MIC47050
500 mA ULDO with Low Input and Low Output Voltage
Features
General Description
• Voltage Range
- Input Voltage: 1.0V to 3.6V
- Bias Voltage: 2.3V to 5.5V
• 0.4V to 2.0V Output Voltage Range
• Low Dropout Voltage of 44 mV at 500 mA
• ±1.5% Initial Output Voltage Accuracy
• High Bandwidth, Very Fast Transient Response
• Stable with a 1 µF Ceramic Output Capacitor
• Logic Level Enable Input
• UVLO on both Supply Voltages
• Available in Thermally Enhanced 2 mm x 2 mm
DFN and TDFN Packages
• -40°C to +125°C Junction Temperature Range
• AEC-Q100 Qualified and PPAP Capable
Available for DFN Package Only
The MIC47050 is a high speed, ultra-low dropout
(ULDO), dual supply NMOS regulator designed to take
advantage of point-of-load applications that use
multiple supply rails to generate a low voltage,
high-current power supply. The MIC47050 can source
500 mA of output current while only requiring a 1 µF
ceramic output capacitor for stability. A 1.5% output
voltage accuracy, low dropout voltage (44 mV at
500 mA) and low ground current make this device
ideally suited for mobile and point-of-load applications.
Applications
•
•
•
•
•
Point-of-Load Applications
PDAs, Notebooks, and Desktops
Datacom and Telecom Systems
DSP, PLD and FPGA Power Supply
Low Voltage Post Regulation
The MIC47050 has an NMOS output stage that offers
very low output impedance. The NMOS output stage
makes for a unique ability to respond very quickly to
sudden load changes such as that required by a
microprocessor, DSP or FPGA. The MIC47050
consumes little quiescent current and can be used for
driving the core voltages of mobile processors, post
regulating a core DC/DC converter in any processor.
The MIC47050 is available in fixed and adjustable
output voltages in a tiny 2 mm x 2 mm DFN and TDFN
packages with an operating junction temperature range
of -40°C to +125°C.
Package Types
MIC47050
6-Pin 2 mm x 2 mm VDFN Fixed (ML)
Top View
MIC47050
6-Pin 2 mm x 2 mm VDFN Adjustable (ML)
Top View
MIC47050
6-Pin 2 mm x 2 mm UDFN Fixed (MT)
Top View
MIC47050
6-Pin 2 mm x 2 mm UDFN Adjustable (MT)
Top View
2018-2022 Microchip Technology Inc. and its subsidiaries
DS20006050D-page 1
MIC47050
Typical Application Circuit
DSP PROCESSOR
UNREGULATED
+3.3V
GPIO
VI/O
MIC23150
VIN
MIC47050-1.2YML
VOUT = 1.8V
SW
FB
VCORE
BIAS
EN
GND
PGOOD
N
0.1μF
PG
10μF
IN
OUT
VOUT = 1.2V
1μF
DS20006050D-page 2
2018-2022 Microchip Technology Inc. and its subsidiaries
MIC47050
Functional Block Diagrams
MIC47050 Fixed Output
MIC47050 Adjustable Output
2018-2022 Microchip Technology Inc. and its subsidiaries
DS20006050D-page 3
MIC47050
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings(†)
IN Supply Voltage (VIN) ................................................................................................................................. -0.3V to +4V
Bias Supply Voltage (VBIAS) .......................................................................................................................... -0.3V to +6V
Enable Voltage (VEN) .................................................................................................................................... -0.3V to +6V
Power Good Voltage (VPGOOD)..................................................................................................................... -0.3V to +6V
ADJ Pin Voltage (VADJ) ................................................................................................................................. -0.3V to +6V
OUT Pin Voltage (VOUT)................................................................................................................................. -0.3V to VIN
ESD Rating (Note 2) ..................................................................................................................................................2 kV
Operating Ratings(‡)
IN Supply Voltage (VIN) ....................................................................................................... +1.0V to +3.6V (VIN < VBIAS)
Bias Voltage (VBIAS) .................................................................................................................................. +2.3V to +5.5V
Enable Input Voltage (VEN) .............................................................................................................................0V to VBIAS
Power Good Voltage (VPGOOD).......................................................................................................................0V to VBIAS
Output Voltage Range ............................................................................................................................... +0.4V to +2.0V
Note 1: The maximum allowable power dissipation of any TA (ambient temperature) is PD(max) = (TJ(max) – TA) / θJA.
Exceeding the maximum allowable power dissipation results in excessive die temperature and the regulator
goes into thermal shutdown.
2: Devices are ESD sensitive. Handling precautions are recommended. Human body model, 1.5 kΩ in series
with 100 pF.
† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above
those indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended periods may affect device reliability. Specifications are for packaged product only.
‡
Notice: The device is not ensured to function outside its operating ratings.
ELECTRICAL CHARACTERISTICS
Electrical Characteristics: VIN = VOUT + 0.5V; VBIAS = VOUT + 2.1V; COUT = 1 µF; IOUT = 100 µA; TJ = +25°C, Bold
values indicate -40°C ≤ TJ ≤ +125°C; unless otherwise noted. Specification for packaged product only.
Parameter
Symbol
Min.
Typ.
Max.
Units
VIN
VIN_UVLO
Conditions
1.0
—
3.6
V
—
0.7
0.85
1.0
V
VIN Rising
VIN UVLO Hysteresis (Note 2) VIN_UVLO_HYST
—
40
—
mV
—
Ground Current in Shutdown
IGND
—
0.1
1.0
µA
VEN ≤ 0.2V (Regulator
Shutdown)
IIN
—
6
15
µA
IOUT = 500 mA; VIN = VOUT
+ 0.5V
Input Supply
Input Voltage Range
VIN UVLO Threshold (Note 1)
IN Bias Current
BIAS Supply
BIAS Input Voltage
VBIAS
2.3
—
5.5
V
—
VBIAS UVLO Threshold
(Note 1)
BIAS_UVLO
1.7
2.1
2.3
V
VBIAS Rising
VBIAS UVLO Hysteresis
(Note 2)
BIAS_UVLO_HYS
—
75
—
mV
Note 1:
2:
3:
—
Both VIN and VBIAS UVLO thresholds must be met for the output voltage to turn on. If either of the two
input voltages is below the UVLO thresholds, the output is disabled.
These parameters are characterized but not production tested.
Design guidance only, not production tested.
DS20006050D-page 4
2018-2022 Microchip Technology Inc. and its subsidiaries
MIC47050
ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Characteristics: VIN = VOUT + 0.5V; VBIAS = VOUT + 2.1V; COUT = 1 µF; IOUT = 100 µA; TJ = +25°C, Bold
values indicate -40°C ≤ TJ ≤ +125°C; unless otherwise noted. Specification for packaged product only.
Parameter
Dropout Voltage
VBIAS Supply Current
VBIAS Supply Current in
Shutdown (IBIAS)
Symbol
Min.
Typ.
Max.
Units
Conditions
—
1.15
—
—
1.25
2.1
IBIAS
—
330
500
µA
IOUT = 1 mA; VBIAS = VOUT +
2.1V
IBIAS_SHDN
—
0.1
1.0
µA
VEN ≤ 0.2V (Regulator
Shutdown)
—
9
50
VBIAS - VOUT
V
IOUT = 100 mA (Note 2)
IOUT = 500 mA
Output Voltage
Dropout Voltage
VIN - VOUT
mV
IOUT = 100 mA
—
44
120
-1.5
—
+1.5
-2.0
—
+2.0
ΔVOUT/
(VOUT x ΔVBIAS)
-0.1
0.015
0.1
%/V
VBIAS = VOUT + 2.1V to 5.5V
VIN Line Regulation
ΔVOUT/
(VOUT x ΔVIN)
-0.05
0.005
0.05
%/V
VIN = VOUT + 0.5V to 3.6V
Load Regulation
ΔVOUT/VOUT
—
0.2
0.5
%
IOUT = 10 mA to 500 mA
ISC
0.6
1.6
3
A
VIN = 2.7V; VOUT = 0V
VEN_HIGH
1.0
0.77
—
V
—
EN Logic Level Low
VEN_LOW
—
0.67
0.2
V
—
EN Hysteresis (Note 2)
VEN_HYST
—
100
—
mV
—
IEN_SHDN
—
1
2
Output Voltage Accuracy
VBIAS Line Regulation
VOUT
%
IOUT = 500 mA
IOUT = 100 µA, variation
from nominal VOUT
Current-Limit
Short-Circuit Current Limit
Enable Input
EN Logic Level High
Enable Bias Current
µA
VEN ≤ 0.2V (Regulator
Shutdown)
VEN = 1.0V (Regulator
Enabled)
IEN
—
6
10
tON
—
15
500
µs
COUT = 1 µF; 90% of typical
VOUT
TSD
—
160
—
°C
TJ Rising
ΔTSD
—
20
—
°C
—
Power Good Threshold
Voltage
VPWRGD_TH_R
—
91
95
VPWRGD_TH_F
85
89
—
Power Good Hysteresis
(Note 2)
PWRGDHYST
—
2
—
%
—
Power Good Output Low
Voltage
VPWRGD_L
—
0.02
0.1
V
IPG = 250 µA
Power Good Leakage Current
IPWRGD_L
-1
0.01
+1
µA
VPG = 5.0V
Turn-On Time
Thermal Protection
Overtemperature Shutdown
(Note 3)
Overtemperature Shutdown
Hysteresis (Note 3)
Power Good
Note 1:
2:
3:
%
VOUT Rising
VOUT Falling
Both VIN and VBIAS UVLO thresholds must be met for the output voltage to turn on. If either of the two
input voltages is below the UVLO thresholds, the output is disabled.
