MIC4420/9
6A Peak Low-Side MOSFET Driver
Bipolar/CMOS/DMOS Process
Features
General Description
• CMOS Construction
• Latch-Up Protected: Will Withstand >500 mA
Reverse Output Current
• Logic Input Withstands Negative Swing of Up to 5V
• Matched Rise and Fall Times: 25 ns
• High Peak Output Current: 6A Peak
• Wide Operating Range: 4.5V to 18V
• High Capacitive Load Drive: 10,000 pF
• Low Delay Time: 55 ns (typ.)
• Logic High Input for Any Voltage from 2.4V to VS
• Low Equivalent Input Capacitance: 6 pF (typ.)
• Low Supply Current: 450 μA with Logic 1 Input
• Low Output Impedance: 2.5Ω
• Output Voltage Swing within 25 mV of Ground or VS
MIC4420 and MIC4429 MOSFET drivers are tough,
efficient, and easy to use. The MIC4429 is an inverting
driver, while the MIC4420 is a non-inverting driver.
Applications
•
•
•
•
Switch Mode Power Supplies
Motor Controls
Pulse Transformer Driver
Class-D Switching Amplifiers
Package Types
MIC4420/9
8-Lead PDIP (N)
8-Lead SOIC (M)
8-Lead MSOP (MM)
VS 1
8 VS
IN 2
7 OUT
NC 3
6 OUT
GND 4
5 GND
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
They are capable of 6A (peak) output and can drive the
largest MOSFETs with an improved safe operating
margin. The MIC4420/4429 accepts any logic input
from 2.4V to VS without external speed-up capacitors
or resistor networks. Proprietary circuits allow the input
to swing negative by as much as 5V without damaging
the part. Additional circuits protect against damage
from electrostatic discharge.
MIC4420/4429 drivers can replace three or more
discrete
components,
reducing
PCB
area
requirements, simplifying product design, and reducing
assembly cost.
Modern BiCMOS/DMOS construction guarantees
freedom from latch-up. The rail-to-rail swing capability
insures adequate gate voltage to the MOSFET during
power-up/down sequencing.
Note: See MIC4120/4129 for high power and narrow
pulse applications.
MIC4420/9
5-Lead TO-220 (T)
5
4
3
2
1
OUT
GND
VS
GND
IN
DS20006092B-page 1
MIC4420/9
Functional Block Diagram
VS
0.4mA
MIC4429
IN V E R T I N G
0.1mA
OUT
IN
2k
MIC4420
NONINVERTING
GND
DS20006092B-page 2
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
MIC4420/9
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
Supply Voltage ..........................................................................................................................................................+20V
Input Voltage ............................................................................................................................. VS + 0.3V to GND – 5.0V
Input Current (VIN > VS) .......................................................................................................................................... 50 mA
Power Dissipation (TA ≤ 25°C)
PDIP..................................................................................................................................................................... 960 mW
SOIC ..................................................................................................................................................................1040 mW
5-Lead TO-220.............................................................................................................................................................2W
Power Dissipation (TC ≤ 25°C)
5-Lead TO-220........................................................................................................................................................12.5W
Derating Factors (to Ambient)
PDIP................................................................................................................................................................. 7.7 mW/°C
SOIC ................................................................................................................................................................8.3 mW/°C
5-Lead TO-220..................................................................................................................................................17 mW/°C
Operating Ratings ‡
Supply Voltage ........................................................................................................................................... +4.5V to +18V
† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at those or any other conditions above those indicated
in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended
periods may affect device reliability.
‡ Notice: The device is not guaranteed to function outside its operating ratings.
ELECTRICAL CHARACTERISTICS
Electrical Characteristics: TA = +25°C with 4.5V ≤ VS ≤ 18V, unless otherwise specified. Note 1
Parameter
Symbol
Min.
Typ.
Max.
