MIC33030
8 MHz 400 mA Internal Inductor Buck Regulator
with HyperLight Load®
Features
General Description
• Internal Inductor
- Simplifies Design to Two External Capacitors
• Input Voltage: 2.7V to 5.5V
• Output Voltage Accuracy of ±2.5% over
Temperature
• 400 mA Output Current
• Efficiency up to 78% at 1 mA
• 21 µA Typical Quiescent Current
• Up to 8 MHz PWM Operation in Continuous Mode
• Ultra-Fast Transient Response
• Low Voltage Output Ripple
- 30 mVPP Ripple in HyperLight Load® Mode
- 7 mV Output Voltage Ripple in Full PWM
Mode
• Fully Integrated MOSFET Switches
• 0.01 µA Shutdown Current
• Thermal Shutdown and Current-Limit Protection
• Fixed and Adjustable Output Voltage Options
Available (0.7V to 3.6V)
• 2.5 mm x 2.0 mm 10-Lead HJDFN Package
• –40°C to +125°C Junction Temperature Range
The MIC33030 is a high-efficiency, 8 MHz 400 mA
synchronous buck regulator with an internal inductor
and HyperLight Load® mode. HyperLight Load®
provides very high efficiency at light loads and ultra-fast
transient response that is perfectly suited for supplying
processor core voltages.
Applications
•
•
•
•
•
•
•
•
An additional benefit of this proprietary architecture is
the very low output ripple voltage throughout the entire
load range with the use of small output capacitors. The
tiny 2.5 mm x 2.0 mm HJDFN package saves precious
board space and requires only two external capacitors.
The MIC33030 is designed for use with tiny output
capacitors as small as 2.2 µF. This gives the MIC33030
the ease of use of an LDO with the efficiency of a
HyperLight Load® DC converter.
The MIC33030 achieves efficiency in HyperLight
Load® mode as high as 78% at 1 mA, with a very low
quiescent current of 21 µA. At higher loads, the
MIC33030 provides a constant switching frequency up
to 8 MHz.
The MIC33030 is available in a 10-lead 2.5 mm x
2.0 mm HJDFN package with an operating junction
temperature range of –40°C to +125°C.
Mobile Handsets
Portable Media/MP3 Players
Portable Navigation Devices (GPS)
WiFi/WiMax/WiBro Modules
Digital Cameras
Wireless LAN Cards
USB-Powered Devices
Portable Applications
2018 - 2022 Microchip Technology Inc.
DS20006026B-page 1
MIC33030
Package Types
2.5 mm x 2.0 mm HJDFN
2.5 mm x 2.0 mm HJDFN
Fixed (Top View)
SNS
1
NC
2
9
EN
3
SW
SW
Adjustable (Top View)
SNS
1
AGND
FB
2
9
AGND
8
PGND
EN
3
8
PGND
4
7
VOUT
SW
4
7
VOUT
5
6
VOUT
SW
5
6
VOUT
EP
10
VIN
EP
10
VIN
Typical Application Circuits
Fixed Output MIC33030
Adjustable Output MIC33030
DS20006026B-page 2
2018 - 2022 Microchip Technology Inc.
MIC33030
Functional Block Diagrams
Simplified MIC33030 Fixed Functional Block Diagram
Simplified MIC33030 Adjustable Functional Block Diagram
2018 - 2022 Microchip Technology Inc.
DS20006026B-page 3
MIC33030
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
Supply Voltage (VIN)..................................................................................................................................... –0.3V to +6V
Sense (VSNS) ............................................................................................................................................... –0.3V to +6V
Output Switch Voltage .................................................................................................................................. –0.3V to +6V
Enable Input Voltage (VEN) ........................................................................................................................... –0.3V to VIN
ESD Rating (Note 1)................................................................................................................................... ESD Sensitive
Operating Ratings ‡
Supply Voltage (VIN).................................................................................................................................. +2.7V to +5.5V
Enable Input Voltage (VEN) ................................................................................................................................ 0V to VIN
Output Voltage (VOUT)............................................................................................................................... +0.7V to +3.6V
† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at those or any other conditions above those indicated
in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended
periods may affect device reliability. Specifications are for packaged product only.
