MIC45116
20V/6A DC/DC Power Module
Features
General Description
• Up to 6A Output Current
• >93% Peak Efficiency
• Output Voltage of 0.8V to 85% of Input with ±1%
Accuracy
• Fixed 600 kHz Switching Frequency
• Enable Input and Open-Drain Power Good Output
• HyperLight Load® (MIC45116-1) Improves Light
Load Efficiency
• Hyper Speed Control® (MIC45116-2) Architecture
Enables Fast Transient Response
• Supports Safe Start-Up into Pre-Biased Output
• –40°C to +125°C Junction Temperature Range
• Thermal Shutdown Protection
• Short-Circuit Protection with Hiccup Mode
• Adjustable Current Limit
• Available in 52-Lead 8 mm x 8 mm x 3 mm
H3QFN Package
The MIC45116 is a synchronous step-down regulator
module, featuring a unique adaptive ON-time control
architecture. The module incorporates a DC/DC
controller, power MOSFETs, bootstrap diode, bootstrap
capacitor, and an inductor in a single package;
simplifying the design and layout process for the end
user.
This highly integrated solution expedites system
design and improves product time-to-market. The
internal MOSFETs and inductor are optimized to
achieve high efficiency at a low output voltage. The fully
optimized design can deliver up to 6A current under a
wide input voltage range of 4.75V to 20V without
requiring additional cooling.
The MIC45116-1 uses HyperLight Load® (HLL) which
maintains high efficiency under light load conditions by
transitioning to variable frequency, discontinuousmode operation. The MIC45116-2 uses Hyper Speed
Control® architecture which enables ultra-fast load
transient response, allowing for a reduction of output
capacitance. The MIC45116 offers 1% output accuracy
that can be adjusted from 0.8V to 85% of the input
(PVIN) with two external resistors. Additional features
include thermal-shutdown protection, adjustable
current limit, and short-circuit protection. The
MIC45116 allows for safe start-up into a pre-biased
output.
Applications
• High Power Density Point-of-Load Conversion
• Servers, Routers, Networking, and Base Stations
• FPGAs, DSP, and Low-Voltage ASIC Power
Supplies
• Industrial and Medical Equipment
Typical Application Circuit
MIC45116
8x8x3 H3QFN
PVDD
5VDD
10k
VIN
CIN
PG
VOUT
PVIN
VOUT
VIN MIC45116
FB
EN
SW
ILIM
CFF
CINJ
RINJ
RFB1
COUT
RFB2
RLIM
PGND
2016 - 2022 Microchip Technology Inc.
DS20005571B-page 1
MIC45116
Package Type
PVIN
1
PVIN
2
KEEPOUT
3
PVDD
4
BST
5
BST
6
KEEPOUT
7
SW
8
SW
9
SW
10
KEEPOUT
11
VOUT
12
VOUT
13
VOUT
14
VOUT
15
PVIN
SW
SW
SW
SW
ILIM
KEEPOUT
PGND
PVDD
5VDD
PGND
MIC45116
8x8x3 H3QFN (MP)
52
51
50
49
48
47
46
45
44
43
42
NC
40
NC
39
VIN
38
EN
37
PG
36
FB
35
PGND
34
NC
33
NC
32
NC
31
PGND
30
NC
PGND ePAD
SW ePAD
PGND ePAD
VOUT ePAD
25
NC
NC
28
NC
27
NC
26
PGND
24
NC
KEEPOUT
23
NC
20
22
VOUT
19
21
VOUT
18
VOUT
29
VOUT
17
VOUT
VOUT
16
DS20005571B-page 2
41
2016 - 2022 Microchip Technology Inc.
MIC45116
Functional Block Diagram
MIC45116
VIN
5VDD
VDD
VIN
BST
BST
PVIN
CONTROLLER
PVDD
PVDD
DH
EN
EN
PG
PG
FB
FB
PVDD
SW
SW
VOUT
DL
AGND
ILIM
PGND
PGND
ILIM
2016 - 2022 Microchip Technology Inc.
DS20005571B-page 3
MIC45116
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
PVIN, VIN to PGND....................................................................................................................................... –0.3V to +30V
PVDD, 5VDD to PGND .................................................................................................................................... –0.3V to +6V
VSW, VILIM, VEN to PGND ................................................................................................................. –0.3V to (VIN + 0.3V)
VBST to VSW ................................................................................................................................................. –0.3V to +6V
VBST to PGND.............................................................................................................................................. –0.3V to +36V
VPG to PGND ................................................................................................................................. –0.3V to (5VDD + 0.3V)
VFB to PGND ................................................................................................................................. –0.3V to (5VDD + 0.3V)
ESD Rating(Note 1).................................................................................................................................... ESD Sensitive
Operating Ratings ‡
Supply Voltage (PVIN, VIN) ....................................................................................................................... +4.75V to +20V
Output Current ..............................................................................................................................................................6A
Enable Input (VEN) ............................................................................................................................................. 0V to VIN
Power Good (VPG) .......................................................................................................................................... 0V to 5VDD
† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at those or any other conditions above those indicated
in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended
periods may affect device reliability.
‡ Notice: The device is not guaranteed to function outside its operating ratings.
Note 1: Devices are ESD sensitive. Handling precautions are recommended.
DS20005571B-page 4
2016 - 2022 Microchip Technology Inc.
MIC45116
ELECTRICAL CHARACTERISTICS
Electrical Characteristics: VIN = VEN = 12V, VOUT = 3.3V, VBST – VSW = 5V, TJ = +25ºC. Bold values indicate
–40°C ≤ TJ ≤ +125°C, unless otherwise noted. (Note 1).
Parameters
Symbol
Min.
Typ.
Max.
Units
Conditions
VIN, PVIN
4.75
—
20
V
—
0.35
0.75
mA
VFB = 1.5V
—
1.03
—
mA
VFB = 1.5V
—
29.4
—
mA
PVIN = VIN = 12V,
VOUT = 1.8V, IOUT = 0A
(MIC45116-2)
—
5.3
10
µA
VEN = 0V
4.8
5.2
5.4
V
VIN = 7V to 20V,
I5VDD = 10 mA
Power Supply Input
Input Voltage Range
Quiescent Supply Current
(MIC45116-1)
IQ
Quiescent Supply Current
(MIC45116-2)
IQ
Operating Current
IIN
Shutdown Supply Current
ISHDN
—
5VDD Output
5VDD Output Voltage
5VDD
5VDD UVLO Threshold
UVLO
3.8
4.2
4.6
V
V5VDD Rising
5VDD UVLO Hysteresis
UVLO_HYS
—
400
—
mV
V5VDD Falling
5VDD Load Regulation
Δ5VDD(LD)
0.6
2
3.6
%
I5VDD = 0 mA to 40 mA
0.792
0.8
0.808
V
TJ = 25°C
0.784
0.8
0.816
IFB_BIAS
—
5
500
nA
VFB = 0.8V
EN Logic Level High
ENHIGH
1.8
—
—
V
—
EN Logic Level Low
ENLOW
—
—
0.6
V
—
EN Hysteresis
ENHYS
—
200
—
mV
—
EN Bias Current
IENBIAS
—
5
10
µA
VEN = 12V
Switching Frequency
fSW
400
600
750
kHz
IOUT = 2A
Maximum Duty Cycle
DMAX
—
85
—
%
—
Minimum Duty Cycle
DMIN
—
0
—
%
VFB = 1V
tOFF(MIN)
140
250
350
ns
—
tSS
—
3.3
—
ms
VFB from 0V to 0.8V
Current-Limit Threshold
VCL(OS)
–30
–14
0
mV
VFB = 0.79V
Short-Circuit Threshold
VSC
–23
–7
9
mV
VFB = 0V
Current-Limit Source Current
ICL
60
80
100
µA
VFB = 0.79V
Short-Circuit Source Current
ISC
25
35
45
µA
VFB = 0V
Reference
Feedback Reference Voltage
FB Bias Current
VREF
–40°C ≤ TJ ≤ +125°C
Enable Control
Oscillator
Minimum Off-Time
Soft-Start
Soft-Start Time
Short-Circuit Protection
Note 1:
Specification for packaged product only.
