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MIC37101-2.1YM

MIC37101-2.1YM

  • 厂商:

    ACTEL(微芯科技)

  • 封装:

    SOIC8_150MIL

  • 描述:

    IC REG LDO 2.1V 1A 8SOIC

  • 详情介绍
  • 数据手册
  • 价格&库存
MIC37101-2.1YM 数据手册
MIC37100/01/02 1A Low-Voltage µCap LDO Regulator Features General Description • Fixed and Adjustable Output Voltages to 1.24V • µCap Regulator, 10 µF Ceramic Output Capacitor Stable • 280 mV Typical Dropout at 1A - Ideal for 3.0V to 2.5V Conversion - Ideal for 2.5V to 1.8V, 1.65V or 1.5V Conversion • 1A Minimum Guaranteed Output Current • 1% Initial Accuracy • Low Ground Current • Current Limiting and Thermal Shutdown • Reversed Leakage Protection • Fast Transient Response • Low Profile SOT-223 Package • Power SO-8 Package • S-PAK Package (MIC37102 Only) The MIC37100, MIC37101, and MIC37102 are 1A low dropout, linear voltage regulators that provide low voltage, high current output from an extremely small package. Utilizing Microchip’s proprietary Super βeta PNP pass element, the MIC37100/01/02 offers extremely low dropout (typically 280 mV at 1A) and low ground current (typically 11 mA at 1A). Applications • • • • • • • LDO Linear Regulator for PC Add In Cards PowerPC Power Supplies High Efficiency Linear Power Supplies SMPS Post Regulator Multimedia and PC Processor Supplies Battery Chargers Low Voltage Microcontrollers and Digital Logic The MIC37100 is a fixed output regulator offered in the SOT-223 package. The MIC37101 and MIC37102 are fixed and adjustable regulators, respectively, in a thermally enhanced power 8-pin SOIC (small outline package). The MIC37102 is also available in the S-PAK power package, for applications that require higher power dissipation or higher operating ambient temperatures. The MIC37100/01/02 is ideal for PC add in cards that need to convert from standard 5V to 3.3V, 3.3V to 2.5V or 2.5V to 1.8V or lower. A guaranteed maximum dropout voltage of 500 mV over all operating conditions allows the MIC37100/01/02 to provide 2.5V from a supply as low as 3V and 1.8V from a supply as low as 2.3V. The MIC37100/01/02 is fully protected with overcurrent limiting and thermal shutdown. Fixed output voltages of 1.5V, 1.65V, 1.8V, 2.5V and 3.3V are available on MIC37100/01 with adjustable output voltages to 1.24V on MIC37102. Typical Application Dropout vs. Output Current 2.5V/1A Regulator GND 350 10µF ceramic 2.5VOUT 300 2.5V DROPOUT (mV) VIN 3.3V MIC37100 OUT IN 250 200 3.3VOUT 150 100 50 0  2018 Microchip Technology Inc. 0 0.25 0.5 0.75 OUTPUT CURRENT (A) 1 DS20006104A-page 1 MIC37100/01/02 Package Types MIC37100-X.X (FIXED) 3-Pin SOT223 (S) (Top View) MIC37102 (ADJUSTABLE) 5-Pin S-PAK (R) (Top View) GND TAB TAB 5 4 3 2 1 1 2 3 ADJ OUT GND IN EN IN GND OUT MIC37101-X.X (FIXED) 8-Pin SOIC (M) (Top View) MIC37102 (ADJUSTABLE) 8-Pin SOIC (M) (Top View) EN 1 8 GND EN 1 8 GND IN 2 7 GND IN 2 7 GND OUT 3 6 GND OUT 3 6 GND FLG 4 5 GND ADJ 4 5 GND DS20006104A-page 2  2018 Microchip Technology Inc. MIC37100/01/02 Functional Diagrams Fixed Output Voltage OUT IN Ref. 1.240V Thermal Shutdown MIC37100 MIC37101 Fixed Regulator with Flag and Enable Block Diagram OUT IN 1.180V FLAG Ref. 1.240V EN Thermal Shutdown GND MIC37101 MIC37102 Adjustable Regulator Block Diagram OUT IN Ref. 1.240V ADJ EN Thermal Shutdown GND MIC37102  2018 Microchip Technology Inc. DS20006104A-page 3 MIC37100/01/02 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings † Supply Voltage (VIN)....................................................................................................................................... 0V to +6.5V Enable Voltage (VEN) ...............................................................................................................................................+6.5V Power Dissipation (PDIS) ........................................................................................................................Internally Limited ESD Rating (Note 1)................................................................................................................................... ESD Sensitive Operating Ratings ‡ Supply Voltage (VIN)................................................................................................................................... +2.25V to +6V Enable Voltage (VEN) ........................................................................................................................................ 