MIC33050
4 MHz Internal Inductor PWM Buck Power Module with
HyperLight Load®
Features
General Description
•
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The MIC33050 is a high-efficiency 600 mA PWM
synchronous buck (step-down) regulator with internal
inductor featuring HyperLight Load®, a switching
scheme that offers best-in-class light load efficiency
and transient performance while providing very small
external components and low output ripple at all loads.
Input Voltage: 2.7V to 5.5V
600 mA Output Current
Fixed and Adjustable Output Voltage Options
No External Inductor Required
Ultra-Fast Transient Response
20 µA Quiescent Current
4 MHz Switching in PWM Mode
Low Output Voltage Ripple
>93% Peak Efficiency
>85% Efficiency at 1 mA
Micropower Shutdown
12-Pin 3 mm x 3 mm HDFN
–40°C to +125°C Junction Temperature Range
Applications
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MPU Power
Portable Instrumentation
Wearable Devices
Space-Constrained MCU Systems
RF Modules
USB-Powered Devices
The MIC33050 also has a very low typical quiescent
current of 20 µA and can achieve over 85% efficiency
even at 1 mA.
In contrast to traditional light load schemes, the
HyperLight Load® architecture does not trade off
control speed to obtain low standby currents and in
doing so, the device only needs a small output
capacitor to absorb the load transient as the powered
device goes from light load to full load.
At higher loads, the MIC33050 provides a nearly
constant switching frequency of greater than 4 MHz
while providing peak efficiencies greater than 93%.
The MIC33050 is available in fixed and adjustable
output voltages and comes in a 12-pin 3 mm x 3 mm
HDFN with a operating junction temperature range of
–40°C to +125°C.
Package Types
12-Pin 3 mm x 3 mm HDFN
Fixed (Top View)
2018 - 2022 Microchip Technology Inc.
12-Pin 3 mm x 3 mm HDFN
Adjustable (Top View)
DS20006120B-page 1
MIC33050
Typical Application Circuits
Fixed Output MIC33050
Adjustable Output MIC33050
R1
R2
DS20006120B-page 2
2018 - 2022 Microchip Technology Inc.
MIC33050
Functional Block Diagrams
Simplified MIC33050 Fixed Functional Block Diagram
Simplified MIC33050 Adjustable Functional Block Diagram
2018 - 2022 Microchip Technology Inc.
DS20006120B-page 3
MIC33050
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
Supply Voltage (VIN)....................................................................................................................................................+6V
Output Switch Voltage (VSW) ......................................................................................................................................+6V
Output Switch Current (ISW) ..........................................................................................................................................2A
Logic Enable Input Voltage (VEN).................................................................................................................. –0.3V to VIN
ESD Rating (Note 1)................................................................................................................................... ESD Sensitive
Operating Ratings ‡
Supply Voltage (VIN).................................................................................................................................. +2.7V to +5.5V
† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at those or any other conditions above those indicated
in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended
periods may affect device reliability. Specifications are for packaged product only.
‡ Notice: The device is not guaranteed to function outside its operating ratings.
Note 1: Devices are ESD sensitive. Handling precautions are recommended. Human body model, 1.5 kΩ in series
with 100 pF.
ELECTRICAL CHARACTERISTICS
Electrical Characteristics: TA = 25°C, VIN = VEN = 3.6V; CFF = 560 pF; COUT = 4.7µF; IOUT = 20 mA unless
otherwise specified. Bold values indicate –40°C ≤ TJ ≤ +125°C. Specification for packaged product only.
Parameter
Symbol
Min.
Typ.
Max.