These parameters are characterized but not production tested.
Design guidance only, not production tested.
2018-2022 Microchip Technology Inc. and its subsidiaries
DS20006050D-page 5
MIC47050
ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Characteristics: VIN = VOUT + 0.5V; VBIAS = VOUT + 2.1V; COUT = 1 µF; IOUT = 100 µA; TJ = +25°C, Bold
values indicate -40°C ≤ TJ ≤ +125°C; unless otherwise noted. Specification for packaged product only.
Parameter
Symbol
Min.
Typ.
Max.
Units
0.406
V
0.408
V
Conditions
Reference Voltage (Adjustable Option Only)
Feedback Reference Voltage
VFB
FB Bias Current (Note 2)
IFB
0.394
0.4
0.392
IOUT = 100 µA
—
20
—
nA
VFB = 0.8V
—
122.71
—
µVRMS
—
50
—
—
37
—
Output Voltage Noise and Ripple Rejection
Output Voltage Noise
(Note 3)
Ripple Rejection (Note 3)
Note 1:
2:
3:
eN
PSRR
f = 10 Hz to 100 kHz;
IOUT = 100 mA; COUT = 1 µF
f = 10 kHz; COUT = 1.0 µF,
IOUT = 100 mA
dB
f = 100 kHz; COUT = 1.0 µF,
IOUT = 100 mA
Both VIN and VBIAS UVLO thresholds must be met for the output voltage to turn on. If either of the two
input voltages is below the UVLO thresholds, the output is disabled.
These parameters are characterized but not production tested.
Design guidance only, not production tested.
TEMPERATURE SPECIFICATIONS (Note 1)
Parameters
Symbol
Min.
Typ.
Max.
Units
Conditions
Lead Temperature
—
—
—
260
°C
Soldering, 10 sec.
Storage Temperature Range
TS
-65
—
+150
°C
—
Junction Temperature Range
TJ
-40
—
+125
°C
—
JA
—
90
—
JC
—
45
—
JA
—
90
—
JC
—
45
—
Temperature Ranges
Package Thermal Resistances
Thermal Resistance DFN-6
Thermal Resistance TDFN-6
Note 1:
°C/W
°C/W
—
—
—
—
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the
maximum allowable power dissipation causes the device operating junction temperature to exceed the
maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.
DS20006050D-page 6
2018-2022 Microchip Technology Inc. and its subsidiaries
MIC47050
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
2.2
2.0
2.0
OUTPUT VOLTAGE (V)
OUTPUT VOLTAGE (V)
1.8
1.6
1.4
1.2
1.0
0.8
0.6
VBIAS = 5.0V
0.4
VOUT = 1.8V
0.2
IOUT = 500mA
1
2
3
1.6
1.4
1.2
IOUT = 500mA
1.0
0.8
0.6
VIN = 2.5V
0.4
0.0
0
IOUT = 100mA
1.8
VOUT = 1.8V
0.2
4
2
INPUT VOLTAGE (V)
3
4
5
BIAS VOLTAGE (V)
Output Voltage vs. Input
FIGURE 2-4:
Voltage.
50
2.0
45
1.8
40
DROPOUT VOLTAGE (V)
DROPOUT VOLTAGE (mV)
FIGURE 2-1:
Voltage.
35
30
25
20
15
10
VBIAS = 5.0V
5
Output Voltage vs. Bias
1.6
VOUT = 2.0V
1.4
1.2
1.0
VOUT = 1.2V
0.8
0.6
0.4
VIN = 2.5V
0.2
VOUT = 1.2V
0
0.0
0
100
200
300
400
500
0
100
OUTPUT CURRENT (mA)
FIGURE 2-2:
Output Current.
Input Dropout Voltage vs.
FIGURE 2-5:
Output Current.
DROPOUT VOLTAGE (V)
DROPOUT VOLTAGE (mV)
70
60
ILOAD = 500 mA
50
40
VBIAS = 3.3V
VOUT = 1.2V
30
20
ILOAD =
= 100
100 mA
ILOAD
mA
10
200
300
400
500
OUTPUT CURRENT (mA)
Bias Dropout Voltage vs.
