MIC38C45BN

MIC38C42/43/44/45 BiCMOS Current-Mode PWM Controllers Features General Description • Fast 40 ns Output Rise and 30 ns Output Fall Times • –40°C to +85°C Ambient Temperature Range Meets UC284x Specifications • High-Performance, Low-Power BiCMOS Process • Ultra-Low Start-Up Current (50 μA Typical) • Low Quiescent Operating Current (4 mA Typical) • CMOS Outputs with Rail-to-Rail Swing • Up to 500 kHz Current-Mode Operation • Trimmed 5V Bandgap Reference • Pin-for-Pin Compatible with UC3842/3843/3844/3845(A) • Trimmed Oscillator Discharge Current • UVLO with Hysteresis • Low Cross-Conduction Currents The MIC38C4x are fixed-frequency, high performance, current-mode PWM controllers. Microchip’s BiCMOS devices are pin compatible with 384x bipolar devices, but feature several improvements. Applications • Current-Mode, Offline, Switched-Mode Power Supplies • Current-Mode, DC-to-DC Converters • Step-Down Buck Regulators • Step-Up Boost Regulators • Flyback, Isolated Regulators • Forward Converters • Synchronous FET Converters Undervoltage lockout circuitry allows the ‘42 and ‘44 versions to start up at 14.5V and operate down to 9V, and the ‘43 and ‘45 versions start at 8.4V with operation down to 7.6V. All versions operate up to 20V. When compared to bipolar 384x devices operating from a 15V supply, start-up current has been reduced to 50 μA typical and operating current has been reduced to 4.0 mA typical. Decreased output rise and fall times drive larger MOSFETs, and rail-to-rail output capability increases efficiency, especially at lower supply voltages. The MIC38C4x also features a trimmed oscillator discharge current and bandgap reference. The MIC38C4x denotes 8-pin plastic DIP, SOIC, and MSOP packages. MIC38C4x-1 denotes 14-pin plastic DIP and SOIC packages. 8-pin devices feature small size, while 14-pin devices separate the analog and power connections for improved performance and power dissipation. For fast rise and fall times and higher output drive, refer to the MIC38HC4x. Package Types MIC38C42-1/43-1/44-1/45-1 14-Lead SOIC (M) 14-Lead DIP (N) MIC38C42/43/44/45 8-Lead SOIC (M) 8-Lead MSOP (MM) 8-Lead DIP (N) COMP 1 14 V R E F COMP 1 8 VREF NC 2 13 N C FB 2 7 VDD FB 3 12 VDD ISNS 3 6 OUT NC 4 11 VD RT/CT 4 5 GND ISNS 5 6 9 AGND RT/CT 7 8 P GND NC  2020 - 2022 Microchip Technology Inc. and its subsidiaries 10 OUT DS20006436B-page 1 MIC38C42/43/44/45 Functional Block Diagram * VDD 7 (12) 35V 5V Reference VREF 8 (14) (VD) UVLO (11) † Oscillator RT/CT 4 (7) OUT 6 (10) T FB Q ‡ 2R 2 (3) 2.5V S R R (PGND) (8) Q * COMP 1 (1) GND* (AGND) ISNS 5 (9) 3 (5) ( ) pins * † ‡ are on MIC38C4x-1 (14-lead) versions only MIC38C4x, (8-lead) versions only MIC38C42, MIC38C43 (96% max. duty cycle) versions only MIC38C44, MIC38C45 (50% max. duty cycle) versions only DS20006436B-page 2  2020 - 2022 Microchip Technology Inc. and its subsidiaries MIC38C42/43/44/45 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings † Zener Current (IZ at VDD Pin).................................................................................................................................30 mA Operation at ≥ 18V may require special precautions. See Note 1. Supply Voltage (VDD, Note 1)....................................................................................................................................+20V Switch Supply Voltage (VD).......................................................................................................................................