‡ Notice: The device is not guaranteed to function outside its operating ratings.
Note 1: Devices are ESD sensitive. Handling precautions are recommended. Human body model, 1.5 kΩ in series
with 100 pF.
ELECTRICAL CHARACTERISTICS
Electrical Characteristics: TA = 25°C, VIN = VEN = 3.6V; COUT = 4.7µF; Bold values indicate –40°C ≤ TJ ≤ +125°C;
unless otherwise specified. Specification for packaged product only.
Parameter
Symbol
Min.
Typ.
Max.
Units
Conditions
Supply Voltage Range
—
2.7
—
5.5
V
—
Undervoltage Lockout
Threshold
—
2.45
2.55
2.65
V
Turn-On
Under-Voltage Lockout
Hysteresis
—
—
100
—
mV
—
Quiescent Current
—
—
21
35
µA
0.01
4
IOUT = 0 mA, SNS > 1.2 * VOUT(NOM)
µA
+2.5
VEN = 0V; VIN = 5.5V
%
VIN = 3.6V; ILOAD = 20 mA
Shutdown Current
—
—
Output Voltage Accuracy
—
–2.5
Feedback Voltage
—
—
0.62
—
V
Adjustable Option Only
Current-Limit
—
0.41
0.7
1
A
SNS = 0.9*VOUT(NOM)
Output Voltage Line
Regulation
—
—
0.5
—
%/V
—
—
0.7
—
%
—
—
0.65
—
—
—
0.8
—
—
—
8
—
MHz
Output Voltage Load
Regulation
PWM Switch On-Resistance
Maximum Frequency
Ω
VIN = 3.0V to 5.5V, VOUT = 1.2V, ILOAD
= 20 mA,
20 mA < ILOAD < 400 mA,
VOUT = 1.2V, VIN = 3.6V
ISW = 100 mA PMOS
ISW = –100 mA NMOS
IOUT = 120 mA
Soft Start Time
—
—
100
—
µs
—
0.5
0.9
1.2
VOUT = 90%
Enable Threshold
V
—
Enable Hysteresis
—
—
35
—
mV
—
Enable Input Current
—
—
0.1
2
µA
—
Over Temperature Shutdown
—
—
160
—
°C
—
Over Temperature Shutdown
Hysteresis
—
—
20
—
°C
—
DS20006026B-page 4
2018 - 2022 Microchip Technology Inc.
MIC33030
TEMPERATURE SPECIFICATIONS (Note 1)
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Junction Operating Temperature Range
TJ
–40
—
+125
°C
—
Storage Temperature Range
TS
–65
—
+150
°C
—
Thermal Resistance HJDFN 2.5 mm x 2.0 mm
JA
—
76
—
°C/W
—
Thermal Resistance HJDFN 2.5 mm x 2.0 mm
JC
—
45
—
°C/W
—
Temperature Ranges
Package Thermal Resistances
Note 1:
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.
2018 - 2022 Microchip Technology Inc.
DS20006026B-page 5
MIC33030
2.0
Note:
TYPICAL PERFORMANCE CURVES
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
FIGURE 2-1:
2.5V).
Efficiency vs. Load (VOUT =
FIGURE 2-4:
1.2V).
Efficiency vs. Load (VOUT =
FIGURE 2-2:
1.8V).
Efficiency vs. Load (VOUT =
FIGURE 2-5:
(VOUT = 1V).
Efficiency vs. Load
FIGURE 2-3:
1.5V)
Efficiency vs. Load (VOUT =
FIGURE 2-6:
Quiescent Current vs. Input
Voltage (Not Switching).
DS20006026B-page 6
2018 - 2022 Microchip Technology Inc.
MIC33030
FIGURE 2-7:
Quiescent Current vs.
Temperature (Not Switching).
FIGURE 2-10:
Temperature.
Output Voltage vs.
FIGURE 2-8:
Voltage.
Output Voltage vs. Input
FIGURE 2-11:
Temperature.