0V to +6V Maximum Power Dissipation (PD(max))................................................................................................................. (Note 2) † Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended periods may affect device reliability. Specifications are for packaged product only. ‡ Notice: The device is not guaranteed to function outside its operating ratings. Note 1: Devices are ESD sensitive. Handling precautions are recommended. Human body model, 1.5 kΩ in series with 100 pF. 2: PD(max) = (TJ(max) – TA) ÷ θJA, where θJA depends upon the printed circuit layout. See “Section 4.0 “Application Information” section. ELECTRICAL CHARACTERISTICS Electrical Characteristics: VIN = VOUT + 1V; VEN = 2.25V; TJ = 25°C, Bold values indicate –40°C ≤ TJ ≤ +125°C; unless otherwise specified. Parameter Symbol Min. Typ. –1 Output Voltage Line Regulation –2 VOUT Load Regulation Output Voltage Temperature Coefficient (Note 1) Dropout Voltage (Note 2) Ground Current (Note 3) Current Limit DS20006104A-page 4 ΔVOUT/ΔT VDO IGND IOUT(lim) — Max. Units Conditions 1 % 10 mA 2 % 10 mA ≤ IOUT ≤ 1A, VOUT + 1V ≤ VIN ≤ 6V — 0.06 0.5 % IOUT = 10 mA, VOUT + 1V ≤ VIN ≤ 6V — 0.2 1 % VIN = VOUT + 1V, 10 mA ≤ IOUT ≤ 1A — 40 — pm/°C — 125 200 mV IOUT = 100 mA, ΔVOUT = –2% — 210 350 mV IOUT = 500 mA, ΔVOUT = –2% — 250 400 mV IOUT = 750 mA, ΔVOUT = –2% — 280 500 mV IOUT = 1A, ΔVOUT = –1% — 650 — µA IOUT = 100 mA, VIN = VOUT + 1V — 3.5 — mA IOUT = 500 mA, VIN = VOUT + 1V — 6.7 — mA IOUT = 750 mA, VIN = VOUT + 1V — 11 25 mA IOUT = 1A, VIN = VOUT + 1V — 1.6 2.5 A VOUT = 0V, VIN = VOUT + 1V  2018 Microchip Technology Inc. MIC37100/01/02 ELECTRICAL CHARACTERISTICS (CONTINUED) Electrical Characteristics: VIN = VOUT + 1V; VEN = 2.25V; TJ = 25°C, Bold values indicate –40°C ≤ TJ ≤ +125°C; unless otherwise specified. Parameter Symbol Min. Typ. Max. Units — — 0.8 V Conditions Enable Input Enable Input Voltage Enable Input Current VEN IEN Logic low (OFF) 2.25 — — V Logic high (ON) 1 10 30 µA VEN = 2.25V — — 2 µA — — 4 µA — 0.01 1 — — 2 — 210 VEN = 0.8V Flag Output Output Leakage Current IFLG(leak) Output Low Voltage VFLG(do) Low Threshold High Threshold µA VOH = 6V 500 mV VIN = 2.25V, IOL, = 250 µA 93 — — % % of VOUT — — 99.2 % % of VOUT — 1 — % — — 1.228 1.240 1.252 V — 1.215 — 1.265 V — — 40 80 nA — — — 120 nA VFLG Hysteresis MIC37102 Only Reference Voltage Adjust Pin Bias Current 1: 2: 3: — — Output voltage temperature coefficient is ΔVOUT(worst case) ÷ (TJ(max) – TJ(min)) where TJ(max) is +125°C and TJ(min) is –40°C. VDO = VIN – VOUT when VOUT decreases to 98% of its nominal output voltage with VIN = VOUT + 1V. For output voltages below 2.25V, dropout voltage is the input-to-output voltage differential with the minimum input voltage being 2.25V. Minimum input operating voltage is 2.25V. IGND is the quiescent current. IIN = IGND + IOUT.  2018 Microchip Technology Inc. DS20006104A-page 5 MIC37100/01/02 TEMPERATURE SPECIFICATIONS (Note 1) Parameters Sym. Min. Typ. Max. Units Conditions Lead Temperature (soldering, 5 sec.) — — — 260 °C — Junction Operating Temperature Range TJ –40 — +125 °C — Storage Temperature Range TS –65 — +150 °C — Thermal Resistance SOT-223 JC — 15 — °C/W — Thermal Resistance SOIC-8 JC — 20 — °C/W — Thermal Resistance SPAK-5 JC — 2 — °C/W — Temperature Ranges Package Thermal Resistances Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability. DS20006104A-page 6  2018 Microchip Technology Inc. MIC37100/01/02 2.0 Note: TYPICAL PERFORMANCE CURVES The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. 80 VIN = 5V VOUT = 3.3V 70 60 PSRR (dB) PSRR (dB) 60 50 40 30 IOUT = 1000mA COUT = 10μF 10 C = 0 IN FIGURE 2-1: Ratio. 80 70 0.1 11 0 100 FREQUENCY (KHz) 1000 Power Supply Rejection DROPOUT (mV) PSRR (dB) 30 20 IOUT = 1000mA COUT = 47μF 10 CIN = 0 0 0.01 0.1 11 0 100 FREQUENCY (KHz) 250 200 3.3VOUT 150 100 0 1000 Power Supply Rejection FIGURE 2-5: 0 0.25 0.5 0.75 OUTPUT CURRENT (A) 1 Dropout vs. Output Current. 450 VIN = 3.3V VOUT = 2.5V 400 DROPOUT (mV) PSRR (dB) 2.5VOUT 50 60 50 40 30 20 IOUT = 1000mA COUT = 10μF 10 CIN = 0 0 0.01 0.1 11 0 100 FREQUENCY (KHz) FIGURE 2-3: Ratio. 1000 Power Supply Rejection 300 40 70 30 350 50 80 40 FIGURE 2-4: Ratio. VIN = 5V VOUT = 3.3V 60 FIGURE 2-2: Ratio. 