MIC3775
750 mA µCap Low Voltage, Low Dropout Regulator
Features
General Description
• Fixed and Adjustable Output Voltages to 1.24V
• 280 mV Typical Dropout at 750 mA
- Ideal for 3.0V to 2.5V Conversion
- Ideal for 2.5V to 1.8V or 1.65V Conversion
• Stable with Ceramic Capacitor
• 750 mA Minimum Guaranteed Output Current
• 1% Initial Accuracy
• Low Ground Current
• Current Limiting and Thermal Shutdown
• Reversed-Leakage Protection
• Fast Transient Response
• Low Profile Power MSOP-8 Package
The MIC3775 is a 750 mA low dropout linear voltage
regulators that provides low voltage, high current
output from an extremely small package. Utilizing
Microchip’s proprietary Superβeta PNP pass element,
the MIC3775 offers extremely low dropout (typically
280 mV at 750 mA) and low ground current (typically
7.5 mA at 750 mA).
Applications
•
•
•
•
•
•
•
•
Fiber Optic Modules
LDO Linear Regulator for PC Add-In Cards
PowerPC Power Supplies
High-Efficiency Linear Power Supplies
SMPS Post Regulator
Multimedia and PC Processor Supplies
Battery Chargers
Low-Voltage Microcontrollers and Digital Logic
The MIC3775 is ideal for PC add-in cards that need to
convert from standard 5V to 3.3V or 3.0V, 3.3V to 2.5V,
or 2.5V to 1.8V or 1.65V. A guaranteed maximum
dropout voltage of 500 mV over all operating conditions
allows the MIC3775 to provide 2.5V from a supply as
low as 3.0V and 1.8V or 1.5V from a supply as low as
2.25V.
The MIC3775 is fully protected with overcurrent
limiting, thermal shutdown, and reversed-leakage
protection. Fixed and adjustable output voltage options
are available with an operating temperature range of
–40°C to +125°C.
Package Types
MIC3775 (FIXED)
MSOP-8 (MM)
(Top View)
MIC3775 (ADJ)
MSOP-8 (MM)
(Top View)
EN 1
8 GND
EN 1
8 GND
IN 2
7 GND
IN 2
7 GND
FLG 3
6 GND
ADJ 3
6 GND
OUT 4
5 GND
OUT 4
5 GND
2018 Microchip Technology Inc.
DS20006045A-page 1
MIC3775
Typical Application Circuit
1.25V/750 MA ADJUSTABLE REGULATOR
MIC3775
VIN
2.5V
IN
1.25V
OUT
R1
ENABLE
SHUTDOWN
EN
ADJ
GND
R2
10μF
ceramic
Functional Block Diagrams
MIC3775 FIXED REGULATOR WITH FLAG AND ENABLE
OUT
IN
1.180V
FLAG
Ref.
1.240V
EN
Thermal
Shutdown
GND
MIC3775 ADJUSTABLE REGULATOR
OUT
IN
Ref.
1.240V
ADJ
EN
Thermal
Shutdown
GND
DS20006045A-page 2
2018 Microchip Technology Inc.
MIC3775
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
Supply Voltage (VIN) ................................................................................................................................................+6.5V
Enable Voltage (VEN) ...............................................................................................................................................+6.5V
Lead Temperature (Soldering, 5 sec.)................................................................................................................... +260°C
Storage Temperature (TS)...................................................................................................................... –65°C to +150°C
ESD Rating .............................................................................................................................................................Note 1
Operating Ratings ††
Supply Voltage (VIN) .................................................................................................................................. +2.25V to +6V
Enable Voltage (VEN) ........................................................................................................................................ 0V to +6V
Maximum Power Dissipation (PD(MAX))...................................................................................................................Note 2
Junction Temperature (TJ)...................................................................................................................... –40°C to +125°C
Package Thermal Resistance (MSOP-8, θJA).......................................................................................................80°C/W
† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at those or any other conditions above those indicated
in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended
periods may affect device reliability.
†† Notice: The device is not guaranteed to function outside its operating ratings.
Note 1: Devices are ESD sensitive. Handling precautions are recommended. Human body model, 1.5 kΩ in series
with 100 pF.
2: PD(MAX) = (TJ(MAX) – TA) ÷ θJA, where θJA depends upon the printed circuit layout. See “Applications Information.”
