to AGND as
close to MIC2875 as possible to ensure a clean supply
voltage for the device. A minimum voltage rating of 10V
is recommended for the input capacitor.
4.2
Switch Node (SW)
The MIC2875 has internal low-side and synchronous
MOSFET switches. The switch node (SW) between the
internal MOSFET switches connects directly to one
end of the inductor and provides the current path during
switching cycles. The other end of the inductor is
connected to the input supply voltage. Due to the
high-speed switching on this pin, the switch node
should be routed away from sensitive nodes wherever
possible.
4.3
4.7
Feedback/Output Voltage Sense
(FB/OUTS)
Feedback or output voltage sense pin for the boost
converter. For the fixed voltage version, this pin should
be connected to the OUT pin. For the adjustable
version, connect a resistor divider to set the output
voltage (see “Section 5.7 “Output Voltage
Programming”” for more information).
4.8
Power Good Output (/PG)
The open-drain active-low power-good output (/PG) is
low when the output voltage is above the power-good
threshold. A pull-up resistor of 1 MΩ is recommended.
4.9
Exposed Heat Sink Pad (EP)
The exposed heat sink pad, or ePad (EP), should be
connected to AGND for best thermal performance.
Ground Path (AGND)
The ground path (AGND) is for the internal biasing and
control circuitry. AGND should be connected to the
PCB pad for the package exposed pad. The current
loop of the analog ground should be separated from
that of the power ground (PGND). AGND should be
connected to PGND and EP at a single point.
4.4
Power Ground (PGND)
The power ground (PGND) is the ground path for the
high current in the boost switches. The current loop for
the power ground should be as short as possible and
separate from the AGND loop as applicable.
4.5
Boost Converter Output (OUT)
A low-ESR ceramic capacitor of 22 µF (for operation
with VIN ≤ 5.0V), or 66 µF (for operation with VIN >
5.0V) should be connected from VOUT to PGND as
close as possible to the MIC2875. A minimum voltage
rating of 10V is recommended for the output capacitor.
4.6
Enable (EN)
Enable pin of the MIC2875. A logic high on this pin
enables the MIC2875. When this pin is driven low, the
MIC2875 enters the shutdown mode. When the EN pin
is left floating, it is pulled-down internally by a built-in
2.5 MΩ resistor.
2016 - 2022 Microchip Technology Inc.
DS20005549B-page 13
MIC2875
5.0
APPLICATION INFORMATION
5.1
General Description
The MIC2875 is a 2 MHz, current-mode, PWM,
synchronous boost converter with an operating input
voltage range of 2.5V to 5.5V. At light load, the
converter enters pulse-skipping mode to maintain high
efficiency over a wide range of load current. The
maximum peak current in the boost switch is limited to
4.8A (typical).
5.2
Bi-Directional Output Disconnect
The power stage of the MIC2875 consists of a NMOS
transistor as the main switch and a PMOS transistor as
the synchronous rectifier. A control circuit turns off the
back gate diode of the PMOS to isolate the output from
the input supply when the chip is disabled (VEN = 0V).
An “always on” maximum supply selector switches the
cathode of the back-gate diode to either the IN or the
OUT (whichever of the two has the higher voltage). As
a result, the output of the MIC2875 is bi-directionally
isolated from the input as long as the device is
disabled. The maximum supply selector and hence the
output disconnect function requires only 0.3V at the IN
pin to operate.
5.3
Minimum Switching Frequency
When the MIC2875 enters the pulse-skipping mode for
more than 20 µs, an internal control circuitry forces the
PMOS to turn on briefly to discharge VOUT to VIN
through the inductor. When the inductor current
reaches a predetermined threshold, the PMOS is
turned off and the NMOS is turned on so that the
inductor current can decrease gradually. Once the
inductor current reaches zero, the NMOS is eventually
turned off. The above cycle repeats if there is no
switching activity for another 20 µs, effectively
maintaining a minimum switching frequency of 45 kHz.
The frequency control circuit is disabled when VOUT is
less than or within 200 mV of VIN. This minimum
switching frequency feature is advantageous for
applications that are sensitive to low-frequency EMI,
such as audio systems.
5.4
Integrated Anti-Ringing Switch
The MIC2875 includes an anti-ringing switch that
eliminates the ringing on the SW node of a
conventional boost converter operating in the
discontinuous conduction mode (DCM). At the end of a
switching cycle during DCM operation, both the NMOS
and PMOS are turned off. The anti-ringing switch in the
MIC2875 clamps the SW pin voltage to IN to dissipate
the remaining energy stored in the inductor and the
parasitic elements of the power switches.