Units
Conditions
VIH
2.4
1.4
—
V
—
INPUT
Logic 1 Input Voltage
Logic 0 Input Voltage
VIL
—
1.1
0.8
V
—
Input Voltage Range
VIN
–5
—
VS + 0.3
V
—
Input Current
IIN
–10
—
10
µA
0V ≤ VIN ≤ VS
Output High Voltage
VOH
VS –
0.025
—
—
V
See Figure 1-1
OUTPUT
Output Low Voltage
VOL
—
—
0.025
V
See Figure 1-1
Output Resistance, Output
Low
ROL
—
1.7
2.8
Ω
IOUT = 10 mA, VS = 18V
Output Resistance, Output
High
ROH
—
1.5
2.5
Ω
IOUT = 10 mA, VS = 18V
Peak Output Current
IPK
—
6
—
A
VS = 18V (See Figure 4-3)
Latch-Up Protection
Withstand Reverse Current
IR
>500
—
—
mA
—
tR
—
12
35
ns
Figure 1-1, CL = 2500 pF
Fall Time
tF
—
13
35
ns
Figure 1-1, CL = 2500 pF
Delay Time 1
tD1
—
18
75
ns
Figure 1-1
Delay Time 2
tD2
—
48
75
ns
Figure 1-1
SWITCHING TIME (Note 2)
Rise Time
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
DS20006092B-page 3
MIC4420/9
ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Characteristics: TA = +25°C with 4.5V ≤ VS ≤ 18V, unless otherwise specified. Note 1
Parameter
Symbol
Min.
Typ.
Max.
Units
—
—
4.5
Conditions
0.45
1.5
mA
VIN = 3V
90
150
µA
VIN = 0V
—
18
V
—
POWER SUPPLY
Power Supply Current
IS
Operating Input Voltage
VS
Note 1:
2:
Specification for packaged product only.
Switching times guaranteed by design.
ELECTRICAL CHARACTERISTICS
Electrical Characteristics: TA = –40°C to +85°C with 4.5V ≤ VS ≤ 18V, unless otherwise specified. Note 1
Parameter
Symbol
Min.
Typ.
Max.
Units
Conditions
VIH
2.4
—
—
V
—
INPUT
Logic 1 Input Voltage
Logic 0 Input Voltage
VIL
—
—
0.8
V
—
Input Voltage Range
VIN
–5
—
VS + 0.3
V
—
Input Current
IIN
–10
—
10
µA
0V ≤ VIN ≤ VS
Output High Voltage
VOH
VS –
0.025
—
—
V
See Figure 1-1
Output Low Voltage
VOL
—
—
0.025
V
See Figure 1-1
Output Resistance, Output
Low
ROL
—
3
5
Ω
IOUT = 10 mA, VS = 18V
Output Resistance, Output
High
ROH
—
2.3
5
Ω
IOUT = 10 mA, VS = 18V
OUTPUT
SWITCHING TIME (Note 2)
Rise Time
tR
—
32
60
ns
Figure 1-1, CL = 2500 pF
Fall Time
tF
—
34
60
ns
Figure 1-1, CL = 2500 pF
Delay Time 1
tD1
—
50
100
ns
Figure 1-1
Delay Time 2
tD2
—
65
100
ns
Figure 1-1
—
0.45
3.0
mA
VIN = 3V
—
0.06
0.4
µA
VIN = 0V
4.5
—
18
V
—
POWER SUPPLY
Power Supply Current
IS
Operating Input Voltage
VS
Note 1:
2:
Specification for packaged product only.
Switching times guaranteed by design.
DS20006092B-page 4
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
MIC4420/9
Test Circuits
VS = 18V
0.1μF
0.1μF
IN
MIC4429
INPUT
OUT
2500pF
5V
90%
2.5V
tP W 0.5μs
10%
0V
VS
90%
1.0μF
tD1
tP W
tF
tD2
tR
OUTPUT
10%
0V
FIGURE 1-1:
Inverting Driver Switching Time.
VS = 18V
0.1μF
0.1μF
IN
OUT
MIC4420
INPUT
5V
90%
2500pF
2.5V
tP W 0.5μs
10%
0V
VS
90%
1.0μF
tD1
tP W
tR
tD2
tF
OUTPUT
10%
0V
FIGURE 1-2:
Noninverting Driver Switching Time.
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
DS20006092B-page 5
MIC4420/9
TEMPERATURE SPECIFICATIONS (Note 1)
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Storage Temperature Range
TS
–65
—
+150
°C
—
Junction Operating Temperature
TJ
°C
—
Temperature Ranges
—
—
+150
–40
—
+85
B Version
Ambient Operating Temperature Range
TA
0
—
+70
Lead Temperature
—
—
—
+300
°C
Thermal Resistance, 8-Lead MSOP
JA
—
250
—
°C/W
—
°C
C Version
Soldering, 10s
Package Thermal Resistances
Thermal Resistance, 5-Lead TO-220
JC
—
10
—
°C/W
—
Thermal Resistance, 8-Lead PDIP
JA
—
125
—
°C/W
—
Thermal Resistance, 8-Lead SOIC
JA
—
155
—
°C/W
—
Note 1:
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +150°C rating. Sustained junction temperatures above +150°C can impact the device reliability.