+20V Current Sense Voltage (VISNS) ................................................................................................................. –0.3V to +5.5V Feedback Voltage (VFB)............................................................................................................................ –0.3V to +5.5V Output Current (IOUT).................................................................................................................................................0.5A † Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended periods may affect device reliability. Note 1: On the 8-pin version, 20V is the maximum input on Pin 7 because this is also the supply pin for the output stage. On the 14-pin version, 40V is the maximum for Pin 12 and 20V is the maximum for Pin 11.  2020 - 2022 Microchip Technology Inc. and its subsidiaries DS20006436B-page 3 MIC38C42/43/44/45 ELECTRICAL CHARACTERISTICS Electrical Characteristics: VDD = 15V, Adjust VDD above the start threshold before setting at 15V; RT = 11.0 kΩ; CT = 3.3 nF; –40°C ≤ TA ≤ +85°C; unless noted. Note 1 Parameter Symbol Min. Typ. Max. Units Conditions VREF 4.90 5.00 5.10 V Line Regulation ΔVREF(LINE) — 2 20 mV 12V ≤ VDD ≤ 18V, IVREF = 5 μA, Note 6 Load Regulation ΔVREF(LOAD) — 1 25 mV 1 mA ≤ IVREF ≤ 20 mA Reference Output Voltage Temperature Stability TCVREF — 0.2 — Total Output Variation ΔVREF(TOT) 4.82 — 5.18 TA = +25°C, IVREF = 1 mA mV/°C Note 2 V Line, Load, Temperature, Note 2 VNOISE — 50 — µV 10 Hz ≤ f ≤ 10 kHz, TA = +25°C, Note 2 Long-Term Stability ΔVREF(LT) — 5 25 mV TA = +125°C, 1000 hours, Note 2 Output Short-Circuit IVREF(SC) –30 –80 –180 mA — Initial Accuracy ΔfOSC(INIT) 49 52 55 kHz Voltage Stability ΔfOSC(VS) — 0.2 1.0 % 12V ≤ VDD ≤ 18V, Note 6 — 0.04 — %/°C TMIN ≤ TA ≤ TMAX, Note 2 6.0 8.4 9.0 mA TA = +25°C, VRT/CT = 2V Output Noise Voltage Oscillator Temperature Stability Clock Ramp Reset Current TCFOSC IDISCHG TA = +25°C, Note 3 6.0 8.4 9.5 mA TA = TMIN to TMAX VAMP — 1.9 — VPP VRT/CT peak-to-peak VIN(EA) 2.42 2.50 2.58 V VCOMP = 2.5V Input Bias Current IBIAS(EA) — –0.1 –2 µA VFB = 5.0V Open Loop Voltage Gain AVOL 65 90 — dB 2V ≤ VCOMP ≤ 4V Unity Gain Bandwidth GBW 0.7 1.0 — MHz PSRREA 60 — — dB 12V ≤ VDD ≤ 18V Output Sink Current ICOMP(SINK) 2 14 — mA VFB = 2.7V, VCOMP = 1.1V Output Source Current ICOMP(SRC) –0.5 –1 — mA VFB = 2.3V, VCOMP = 5V COMP High Voltage VCOMP_H 5 6.8 — V VFB = 2.3V, RLOAD = 15 kΩ to ground COMP Low Voltage VCOMP_L — 0.1 1.1 V VFB = 2.7V, RLOAD = 15 kΩ to VREF ADIV 2.85 3.0 3.15 V/V Maximum Threshold VTH(MAX) 0.9 1 1.1 V VCOMP = 5V, Note 4 Power Supply Rejection Ratio PSRRCS — 70 — dB 12V ≤ VDD ≤ 18V, Note 4 Input Bias Current IBIAS(CS) — –0.1 –2 µA — tD — 120 250 ns — RDS(ON) Pull High RDSON_H — 20 — Ω ISOURCE = 200 mA RDS(ON) Pull Low Amplitude Error Amp Input Voltage Power Supply Rejection Ratio Current Sense Divider Gain Input-to-Output Delay to Output Output Note 2 Note 4, Note 5 RDSON_L — 11 — Ω ISINK = 200 mA Rise Time tR — 40 80 ns TA = +25°C, CLOAD = 1 nF Fall Time tF — 30 60 ns TA = +25°C, CLOAD = 1 nF DS20006436B-page 4  2020 - 2022 Microchip Technology Inc. and its subsidiaries MIC38C42/43/44/45 ELECTRICAL CHARACTERISTICS (CONTINUED) Electrical Characteristics: VDD = 15V, Adjust VDD above the start threshold before setting at 15V; RT = 11.0 kΩ; CT = 3.3 nF; –40°C ≤ TA ≤ +85°C; unless noted. Note 1 Parameter Symbol Min. Typ. Max. Units Conditions 13.5 14.5 15.5 V 7.8 8.4 9.0 V MIC38C43/45 8 9 10 V MIC38C42/44 7.0 7.6 8.2 V MIC38C43/45 Undervoltage Lockout Start Threshold Minimum Operating Voltage VTH(ST) VDD(MIN) MIC38C42/44 Pulse Width Modulator 94 96 — % MIC38C42/43 46 50 — % MIC38C44/45 DMIN — — 0 % — Start-Up Current IDD(START) — 50 200 µA Operating Supply Current IDD(Q) — 4.0 6.0 mA VZ 30 37 — V Maximum Duty Cycle DMAX Minimum Duty Cycle Total Standby Current Zener Voltage at VDD Pin Note 1: 2: 3: 4: 5: 6: VDD = 13V for MIC38C42/44 VDD = 7.5V for MIC38C43/45 VFB = VISNS = 0V IDD = 25 mA, Note 6 Specification for packaged product only. These parameters, although guaranteed, are not 100% tested in production. Output frequency equals oscillator frequency for the MIC38C42 and MIC38C43. Output frequency for the MIC38C44 and MIC38C45 equals one-half the oscillator frequency. Parameter measured at trip point of latch with VFB = 0V. Gain defined as Equation 1-1; 0V ≤ VTH(ISNS) ≤ 0.8V. On the 8-pin version, 20V is the maximum input on Pin 7 because this is also the supply pin for the output stage. On the 14-pin version, 40V is the maximum for Pin 12 and 20V is the maximum for Pin 11. EQUATION 1-1: V COMP A DIV = --------------------------V TH  ISNS   2020 - 2022 Microchip Technology Inc. and its subsidiaries DS20006436B-page 5 MIC38C42/43/44/45 TEMPERATURE SPECIFICATIONS (Note 1) Parameters Sym. Min. Typ. Max. Units Conditions Storage Temperature Range TS –65 — +150 °C — Operating Ambient Temperature Range TA –40 — +85 °C — Operating Junction Temperature Range TJ –40 — +125 °C — Maximum Junction Temperature TJ(MAX) — — +150 °C — Thermal Resistance 8-Ld Plastic DIP θJA — 125 — °C/W — Thermal Resistance 8-Ld MSOP θJA — 250 — °C/W — Thermal Resistance 8-Ld SOIC θJA — 170 — °C/W — Thermal Resistance 14-Ld Plastic DIP θJA — 90 — °C/W — Thermal Resistance 14-Ld SOIC θJA — 145 — °C/W — Temperature Ranges Package Thermal Resistance Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability. DS20006436B-page 6  2020 - 2022 Microchip Technology Inc. and its subsidiaries MIC38C42/43/44/45 RT5(6,67$1&(NŸ 100 200pF 470pF 1nF 10 1.8nF 4.7nF 10nF VDD = 15V 1 1x104 1x105 5x105 OSCILLATOR FREQUENCY (Hz) FIGURE 2-1: Configuration. Oscillator Frequency OUTPUT DEAD TIME (%) 100 VDD = 15V 4.7nF 10 200pF 10nF 470pF 1nF 1 1x104 1.8nF 1x105 FREQUENCY (Hz) 1x106 OSC. DISCHARGE CURRENT (mA) FIGURE 2-2: MIC38C42/43 Output Dead Time vs. Oscillator Frequency. 8.6 8.4 8.2 8.0 7.2 VDD = 15V VOSC = 2V 7.0 -60 -30 0 30 60 90 120 150 TEMPERATURE (°C) FIGURE 2-3: vs. Temperature. 1.2 1.0 125°C 0.8 0.6 25°C 0.4 -50°C 0.2 0 0 2 4 6 8 ERROR AMPLIFIER OUTPUT (V) FIGURE 2-4: Current Sense Amplifier Threshold vs. Error Amplifier Output. 120 100 80 60 40 20 VDD = 15V 0 -60 -30 0 30 60 90 120 150 TEMPERATURE (°C) FIGURE 2-5: Short-Circuit Reference Current vs. Temperature. 25 9.0 8.8 7.8 7.6 7.4 CURRENT SENSE AMP THRESHOLD (V) The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. VREF SHORT CURCUIT CURRENT (mA) Note: TYPICAL PERFORMANCE CURVES Oscillator Discharge Current  2020 - 2022 Microchip Technology Inc. and its subsidiaries OUTPUT VOLTAGE (V) 2.0 20 15 10 5 0 -5 -10 -15 0.0 FIGURE 2-6: Waveform. VD = 15V CLOAD= 1nF 0.2 0.4 0.6 TIME (μs) 0.8 1.0 MIC38C4x Output DS20006436B-page 7 MIC38C42/43/44/45 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE Pin Number 8-Pin DIP, SOIC, MSOP Pin Number 14-Pin DIP and SOIC Pin Name Description 1 1 COMP Compensation: Connect external compensation network to modify the error amplifier output. — 2 NC Not internally connected. 2 3 FB Feedback (Input): Error amplifier input. Feedback is 2.5V at desired output voltage. — 4 NC Not internally connected. 3 5 ISNS — 6 NC 4 7 RT/CT 5 — GND Current Sense (Input): Current sense comparator input. Connect to current sensing resistor or current transformer. Not internally connected. Timing Resistor/Timing Capacitor: Connect external RC network to select switching frequency. Ground: Combined analog and power ground. — 8 PGND Power Ground: N-channel driver transistor ground. — 9 AGND Analog Ground: Controller circuitry ground. 