DS20005549B-page 14
5.5
Automatic Bypass Mode (when
VIN > VOUT)
The MIC2875 automatically operates in bypass mode
when the input voltage is higher than the target output
voltage. In bypass mode, the NMOS is turned off while
the PMOS is fully turned-on to provide a very low
impedance path from IN to OUT.
5.6
Soft-Start
The MIC2875 integrates an internal soft-start circuit to
limit the inrush current during start-up. When the device
is enabled, the PMOS is turned-on slowly to charge the
output capacitor to a voltage close to the input voltage.
Then, the device begins boost switching cycles to
gradually charge up the output voltage to the target
VOUT.
5.7
Output Voltage Programming
The MIC2875 has an adjustable version that allows the
output voltage to be set by an external resistor divider
R2 and R3. The typical feedback voltage is 900 mV, the
recommended maximum and minimum output voltage
is 5.5V and 3.2V, respectively. The current through the
resistor divider should be significantly larger than the
current into the FB pin (typically 0.01 µA). It is
recommended that 0.1% tolerance feedback resistors
must be used and the total resistance of R2 + R3
should be around 1 MΩ. The appropriate R2 and R3
values for the desired output voltage are calculated as
in Equation 5-1:
EQUATION 5-1:
V OUT
R2 = R3 ------------–1
0.9V
5.8
Current Limit Protection
The MIC2875 has a current limit feature to protect the
part against heavy loading condition. When the current
limit comparator determines that the NMOS switch has
a peak current higher than 4.8A, the NMOS is turned off
and the PMOS is turned on until the next switching
cycle. The overcurrent protection is reset cycle by
cycle.
2016 - 2022 Microchip Technology Inc.
MIC2875
6.0
COMPONENT SELECTION
6.1
Inductor
Inductor selection is a trade-off between efficiency,
stability, cost, size, and rated current. Because the
boost converter is compensated internally, the
recommended inductance is limited from 1 µH to
2.2 µH to ensure system stability and presents a good
balance between these considerations.
A large inductance value reduces the peak-to-peak
inductor ripple current hence the output ripple voltage.
This also reduces both the DC loss and the transition
loss at the same inductor’s DC resistance (DCR).
However, the DCR of an inductor usually increases
with the inductance in the same package size. This is
due to the longer windings required for an increase in
inductance.
Since the majority of the input current passes through
the inductor, the higher the DCR the lower the
efficiency is, and more significantly at higher load
currents. On the other hand, inductor with smaller DCR
but the same inductance usually has a larger size. The
saturation current rating of the selected inductor must
be higher than the maximum peak inductor current to
be encountered and should be at least 20% to 30%
higher than the average inductor current at maximum
output current.
6.2
Input Capacitor to the Device
Supply
A ceramic capacitor of 1 µF or larger with low ESR is
recommended to reduce the input voltage ripple to
ensure a clean supply voltage for the device. The input
capacitor should be placed as close as possible to the
MIC2875 IN pin and AGND pin with short traces to
ensure good noise performance. X5R or X7R type
ceramic capacitors are recommended for better
tolerance over temperature.
performance at heavy load condition. X5R or X7R type
ceramic capacitors are recommended for better
tolerance overtemperature.
The Y5V and Z5U type temperature rating ceramic
capacitors are not recommended due to their large
reduction in capacitance over temperature and
increased resistance at high frequencies. These
reduce their ability to filter out high-frequency noise.
The rated voltage of the input capacitor should be at
least 20% higher than the maximum operating input
voltage over the operating temperature range.
6.4
Output Capacitor
Output capacitor selection is also a trade-off between
performance, size, and cost. Increasing output
capacitor will lead to an improved transient response,
however, the size and cost also increase. For operation
with VIN ≤ 5.0V, a minimum of 22 µF output capacitor
with ESR less than 10 mΩ is required.
For operation with VIN > 5.0V, a minimum of 66 µF
output capacitor with ESR less than 10 mΩ is required.
X5R or X7R type ceramic capacitors are recommended
for better tolerance over temperature. Additional
capacitors can be added to improve the transient
response, and to reduce the ripple of the output when
the MIC2875 operates in and out of bypass mode.