ELECTRICAL CHARACTERISTICS
Electrical Characteristics: VIN = VOUT + 1V; VEN = 2.25V; TJ = +25°C, bold values indicate –40°C ≤ TJ ≤ +125°C,
unless noted. Note 1
Parameter
Sym.
Min.
Typ.
Max.
–1
—
1
–2
—
2
Output Voltage
VOUT
Line Regulation
∆VOUT/
VOUT
—
0.06
Load Regulation
∆VOUT/
VOUT
—
Output Voltage Temp.
Coefficient
∆VOUT/
∆T
Dropout Voltage (Note 3)
Note 1:
2:
3:
4:
VDO
Units
Conditions
10 mA
%
10 mA ≤ IOUT ≤ 750 mA,
VOUT + 1V ≤ VIN ≤ 6V
0.5
%
IOUT = 10 mA, VOUT + 1V ≤ VIN ≤ 6V
0.2
1
%
VIN = VOUT + 1V,
10 mA ≤ IOUT ≤ 750 mA
—
40
—
—
125
200
—
—
250
—
210
—
—
280
500
ppm/°C Note 2
IOUT = 100 mA
mV
IOUT = 500 mA
IOUT = 750 mA
Specification for packaged product only.
Output voltage temperature coefficient is ∆VOUT(WORSTCASE) ÷ (TJ(MAX) – TJ(MIN)) where TJ(MAX) is
+125°C and TJ(MIN) is –40°C.
VDO = VIN – VOUT when VOUT decreases to 98% of its nominal output voltage with VIN = VOUT + 1V. For
output voltages below 1.75V, dropout voltage is the input-to-output voltage differential with the minimum
input voltage being 2.25V. Minimum input operating voltage is 2.25V.
IGND is the quiescent current. IIN = IGND + IOUT.
2018 Microchip Technology Inc.
DS20006045A-page 3
MIC3775
ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Characteristics: VIN = VOUT + 1V; VEN = 2.25V; TJ = +25°C, bold values indicate –40°C ≤ TJ ≤ +125°C,
unless noted. Note 1
Parameter
Ground Current (Note 4)
Current Limit
Sym.
IGND
IOUT(LIM)
Min.
Typ.
Max.
Units
—
700
—
µA
—
3.7
—
—
7.5
15
—
1.6
2.5
—
—
0.8
2.25
—
—
1
10
30
—
—
2
—
—
4
—
0.01
1
—
—
2
—
250
500
93
—
—
—
—
99.2
—
1
—
1.227
1.240
1.252
1.215
—
1.265
—
40
80
—
—
120
mA
A
Conditions
IOUT = 100 mA, VIN = VOUT + 1V
IOUT = 500 mA, VIN = VOUT + 1V
IOUT = 750 mA, VIN = VOUT + 1V
VOUT = 0V, VIN = VOUT + 1V
Enable Input
Enable Input Voltage
Enable Input Current
VEN
IEN
V
Logic low (off)
Logic high (on)
VEN = 2.25V
µA
VEN = 0.8V
Flag Output
Output Leakage Current
IFLG(LEAK)
Output Low Voltage
VFLG(DO)
Low Threshold
High Threshold
VFLG
Hysteresis
µA
VOH = 6V
mV
VIN = 2.250V, IOL = 250 µA
% of VOUT
%
% of VOUT
—
Adjustable Output Only
Reference Voltage
Adjust Pin Bias Current
Note 1:
2:
3:
4:
VREF
—
V
—
nA
—
Specification for packaged product only.
Output voltage temperature coefficient is ∆VOUT(WORSTCASE) ÷ (TJ(MAX) – TJ(MIN)) where TJ(MAX) is
+125°C and TJ(MIN) is –40°C.
VDO = VIN – VOUT when VOUT decreases to 98% of its nominal output voltage with VIN = VOUT + 1V. For
output voltages below 1.75V, dropout voltage is the input-to-output voltage differential with the minimum
input voltage being 2.25V. Minimum input operating voltage is 2.25V.
IGND is the quiescent current. IIN = IGND + IOUT.
DS20006045A-page 4
2018 Microchip Technology Inc.
MIC3775
TEMPERATURE SPECIFICATIONS
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Maximum Junction Temperature Range
TJ
–40
—
+125
°C
—
Storage Temperature Range
TS
–65
—
+150
°C
—
Lead Temperature
—
—
—
+260
°C
Soldering, 5 sec.