50 20 IOUT = 1000mA COUT = 47μF 10 CIN = 0 0 0.01 0.1 11 0 100 FREQUENCY (KHz) 20 0 0.01 VIN = 3.3V VOUT = 2.5V 70 300 250 2.5VOUT 200 150 100 50 1000 Power Supply Rejection  2018 Microchip Technology Inc. 350 0 -40 -20 0 20 40 60 80 100 120 TEMPERATURE (°C) FIGURE 2-6: Dropout vs. Temperature. DS20006104A-page 7 MIC37100/01/02 3.5 10mA Load 1.4 OUTPUT VOLTAGE (V) OUTPUT VOLTAGE (V) 1.6 1.2 1 0.8 1000mA Load 0.6 0.4 0.2 0 1.5 1.7 1.9 2.1 2.3 INPUT VOLTAGE (V) FIGURE 2-7: (1.5V). GROUND CURRENT (mA) OUTPUT VOLTAGE (V) 2.0 1.5 1000mA Load 1.0 0.5 2 2.5 3 3.5 INPUT VOLTAGE (V) 4 Dropout Characteristics 12 10mA Load 1.8 1.6 1.4 1.2 1.0 1000mA Load 0.8 0.6 0.4 0.2 0.0 1.5 1.7 1.9 2.1 2.3 2.5 INPUT VOLTAGE (V) FIGURE 2-8: (1.8V). 10 8 6 4 1.5V OUT 3.3VOUT 2 0 2.7 0 0.25 0.5 0.75 1 OUTPUT CURRENT (A) Dropout Characteristics FIGURE 2-11: Current. 3.0 Ground Current vs. Output 0.8 GROUND CURRENT (mA) OUTPUT VOLTAGE (V) 2.5 FIGURE 2-10: (3.3V). 2.0 2.5 10mA Load 0 1.5 2.5 Dropout Characteristics 3.0 10mA Load 2.0 1.5 1000mA Load 1.0 0.5 0 1.5 FIGURE 2-9: (2.5V). DS20006104A-page 8 2 2.5 3 INPUT VOLTAGE (V) 3.5 Dropout Characteristics 0.7 0.6 100mA 0.5 0.4 0.3 0.2 10mA 0.1 0 0 FIGURE 2-12: Voltage (1.5V). 1 2 3 4 5 INPUT VOLTAGE (V) 6 Ground Current vs. Supply  2018 Microchip Technology Inc. MIC37100/01/02 1.4 GROUND CURRENT (mA) GROUND CURRENT (mA) 18 16 14 12 1000mA 10 8 6 4 750mA 1.2 1 0.6 0.4 0.2 1 2 3 4 5 INPUT VOLTAGE (V) FIGURE 2-13: Voltage (1.5V). 0 0 6 Ground Current vs. Supply GROUND CURRENT (mA) 0.6 100mA 0.5 0.4 0.3 0.2 10mA 0.1 0 1 FIGURE 2-14: Voltage (1.8V). 2 3 4 5 INPUT VOLTAGE (V) Ground Current vs. Supply Ground Current vs. Supply 20 15 1000mA 10 5 750mA 0 1 2 3 4 5 INPUT VOLTAGE (V) FIGURE 2-17: Voltage (2.5V). 6 Ground Current vs. Supply GROUND CURRENT (mA) 1.4 20 15 1000mA 10 5 750mA FIGURE 2-15: Voltage (1.8V). 6 25 0 6 25 0 0 2 3 4 5 INPUT VOLTAGE (V) 30 0.7 0 1 FIGURE 2-16: Voltage (2.5V). 0.8 GROUND CURRENT (mA) 10mA 2 0 0 GROUND CURRENT (mA) 100mA 0.8 1 2 3 4 5 INPUT VOLTAGE (V) 6 Ground Current vs. Supply  2018 Microchip Technology Inc. 1.2 1 100mA 0.8 0.6 0.4 0.2 0 0 FIGURE 2-18: Voltage (3.3V). 10mA 1 2 3 4 5 INPUT VOLTAGE (V) 6 Ground Current vs. Supply DS20006104A-page 9 MIC37100/01/02 16 GROUND CURRENT (mA) GROUND CURRENT (mA) 30 25 20 15 750mA 10 5 0 0 500mA 1 2 3 4 5 INPUT VOLTAGE (V) FIGURE 2-19: Voltage (3.3V). 14 12 10 8 4 2 IOUT=1000mA 0 -40 -20 0 20 40 60 80 100 120 TEMPERATURE (°C) 6 Ground Current vs. Supply FIGURE 2-22: Temperature. GROUND CURRENT (mA) 2.5VOUT 0.2 0.15 0.1 0.05 OUTPUT VOLTAGE (V) 0.3 2.55 2.5 2.5VOUT 2.45 IOUT=10mA 0 -40 -20 0 20 40 60 80 100 120 TEMPERATURE (°C) FIGURE 2-20: Temperature. 5 4.5 4 3.5 3 2.5 2 1.5 1 0.5 Ground Current vs. 2.5VOUT IOUT=500mA 0 -40 -20 0 20 40 60 80 100 120 TEMPERATURE (°C) FIGURE 2-21: Temperature. DS20006104A-page 10 Ground Current vs. 2.6 Ground Current vs. 2.4 -40 -20 0 20 40 60 80 100 120 TEMPERATURE (°C) FIGURE 2-23: Temperature. SHORT CIRCUIT CURRENT (A) GROUND CURRENT (mA) 0.4 0.35 0.25 2.5VOUT 6 Output Voltage vs. 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 2.25 FIGURE 2-24: Supply Voltage. 3 3.75 4.5 5.25 SUPPLY VOLTAGE (V) 6 Short Circuit Current vs.  2018 Microchip Technology Inc. 6 1.8 1.6 1.4 2.5V IN 1.2 1.0 0.8 0.6 0.4 =5V IN 4 3 2 Flag Low (FAULT) 1 0 0.0 -40 -20 0 20 40 60 80 100 120 TEMPERATURE (°C) Short Circuit Current vs. 0.01 FIGURE 2-28: 3.3VIN 0.6 5VIN 2.5VIN 0.4 0.2 Flag Voltage vs. Flag 100 1000 10000 Error Flag Pull-Up Resistor. 300 250 200 8 7 6 5 4 2.5VEN 3 2 1 FIGURE 2-29: Temperature. OUTPUT VOLTAGE (200mV/div) 350 Enable Current vs. VIN = 3.3V VOUT = 2.5V COUT = 10µF Ceramic 150 50 Flag Current = 250μA 0 -40 -20 0 20 40 60 80 100 120 TEMPERATURE (°C) Flag Low Voltage vs.  2018 Microchip Technology Inc. LOAD CURRENT (500mA/div) 1000mA 100 FIGURE 2-27: Temperature. 10 0 -40 -20 0 20 40 60 80 100 120 TEMPERATURE (°C) 0 0 0.5 1 1.5 2 2.5 3 3.5 4 FLAG CURRENT (mA) FIGURE 2-26: Current. 