The Y5V and Z5U type ceramic capacitors are not
recommended due to their wide variation in
capacitance over temperature and increased
resistance at high frequencies. The rated voltage of the
output capacitor should be at least 20% higher than the
maximum operating output voltage over the operating
temperature range.
The 0805 size ceramic capacitor is recommended for
smaller ESL at output capacitor which contributes to a
smaller voltage spike value at the output voltage of the
high-frequency switching boost converter.
The Y5V and Z5U type temperature rating ceramic
capacitors are not recommended due to their large
reduction in capacitance over temperature and
increased resistance at high frequencies. The use of
these reduces the ability to filter out high-frequency
noise. The rated voltage of the input capacitor should
be at least 20% higher than the maximum operating
input voltage over the operating temperature range.
6.3
Input Capacitor to the Power Path
A ceramic capacitor of a 4.7 µF or larger with low ESR
is recommended to reduce the input voltage fluctuation
at the voltage supply of the high current power path. An
input capacitor should be placed close to the VIN supply
to the power inductor and PGND for good device
2016 - 2022 Microchip Technology Inc.
DS20005549B-page 15
MIC2875
7.0
POWER DISSIPATION
As with all power devices, the ultimate current rating of
the output is limited by the thermal properties of the
device package and the PCB on which the device is
mounted. There is a simple, Ohm’s law-type
relationship between thermal resistance, power
dissipation, and temperature which are analogous to
an electrical circuit (see Figure 7-1):
EQUATION 7-2:
T J = P DISS JC + CA + T A
As can be seen in the diagram, total thermal resistance
θJA = θJC + θCA. This can also be written as in
Equation 7-3:
EQUATION 7-3:
T J = P DISS JA + T A
FIGURE 7-1:
Circuit.
Series Electrical Resistance
From this simple circuit we can calculate VX if we know
ISOURCE, VZ, and the resistor values, RXY and RYZ
using Equation 7-1:
Given that all of the power losses (minus the inductor
losses) are effectively in the converter and dissipated
within the MIC2875 package, PDISS can be calculated
thusly:
EQUATION 7-4:
2
1
P DISS = P OUT --- – 1 – I OUT DCR
EQUATION 7-1:
V X = I SOURCE R XY + R YZ + V Z
Thermal circuits can be considered using this same
rule and can be drawn similarly by replacing current
sources with power dissipation (in watts), resistance
with thermal resistance (in °C/W) and voltage sources
with temperature (in °C).
For Linear Mode.
EQUATION 7-5:
I OUT 2
1
P DISS = P OUT --- – 1 – ------------- DCR
1 – D
For Boost Mode.
EQUATION 7-6:
V OUT – V IN
D = ---------------------------V OUT
FIGURE 7-2:
Circuit.
Series Thermal Resistance
Now replacing the variables in the equation for VX, we
can find the junction temperature (TJ) from the power
dissipation, ambient temperature and the known
thermal resistance of the PCB (θCA) and the package
(θJC).
DS20005549B-page 16
In the equations above, ƞ is the efficiency taken from
the efficiency curves and DCR represents the inductor
DCR. θJC and θJA are found in the temperature
specifications section of the data sheet.
Where the real board area differs from 1” square, θCA
(the PCB thermal resistance), values for various PCB
copper areas can be taken from Figure 7-3.
2016 - 2022 Microchip Technology Inc.
MIC2875
FIGURE 7-3:
Determining PCB Area for a
Given PCB Thermal Resistance.
Figure 7-3 shows the total area of a round or square
pad, centered on the device. The solid trace represents
the area of a square, single-sided, horizontal, solder
masked, copper PC board trace heat sink, measured in
square millimeters. No airflow is assumed.
The dashed line shows the PC board’s trace heat sink
covered in black oil-based paint and with 1.3 m/sec
(250 feet per minute) airflow. This approaches a “best
case” pad heat sink. Conservative design dictates
using the solid trace data, which indicates that a
maximum pad size of 5000 mm2 is needed. This is a
pad 71 mm × 71 mm (2.8 inches per side).
2016 - 2022 Microchip Technology Inc.
DS20005549B-page 17
MIC2875
8.0
PCB LAYOUT GUIDELINES
PCB layout is critical to achieve reliable, stable and
efficient performance. A ground plane is required to
control EMI and minimize the inductance in power,
signal and return paths. The following guidelines
should be followed to ensure proper operation of the
device. Please refer to the MIC2875 evaluation board
document for the recommended components
placement and layouts.