Switching Frequency vs.
FIGURE 2-9:
Current.
Output Voltage vs. Output
FIGURE 2-12:
Load Current.
Switching Frequency vs.
2018 - 2022 Microchip Technology Inc.
DS20006026B-page 7
MIC33030
FIGURE 2-13:
Input Voltage.
Enable (ON) Voltage vs.
FIGURE 2-16:
Switching Waveform Discontinuous Mode IOUT = 1 mA.
FIGURE 2-14:
Temperature.
Enable Voltage vs.
FIGURE 2-17:
Switching Waveform Discontinuous Mode IOUT = 10 mA.
FIGURE 2-15:
Voltage.
Current-Limit vs. Input
FIGURE 2-18:
Switching Waveform Discontinuous Mode IOUT = 50 mA.
DS20006026B-page 8
2018 - 2022 Microchip Technology Inc.
MIC33030
FIGURE 2-19:
Switching Waveform Continuous Mode IOUT = 120 mA.
FIGURE 2-22:
Start Up (IOUT = 350 mA).
FIGURE 2-20:
Switching Waveform Continuous Mode IOUT = 300 mA.
FIGURE 2-23:
Start Up (IOUT = 1 mA).
FIGURE 2-21:
Switching Waveform Continuous Mode IOUT = 400 mA.
FIGURE 2-24:
150 mA.
Load Transient 0 mA to
2018 - 2022 Microchip Technology Inc.
DS20006026B-page 9
MIC33030
FIGURE 2-25:
300 mA.
Load Transient 0 mA to
FIGURE 2-27:
400 mA).
Load Transient (100 mA to
FIGURE 2-26:
400 mA).
Load Transient (0 mA to
FIGURE 2-28:
Line Transient (3V to 4.2V).
DS20006026B-page 10
2018 - 2022 Microchip Technology Inc.
MIC33030
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
Pin Number
MIC33030
(Fixed Option)
Pin Number
MIC33030
(ADJ Option)
Pin
Name
1
1
SNS
2
—
NC
Not internally connected.
—
2
FB
Feedback: Connect resistor divider at this node to set output
voltage. Resistors should be selected based on a nominal
VFB = 0.62V.
3
3
EN
Enable: Logic high enables operation of the regulator. Logic
low will shut down the device. Do not leave floating.
4, 5
4, 5
SW
Switch: Internal power MOSFET output switches.
6, 7
6, 7
VOUT
Output Voltage: The output of the regulator. Connect to SNS
pin. For adjustable option, connect to feedback resistor
network.
8
8
PGND
Power Ground.
9
9
AGND
Analog Ground.
10
10
VIN
ePAD
ePAD
HS PAD
2018 - 2022 Microchip Technology Inc.
Description
Sense: Connect to VOUT as close to output capacitor as
possible to sense output voltage.
Input Voltage: Connect a capacitor to ground to decouple the
noise.
Connect to PGND or AGND.
DS20006026B-page 11
MIC33030
4.0
FUNCTIONAL DESCRIPTION
4.1
VIN
The input supply (VIN) provides power to the internal
MOSFETs for the switch mode regulator along with the
internal control circuitry. The VIN operating range is
2.7V to 5.5V, so an input capacitor with a minimum
voltage rating of 6.3V is recommended. Due to the high
switching speed, a minimum 2.2 µF bypass capacitor
placed close to VIN and the power ground (PGND) pin
is required.
4.2
4.7
FB (Adjustable Output Only)
The feedback pin (FB) allows the regulated output
voltage to be set by applying an external resistor
network. The internal reference voltage is 0.62V and
the recommended value of R2 is 200 kΩ. The output
voltage is calculated from the equation below:
EQUATION 4-1:
R1
V OUT = 0.62V ---------------+ 1
200k
EN
A logic high signal on the enable pin activates the
output voltage of the device. A logic low signal on the
enable pin deactivates the output and reduces supply
current to 0.01 µA. The MIC33030 features built in
soft-start circuitry that reduces in-rush current and
prevents the output voltage from overshooting at start
up. Do not leave the enable pin floating.