DS20006092B-page 6
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
MIC4420/9
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
60
50
40
50
TIME (ns)
TIME (ns)
30
C L = 10,000 pF
40
30
C L = 4700 pF
VS = 5V
20
VS = 12V
20
10
C L = 2200 pF
VS = 18V
10
0
5
7
9
11
13
5
1000
15
3000
CAPACITIVE LOAD (pF)
VS (V)
FIGURE 2-1:
Voltage.
Rise Time vs. Supply
FIGURE 2-4:
Load.
50
10,000
Rise Time vs. Capacitive
50
40
40
30
30
C L = 4700 pF
20
TIME (ns)
TIME (ns)
C L = 10,000 pF
C L = 2200 pF
20
VS = 5V
VS = 12V
VS = 18V
10
10
0
5
7
FIGURE 2-2:
Voltage.
9
11
VS (V)
13
5
1000
15
Fall Time vs. Supply
FIGURE 2-5:
Load.
Fall Time vs. Capacitive
50
tD2
DELAY TIME (ns)
TIME (ns)
C L = 2200 pF
VS = 18V
15
t FALL
t RISE
10
5
0
–60
FIGURE 2-3:
Temperature.
10,000
60
25
20
3000
CAPACITIVE LOAD (pF)
40
30
20
tD1
10
–20
20
60
100
TEMPERATURE (°C)
140
Rise and Fall Times vs.
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
0
4
FIGURE 2-6:
Voltage.
6
8
10
12 14 16
SUPPLY VOLTAGE (V)
18
Delay Time vs. Supply
DS20006092B-page 7
MIC4420/9
60
1000
TIME (ns)
SUPPLY CURRENT (A)
t D2
50
40
30
t D1
20
10
–60
800
600
400
200
C L = 2200 pF
V S = 18V
–20
20
60
100
TEMPERATURE (°C)
FIGURE 2-7:
Temperature.
LOGIC “0” INPUT
0
140
Propagation Delay Time vs.
LOGIC “1” INPUT
0
8
12
16
SUPPLY VOLTAGE (V)
20
FIGURE 2-10:
Quiescent Power Supply
Voltage vs. Supply Current.
84
900
LOGIC “1” INPUT
VS = 18V
VS = 15V
70
SUPPLY CURRENT (A)
SUPPLY CURRENT (mA)
4
56
42
500 kHz
28
200 kHz
14
800
700
600
500
20 kHz
0
0
100
1000
CAPACITIVE LOAD (pF)
FIGURE 2-8:
Capacitive Load.
10,000
Supply Current vs.
400
–60
–20
20
60
100
TEMPERATURE (°C)
140
FIGURE 2-11:
Quiescent Power Supply
Current vs. Temperature.
5
1000
18V
100 mA
10V
100
5V
4
ROUT (W)
SUPPLY CURRENT (mA)
CL = 2200 pF
50 mA
10 mA
3
10
0
2
0
FIGURE 2-9:
Frequency.
DS20006092B-page 8
100
1000
FREQUENCY (kHz)
10,000
Supply Current vs.
5
FIGURE 2-12:
Resistance.
7
9
11
VS (V)
13
15
High-State Output
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
MIC4420/9
2.5
2.0
CROSSOVER AREA (A•s) x 10
-8
PER TRANSITION
ROUT (W)
2
100 mA
50 mA
1.5
10 mA
1
5
7
FIGURE 2-13:
Resistance.
9
11
VS (V)
13
15
Low-State Output
1.5
1.0
0.5
0
5
6
7 8 9 10 11 12 13 14 15
SUPPLY VOLTAGE V (V)
S
FIGURE 2-15:
Voltage.
Crossover Area vs. Supply
200
LOAD = 2200 pF
DELAY (ns)
160
120
INPUT 2.4V
INPUT 3.0V
80
INPUT 5.0V
40
INPUT 8V AND 10V
0
5
6
7
8
9 10 11 12 13 14 15
V (V)
S
FIGURE 2-14:
Effect of Input Amplitude on
Propagation Delay.