6 10 OUT — 11 VD 7 12 VDD — 13 NC 8 14 VREF DS20006436B-page 8 Gate Driver Output: Totem-pole output. Power Supply (Input): P-channel driver transistor supply input. Return to power ground (PGND). Analog Supply (Input): Controller circuitry supply input. Return to analog ground (AGND). Not internally connected. 5V Reference (Output): Connect external RC network.  2020 - 2022 Microchip Technology Inc. and its subsidiaries MIC38C42/43/44/45 4.0 FUNCTIONAL DESCRIPTION Familiarity with 384x converter designs is assumed. 4.1 4.1.1 MIC38C4x Advantages START-UP CURRENT Start-up current has been reduced to an ultra-low 50 μA (typical) permitting higher-resistance, lower-wattage, start-up resistors (powers controller during power supply start-up). The reduced resistor wattage reduces cost and printed circuit space. 4.1.2 OPERATING CURRENT Quiescent operating current has been reduced to 4 mA compared to 11 mA for a typical bipolar controller. The controller runs cooler and the VDD hold-up capacitance required during start-up may be reduced. 4.1.3 OUTPUT DRIVER Complementary internal P-channel and N-channel MOSFETs produce rail-to-rail output voltages for better performance driving external power MOSFETs. The driver transistor’s low on resistance and high peak current capability can drive gate capacitances of greater than 1000 pF. The value of output capacitance which can be driven is determined only by the rise/fall time requirements. Within the restrictions of output capacity and controller power dissipation, maximum switching frequency can approach 500 kHz. 4.2 Design Precautions When operating near 20V, circuit transients can easily exceed the 20V absolute maximum rating, permanently damaging the controller’s CMOS construction. To reduce transients, connect a 0.1 μF low-ESR capacitor to next to the controller’s supply VDD (or VD for ‘-1’ versions) and ground connections. Film type capacitors, such as Wima MKS2, are recommended. When designing high-frequency converters, avoid capacitive and inductive coupling of the switching waveform into high impedance circuitry such as the error amplifier, oscillator, and current sense amplifier. Avoid long printed-circuit traces and component leads. Locate oscillator and compensation circuitry near the IC. Use high frequency decoupling capacitors on VREF, and if necessary, on VDD. Return high di/dt currents directly to their source and use large area ground planes. 4.3 turned on by the gate drive transformer T1, charging the output filter capacitor C3 through L1. D5 supplies a regulated +12V to VDD once the circuit is running. Current sense transformer CT1 provides current feedback to ISNS for current-mode operation and cycle-by-cycle current limiting. This is more efficient than a high-power sense resistor and provides the required ground-referenced level shift. When Q1 turns off, current flow continues from ground through D1 and L1 until Q1 is turned on again. The 100V Schottky diode D1 reduces the forward voltage drop in the main current path, resulting in higher efficiency than could be accomplished using an ultra-fast-recovery diode. R1 and C2 suppress parasitic oscillations from D1. Using a high-value inductance for L1 and a low-ESR capacitor for C3 permits small capacitance with minimum output ripple. This inductance value also improves circuit efficiency by reducing the flux swing in L1. Magnetic components are carefully chosen for minimal loss at 500 kHz. CT1 and T1 are wound on Magnetics, Inc. P-type material toroids. L1 is wound on a Siemens N49 EFD core. TABLE 4-1: MAGNETIC COMPONENTS Custom Coils (Note 1) Symbol ETS (Note 2) CT1 4923 ETS 92420 T1 4924 ETS 92419 4925 ETS 92421 L1 Note 1: 2: Custom Coils, Alcester, SD. Tel: (605) 934-2460. Energy Transformation Systems, Inc. Tel: (510) 656-2012. TABLE 4-2: COMPONENT TEST RESULTS Test Conditions Results