2016 - 2022 Microchip Technology Inc.
DS20005571B-page 5
MIC45116
ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Characteristics: VIN = VEN = 12V, VOUT = 3.3V, VBST – VSW = 5V, TJ = +25ºC. Bold values indicate
–40°C ≤ TJ ≤ +125°C, unless otherwise noted. (Note 1).
Parameters
Symbol
Min.
Typ.
Max.
Units
Conditions
PG Threshold Voltage
VPG_TH
85
88
95
% VREF
Sweep VFB from low-to-high
PG Hysteresis
VPG_HYS
—
6
—
% VREF
Sweep VFB from high-to-low
PG Delay Time
tPG_DLY
—
80
—
µs
Sweep VFB from low-to-high
PG Low Voltage
VPG_LOW
—
60
200
mV
VFB < 90% x VNOM, IPG = 1 mA
Overtemperature Shutdown
TSHD
—
160
—
°C
TJ rising
Overtemperature Shutdown
Hysteresis
TSHD_HYS
—
15
—
°C
—
Power Good (PG)
Thermal Protection
Note 1:
Specification for packaged product only.
DS20005571B-page 6
2016 - 2022 Microchip Technology Inc.
MIC45116
TEMPERATURE SPECIFICATIONS
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
TJ
–40
—
+125
°C
Note 1
TJ(ABSMAX)
—
—
+150
°C
—
Temperature Ranges
Operating Junction Temperature
Range
Absolute Maximum Junction
Temperature
TS
–65
—
+150
°C
—
TLEAD
—
—
+260
°C
Soldering, 10 seconds
52-lead 8 mm x 8 mm x 3 mm H3QFN
JA
—
22
—
°C/W
Note 2
52-lead 8 mm x 8 mm x 3 mm H3QFN
JC
—
5
—
°C/W
Note 2
Storage Temperature Range
Lead Temperature
Package Thermal Resistances
Note 1:
2:
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.
JA and JC were measured using the MIC45116 evaluation board.
2016 - 2022 Microchip Technology Inc.
DS20005571B-page 7
MIC45116
2.0
Note:
TYPICAL PERFORMANCE CURVES
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
FIGURE 2-1:
VIN Operating Supply
Current vs. Temperature (MIC45116-1).
FIGURE 2-4:
Temperature.
Feedback Voltage vs.
FIGURE 2-2:
Temperature.
VIN Shutdown Current vs.
FIGURE 2-5:
Temperature.
Switching Frequency vs.
FIGURE 2-3:
Temperature.
VDD Voltage vs.
FIGURE 2-6:
Temperature.
Output Current Limit vs.
DS20005571B-page 8
2016 - 2022 Microchip Technology Inc.
MIC45116
FIGURE 2-7:
Temperature.
VDD UVLO Threshold vs.
FIGURE 2-10:
Output Voltage vs.
Temperature (MIC45116-1).
FIGURE 2-8:
Temperature.
Enable Threshold vs.
FIGURE 2-11:
Load Regulation vs.
Temperature (MIC45116-1).
FIGURE 2-9:
Temperature.
EN Bias Curent vs.
FIGURE 2-12:
Line Regulation vs.
Temperature (MIC45116-1).
2016 - 2022 Microchip Technology Inc.
DS20005571B-page 9
MIC45116
FIGURE 2-13:
Efficiency (VIN = 5V) vs.
Output Current (MIC45116-1).
FIGURE 2-16:
Efficiency (VIN = 5V) vs.
Output Current (MIC45116-2).
FIGURE 2-14:
Efficiency (VIN = 12V) vs.
Output Current (MIC45116-1).
FIGURE 2-17:
Efficiency (VIN = 12V) vs.
Output Current (MIC45116-2).
FIGURE 2-15:
Efficiency (VIN = 18V) vs.
Output Current (MIC45116-1).
FIGURE 2-18:
Efficiency (VIN = 18V) vs.
Output Current (MIC45116-2).
DS20005571B-page 10
2016 - 2022 Microchip Technology Inc.
MIC45116
FIGURE 2-19:
Power Dissipation (VIN =
5V) vs. Output Current (MIC45116-1).
FIGURE 2-22:
Power Dissipation (VIN =
5V) vs. Output Current (MIC45116-2).
FIGURE 2-20:
Power Dissipation (VIN =
12V) vs. Output Current (MIC45116-1).
FIGURE 2-23:
Power Dissipation (VIN =
12V) vs. Output Current (MIC45116-2).
FIGURE 2-21:
Power Dissipation (VIN =
18V) vs. Output Current (MIC45116-1).
2016 - 2022 Microchip Technology Inc.
FIGURE 2-24:
Power Dissipation (VIN =
18V) vs. Output Current (MIC45116-2).
DS20005571B-page 11
MIC45116
FIGURE 2-25:
Line Regulation vs. Output
Current (MIC45116-1).
FIGURE 2-28:
Line Regulation vs. Output
Current (MIC45116-2).
FIGURE 2-26:
Output Voltage vs. Output
Current (MIC45116-1).
FIGURE 2-29:
Output Voltage vs. Output
Current (MIC45116-2).
FIGURE 2-27:
Switching Frequency vs.
Output Current (MIC45116-1).
FIGURE 2-30:
Switching Frequency vs.
Output Current (MIC45116-2).
DS20005571B-page 12
2016 - 2022 Microchip Technology Inc.
MIC45116
FIGURE 2-31:
Feedback Voltage vs. Input
Voltage (MIC45116-1).
FIGURE 2-34:
Feedback Voltage vs. Input
Voltage (MIC45116-2).
FIGURE 2-32:
Output Regulation vs. Input
Voltage (MIC45116-1).
FIGURE 2-35:
Output Regulation vs. Input
Voltage (MIC45116-2).
FIGURE 2-33:
Switching Frequency vs.
Input Voltage (MIC45116-1).
FIGURE 2-36:
Switching Frequency vs.
Input Voltage (MIC45116-2).
2016 - 2022 Microchip Technology Inc.