1 9 ENABLE CURRENT (μA) 0.8 0.1 RESISTANCE (kΩ) 1.0 FLAG VOLTAGE (V) V 0.2 FIGURE 2-25: Temperature. FLAG LOW VOLTAGE (mV) Flag High (OK) 5 FLAG VOLTAGE (V) SHORT CIRCUIT CURRENT (A) MIC37100/01/02 100mA TIME (400µs/div.) FIGURE 2-30: Load Transient Response. DS20006104A-page 11 OUTPUT VOLTAGE (200mV/div) MIC37100/01/02 VIN = 3.3V VOUT = 2.5V COUT = 10µF Ceramic LOAD CURRENT (500mA/div) 1000mA 10mA TIME (400µs/div.) Load Transient Response. OUTPUT VOLTAGE (50mV/div) INPUT VOLTAGE (2V/div) FIGURE 2-31: 5V 3.3V VOUT = 2.5V COUT = 10µF Ceramic Load=100mA TIME (400µs/div.) OUTPUT VOLTAGE ENABLE VOLTAGE (1V/div) (2V/div) FIGURE 2-32: Line Transient Response. VIN = 3.3V VOUT = 2.5V IOUT = 100mA COUT = 10µF Ceramic TIME (10µs/div.) FIGURE 2-33: DS20006104A-page 12 Enable Transient Response.  2018 Microchip Technology Inc. MIC37100/01/02 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE Pin Number MIC37100 SOT223-3 Pin Number MIC37101 SOIC-8 Pin Number MIC37102 SOIC-8 Pin Number MIC37102 S-PAK-5 Pin Name — 1 1 1 EN Enable (Input): CMOS compatible control input. Logic high = enable, Logic low or open = shutdown. 1 2 2 2 IN Supply (Input). 3 3 3 4 OUT Regulator output. — 4 — — FLG Flag (Output): Open collector error flag output. Active low = output under voltage. — — 4 5 ADJ Adjustment Input: Feedback input. Connect to resistive voltage divider network. 2, TAB 5-8 5-8 3, TAB GND Ground.  2018 Microchip Technology Inc. Description DS20006104A-page 13 MIC37100/01/02 4.0 APPLICATION INFORMATION The MIC37100/01/02 is a high-performance low dropout voltage regulator suitable for moderate to high current voltage regulator applications. Its 500 mV dropout voltage at full load and overtemperature makes it especially valuable in battery powered systems and as high efficiency noise filters in post regulator applications. Unlike older NPN-pass transistor designs, where the minimum dropout voltage is limited by the base-to-emitter voltage drop and collector-to-emitter saturation voltage, dropout performance of the PNP output of these devices is limited only by the low VCE saturation voltage. A trade-off for the low dropout voltage is a varying base drive requirement. Microchip’s Super βeta PNP process reduces this drive requirement to only 2% of the load current. The MIC37100/01/02 regulator is fully protected from damage due to fault conditions. Linear current limiting is provided. Output current during overload conditions is constant. Thermal shutdown disables the device when the die temperature exceeds the maximum safe operating temperature. The output structure of these regulators allows voltages in excess of the desired output voltage to be applied without reverse current flow. VIN MIC37100-x.x IN CIN FIGURE 4-1: 4.1 VOUT OUT GND COUT Capacitor Requirements. Output Capacitor The MIC37100/01/02 requires an output capacitor to maintain stability and improve transient response. As a µCap LDO, the MIC37100/01/02 can operate with ceramic output capacitors as long as the amount of capacitance is 10 µF or greater. For values of output capacitance lower than 10 µF, the recommended ESR range is 200 mΩ to 2Ω. The minimum value of output capacitance recommended for the MIC37100/01/02 is 4.7 µF. For 10 µF or greater the ESR range recommended is less than 1Ω. Ultra-low ESR ceramic capacitors are recommended for output capacitance of 10 µF or greater to help improve transient response and noise DS20006104A-page 14 reduction at high frequency. X7R/X5R dielectric-type ceramic capacitors are recommended because of their temperature performance. X7R-type capacitors change capacitance by 15% over their operating temperature range and are the most stable type of ceramic capacitors. Z5U and Y5V dielectric capacitors change value by as much as 50% and 60% respectively over their operating temperature ranges. To use a ceramic chip capacitor with Y5V dielectric, the value must be much higher than an X7R ceramic capacitor to ensure the same minimum capacitance over the equivalent operating temperature range. 4.2 Input Capacitor An input capacitor of 1 µF or greater is recommended when the device is more than 4 inches away from the bulk ac supply capacitance or when the supply is a battery. Small, surface mount, ceramic chip capacitors can be used for bypassing. Larger values will help to improve ripple rejection by bypassing the input to the regulator, further improving the integrity of the output voltage. 