Line Regulation VIN = 26V to 80V, VOUT = 12V, IO = 2A 0.5% Load Regulation VIN = 48V, VOUT = 12V, IO = 0.2A to 2A 0.6% Efficiency VIN = 48V, VOUT = 12V, IO = 2A 90% Output Ripple VIN = 48V, VOUT = 12V, IO = 2A (20 MHz BW) 100 mV Buck Converter Refer to Figure 4-1. When at least 26V is applied to the input, C5 is charged through R2 until the voltage VDD is greater than 14.5V (the undervoltage lockout value of the MIC38C42). Output switching begins when Q1 is  2020 - 2022 Microchip Technology Inc. and its subsidiaries DS20006436B-page 9 MIC38C42/43/44/45 V IN 26V to 80V R2 68k R1 10 1/2W D4 1N765B 0.1μF* D2 17V 1W 100k 1 0.22μF 2 3 R4 18 C5 4.7μF C2 1000pF 4.7Ω C3 3.3μF C4 0.1μF MIC38C42 COM P V R E F FB VDD ISNS OU T 4 8 1N4001 T1 6 5 R5 16k D5 7 RT/CT GND C7 200pF FIGURE 4-1: MKS2 L1 48μH 31DQ10 D1 0.1μF 6.8k D3 MBR030 4.4 V OUT 12V, 2A Q1 IRF820 CT1 6.19k 1% C8 0.1μF 1.62k 1% *Locate near MIC38C42 supply pins 0.1μF 500 kHz, 25W, Buck Converter. Synchronous Buck Converter The on-state voltage drop of the low-side MOSFET is lower than the forward voltage drop of an equivalent Schottky rectifier. This lower voltage drop results in higher efficiency. Refer to Figure 4-2. This MIC38C43 synchronous buck converter uses an MIC5022 half-bridge driver to alternately drive the PWM switch MOSFET (driven by GATEH, or high-side output) and a MOSFET which functions as a synchronous rectifier (driven by the GATEL, or low-side output). A sense resistor (5 mΩ) is connected to the driver’s high-side current sense inputs to provide overcurrent protection. Refer to the MIC5020, MIC5021, and MIC5022 data sheets for more information. The low-side MOSFET turns on when the high-side MOSFET is off, allowing current to return from ground. Current flows through the low-side MOSFET in the source to drain direction. +12V MIC5022 0.15μF 10k VDD 0.1μF NC 6.8k 300k 4.7nF MIC38C43 COM P V R E F 4.3k 47k 2200 pF 3.3k FB VDD ISNS OU T NC 470μF 25V NC RT/CT GND FL T EN SQP60N06-15 5mΩ 35μH V OUT 5V, 8A VB GATEL IN SH+ CT SH– 0.1μF* MKS2 1000μF Low ESR SL+ GND 10k GATEH 0.1μF S L– *Locate near the MIC38C43 supply pins. FIGURE 4-2: DS20006436B-page 10 100 kHz Synchronous Buck Converter.  2020 - 2022 Microchip Technology Inc. and its subsidiaries MIC38C42/43/44/45 5.0 PACKAGING INFORMATION 5.1 Package Marking Information 8-Lead SOIC* Example MIC 38C42YM 89Z3 XXX XXXXXXX WNNN 8-Lead DIP* Example MIC 38C43YN 2PF8 S XXX XXXXXXX WNNN S 8-Lead MSOP* (Front) Example XXXX XXX 3843 YMM Legend: XX...X Y YY WW NNN e3 * 14-Lead SOIC* Example XXX XXXXX-XXX WNNN S MIC 38C45-1YM 1U71 S 14-Lead DIP* Example MIC 38C44-1YN 992W S XXX XXXXX-XXX WNNN S 8-Lead MSOP* (Back) Example WNNN 8W7F Product code or customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC® designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. ●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle mark). Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. Package may or may not include the corporate logo. Underbar (_) and/or Overbar (‾) symbol may not be to scale. Note: If the full seven-character YYWWNNN code cannot fit on the package, the following truncated codes are used based on the available marking space: 6 Characters = YWWNNN; 5 Characters = WWNNN; 4 Characters = WNNN; 3 Characters = NNN; 2 Characters = NN; 1 Character = N  2020 - 2022 Microchip Technology Inc. and its subsidiaries DS20006436B-page 11 MIC38C42/43/44/45 8-Lead SOIC Package Outline and Recommended Land Pattern Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging. DS20006436B-page 12  2020 - 2022 Microchip Technology Inc. and its subsidiaries MIC38C42/43/44/45 8-Lead MSOP Package Outline and Recommended Land Pattern Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging.  