DS20005571B-page 13
MIC45116
VIN
(5V/div)
VOUT
(1V/div)
VPG
(5V/div)
VIN = 12V
VOUT = 1.8V
IOUT = 6A
IIN
(2A/div)
Time (2.0ms/div)
FIGURE 2-37:
Input Voltage.
Enable Input Current vs.
FIGURE 2-40:
VEN
(2V/div)
VIN Soft Turn-Off.
VIN = 12V
VOUT = 1.8V
IOUT = 6A
VOUT
(1V/div)
VPG
(5V/div)
IIN
(1A/div)
Time (2.0ms/div)
FIGURE 2-38:
Voltage.
Enable Threshold vs. Input
VIN = 12V
VOUT = 1.8V
IOUT = 6A
FIGURE 2-41:
Rise Time.
VOUT
(1V/div)
VPG
(5V/div)
VPG
(5V/div)
IIN
(2A/div)
IIN
(1A/div)
Time (40μs/div)
Time (2.0ms/div)
DS20005571B-page 14
VIN = 12V
VOUT = 1.8V
IOUT = 6A
VEN
(2V/div)
VIN
(5V/div)
VOUT
(1V/div)
FIGURE 2-39:
Enable Turn-On Delay and
VIN Soft Turn-On.
FIGURE 2-42:
Fall Time.
Enable Turn-Off Delay and
2016 - 2022 Microchip Technology Inc.
MIC45116
VEN
(2V/div)
VEN
(2V/div)
VOUT
(1V/div)
VPG
(5V/div)
VOUT
(200mV/div)
VIN = 12V
VOUT = 1.8V
IOUT = 0A
VPRE-BIAS = 1.2V
IIN
(200mA/div)
Time (2.0ms/div)
FIGURE 2-43:
Enable Start-Up with
Pre-Biased Output.
VIN = 12V
VOUT = 1.8V
IOUT = Short Wire across output
Time (400μs/div)
FIGURE 2-46:
Enabled Into Short-Circuit.
VIN = 12V
VOUT = 1.8V
IOUT = 6A
VEN
(2V/div)
VOUT
(1V/div)
VOUT
(1V/div)
VPG
(5V/div)
VPG
(5V/div)
IIN
(1A/div)
VIN = 12V
VOUT = 1.8V
IOUT = 6A
IOUT
(5A/div)
Time (200μs/div)
Time (2ms/div)
FIGURE 2-44:
VIN
(5V/div)
VOUT
(200mV/div)
Enable Turn-On/Turn-Off.
FIGURE 2-47:
State.
Short-Circuit During Steady
VIN = 12V
VOUT = 1.8V
IOUT = Short wire across output
VOUT
(1V/div)
VPG
(5V/div)
IIN
(500mA/div)
Time (2.0ms/div)
Time (2.0ms/div)
FIGURE 2-45:
VIN = 12V
VOUT = 1.8V
IOUT = 6A
IOUT
(5A/div)
Power Up Into Short-Circuit.
2016 - 2022 Microchip Technology Inc.
FIGURE 2-48:
Short-Circuit.
Output Recovery from
DS20005571B-page 15
MIC45116
VIN = 12V
VOUT = 1.8V
IPK_CL = 8.1A
VOUT
(1V/div)
VOUT
(1V/div)
VIN = 12V
VOUT = 1.8V
IOUT = 6A
VSW
(10V/div)
VPG
(5V/div)
VPG
(5V/div)
IOUT
(5A/div)
IOUT
(5A/div)
Time (400μs/div)
FIGURE 2-49:
Threshold.
Time (2ms/div)
Peak Current-Limit
VIN = 12V
VOUT = 1.8V
IOUT = 6A
FIGURE 2-52:
Output Recovery from
Thermal Shutdown.
VOUT
(AC-Coupled)
(20mV/div)
VIN
(5V/div)
VOUT
(1V/div)
VPG
(5V/div)
VSW
(5V/div)
Time (400ns/div)
Time (2ms/div)
FIGURE 2-50:
VIN = 12V
VOUT = 1.8A
IOUT = 6A
IOUT
(5A/div)
IIN
(1A/div)
Inrush with 3000 µF.
VIN = 12V
VOUT = 1.8V
IOUT = 6A
VOUT
(1V/div)
FIGURE 2-53:
MIC45116-1 Switching
Waveforms (IOUT = 6A).
VOUT
(AC-Coupled)
(20mV/div)
VSW
(10V/div)
VPG
(5V/div)
VSW
(5V/div)
IOUT
(5A/div)
IOUT
(5A/div)
Time (1ms/div)
FIGURE 2-51:
DS20005571B-page 16
Thermal Shutdown.
VIN = 12V
VOUT = 1.8V
IOUT = 0A
Time (4ms/div)
FIGURE 2-54:
MIC45116-1 Switching
Waveforms (IOUT = 0A).
2016 - 2022 Microchip Technology Inc.
MIC45116
VOUT
(AC-Coupled)
(50mV/div)
IOUT
(1A/div)
VIN = 12V
VOUT = 1.8V
IOUT = 0.5A to 3.5A
Time (100μs/div)
FIGURE 2-55:
(MIC45116-1).
Load Transient Response
VOUT
(AC-Coupled)
(50mV/div)
IOUT
(2A/div)
VIN = 12V
VOUT = 1.8V
IOUT = 3A to 6A
Time (100μs/div)
FIGURE 2-56:
(MIC45116-2).
Load Transient Response
FIGURE 2-57:
Response.
Control Loop Frequency
2016 - 2022 Microchip Technology Inc.
DS20005571B-page 17
MIC45116
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
Pin Number
Pin Name
1, 2, 52
PVIN
Power Input Voltage. Connection to the drain of the internal high-side power
MOSFET. Connect an input capacitor from PVIN to PGND.
4, 44
PVDD
Supply input for the internal power MOSFET drivers. Connect PVDD pins together. Do
not leave floating.
5, 6
BST
Connection to the internal bootstrap circuitry and high-side power MOSFET drive
circuitry. Connect the two BST pins together.
8-10, 48-51
SW
The SW pin connects directly to the switch node. Due to the high-speed switching on
this pin, the SW pin should be routed away from sensitive nodes. The SW pin also
senses the current by monitoring the voltage across the low-side MOSFET during
OFF time.
12-21
VOUT
23-25, 27-30,
32-34, 40, 41
NC
26, 31, 35, 42,
45
PGND
Power Ground. PGND is the return path for the step-down power module power stage.
The PGND pin connects to the source of internal low-side power MOSFET, the
negative terminals of input capacitors, and the negative terminals of output capacitors.
Signal Ground and Power Ground of MIC45116 are internally connected.
36
FB
Feedback. Input to the transconductance amplifier of the control loop. The FB pin is
referenced to 0.8V. A resistor divider connecting the feedback to the output is used to
set the desired output voltage. Connect the bottom resistor from FB to system ground.
External ripple injection (series R and C) can be connected between FB and SW.
37
PG
Power Good. Open-Drain Output. If used, connect to an external pull-up resistor of at
least 10 kΩ between PG and the external bias voltage.
38
EN
Enable. A logic signal to enable or disable the step-down regulator module operation.