4.3 Error Flag The MIC37101 features an error flag (FLG), which monitors the output voltage and signals an error condition when this voltage drops 5% below its expected value. The error flag is an open-collector output that pulls low under fault conditions and may sink up to 10 mA. Low output voltage signifies a number of possible problems, including an overcurrent fault (the device is in current limit) or low input voltage. The flag output is inoperative during overtemperature conditions. A pull-up resistor from FLG to either VIN or VOUT is required for proper operation. For information regarding the minimum and maximum values of pull-up resistance, refer to FIGURE 2-28: “Error Flag Pull-Up Resistor.”in the 2.0 “Typical Performance Curves” section of the data sheet. 4.4 Enable Input The MIC37101 and MIC37102 versions feature an active-high enable input (EN) that allows on-off control of the regulator. Current drain reduces to “zero” when the device is shutdown, with only microamperes of leakage current. The EN input has TTL/CMOS compatible thresholds for simple logic interfacing. EN may be directly tied to VIN and pulled up to the maximum supply voltage. 4.5 Transient Response and 3.3V to 2.5V or 2.5V to 1.8V, 1.65V or 1.5V Conversion The MIC37100/01/02 has excellent transient response to variations in input voltage and load current. The device has been designed to respond quickly to load  2018 Microchip Technology Inc. MIC37100/01/02 current variations and input voltage variations. Large output capacitors are not required to obtain this performance. A standard 10 µF output capacitor, is all that is required. Larger values help to improve performance even further. the very high input impedance and low bias current of the sense comparator. The resistor values are calculated by: EQUATION 4-2: By virtue of its low dropout voltage, this device does not saturate into dropout as readily as similar NPN-based designs. When converting from 3.3V to 2.5V or 2.5V to 1.8V, or lower, the NPN based regulators are already operating in dropout, with typical dropout requirements of 1.2V or greater. To convert down to 2.5V or 1.8V without operating in dropout, NPN-based regulators require an input voltage of 3.7V at the very least. The MIC37100 regulator will provide excellent performance with an input as low as 3.0V or 2.5V respectively. This gives the PNP based regulators a distinct advantage over older, NPN based linear regulators. Where VOUT is the desired output voltage. Figure 4-2 shows the component definition. Applications with widely varying load currents may scale the resistors to draw the minimum load current required for proper operation. 4.6 4.8 Minimum Load Current The MIC37100/01/02 regulator is specified between finite loads. If the output current is too small, leakage currents dominate and the output voltage rises. A 10 mA minimum load current is necessary for proper regulation. 4.7 Adjustable Regulator Design VIN MIC37102 OUT R1 ENABLE SHUTDOWN EN ADJ GND FIGURE 4-2: Resistors. R2 Power SOIC-8 Thermal Characteristics One of the secrets of the MIC37101/02’s performance is its power SO-8 package featuring half the thermal resistance of a standard SO-8 package. Lower thermal resistance means more output current or higher input voltage for a given package size. Lower thermal resistance is achieved by joining the four ground leads with the die attach paddle to create a single piece electrical and thermal conductor. This concept has been used by MOSFET manufacturers for years, proving very reliable and cost effective for the user. VOUT IN V OUT R1 = R2  ------------- – 1 1.240 COUT Thermal resistance consists of two main elements, θJC (junction-to-case thermal resistance) and θCA (case-to-ambient thermal resistance). See Figure 4-3. θJC is the resistance from the die to the leads of the package. θCA is the resistance from the leads to the ambient air and it includes θCS (case-to-sink thermal resistance) and θSA (sink-to-ambient thermal resistance). Adjustable Regulator with EQUATION 4-1: SOP-8 R1 V OUT = 1.240V  1 + -------  R2 qJA qJC qCA ground plane heat sink area AM BIE NT The MIC37102 allows programming the output voltage anywhere between 1.24V and the 6V maximum operating rating of the family. Two resistors are used. Resistors can be quite large, up to 1 MΩ, because of  2018 Microchip Technology Inc. printed circuit board FIGURE 4-3: Thermal Resistance. DS20006104A-page 15 MIC37100/01/02 Using the power SOIC-8 reduces the