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
DS20006092B-page 9
MIC4420/9
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
Pin Number
TO-220
PIN FUNCTION TABLE
Pin Number
PDIP, SOIC,
MSOP
Pin Name
1
2
IN
2, 4
4, 5
GND
3, TAB
1, 8
VS
5
6, 7
OUT
—
3
NC
DS20006092B-page 10
Description
Control input.
Ground: Duplicate pins must be externally connected together.
Supply input: Duplicate pins must be externally connected together.
Output: Duplicate pins must be externally connected together.
Not connected.
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
MIC4420/9
4.0
APPLICATION INFORMATION
4.1
Supply Bypassing
4.2
The high current capability of the MIC4420/4429
demands careful PC board layout for best performance
Because the MIC4429 is an inverting driver, any
ground lead impedance will appear as negative
feedback which can degrade switching speed.
Feedback is especially noticeable with slow-rise time
inputs. The MIC4429 input structure includes 300 mV
of hysteresis to ensure clean transitions and freedom
from oscillation, but attention to layout is still
recommended.
Charging and discharging large capacitive loads
quickly requires large currents. For example, charging
a 2500 pF load to 18V in 25 ns requires a 1.8A current
from the device power supply.
The MIC4420/4429 has double bonding on the supply
pins, the ground pins and output pins This reduces
parasitic lead inductance. Low inductance enables
large currents to be switched rapidly. It also reduces
internal ringing that can cause voltage breakdown
when the driver is operated at or near the maximum
rated voltage.
Figure 4-1 shows the feedback effect in detail. As the
MIC4429 input begins to go positive, the output goes
negative and several amperes of current flow in the
ground lead. As little as 0.05Ω of PC trace resistance
can produce hundreds of millivolts at the MIC4429
ground pins. If the driving logic is referenced to power
ground, the effective logic input level is reduced and
oscillation may result.
Internal ringing can also cause output oscillation due to
feedback. This feedback is added to the input signal
because it is referenced to the same ground.
To guarantee low supply impedance over a wide
frequency range, a parallel capacitor combination is
recommended for supply bypassing. Low inductance
ceramic disk capacitors with short lead lengths (less
than 0.5 inch) should be used. A 1 μF low ESR film
capacitor in parallel with two 0.1 μF low ESR ceramic
capacitors, (such as AVX RAM GUARD®), provides
adequate bypassing. Connect one ceramic capacitor
directly between pins 1 and 4. Connect the second
ceramic capacitor directly between pins 8 and 5.
+15
Grounding
To ensure optimum performance, separate ground
traces should be provided for the logic and power
connections. Connecting the logic ground directly to
the MIC4429 GND pins will ensure full logic drive to the
input and ensure fast output switching. Both of the
MIC4429 GND pins should, however, still be connected
to power ground.
(x2) 1N4448
Output Voltage vs.
Load Current
5.6 k
30
560
0.1μF
50V
+
1
8
2
0.1μF
WIMA
MKS2
1μF
50V
MKS2
6, 7
BYV 10 (x 2)
+
MIC4429
5
4
220 μF 50V
+
35 μF 50V
UNITED CHEMCON SXE
FIGURE 4-1:
4.3
VOLTS
29
28
30 LINE
27
26
25
0
20
40
60
80
100 120 140
mA
Self-Contained Voltage Doubler.
Input Stage
The input voltage level of the 4429 changes the
quiescent supply current. The N channel MOSFET
input stage transistor drives a 450 μA current source
load. With a logic “1” input, the maximum quiescent
supply current is 450 μA. Logic “0” input level signals
reduce quiescent current to 55 μA maximum.
The MIC4420/4429 input is designed to provide
300 mV of hysteresis. This provides clean transitions,
reduces noise sensitivity, and minimizes output stage
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
current spiking when changing states. Input voltage
threshold level is approximately 1.5V, making the
device TTL compatible over the 4.5V to 18V operating
supply voltage range. Input current is less than 10 μA
over this range.
The MIC4429 can be directly driven by the TL494,
SG1526/1527, SG1524, TSC170, MIC38HC42, and
similar switch mode power supply integrated circuits.
By offloading the power-driving duties to the
DS20006092B-page 11
MIC4420/9
MIC4420/4429, the power supply controller can
operate at lower dissipation. This can improve
performance and reliability.
package, from the data sheet, is 250°C/W. In a 25°C
ambient, then, using a maximum junction temperature
of 150°C, this package will dissipate 500 mW.