8.1
8.5
Output Capacitor
• Use wide and short traces to connect the output
capacitor as close as possible to the OUT and
PGND pins without going through via holes to
minimize the switching current loop during the
main switch off cycle and the switching noise.
• Use either X5R or X7R temperature rating
ceramic capacitors. Do not use Y5V or Z5U type
ceramic capacitors.
Integrated Circuit (IC)
• Place the IC close to the point-of-load.
• Use fat traces to route the input and output power
lines.
• Analog grounds and power ground should be kept
separate and connected at a single location at the
PCB pad for exposed pad of the IC.
• Place as much thermal vias as possible on the
PCB pad for exposed pad and connected it to the
ground plane to ensure a good PCB thermal
resistance can be achieved.
8.2
IN Decoupling Capacitor
• The IN decoupling capacitor must be placed close
to the IN pin of the IC and preferably connected
directly to the pin and not through any via. The
capacitor must be located right at the IC.
• The IN decoupling capacitor should be connected
as close as possible to AGND.
• The IN terminal is noise sensitive and the
placement of capacitor is very critical.
8.3
VIN Power Path Bulk Capacitor
• The VIN power path bulk capacitor should be
placed and connected close to the VIN supply to
the power inductor and the PGND of the IC.
• Use either X5R or X7R temperature rating
ceramic capacitors. Do not use Y5V or Z5U type
ceramic capacitors.
8.4
Inductor
• Keep both the inductor connections to the switch
node (SW) and input power line short and wide
enough to handle the switching current. Keep the
areas of the switching current loops small to
minimize the EMI problem.
• Do not route any digital lines underneath or close
to the inductor.
• Keep the switch node (SW) away from the noise
sensitive pins.
• To minimize noise, place a ground plane
underneath the inductor.
DS20005549B-page 18
2016 - 2022 Microchip Technology Inc.
MIC2875
9.0
PACKAGING INFORMATION
9.1
Package Marking Information
8-Lead UDFN*
XXX
NNNC
Legend: XX...X
Y
YY
WW
NNN
e3
*
Example
87F
812C
Product code or customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle
mark).
Note:
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information. Package may or may not include
the corporate logo.
Underbar (_) and/or Overbar (‾) symbol may not be to scale.
Note 1: If the full seven-character YYWWNNN code cannot fit on the package, the following truncated codes
are used based on the available marking space:
6 Characters = YWWNNN; 5 Characters = WWNNN; 4 Characters = WNNN; 3 Characters = NNN;
2 Characters = NN; 1 Character = N.
2: The “C” on the left package marking drawing represents copper bonding wire.
2016 - 2022 Microchip Technology Inc.
DS20005549B-page 19
MIC2875
8-Lead UDFN 2 mm x 2 mm Package Outline and Recommended Land Pattern
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
A
B
N
(DATUM A)
(DATUM B)
E
NOTE 1
2X
0.05 C
2
1
2X
TOP VIEW
0.05 C
0.05 C
8X
0.08 C
(A3)
C
A
A1
SEATING
PLANE
SIDE VIEW
0.05
C A B
D2
1
2
NOTE 1
0.05
C A B
E2
R0.10
(K)
L
N
e
e
2
8X b
0.10
0.05
C A B
C
BOTTOM VIEW
Microchip Technology Drawing C04-1158-HZA Rev B Sheet 1 of 2
DS20005549B-page 20
2016 - 2022 Microchip Technology Inc.
MIC2875
8-Lead UDFN 2 mm x 2 mm Package Outline and Recommended Land Pattern
Note:
Notes:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
Dimension Limits
N
Number of Terminals
e
Pitch
Overall Height
A
Standoff
A1
Terminal Thickness
A3
Overall Length
D
Exposed Pad Length
D2
Overall Width
E
Exposed Pad Width
E2
Terminal Width
b
Terminal Length
L
Terminal-to-Exposed-Pad
K
MIN
0.50
0.00
1.10
0.50
0.20
0.30
MILLIMETERS
NOM
8
0.50 BSC
0.55
0.02
0.152 REF
2.00 BSC
1.20
2.00 BSC
0.60
0.25
0.35
0.35 REF
MAX
0.60
0.05
1.30
0.70
0.30
0.40
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-1158-HZA Rev B Sheet 2 of 2
2016 - 2022 Microchip Technology Inc.
