MIC2877
2 MHz Synchronous Low Voltage Step-Up Regulator
with 6.5A Switch and Bidirectional Load Disconnect
Features
Applications
• Typical 6.5A Input Peak Current Limit
• Up to 95% Efficiency
• Fully Integrated, High-Efficiency, 2 MHz Switching
Frequency
• Bidirectional True Load Disconnect, Overvoltage
Protection (OVP) and Undervoltage Lockout
(UVLO)
• Controlled Pre-Charge Current Limit at Start-Up
• Ultra-Fast Transient Response
• Input Voltage Range from 2.5V to 5.5V
• Maximum Output Current:
- 1.5A, VIN = 2.5V and VOUT = 5V
- 2A,VIN = 3V and VOUT = 5V
• Output Voltage Range:
- Adjustable
- Fixed Versions: 4.75V, 5V, 5.25V, 5.5V
• Integrated Anti-Ringing Switch for
Electromagnetic Interference (EMI) Reduction
• Typically Less than 2 µA Shutdown Current
• Internal Compensation
• Bypass Mode for VIN ≥ VOUT
• Power Good (PG) Output
• Overcurrent Protection and Thermal Shutdown
• Fixed and Adjustable Output Versions
• Available Package: 8-pin FTQFN 2 x 2 mm
•
•
•
•
USB OTG and HDMI Hosts
Portable Power Reserve Supplies
High-Current Parallel Lithium Cell Applications
Portable Equipment
General Description
The MIC2877 is a compact and highly efficient 2 MHz
synchronous boost regulator with a typically 6.5A
switch. It features a bidirectional true load disconnect
function that prevents any leakage current between the
input and output when the device is disabled
(EN = GND), it protects the input supply and improves
the start-up performance.
The MIC2877 has the input voltage range between
2.5V and 5.5V and provides a 2A output continuous
current for VIN = 3.0V and VOUT = 5V. Fixed and
adjustable versions are available.
The MIC2877 operates in Bypass mode automatically
when the input voltage is higher or equal to the target
output voltage. At light loads, the boost converter goes
to Pulse Frequency Modulation (PFM) mode to
improve the efficiency. In Shutdown mode (EN = GND),
the regulator typically consumes less than 2 µA.
The MIC2877 also features an integrated anti-ringing
switch to minimize EMI, overvoltage and overcurrent
protection, UVLO and thermal shutdown.
The MIC2877 is available in an 8-pin FTQFN 2 x 2 mm
package.
Package Types
MIC2877 (Fixed Output)
8-pin 2 x 2 mm FTQFN
MIC2877 (Adjustable Output)
8-pin 2 x 2 mm FTQFN
PG
PG
VIN
VOUTS
AGND
EN
PGND
SW
2017 Microchip Technology Inc.
VOUT
VIN
FB
AGND
EN
PGND
SW
VOUT
DS20005873A-page 1
MIC2877
Typical Application Schematics
MIC2877 (Fixed Output)
MIC2877 (Adjustable Output)
Efficiency (%)
MIC2877 Efficiency vs. Load Current
100
90
80
70
60
50
40
30
20
10
0
VIN = 4.5V
VIN = 3.3V
VIN = 2.5V
VOUT = 5V
L = 1 µH
COUT = 3 x 22 µF
1
10
100
1000
IOUT (mA)
DS20005873A-page 2
2017 Microchip Technology Inc.
MIC2877
Functional Block Diagrams
MIC2877 (Fixed Output)
VIN
EN
SW
VIN
ANTI RINGING
BODY
DRIVER
REFERENCE
GENERATOR
PWM
LOGIC
CONTROL
+
MINIMUM
SWITCHING
2 MHz
OSCILLATOR
OC
6A
PWM
OUT
HS
DRIVER
LS
DRIVER
OUTS
VIN
CURRENT
SENSE
+
SLOPE
COMPENSATION
/PG
OV FB
OVP
VREF
OV REF
SOFT
START
PGND
AGND
MIC2877 (Adjustable Output)
EN
VIN
SW
VIN
ANTI RINGING
BODY
DRIVER
REFERENCE
GENERATOR
PWM
LOGIC
CONTROL
+
MINIMUM
SWITCHING
2 MHz
OSCILLATOR
OC
6.5A
PWM
OUT
HS
DRIVER
LS
DRIVER
PGL
PGH
/PG
CURRENT
SENSE
+
SLOPE
COMPENSATION
FB
OV FB
OVP
OV REF
VREF
SOFT
START
PGND
2017 Microchip Technology Inc.
AGND
DS20005873A-page 3
MIC2877
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
VIN, EN, OUT, FB/VOUTs, PG, SW to PGND .................................................................................................. –0.3V to +6V
AGND to PGND ............................................................................................................................................ –0.3V to +0.3V
EN to AGND .................................................................................................................................................. –0.3V to +6V
Power Dissipation............................................................................................................................... Internally Limited(1)
Lead Temperature (soldering, 10 seconds)........................................................................................................... +260°C
Junction Temperature (TJ)...................................................................................................................... –40°C to +150°C
Storage Temperature (TS) ...................................................................................................................... –40°C to +150°C
ESD Rating Human Body Model (HBM)(2) .................................................................................................................2 kV
ESD Rating Machine Model (MM)(2) .........................................................................................................................200V
Operating Ratings ‡
Supply Voltage (VIN).................................................................................................................................. +2.5V to +5.5V
Output Voltage (VOUT)................................................................................................................................... VIN to +5.5V
Enable Voltage (VEN) ......................................................................................................................................... 0V to VIN
Junction Temperature (TJ)...................................................................................................................... –40°C to +125°C
Operating Ambient Temperature (TA)....................................................................................................... –40°C to +85°C
Package Thermal Resistance FTQFN22-8LD (JA) ........................................................................................... +50°C/W
† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at those or any other conditions above those indicated
in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended
periods may affect device reliability.