The input can be greater than the +VS supply, however,
current will flow into the input lead. The propagation
delay for tD2 will increase to as much as 400 ns at room
temperature. The input currents can be as high as
30 mA peak-to-peak (6.4 mARMS) with the input, 6 V
greater than the supply voltage. No damage will occur
to MIC4420/4429 however, and it will not latch.
Accurate power dissipation numbers can be obtained
by summing the three sources of power dissipation in
the device:
The input appears as a 7 pF capacitance, and does not
change even if the input is driven from an AC source.
Care should be taken so that the input does not go
more than 5 volts below the negative rail.
+18 V
WIMA
MKS-2
1 μF
5.0V
1
8
6, 7
TE K C U R R E N T
PROBE 6302
18 V
0.1μF
4
LOGIC
GROUND
MIC4429 MAX. OPERATING
FREQUENCY
VS
Maximum Frequency
18V
500 kHz
15V
700 kHz
10V
1.6 MHz
2,500 pF
POLYCARBONATE
4.4.1
6 AMPS
300 mV
3&75$&(5(6,67$1&(
POWER
GROUND
FIGURE 4-2:
Switching Time Degradation
Due to Negative Feedback.
4.4
TABLE 4-1:
0V
5
0.1μF
Calculation of load power dissipation differs depending
on whether the load is capacitive, resistive or inductive.
Note 1:
MIC4429
0V
• Load power dissipation (PL)
• Quiescent power dissipation (PQ)
• Transition power dissipation (PT)
The supply current vs. frequency and supply current vs.
capacitive load characteristic curves aid in determining
power dissipation calculations. Table 4-1 lists the
maximum safe operating frequency for several power
supply voltages when driving a 2500 pF load. More
accurate power dissipation figures can be obtained by
summing the three dissipation sources.
Given the power dissipation in the device, and the
thermal resistance of the package, junction operating
temperature for any ambient is easy to calculate. For
example, the thermal resistance of the 8-pin MSOP
DS20006092B-page 12
RESISTIVE LOAD POWER
DISSIPATION
Dissipation caused by a resistive load can be
calculated as:
EQUATION 4-1:
2
PL = I RO D
Power Dissipation
CMOS circuits usually permit the user to ignore power
dissipation. Logic families such as 4000 and 74C have
outputs which can only supply a few milliamperes of
current, and even shorting outputs to ground will not
force enough current to destroy the device. The
MIC4420/4429 on the other hand, can source or sink
several amperes and drive large capacitive loads at
high frequency. The package power dissipation limit
can easily be exceeded. Therefore, some attention
should be given to power dissipation when driving low
impedance loads and/or operating at high frequency.
Conditions: DIP package (θJA =
130°C/W), TA = 25°C, CL = 2500 pF.
Where:
I
RO
D
4.4.2
= The current drawn by the load.
= The output resistance of the driver
when the output is high, at the power
supply voltage used.
= Fraction of the time the load is
conducting (duty cycle).
CAPACITIVE LOAD DISSIPATION
Dissipation caused by a capacitive load is simply the
energy placed in, or removed from, the load
capacitance by the driver. The energy stored in a
capacitor is described by Equation 4-2:
EQUATION 4-2:
E = 1/2C V
2
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
MIC4420/9
As this energy is lost in the driver each time the load is
charged or discharged, for power dissipation
calculations the 1/2 is removed. This equation also
shows that it is good practice not to place more voltage
on the capacitor than is necessary, as dissipation
increases as the square of the voltage applied to the
capacitor. For a driver with a capacitive load:
The two parts of the load dissipation must be summed
in to produce PL.
EQUATION 4-3:
4.4.4
PL = f C VS
2
Where:
f
= Operating frequency.
C
= Load capacitance.
VS
= Driver supply voltage.
4.4.3
INDUCTIVE LOAD POWER
DISSIPATION
For inductive loads the situation is more complicated.
For the part of the cycle in which the driver is actively
forcing current into the inductor, the situation is the
same as it is in the resistive case:
EQUATION 4-4:
EQUATION 4-6:
P L = P L1 + P L2
Quiescent power dissipation (PQ, as described in the
Input Stage section) depends on whether the input is
high or low. A low input will result in a maximum current
drain (per driver) of ≤0.2 mA; a logic high will result in a
current drain of ≤2.0 mA. Quiescent power can
therefore be found from:
EQUATION 4-7:
PQ = VS D IH + 1 – D IL
Where:
IH
= Quiescent current with input high.