The EN pin is TTL/CMOS compatible. Logic-high = enable, logic-low = disable or
shutdown. EN pin has an internal 1 MΩ (typical) pull-down resistor to GND. Do not
leave floating.
39
VIN
Input for the internal linear regulator. Allows for split supplies to be used when there is
an external bus voltage available. Connect to PVIN for single supply operation.
Bypass with a 0.1 µF capacitor from VIN to PGND.
43
5VDD
Internal +5V Linear Regulator Output. Powered by VIN, 5VDD is the internal supply
bus for the device. In the applications with VIN < +5.5V, 5VDD should be tied to VIN to
bypass the linear regulator.
47
3, 7, 11, 22, 46
—
ILIM
Description
Output Voltage. Connected to the internal inductor, the output capacitor should be
connected from this pin to PGND as close to the module as possible.
Not internally connected.
Current Limit. Connect a resistor between ILIM and SW to program the current limit.
KEEPOUT Depopulated pin positions.
VOUT ePad VOUT Exposed Pad. Internally connected to VOUT pins. Please see the PCB Layout
Guidelines section.
—
SW ePad
—
PGND
ePAD
DS20005571B-page 18
SW Exposed Pad. Internally connected to SW pins. Please see the PCB Layout
Guidelines section.
PGND Exposed Pads. Please see the PCB Layout Guidelines section for the
connection to the system Ground.
2016 - 2022 Microchip Technology Inc.
MIC45116
4.0
FUNCTIONAL DESCRIPTION
The MIC45116 is an adaptive ON-time synchronous
buck regulator module built for high-input voltage to
low-output voltage conversion applications. The
MIC45116 is designed to operate over a wide input
voltage range, from 4.75V to 20V, and the output is
adjustable with an external resistor divider.
An adaptive ON-time control scheme is employed to
obtain a constant switching frequency in steady state
and to simplify the control compensation. Hiccup mode
over-current protection is implemented by sensing
low-side MOSFET’s RDS(ON). The device features
internal soft-start, enable, UVLO, and thermal
shutdown. The module has integrated switching FETs,
inductor, bootstrap diode, and bypass capacitors.
4.1
Theory of Operation
Figure 4-1, in association with Equation 4-1, shows the
output voltage is sensed by the MIC45116 feedback pin
(FB) via the voltage divider RFB1 and RFB2 and
compared to a 0.8V reference voltage (VREF) at the
error comparator through a low-gain transconductance
(gm) amplifier.
If the feedback voltage decreases, and the amplifier
output falls below 0.8V, then the error comparator will
trigger the control logic and generate an ON-time
period. The ON-time period length is predetermined by
the Fixed tON Estimator circuitry:
SW
INTERNAL
RIPPLE
INJECTION
COMPENSATION
RFB1
VINJ
gM EA
FB
COMP
RFB2
VREF
0.8V
FIGURE 4-1:
FB Pin.
Output Voltage Sense via
EQUATION 4-1:
t ON ESTIMATED
V OUT
= ---------------------V IN f SW
Where:
VOUT
Output Voltage
VIN
Power Stage Input Voltage
fSW
Switching Frequency
2016 - 2022 Microchip Technology Inc.
At the end of the ON-time period, the internal high-side
driver turns off the high-side MOSFET and the low-side
driver turns on the low-side MOSFET. The OFF-time
period length depends upon the feedback voltage in
most cases.
When the feedback voltage decreases and the output
of the gm amplifier falls below 0.8V, the ON-time period
is triggered and the OFF-time period ends. If the
OFF-time period determined by the feedback voltage is
less than the minimum OFF-time tOFF(MIN), which is
about 250 ns, the MIC45116 control logic will apply the
tOFF(MIN) instead. tOFF(MIN) is required to maintain
enough energy in the internal boost capacitor (CBST) to
drive the high-side MOSFET.
The maximum duty cycle is obtained from the 250 ns
tOFF(MIN):
EQUATION 4-2:
t S – t OFF MIN
D MAX = ---------------------------------- = 1 – 250ns
--------------tS
tS
Where:
tS
1/fSW
It is not recommended to use MIC45116 with an
OFF-time close to tOFF(MIN) during steady-state
operation.
The adaptive ON-time control scheme results in a
constant switching frequency in the MIC45116 during
steady state operation. The actual ON-time and
resulting switching frequency will vary with the different
rising and falling times of the MOSFETs. Also, the
minimum tON results in a lower switching frequency in
high VIN to VOUT applications. During load transients,
the switching frequency is changed due to the varying
OFF-time.
To illustrate the control loop operation, we will analyze
both the steady-state and load transient scenarios. For
easy analysis, the gain of the gm amplifier is assumed
to be 1. With this assumption, the inverting input of the
error comparator is the same as the feedback voltage.
Figure 4-2 shows the MIC45116 control loop timing
during steady-state operation. During steady-state, the
gm amplifier senses the feedback voltage ripple, which
is proportional to the output voltage ripple plus injected
voltage ripple, to trigger the ON-time period.
The ON-time is predetermined by the tON estimator.
The termination of the OFF-time is controlled by the
feedback voltage. At the valley of the feedback voltage
ripple, which occurs when VFB falls below VREF, the
OFF period ends and the next ON-time period is
triggered through the control logic circuitry.
DS20005571B-page 19
MIC45116
Unlike true current-mode control, the MIC45116 uses
the output voltage ripple to trigger an ON-time period.
The output voltage ripple is proportional to the inductor
current ripple if the ESR of the output capacitor is large
enough.
IL
IOUT
¨IL(PP)
VOUT
¨VOUT(PP) = ESRC î¨IL(PP)
OUT
VFB
¨VFB(PP) = ¨VOUT(PP) × RFB2
RFB4 + RFB2
VREF
VDH
DH
TRIGGER ON-TIME IF VFB IS BELOW VREF
ESTIMATED ON TIME
FIGURE 4-2:
Timing.
MIC45116 Control Loop
Figure 4-3 shows the operation of the MIC45116 during
a load transient. The output voltage drops due to the
sudden load increase, which causes the VFB to be less
than VREF. This will cause the error comparator to
trigger an ON-time period. At the end of the ON-time
period, a minimum OFF-time tOFF(MIN) is generated to
charge the bootstrap capacitor (CBST) since the
feedback voltage is still below VREF.
Then, the next ON-time period is triggered due to the
low feedback voltage. Therefore, the switching
frequency changes during the load transient, but
returns to the nominal fixed frequency once the output
has stabilized at the new load current level. With the
varying duty cycle and switching frequency, the output
recovery time is fast and the output voltage deviation is
small.
Note that the instantaneous switching frequency during
load transient remains bounded and cannot increase
arbitrarily. The minimum period is limited by tON +
tOFF(MIN). Because the variation in VOUT is relatively
limited during load transient, tON stays virtually close to
its steady-state value.
DS20005571B-page 20
If a low ESR output capacitor is selected, then the
feedback voltage ripple may be too small to be sensed
by the gm amplifier and the error comparator. Also, the
output voltage ripple and the feedback voltage ripple
are not necessarily in phase with the inductor current
ripple if the ESR of the output capacitor is very low. In
these cases, ripple injection is required to ensure
proper operation.