Supply Voltage Range
VIN
2.7
—
5.5
V
—
Undervoltage Lockout
Threshold
UVLO
2.45
2.55
2.65
V
Turn-On
Undervoltage Lockout
Hysteresis
UVLOHYS
—
100
—
mV
—
IQ
—
20
32
µA
IOUT = 0 mA, SNS > 1.2 * VOUT(NOM)
Quiescent Current
Shutdown Current
ISHDN
Output Voltage Accuracy
ΔVOUT
Units Conditions
—
0.01
4
µA
–2.5
+2.5
VEN = 0V; VIN = 5.5V
—
%
VIN = 3.0V; ILOAD = 20 mA
VSNS = 0.9*VOUT(NOM)
ILIM
0.65
1
1.7
A
Output Voltage Line
Regulation
ΔVO_LINE
—
0.5
—
%/V
Output Voltage Load
Regulation
ΔVO_LOAD
—
0.3
—
%
20 mA < ILOAD < 500 mA
VFB
VIN = 3.0V; IOUT = 20 mA
Current Limit in PWM Mode
Feedback Voltage
Maximum Duty Cycle
390
400
410
mV
DMAX
80
89
—
%
RDS(ON)P
—
0.45
—
RDS(ON)N
—
0.5
—
Switching Frequency
fSW
—
4
—
MHz
Soft Start Time
tSS
—
650
—
µs
PWM Switch On-Resistance
Ω
VIN = 3.0V to 5.5V, ILOAD = 20 mA
VSNS ≤ VOUT(NOM)
ISW = 100 mA PMOS
ISW = –100 mA NMOS
IOUT = 120 mA
VOUT = 90% of VOUT(NOM)
Enable Threshold
VENTH
0.5
0.8
1.2
V
Enable Hysteresis
VENHYS
—
35
—
mV
—
Turn-On
Enable Input Current
IEN
—
0.1
2
µA
—
Overtemperature Shutdown
TSD
—
165
—
°C
—
Overtemperature Shutdown
Hysteresis
TSDHYS
—
20
—
°C
—
DS20006120B-page 4
2018 - 2022 Microchip Technology Inc.
MIC33050
TEMPERATURE SPECIFICATIONS (Note 1)
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Operating Junction Temperature Range
TJ
–40
—
+125
°C
—
Storage Temperature Range
TS
–65
—
+150
°C
—
JA
—
60
—
°C/W
—
Temperature Ranges
Package Thermal Resistances
Thermal Resistance 12-Pin HDFN 3 mm x 3 mm
Note 1:
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.
2018 - 2022 Microchip Technology Inc.
DS20006120B-page 5
MIC33050
2.0
Note:
TYPICAL PERFORMANCE CURVES
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
100
90
VIN = 4.2V
EFFICIENCY (%)
EFFICIENCY (%)
100
80
70
VIN = 5.5V
VIN = 5.0V
60
90
VIN = 2.7V
80
70
VIN = 4.2V
60 VIN = 3.6V
L = 1uH
50
1
50
1
10
100
1000
OUTPUT CURRENT (mA)
FIGURE 2-1:
Efficiency (VOUT = 3.3V).
FIGURE 2-4:
= 3.0V
80
70 V = 3.6V
IN
VIN = 4.2V
60
30
20
10
VIN = 3.6V
VOUT = 1.8V
0
10
100
1000
OUTPUT CURRENT (mA)
FIGURE 2-2:
Efficiency (VOUT = 1.8V).
-40
-20
0
20
40
60
80
100
120
TEMPERATURE (°C)
FIGURE 2-5:
Temperature.
Quiescent Current vs.
50
100
EFFICIENCY (%)
QUIESCENT CURRENT (uA)
IN
90
VIN = 2.7V
80
70
VIN = 3.6V
VIN = 4.2V
QUIESCENT CURRENT (μA)
EFFICIENCY (%)
V
90
60
Efficiency (VOUT = 1.0V).
40
100
50
1
10
100
1000
OUTPUT CURRENT (mA)
45
40
35
30
25
20
15
VOUT = 1.8V
No Load
10
5
0
50
1
10
100
1000
OUTPUT CURRENT (mA)
FIGURE 2-3:
DS20006120B-page 6
Efficiency (VOUT = 1.2V).
2.7
3.2
3.7
4.2
4.7
5.2
INPUT VOLTAGE (V)
FIGURE 2-6:
Voltage.
Quiescent Current vs. Input
2018 - 2022 Microchip Technology Inc.