‡ Notice: The device is not guaranteed to function outside its operating ratings.
Note 1: The maximum allowable power dissipation of any TA (ambient temperature) is PD(max) = (TJ(max) – TA)/θJA.
Exceeding the maximum allowable power dissipation will result in excessive die temperature, and the
regulator will go into thermal shutdown.
2: Devices are ESD sensitive. Handling precautions are recommended. Human body model, 1.5 kΩ in series
with 100 pF.
DS20005873A-page 4
2017 Microchip Technology Inc.
MIC2877
ELECTRICAL CHARACTERISTICS
Electrical Characteristics: VIN = 3V, VOUT = 5V, CIN = 22 µF, COUT = 3 x 22 µF, L = 1 µH, TA = +25°C. Bold values
are valid for –40°C ≤ TA < +85°C, unless otherwise noted. (Note 1)
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
VIN
2.5
—
5.5
V
VOUT
VIN
—
5.5
V
UVLO(r)
—
2.29
2.49
V
UVLO Hysteresis
UVLOHYS
—
200
—
mV
Quiescent Current
IVIN
—
125
180
µA
Non-Switching
IVINSD
—
1
3
µA
VIN = 5.5V, VOUT = 0V,
EN = 0
IVOUTSD
—
1
3
µA
VIN = 0V, VOUT = 5.5V,
EN = 0
Overtemperature Shutdown
Threshold
TSD
—
+155
—
°C
Overtemperature Shutdown
Hysteresis
TSD-HYS
—
+15
—
°C
VFB
0.8865
—
0.9135
V
Adjustable version
Line Regulation
—
—
0.3
—
%
2.5V < VIN < 4.5V,
IOUT = 0.5A
Load Regulation
—
—
0.2
—
%/A
IOUT = 300 mA to 1.2A
VOVD
6.6
—
6.75
V
TONMIN
—
35
—
ns
DMAX
—
93.6
—
%
ISW
4.8
6.5
7.2
A
VIN = 3V, VOUT = 5V
RPMOS
—
45
—
mΩ
RNMOS
—
33
—
VIN = 3V, VOUT = 5V,
ISW = 200 mA
Switch Leakage Current
ISW
—
0.2
5
µA
VEN = 0V, VSW = 5.5V
Oscillator Frequency
fSW
1.6
2
2.4
MHz
IPRE-CHARGE
0.27
0.5
0.76
A
1.7
2.55
3.2
ISS
—
1.1
2
ms
VOUT = 5V, VIN = 3V,
COUT = 22 µF x 3
VEN
1.5
—
VIN
V
Device enabled
—
—
0.4
Power Supply
Supply Voltage Range
Output Voltage
UVLO Rising Threshold
VIN Shutdown Current
VOUT Shutdown Current
Boost Converter
Feedback Voltage
Overvoltage Protection
Threshold
Minimum Controllable On Time
Maximum Duty Cycle
Low-Side Switch Current Limit
(Note 2)
Switch-on Resistance
Pre-Charge Current Limit
Soft Start Charge Time
VOUT 0.5V
VIN = 4.5V, VOUT = 3V
EN/PG Control Pins
EN Threshold (Note 3)
Note 1:
2:
3:
Device disabled
Specification for packaged product only.
Data from design and characterization. Not production tested.
If the EN pin is externally driven High before VIN is applied, a 200kΩ series resistor is required on the EN
signal to the pin.
2017 Microchip Technology Inc.
DS20005873A-page 5
MIC2877
ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Characteristics: VIN = 3V, VOUT = 5V, CIN = 22 µF, COUT = 3 x 22 µF, L = 1 µH, TA = +25°C. Bold values
are valid for –40°C ≤ TA < +85°C, unless otherwise noted. (Note 1)
Parameters
EN Input Current
Power Good Threshold (Rising)
Power Good Threshold (Falling)
Note 1:
2:
3:
Sym.
Min.
Typ.
Max.
Units
Conditions
—
—
1.5
—
µA
EN = 3V
VPG-THR
—
0.91 x VFB
—
V
Adjustable version
—
0.91 x VOUT
—
—
0.82 x VFB
—
—
0.83 x VOUT
—
VPG-THF
Fixed version
V
Adjustable version
Fixed version
Specification for packaged product only.
Data from design and characterization. Not production tested.
If the EN pin is externally driven High before VIN is applied, a 200kΩ series resistor is required on the EN
signal to the pin.