IL
= Quiescent current with input low.
D
= Duty cycle.
VS
= Power supply voltage.
4.4.5
2
P L1 = I R O D
However, in this instance the RO required may be either
the on resistance of the driver when its output is in the
high state, or its on resistance when the driver is in the
low state, depending on how the inductor is connected,
and this is still only half the story. For the part of the
cycle when the inductor is forcing current through the
driver, dissipation is best described in Equation 4-5 in
which VD is the forward drop of the clamp diode in the
driver (generally around 0.7V).
EQUATION 4-5:
P L2 = I V D 1 – D
QUIESCENT POWER DISSIPATION
TRANSITION POWER DISSIPATION
Transition power is dissipated in the driver each time its
output changes state, because during the transition, for
a very brief interval, both the N- and P-channel
MOSFETs in the output totem-pole are ON
simultaneously, and a current is conducted through
them from +VS to ground. The transition power
dissipation is approximately:
EQUATION 4-8:
PT = 2 f VS A s
Where:
A•s = A time-current factor derived from the typical
characteristic curves.
Total power dissipation (PD), then, as previously
described, is:
EQUATION 4-9:
PD = PL + PQ + PT
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
DS20006092B-page 13
MIC4420/9
4.4.6
DEFINITIONS
driver’s load in Watts.
• PQ = Power dissipated in a quiescent driver in
Watts.
• PT = Power dissipated in a driver when the output
changes states (“shoot-through current”) in Watts.
Please note that the “shoot-through” current from
a dual transition (once up, once down) for both
drivers is shown by Figure 2-15 and is in
ampere-seconds. This figure must be multiplied
by the number of repetitions per second
(frequency) to find Watts.
• RO = Output resistance of a driver in Ohms.
• VS = Power supply voltage to the IC in Volts.
• CL = Load Capacitance in Farads.
• D = Duty Cycle expressed as the fraction of time
the input to the driver is high.
• f = Operating Frequency of the driver in Hertz.
• IH = Power supply current drawn by a driver when
both inputs are high and neither output is loaded.
• IL = Power supply current drawn by a driver when
both inputs are low and neither output is loaded.
• ID = Output current from a driver in Amps.
• PD = Total power dissipated in a driver in Watts.
• PL = Power dissipated in the driver due to the
+18 V
WIMA
MK22
1 μF
5.0V
1
8
2
6, 7
TE K C U R R E N T
PROBE 6302
18 V
MIC4429
0V
5
0.1μF
FIGURE 4-3:
DS20006092B-page 14
4
0V
0.1μF
10,000 pF
POLYCARBONATE
Peak Output Current Test Circuit.
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
MIC4420/9
5.0
PACKAGING INFORMATION
5.1
Package Marking Information
8-Lead PDIP*
Example
MIC
XXXXXX
WNNN
MIC
4420YN
9223
8-Lead SOIC*
Example
MIC
XXXXXX
WNNN
MIC
4420YM
9223
5-Lead TO-220*
MIC
XXXXXX
WNNN
Legend: XX...X
Y
YY
WW
NNN
e3
*
8-Lead MSOP* (front)
XXXX
XXX
8-Lead MSOP* (back)
WNNN
Example
4429
YMM
Example
9722
Example
MIC
4429ZT
9223
Product code or customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle
mark).
Note:
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information. Package may or may not include
the corporate logo.
Underbar (_) and/or Overbar (‾) symbol may not be to scale.
Note:
If the full seven-character YYWWNNN code cannot fit on the package, the following truncated codes are
used based on the available marking space:
6 Characters = YWWNNN; 5 Characters = WWNNN; 4 Characters = WNNN; 3 Characters = NNN; 2 Characters = NN; 1 Character = N
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
DS20006092B-page 15
MIC4420/9
5-Lead TO-220 Package Outline and Recommended Land Pattern
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
DS20006092B-page 16
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
MIC4420/9
8-Lead SOIC Package Outline and Recommended Land Pattern
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
DS20006092B-page 17
MIC4420/9
8-Lead MSOP Package Outline and Recommended Land Pattern
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
DS20006092B-page 18
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
MIC4420/9
8-Lead PDIP Package Outline and Recommended Land Pattern
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
DS20006092B-page 19
MIC4420/9
NOTES:
DS20006092B-page 20
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
MIC4420/9
APPENDIX A:
REVISION HISTORY
Revision A (October 2018)
• Converted Micrel document MIC4420/9 to Microchip data sheet DS20006092B.