MIC33050
1.9
5
OUTPUT VOLTAGE (V)
SWITCHING FREQUENCY (MHz)
5.5
4.5
4
3.5
VIN = 3.6V
VOUT = 1.8V
Load = 150mA
3
1.85
1.8
VIN = 3.6V
VOUT = 1.8V
No Load
1.75
2.5
-40
-20
0
20
40
60
80
100
120
1.7
TEMPERATURE (°C)
Switching Frequency vs.
0
FIGURE 2-10:
Temperature.
5.50
20
40
60
80
100
120
Output Voltage vs.
1.9
5.00
4.50
4.00
3.50
VOUT = 1.8V
Load = 150mA
3.00
2.50
2.70
1.85
1.8
1.75
Load = 20mA
1.7
3.20
3.70
4.20
4.70
5.20
2.7
INPUT VOLTAGE (V)
FIGURE 2-8:
Input Voltage.
3.2
3.7
4.2
4.7
5.2
INPUT VOLTAGE (V)
Switching Frequency vs.
FIGURE 2-11:
Voltage.
Output Voltage vs. Input
1.90
0.5
FEEDBACK VOLTAGE (V)
-20
TEMPERATURE (°C)
OUTPUT VOLTAGE (V)
SWITCHING FREQUENCY (MHz)
FIGURE 2-7:
Temperature.
-40
0.48
0.46
1.85
0.44
0.42
1.80
0.4
0.38
0.36
VIN = 3.6V
VOUT = 1.8V
No Load
0.34
0.32
1.75
0.3
-40
-20
0
20
40
60
80
100
120
1.70
0
TEMPERATURE (°C)
FIGURE 2-9:
Temperature.
Feedback Voltage vs.
2018 - 2022 Microchip Technology Inc.
FIGURE 2-12:
Current.
VIN = 3.6V
100 200 300 400 500 600
OUTPUT CURRENT (mA)
Output Voltage vs. Output
DS20006120B-page 7
MIC33050
FIGURE 2-13:
(IOUT = 1 mA).
Switching Waveforms,
FIGURE 2-16:
(IOUT = 150 mA).
Switching Waveforms,
FIGURE 2-14:
(IOUT = 10 mA).
Switching Waveforms,
FIGURE 2-17:
(IOUT = 300 mA).
Switching Waveforms,
FIGURE 2-15:
(IOUT = 50 mA).
Switching Waveforms,
FIGURE 2-18:
(IOUT = 500 mA).
Switching Waveforms,
DS20006120B-page 8
2018 - 2022 Microchip Technology Inc.
MIC33050
FIGURE 2-19:
Start-Up, (IOUT = 1 mA).
FIGURE 2-20:
150 mA).
Load Transient, (1 mA to
FIGURE 2-21:
Start-Up, (IOUT = 150 mA).
2018 - 2022 Microchip Technology Inc.
FIGURE 2-22:
500 mA).
Load Transient, (25 mA to
DS20006120B-page 9
MIC33050
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
Pin Number
MIC33050
(Fixed Option)
Pin Number
MIC33050
(Adj. Option)
Pin
Name
Description
1
1
VIN
2
2
PGND
3, 4, 5, 6
3, 4, 5, 6
SW
Switch (Output): Internal power MOSFET output switches.
7, 8
7, 8
OUT
Output after the internal inductor.
9
9
EN
Supply Voltage (Input): Requires bypass capacitor to GND.
Power Ground.
Enable (Input): Logic low will shut down the device, reducing
the quiescent current to less than 4 µA. Do not leave floating.
10
10
SNS
Input to the error amplifier. Connect to the external resistor
divider network to see the output voltage. For fixed output
voltages connect VOUT (internal resistor network sets the
output voltage).
11
—
CFF
Feed forward capacitor connected to out sense pin.
—
11
FB
12
12
AGND
Analog ground.
ePAD
ePAD
ePAD
Exposed Heatsink Pad. Connect to power ground for best
thermal performance.
DS20006120B-page 10
Feedback voltage. Connect a resistor divider from output to
ground to set the output voltage.
2018 - 2022 Microchip Technology Inc.