JA
—
80
—
°C/W
Temperature Ranges
Package Thermal Resistances
Thermal Resistance, MSOP 8-Ld
Note 1:
—
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.
2018 Microchip Technology Inc.
DS20006045A-page 5
MIC3775
2.0
Note:
TYPICAL PERFORMANCE CURVES
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
80
80
VIN = 5V
VOUT = 3.3V
PSRR (dB)
60
60
50
40
30 I
OUT=750mA
20 COUT =10μF
10 CIN =0
0
0.01
0.1
1
10
100
FREQUENCY (kHz )
DROPOUT (mV)
PSRR (dB)
40
30 I
OUT=750mA
20 COUT =47μF
10 CIN =0
0.1
1
10
100
FREQUENCY (kHz )
1.8VOUT
200
150
100
0
0
1000
Power Supply Rejection
3.3VOUT
2.5VOUT
0.25
0.5
0.75
OUTPUT CURRENT (A)
Dropout vs. Output Current.
FIGURE 2-5:
400
VIN =3.3V
VOUT =2.5V
70
350
DROPOUT (mV)
60
PSRR (dB)
1000
50
80
50
40
30 I
OUT=750mA
20 COUT =10μF
10 CIN =0
0
0.01
0.1
1
10
100
FREQUENCY (kHz )
Power Supply Rejection
250
50
FIGURE 2-2:
Ratio.
30 I
OUT=750mA
20 COUT =47μF
10 CIN =0
300
VIN =5V
VOUT =3.3V
60
0
0.01
40
FIGURE 2-4:
Ratio.
80
70
50
0
0.01
1000
Power Supply Rejection
FIGURE 2-1:
Ratio.
VIN =3.3V
VOUT =2.5V
70
PSRR (dB)
70
0.1
1
10
100
FREQUENCY (kHz )
FIGURE 2-3:
Ratio.
DS20006045A-page 6
300
250
2.5VOUT
200
150
100
50
0
-40 -20 0 20 40 60 80 100 120
TEMPERATURE (°C)
1000
Power Supply Rejection
FIGURE 2-6:
Dropout vs. Temperature.
2018 Microchip Technology Inc.
1.6
4.0
1.4
3.5
OUTPUT VOLTAGE (V)
OUTPUT VOLTAGE (V)
MIC3775
1.2
1.0
0.8
10mA Load
0.6
0.4
750mA Load
0.2
0
1.5
1.7
1.9
2.1
2.3
INPUT VOLTAGE (V)
10mA Load
2
2.5
INPUT VOLTAGE (V)
GROUND CURRENT (mA)
OUTPUT VOLTAGE (V)
2.0
750mA Load
10mA Load
0.5
0
1.5
FIGURE 2-9:
(2.5V).
2
2.5
3
3.5
4
INPUT VOLTAGE (V)
4.5
Dropout Characteristics
2.5VOUT
5
4
3
2
1
3.3VOUT
0
0.25
0.5
0.75
OUTPUT CURRENT (A)
Ground Current vs. Output
0.8
2.5
1.0
6
FIGURE 2-11:
Current.
3.0
1.5
0.5
0
3
Dropout Characteristics
FIGURE 2-8:
(1.8V).
10mA Load
1.0
FIGURE 2-10:
(3.3V).
GROUND CURRENT (mA)
OUTPUT VOLTAGE (V)
750mA Load
0.6
0.4
0.2
0
1.5
1.5
7
1.8
1.6
1.0
0.8
750mA Load
2.0
0
1.5
2.0
1.4
1.2
2.5
2.5
Dropout Characteristics
FIGURE 2-7:
(1.5V).
3.0
2
2.5
3
INPUT VOLTAGE (V)
3.5
Dropout Characteristics
2018 Microchip Technology Inc.
0.7
0.6
100mA
0.5
0.4
0.3
0.2
10mA
0.1
0
0
FIGURE 2-12:
Voltage (1.5V).
1
2
3
4
5
INPUT VOLTAGE (V)
6
Ground Current vs. Supply
DS20006045A-page 7
10
9
8
7
750mA
6
5
4
3
2
1
0
0
500mA
1
2
3
4
5
INPUT VOLTAGE (V)
FIGURE 2-13:
Voltage (1.5V).