4.3
SW
The switch (SW) connects directly to one end of the
internal inductor and provides the current path during
switching cycles. The other end of the inductor is
connected to the load, SNS pin and output capacitor.
Because the MIC33030 has an internal inductor, this
pin is not routed in most applications.
4.4
VOUT
The output pin (VOUT) is the output voltage pin
following the internal inductor. Connect a minimum of
2.2 µF output filter capacitor to this pin.
4.5
SNS
The sense (SNS) pin is connected to the output of the
device to provide feedback to the control circuitry. The
SNS connection should be placed close to the output
capacitor.
4.6
FIGURE 4-1:
Schematic.
4.8
MIC33030-AYHJ
PGND
The power ground pin is the ground path for the high
current in PWM mode. The current loop for the power
ground should be as small as possible and separate
from the analog ground (AGND) loop as applicable.
AGND
The analog ground (AGND) is the ground path for the
biasing and control circuitry. The current loop for the
signal ground should be separate from the power
ground (PGND) loop.
DS20006026B-page 12
2018 - 2022 Microchip Technology Inc.
MIC33030
5.0
APPLICATION INFORMATION
5.5
Efficiency Considerations
The MIC33030 is a high-performance DC/DC step
down regulator that offers a small solution size.
Supporting an output current up to 400 mA inside a tiny
2.5 mm x 2.0 mm HJDFN package and requiring only
two external components, the MIC33030 meets today’s
miniature portable electronic device needs. Using the
HyperLight Load® switching scheme, the MIC33030 is
able to maintain high efficiency throughout the entire
load range while providing ultra-fast load transient
response. The following sections provide additional
device application information.
Efficiency is defined as the amount of useful output
power, divided by the amount of power supplied.
5.1
Maintaining high efficiency serves two purposes. It
reduces power dissipation in the power supply,
reducing the need for heat sinks and thermal design
considerations and it reduces consumption of current
for battery powered applications. Reduced current
draw from a battery increases the devices operating
time which is critical in hand held devices.
A 2.2 µF ceramic capacitor or greater should be placed
close to the VIN pin and PGND pin for bypassing. A
TDK C1608X5R0J475K, size 0603, 4.7 µF ceramic
capacitor is recommended based upon performance,
size and cost. A X5R or X7R temperature rating is
recommended for the input capacitor. Y5V temperature
rating capacitors, aside from losing most of their
capacitance over temperature, can also become
resistive at high frequencies. This reduces their ability
to filter out high frequency noise.
5.2
Output Capacitor
The MIC33030 is designed for use with a 2.2 µF or
greater ceramic output capacitor. Increasing the output
capacitance will lower output ripple and improve load
transient response but could increase solution size or
cost. A low equivalent series resistance (ESR) ceramic
output capacitor such as the TDK C1608X5R0J475K,
size 0603, 4.7 µF ceramic capacitor is recommended
based upon performance, size and cost. Both the X7R
or X5R temperature rating capacitors are
recommended. The Y5V and Z5U temperature rating
capacitors are not recommended due to their wide
variation in capacitance over temperature and
increased resistance at high frequencies.
5.3
Compensation
The MIC33030 is designed to be stable with a minimum
of 2.2 µF ceramic (X5R) output capacitor.
5.4
Duty Cycle
The typical maximum duty cycle of the MIC33030 is
90%.
V OUT I OUT
= -------------------------------- 100
V IN I IN
There are two types of losses in switching converters;
DC losses and switching losses. DC losses are simply
the power dissipation of I2R. Power is dissipated in the
high-side switch during the on cycle. Power loss is
equal to the high-side MOSFET RDS(ON) multiplied by
the switch current squared. During the off cycle, the
low-side N-channel MOSFET conducts, also
dissipating power. Device operating current also
reduces efficiency. The product of the quiescent
(operating) current and the supply voltage represents
another DC loss. The current required driving the gates
on and off at a constant 8 MHz frequency and the
switching transitions make up the switching losses.