θJC dramatically and allows the user to reduce θCA. The total thermal resistance, θJA (junction-to-ambient thermal resistance) is the limiting factor in calculating the maximum power dissipation capability of the device. Typically, the power SOIC-8 has a θJC of 20°C/W, this is significantly lower than the standard SOIC-8 which is typically 75°C/W. θCA is reduced because pins 5 through 8 can now be soldered directly to a ground plane which significantly reduces the case-to-sink thermal resistance and sink to ambient thermal resistance. Low dropout linear regulators from Microchip are rated to a maximum junction temperature of 125°C. It is important not to exceed this maximum junction temperature during operation of the device. To prevent this maximum junction temperature from being exceeded, the appropriate ground plane heat sink must be used. For example, the maximum ambient temperature is 50°C, the ΔT is determined as follows: EQUATION 4-4: T = 125C – 50C T = 75C Using Figure 4-4, the minimum amount of required copper can be determined based on the required power dissipation. Power dissipation in a linear regulator is calculated as follows: EQUATION 4-5: ∆TJA = 100°C 700 40°C 50°C 55°C 65°C 75°C 85°C COPPER AREA (mm2) P D =  V IN – V OUT I OUT + V IN  I GND 600 If we use a 2.5V output device and a 3.3V input at an output current of 1A, then our power dissipation is as follows: 500 400 300 EQUATION 4-6: 200 100 0 0 P D =  3.3V – 2.5V   1A + 3.3V  11 mA 0.25 0.50 0.75 1.00 1.25 1.50 POWER DISSIPATION (W) P D = 800mV + 36mV FIGURE 4-4: Copper Area vs. Power SO-8 Power Dissipation. Figure 4-4 shows copper area versus power dissipation with each trace corresponding to a different temperature rise above ambient. From these curves, the minimum area of copper necessary for the part to operate safely can be determined. The maximum allowable temperature rise must be calculated to determine operation along which curve. EQUATION 4-3: T = T J  max  – T A  max  Where: TJ(max) = 125°C TA(max) = maximum ambient operating temperature DS20006104A-page 16 P D = 836mW From Figure 4-4, the minimum amount of copper required to operate this application at a ΔT of 75°C is 160 mm2. 4.9 Quick Method Determine the power dissipation requirements for the design along with the maximum ambient temperature at which the device will be operated. Refer to Figure 4-5, which shows safe operating curves for three different ambient temperatures: 25°C, 50°C and 85°C. From these curves, the minimum amount of copper can be determined by knowing the maximum power dissipation required. If the maximum ambient temperature is 50°C and the power dissipation is as above, 836 mW, the curve in Figure 4-5 shows that the required area of copper is 160 mm2. The θJA of this package is ideally 63°C/W, but it will vary depending upon the availability of copper ground plane to which it is attached.  2018 Microchip Technology Inc. MIC37100/01/02 COPPER AREA (mm2) 900 800 T = 125°C J 700 TA = 85°C 50°C 25°C 600 500 400 300 200 100 0 0 0.25 0.50 0.75 1.00 1.25 1.50 POWER DISSIPATION (W) FIGURE 4-5: Copper Area vs. Power-SOIC Power Dissipation.  2018 Microchip Technology Inc. DS20006104A-page 17 MIC37100/01/02 5.0 PACKAGING INFORMATION 5.1 Package Marking Information 8-Pin SOIC* XXXXX -X.XXX WNNN 3-Pin SOT223* XXXXX X.XWNNNP 5-Pin S-PAK* XXXXX XX WNNNP XXX Legend: XX...X Y YY WW NNN e3 * Example 37101 -3.3YM 1986 Example 37100 1.52196P Example 37101 WR 1930P USA Product code or customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC® designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. ●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle mark). Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. Package may or may not include the corporate logo. Underbar (_) and/or Overbar (‾) symbol may not be to scale. DS20006104A-page 18  2018 Microchip Technology Inc. MIC37100/01/02 8-Lead SOIC-8 Package Outline and Recommended Land Pattern Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging.  2018 Microchip Technology Inc. DS20006104A-page 19 MIC37100/01/02 3-Lead SOT223 Package Outline and Recommended Land Pattern Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging. DS20006104A-page 20  2018 Microchip Technology Inc. MIC37100/01/02 5-Lead S-PAK Package Outline and Recommended Land Pattern Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging.  2018 Microchip Technology Inc. DS20006104A-page 21 MIC37100/01/02 NOTES: DS20006104A-page 22  2018 Microchip Technology Inc. MIC37100/01/02 APPENDIX A: REVISION HISTORY Revision A (November 2018) • Converted Micrel document MIC37100/01/02 to Microchip data sheet DS20006104A. • Minor text changes throughout.  