Please refer to the Ripple Injection subsection in the
Application Information section for more details about
the ripple injection technique.
4.2
Discontinuous Mode (MIC45116-1
Only)
In continuous mode, the inductor current is always
greater than zero; however, at light loads, the
MIC45116-1 is able to force the inductor current to
operate in discontinuous mode. Discontinuous mode is
where the inductor current falls to zero, as indicated by
trace (IL) shown in Figure 4-4.
During this period, the efficiency is optimized by
shutting down all the non-essential circuits and
minimizing the supply current as the switching
frequency is reduced. The MIC45116-1 wakes up and
turns on the high-side MOSFET when the feedback
voltage VFB drops below 0.8V.
The MIC45116-1 has a zero crossing comparator (ZC)
that monitors the inductor current by sensing the
voltage drop across the low-side MOSFET during its
ON-time. If the VFB > 0.8V and the inductor current
goes slightly negative, then the MIC45116-1
automatically powers down most of the IC circuitry and
goes into a low-power mode.
Once the MIC45116-1 goes into discontinuous mode,
both low-side driver (DL) and high-side driver (DH) are
low, which turns off the high-side and low-side
MOSFETs. The load current is supplied by the output
capacitors and VOUT drops. If the drop of VOUT causes
VFB to go below VREF, then all the circuits will wake up
into normal continuous mode.
VDH
FIGURE 4-3:
Response.
In order to meet the stability requirements, the
MIC45116 feedback voltage ripple should be in phase
with the inductor current ripple and is large enough to
be sensed by the gm amplifier and the error
comparator. The recommended feedback voltage
ripple is 20 mV~100 mV over full input voltage range.
MIC45116 Load Transient
First, the bias currents of most circuits reduced during
the discontinuous mode are restored, and then a tON
pulse is triggered before the drivers are turned on to
avoid any possible glitches.
2016 - 2022 Microchip Technology Inc.
MIC45116
Finally, the high-side driver is turned on. Figure 4-4
shows the control loop timing in discontinuous mode.
IL CROSSES 0 AND VFB > 0.8V
DISCONTINUOUS MODE STARTS
VFB < 0.8V WAKE UP FROM
DISCONTINUOUS MODE
IL
0
VFB
VREF
In each switching cycle of the MIC45116, the inductor
current is sensed by monitoring the low-side MOSFET
in the OFF period. The sensed voltage VILIM is
compared with the power ground (PGND) after a
blanking time of 150 ns.
In this way, the drop voltage over the resistor R26
(VR26) is compared with the drop over the bottom FET
generating the short current limit. The small capacitor
(C16) connected from the ILIM pin to PGND filters the
switching node ringing during the off-time allowing a
better short-limit measurement. The time constant
created by R26 and C16 should be much less than the
minimum off time.
ZC
MIC45116
PVIN
VIN
BST
VDH
DH
SW
C5
VDL
DL
SW
CS
R26
ESTIMATED ON-TIME
ILIM
C16
FB
PGND
FIGURE 4-4:
MIC45116-1 Control Loop
(Discontinuous Mode).
During discontinuous mode, the bias current of most
circuits is substantially reduced. As a result, the total
power supply current during discontinuous mode is
only about 350 µA, allowing the MIC45116-1 to achieve
high efficiency in light load applications.
4.3
Soft-Start
Soft-start reduces the input power supply surge current
at startup by controlling the output voltage rise time.
The input surge appears while the output capacitor is
charged up.
The MIC45116 implements an internal digital soft-start
by making the 0.8V reference voltage VREF ramp from
0 to 100% in about 3 ms with 9.7 mV steps. Therefore,
the output voltage is controlled to increase slowly by a
stair-case VFB ramp.
FIGURE 4-5:
Circuit.
MIC45116 Current-Limiting
The VR26 drop allows short-limit programming based
on the value of the resistor (R26). If the absolute value
of the voltage drop on the bottom FET becomes greater
than VR26, and the VILIM falls below PGND, an
overcurrent is triggered causing the IC to enter hiccup
mode.
The hiccup sequence including the soft-start reduces
the stress on the switching FETs and protects the load
and supply for severe short conditions.
The short-circuit current limit can be programmed by
using Equation 4-3.
Once the soft-start cycle ends, the related circuitry is
disabled to reduce current consumption. PVDD must be
powered up at the same time or after VIN to make the
soft-start function correctly.
4.4
Current Limit
The MIC45116 uses the RDS(ON) of the low-side
MOSFET and external resistor connected from the ILIM
pin to SW node to set the current limit.
2016 - 2022 Microchip Technology Inc.
DS20005571B-page 21
MIC45116
EQUATION 4-3:
The peak-to-peak inductor current ripple is:
R26 =
I CLIM + I L PP 0.5 – 0.1 R DS ON + V CL OS
----------------------------------------------------------------------------------------------------------------------------I CL
EQUATION 4-4:
V OUT V IN MAX – V OUT
I L PP = ------------------------------------------------------------------V IN MAX f SW L
Where:
I CLIM
Desired current limit.
RDS(ON)
On-resistance of low-side power
MOSFET, 16 mΩ typically.
VCL(OS)
Current-limit threshold offset (typical
value is 14 mV).
ICL
Current-limit source current (typical
value is 80 µA).
ΔIL(PP)
Inductor current peak-to-peak,
since the inductor is integrated, use
Equation 4-4 to calculate the
inductor ripple current.
DS20005571B-page 22
The MIC45116 has a 1.0 µH inductor integrated into
the module. In case of a hard short, the short limit is
folded down to allow an indefinite hard short on the
output without any destructive effect.
It is mandatory to make sure that the inductor current
used to charge the output capacitance during soft-start
is under the folded short limit; otherwise the supply will
go in hiccup mode and may not finish the soft-start
successfully.
With R26 = 1.62 kΩ and C16 = 15 pF, the typical output
current limit is 8A.
2016 - 2022 Microchip Technology Inc.
MIC45116
5.0
APPLICATION INFORMATION
5.1
Output Capacitor Selection
The type of the output capacitor is usually determined
by the application and its equivalent series resistance
(ESR). Voltage and RMS current capability are two
other important factors for selecting the output
capacitor. Recommended capacitor types are MLCC,
OS-CON and POSCAP. The output capacitor’s ESR is
usually the main cause of the output ripple. The
MIC45116 requires ripple injection and the output
capacitor ESR affects the control loop from a stability
point of view.
If low-ESR capacitors, such as ceramic capacitors, are
selected as the output capacitors, a ripple injection
method should be applied to provide enough feedback
voltage ripple. Please refer to the Ripple Injection
subsection for more details.
The output capacitor RMS current is calculated in
Equation 5-3:
EQUATION 5-3:
I L PP
I COUT RMS = ----------------12
Equation 5-1 shows how the maximum value of ESR is
calculated.
The power dissipated in the output capacitor is:
EQUATION 5-1:
EQUATION 5-4:
V OUT PP
ESR COUT --------------------------I L PP
2
P DISS COUT = I COUT RMS ESR COUT
Where:
ΔVOUT(PP)
ΔIL(PP)
Peak-to-peak output voltage ripple
5.2
Peak-to-peak inductor current
ripple
The input capacitor for the power stage input PVIN
should be selected for ripple current rating and voltage
rating.