TEMPERATURE SPECIFICATIONS
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Power Dissipation
—
—
—
—
—
Internally Limited(1)
Lead Temperature
—
—
—
+260
°C
Soldering, 10s
Temperature Ranges
Junction Temperature
TJ
–40
—
+125
°C
Storage Temperature
TS
–40
—
+150
°C
Operating Ambient Temperature
TA
–40
—
+85
°C
JA
—
+50
—
°C/W
Package Thermal Resistances
Thermal Resistance FTQFN22-8LD
Note 1:
The maximum allowable power dissipation of any TA (ambient temperature) is
PD(max) = (TJ(max) – TA)/θJA. Exceeding the maximum allowable power dissipation will result in excessive
die temperature, and the regulator will go into thermal shutdown.
DS20005873A-page 6
2017 Microchip Technology Inc.
MIC2877
2.0
TYPICAL PERFORMANCE CURVES
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
100
90
80
70
60
50
40
30
20
10
0
0.93
VIN = 4.5V
VIN = 3.3V
Feedback Voltage (V)
Efficiency (%)
Note:
VIN = 2.5V
VOUT = 5V
L = 1 µH
COUT = 3 x 22 µF
1
10
100
0.92
0.91
VIN = 4.5V
0.9
VIN = 3.3V
VOUT = 5V
0.88 L
= 1 µH, TA = -40oC
COUT = 3 x 22 µF
0.87
1000
1
10
IOUT (mA)
VOUT (V)
FIGURE 2-4:
Feedback Voltage vs. Load
Current (TA = –40°C), Adjustable Output Version.
Feedback Voltage (V)
TA = -40°C
TA = +25°C
TA = +85°C
0.25
0.5
0.75
1
0.92
VIN = 4.5V
0.91
VIN = 3.3V
0.9
VOUT = 5V
L = 1 µH, TA = +25oC
COUT = 3 x 22 µF
0.88
0.87
1.25
1
10
1000
FIGURE 2-5:
Feedback Voltage vs. Load
Current (TA = +25°C), Adjustable Output Version.
0.93
2020
TA = -40°C
TA = +25°C
2000
TA = +85°C
1980
1960
1940
VOUT = 5V, IOUT = 0.5A
L = 1 µH, COUT = 3 x 22 µF
2.5
3
3.5
4
Input Voltage (V)
0.92
VIN = 4.5V
0.91
5
VIN = 3.3V
VIN = 2.5V
0.9
0.89
VOUT = 5V
L = 1 µH, TA = +85oC
COUT = 3 x 22 µF
0.88
0.87
4.5
FIGURE 2-3:
Switching Frequency vs.
Input Voltage, Adjustable Output Version.
2017 Microchip Technology Inc.
Feedback Voltage (V)
Switching Frequency (kHz)
100
IOUT (mA)
FIGURE 2-2:
Output Voltage vs. Load
Current, Adjustable Output Version.
1900
VIN = 2.5V
0.89
IOUT (A)
1920
1000
0.93
VIN = 3V
L = 1 µH
COUT = 3 x 22 µF
0
100
IOUT (mA)
FIGURE 2-1:
Efficiency vs. Load Current,
Adjustable Output Version.
5.1
5.08
5.06
5.04
5.02
5
4.98
4.96
4.94
4.92
4.9
VIN = 2.5V
0.89
1
10
100
1000
IOUT (mA)
FIGURE 2-6:
Feedback Voltage vs. Load
Current (TA = +85°C), Adjustable Output Version.
DS20005873A-page 7
MIC2877
1.6
VOUT = 5V, EN = GND
Shutdown Mode, No Load
EN to Start-Up Delay (ms)
Shutdown Current (µA)
2
1.75
1.5
1.25
TA = +85oC
1
0.75
TA = +25oC
0.5
TA = -40oC
0.25
TA = +25°C
1.2
TA = +85°C
1
0.8
0.6
0.4
VOUT = 5V, IOUT = 1A
L = 1 µH, COUT = 3 x 22 µF
0.2
0
0
2.5
3
3.5
4
Input Voltage (V)
4.5
2.5
5
FIGURE 2-7:
Shutdown Current vs. Input
Voltage, Adjustable Output Version.
3
3.5
4
Input Voltage (V)
4.5
5
FIGURE 2-10:
Enable to Start-Up Delay vs.
Input Voltage, Adjustable Output Version.
6000
0.92
RISING
0.9
5000
VOUT = 5V, IOUT = 0A
L = 1 µH, COUT = 3 x 22 µF
0.88
IOU7 Max (mA)
PG Threshold/VFB
TA = -40°C
1.4
0.86
0.84
VOUT = 5V
L = 1 µH
COUT = 3 x 22 µF
4000
3000
TA = -40°C
FALLING
0.82
1000
0.8
0
TA = +25°C
TA = +85°C
2.5
3
3.5
4
Input Voltage (V)
4.5
FIGURE 2-8:
Power Good Threshold vs.
Input Voltage, Adjustable Output Version.
2.9
3.3
3.7
VIN (V)
4.1
4.5
FIGURE 2-11:
Maximum Output Current
vs. Input Voltage, Adjustable Output Version.