90.0%
80.0%
VIN = 3.6V
70.0%
EFFICIENCY (%)
Input Capacitor
EQUATION 5-1:
60.0%
50.0%
40.0%
30.0%
20.0%
10.0%
0.0%
1
10
100
1000
LOAD CURRENT (mA)
FIGURE 5-1:
Efficiency under Load.
Figure 5-1 shows an efficiency curve. From no load to
100 mA, efficiency losses are dominated by quiescent
current losses, gate drive and transition losses. By
using the HyperLight Load® mode, the MIC33030 is
able to maintain high efficiency at low output currents.
Over 100 mA, efficiency loss is dominated by MOSFET
RDS(ON) and inductor losses. Higher input supply
voltages will increase the gate to source threshold on
the internal MOSFETs, thereby reducing the internal
2018 - 2022 Microchip Technology Inc.
DS20006026B-page 13
MIC33030
RDS(ON). This improves efficiency by reducing DC
losses in the device. All but the inductor losses are
inherent to the device. In which case, inductor selection
becomes increasingly critical in efficiency calculations.
As the inductors are reduced in size, the DC resistance
(DCR) can become quite significant.
The DCR losses can be calculated by using
Equation 5-2:
EQUATION 5-2:
2
P DCR = I OUT DCR
From that, the loss in efficiency due to inductor
resistance can be calculated by using Equation 5-3:
EQUATION 5-3:
V OUT I OUT
EfficiencyLoss = 1 – ---------------------------------------------------- 100
V OUT I OUT + P DCR
Efficiency loss due to DCR is minimal at light loads and
gains significance as the load is increased. Inductor
selection becomes a trade-off between efficiency and
size in this case.
5.6
HyperLight Load® Mode
MIC33030 uses a minimum on-time and off-time
proprietary control loop. When the output voltage falls
below the regulation threshold, the error comparator
begins a switching cycle that turns the PMOS on and
keeps it on for the duration of the minimum-on-time.
This increases the output voltage.
If the output voltage is over the regulation threshold,
then the error comparator turns the PMOS off for a
minimum off-time until the output drops below the
threshold. The NMOS acts as an ideal rectifier that
conducts when the PMOS is off. Using a NMOS switch
instead of a diode allows for lower voltage drop across
the switching device when it is on.
The asynchronous switching combination between the
PMOS and the NMOS allows the control loop to work
in discontinuous mode for light load operations. In
discontinuous mode, the MIC33030 works in pulse
frequency modulation (PFM) to regulate the output. As
the output current increases, the off-time decreases,
thus provides more energy to the output.
This switching scheme improves the efficiency of
MIC33030 during light load currents by only switching
when it is needed. As the load current increases, the
MIC33030 goes into continuous conduction mode
(CCM) and switches at a frequency centered at 8 MHz.
The equation to calculate the load when the MIC33030
goes into continuous conduction mode may be
approximated by the following Equation 5-4:
EQUATION 5-4:
The effect of MOSFET voltage drops and DCR losses
in conjunction with the maximum duty cycle combine to
limit maximum output voltage for a given input voltage.
Figure 5-2 shows this relationship based on the typical
resistive losses in the MIC33030:
V IN – V OUT D
I LOAD -------------------------------------------2L f
The load at which MIC33030 transitions from
HyperLight Load® mode to PWM mode is a function of
the input voltage (VIN), output voltage (VOUT), duty
cycle (D), inductance (L), and frequency (f). Because
the inductance of MIC33030 is 0.36 µH, the device will
enter HyperLight Load® mode or PWM mode at
approximately 150 mA.
5.7
FIGURE 5-2:
DS20006026B-page 14
VOUT(MAX) vs. VIN
Power Dissipation Considerations
As with all power devices, the ultimate current rating of
the output is limited by the thermal properties of the
package and the PCB it is mounted on. There is a
simple, ohms law type relationship between thermal
resistance, power dissipation, and temperature which
are analogous to an electrical circuit:
2018 - 2022 Microchip Technology Inc.
