MIC4469BN

MIC4467/8/9 Quad 1.2A Peak Low-Side MOSFET Drivers Features General Description • Reliable, Low-Power Bipolar/CMOS/DMOS Construction • Latch-Up Protected to >500 mA Reverse Current • Logic Input withstands Swing to –5V • High 3A Peak Output Current • Wide 4.5V to 18V Operating Range • Symmetrical Rise and Fall Times • Short 500 — — mA — Rise Time tR — 14 25 ns Figure 1-1 Fall time tF — 13 25 ns Figure 1-1 tD1 — 30 75 ns Figure 1-1 tD2 — 45 75 ns Figure 1-1 IS — 0.2 4 mA — Latch-Up Protection Withstand Reverse Current Switching Time Delay Time Power Supply Power Supply Current Note 1: Specification for packaged product only.  2022 Microchip Technology Inc. and its subsidiaries DS20006614A-page 3 MIC4467/8/9 ELECTRICAL CHARACTERISTICS Electrical Characteristics: Measured over operating temperature range with 4.5V ≤ VS ≤ 18V unless otherwise specified. (Note 1) Parameter Symbol Min. Typ. Max. Units Conditions Logic 1 Input Voltage VIH 2.4 1.4 — V — Logic 0 Input Voltage VIL — 1.0 0.8 V — Input Current IIN –1 — 1 µA 0V ≤ VIN ≤ VS High Output Voltage VOH VS - 0.3 — — V ILOAD = 10 mA Low Output Voltage VOL — — 0.3 V ILOAD = 10 mA Output Resistance RO — 7 30 Ω IOUT = 10 mA, VS = 18V Peak Output Current IPK — 1.2 — A — I 500 — — mA — tR — 17 50 ns Figure 1-1 Input Output Latch-Up Protection Withstand Reverse Current Switching Time Rise Time Fall time Delay Time Power Supply Power Supply Current Note 1: tF — 16 50 ns Figure 1-1 tD1 — 35 100 ns Figure 1-1 tD2 — 55 100 ns Figure 1-1 IS — 0.4 8 mA — Specification for packaged product only. TEMPERATURE SPECIFICATIONS (Note 1) Parameters Symbol Min. Typ. Max. Units Conditions –40 — +85 °C Temperature Range Device: Y 0 — +70 °C Temperature Range Device: Z Temperature Ranges Operating Ambient Temperature TA Maximum Junction Temperature TJ — — +150 °C — Storage Temperature Range TS –65 — +150 °C — TLEAD — — +300 °C Soldering, 10 sec. Thermal Resistance 14-Lead PDIP JA — 80 — Thermal Resistance 16-Lead Wide SOIC JA — 120 — Lead Temperature Package Thermal Resistances Note 1: °C/W — — The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). DS20006614A-page 4  2022 Microchip Technology Inc. and its subsidiaries MIC4467/8/9 Test Circuits INVE RTING INPU T +5V V INPUT 90% 1 μF FILM 0.1 μF CERAMIC 10% V OUTPUT 18V tD1 tD2 tF tR 90% 90% 10% 0V IN2 10% IN2 NON-INVE RTING INPU T +5V IN3 IN3 90% V INPUT 10% 18V V OUTPUT IN4 tD1 90% 10% 0V FIGURE 1-1: VOUT 470 pF IN1 IN1 tR IN4 90% tD2 tF 10% Inverting and Non-Inverting Input. 1500 +5V TO +15V 1250 14-PIN PDIP SLOPE = –12 mW/°C MIC4467 PD (mW) 1000 CW CCW DC BRUSH MOTOR 750 500 250 0 25 FIGURE 1-2: PWM SPEED 16-PIN WIDE SOIC SLOPE = –8 mW/°C GND 50 75 100 125 AMBIENT TEMPERATURE (°C) 150 Package Power Dissipation.  2022 Microchip Technology Inc. and its subsidiaries FIGURE 1-3: Quad Driver Drives H Bridge to Control motor Speed and Direction. DS20006614A-page 5 MIC4467/8/9 2.0 Note: TYPICAL PERFORMANCE CURVES The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. FIGURE 2-1: Supply Voltage. Rise and Fall Time vs. FIGURE 2-4: Temperature. Delay Time vs. FIGURE 2-2: Voltage. Delay Time vs. Supply FIGURE 2-5: Capacitive Load. Supply Current vs. FIGURE 2-3: Temperature. Rise and Fall Time vs. FIGURE 2-6: Capacitive Load. Rise and Fall Time vs. DS20006614A-page 6  2022 Microchip Technology Inc. and its subsidiaries MIC4467/8/9 SUPPLY CURRENT (mA) 2.5 2.0 1.5 1.0 NO LOAD BOTH INPUTS LOGIC "1" TA = 25 °C 0.5 0 0 5 10 15 20 SUPPLY VOLTAGE (V) FIGURE 2-7: Frequency. Supply Current vs. FIGURE 2-10: Quiescent Power Supply Current vs. Supply Voltage. SUPPLY CURRENT (μA) 400 300 200 150 NO LOAD BOTH INPUTS LOGIC "0" TA = 25 °C 100 50 0 0 FIGURE 2-8: High Output vs. Current. FIGURE 2-9: Low Output vs. Current.  