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MIC4452ZT

MIC4452ZT

  • 厂商:

    ACTEL(微芯科技)

  • 封装:

    TO220-5

  • 描述:

    IC GATE DRVR LOW-SIDE TO220-5

  • 数据手册
  • 价格&库存
MIC4452ZT 数据手册
MIC4451/52 12A Peak Low-Side MOSFET Drivers Features General Description • BiCMOS/DMOS Construction • Latch-Up Proof: Fully Isolated Process is Inherently Immune to Any Latch-Up • Input Will Withstand Negative Swing of up to 5V • Matched Rise and Fall Times: 25 ns • High Peak Output Current: 12A • Wide Operating Range: 4.5V to 18V • High Capacitive Load Drive: 62,000 pF • Low Delay Time: 30 ns (typ.) • Logic High Input for Any Voltage from 2.4V to VS • Low Supply Current 450 µA with Logic 1 Input • Low Output Impedance: 1.0Ω • Output Voltage Swing to within 25 mV of GND or VS • Low Equivalent Input Capacitance: 7 pF (typ.) The MIC4451 and MIC4452 CMOS MOSFET drivers are robust, efficient, and easy to use. The MIC4451 is an inverting driver, while the MIC4452 is a non-inverting driver. Applications • • • • • • • • Switch Mode Power Supplies Motor Controls Pulse Transformer Driver Class-D Switching Amplifier Line Drivers Driving MOSFET or IGBT Parallel Chip Modules Local Power ON/OFF Switch Pulse Generators Both versions are capable of 12A (peak) output and can drive the largest MOSFETs with an improved safe operating margin. The MIC4451/52 accept any logic input from 2.4V to VS without external speed-up capacitors or resistor networks. Proprietary circuits allow the input to swing negative by as much as 5V without damaging the part. Additional circuits protect against damage from electrostatic discharge. MIC4451/52 drivers can replace three or more discrete components, reducing PCB area requirements, simplifying product design, and reducing assembly cost. Modern Bipolar/CMOS/DMOS construction ensures freedom from latch-up. The rail-to-rail swing capability of CMOS/DMOS ensures adequate gate voltage to the MOSFET during power up/down sequencing. Because these devices are fabricated on a self-aligned process, they have very low crossover current, run cool, use little power, and are easy to drive. Package Types MIC4451, MIC4452 8-Lead SOIC (M) 8-Lead PDIP (N) (Top View) VS 1 8 VS IN 2 7 OUT NC 3 6 OUT GND 4 5 GND  2021 Microchip Technology Inc. and its subsidiaries MIC4451, MIC4452 5-Lead TO-220 (T) (Top View) 5 4 3 2 1 OUT GND VS GND IN DS20006616A-page 1 MIC4451/52 Functional Block Diagram VS 0.3mA MIC4451 INVERTING 0.1mA OUT IN 2kŸ MIC4452 NONINVERTING GND DS20006616A-page 2  2021 Microchip Technology Inc. and its subsidiaries MIC4451/52 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings † Supply Voltage ..........................................................................................................................................................+20V Input Voltage ................................................................................................................................ VS + 0.3V to GND – 5V Input Current (VIN > VS) ............................................................................................................................................5 mA Power Dissipation (TA ≤ 25°C) PDIP.................................................................................................................................................................960 mW SOIC ..............................................................................................................................................................1040 mW TO-220 .....................................................................................................................................................................2W Power Dissipation (TCASE ≤ 25°C) TO-220 ................................................................................................................................................................12.5W Derating Factors (to Ambient) PDIP.............................................................................................................................................................7.7 mW/°C SOIC ............................................................................................................................................................8.3 mW/°C TO-220 ..........................................................................................................................................................17 mW/°C † Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended periods may affect device reliability. Static-sensitive device. Store only in conductive containers. Handling personnel and equipment should be grounded to prevent damage from static discharge. ELECTRICAL CHARACTERISTICS Electrical Characteristics: TA = +25°C, with 4.5V ≤ VS ≤ 18V unless otherwise specified. Parameter Symbol Min. Typ. Max. Units Conditions Logic 1 Input Voltage VIH 2.4 1.3 — V — Logic 0 Input Voltage VIL — 1.1 0.8 V — V — Input Input Voltage Range VIN –5 — VS + 0.3 Input Current IIN –10 — 10 µA 0V ≤ VIN ≤ VS High Output Voltage VOH VS – 0.025 — — V See Figure 1-1. Output Low Output Voltage VOL — — 0.025 V See Figure 1-1. Output Resistance, Output High RO — 0.6 1.5 Ω IOUT = 10 mA, VS = 18V Output Resistance, Output Low RO — 0.8 1.5 Ω IOUT = 10 mA, VS = 18V Peak Output Current IPK — 12 — A VS = 18V, see Figure 1-3 Continuous Output Current IDC 2 — — A — Latch-up Protection Withstand Reverse Current IR >1500 — — mA Duty Cycle ≤ 2%, t ≤ 300 μs tR — 20 40 ns See Figure 1-1. CL = 15,000 pF Fall Time tF — 24 50 ns See Figure 1-1. CL = 15,000 pF Delay Time tD1 — 25 50 ns See Figure 1-1. Delay Time tD2 — 40 60 ns See Figure 1-1. Switching Time (Note 1) Rise Time  2021 Microchip Technology Inc. and its subsidiaries DS20006616A-page 3 MIC4451/52 ELECTRICAL CHARACTERISTICS (CONTINUED) Electrical Characteristics: TA = +25°C, with 4.5V ≤ VS ≤ 18V unless otherwise specified. Parameter Symbol Min. Typ. Max. Units — — 4.5 Conditions 0.4 1.5 mA VIN = 3V 80 150 µA VIN = 0V — 18 V — Power Supply Power Supply Current IS Operating Input Voltage VS Note 1: Specification for packaged product only. ELECTRICAL CHARACTERISTICS Electrical Characteristics: Over operating temperature range with 4.5V ≤ VS ≤ 18V unless otherwise specified. Parameter Symbol Min. Typ. Max. Units Conditions Input Logic 1 Input Voltage VIH 2.4 — — V — Logic 0 Input Voltage VIL — — 0.8 V — Input Voltage Range VIN –5 — VS + 0.3 V — Input Current IIN –10 — 10 µA 0V ≤ VIN ≤ VS High Output Voltage VOH VS – 0.025 — — V See Figure 1-1. Low Output Voltage VOL — — 0.025 V See Figure 1-1. Output Resistance, Output High RO — — 2.2 Ω IOUT = 10 mA, VS = 18V Output Resistance, Output Low RO — — 2.2 Ω IOUT = 10 mA, VS = 18V Rise Time tR — — 50 ns See Figure 1-1. CL = 15,000 pF Fall Time tF — — 60 ns See Figure 1-1. CL = 15,000 pF Delay Time tD1 — — 65 ns See Figure 1-1. Delay Time tD2 — — 80 ns See Figure 1-1. — — 3 — — 0.4 4.5 — 18 Output Switching Time (Note 1) Power Supply Power Supply Current IS Operating Input Voltage VS Note 1: mA V VIN = 3V VIN = 0V — Specification for packaged product only. DS20006616A-page 4  2021 Microchip Technology Inc. and its subsidiaries MIC4451/52 TEMPERATURE SPECIFICATIONS (Note 1) Parameters Sym. Min. Typ. Max. Units Conditions 0 — +70 °C Z Ordering Option –40 — +85 °C Y Ordering Option –40 — +125 °C V Ordering Option Temperature Ranges Ambient Operating Temperature Range TA Storage Temperature Range TS –65 — +150 °C — Chip Operating Temperature — — — +150 °C — Lead Temperature — — — +300 °C Soldering, 10 sec. θJC — 10 — °C/W Package Thermal Resistance Thermal Resistance, TO-220 5-Ld Note 1: — The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability. Test Circuits FIGURE 1-1: Time. Inverting Driver Switching FIGURE 1-3: Peak Output Current Test Circuit.  2021 Microchip Technology Inc. and its subsidiaries FIGURE 1-2: Switching Time. Non-Inverting Driver DS20006616A-page 5 MIC4451/52 2.0 Note: TYPICAL PERFORMANCE CURVES The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. FIGURE 2-1: Voltage. Rise Time vs. Supply FIGURE 2-4: Load. Rise Time vs. Capacitive FIGURE 2-2: Voltage. Fall Time vs. Supply FIGURE 2-5: Load. Fall Time vs. Capacitive FIGURE 2-3: Temperature. Rise and Fall Times vs. FIGURE 2-6: Supply Voltage. Crossover Energy vs. DS20006616A-page 6  2021 Microchip Technology Inc. and its subsidiaries MIC4451/52 FIGURE 2-7: Capacitive Load. Supply Current vs. FIGURE 2-10: Frequency. Supply Current vs. FIGURE 2-8: Capacitive Load. Supply Current vs. FIGURE 2-11: Frequency. Supply Current vs. FIGURE 2-9: Capacitive Load. Supply Current vs. FIGURE 2-12: Frequency. Supply Current vs.  2021 Microchip Technology Inc. and its subsidiaries DS20006616A-page 7 MIC4451/52 FIGURE 2-13: vs. Temperature. FIGURE 2-16: Amplitude. Propagation Delay vs. Input FIGURE 2-14: High-State Output Resistance vs. Supply Voltage. FIGURE 2-17: Amplitude. Propagation Delay vs. Input FIGURE 2-15: Low-State Output Resistance vs. Supply Voltage. FIGURE 2-18: Temperature. Propagation Delay vs. Input DS20006616A-page 8 Quiescent Supply Current  2021 Microchip Technology Inc. and its subsidiaries MIC4451/52 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. TABLE 3-1: Pin Number TO-220 PIN FUNCTION TABLE Pin Number SOIC/PDIP Pin Name 1 2 IN 2, 4 4, 5 GND 3, TAB 1, 8 VS 5 6, 7 OUT — 3 NC  2021 Microchip Technology Inc. and its subsidiaries Description Control Input. Ground: Duplicate Pins must be externally connected together. Supply Input: Duplicate pins must be externally connected together. Output: Duplicate pins must be externally connected together. Not Connected. DS20006616A-page 9 MIC4451/52 4.0 APPLICATIONS INFORMATION 4.1 Supply Bypassing Charging and discharging large capacitive loads quickly requires large currents. For example, changing a 10,000 pF load to 18V in 50 ns requires 3.6A. The MIC4451 and MIC4452 have double bonding on the supply pins, the ground pins, and output pins. This reduces parasitic lead inductance. Low inductance enables large currents to be switched rapidly. It also reduces internal ringing that can cause voltage breakdown when the driver is operated at or near the maximum rated voltage. Internal ringing can also cause output oscillation due to feedback. This feedback is added to the input signal because it is referenced to the same ground. To ensure low supply impedance over a wide frequency range, a parallel capacitor combination is recommended for supply bypassing. Low inductance ceramic disc capacitors with short lead lengths (
MIC4452ZT 价格&库存

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