GROUND CURRENT (mA)
GROUND CURRENT (mA)
1.4
1.0
0.6
0.4
0.2
0
0
6
Ground Current vs. Supply
FIGURE 2-16:
Voltage (2.5V).
18
0.7
16
0.6
100mA
0.5
0.4
0.3
0.2
0.1
FIGURE 2-14:
Voltage (1.8V).
10mA
1
2
3
4
5
INPUT VOLTAGE (V)
Ground Current vs. Supply
GROUND CURRENT (mA)
12
750mA
8
6
4
2
0
0
FIGURE 2-15:
Voltage (1.8V).
DS20006045A-page 8
6
Ground Current vs. Supply
10
750mA
8
6
4
2
500mA
1
2
3
4
5
INPUT VOLTAGE (V)
6
Ground Current vs. Supply
1.4
14
10
1
2
3
4
5
INPUT VOLTAGE (V)
12
FIGURE 2-17:
Voltage (2.5V).
16
10mA
14
0
0
6
100mA
0.8
0.8
0
0
GROUND CURRENT (mA)
1.2
GROUND CURRENT (mA)
GROUND CURRENT (mA)
MIC3775
500mA
1
2
3
4
5
INPUT VOLTAGE (V)
6
Ground Current vs. Supply
1.2
1.0
100mA
0.8
0.6
0.4
10mA
0.2
0
0
FIGURE 2-18:
Voltage (3.3V).
1
2
3
4
5
INPUT VOLTAGE (V)
6
Ground Current vs. Supply
2018 Microchip Technology Inc.
18
9
16
8
GROUND CURRENT (mA)
GROUND CURRENT (mA)
MIC3775
14
12
750mA
10
8
6
4
500mA
2
0
0
FIGURE 2-19:
Voltage (3.3V).
1
2
3
4
5
INPUT VOLTAGE (V)
6
Ground Current vs. Supply
GROUND CURRENT (mA)
0.2
0.15
0.1
0.05
OUTPUT VOLTAGE (V)
2.5VOUT
IOUT=10mA
0
-40 -20 0 20 40 60 80 100 120
TEMPERATURE (°C)
Ground Current vs.
5
4.5
4
3.5
2.5VOUT
2
1.5
IOUT=500mA
0
-40 -20 0 20 40 60 80 100 120
TEMPERATURE (°C)
FIGURE 2-21:
Temperature.
4
3
2
1
IOUT=750mA
0
-40 -20 0 20 40 60 80 100 120
TEMPERATURE (°C)
Ground Current vs.
Ground Current vs.
2018 Microchip Technology Inc.
2.55
2.50
2.45
2.5VOUT
2.40
-40 -20 0 20 40 60 80 100 120
TEMPERATURE (°C)
FIGURE 2-23:
Temperature.
SHORT CIRCUIT CURRENT (A)
GROUND CURRENT (mA)
0.3
1
0.5
2.5VOUT
5
2.60
0.25
3
2.5
6
FIGURE 2-22:
Temperature.
0.4
0.35
FIGURE 2-20:
Temperature.
7
Output Voltage vs.
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
2.25
FIGURE 2-24:
Supply Voltage.
3
3.75 4.5 5.25
SUPPLY VOLTAGE (V)
6
Short Circuit Current vs.
DS20006045A-page 9
2.0
1.8
6
1.6
1.4
5
Flag High (OK)
FLAG VOLTAGE (V)
SHORT CIRCUIT CURRENT (A)
MIC3775
2.5VIN
1.2
1.0
0.8
0.6
0.4
0.2
Short Circuit Current vs.
FIGURE 2-25:
Temperature.
Flag Low (FAULT)
0
0.1
1
10
100 1000 10000
RESISTANCE (k)
FIGURE 2-28:
Error Flag Pull-Up Resistor.
9
3.3VIN
0.6
ENABLE CURRENT (μA)
FLAG VOLTAGE (V)
2
0.01
1.0
5VIN
2.5VIN
0.4
0.2
FIGURE 2-26:
Current.
Flag Voltage vs. Flag
7
6
5
4
2.5VEN
3
2
1
FIGURE 2-29:
Temperature.
Enable Current vs.
