MIC4467/8/9
Quad 1.2A Peak Low-Side MOSFET Drivers
Features
General Description
• Reliable, Low-Power Bipolar/CMOS/DMOS
Construction
• Latch-Up Protected to >500 mA Reverse Current
• Logic Input withstands Swing to –5V
• High 3A Peak Output Current
• Wide 4.5V to 18V Operating Range
• Symmetrical Rise and Fall Times
• Short 500
—
—
mA
—
Rise Time
tR
—
14
25
ns
Figure 1-1
Fall time
tF
—
13
25
ns
Figure 1-1
tD1
—
30
75
ns
Figure 1-1
tD2
—
45
75
ns
Figure 1-1
IS
—
0.2
4
mA
—
Latch-Up Protection Withstand
Reverse Current
Switching Time
Delay Time
Power Supply
Power Supply Current
Note 1:
Specification for packaged product only.
2022 Microchip Technology Inc. and its subsidiaries
DS20006614A-page 3
MIC4467/8/9
ELECTRICAL CHARACTERISTICS
Electrical Characteristics: Measured over operating temperature range with 4.5V ≤ VS ≤ 18V unless otherwise
specified. (Note 1)
Parameter
Symbol
Min.
Typ.
Max.
Units
Conditions
Logic 1 Input Voltage
VIH
2.4
1.4
—
V
—
Logic 0 Input Voltage
VIL
—
1.0
0.8
V
—
Input Current
IIN
–1
—
1
µA
0V ≤ VIN ≤ VS
High Output Voltage
VOH
VS - 0.3
—
—
V
ILOAD = 10 mA
Low Output Voltage
VOL
—
—
0.3
V
ILOAD = 10 mA
Output Resistance
RO
—
7
30
Ω
IOUT = 10 mA, VS = 18V
Peak Output Current
IPK
—
1.2
—
A
—
I
500
—
—
mA
—
tR
—
17
50
ns
Figure 1-1
Input
Output
Latch-Up Protection Withstand
Reverse Current
Switching Time
Rise Time
Fall time
Delay Time
Power Supply
Power Supply Current
Note 1:
tF
—
16
50
ns
Figure 1-1
tD1
—
35
100
ns
Figure 1-1
tD2
—
55
100
ns
Figure 1-1
IS
—
0.4
8
mA
—
Specification for packaged product only.
TEMPERATURE SPECIFICATIONS (Note 1)
Parameters
Symbol
Min.
Typ.
Max.
Units
Conditions
–40
—
+85
°C
Temperature Range
Device: Y
0
—
+70
°C
Temperature Range
Device: Z
Temperature Ranges
Operating Ambient Temperature
TA
Maximum Junction Temperature
TJ
—
—
+150
°C
—
Storage Temperature Range
TS
–65
—
+150
°C
—
TLEAD
—
—
+300
°C
Soldering, 10 sec.
Thermal Resistance 14-Lead PDIP
JA
—
80
—
Thermal Resistance 16-Lead Wide SOIC
JA
—
120
—
Lead Temperature
Package Thermal Resistances
Note 1:
°C/W
—
—
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA).
DS20006614A-page 4
2022 Microchip Technology Inc. and its subsidiaries
MIC4467/8/9
Test Circuits
INVE RTING INPU T
+5V
V INPUT
90%
1 μF FILM
0.1 μF CERAMIC
10%
V OUTPUT
18V
tD1
tD2
tF
tR
90%
90%
10%
0V
IN2
10%
IN2
NON-INVE RTING INPU T
+5V
IN3
IN3
90%
V INPUT
10%
18V
V OUTPUT
IN4
tD1
90%
10%
0V
FIGURE 1-1:
VOUT
470 pF
IN1
IN1
tR
IN4
90%
tD2
tF
10%
Inverting and Non-Inverting Input.
1500
+5V TO +15V
1250
14-PIN PDIP
SLOPE = –12 mW/°C
MIC4467
PD (mW)
1000
CW
CCW
DC BRUSH
MOTOR
750
500
250
0
25
FIGURE 1-2:
PWM SPEED
16-PIN WIDE SOIC
SLOPE = –8 mW/°C
GND
50
75
100
125
AMBIENT TEMPERATURE (°C)
150
Package Power Dissipation.
2022 Microchip Technology Inc. and its subsidiaries
FIGURE 1-3:
Quad Driver Drives H Bridge
to Control motor Speed and Direction.
DS20006614A-page 5
MIC4467/8/9
2.0
Note:
TYPICAL PERFORMANCE CURVES
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
FIGURE 2-1:
Supply Voltage.