The total output ripple voltage is a combination of ripple
voltages caused by the ESR and output capacitance.
The total output ripple voltage is calculated in
Equation 5-2:
EQUATION 5-2:
V OUT PP =
2
I L PP
2
------------------------------------- + I L PP ESR COUT
C OUT f SW 8
Where:
D
COUT
fSW
Input Capacitor Selection
The input capacitor must be rated for the input current
ripple. The RMS value of input capacitor current is
determined at the maximum output current. Assuming
the peak-to-peak inductor current ripple is low:
EQUATION 5-5:
I CIN RMS I OUT MAX D 1 – D
The power dissipated in the input capacitor is:
Duty cycle
Output capacitance value
Switching frequency
As described in the Theory of Operation subsection in
the Functional Description, the MIC45116 requires at
least 20 mV peak-to-peak ripple at the FB pin to make
the gm amplifier and the error comparator behave
properly. Also, the output voltage ripple should be in
phase with the inductor current.
Therefore, the output voltage ripple caused by the
output capacitors value should be much smaller than
the ripple caused by the output capacitor ESR.
2016 - 2022 Microchip Technology Inc.
EQUATION 5-6:
2
P DISS CIN = I CIN RMS ESR CIN
The general rule is to pick the capacitor with a ripple
current rating equal to or greater than the calculated
worst-case RMS capacitor current.
Equation 5-7 should be used to calculate the input
capacitor. Also it is recommended to keep some margin
on the calculated value:
DS20005571B-page 23
MIC45116
EQUATION 5-7:
EQUATION 5-9:
I OUT MAX 1 – D D
C IN ------------------------------------------------------------ f SW dV
V REF R FB1
R FB2 = -------------------------------V OUT – V REF
Where:
dV
Input ripple voltage
fSW
Switching frequency
η
For fixed RFB1 = 10 kΩ, output voltage can be selected
by RFB2. Table 5-1 provides RFB2 values for some
common output voltages.
Power conversion efficiency
TABLE 5-1:
5.3
Output Voltage Setting
Components
The MIC45116 requires two resistors to set the output
voltage as shown in Figure 5-1.
RFB1
gM AMP
FB
RFB2
VREF
FIGURE 5-1:
Configuration.
Voltage Divider
The output voltage is determined by Equation 5-8:
EQUATION 5-8:
R FB1
V OUT = V REF 1 + ----------
R FB2
Where:
VREF
5.4
VOUT PROGRAMMING
RESISTOR LOOK-UP
RFB2
VOUT
OPEN
0.8V
40.2 kΩ
1.0V
20 kΩ
1.2V
11.5 kΩ
1.5V
8.06 kΩ
1.8V
4.75 kΩ
2.5V
3.24 kΩ
3.3V
1.91 kΩ
5.0V
Ripple Injection
The VFB ripple required for proper operation of the
MIC45116 gm amplifier and error comparator is 20 mV
to 100 mV. However, the output voltage ripple is
generally too small to provide enough ripple amplitude
at the FB pin and this issue is more visible in lower
output voltage applications. If the feedback voltage
ripple is so small that the gm amplifier and error
comparator cannot sense it, then the MIC45116 will
lose control and the output voltage is not regulated. In
order to have some amount of VFB ripple, a ripple
injection method is applied for low output voltage ripple
applications.
The applications are divided into three situations
according to the amount of the feedback voltage ripple:
• Enough ripple at the feedback voltage due to the
large ESR of the output capacitors (Figure 5-2).
The converter is stable without any ripple
injection.
0.8V
VOUT
A typical value of RFB1 used on the standard evaluation
board is 10 kΩ. If RFB1 is too large, it may allow noise
to be introduced into the voltage feedback loop. If RFB1
is too small in value, it will decrease the efficiency of the
power supply, especially at light loads. Once RFB1 is
selected, RFB2 can be calculated using Equation 5-9:
COUT
FB
RFB2
ESR
PGND
FIGURE 5-2:
DS20005571B-page 24
RFB1
MIC45116
Enough Ripple at FB.
2016 - 2022 Microchip Technology Inc.
MIC45116
The feedback voltage ripple is:
VOUT
EQUATION 5-10:
V FB PP
COUT
FB
Where:
ΔIL(PP)
CFF
RFB1
MIC45116
R FB2
= ------------------------------- ESR C I L PP
OUT
R FB1 + R FB2
SW
Peak-to-Peak Value of the Inductor
Current Ripple
• Inadequate ripple at the feedback voltage due to
the small ESR of the output capacitors.
The output voltage ripple is fed into the FB pin
through a feed-forward capacitor, CFF in this
situation, as shown in Figure 5-3. The typical CFF
value is between 1 nF and 100 nF.
RFB2
CINJ
PGND
FIGURE 5-4:
Circuit at FB.
ESR
RINJ
External Ripple Injection
The injected ripple is calculated via:
EQUATION 5-12:
1
V FB PP = V IN K div D 1 – D ----------------f SW
EQUATION 5-11:
V FB PP = ESR COUT I L PP
Where:
Power stage input voltage
VIN
With the feed-forward capacitor, the feedback
voltage ripple is very close to the output voltage
ripple.
D
Duty cycle
Switching frequency
fSW
τ
(RFB1//RFB2//RINJ) x CFF
VOUT
RFB1
MIC45116
CFF
COUT
EQUATION 5-13:
R FB1 //R FB2
K div = ---------------------------------------------R INJ + R FB1 //R FB2
FB
RFB2
ESR
Where:
PGND
FIGURE 5-3:
RINJ
Inadequate Ripple at FB.
• Virtually no ripple at the FB pin voltage due to the
very low ESR of the output capacitors, such is the
case with ceramic output capacitors.
In this situation, the VFB ripple waveform needs to be
generated by injecting suitable signal. A series RC
network between the SW pin and FB pin, RINJ and
CINJ as shown in Figure 5-4 injects a square-wave
current waveform into the FB pin, which, by means of
integration across the capacitor (CFF), generates an
appropriate sawtooth FB ripple waveform.
20 kΩ
In Equation 5-13 and Equation 5-14, it is assumed that
the time constant associated with CFF must be much
greater than the switching period:
EQUATION 5-14:
1
----------------- = T
--- « 1
f SW
If the voltage divider resistors RFB1 and RFB2 are in the
kΩ range, a CFF of 1 nF to 100 nF can easily satisfy the
large time constant requirements.
5.5
Thermal Measurements and Safe
Operating Area (SOA)
Measuring the IC’s case temperature is recommended
to ensure it is within its operating limits. Although this
might seem like a very elementary task, it is easy to get
erroneous results.
2016 - 2022 Microchip Technology Inc.
DS20005571B-page 25
MIC45116
The most common mistake is to use the standard
thermal couple that comes with a thermal meter. This
thermal couple wire gauge is large, typically 22 gauge,
and behaves like a heatsink, resulting in a lower case
measurement.