2020 - 2022 Microchip Technology Inc. and its subsidiaries DS20006436B-page 13 MIC38C42/43/44/45 8-Lead DIP Package Outline and Recommended Land Pattern Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging. DS20006436B-page 14  2020 - 2022 Microchip Technology Inc. and its subsidiaries MIC38C42/43/44/45 14-Lead SOIC Package Outline and Recommended Land Pattern 14-Lead Plastic Small Outline (D3X, UEB, M5B, UEB) - Narrow, 3.90 mm Body [SOIC] Atmel Legacy Global Package Code SVQ Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2X 0.10 C A–B D A NOTE 5 D N E 2 E2 2 E1 E 2X 0.10 C D NOTE 1 1 2 2X N/2 TIPS 0.20 C 3 e NX b B 0.25 NOTE 5 C A–B D TOP VIEW 0.10 C C A A2 SEATING PLANE 14X h 0.10 C SIDE VIEW A1 h R0.13 H R0.13 c SEE VIEW C VIEW A–A L (L1) VIEW C Microchip Technology Drawing No. C04-065-D3X Rev D  2020 - 2022 Microchip Technology Inc. and its subsidiaries DS20006436B-page 15 MIC38C42/43/44/45 14-Lead Plastic Small Outline (D3X, UEB, M5B, UEB) - Narrow, 3.90 mm Body [SOIC] Atmel Legacy Global Package Code SVQ Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units Dimension Limits Number of Pins N e Pitch Overall Height A Molded Package Thickness A2 Standoff § A1 Overall Width E Molded Package Width E1 Overall Length D Chamfer (Optional) h Foot Length L Footprint L1 Lead Angle Foot Angle c Lead Thickness Lead Width b Mold Draft Angle Top Mold Draft Angle Bottom MIN 1.25 0.10 0.25 0.40 0° 0° 0.10 0.31 5° 5° MILLIMETERS NOM 14 1.27 BSC 6.00 BSC 3.90 BSC 8.65 BSC 1.04 REF - MAX 1.75 0.25 0.50 1.27 8° 0.25 0.51 15° 15° Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. § Significant Characteristic 3. Dimension D does not include mold flash, protrusions or gate burrs, which shall not exceed 0.15 mm per end. Dimension E1 does not include interlead flash or protrusion, which shall not exceed 0.25 mm per side. 4. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. 5. Datums A & B to be determined at Datum H. Microchip Technology Drawing No. C04-065-D3X Rev D Sheet 2 of 2 DS20006436B-page 16  2020 - 2022 Microchip Technology Inc. and its subsidiaries MIC38C42/43/44/45 14-Lead Plastic Small Outline (D3X, UEB, M5B, UEB) - Narrow, 3.90 mm Body [SOIC] Atmel Legacy Global Package Code SVQ Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 14 SILK SCREEN C Y 1 2 X E RECOMMENDED LAND PATTERN Units Dimension Limits Contact Pitch E Contact Pad Spacing C Contact Pad Width (X14) X Contact Pad Length (X14) Y MIN MILLIMETERS NOM 1.27 BSC 5.40 MAX 0.60 1.55 Notes: 1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing No. C04-2065-D3X Rev D  2020 - 2022 Microchip Technology Inc. and its subsidiaries DS20006436B-page 17 MIC38C42/43/44/45 14-Lead DIP Package Outline and Recommended Land Pattern Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging. DS20006436B-page 18  2020 - 2022 Microchip Technology Inc. and its subsidiaries MIC38C42/43/44/45 APPENDIX A: REVISION HISTORY Revision A (October 2020) • Converted Micrel document MIC38C42/43/44/45 to Microchip data sheet DS20006436A. • Minor text changes throughout. Revision B (February 2022) • Updated the Package Marking Information drawing with the most current marking information. • Updated the 14-Lead SOIC Package Outline and Recommended Land Pattern drawing with the most current file.  2020 - 2022 Microchip Technology Inc. and its subsidiaries DS20006436B-page 19 MIC38C42/43/44/45 NOTES: DS20006436B-page 20  2020 - 2022 Microchip Technology Inc. and its subsidiaries MIC38C42/43/44/45 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office. Device [-X] X XX [-XX] Part No. Product Feature Temp. Range Package Media Type Device: MIC38C4x: BiCMOS Current-Mode PWM Controller (See Selection