Rise and Fall Time vs.
FIGURE 2-4:
Temperature.
Delay Time vs.
FIGURE 2-2:
Voltage.
Delay Time vs. Supply
FIGURE 2-5:
Capacitive Load.
Supply Current vs.
FIGURE 2-3:
Temperature.
Rise and Fall Time vs.
FIGURE 2-6:
Capacitive Load.
Rise and Fall Time vs.
DS20006614A-page 6
2022 Microchip Technology Inc. and its subsidiaries
MIC4467/8/9
SUPPLY CURRENT (mA)
2.5
2.0
1.5
1.0
NO LOAD
BOTH INPUTS LOGIC "1"
TA = 25 °C
0.5
0
0
5
10
15
20
SUPPLY VOLTAGE (V)
FIGURE 2-7:
Frequency.
Supply Current vs.
FIGURE 2-10:
Quiescent Power Supply
Current vs. Supply Voltage.
SUPPLY CURRENT (μA)
400
300
200
150
NO LOAD
BOTH INPUTS LOGIC "0"
TA = 25 °C
100
50
0
0
FIGURE 2-8:
High Output vs. Current.
FIGURE 2-9:
Low Output vs. Current.
2022 Microchip Technology Inc. and its subsidiaries
5
10
15
SUPPLY VOLTAGE (V)
20
FIGURE 2-11:
Quiescent Power Supply
Current vs. Supply Voltage.
DS20006614A-page 7
MIC4467/8/9
3.0
PIN DESCRIPTIONS
Package Types
14-Pin DIP (N)
16-Pin Wide SOIC (WM)
14 VS
1A
1
16
VS
1B 2
13 1Y
1B
2
15
VS
2A 3
12 2Y
2A
3
14
1Y
2B
4
13
2Y
3A
5
12
3Y
3B
6
11
4Y
1A 1
2B 4
11 3Y
3A 5
10 4Y
3B 6
9
4B
GND
7
10
4B
GND 7
8
4A
GND
8
9
4A
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
Pin Number
DIP
Pin Number
Wide SOIC
Pin Name
1
1
1A
Input A for Driver 1. TTL/CMOS Compatible Input
2
2
1B
Input B for Driver 1. TTL/CMOS Compatible Input
3
3
2A
Input A for Driver 2. TTL/CMOS Compatible Input
4
4
2B
Input B for Driver 2. TTL/CMOS Compatible Input
5
5
3A
Input A for Driver 3. TTL/CMOS Compatible Input
6
6
3B
Input B for Driver 3. TTL/CMOS Compatible Input
7
7
GND
8
—
4A
—
8
GND
9
—
4B
Input B for Driver 4. TTL/CMOS Compatible Input
Description
Ground
Input A for Driver 4. TTL/CMOS Compatible Input
Ground
—
9
4A
Input A for Driver 4. TTL/CMOS Compatible Input
10
—
4Y
Output for Driver 4, CMOS Push-Pull Output
—
10
4B
Input B for Driver 4. TTL/CMOS Compatible Input
11
—
3Y
Output for Driver 3, CMOS Push-Pull Output
—
11
4Y
Output for Driver 4, CMOS Push-Pull Output
12
—
2Y
Output for Driver 2, CMOS Push-Pull Output
—
12
3Y
Output for Driver 3, CMOS Push-Pull Output
13
—
1Y
Output for Driver 1, CMOS Push-Pull Output
—
13
2Y
Output for Driver 2, CMOS Push-Pull Output
14
—
VS
Supply Input, 4.5V to 18V
—
14
1Y
Output for Driver 1, CMOS Push-Pull Output
—
15
VS
Supply Input, 4.5V to 18V
—
16
VS
Supply Input, 4.5V to 18V
DS20006614A-page 8
2022 Microchip Technology Inc. and its subsidiaries
MIC4467/8/9
3.1
Truth Table
TABLE 3-2:
TRUTH TABLE
Part No.
MIC4467
(Each Driver)
MIC4468
(Each Driver)
MIC4469
(Each Driver)
Inputs
Output
A
B
Y
L
X
H
X
L
H
H
H
L
H
H
H
L
X
L
X
L
L
L
X
L
X
H
L
H
L
H
2022 Microchip Technology Inc. and its subsidiaries
DS20006614A-page 9
MIC4467/8/9
4.0
PACKAGING INFORMATION
4.1
Package Marking Information
16-Lead PDIP*
Example
XXX
MIC
XXXXXXXXX
MIC4467ZN
1978
WNNN
16-Lead Wide SOIC*
Example
XXXXX
MICREL
XXXXXXXXXX
MIC4469ZWM
WNNN
1985
Legend: XX...X
Y
YY
WW
NNN
e3
*
Product code or customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle
mark).