VSW
5V/div
2.5
UVLO Threshold (V
2.5
5
VOUT = 5V, TA = +25oC
L = 1 µH, COUT = 3 x 22 µF
2.4
PG
2V/div
RISING
2.35
VOUT
200 mV/div
AC Coupled
2.3
2.25
FALLING
2.2
2.15
2.1
0
0.05
0.1
0.15
0.2
Load Current (A)
0.25
0.3
FIGURE 2-9:
UVLO Threshold vs. Load
Current, Adjustable Output Version.
DS20005873A-page 8
IOUT
1A/div
VIN = 3.3V
VOUT = 5V
Load Step: 0.01A to 1.5A
TA = 25°C
400 µs/div
FIGURE 2-12:
Load Transient (VIN = 3.3V),
Adjustable Output Version.
2017 Microchip Technology Inc.
MIC2877
VSW
5V/div
VIN = 2.5V to 4.5V
IOUT = 1A
VOUT = 5V
L = 1 µH
COUT = 3 x 22 µF
PG
2V/div
PG
2V/div
IOUT
1A/div
VOUT
200 mV/div
AC Coupled
VOUT
200 mV/div
AC Coupled
VIN
2V/div
IOUT
1A/div
VIN = 4V
VOUT = 5V
Load Step: 0.01A to 1.5A
TA = 25°C
FIGURE 2-13:
Load Transient (VIN = 4V),
Adjustable Output Version.
VSW
5V/div
FIGURE 2-16:
Line Transient (VIN = 2.5V to
4.5V), Adjustable Output Version.
PG
2V/div
VSW
2V/div
PG
2V/div
IOUT
1A/div
400 µs/div
400 µs/div
VOUT
200 mV/div
AC Coupled
VIN =4.75V
VOUT = 5V
Load Step: 0.01A to 1.5A
TA = 25°C
IL
2A/div
VOUT
50 mV/div, AC Coupled
FIGURE 2-14:
Load Transient
(VIN = 4.75V), Adjustable Output Version.
PG
2V/div
IOUT
1A/div
400 ns/div
400 µs/div
VIN = 2.5V to 3.5V
IOUT = 1A
VOUT = 5V
L = 1 µH
COUT = 3 x 22 µF
FIGURE 2-17:
Switching Waveforms
(VIN = 2.5V, VOUT = 5V, IOUT = 1.5A), Adjustable
Output Version.
PG
2V/div
VSW
2V/div
VOUT
200 mV/div
AC Coupled
IL
2A/div
VIN
2V/div
400 µs/div
VOUT
50 mV/div, AC Coupled
400 ns/div
FIGURE 2-15:
Line Transient (VIN = 2.5V to
3.5V), Adjustable Output Version.
2017 Microchip Technology Inc.
FIGURE 2-18:
Switching Waveforms
(VIN = 3V, VOUT = 5V, IOUT = 2A), Adjustable
Output Version.
DS20005873A-page 9
MIC2877
VSW
2V/div
EN
2V/div
PG
2V/div
EN
2V/div
VIN = 3.3V
VOUT = 5V
IOUT = 0.5A
Resistive Load
VOUT
2V/div
IL
2A/div
PG
500 mV/div
IOUT
500 mA/div
4 ms/div
400 µs/div
FIGURE 2-19:
Soft Start in Boost Mode,
Adjustable Output Version.
VSW
2v/div
VOUT = 5V
VIN = 2.5V
L = 1 µH
COUT = 3 x 22 µF
FIGURE 2-22:
Start-Up in Short Circuit
(VIN = 2.5V, TA = +25°C), Adjustable Output
Version.
VOUT = 5V
VIN = 4.5V
L = 1 µH
COUT = 3 x 22 µF
EN
2V/div
PG
5V/div
PG
500 mV/div
IIN
500 mA/div
VIN = GND = EN
VOUT = 0 to 5V step
CIN = 22 µF, L = 1 µH
COUT = 3 x 22 µF
VOUT
1V/div
IOUT
500 mA/div
4 ms/div
FIGURE 2-20:
Start-Up in Short Circuit
(VIN = 4.5V, TA = +25°C), Adjustable Output
Version.
VIN
1V/div
400 µs/div
FIGURE 2-23:
Bidirectional True
Shutdown. Shorted Input, Output Step from 0V to
5V with EN = 0V. Adjustable Output Version.
VSW
5V/div
VIN
1V/div
VOUT
1V/div
VOUT
1V/div
VIN = 4V to 5.5V
VOUT = 5V
IOUT = 0.5A
PG
5V/div
IOUT
500 mA/div
IL
1A/div
VIN
1V/div
1s/div
FIGURE 2-21:
Output Version.
DS20005873A-page 10
Bypass Mode, Adjustable
VOUT = GND = EN
VIN = 0 to 5V step
CIN = 22 µF, L = 1 µH
COUT = 3 x 22 µF
400 µs/div
FIGURE 2-24:
Bidirectional True
Shutdown. Shorted Output, Supply Step from 0V
to 5.0V with EN = 0V. Adjustable Output Version.