• Minor text changes throughout.
Revision B (January 2022)
• Corrected Section 5.1 “Package Marking Information” device marking specification.
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
DS20006092B-page 21
MIC4420/9
NOTES:
DS20006092B-page 22
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
MIC4420/9
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
Device
X
XX
-XX
Part No.
Junction Temp.
Range
Package
Media Type
MIC4420:
Device:
MIC4429:
6A Peak Low-Side Non-Inverting MOSFET
Driver, Bipolar/CMOS/DMOS Process
6A Peak Low-Side Inverting MOSFET
Driver, Bipolar/CMOS/DMOS Process
Junction
Temperature
Range:
Y
Z
=
=
–40°C to +85°C, RoHS-Compliant
0°C to +70°C, RoHS-Compliant
Package:
N
M
MM
T
=
=
=
=
8-Lead PDIP
8-Lead SOIC
8-Lead MSOP
5-Lead TO-220
Media Type:
=
=
=
TR =
95/Tube (M, SOIC)
100/Tube (MM, MSOP)
50/Tube (N, PDIP & T, TO-220)
2,500/Reel (SOIC, MSOP)
Examples:
a) MIC4420: 6A Peak Low-Side Non-Inverting MOSFET
Driver, Industrial Grade –40°C to +85°C Junction Temperature Range, RoHS-Compliant.
•
•
•
•
•
MIC4420YM:
MIC4420YM-TR:
MIC4420YMM:
MIC4420YMM-TR:
MIC4420YN:
8-Lead SOIC, 95/Tube
8-Lead SOIC, 2,500/Reel
8-Lead MSOP, 100/Tube
8-Lead MSOP, 2,500/Reel
8-Lead PDIP, 50/Tube
b) MIC4420: 6A Peak Low-Side Non-Inverting MOSFET
Driver, Commercial Grade 0°C to +70°C Junction Temperature Range, RoHS-Compliant.
•
•
•
•
MIC4420ZM:
MIC4420ZM-TR:
MIC4420ZN:
MIC4420ZT:
8-Lead SOIC, 95/Tube
8-Lead SOIC, 2,500/Reel
8-Lead PDIP, 50/Tube
5-Lead TO-220, 50/Tube
c) MIC4429: 6A Peak Low-Side Inverting MOSFET Driver,
Industrial Grade –40°C to +85°C Junction Temperature
Range, RoHS-Compliant.
•
•
•
•
•
MIC4429YM:
MIC4429YM-TR:
MIC4429YMM:
MIC4429YMM-TR:
MIC4429YN:
8-Lead SOIC, 95/Tube
8-Lead SOIC, 2,500/Reel
8-Lead MSOP, 100/Tube
8-Lead MSOP, 2,500/Reel
8-Lead PDIP, 50/Tube
d) MIC4429: 6A Peak Low-Side Inverting MOSFET Driver,
Commercial Grade 0°C to +70°C Junction Temperature
Range, RoHS-Compliant.
•
•
•
•
MIC4429ZM:
MIC4429ZM-TR:
MIC4429ZN:
MIC4429ZT:
Note 1:
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
8-Lead SOIC, 95/Tube
8-Lead SOIC, 2,500/Reel
8-Lead PDIP, 50/Tube
5-Lead TO-220, 50/Tube
Tape and Reel identifier only appears in the
catalog part number description. This identifier is
used for ordering purposes and is not printed on
the device package. Check with your Microchip
Sales Office for package availability with the
Tape and Reel option.
DS20006092B-page 23
MIC4420/9
NOTES:
DS20006092B-page 24
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
Note the following details of the code protection feature on Microchip products:
•
Microchip products meet the specifications contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is secure when used in the intended manner, within operating specifications, and
under normal conditions.
•
Microchip values and aggressively protects its intellectual property rights. Attempts to breach the code protection features of
Microchip product is strictly prohibited and may violate the Digital Millennium Copyright Act.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code. Code protection does not
mean that we are guaranteeing the product is “unbreakable”. Code protection is constantly evolving. Microchip is committed to
continuously improving the code protection features of our products.
This publication and the information herein may be used only
with Microchip products, including to design, test, and integrate
Microchip products with your application. Use of this information in any other manner violates these terms. Information
regarding device applications is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your
specifications. Contact your local Microchip sales office for
additional support or, obtain additional support at https://
www.microchip.com/en-us/support/design-help/client-supportservices.