2022 Microchip Technology Inc. and its subsidiaries 5 10 15 SUPPLY VOLTAGE (V) 20 FIGURE 2-11: Quiescent Power Supply Current vs. Supply Voltage. DS20006614A-page 7 MIC4467/8/9 3.0 PIN DESCRIPTIONS Package Types 14-Pin DIP (N) 16-Pin Wide SOIC (WM) 14 VS 1A 1 16 VS 1B 2 13 1Y 1B 2 15 VS 2A 3 12 2Y 2A 3 14 1Y 2B 4 13 2Y 3A 5 12 3Y 3B 6 11 4Y 1A 1 2B 4 11 3Y 3A 5 10 4Y 3B 6 9 4B GND 7 10 4B GND 7 8 4A GND 8 9 4A The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE Pin Number DIP Pin Number Wide SOIC Pin Name 1 1 1A Input A for Driver 1. TTL/CMOS Compatible Input 2 2 1B Input B for Driver 1. TTL/CMOS Compatible Input 3 3 2A Input A for Driver 2. TTL/CMOS Compatible Input 4 4 2B Input B for Driver 2. TTL/CMOS Compatible Input 5 5 3A Input A for Driver 3. TTL/CMOS Compatible Input 6 6 3B Input B for Driver 3. TTL/CMOS Compatible Input 7 7 GND 8 — 4A — 8 GND 9 — 4B Input B for Driver 4. TTL/CMOS Compatible Input Description Ground Input A for Driver 4. TTL/CMOS Compatible Input Ground — 9 4A Input A for Driver 4. TTL/CMOS Compatible Input 10 — 4Y Output for Driver 4, CMOS Push-Pull Output — 10 4B Input B for Driver 4. TTL/CMOS Compatible Input 11 — 3Y Output for Driver 3, CMOS Push-Pull Output — 11 4Y Output for Driver 4, CMOS Push-Pull Output 12 — 2Y Output for Driver 2, CMOS Push-Pull Output — 12 3Y Output for Driver 3, CMOS Push-Pull Output 13 — 1Y Output for Driver 1, CMOS Push-Pull Output — 13 2Y Output for Driver 2, CMOS Push-Pull Output 14 — VS Supply Input, 4.5V to 18V — 14 1Y Output for Driver 1, CMOS Push-Pull Output — 15 VS Supply Input, 4.5V to 18V — 16 VS Supply Input, 4.5V to 18V DS20006614A-page 8  2022 Microchip Technology Inc. and its subsidiaries MIC4467/8/9 3.1 Truth Table TABLE 3-2: TRUTH TABLE Part No. MIC4467 (Each Driver) MIC4468 (Each Driver) MIC4469 (Each Driver) Inputs Output A B Y L X H X L H H H L H H H L X L X L L L X L X H L H L H  2022 Microchip Technology Inc. and its subsidiaries DS20006614A-page 9 MIC4467/8/9 4.0 PACKAGING INFORMATION 4.1 Package Marking Information 16-Lead PDIP* Example XXX MIC XXXXXXXXX MIC4467ZN 1978 WNNN 16-Lead Wide SOIC* Example XXXXX MICREL XXXXXXXXXX MIC4469ZWM WNNN 1985 Legend: XX...X Y YY WW NNN e3 * Product code or customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC® designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. ●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle mark). Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. Package may or may not include the corporate logo. Underbar (_) and/or Overbar (‾) symbol may not be to scale. Note: If the full seven-character YYWWNNN code cannot fit on the package, the following truncated codes are used based on the available marking space: 6 Characters = YWWNNN; 5 Characters = WWNNN; 4 Characters = WNNN; 3 Characters = NNN; 2 Characters = NN; 1 Character = N DS20006614A-page 10  2022 Microchip Technology Inc. and its subsidiaries MIC4467/8/9 14-Lead Plastic DIP Package Outline and Recommended Land Pattern Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging.  2022 Microchip Technology Inc. and its subsidiaries DS20006614A-page 11 MIC4467/8/9 16-Lead Wide SOIC Package Outline and Recommended Land Pattern Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging. DS20006614A-page 12  2022 Microchip Technology Inc. and its subsidiaries MIC4467/8/9 APPENDIX A: REVISION HISTORY Revision A (May 2022) • Converted Micrel document MIC4467/8/9 to Microchip data sheet DS20006614A. • Minor text changes throughout.  