2017 Microchip Technology Inc.
MIC2877
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
MIC2877
(for Fixed and
Adjustable Output)
Symbol
1
VIN
2
AGND
Analog Ground Pin
3
PGND
Power Ground Pin
4
SW
5
VOUT
6
EN
7
VOUTS
FB
Feedback Pin for the adjustable output voltage variant only.
8
PG
Power Good Pin. It is an open drain output, it should be connected to a pull-up
resistor.
2017 Microchip Technology Inc.
Description
Input Voltage Pin. Connect a minimum 22 µF ceramic capacitor between VIN
and PGND.
Switch Node, Boost Inductor Input Pin
Boost Converter Output Pin. Connect at least 3 x 22 µF ceramic capacitors
between VOUT and PGND.
Enable Pin. When this pin is driven low, the IC enters Shutdown mode (device
disabled). It should not be left floating. Connect it to VIN using a 10 k resistor.
Output Voltage Sensing Pin for the fixed output voltage variant only.
DS20005873A-page 11
MIC2877
4.0
DETAILED DESCRIPTION
4.7
4.1
Voltage Input (VIN)
This is a feedback or output voltage sensing pin for the
boost converter. For the fixed voltage version, this pin
must be connected directly to the VOUT pin. For the
adjustable version, connect a resistor divider to set the
output voltage (see Section 5.7, Output Voltage Programming for more information).
The input supply provides power to the internal
MOSFET gate drivers and control circuitry for the boost
regulator. The operating input voltage range is from
2.5V to 5.5V. A 1 µF low-ESR ceramic input capacitor
should be connected from the VIN pin to AGND, as close
to the MIC2877 as possible, to ensure a clean supply
voltage for the device. A minimum voltage rating of 10V
is recommended for this input capacitor. A 22 µF
low-ESR ceramic capacitor should also be connected
between the input pin and the power ground (PGND),
with a 10V minimum voltage rating.
4.2
Switch Node (SW)
4.8
Feedback/Output Voltage Sense
(FB/VOUTS)
Power Good Output (PG)
A power good (PG) pin is provided to monitor the power
good function. It is an open drain active high output.
The PG pin must be connected to VIN through a 1 M
pull-up resistor. This pin is asserted high when the
output voltage is higher than 91% of its nominal
voltage.
The MIC2877 has internal low-side and synchronous
MOSFET switches. The switch node (SW) between the
internal MOSFET switches connects directly to one
end of the inductor and provides the current path during
switching cycles. The other end of the inductor is
connected to the input supply voltage. Due to the
high-speed switching on this pin, the switch node
should be routed away from sensitive nodes wherever
possible.
4.3
Analog Ground (AGND)
The analog ground path (AGND) is dedicated to the
internal biasing and control circuitry. The current loop of
the analog ground should be separated from the power
ground (PGND) path. The AGND should be connected to
the PGND in a single point, very close to the regulator.
4.4
Power Ground (PGND)
The power ground (PGND) is the ground path for the
high current in the boost switches. The current loop for
the power ground should be as short as possible and
separate from the AGND loop as applicable.
4.5
Boost Converter Output (VOUT)
Three parallel low-ESR ceramic capacitors of 22 µF
each should be connected from the VOUT and PGND, as
close as possible to the MIC2877. A minimum voltage
rating of 10V is recommended for the output
capacitors.
4.6
Enable (EN)
Logic high on the EN pin of the MIC2877 enables the
regulator. When this pin is driven low, the MIC2877
goes to Shutdown mode. Even if it is internally pulled
down by a 2.5 M resistor, this pin should not be left
floating.
DS20005873A-page 12
2017 Microchip Technology Inc.
MIC2877
5.0
APPLICATION INFORMATION
5.1
General Description
The MIC2877 is a 2 MHz, current-mode, PWM,
synchronous boost converter with an operating input
voltage range of 2.5V to 5.5V. At light load, the converter enters PFM mode to maintain a high efficiency
over a wide range of load current. The maximum peak
current in the boost switch is limited to 6.5A (typical).
5.2
Bidirectional Output Disconnect
The power stage of the MIC2877 consists of an NMOS
transistor as the main switch and a PMOS transistor as
the synchronous rectifier. A control circuit turns off the
back gate diode of the PMOS to isolate the output from
the input supply when the chip is disabled (VEN = 0V).
5.3
Integrated Anti-Ringing Switch
The MIC2877 includes an anti-ringing switch that
eliminates the ringing on the SW node of a conventional boost converter operating in the Discontinuous
Conduction mode (DCM). At the end of a switching
cycle during DCM operation, both the NMOS and
PMOS are turned off. The anti-ringing switch in the
MIC2877 clamps the SW pin voltage to the input, to
dissipate the remaining energy stored in the inductor
and the parasitic elements of the power switches.
5.4
Automatic Bypass Mode (for
VIN > VOUT)
5.6
Soft Start
The MIC2877 integrates an internal soft start circuit to
limit the inrush current during start-up. When the device
is enabled, the PMOS is turned on slowly to charge the
output capacitor to a voltage close to the input voltage.
Then, the device starts boost switching cycles to
gradually increase the output voltage to the targeted
VOUT. A 500 µs timer is provided to soft start the
internal reference voltage. This timer sets the soft-start
time by charging a capacitor with a reference current.