Note:
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information. Package may or may not include
the corporate logo.
Underbar (_) and/or Overbar (‾) symbol may not be to scale.
Note:
If the full seven-character YYWWNNN code cannot fit on the package, the following truncated codes are
used based on the available marking space:
6 Characters = YWWNNN; 5 Characters = WWNNN; 4 Characters = WNNN; 3 Characters = NNN;
2 Characters = NN; 1 Character = N
DS20006614A-page 10
2022 Microchip Technology Inc. and its subsidiaries
MIC4467/8/9
14-Lead Plastic DIP Package Outline and Recommended Land Pattern
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
2022 Microchip Technology Inc. and its subsidiaries
DS20006614A-page 11
MIC4467/8/9
16-Lead Wide SOIC Package Outline and Recommended Land Pattern
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
DS20006614A-page 12
2022 Microchip Technology Inc. and its subsidiaries
MIC4467/8/9
APPENDIX A:
REVISION HISTORY
Revision A (May 2022)
• Converted Micrel document MIC4467/8/9 to
Microchip data sheet DS20006614A.
• Minor text changes throughout.
2022 Microchip Technology Inc. and its subsidiaries
DS20006614A-page 13
MIC4467/8/9
NOTES:
DS20006614A-page 14
2022 Microchip Technology Inc. and its subsidiaries
MIC4467/8/9
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
PART NO.
X
XX
–XX
Device
Temperature
Range
Package
Media Type
MIC4467: Quad 1.2A-Peak Low-Side MOSFET Driver
with Bi-Polar/CMOS/DMOS Process featuring NAND Input Logic
Device:
MIC4468: Quad 1.2A-Peak Low-Side MOSFET Driver
with Bi-Polar/CMOS/DMOS Process
featuring AND Input Logic
MIC4469: Quad 1.2A-Peak Low-Side MOSFET Driver
with Bi-Polar/CMOS/DMOS Process
featuring AND with 1 Inverting Input Logic
Temperature Range:
Y
=
Z
=
–40°C to +85°C, Industrial
(RoHs Compliant)
0°C to +70°C, Commercial
(RoHs Compliant)
Package:
N
=
WM =
Media Type:
= 25/Tube (N, PDIP)
= 47/Tube (WM, SOIC)
TR
= 1,000/Reel (WM, SOIC)
Examples:
a) MIC4467:
1.2A-Peak, Quad Low-Side MOSFET
Driver, NAND Input Logic, –40°C to
+85°C Industrial Temperature Range,
RoHS Compliant
MIC4467YWM
16-Lead SOIC Wide Package, 47/Tube
MIC4467YWM-TR
16-Lead SOIC Wide Package, 1,000/Reel
b) MIC4467:
1.2A-Peak, Quad Low-Side MOSFET
Driver, NAND Input Logic, 0°C to +70°C
Commercial Temperature Range, RoHS
Compliant
MIC4467ZN
14-Lead PDIP Package, 25/Tube
MIC4467ZWM
16-Lead SOIC Wide Package, 47/Tube
MIC4467ZWM-TR
16-Lead SOIC Wide Package, 1000/Reel
c) MIC4468:
1.2A-Peak, Quad Low-Side MOSFET
Driver, AND Input Logic, –40°C to +85°C
Industrial Temperature Range, RoHS
Compliant
MIC4468YN
14-Lead PDIP Package, 25/Tube
MIC4468YWM
16-Lead SOIC Wide Package, 47/Tube
MIC4468YWM-TR
16-Lead SOIC Wide Package, 1,000/Reel
d) MIC4468:
1.2A-Peak, Quad Low-Side MOSFET
Driver, AND Input Logic, 0°C to +70°C
Commercial Temperature Range, RoHS
Compliant
MIC4468ZN
14-Lead PDIP Package, 25/Tube
MIC4468ZWM
16-Lead SOIC Wide Package, 47/Tube
14-Lead PDIP
16-Lead SOIC (Wide Body)
MIC4468ZWM-TR
16-Lead SOIC Wide Package, 1,000/Reel
MIC4469:
1.2A-Peak, Quad Low-Side MOSFET
Driver, AND with 1 Inverting Input Logic,
–40°C to +85°C Industrial Temperature
Range, RoHS Compliant
MIC4469YN
14-Lead PDIP Package, 25/Tube
MIC4469YWM
16-Lead SOIC Wide Package, 47/Tube
MIC4469YWM-TR
16-Lead SOIC Wide Package, 1,000/Reel
MIC4469:
1.2A-Peak, Quad Low-Side MOSFET
Driver, AND with 1 Inverting Input Logic,
–40°C to +85°C Commercial Temperature
Range, RoHS Compliant
MIC4469ZN
14-Lead PDIP Package, 25/Tube
MIC4469ZWM
16-Lead SOIC Wide Package, 47/Tube
MIC4469WM-TR
16-Lead SOIC Wide Package, 1,000/Reel
Note 1:
2022 Microchip Technology Inc. and its subsidiaries
Tape and Reel identifier only appears in the catalog
part number description. This identifier is used for
ordering purposes and is not printed on the device
package. Check with your Microchip Sales Office for
package availability with the Tape and Reel option.