Guide Below for PartSpecific Detail) MIC38C42: 96% Max. Duty Cycle, UVLO Threshold Startup 14.5V, Min. Operating 9V 96% Max. Duty Cycle, UVLO Threshold Startup 8.4V, Min. Operating 7.6V 50% Max. Duty Cycle, UVLO Threshold Startup 14.5V, Min. Operating 9V 50% Max. Duty Cycle, UVLO Threshold Startup 8.4V, Min. Operating 7.6V MIC38C43: MIC38C44: MIC38C45: Examples: a) MIC38C42: MIC38C42YM: MIC38C42-1YM MIC38C42YM-TR: MIC38C42-1YM-TR MIC38C42YMM: MIC38C42YMM-TR: MIC38C42-1YN MIC38C42YN b) MIC38C43: Product Feature: = 8-Lead 1 = 14-Lead Junction Temperature Range: Y Package: M = MM = N = Media Type: TR = 2,500/Reel = 95/Tube for 8-Lead M Package = 100/Tube for MM Package = 50/Tube for 8-Lead N Package = 25/Tube for 14-Lead N Package = 54/Tube for 14-Lead M Package = –40°C to +125°C, RoHS-Compliant SOIC Package MSOP Package DIP Package Selection Guide Duty Cycle UVLO Thresholds — Start-Up 8.4V Min. Operating 7.6V Start-Up 14.5V Min. Operating 9V 0% to 96% MIC38C43 MIC38C42 0% to 50% MIC38C45 MIC38C44 MIC38C43YM: MIC38C43-1YM MIC38C43YM-TR: MIC38C43-1YM-TR MIC38C43YMM: MIC38C43YMM-TR: MIC38C43-1YN MIC38C43YN c) MIC38C44: MIC38C44YM: MIC38C44-1YM MIC38C44YM-TR: MIC38C44-1YM-TR MIC38C44YMM: MIC38C44YMM-TR: MIC38C44-1YN MIC38C44YN d) MIC38C45: MIC38C45YM: MIC38C45-1YM MIC38C45YM-TR: MIC38C45-1YM-TR MIC38C45YMM: MIC38C45YMM-TR: MIC38C45-1YN MIC38C45YN Note 1:  2020 - 2022 Microchip Technology Inc. and its subsidiaries BiCMOS Current-Mode PWM Controller, 96% Max. Duty Cycle, UVLO Threshold Startup 14.5V, Min. Operating 9V, –40°C to +125°C Junction Temperature Range 8-Lead SOIC, 95/Tube 14-Lead SOIC, 54/Tube 8-Lead SOIC, 2,500/Reel 14-Lead SOIC, 2,500/Reel 8-Lead MSOP, 100/Tube 8-Lead MSOP, 2,500/Reel 14-Lead DIP, 25/Tube 8-Lead DIP, 50/Tube BiCMOS Current-Mode PWM Controller, 96% Max. Duty Cycle, UVLO Threshold Startup 8.4V, Min. Operating 7.6V, –40°C to +125°C Junction Temperature Range 8-Lead SOIC, 95/Tube 14-Lead SOIC, 54/Tube 8-Lead SOIC, 2,500/Reel 14-Lead SOIC, 2,500/Reel 8-Lead MSOP, 100/Tube 8-Lead MSOP, 2,500/Reel 14-Lead DIP, 25/Tube 8-Lead DIP, 50/Tube BiCMOS Current-Mode PWM Controller, 50% Max. Duty Cycle, UVLO Threshold Startup 14.5V, Min. Operating 9V, –40°C to +125°C Junction Temperature Range 8-Lead SOIC, 95/Tube 14-Lead SOIC, 54/Tube 8-Lead SOIC, 2,500/Reel 14-Lead SOIC, 2,500/Reel 8-Lead MSOP, 100/Tube 8-Lead MSOP, 2,500/Reel 14-Lead DIP, 25/Tube 8-Lead DIP, 50/Tube BiCMOS Current-Mode PWM Controller, 50% Max. Duty Cycle, UVLO Threshold Startup 8.4V, Min. Operating 7.6V, –40°C to +125°C Junction Temperature Range 8-Lead SOIC, 95/Tube 14-Lead SOIC, 54/Tube 8-Lead SOIC, 2,500/Reel 14-Lead SOIC, 2,500/Reel 8-Lead MSOP, 100/Tube 8-Lead MSOP, 2,500/Reel 14-Lead DIP, 25/Tube 8-Lead DIP, 50/Tube Tape and Reel identifier only appears in the catalog part number description. This identifier is used for ordering purposes and is not printed on the device package. Check with your Microchip Sales Office for package availability with the Tape and Reel option. DS20006436B-page 21 MIC38C42/43/44/45 NOTES: DS20006436B-page 22  2020 - 2022 Microchip Technology Inc. and its subsidiaries Note the following details of the code protection feature on Microchip products: • Microchip products meet the specifications contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is secure when used in the intended manner, within operating specifications, and under normal conditions. • Microchip values and aggressively protects its intellectual property rights. Attempts to breach the code protection features of Microchip product is strictly prohibited and may violate the Digital Millennium Copyright Act. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code. Code protection does not mean that we are guaranteeing the product is “unbreakable”. Code protection is constantly evolving. Microchip is committed to continuously improving the code protection features of our products. This publication and the information herein may be used only with Microchip products, including to design, test, and integrate Microchip products with your application. Use of this information in any other manner violates these terms. Information regarding device applications is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. Contact your local Microchip sales office for additional support or, obtain additional support at https:// www.microchip.com/en-us/support/design-help/client-supportservices. THIS INFORMATION IS PROVIDED BY MICROCHIP "AS IS". MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIED WARRANTIES OF NONINFRINGEMENT, MERCHANTABILITY, AND FITNESS FOR A PARTICULAR PURPOSE, OR WARRANTIES RELATED TO ITS CONDITION, QUALITY, OR PERFORMANCE. IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT, SPECIAL, PUNITIVE, INCIDENTAL, OR CONSEQUENTIAL LOSS, DAMAGE, COST, OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THE INFORMATION OR ITS USE, HOWEVER CAUSED, EVEN IF MICROCHIP HAS BEEN ADVISED OF THE POSSIBILITY OR THE DAMAGES ARE FORESEEABLE. TO THE FULLEST EXTENT ALLOWED BY LAW, MICROCHIP'S TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USE WILL NOT EXCEED THE AMOUNT OF FEES, IF ANY, THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FOR THE INFORMATION. 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Trademarks The Microchip name and logo, the Microchip logo, Adaptec, AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud, CryptoMemory, CryptoRF, dsPIC, flexPWR, HELDO, IGLOO, JukeBlox, KeeLoq, Kleer, LANCheck, LinkMD, maXStylus, maXTouch, MediaLB, megaAVR, Microsemi, Microsemi logo, MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, PolarFire, Prochip Designer, QTouch, SAM-BA, SenGenuity, SpyNIC, SST, SST Logo, SuperFlash, Symmetricom, SyncServer, Tachyon, TimeSource, tinyAVR, UNI/O, Vectron, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AgileSwitch, APT, ClockWorks, The Embedded Control Solutions Company, EtherSynch, Flashtec, Hyper Speed Control, HyperLight Load, IntelliMOS, Libero, motorBench, mTouch, Powermite 3, Precision Edge, ProASIC, ProASIC Plus, ProASIC Plus logo, QuietWire, SmartFusion, SyncWorld, Temux, TimeCesium, TimeHub, TimePictra, TimeProvider, TrueTime, WinPath, and ZL are registered trademarks of Microchip Technology Incorporated in the U.S.A. Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, Augmented Switching, BlueSky, BodyCom, CodeGuard, CryptoAuthentication, CryptoAutomotive, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, Espresso T1S, EtherGREEN, GridTime, IdealBridge, In-Circuit Serial Programming, ICSP, INICnet, Intelligent Paralleling, Inter-Chip Connectivity, JitterBlocker, Knob-on-Display, maxCrypto, maxView, memBrain, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, NVM Express, NVMe, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple Blocker, RTAX, RTG4, SAM-ICE, Serial Quad I/O, simpleMAP, SimpliPHY, SmartBuffer, SmartHLS, SMART-I.S., storClad, SQI, SuperSwitcher, SuperSwitcher II, Switchtec, SynchroPHY, Total Endurance, TSHARC, USBCheck, VariSense, VectorBlox, VeriPHY, ViewSpan, WiperLock, XpressConnect, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. The Adaptec logo, Frequency on Demand, Silicon Storage Technology, Symmcom, and Trusted Time are registered trademarks of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2020 - 2022, Microchip Technology Incorporated and its subsidiaries. All Rights Reserved. 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