MIC33050
4.0
FUNCTIONAL DESCRIPTION
4.1
VIN
VIN provides power to the MOSFETs for the switch
mode regulator section and to the analog supply
circuitry. Due to the high switching speeds, it is
recommended that a 2.2 µF or greater capacitor be
placed close to VIN and the power ground (PGND) pin
for bypassing.
4.2
EN
4.7
The feedback pin is provided for the adjustable output
version. An external resistor divider network is
connected from the output and is compared to the
internal 400 mV internal reference voltage within the
control loop.
The output voltage, of the circuit in Figure 4-1, may be
calculated via the equation below:
EQUATION 4-1:
The enable pin, EN, controls the on and off state of the
device. A high logic on the enable pin activates the
regulator while a low logic deactivates it. MIC33050
features built-in soft-start circuitry that reduces in-rush
current and prevents the output voltage from
overshooting at start-up. Do not leave floating.
4.3
FB
V OUT = 0.4V 1 + R1
-------
R2
SW
The pins at the switch node, SW, are connected directly
to the internal inductor. Due to the high-speed
switching on this pin, the switch node should be routed
away from sensitive nodes such as the CFF and FB
pins.
4.4
SNS
The sense pin, SNS, is needed to sense the output
voltage at the output filter capacitor. In order for the
control loop to monitor the output voltage accurately it
is good practice to sense the output voltage at the
positive side of the output filter capacitor where voltage
ripple is smallest.
4.6
R2
OUT
The OUT pin is for the output voltage following the
internal inductor of the device. Connect an output filter
capacitor equal to 2.2 µF or greater to this pin.
4.5
R1
CFF
The CFF pin is connected to the SNS pin of MIC33050
with a feed-forward capacitor of 560 pF. The CFF pin
itself is compared with the internal reference voltage
(VREF) of the device and provides the control path to
control the output. VREF is equal to 400 mV. The CFF
pin is sensitive to noise and should be place away from
the SW pin.
2018 - 2022 Microchip Technology Inc.
FIGURE 4-1:
MIC33050-AYHL
Application Schematic.
4.8
PGND
Power ground (PGND) is the ground path for high
current. The current loop for the power ground should
be as small as possible and separate from the analog
ground (AGND) loop.
4.9
AGND
Signal ground (AGND) is the ground path for the
biasing and control circuitry. The current loop for the
signal ground should be separate from the PGND loop.
DS20006120B-page 11
MIC33050
APPLICATIONS INFORMATION
5.1
Input Capacitor
A minimum of 2.2 µF ceramic capacitor should be
placed close to the VIN pin and PGND pin for
bypassing. X5R or X7R dielectrics are recommended
for the input capacitor. Y5V dielectrics, aside from
losing most of their capacitance over temperature, they
also become resistive at high frequencies. This
reduces their ability to filter out high frequency noise.
5.2
Output Capacitor
The MIC33050 was designed for use with a 2.2 µF or
greater ceramic output capacitor. A low equivalent
series resistance (ESR) ceramic output capacitor either
X7R or X5R is recommended. Y5V and Z5U dielectric
capacitors, aside from the undesirable effect of their
wide variation in capacitance over temperature,
become resistive at high frequencies.
5.3
Compensation
The MIC33050 is designed to be stable with an internal
inductor with a minimum of 2.2 µF ceramic (X5R)
output capacitor.
5.4
Efficiency Considerations
Efficiency is defined as the amount of useful output
power, divided by the amount of power supplied.
EQUATION 5-1:
V OUT I OUT
= -------------------------------- 100
V IN I IN
Maintaining high efficiency serves two purposes. It
reduces power dissipation in the power supply,
reducing the need for heat sinks and thermal design
considerations and it reduces consumption of current
for battery powered applications. Reduced current
draw from a battery increases the devices operating
time which is critical in hand held devices.