THIS INFORMATION IS PROVIDED BY MICROCHIP "AS IS".
MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED,
WRITTEN OR ORAL, STATUTORY OR OTHERWISE,
RELATED TO THE INFORMATION INCLUDING BUT NOT
LIMITED TO ANY IMPLIED WARRANTIES OF NONINFRINGEMENT, MERCHANTABILITY, AND FITNESS FOR A
PARTICULAR PURPOSE, OR WARRANTIES RELATED TO
ITS CONDITION, QUALITY, OR PERFORMANCE.
IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT, SPECIAL, PUNITIVE, INCIDENTAL, OR CONSEQUENTIAL LOSS, DAMAGE, COST, OR EXPENSE OF ANY
KIND WHATSOEVER RELATED TO THE INFORMATION OR
ITS USE, HOWEVER CAUSED, EVEN IF MICROCHIP HAS
BEEN ADVISED OF THE POSSIBILITY OR THE DAMAGES
ARE FORESEEABLE. TO THE FULLEST EXTENT
ALLOWED BY LAW, MICROCHIP'S TOTAL LIABILITY ON
ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION
OR ITS USE WILL NOT EXCEED THE AMOUNT OF FEES, IF
ANY, THAT YOU HAVE PAID DIRECTLY TO MICROCHIP
FOR THE INFORMATION.
Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to
defend, indemnify and hold harmless Microchip from any and
all damages, claims, suits, or expenses resulting from such
use. No licenses are conveyed, implicitly or otherwise, under
any Microchip intellectual property rights unless otherwise
stated.
Trademarks
The Microchip name and logo, the Microchip logo, Adaptec,
AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud,
CryptoMemory, CryptoRF, dsPIC, flexPWR, HELDO, IGLOO,
JukeBlox, KeeLoq, Kleer, LANCheck, LinkMD, maXStylus,
maXTouch, MediaLB, megaAVR, Microsemi, Microsemi logo,
MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower,
PICSTART, PIC32 logo, PolarFire, Prochip Designer, QTouch,
SAM-BA, SenGenuity, SpyNIC, SST, SST Logo, SuperFlash,
Symmetricom, SyncServer, Tachyon, TimeSource, tinyAVR, UNI/O,
Vectron, and XMEGA are registered trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
AgileSwitch, APT, ClockWorks, The Embedded Control Solutions
Company, EtherSynch, Flashtec, Hyper Speed Control, HyperLight
Load, IntelliMOS, Libero, motorBench, mTouch, Powermite 3,
Precision Edge, ProASIC, ProASIC Plus, ProASIC Plus logo, QuietWire, SmartFusion, SyncWorld, Temux, TimeCesium, TimeHub,
TimePictra, TimeProvider, TrueTime, WinPath, and ZL are
registered trademarks of Microchip Technology Incorporated in the
U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, Augmented Switching, BlueSky,
BodyCom, CodeGuard, CryptoAuthentication, CryptoAutomotive,
CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net,
Dynamic Average Matching, DAM, ECAN, Espresso T1S,
EtherGREEN, GridTime, IdealBridge, In-Circuit Serial
Programming, ICSP, INICnet, Intelligent Paralleling, Inter-Chip
Connectivity, JitterBlocker, Knob-on-Display, maxCrypto, maxView,
memBrain, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo,
MPLIB, MPLINK, MultiTRAK, NetDetach, NVM Express, NVMe,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple
Blocker, RTAX, RTG4, SAM-ICE, Serial Quad I/O, simpleMAP,
SimpliPHY, SmartBuffer, SmartHLS, SMART-I.S., storClad, SQI,
SuperSwitcher, SuperSwitcher II, Switchtec, SynchroPHY, Total
Endurance, TSHARC, USBCheck, VariSense, VectorBlox, VeriPHY,
ViewSpan, WiperLock, XpressConnect, and ZENA are trademarks
of Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
The Adaptec logo, Frequency on Demand, Silicon Storage
Technology, Symmcom, and Trusted Time are registered
trademarks of Microchip Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology Germany
II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in
other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2018 - 2022, Microchip Technology Incorporated and its subsidiaries.
All Rights Reserved.
For information regarding Microchip’s Quality Management Systems,
please visit www.microchip.com/quality.
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
ISBN: 978-1-5224-9377-8
DS20006092B-page 25
Worldwide Sales and Service
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DS20006092B-page 26
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