5.7
Output Voltage Programming
The MIC2877 has an adjustable version that allows the
output voltage to be set by an external resistor divider
(R1 and R2). The typical feedback voltage is 0.9V. The
current through the resistor divider should be significantly larger than the current into the FB pin. It is
recommended that the total resistance of R1 + R2
should be less than about 1 M for accurate output
voltage setting. The appropriate R1 and R2 values for
the desired output voltage are calculated as in
Equation 5-1:
EQUATION 5-1:
V OUT
R1 = R2 --------------- – 1
0.9V
5.8
Overvoltage Protection
The MIC2877 automatically operates in Bypass mode
when the input voltage is higher or equal to the target
output voltage. In Bypass mode, the NMOS is turned
off while the PMOS is fully turned on to provide a very
low impedance path from IN to OUT.
When the output voltage rises above the OVP
threshold (maximum 6.75V) for any reason, the whole
device is latched off automatically to avoid the IC
permanent damage. To clear the latch-off condition,
either recycle the input supply or deassert the EN pin.
5.5
5.9
Pre-Charge Current Limit
For MIC2877, a pre-charge current limit circuit is used
during start-up phase, to limit the inrush current to 0.5A
(typical), when VOUT < 0.5V. Then, the current limit will
gradually increase to 2.55A when VOUT rises to 3V. If a
heavy load (lower than 1) is connected to the output
during start-up, the converter will stay in the pre-charge
state and limit the output current to 0.5A. The
pre-charge current limit essentially provides a start-up
short circuit protection to prevent part damage.
2017 Microchip Technology Inc.
Thermal Shutdown
When the internal die temperature reaches +155°C,
the boost converter is disabled. The device will resume
its normal operation until the die temperature falls
below +140°C (+15°C hysteresis).
5.10
Overcurrent Protection
The MIC2877 has a current limit feature to protect the
part against heavy load conditions. When the current
limit comparator determines that the NMOS switch has
a peak current higher than 6.5A (typ.), the NMOS is
turned off and the PMOS is turned on until the next
switching cycle. The current limit protection is reset
cycle by cycle.
DS20005873A-page 13
MIC2877
5.11
Working with Inductive or Active
Loads
The MIC2877 is designed for on-board power
conversion and with on-board loads in mind, where
stray inductance is very small. This allows for a very
compact solution, with a small amount of input and
output capacitance. When using the MIC2877 with
remote, inductive (e.g., load boards with long leads, or
large rheostats) or active loads, it is recommended to
add a Schottky diode (20V, 0.5A-1A ratings) with the
anode connected to ground, and cathode connected to
the output of the MIC2877 board. This is done to
prevent the output from being pulled below ground,
which may damage the part.
This precaution is especially important when exercising
protections (e.g., thermal shutdown) or when
exercising any other condition that may trigger
protections and shut down the part. When the
protection triggers, the current delivered by the
MIC2877 will exhibit a sudden change. If significant
inductance is present on the load side or if the current
sink capability of the load is maintained down to very
low voltages, the output may be pulled below ground by
more than 0.3V, thus exceeding the absolute maximum
ratings of the device.
DS20005873A-page 14
5.12
Input Bulk Capacitor
A similar phenomenon may also endanger the part
from the input side, especially when using high-input
voltages. Long power supply leads are inductive. When
the protection triggers, or when the load drops very
rapidly in normal conditions, the current consumption of
the MIC2877 will also exhibit a sudden change. The
lead inductance will therefore discharge into the input
capacitor, thus causing the input voltage to rise. If the
input capacitance at the MIC2877 is too small, the input
voltage spike may rise to a point where the device is
damaged. If the input supply to the MIC2877 has some
significant stray inductance and it is close to the
maximum rating, the input bulk capacitor is mandatory.
The capacitor’s value can be increased as needed to
keep the overvoltage within safe limits. Since the
current change through the MIC2877 is instantaneous,
the ESR of the input bulk capacitor should also be
small.
2017 Microchip Technology Inc.
MIC2877
6.0
COMPONENT SELECTION
6.1
Inductor
The inductor selection is a trade-off between efficiency,
stability, cost, size and rated current. Since the boost
converter is compensated internally, the recommended
inductance is limited to 1 µH, to ensure system stability.
The saturation current rating of the selected inductor
must be higher than the maximum expected peak
inductor current and should be at least 20% to 30%
higher than the average inductor current at maximum
output current.
6.2
Input Capacitor to the Device
Supply
A ceramic capacitor of 1 µF or larger with low ESR is
recommended to reduce the input voltage ripple and to
ensure a clean supply voltage for the device. The input
capacitor should be placed as close as possible to the
MIC2877 VIN and AGND pins with short traces to ensure
good switching noise suppression performance. X5R
or X7R type ceramic capacitors are recommended for
better tolerance over temperature. The Y5V and Z5U
type temperature rating ceramic capacitors are not
recommended due to their large reduction in
capacitance over temperature and increased resistance at high frequencies. The use of these reduces
their ability to filter the high-frequency noise. The rated
voltage of the input capacitor should be at least 20%
higher than the maximum operating input voltage over
the operating temperature range.