Output Voltage
(200mV/div)
350
8
0
-40 -20 0 20 40 60 80 100 120
TEMPERATURE (°C)
0
0 0.5 1 1.5 2 2.5 3 3.5 4
FLAG CURRENT (mA)
300
250
VIN = 3.3V
VOUT = 2.5V
COUT = 10μF Ceramic
200
750mA
150
100
50
Flag Current = 250μA
0
-40 -20 0 20 40 60 80 100 120
TEMPERATURE (°C)
Output Current
(500mA/div)
FLAG LOW VOLTAGE (mV)
3
1
0
-40 -20 0 20 40 60 80 100 120
TEMPERATURE (°C)
0.8
4
10mA
TIME (200μs/div)
FIGURE 2-27:
Temperature.
DS20006045A-page 10
Flag Low Voltage vs.
FIGURE 2-30:
Load Transient Response.
2018 Microchip Technology Inc.
Output Voltage
(200mV/div)
MIC3775
VIN = 3.3V
VOUT = 2.5V
COUT = 10μF Ceramic
Output Current
(500mA/div)
750mA
50mA
TIME (200μs/div)
Load Transient Response.
5V
3.3V
VOUT = 2.5V
COUT = 10μF Ceramic
Output Voltage
(50mV/div)
Input Voltage
(2V/div)
FIGURE 2-31:
TIME (200μs/div)
Line Transient Response.
Enable Voltage
(2V/div)
FIGURE 2-32:
Output Voltage
(1V/div)
VIN = 3.3V
VOUT = 2.5V
COUT = 10μF Ceramic
TIME (10μs/div)
FIGURE 2-33:
Enable Transient Response.
2018 Microchip Technology Inc.
DS20006045A-page 11
MIC3775
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
Pin Number
Pin Name
1
EN
Enable (Input): CMOS-compatible control input. Logic high = enable, logic low or
open = shutdown. Do not leave this pin floating.
IN
Supply (Input).
2
3
Description
FLG
Flag (Output): Open-collector error flag output. Active low = output undervoltage.
ADJ
Adjustment Input: Feedback input. Connect to resistive voltage-divider network.
4
OUT
Regulator Output.
5-8
GND
Ground.
DS20006045A-page 12
2018 Microchip Technology Inc.
MIC3775
4.0
APPLICATION INFORMATION
The MIC3775 is a high-performance low-dropout
voltage regulator suitable for moderate to high-current
voltage regulator applications. Its 500 mV dropout
voltage at full load and over temperature makes it
especially valuable in battery-powered systems and as
high-efficiency noise filters in post-regulator
applications. Unlike older NPN-pass transistor designs,
where the minimum dropout voltage is limited by the
base-to-emitter voltage drop and collector-to-emitter
saturation voltage, dropout performance of the PNP
output of these devices is limited only by the low VCE
saturation voltage.
A trade-off for the low-dropout voltage is a varying base
drive requirement. Microchip’s Superβeta PNP process
reduces this drive requirement to only 2% of the load
current.
The MIC3775 regulator is fully protected from damage
due to fault conditions. Linear current limiting is
provided. Output current during overload conditions is
constant. Thermal shutdown disables the device when
the die temperature exceeds the maximum safe
operating temperature. The output structure of these
regulators allows voltages in excess of the desired
output voltage to be applied without reverse current
flow.
VIN
MIC3775-x.xYMM
IN
CIN
FIGURE 4-1:
4.1
VOUT
OUT
GND
COUT
Capacitor Requirements.
Output Capacitor
The MIC3775 requires an output capacitor for stable
operation. As a µCap LDO, the MIC3775 can operate
with ceramic output capacitors as long as the amount
of capacitance is 10 µF or greater. For values of output
capacitance lower than 10 µF, the recommended ESR
range is 200 mΩ to 2Ω. The minimum value of output
capacitance recommended for the MIC3775 is 4.7 µF.
For 10 µF or greater, the ESR range recommended is
less than 1Ω. Ultra-low ESR ceramic capacitors are
recommended for output capacitance of 10 µF or
greater to help improve transient response and noise
reduction at high frequency. X7R/X5R dielectric-type
ceramic capacitors are recommended because of their
temperature performance. X7R-type capacitors
change capacitance by 15% over their operating
temperature range and are the most stable type of
ceramic capacitors. Z5U and Y5V dielectric capacitors
change value by as much as 50% and 60%
2018 Microchip Technology Inc.
respectively over their operating temperature ranges.