2018 Microchip Technology Inc. DS20006104A-page 23 MIC37100/01/02 NOTES: DS20006104A-page 24  2018 Microchip Technology Inc. MIC37100/01/02 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office. PART NO. Device –X.X X XX –XX Output Package Media Type Junction Voltage Temperature Range MIC371xx: MIC37100: Device: 1A Low-Voltage µCap LDO Regulator Fixed VOUT to 1.24V in SOT-223 Package MIC37101: Fixed VOUT to 1.24V in Power SOIC Package MIC37102: Adjustable VOUT to 1.24V in Power SOIC and S-PAK Packages Output Voltage: Fixed Output Voltage Option (MIC37100/37101) 1.5 = 1.5V 1.65 = 1.65V 1.8 = 1.8V 2.5 = 2.5V 3.3 = 3.3V Adjustable = Adjustable (MIC37102) Junction Temperature Range: W Y = = –40°C to +125°C, RoHs Compliant* –40°C to +125°C, RoHs Compliant Package: M R S = = = 8-Lead SOIC(MIC37101/37102) 5-Lead SPAK (MIC37102) 3-Lead SOT-223 (MIC37100) Media Type: = 78/Tube (S, SOT-223) = 48/Tube (R, SPAK) = 95/Tube (M, SOIC) TR = 2,500/Reel Examples: a) MIC37100-1.8WS: 1A Low-Voltage µCap LDO Regulator, 1.8V Fixed Output Voltage option, –40°C to +125°C Junction Temperature Range, RoHS Compliant*, 3-Lead SOT223 Package, 78/Tube b) MIC37100-1.8WS-TR: 1A Low-Voltage µCap LDO Regulator, 1.8V Fixed Output Voltage option, –40°C to +125°C Junction Temperature Range, RoHS Compliant*, 3-Lead SOT223 Package, 2500/Reel c) MIC37101-1.5YM: 1A Low-Voltage µCap LDO Regulator, 1.5V Fixed Output Voltage option, –40°C to +125°C Junction Temperature Range, RoHS Compliant, 8-Lead SOIC Package, 95/Tube d) MIC37101-1.5YM-TR: 1A Low-Voltage µCap LDO Regulator, 1.5V Fixed Output Voltage option, –40°C to +125°C Junction Temperature Range, RoHS Compliant, 8-Lead SOIC Package, 2500/Reel e) MIC37102YM: 1A Low-Voltage µCap LDO Regulator, Adjustable Output Voltage, –40°C to +125°C Junction Temperature Range, RoHS Compliant, 8-Lead SOIC Package, 95/Tube f) MIC371012YM-TR: 1A Low-Voltage µCap LDO Regulator, Adjustable Output Voltage, –40°C to +125°C Junction Temperature Range, RoHS Compliant, 8-Lead SOIC Package, 2500/Reel g) MIC37102WR: 1A Low-Voltage µCap LDO Regulator, Adjustable Output Voltage, –40°C to +125°C Junction Temperature Range, RoHS Compliant*, 5-Lead SPAK Package, 48/Tube h) MIC371012WR-TR: 1A Low-Voltage µCap LDO Regulator, Adjustable Output Voltage, –40° to +125°C Junction Temperature Range, RoHS Compliant*, 8-Lead SPAK Package, 2500/Reel Note 1:  2018 Microchip Technology Inc. Tape and Reel identifier only appears in the catalog part number description. This identifier is used for ordering purposes and is not printed on the device package. Check with your Microchip Sales Office for package availability with the Tape and Reel option. DS20006104A-page 25 MIC37100/01/02 NOTES: DS20006104A-page 26  2018 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Trademarks Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV The Microchip name and logo, the Microchip logo, AnyRate, AVR, AVR logo, AVR Freaks, BitCloud, chipKIT, chipKIT logo, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq, Kleer, LANCheck, LINK MD, maXStylus, maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip Designer, QTouch, SAM-BA, SpyNIC, SST, SST Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. ClockWorks, The Embedded Control Solutions Company, EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS, mTouch, Precision Edge, and Quiet-Wire are registered trademarks of Microchip Technology Incorporated in the U.S.A. Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom, CodeGuard, CryptoAuthentication, CryptoAutomotive, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, INICnet, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, memBrain, Mindi, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2018, Microchip Technology Incorporated, All Rights Reserved. ISBN: 978-1-5224-3841-0 == ISO/TS 16949 ==  2018 Microchip Technology Inc. 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MIC37101-2.1YM
物料型号: - MIC37100/01/02