Two methods of temperature measurement are using a
smaller thermal couple wire or an infrared
thermometer. If a thermal couple wire is used, it must
be constructed of 36-gauge wire or higher (smaller wire
size) to minimize the wire heat-sinking effect.
In addition, the thermal couple tip must be covered in
either thermal grease or thermal glue to make sure that
the thermal couple junction is making good contact with
the case of the IC. Omega brand thermal couple
(5SC-TT-K-36-36) is adequate for most applications.
Wherever possible, an infrared thermometer is
recommended. The measurement spot size of most
infrared thermometers is too large for an accurate
reading on a small form factor ICs.
FIGURE 5-5:
MIC45116 Power Derating
vs. Output Voltage with 12V Input with No
Airflow.
However, an IR thermometer from Optris has a 1 mm
spot size, which makes it a good choice for measuring
the hottest point on the case. An optional stand makes
it easy to hold the beam on the IC for long periods of
time.
The safe operating area (SOA) of the MIC45116 is
shown in Figure 5-5 and Figure 5-6. These thermal
measurements were taken on MIC45116 evaluation
board with no air flow.
Since the MIC45116 is an entire system comprised of
switching regulator controller, MOSFETs, and inductor,
the part needs to be considered as a system. The SOA
curves will give guidance to reasonable use of the
MIC45116.
SOA curves should only be used as a point of
reference. SOA data was acquired using the MIC45116
evaluation board. Thermal performance depends on
the PCB layout, board size, copper thickness, number
of thermal vias, and actual airflow.
DS20005571B-page 26
FIGURE 5-6:
MIC45116 Power Derating
vs. Input Voltage with 1.0V Output with No
Airflow.
2016 - 2022 Microchip Technology Inc.
MIC45116
6.0
PCB LAYOUT GUIDELINES
PCB layout is critical to achieve reliable, stable and
efficient performance. A ground plane is required to
control EMI and minimize the inductance in power,
signal and return paths. The following guidelines
should be followed to ensure proper operation of the
MIC45116 module.
6.1
Module
• Place the module close to the point-of-load.
• Use wide polygons to route the input and output
power lines.
• Follow the instructions in Package Information
and Recommended Landing Pattern to connect
the Ground exposed pads to system ground
planes.
6.2
6.5
Output Capacitor
• Use a wide trace to connect the output capacitor
ground terminal to the input capacitor ground
terminal.
• Phase margin will change as the output capacitor
value and ESR changes.
• The feedback trace should be separate from the
power trace and connected as close as possible
to the output capacitor. Sensing a long
high-current load trace can degrade the DC load
regulation.
Figure 6-1 is optimized from a small form factor point of
view shows top and bottom layer of a four layer PCB. It
is recommended to use mid layer 1 as a continuous
ground plane.
Input Capacitor
• Place the input capacitors on the same side of the
board and as close to the module as possible.
• Place several vias to the ground plane close to
the input capacitor ground terminal.
• Use either X7R or X5R dielectric input capacitors.
Do not use Y5V or Z5U type capacitors.
• Do not replace the ceramic input capacitor with
any other type of capacitor. Any type of capacitor
can be placed in parallel with the ceramic input
capacitor.
• If a non-ceramic input capacitor is placed in
parallel with the input capacitor, it must be
recommended for switching regulator applications
and the operating voltage.
• In “Hot-Plug” applications, an electrolytic bypass
capacitor must be used to limit the over-voltage
spike seen on the input supply with power is
suddenly applied. If hot-plugging is the normal
operation of the system, using an appropriate
hot-swap IC is recommended.
6.3
RC Snubber (Optional)
• Depending on the operating conditions, a RC
snubber can be used. Place the RC and as close
to the SW pin as possible if needed. Placement of
the snubber on the same side as module is
preferred.
6.4
FIGURE 6-1:
Top and Bottom of a
Four-Layer Board.
SW Node
• Do not route any digital lines underneath or close
to the SW node.
• Keep the switch node (SW) away from the
feedback (FB) pin.
2016 - 2022 Microchip Technology Inc.
DS20005571B-page 27
MIC45116
7.0
SIMPLIFIED PCB DESIGN
RECOMMENDATIONS
7.1
Periphery I/O Pad Layout and
Large Pad for Exposed Heatsink
The board design should begin with copper/metal pads
that sit beneath the periphery leads of a mounted
H3QFN. The board pads should extend outside the
H3QFN package edge a distance of approximately
0.20 mm per side:
After completion of the periphery pad design, the larger
exposed pads will be designed to create the mounting
surface of the H3QFN exposed heatsink. The primary
transfer of heat out of the H3QFN will be directly
through the bottom surface of the exposed heatsink. To
aid in the transfer of generated heat into the PCB, the
use of an array of plated through-hole vias beneath the
mounted part is recommended. The typical via hole
diameter is 0.30 mm to 0.35 mm, with center-to-center
pitch of 0.80 mm to 1.20 mm.
EQUATION 7-1:
TotalPadLength = 8mm + 0.20mm 2sides = 8.4mm
FIGURE 7-1:
Package Bottom View vs. PCB Recommended Exposed Metal Trace.
Please note the exposed metal trace is a “mirror image” of the package bottom view.
DS20005571B-page 28
2016 - 2022 Microchip Technology Inc.
MIC45116
7.2
Solder Paste Stencil Design
(Recommended Stencil Thickness
= 112.5 ±12.5 µm)
The solder stencil aperture openings should be smaller
than the periphery or large PCB exposed pads to
reduce any chance of build-up of excess solder at the
large exposed pad area which can result to solder
bridging.
The suggested reduction of the stencil aperture
opening is typically 0.20 mm smaller than exposed
metal trace.
Please note that a critical requirement is to not
duplicate land pattern of the exposed metal trace as
solder stencil opening because the design and
dimension values are different.
Cyan-colored shaded pad areas indicate exposed
trace keep-out area in Figure 7-2 and Figure 7-3.
FIGURE 7-3:
Stack-Up of Pad Layout and
Solder Paste Stencil.
FIGURE 7-2:
Solder Stencil Opening.
2016 - 2022 Microchip Technology Inc.
DS20005571B-page 29
MIC45116
8.0
PACKAGING INFORMATION
8.1
Package Marking Information
52-Pin H3QFN*
XXX
XXXXX-X
WNNN
Legend: XX...X
Y
YY
WW
NNN
e3
*
Example
MIC
45116-1
6423
Product code or customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle
mark).
Note:
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information. Package may or may not include
the corporate logo.
Underbar (_) symbol may not be to scale.
Note:
If the full seven-character YYWWNNN code cannot fit on the package, the following truncated codes
are used based on the available marking space:
6 Characters = YWWNNN; 5 Characters = WWNNN; 4 Characters = WNNN; 3 Characters = NNN;
2 Characters = NN; 1 Character = N
DS20005571B-page 30
2016 - 2022 Microchip Technology Inc.
MIC45116
52-Lead H3QFN 8 mm x 8 mm Package Outline and Recommended Land Pattern
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2016 - 2022 Microchip Technology Inc.
DS20005571B-page 31
MIC45116
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS20005571B-page 32
2016 - 2022 Microchip Technology Inc.