To use a ceramic chip capacitor with Y5V dielectric, the
value must be much higher than an X7R ceramic
capacitor to ensure the same minimum capacitance
over the equivalent operating temperature range.
4.2
Input Capacitor
An input capacitor of 1 µF or greater is recommended
when the device is more than 4 inches away from the
bulk AC supply capacitance or when the supply is a
battery. Small, surface mount, ceramic chip capacitors
can be used for bypassing. Larger values will help to
improve ripple rejection by bypassing the input to the
regulator, further improving the integrity of the output
voltage.
4.3
Error Flag
The MIC3775 features an error flag (FLG) that monitors
the output voltage and signals an error condition when
this voltage drops 5% below its expected value. The
error flag is an open-collector output that pulls low
under fault conditions and may sink up to 10 mA. Low
output voltage signifies a number of possible problems,
including an overcurrent fault (the device is in current
limit) or low input voltage. The flag output is inoperative
during overtemperature conditions. A pull-up resistor
from FLG to either VIN or VOUT is required for proper
operation. For information regarding the minimum and
maximum values of pull-up resistance, refer to the
graph in the Typical Performance Curves section of the
data sheet.
4.4
Enable Input
The MIC3775 features an active-high enable input (EN)
that allows on-off control of the regulator. Current drain
reduces to “zero” when the device is shutdown, with
only microamperes of leakage current. The EN input
has TTL/CMOS compatible thresholds for simple logic
interfacing. EN may be directly tied to VIN and pulled up
to the maximum supply voltage. Do not leave the
Enable input pin floating.
4.5
Transient Response and 3.3V to
2.5V or 2.5V to 1.8V or 1.65V
Conversion
The MIC3775 has excellent transient response to
variations in input voltage and load current. The device
has been designed to respond quickly to load current
variations and input voltage variations. Large output
capacitors are not required to obtain this performance.
A standard 10 µF output capacitor is all that is required.
Larger values help to improve performance even
further.
DS20006045A-page 13
MIC3775
By virtue of its low dropout voltage, this device does not
saturate into dropout as readily as similar NPN-based
designs. When converting from 3.3V to 2.5V or 2.5V to
1.8V or 1.65V, the NPN-based regulators are already
operating in dropout, with typical dropout requirements
of 1.2V or greater. To convert down to 2.5V or 1.8V
without operating in dropout, NPN-based regulators
require an input voltage of 3.7V at the very least. The
MIC3775 regulator will provide excellent performance
with an input as low as 3.0V or 2.5V respectively. This
gives the PNP-based regulators a distinct advantage
over older, NPN-based linear regulators.
4.6
Minimum Load Current
The MIC3775 regulator is specified between finite
loads. If the output current is too small, leakage
currents dominate and the output voltage rises. A
10 mA minimum load current is necessary for proper
regulation.
4.7
Adjustable Regulator Design
The MIC3775 allows programming the output voltage
anywhere between 1.24V and the 6V maximum
operating rating of the family. Two resistors are used.
Resistors can be quite large, up to 1 MΩ, because of
the very high input impedance and low bias current of
the sense comparator.
MIC3775
IN
OUT
VIN
VOUT
R1
ENABLE
SHUTDOWN
EN
ADJ
GND
R2
COUT
( )
VOUT = 1.240V 1+
R1
R2
Adjustable Regulator with
FIGURE 4-2:
Resistors.
The resistor values are calculated by:
EQUATION 4-1:
4.8
Power MSOP-8 Thermal
Characteristics
One of the secrets of the MIC3775’s performance is its
power MSOP-8 package that features half the thermal
resistance of a standard MSOP-8 package. Lower
thermal resistance means more output current or
higher input voltage for a given package size.
Lower thermal resistance is achieved by joining the
four ground leads with the die attach paddle to create a
single-piece electrical and thermal conductor. This
concept has been used by MOSFET manufacturers for
years, proving very reliable and cost effective for the
user.
Thermal resistance consists of two main elements, θJC
(junction-to-case thermal resistance) and θCA
(case-to-ambient thermal resistance). See Figure 4-3.
θJC is the resistance from the die to the leads of the
package. θCA is the resistance from the leads to the
ambient air and it includes θCS (case-to-sink thermal
resistance) and θSA (sink-to-ambient thermal
resistance).