6.3
6.4
Output Capacitor
The output capacitor selection is also a trade-off
between performance, size and cost. Increasing the
output capacitor will lead to an improved transient
response; however, the size and cost also increase.
Three 22 µF output capacitors with ESR less than
10 m are required, while X5R or X7R type ceramic
capacitors are recommended for better tolerance over
temperature. Additional capacitors can be added to
improve the transient response, and to reduce the
output ripple when the MIC2877 operates in and out of
Bypass mode.
The Y5V and Z5U type ceramic capacitors are not
recommended due to their wide capacitance variation
over temperature and increased resistance at high
frequencies. The rated voltage of the output capacitor
should be at least 20% higher than the maximum
operating output voltage over the operating
temperature range. A 0805 size ceramic capacitor is
recommended for a smaller ESL of the output
capacitor, which contributes to a smaller voltage spike
of the output voltage of the high frequency switching
boost converter.
Input Capacitor to the Power Path
A ceramic capacitor of a 22 µF or larger with low ESR
is recommended, to reduce the input voltage fluctuation at the voltage supply of the high-current power
path. This input capacitor should be placed close to the
VIN supply of the power inductor and the PGND for good
device performance under heavy loads. X5R or
X7R-type ceramic capacitors are recommended for
better tolerance over temperature.
The Y5V and Z5U type temperature rating ceramic
capacitors are not recommended due to their large
reduction in capacitance over temperature and
increased resistance at high frequencies. These
reduce their ability to filter out high-frequency noise.
The rated voltage of the input capacitor should be at
least 20% higher than the maximum operating input
voltage over the operating temperature range.
2017 Microchip Technology Inc.
DS20005873A-page 15
MIC2877
7.0
POWER DISSIPATION
As with all power devices, the ultimate current rating of
the output is limited by the thermal properties of the
device package and the PCB on which the device is
mounted. There is a simple, Ohm's law-type relationship between thermal resistance, power dissipation,
and temperature which are analogous to an electrical
circuit (see Figure 7-1):
EQUATION 7-2:
T J = P DISS JC + CA + T A
Where PDISS is explained in Equation 7-4.
As the diagram shows, the total thermal resistance is
θJA = θJC + θCA. This can also be written as in
Equation 7-3:
EQUATION 7-3:
T J = P DISS JA + T A
FIGURE 7-1:
Circuit.
Series Electrical Resistance
From this simple circuit, we can calculate the VX if we
know the ISOURCE, VZ, and the resistor values, RXY and
RYZ, using Equation 7-1:
EQUATION 7-1:
V X = I SOURCE R XY + R YZ + V Z
Thermal circuits can be considered using this same
rule and can be drawn similarly by replacing current
sources with power dissipation (in W), resistance with
thermal resistance (in °C/W) and voltage sources with
temperature (in °C).
Given that all of the power losses (minus the inductor
losses) that are effectively in the converter are
dissipated within the MIC2877 package, PDISS can be
estimated thusly:
EQUATION 7-4:
BOOST MODE
I OUT 2
P DISS = P OUT --1- – 1 – -------------- DCR
1 – D
Where D is the Duty Cycle and is explained in
Equation 7-5.
EQUATION 7-5:
DUTY CYCLE (BOOST)
V OUT – V IN
D = -------------------------------V OUT
In the equations above, ƞ is the efficiency taken from
the efficiency curves and DCR represents the inductor DCR. θJA can be found in Section “Operating
Ratings ‡”.
FIGURE 7-2:
Circuit.
Series Thermal Resistance
By replacing the variables in the equation for VX, we
can find the junction temperature (TJ) from the power
dissipation, ambient temperature and the known
thermal resistance of the PCB (θCA) and the package
(θJC).
DS20005873A-page 16
2017 Microchip Technology Inc.
MIC2877
8.0
PCB LAYOUT GUIDELINES
The PCB layout is critical to achieve reliable, stable and
efficient performance. A ground plane is required to
control EMI and minimize the inductance in power,
signal and return paths. The following guidelines
should be followed to ensure proper operation of the
device:
8.1
Integrated Circuit (IC)
• Place the IC close to the point of load.
• Use thick traces to route the input and output
power lines.
• Analog grounds and power ground should be kept
separate and connected at a single location.
• Place as many thermal vias as possible close to
the regulator and connect them to the ground
plane (preferably on the bottom layer) to ensure a
good PCB thermal resistance can be achieved.
8.2
8.5
Output Capacitor
Use wide and short traces to connect the output
capacitor as close as possible to the VOUT and PGND
pins without going through via holes to minimize the
switching current loop during the main switch-off cycle
and the switching noise.
The location of the output capacitor is very important for
any boost converter. It should be placed as close as
possible to the IC. The parasitic inductance between
the regulator and the output capacitors must be minimized, as it causes voltage spikes and ringing on the
SW pin. If these voltage spikes are too high, they can
lead to IC damage and the corresponding ringing
causes EMI problems.
In the MIC2877 case, for a very small parasitic
inductance, it is recommended to place the three 0805
output capacitors in parallel, very close to the IC:
VIN Decoupling Capacitor
• The input decoupling capacitor must be placed
very close to the VIN pin of the IC and preferably
connected directly to the pin and not through vias.