DS20005549B-page 21
MIC2875
8-Lead UDFN 2 mm x 2 mm Package Outline and Recommended Land Pattern
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
X2
8
ØV
C Y2
G1
Y1
1
2
SILK SCREEN
X1
E
RECOMMENDED LAND PATTERN
Units
Dimension Limits
E
Contact Pitch
Optional Center Pad Width
X2
Optional Center Pad Length
Y2
Contact Pad Spacing
C
Contact Pad Width (X8)
X1
Contact Pad Length (X8)
Y1
Contact Pad to Center Pad (X8)
G1
Thermal Via Diameter
V
MIN
MILLIMETERS
NOM
0.50 BSC
MAX
1.30
0.70
1.90
0.30
0.80
0.20
0.30
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
2. For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
Microchip Technology Drawing C04-3158-HZA Rev. B
DS20005549B-page 22
2016 - 2022 Microchip Technology Inc.
MIC2875
APPENDIX A:
REVISION HISTORY
Revision A (May 2016)
• Converted Micrel document DSC2875 to Microchip data sheet template DS20005549A.
• Minor text changes throughout.
Revision B (July 2022)
• Corrected package marking drawings and added
note below legend in Section 9.1, Package Marking Information.
• Corrected package type information throughout
text. Replaced previous package outline images
with most current images.
• Other minor corrections to the text made as
requested by engineering team.
2016 - 2022 Microchip Technology Inc.
DS20005549B-page 23
MIC2875
NOTES:
DS20005549B-page 24
2016 - 2022 Microchip Technology Inc.
MIC2875
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
–
PART NO.
Device
XX
XX
Examples:
a)
MIC2875-4.75YMT:
4.8A ISW, Synchronous
Boost Regulator with BiDirectional Load Disconnect, 4.75V Output Voltage,
–40°C to +125°C Temp.
Range, 8-Lead UDFN
b)
MIC2875-5.0YMT:
4.8A ISW, Synchronous
Boost Regulator with BiDirectional Load Disconnect, 5.00V Output Voltage,
–40°C to +125°C Temp.
Range, 8-Lead UDFN
c)
MIC2875-5.25YMT:
4.8A ISW, Synchronous
Boost Regulator with BiDirectional Load Disconnect, 5.25V Output Voltage,
–40°C to +125°C Temp.
Range, 8-Lead UDFN
d)
MIC2875-5.5YMT:
4.8A ISW, Synchronous
Boost Regulator with BiDirectional Load Disconnect, 5.50V Output Voltage,
–40°C to +125°C Temp.
Range, 8-Lead UDFN
e)
MIC2875-AYMT:
4.8A ISW, Synchronous
Boost Regulator with BiDirectional Load Disconnect, Adjustable Output
Voltage, –40°C to +125°C
Temp.
Range,
8-Lead
UDFN
Output Temperature Package
Voltage
Device:
MIC2875:
Output Voltage:
4.75
5.0
5.25
5.5
A
Temperature:
Y
Package:
MT =
Note 1:
X
=
=
=
=
=
=
4.8A ISW, Synchronous Boost Regulator
with Bi-Directional Load Disconnect
4.75V
5.00V
5.25V
5.50V
Adjustable
–40°C to +125°C
8-Pin 2 mm x 2 mm UDFN (Note 1)
Ultra-Thin DFN is an RoHS-compliant package. Lead finish is
Pb-free and Matte Tin. Mold compound is Halogen free.
▲ = UDFN Pin 1 identifier
2016 - 2022 Microchip Technology Inc.
DS20005549B-page 25
MIC2875
NOTES:
DS20005549B-page 26
2016 - 2022 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip products:
•
Microchip products meet the specifications contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is secure when used in the intended manner, within operating specifications, and
under normal conditions.
•
Microchip values and aggressively protects its intellectual property rights. Attempts to breach the code protection features of
Microchip product is strictly prohibited and may violate the Digital Millennium Copyright Act.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code. Code protection does not
mean that we are guaranteeing the product is "unbreakable" Code protection is constantly evolving. Microchip is committed to
continuously improving the code protection features of our products.
This publication and the information herein may be used only
with Microchip products, including to design, test, and integrate
Microchip products with your application. Use of this information in any other manner violates these terms. Information
regarding device applications is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your
specifications. Contact your local Microchip sales office for
additional support or, obtain additional support at https://
www.microchip.com/en-us/support/design-help/client-supportservices.