MIC33030
EQUATION 5-6:
Rxy
Vx
Ryz
Vy
Vz
T J = P DISS R JC + R CA + T AMB
+
Vz
Isource
As can be seen in Figure 5-4, total thermal resistance
RθJA = RθJC + RθCA. This can also be calculated using
Equation 5-6:
FIGURE 5-3:
From this simple circuit Vx can be calculated if ISOURCE,
Vz and the resistor values, Rxy and Ryz are known,
using the Equation 5-5:
EQUATION 5-7:
EQUATION 5-5:
T J = P DISS R JA + T AMB
Since effectively all of the power loss in the converter is
dissipated within the MIC33030 package, PDISS can be
calculated by using Equation 5-8:
V X = I SOURCE R XY + R YZ + V Z
Thermal circuits can be considered using these same
rules and can be drawn similarly replacing current
sources with power dissipation (in Watts), resistance
with thermal resistance (in °C/W) and voltage sources
with temperature (in °C):
EQUATION 5-8:
1
P DISS = P OUT --- – 1
Where:
RTJC
Tj
η=
RTCA
Tc
Tamb
+
Pdiss
Tamb
Efficiency taken from Efficiency Curves
RθJC and RθJA are found in the operating ratings
section of the data sheet.
EXAMPLE 5-1:
FIGURE 5-4:
Now replacing the variables in the equation for Vx, we
can find the junction temperature (TJ) from power
dissipation, ambient temperature and the known
thermal resistance of the PCB (RθCA) and the package
(RθJC):
A MIC33030 is intended to drive a 300 mA load at 1.8V
and is placed on a printed circuit board which has a
ground plane area of at least 25 mm square. The
voltage source is a Li-ion battery with a lower operating
threshold of 3V and the ambient temperature of the
assembly can be up to 50°C.
Summary of variables:
•
•
•
•
•
IOUT = 0.3A
VOUT = 1.8V
VIN = 3V to 4.2V
TAMB = 50°C
RθJA = 76°C/W
η @ 300 mA = 75% (worst case with VIN = 4.2V) See
Section 2.0, Typical Performance Curves.
2018 - 2022 Microchip Technology Inc.
DS20006026B-page 15
MIC33030
EQUATION 5-9:
1
P DISS = 1.8 0.3 --------- – 1 = 0.18W
0.75
The worst case switch and inductor resistance will
increase at higher temperatures, so a margin of 20%
can be added to account for this:
EQUATION 5-10:
P DISS = 0.18 1.2 = 0.216W
Therefore:
TJ =
0.216W x (76°C/W) + 50°C
TJ =
66°C
This is well below the maximum 125°C.
DS20006026B-page 16
2018 - 2022 Microchip Technology Inc.
MIC33030
6.0
PACKAGING INFORMATION
6.1
Package Marking Information
10-Lead HJDFN*
Example
3GF4
275Y
XXXX
NNNY
TABLE 6-1:
MIC33030 PACKAGE MARKING CODES
Part Number
Output Voltage
Marking Code
MIC33030-AYHJ
ADJ
3GFA
MIC33030-JYHJ
2.5V
3GFJ
MIC33030-GYHJ
1.8V
3GFG
MIC33030-4YHJ
1.2V
3GF4
Legend: XX...X
Y
YY
WW
NNN
e3
*
Product code or customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle
mark).
Note:
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information. Package may or may not include
the corporate logo.
Underbar (_) and/or Overbar (‾) symbol may not be to scale.
Note:
If the full seven-character YYWWNNN code cannot fit on the package, the following truncated codes
are used based on the available marking space:
6 Characters = YWWNNN; 5 Characters = WWNNN; 4 Characters = WNNN; 3 Characters = NNN;
2 Characters = NN; 1 Character = N
2018 - 2022 Microchip Technology Inc.
DS20006026B-page 17
MIC33030
10-Lead HJDFN 2.5 mm x 2.0 mm Package Outline and Recommended Land Pattern
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
DS20006026B-page 18
2018 - 2022 Microchip Technology Inc.
MIC33030
APPENDIX A:
REVISION HISTORY
Revision A (May 2018)
• Converted Micrel document MIC33030 to Microchip data sheet DS20006026B.
• Minor text changes throughout.