Using the power MSOP-8 reduces the θJC dramatically
and allows the user to reduce θCA. The total thermal
resistance,
θJA
(junction-to-ambient
thermal
resistance) is the limiting factor in calculating the
maximum power dissipation capability of the device.
Typically, the power MSOP-8 has a θJA of 80°C/W, this
is significantly lower than the standard MSOP-8, which
is typically 160°C/W. θCA is reduced because pins 5
through 8 can now be soldered directly to a ground
plane, which significantly reduces the case-to-sink
thermal resistance and sink-to-ambient thermal
resistance.
Low-dropout linear regulators from Microchip are rated
to a maximum junction temperature of 125°C. It is
important not to exceed this maximum junction
temperature during operation of the device. To prevent
this maximum junction temperature from being
exceeded, the appropriate ground plane heat sink must
be used.
V OUT
R1 = R2 ------------- – 1
1.240
MSOP-8
Where:
VOUT = The desired output voltage.
Figure 4-2 shows component definition. Applications
with widely varying load currents may scale the
resistors to draw the minimum load current required for
proper operation.
șJA
șJC
Ground Plane
Heat Sink Area
șCA
AMBIENT
Printed Circuit Board
FIGURE 4-3:
DS20006045A-page 14
Thermal Resistance.
2018 Microchip Technology Inc.
MIC3775
Figure 4-4 shows copper area versus power
dissipation with each trace corresponding to a different
temperature rise above ambient.
From these curves, the minimum area of copper
necessary for the part to operate safely can be
determined. The maximum allowable temperature rise
must be calculated to determine operation along which
curve.
Using Figure 4-4, the minimum amount of required
copper can be determined based on the required
power dissipation. Power dissipation in a linear
regulator is calculated as follows:
EQUATION 4-4:
P D = V IN – V OUT I OUT + V IN I GND
40°C
50°C
55°C
65°C
75°C
85°C
800
700
100°C
900
600
If using a 2.5V output device and a 3.3V input at an
output current of 750 mA, then calculating power
dissipation is as follows:
500
400
300
200
EQUATION 4-5:
100
0
0
0.25 0.50 0.75 1.00 1.25 1.50
POWER DISSIPATION (W)
FIGURE 4-4:
Copper Area vs. Power
MSOP Power Dissipation (∆TJA).
P D = 3.3V – 2.5V 750mA + 3.3V 7.5mA
P D = 600mW + 25mW = 625mW
900
800
TJ = 125°C
700
85°C
50°C 25°C
600
From Figure 4-4, the minimum amount of copper
required to operate this application at a ∆T of 75°C is
160 mm2.
500
400
300
200
4.9
100
0
0
0.25 0.50 0.75 1.00 1.25 1.50
POWER DISSIPATION (W)
FIGURE 4-5:
Copper Area vs. Power
MSOP Power Dissipation (TA).
EQUATION 4-2:
T = T J MAX – T A MAX
Where:
TJ(MAX) = 125°C
TA(MAX) = The max. ambient operating temp.
Quick Method
Determine the power dissipation requirements for the
design along with the maximum ambient temperature
at which the device will be operated. Refer to
Figure 4-5, which shows safe operating curves for
three different ambient temperatures: 25°C, 50°C, and
85°C. From these curves, the minimum amount of
copper can be determined by knowing the maximum
power dissipation required. If the maximum ambient
temperature is 50°C and the power dissipation is
625 mW, the curve in Figure 4-5 shows that the
required area of copper is 160 mm2.The θJA of this
package is ideally 80°C/W, but it will vary depending
upon the availability of copper ground plane to which it
is attached.
For example, the maximum ambient temperature is
50°C, the ∆T is determined as follows:
EQUATION 4-3:
T = 125C – 50C = 75C
2018 Microchip Technology Inc.
DS20006045A-page 15
MIC3775
5.0
PACKAGING INFORMATION
5.1
Package Marking Information
8-Lead MSOP*
(Fixed)
XXXX
X.XY
8-Lead MSOP*
(Adj.)
XXXX
XXX
Legend: XX...X
Y
YY
WW
NNN
e3
*
Example
3775
1.8Y
Example
3775
YMM
Product code or customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle
mark).
Note:
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information. Package may or may not include
the corporate logo.
Underbar (_) and/or Overbar (⎯) symbol may not be to scale.