THIS INFORMATION IS PROVIDED BY MICROCHIP "AS IS".
MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED,
WRITTEN OR ORAL, STATUTORY OR OTHERWISE,
RELATED TO THE INFORMATION INCLUDING BUT NOT
LIMITED TO ANY IMPLIED WARRANTIES OF NONINFRINGEMENT, MERCHANTABILITY, AND FITNESS FOR A
PARTICULAR PURPOSE, OR WARRANTIES RELATED TO
ITS CONDITION, QUALITY, OR PERFORMANCE.
IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT, SPECIAL, PUNITIVE, INCIDENTAL, OR CONSEQUENTIAL LOSS, DAMAGE, COST, OR EXPENSE OF ANY
KIND WHATSOEVER RELATED TO THE INFORMATION OR
ITS USE, HOWEVER CAUSED, EVEN IF MICROCHIP HAS
BEEN ADVISED OF THE POSSIBILITY OR THE DAMAGES
ARE FORESEEABLE. TO THE FULLEST EXTENT
ALLOWED BY LAW, MICROCHIP'S TOTAL LIABILITY ON
ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION
OR ITS USE WILL NOT EXCEED THE AMOUNT OF FEES, IF
ANY, THAT YOU HAVE PAID DIRECTLY TO MICROCHIP
FOR THE INFORMATION.
Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to
defend, indemnify and hold harmless Microchip from any and
all damages, claims, suits, or expenses resulting from such
use. No licenses are conveyed, implicitly or otherwise, under
any Microchip intellectual property rights unless otherwise
stated.
Trademarks
The Microchip name and logo, the Microchip logo, Adaptec, AVR,
AVR logo, AVR Freaks, BesTime, BitCloud, CryptoMemory,
CryptoRF, dsPIC, flexPWR, HELDO, IGLOO, JukeBlox, KeeLoq,
Kleer, LANCheck, LinkMD, maXStylus, maXTouch, MediaLB,
megaAVR, Microsemi, Microsemi logo, MOST, MOST logo,
MPLAB, OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo,
PolarFire, Prochip Designer, QTouch, SAM-BA, SenGenuity,
SpyNIC, SST, SST Logo, SuperFlash, Symmetricom, SyncServer,
Tachyon, TimeSource, tinyAVR, UNI/O, Vectron, and XMEGA are
registered trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
AgileSwitch, APT, ClockWorks, The Embedded Control Solutions
Company, EtherSynch, Flashtec, Hyper Speed Control, HyperLight
Load, Libero, motorBench, mTouch, Powermite 3, Precision Edge,
ProASIC, ProASIC Plus, ProASIC Plus logo, Quiet- Wire,
SmartFusion, SyncWorld, Temux, TimeCesium, TimeHub,
TimePictra, TimeProvider, TrueTime, and ZL are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, Augmented Switching, BlueSky,
BodyCom, Clockstudio, CodeGuard, CryptoAuthentication,
CryptoAutomotive, CryptoCompanion, CryptoController,
dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM,
ECAN, Espresso T1S, EtherGREEN, GridTime, IdealBridge, InCircuit Serial Programming, ICSP, INICnet, Intelligent Paralleling,
IntelliMOS, Inter-Chip Connectivity, JitterBlocker, Knob-on-Display,
KoD, maxCrypto, maxView, memBrain, Mindi, MiWi, MPASM, MPF,
MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple
Blocker, RTAX, RTG4, SAM-ICE, Serial Quad I/O, simpleMAP,
SimpliPHY, SmartBuffer, SmartHLS, SMART-I.S., storClad, SQI,
SuperSwitcher, SuperSwitcher II, Switchtec, SynchroPHY, Total
Endurance, Trusted Time, TSHARC, USBCheck, VariSense,
VectorBlox, VeriPHY, ViewSpan, WiperLock, XpressConnect, and
ZENA are trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
The Adaptec logo, Frequency on Demand, Silicon Storage
Technology, and Symmcom are registered trademarks of Microchip
Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology Germany
II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in
other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2017 - 2022, Microchip Technology Incorporated and its subsidiaries.
All Rights Reserved.
For information regarding Microchip’s Quality Management Systems,
please visit www.microchip.com/quality.
2017 - 2022 Microchip Technology Inc. and its subsidiariesAdvance
ISBN:
Information
DS20005549B-page 27
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