2022 Microchip Technology Inc. and its subsidiaries DS20006614A-page 13 MIC4467/8/9 NOTES: DS20006614A-page 14  2022 Microchip Technology Inc. and its subsidiaries MIC4467/8/9 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office. PART NO. X XX –XX Device Temperature Range Package Media Type MIC4467: Quad 1.2A-Peak Low-Side MOSFET Driver with Bi-Polar/CMOS/DMOS Process featuring NAND Input Logic Device: MIC4468: Quad 1.2A-Peak Low-Side MOSFET Driver with Bi-Polar/CMOS/DMOS Process featuring AND Input Logic MIC4469: Quad 1.2A-Peak Low-Side MOSFET Driver with Bi-Polar/CMOS/DMOS Process featuring AND with 1 Inverting Input Logic Temperature Range: Y = Z = –40°C to +85°C, Industrial (RoHs Compliant) 0°C to +70°C, Commercial (RoHs Compliant) Package: N = WM = Media Type: = 25/Tube (N, PDIP) = 47/Tube (WM, SOIC) TR = 1,000/Reel (WM, SOIC) Examples: a) MIC4467: 1.2A-Peak, Quad Low-Side MOSFET Driver, NAND Input Logic, –40°C to +85°C Industrial Temperature Range, RoHS Compliant MIC4467YWM 16-Lead SOIC Wide Package, 47/Tube MIC4467YWM-TR 16-Lead SOIC Wide Package, 1,000/Reel b) MIC4467: 1.2A-Peak, Quad Low-Side MOSFET Driver, NAND Input Logic, 0°C to +70°C Commercial Temperature Range, RoHS Compliant MIC4467ZN 14-Lead PDIP Package, 25/Tube MIC4467ZWM 16-Lead SOIC Wide Package, 47/Tube MIC4467ZWM-TR 16-Lead SOIC Wide Package, 1000/Reel c) MIC4468: 1.2A-Peak, Quad Low-Side MOSFET Driver, AND Input Logic, –40°C to +85°C Industrial Temperature Range, RoHS Compliant MIC4468YN 14-Lead PDIP Package, 25/Tube MIC4468YWM 16-Lead SOIC Wide Package, 47/Tube MIC4468YWM-TR 16-Lead SOIC Wide Package, 1,000/Reel d) MIC4468: 1.2A-Peak, Quad Low-Side MOSFET Driver, AND Input Logic, 0°C to +70°C Commercial Temperature Range, RoHS Compliant MIC4468ZN 14-Lead PDIP Package, 25/Tube MIC4468ZWM 16-Lead SOIC Wide Package, 47/Tube 14-Lead PDIP 16-Lead SOIC (Wide Body) MIC4468ZWM-TR 16-Lead SOIC Wide Package, 1,000/Reel MIC4469: 1.2A-Peak, Quad Low-Side MOSFET Driver, AND with 1 Inverting Input Logic, –40°C to +85°C Industrial Temperature Range, RoHS Compliant MIC4469YN 14-Lead PDIP Package, 25/Tube MIC4469YWM 16-Lead SOIC Wide Package, 47/Tube MIC4469YWM-TR 16-Lead SOIC Wide Package, 1,000/Reel MIC4469: 1.2A-Peak, Quad Low-Side MOSFET Driver, AND with 1 Inverting Input Logic, –40°C to +85°C Commercial Temperature Range, RoHS Compliant MIC4469ZN 14-Lead PDIP Package, 25/Tube MIC4469ZWM 16-Lead SOIC Wide Package, 47/Tube MIC4469WM-TR 16-Lead SOIC Wide Package, 1,000/Reel Note 1:  2022 Microchip Technology Inc. and its subsidiaries Tape and Reel identifier only appears in the catalog part number description. This identifier is used for ordering purposes and is not printed on the device package. Check with your Microchip Sales Office for package availability with the Tape and Reel option. DS20006614A-page 15 MIC4467/8/9 NOTES: DS20006614A-page 16  2022 Microchip Technology Inc. and its subsidiaries Note the following details of the code protection feature on Microchip products: • Microchip products meet the specifications contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is secure when used in the intended manner, within operating specifications, and under normal conditions. • Microchip values and aggressively protects its intellectual property rights. Attempts to breach the code protection features of Microchip product is strictly prohibited and may violate the Digital Millennium Copyright Act. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code. Code protection does not mean that we are guaranteeing the product is “unbreakable”. Code protection is constantly evolving. Microchip is committed to continuously improving the code protection features of our products. This publication and the information herein may be used only with Microchip products, including to design, test, and integrate Microchip products with your application. Use of this information in any other manner violates these terms. Information regarding device applications is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. Contact your local Microchip sales office for additional support or, obtain additional support at https:// www.microchip.com/en-us/support/design-help/client-supportservices. THIS INFORMATION IS PROVIDED BY MICROCHIP "AS IS". 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