DS20006045A-page 16
2018 Microchip Technology Inc.
MIC3775
8-Lead MSOP Package Outline & Recommended Land Pattern
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
2018 Microchip Technology Inc.
DS20006045A-page 17
MIC3775
NOTES:
DS20006045A-page 18
2018 Microchip Technology Inc.
MIC3775
APPENDIX A:
REVISION HISTORY
Revision A (July 2018)
• Converted Micrel document MIC3775 to Microchip data sheet template DS20006045A.
• Minor grammatical text changes throughout.
• Typographical correction to the equation in
Figure 4-2.
2018 Microchip Technology Inc.
DS20006045A-page 19
MIC3775
NOTES:
DS20006045A-page 20
2018 Microchip Technology Inc.
MIC3775
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
Examples:
Device
-X.X
X
XX
-XX
Part No.
Output
Voltage
Junction
Temp. Range
Package
Media Type
Device:
MIC3775:
750 mA µCap Low Voltage, Low Dropout
Regulator
1.5 =
1.65 =
1.8 =
2.5 =
3.0 =
3.3 =
=
1.5V
1.65V
1.8V
2.5V
3.0V
3.3V
Adjustable
Junction
Temperature
Range:
Y
–40°C to +125°C, RoHS-Compliant
Package:
MM =
Media Type:
= 100/Tube
TR =
2,500/Reel
Output Voltage:
=
a) MIC3775-1.5YMM-TR:
MIC3775, 1.5V Output
Voltage, –40°C to +125°C
Temperature Range, 8-Lead
MSOP, 2,500/Reel
b) MIC3775-1.65YMM:
MIC3775, 1.65V Output
Voltage, –40°C to +125°C
Temperature Range, 8-Lead
MSOP, 100/Tube
c) MIC3775-1.8YMM-TR:
MIC3775, 1.8V Output
Voltage, –40°C to +125°C
Temperature Range, 8-Lead
MSOP, 2,500/Reel
d) MIC3775-2.5YMM:
MIC3775, 2.5V Output
Voltage, –40°C to +125°C
Temperature Range, 8-Lead
MSOP, 100/Tube
e) MIC3775-3.0YMM-TR:
MIC3775, 3.0V Output
Voltage, –40°C to +125°C
Temperature Range, 8-Lead
MSOP, 2,500/Reel
f) MIC3775-3.3YMM:
MIC3775, 3.3V Output
Voltage, –40°C to +125°C
Temperature Range, 8-Lead
MSOP, 100/Tube
g) MIC3775YMM-TR:
MIC3775, Adjustable Output
Voltage, –40°C to +125°C
Temperature Range, 8-Lead
MSOP, 2,500/Reel
8-Lead MSOP
Note 1:
2018 Microchip Technology Inc.
Tape and Reel identifier only appears in the
catalog part number description. This identifier is
used for ordering purposes and is not printed on
the device package. Check with your Microchip
Sales Office for package availability with the
Tape and Reel option.
DS20006045A-page 21
MIC3775
NOTES:
DS20006045A-page 22
2018 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
The Microchip name and logo, the Microchip logo, AnyRate, AVR,
AVR logo, AVR Freaks, BitCloud, chipKIT, chipKIT logo,
CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo,
JukeBlox, KeeLoq, Kleer, LANCheck, LINK MD, maXStylus,
maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip
Designer, QTouch, SAM-BA, SpyNIC, SST, SST Logo,
SuperFlash, tinyAVR, UNI/O, and XMEGA are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
and other countries.
ClockWorks, The Embedded Control Solutions Company,
EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS,
mTouch, Precision Edge, and Quiet-Wire are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, BodyCom, CodeGuard,
CryptoAuthentication, CryptoAutomotive, CryptoCompanion,
CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average
Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial
Programming, ICSP, INICnet, Inter-Chip Connectivity,
JitterBlocker, KleerNet, KleerNet logo, memBrain, Mindi, MiWi,
motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB,
MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation,
PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon,
QMatrix, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O,
SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total
Endurance, TSHARC, USBCheck, VariSense, ViewSpan,
WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
Silicon Storage Technology is a registered trademark of Microchip
Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2018, Microchip Technology Incorporated, All Rights Reserved.
ISBN: 978-1-5224-3313-2
== ISO/TS 16949 ==
2018 Microchip Technology Inc.
DS20006045A-page 23
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DS20006045A-page 24
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10/25/17
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