There are two types of losses in switching converters;
DC losses and switching losses. DC losses are simply
the power dissipation of I2R. Power is dissipated in the
high-side switch during the on cycle. Power loss is
equal to the high-side MOSFET RDS(ON) multiplied by
the switch current squared. During the off cycle, the
low-side N-channel MOSFET conducts, also
dissipating power. Device operating current also
reduces efficiency. The product of the quiescent
(operating) current and the supply voltage represents
another DC loss. The current required driving the gates
on and off at a constant 4 MHz frequency and the
switching transitions make up the switching losses.
100
EFFICIENCY (%)
5.0
V
90
IN
= 3.0V
80
70 V = 3.6V
IN
VIN = 4.2V
60
50
1
10
100
1000
OUTPUT CURRENT (mA)
FIGURE 5-1:
Efficiency under Load.
Figure 5-1 shows an efficiency curve. From 1 µA to
100 mA, efficiency losses are dominated by quiescent
current losses, gate drive and transition losses. By
using the HyperLight Load® mode, the MIC33050 is
able to maintain high efficiency at low output currents.
Over 100 mA, efficiency loss is dominated by MOSFET
RDS(ON) and inductor losses. Higher input supply
voltages will increase the gate to source threshold on
the internal MOSFETs, thereby reducing the internal
RDS(ON). This improves efficiency by reducing DC
losses in the device. All but the inductor losses are
inherent to the device. In which case, inductor selection
becomes increasingly critical in efficiency calculations.
As the inductors are reduced in size, the DC resistance
(DCR) can become quite significant.
The DCR losses can be calculated by using
Equation 5-2:
EQUATION 5-2:
2
P D L I OUT DCR
From that, the loss in efficiency due to inductor
resistance can be calculated by using Equation 5-3:
DS20006120B-page 12
2018 - 2022 Microchip Technology Inc.
MIC33050
EQUATION 5-3:
V OUT I OUT
EfficiencyLoss = 1 – ---------------------------------------------------- 100
V OUT I OUT + P D L
Efficiency loss due to DCR is minimal at light loads and
gains significance as the load is increased. Inductor
selection becomes a trade-off between efficiency and
size in this case.
5.5
HyperLight Load® Mode
The MIC33050 uses a minimum on and off time
proprietary control loop. When the output voltage falls
below the regulation threshold, the error comparator
begins a switching cycle that turns the PMOS on and
keeps it on for the duration of the minimum on-time.
When the output voltage is over the regulation
threshold, the error comparator turns the PMOS off for
a minimum off-time. The NMOS acts as an ideal
rectifier that conducts when the PMOS is off. Using a
NMOS switch instead of a diode allows for lower
voltage drop across the switching device when it is on.
The asynchronous switching combination between the
PMOS and the NMOS allows the control loop to work
in discontinuous mode for light load operations. In
discontinuous mode, MIC33050 works in pulse
frequency modulation (PFM) to regulate the output. As
the output current increases, the switching frequency
increases. This improves the efficiency of the
MIC33050 during light load currents. As the load
current increases, the MIC33050 goes into continuous
conduction mode (CCM) at a constant frequency of
4 MHz. The equation to calculate the load when the
MIC33050 goes into continuous conduction mode may
be approximated by the following Equation 5-4:
EQUATION 5-4:
V IN – V OUT D
I LOAD = --------------------------------------------
2L f
2018 - 2022 Microchip Technology Inc.
DS20006120B-page 13
MIC33050
6.0
PACKAGING INFORMATION
6.1
Package Marking Information
12-Lead HDFN*
Example
X
XXXXX
NNNY
A
33050
139Y
Legend: XX...X
Y
YY
WW
NNN
e3
*
Product code or customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle
mark).
Note:
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information. Package may or may not include
the corporate logo.
Underbar (_) and/or Overbar (‾) symbol may not be to scale.
Note:
If the full seven-character YYWWNNN code cannot fit on the package, the following truncated codes
are used based on the available marking space:
6 Characters = YWWNNN; 5 Characters = WWNNN; 4 Characters = WNNN; 3 Characters = NNN;
2 Characters = NN; 1 Character = N
DS20006120B-page 14
2018 - 2022 Microchip Technology Inc.