器件简介: - 这些是1A低电压微电容(µCap)线性低压差(LDO)调节器,提供高达1A的最小保证输出电流,具有极低的压降(典型值280mV@1A)和低地电流(典型值11mA@1A)。

引脚分配: - MIC37100 (SOT-223封装): 1-EN, 2-IN, 3-OUT - MIC37101 (SOIC-8封装): 1-EN, 2-IN, 3-OUT, 4-ADJ, 5-GND, 6-GND, 7-GND, 8-GND - MIC37102 (SOIC-8和S-PAK封装): 与MIC37101相同,但S-PAK封装有不同布局。

参数特性: - 固定和可调输出电压高达1.24V。 - 典型压降在1A时为280mV。 - 初始精度为1%。 - 具有过流保护和热关断功能。 - 快速瞬态响应。 - 提供SOT-223、SO-8和S-PAK封装。

功能详解: - MIC37100提供固定输出电压,MIC37101和MIC37102提供固定和可调输出电压。 - 设计用于从标准5V转换到3.3V,或从3.3V转换到2.5V,甚至更低至1.8V或1.65V。 - 具有过流限制和热关断的全面保护。

应用信息: - 适用于PC附加卡、PowerPC电源、高效率线性电源、SMPS后级调节、多媒体和PC处理器电源、电池充电器、低电压微控制器和数字逻辑。

封装信息: - MIC37100提供SOT-223封装。 - MIC37101提供SOIC-8封装。 - MIC37102提供SOIC-8和S-PAK封装。
MIC37101-2.1YM 价格&库存

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MIC37101-2.1YM
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    • 1000+10.45000

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