MIC45116
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2016 - 2022 Microchip Technology Inc.
DS20005571B-page 33
MIC45116
Thermally Enhanced Land Pattern
DS20005571B-page 34
2016 - 2022 Microchip Technology Inc.
MIC45116
2016 - 2022 Microchip Technology Inc.
DS20005571B-page 35
MIC45116
NOTES:
DS20005571B-page 36
2016 - 2022 Microchip Technology Inc.
MIC45116
APPENDIX A:
REVISION HISTORY
Revision A (August 2016)
• Converted Micrel document MIC45116 to Microchip data sheet DS20005571A.
• Minor text changes throughout.
Revision B (April 2022)
• Corrected package marking drawings and added
note below legend in Section 8.1, Package Marking Information.
• Minor text changes throughout.
2016 - 2022 Microchip Technology Inc.
DS20005571B-page 37
MIC45116
NOTES:
DS20005571B-page 38
2016 - 2022 Microchip Technology Inc.
MIC45116
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
–
PART NO.
Device
X
X
XX
–
XX
Examples:
a)
MIC45116-1YMP-TR:
20V/6A DC/DC Power
Module, HyperLight Load,
–40°C to +125°C Temp.
Range, 52-Pin H3QFN,
1,500/Reel
b)
MIC45116-2YMP-TR:
20V/6A DC/DC Power
Module, Hyper Speed
Control, –40°C to +125°C
Temp. Range, 52-Pin
H3QFN, 1,500/Reel
Features Temperature Package Media Type
Device:
MIC45116:
Features:
1
2
=
=
Temperature:
Y
=
Package:
MP =
52-Pin 8 mm x 8 mm x 3 mm H3QFN
Media Type:
TR
1,500/Reel
=
20V/6A DC/DC Power Module
HyperLight Load
Hyper Speed Control
–40°C to +125°C
2016 - 2022 Microchip Technology Inc.
DS20005571B-page 39
MIC45116
NOTES:
DS20005571B-page 40
2016 - 2022 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip products:
•
Microchip products meet the specifications contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is secure when used in the intended manner, within operating specifications, and
under normal conditions.
•
Microchip values and aggressively protects its intellectual property rights. Attempts to breach the code protection features of
Microchip product is strictly prohibited and may violate the Digital Millennium Copyright Act.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code. Code protection does not
mean that we are guaranteeing the product is “unbreakable”. Code protection is constantly evolving. Microchip is committed to
continuously improving the code protection features of our products.
This publication and the information herein may be used only
with Microchip products, including to design, test, and integrate
Microchip products with your application. Use of this information in any other manner violates these terms. Information
regarding device applications is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your
specifications. Contact your local Microchip sales office for
additional support or, obtain additional support at https://
www.microchip.com/en-us/support/design-help/client-supportservices.
THIS INFORMATION IS PROVIDED BY MICROCHIP "AS IS".
MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED,
WRITTEN OR ORAL, STATUTORY OR OTHERWISE,
RELATED TO THE INFORMATION INCLUDING BUT NOT
LIMITED TO ANY IMPLIED WARRANTIES OF NONINFRINGEMENT, MERCHANTABILITY, AND FITNESS FOR A
PARTICULAR PURPOSE, OR WARRANTIES RELATED TO
ITS CONDITION, QUALITY, OR PERFORMANCE.
IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT, SPECIAL, PUNITIVE, INCIDENTAL, OR CONSEQUENTIAL LOSS, DAMAGE, COST, OR EXPENSE OF ANY
KIND WHATSOEVER RELATED TO THE INFORMATION OR
ITS USE, HOWEVER CAUSED, EVEN IF MICROCHIP HAS
BEEN ADVISED OF THE POSSIBILITY OR THE DAMAGES
ARE FORESEEABLE. TO THE FULLEST EXTENT
ALLOWED BY LAW, MICROCHIP'S TOTAL LIABILITY ON
ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION
OR ITS USE WILL NOT EXCEED THE AMOUNT OF FEES, IF
ANY, THAT YOU HAVE PAID DIRECTLY TO MICROCHIP
FOR THE INFORMATION.
Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to
defend, indemnify and hold harmless Microchip from any and
all damages, claims, suits, or expenses resulting from such
use. No licenses are conveyed, implicitly or otherwise, under
any Microchip intellectual property rights unless otherwise
stated.
Trademarks
The Microchip name and logo, the Microchip logo, Adaptec,
AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud,
CryptoMemory, CryptoRF, dsPIC, flexPWR, HELDO, IGLOO,
JukeBlox, KeeLoq, Kleer, LANCheck, LinkMD, maXStylus,
maXTouch, MediaLB, megaAVR, Microsemi, Microsemi logo,
MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower,
PICSTART, PIC32 logo, PolarFire, Prochip Designer, QTouch,
SAM-BA, SenGenuity, SpyNIC, SST, SST Logo, SuperFlash,
Symmetricom, SyncServer, Tachyon, TimeSource, tinyAVR, UNI/O,
Vectron, and XMEGA are registered trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
AgileSwitch, APT, ClockWorks, The Embedded Control Solutions
Company, EtherSynch, Flashtec, Hyper Speed Control, HyperLight
Load, IntelliMOS, Libero, motorBench, mTouch, Powermite 3,
Precision Edge, ProASIC, ProASIC Plus, ProASIC Plus logo, QuietWire, SmartFusion, SyncWorld, Temux, TimeCesium, TimeHub,
TimePictra, TimeProvider, TrueTime, WinPath, and ZL are
registered trademarks of Microchip Technology Incorporated in the
U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, Augmented Switching, BlueSky,
BodyCom, CodeGuard, CryptoAuthentication, CryptoAutomotive,
CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net,
Dynamic Average Matching, DAM, ECAN, Espresso T1S,
EtherGREEN, GridTime, IdealBridge, In-Circuit Serial
Programming, ICSP, INICnet, Intelligent Paralleling, Inter-Chip
Connectivity, JitterBlocker, Knob-on-Display, maxCrypto, maxView,
memBrain, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo,
MPLIB, MPLINK, MultiTRAK, NetDetach, NVM Express, NVMe,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple
Blocker, RTAX, RTG4, SAM-ICE, Serial Quad I/O, simpleMAP,
SimpliPHY, SmartBuffer, SmartHLS, SMART-I.S., storClad, SQI,
SuperSwitcher, SuperSwitcher II, Switchtec, SynchroPHY, Total
Endurance, TSHARC, USBCheck, VariSense, VectorBlox, VeriPHY,
ViewSpan, WiperLock, XpressConnect, and ZENA are trademarks
of Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
The Adaptec logo, Frequency on Demand, Silicon Storage
Technology, Symmcom, and Trusted Time are registered
trademarks of Microchip Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology Germany
II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in
other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2016 - 2022, Microchip Technology Incorporated and its subsidiaries.
All Rights Reserved.
For information regarding Microchip’s Quality Management Systems,
please visit www.microchip.com/quality.
2016 - 2022 Microchip Technology Inc. and its subsidiaries.
ISBN: 978-1-6683-0319-1
DS20005571B-page 41
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DS20005571B-page 42
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09/14/21
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