MIC33050
12-Lead HDFN 3 mm x 3 mm Package Outline and Recommended Land Pattern
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
2018 - 2022 Microchip Technology Inc.
DS20006120B-page 15
MIC33050
NOTES:
DS20006120B-page 16
2018 - 2022 Microchip Technology Inc.
MIC33050
APPENDIX A:
REVISION HISTORY
Revision A (November 2018)
• Converted Micrel document MIC33050 to Microchip data sheet DS20006120B.
• Minor text changes throughout.
• Deleted bullet: Up to 8 MHz PWM Operation in
Continuous Mode from the Features, Updated
Applications, removed the word patent-pending
from General Description, Revised Figure 2-6 and
Figure 2-8.
Revision B (March 2022)
• Corrected package marking drawings and added
note below legend in Section 6.1, Package Marking Information.
• Minor formatting corrections throughout.
2018 - 2022 Microchip Technology Inc.
DS20006120B-page 17
MIC33050
NOTES:
DS20006120B-page 18
2018 - 2022 Microchip Technology Inc.
MIC33050
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
PART NO.
Device
-X
X
Output
Junction
Voltage Temperature
Range
XX
–XX
Package
Option
Media Type
Device:
MIC33050: 4 MHz Internal Inductor PWM Buck Power
Module with HyperLight Load
Output Voltage:
C = 1.0V
4 = 1.2V
G = 1.8V
S = 3.3V
A = Adjustable
Junction
Y
Temperature Range:
=
–40°C to +125°C (Pb-Free, RoHS Compliant)
Package:
HL
=
12-Lead 3 mm x 3 mm x 0.9 mm HDFN
Media Type:
T5
TR
= 500/Reel
= 5000/Reel
Note: Other output voltage options are available. Contact Factory for
details.
Examples:
a) MIC33050-4YHL-TR:
4 MHz Internal Inductor PWM Buck
Power Module with HyperLight
Load®, 1.2V Fixed Output Voltage,
–40°C to +125°C Junction
Temperature Range, Pb-Free,
RoHS Compliant, 12-Lead HDFN
Package, 5000/Reel
b) MIC33050-GYHL-TR:
4 MHz Internal Inductor PWM Buck
Power Module with HyperLight
Load®, 1.8V Fixed Output Voltage,
–40°C to +125°C Junction
Temperature Range, Pb-Free,
RoHS Compliant, 12-Lead HDFN
Package, 5000/Reel
c) MIC33050-SYHL-TR:
4 MHz Internal Inductor PWM Buck
Power Module with HyperLight
Load®, 3.3V Fixed Output Voltage,
–40°C to +125°C Junction
Temperature Range, Pb-Free,
RoHS Compliant, 12-Lead HDFN
Package, 5000/Reel
d) MIC33030-AYHL-T5:
4 MHz Internal Inductor PWM Buck
Power Module with HyperLight
Load®, Adjustable Output Voltage,
–40°C to +125°C Junction
Temperature Range, Pb-Free,
RoHS Compliant, 12-Lead HDFN
Package, 500/Reel
e) MIC33030-AYHL-TR:
4 MHz Internal Inductor PWM Buck
Power Module with HyperLight
Load®, Adjustable Output Voltage,
–40°C to +125°C Junction
Temperature Range, Pb-Free,
RoHS Compliant, 12-Lead HDFN
Package, 5000/Reel
Note 1:
2018 - 2022 Microchip Technology Inc.
Tape and Reel identifier only appears in the
catalog part number description. This identifier is
used for ordering purposes and is not printed on
the device package. Check with your Microchip
Sales Office for package availability with the
Tape and Reel option.
DS20006120B-page 19
MIC33050
NOTES:
DS20006120B-page 20
2018 - 2022 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip products:
•
Microchip products meet the specifications contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is secure when used in the intended manner, within operating specifications, and
under normal conditions.
•
Microchip values and aggressively protects its intellectual property rights. Attempts to breach the code protection features of
Microchip product is strictly prohibited and may violate the Digital Millennium Copyright Act.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code. Code protection does not
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ISBN: 978-1-6683-0158-6
DS20006120B-page 21
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