DS20006614A-page 15
MIC4467/8/9
NOTES:
DS20006614A-page 16
2022 Microchip Technology Inc. and its subsidiaries
Note the following details of the code protection feature on Microchip products:
•
Microchip products meet the specifications contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is secure when used in the intended manner, within operating specifications, and
under normal conditions.
•
Microchip values and aggressively protects its intellectual property rights. Attempts to breach the code protection features of
Microchip product is strictly prohibited and may violate the Digital Millennium Copyright Act.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code. Code protection does not
mean that we are guaranteeing the product is “unbreakable”. Code protection is constantly evolving. Microchip is committed to
continuously improving the code protection features of our products.
This publication and the information herein may be used only
with Microchip products, including to design, test, and integrate
Microchip products with your application. Use of this information in any other manner violates these terms. Information
regarding device applications is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your
specifications. Contact your local Microchip sales office for
additional support or, obtain additional support at https://
www.microchip.com/en-us/support/design-help/client-supportservices.
THIS INFORMATION IS PROVIDED BY MICROCHIP "AS IS".
MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED,
WRITTEN OR ORAL, STATUTORY OR OTHERWISE,
RELATED TO THE INFORMATION INCLUDING BUT NOT
LIMITED TO ANY IMPLIED WARRANTIES OF NONINFRINGEMENT, MERCHANTABILITY, AND FITNESS FOR A
PARTICULAR PURPOSE, OR WARRANTIES RELATED TO
ITS CONDITION, QUALITY, OR PERFORMANCE.
IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT, SPECIAL, PUNITIVE, INCIDENTAL, OR CONSEQUENTIAL LOSS, DAMAGE, COST, OR EXPENSE OF ANY
KIND WHATSOEVER RELATED TO THE INFORMATION OR
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BEEN ADVISED OF THE POSSIBILITY OR THE DAMAGES
ARE FORESEEABLE. TO THE FULLEST EXTENT
ALLOWED BY LAW, MICROCHIP'S TOTAL LIABILITY ON
ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION
OR ITS USE WILL NOT EXCEED THE AMOUNT OF FEES, IF
ANY, THAT YOU HAVE PAID DIRECTLY TO MICROCHIP
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use. No licenses are conveyed, implicitly or otherwise, under
any Microchip intellectual property rights unless otherwise
stated.
Trademarks
The Microchip name and logo, the Microchip logo, Adaptec,
AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud,
CryptoMemory, CryptoRF, dsPIC, flexPWR, HELDO, IGLOO,
JukeBlox, KeeLoq, Kleer, LANCheck, LinkMD, maXStylus,
maXTouch, MediaLB, megaAVR, Microsemi, Microsemi logo,
MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower,
PICSTART, PIC32 logo, PolarFire, Prochip Designer, QTouch,
SAM-BA, SenGenuity, SpyNIC, SST, SST Logo, SuperFlash,
Symmetricom, SyncServer, Tachyon, TimeSource, tinyAVR, UNI/O,
Vectron, and XMEGA are registered trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
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Company, EtherSynch, Flashtec, Hyper Speed Control, HyperLight
Load, IntelliMOS, Libero, motorBench, mTouch, Powermite 3,
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TimePictra, TimeProvider, TrueTime, WinPath, and ZL are
registered trademarks of Microchip Technology Incorporated in the
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SQTP is a service mark of Microchip Technology Incorporated in
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The Adaptec logo, Frequency on Demand, Silicon Storage
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© 2022, Microchip Technology Incorporated and its subsidiaries.
All Rights Reserved.
For information regarding Microchip’s Quality Management Systems,
please visit www.microchip.com/quality.
2022 Microchip Technology Inc. and its subsidiaries
ISBN: 978-1-6683-0406-8
DS20006614A-page 17
Worldwide Sales and Service
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DS20006614A-page 18
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09/14/21