• The VIN decoupling capacitor should be
connected as close as possible to the AGND pin.
• The VIN terminal is noise sensitive and the
placement of the capacitor is very critical.
8.3
VIN Power Path Capacitor
• The VIN power path capacitor should be placed
and connected close to the VIN supply of the
power inductor and the PGND pin of the IC.
• Vias should not be used to connect the capacitor
to VIN.
8.4
Inductor
• Keep the inductor connections to the switch node
(SW) and to the input power line short and wide
enough to handle the switching current. Keep the
areas of the switching current loops small to
minimize the EMI problem.
• Do not route any digital lines underneath or close
to the inductor.
• Keep the switch node (SW) away from the noise
sensitive pins.
• To minimize the noise, place a ground plane
underneath the inductor.
FIGURE 8-1:
Recommended Output
Capacitors Placement on the MIC2877 PCB
Layout (See Typical Application Schematics).
The SW pin should be connected to the power inductor
using a bottom copper plane and the connection
between the SW pin and this bottom plane should be
done using several vias placed between the output
capacitors pads, while the connection of the copper
plane to the inductor should be done using several vias
placed very close or under the coil pad.
FIGURE 8-2:
Recommended Routing of
the SW Pin to the Power Inductor.
2017 Microchip Technology Inc.
DS20005873A-page 17
MIC2877
9.0
PACKAGING INFORMATION
9.1
Package Marking Information
8-Lead FTQFN 2 x 2 mm
Example
7A7
256
Legend: XX...X
Y
YY
WW
NNN
e3
*
Device
Code
MIC2877-AYFT-TR
7A7
MIC2877-4.75YFT-TR
7F7
MIC2877-5.0YFT-TR
7G7
MIC2877-5.25YFT-TR
7H7
MIC2877-5.5YFT-TR
7J7
Product code or customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle
mark).
Note:
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available characters for customer-specific information. Package may or may not include the
corporate logo.
Underbar (_) symbol may not be to scale.
DS20005873A-page 18
2017 Microchip Technology Inc.
MIC2877
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
2017 Microchip Technology Inc.
DS20005873A-page 19
MIC2877
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
DS20005873A-page 20
2017 Microchip Technology Inc.
MIC2877
APPENDIX A:
REVISION HISTORY
Revision A (November 2017)
• Original Release of this Document.
2017 Microchip Technology Inc.
DS20005873A-page 21
MIC2877
NOTES:
DS20005873A-page 22
2017 Microchip Technology Inc.
MIC2877
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
–
PART NO.
Device
Device:
Output Voltage:
XX
X
XX
–
Output Temperature Package
Voltage
MIC2877:
4.75
5.0
5.25
5.5
A
=
=
=
=
=
XX
Temperature:
Y
=
–40°C to +85°C
Package:
FT
=
8-Lead FTQFN 2 x 2 mm
Media Type:
TR
=
5,000/Reel(1)
a)
MIC2877-4.75YFT-TR:
4.75V Output Voltage,
–40°C to +85°C Temp. Range,
8-Pin FTQFN, 5,000/Reel
b)
MIC2877-5.0YFT-TR:
5V Output Voltage,
–40°C to +85°C Temp. Range,
8-Pin FTQFN, 5,000/Reel
c)
MIC2877-5.25YFT-TR:
5.25V Output Voltage,
–40°C to +85°C Temp. Range,
8-Pin FTQFN, 5,000/Reel
d)
MIC2877-5.5YFT-TR:
5.5V Output Voltage,
–40°C to +85°C Temp. Range,
8-Pin FTQFN, 5,000/Reel
e)
MIC2877-AYFT-TR:
Adjustable Output Voltage,
–40°C to +85°C Temp. Range,
8-Pin FTQFN, 5,000/Reel
Media
Type
2 MHz Synchronous Low Voltage Step-Up
Regulator with 6.5A Switch and
Bidirectional Load Disconnect
4.75V
5.00V
5.25V
5.50V
Adjustable
Examples:
Note 1:
2017 Microchip Technology Inc.
Tape and Reel identifier only appears in the
catalog part number description. This identifier is used for ordering purposes and is nto
printed on the device package. Check with
your Microchip Sales Office for package
availability with the Tape and Reel option.
DS20005873A-page 23
MIC2877
NOTES:
DS20005873A-page 24
2017 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate, AVR,
AVR logo, AVR Freaks, BeaconThings, BitCloud, CryptoMemory,
CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KEELOQ,
KEELOQ logo, Kleer, LANCheck, LINK MD, maXStylus,
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Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
and other countries.
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mTouch, Precision Edge, and Quiet-Wire are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo,
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SQTP is a service mark of Microchip Technology Incorporated in
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All other trademarks mentioned herein are property of their
respective companies.
© 2017, Microchip Technology Incorporated, All Rights Reserved.
ISBN: 978-1-5224-2304-1
== ISO/TS 16949 ==
2017 Microchip Technology Inc.
DS20005873A-page 25
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Tel: 40-21-407-87-50
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Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
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Tel: 46-8-5090-4654
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Fax: 44-118-921-5820
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10/25/17
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