Revision B (March 2022)
• Corrected package marking drawings and added
note below legend in Section 6.1, Package Marking Information.
2018 - 2022 Microchip Technology Inc.
DS20006026B-page 19
MIC33030
NOTES:
DS20006026B-page 20
2018 - 2022 Microchip Technology Inc.
MIC33030
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
-X
PART NO.
Device
X
Output
Junction
Voltage Temperature
Range
XX
–XX
Package
Option
Media Type
Device:
MIC33030: 8 MHz 400 mA Internal Inductor Buck
Regulator with HyperLight Load®
Output Voltage:
4 = 1.2V
G* = 1.8V
J = 2.5V
A = Adjustable
Junction
Temperature Range:
Y
=
–40°C to +125°C
Package:
HJ
=
10-Lead 2.5 mm x 2.0 mm x 1.15 mm
HJDFN
Media Type:
T5
TR
= 500/Reel
= 5000/Reel
Note: Other voltages available. Contact Factory for details.
Examples:
a) MIC33030-4YHJ-T5:
8 MHz 400 mA Internal Inductor
Buck Regulator with HyperLight
Load®, 1.2V Fixed Output Voltage,
–40°C to +125°C Junction
Temperature Range, Pb-Free,
RoHS Compliant, 10-Lead HJDFN
Package, 500/Reel
b) MIC33030-GYHJ-TR:
8 MHz 400 mA Internal Inductor
Buck Regulator with HyperLight
Load®, 1.8V Fixed Output Voltage,
–40°C to +125°C Junction
Temperature Range, Pb-Free,
RoHS Compliant, 10-Lead HJDFN
Package, 5000/Reel
c) MIC33030-JYHJ-T5:
8 MHz 400 mA Internal Inductor
Buck Regulator with HyperLight
Load®, 2.5V Fixed Output Voltage,
–40°C to +125°C Junction
Temperature Range, Pb-Free,
RoHS Compliant, 10-Lead HJDFN
Package, 500/Reel
d) MIC33030-AYHJ-TR:
8 MHz 400 mA Internal Inductor
Buck Regulator with HyperLight
Load®, Adjustable Output Voltage,
–40°C to +125°C Junction
Temperature Range, Pb-Free,
RoHS Compliant, 10-Lead HJDFN
Package, 5000/Reel
d) MIC33030-4YHJ-TR
8 MHz 400 mA Internal Inductor
Buck Regulator with HyperLight
Load®, 1.2V Fixed Output Voltage,
-40°C to +125°C Junction
Temperature Range, 10-Lead
HJDFN Package, 5000/Reel
Note 1:
2018 - 2022 Microchip Technology Inc.
Tape and Reel identifier only appears in the
catalog part number description. This identifier is
used for ordering purposes and is not printed on
the device package. Check with your Microchip
Sales Office for package availability with the
Tape and Reel option.
DS20006026B-page 21
MIC33030
NOTES:
DS20006026B-page 22
2018 - 2022 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip products:
•
Microchip products meet the specifications contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is secure when used in the intended manner, within operating specifications, and
under normal conditions.
•
Microchip values and aggressively protects its intellectual property rights. Attempts to breach the code protection features of
Microchip product is strictly prohibited and may violate the Digital Millennium Copyright Act.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code. Code protection does not
mean that we are guaranteeing the product is “unbreakable”. Code protection is constantly evolving. Microchip is committed to
continuously improving the code protection features of our products.
This publication and the information herein may be used only
with Microchip products, including to design, test, and integrate
Microchip products with your application. Use of this information in any other manner violates these terms. Information
regarding device applications is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your
specifications. Contact your local Microchip sales office for
additional support or, obtain additional support at https://
www.microchip.com/en-us/support/design-help/client-supportservices.
THIS INFORMATION IS PROVIDED BY MICROCHIP "AS IS".
MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED,
WRITTEN OR ORAL, STATUTORY OR OTHERWISE,
RELATED TO THE INFORMATION INCLUDING BUT NOT
LIMITED TO ANY IMPLIED WARRANTIES OF NONINFRINGEMENT, MERCHANTABILITY, AND FITNESS FOR A
PARTICULAR PURPOSE, OR WARRANTIES RELATED TO
ITS CONDITION, QUALITY, OR PERFORMANCE.
IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT, SPECIAL, PUNITIVE, INCIDENTAL, OR CONSEQUENTIAL LOSS, DAMAGE, COST, OR EXPENSE OF ANY
KIND WHATSOEVER RELATED TO THE INFORMATION OR
ITS USE, HOWEVER CAUSED, EVEN IF MICROCHIP HAS
BEEN ADVISED OF THE POSSIBILITY OR THE DAMAGES
ARE FORESEEABLE. TO THE FULLEST EXTENT
ALLOWED BY LAW, MICROCHIP'S TOTAL LIABILITY ON
ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION
OR ITS USE WILL NOT EXCEED THE AMOUNT OF FEES, IF
ANY, THAT YOU HAVE PAID DIRECTLY TO MICROCHIP
FOR THE INFORMATION.
Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to
defend, indemnify and hold harmless Microchip from any and
all damages, claims, suits, or expenses resulting from such
use. No licenses are conveyed, implicitly or otherwise, under
any Microchip intellectual property rights unless otherwise
stated.
Trademarks
The Microchip name and logo, the Microchip logo, Adaptec,
AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud,
CryptoMemory, CryptoRF, dsPIC, flexPWR, HELDO, IGLOO,
JukeBlox, KeeLoq, Kleer, LANCheck, LinkMD, maXStylus,
maXTouch, MediaLB, megaAVR, Microsemi, Microsemi logo,
MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower,
PICSTART, PIC32 logo, PolarFire, Prochip Designer, QTouch,
SAM-BA, SenGenuity, SpyNIC, SST, SST Logo, SuperFlash,
Symmetricom, SyncServer, Tachyon, TimeSource, tinyAVR, UNI/O,
Vectron, and XMEGA are registered trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
AgileSwitch, APT, ClockWorks, The Embedded Control Solutions
Company, EtherSynch, Flashtec, Hyper Speed Control, HyperLight
Load, IntelliMOS, Libero, motorBench, mTouch, Powermite 3,
Precision Edge, ProASIC, ProASIC Plus, ProASIC Plus logo, QuietWire, SmartFusion, SyncWorld, Temux, TimeCesium, TimeHub,
TimePictra, TimeProvider, TrueTime, WinPath, and ZL are
registered trademarks of Microchip Technology Incorporated in the
U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, Augmented Switching, BlueSky,
BodyCom, CodeGuard, CryptoAuthentication, CryptoAutomotive,
CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net,
Dynamic Average Matching, DAM, ECAN, Espresso T1S,
EtherGREEN, GridTime, IdealBridge, In-Circuit Serial
Programming, ICSP, INICnet, Intelligent Paralleling, Inter-Chip
Connectivity, JitterBlocker, Knob-on-Display, maxCrypto, maxView,
memBrain, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo,
MPLIB, MPLINK, MultiTRAK, NetDetach, NVM Express, NVMe,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple
Blocker, RTAX, RTG4, SAM-ICE, Serial Quad I/O, simpleMAP,
SimpliPHY, SmartBuffer, SmartHLS, SMART-I.S., storClad, SQI,
SuperSwitcher, SuperSwitcher II, Switchtec, SynchroPHY, Total
Endurance, TSHARC, USBCheck, VariSense, VectorBlox, VeriPHY,
ViewSpan, WiperLock, XpressConnect, and ZENA are trademarks
of Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
The Adaptec logo, Frequency on Demand, Silicon Storage
Technology, Symmcom, and Trusted Time are registered
trademarks of Microchip Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology Germany
II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in
other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2018 - 2022, Microchip Technology Incorporated and its subsidiaries.
All Rights Reserved.
For information regarding Microchip’s Quality Management Systems,
please visit www.microchip.com/quality.
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
ISBN: 978-1-6683-0052-7
DS20006026B-page 23
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DS20006026B-page 24
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09/14/21
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