1.9
VIN = 2.5V
ILOAD = 500 mA
1.7
VOUT = 1.8V
1.5
1.3
= 1.2V
1.2V
VOUT
OUT =
1.1
0.9
0
-40
-20
FIGURE 2-3:
Temperature.
0
20
40
60
TEMPERATURE (°C)
80
100
120
Input Dropout Voltage vs.
2018-2022 Microchip Technology Inc. and its subsidiaries
-40
-20
FIGURE 2-6:
Temperature.
0
20
40
60
TEMPERATURE (°C)
80
100
120
Bias Dropout Voltage vs.
DS20006050D-page 7
MIC47050
440
30
VBIAS = 5.0V
400
VOUT = 1.2V
25
IN BIAS CURRENT (μA)
BIAS CURRENT (μA)
420
380
IOUT = 500mA
20
360
340
15
320
10
300
280
VIN = 1.8V
260
IOUT = 1mA
240
5
0
3
3.5
4
4.5
5
1.2
5.5
1.6
BIAS VOLTAGE (V)
FIGURE 2-10:
Voltage.
Bias Current vs. Bias
340
7
338
6.5
IN BIAS CURRENT (μA)
BIAS CURRENT (μA)
FIGURE 2-7:
Voltage.
336
334
332
330
328
326
VBIAS = 3.6V
324
VIN = 1.8V
322
VOUT = 1.2V
320
0
100
200
300
400
3.2
3.6
Input Bias Current vs. Input
6
5.5
5
4.5
VIN = 1.7V
VBIAS = 3.3V
VOUT = 1.2V
ILOAD = 500 mA
4
3.5
3
500
-40
-20
0
20
40
60
TEMPERATURE (°C)
OUTPUT CURRENT (mA)
FIGURE 2-8:
Current.
2
2.4
2.8
INPUT VOLTAGE (V)
FIGURE 2-11:
Temperature.
Bias Current vs. Output
350
80
100
120
Input Bias Current vs.
1.208
1.206
OUTPUT VOLTAGE (V)
BIAS CURRENT (μA)
340
330
320
VIN = 1.7V
VBIAS = 3.3V
VOUT = 1.2V
ILOAD = 1 mA
310
300
1.204
1.202
1.200
1.198
1.196
1.194
VBIAS = 3.6V
1.192
VIN = 1.8V
1.190
0
290
-40
-20
FIGURE 2-9:
Temperature.
DS20006050D-page 8
0
20
40
60
TEMPERATURE (°C)
80
Bias Current vs.
100
100
200
300
400
500
OUTPUT CURRENT (mA)
120
FIGURE 2-12:
Current.
Output Voltage vs. Output
2018-2022 Microchip Technology Inc. and its subsidiaries
1.80
90
1.75
80
1.70
70
1.65
60
PSRR (dB)
CURRENT LIMIT (A)
MIC47050
50
1.60
40
1.55
30
VBIAS = 3.6V
VBIAS = 5.0V
20
VIN = 1.8V ± 300mV
VOUT = 1.2V
10
1.50
1.45
1.40
1.5
2
2.5
3
3.5
0
0.01
4
INPUT VOLTAGE (V)
0.1
1
10
100
1000
FREQUENCY (kHz)
Current-Limit vs. Input
FIGURE 2-16:
Power Supply Ripple
Rejection (Input Voltage).
2.4
90
2.3
80
2.2
70
60
2.1
PSRR (dB)
CURRENT LIMIT (A)
FIGURE 2-13:
Voltage.
VOUT = 1.2V
IOUT = 500mA
50
2
40
1.9
30
1.8
20
VIN = 1.7V
VBIAS = 3.3V
VOUT = 1.2V
1.7
10
-20
0
20
40
60
TEMPERATURE (°C)
FIGURE 2-14:
Temperature.
80
100
VIN = 1.8V
VOUT = 1.2V
IOUT = 500mA
0
0.01
0.1
1.6
-40
VBIAS = 3.6V ± 300mV
120
1
10
100
1000
FREQUENCY (kHz)
Current-Limit vs.
FIGURE 2-17:
Power Supply Ripple
Rejection (Bias Voltage).
1.225
100.000
OUTPUT VOLTAGE (V)
1.220
1.215
1.205
1.200
VBIAS = 3.3V
1.195
VIN = 1.7V
1.190
I LOAD = 100μA
12,6(9¥+]
10.000
1.210
1.000
0.100
0.010
VIN = 1.8V
VBIAS = 4.1V
VOUT = 1.2V
load = 100 mA
Noise (100Hz - 100 kHz )= 112.28 μVrms
0.001
0.01
1.185
-40 -20
0
20
40
60
80
100 120
Output Voltage vs.
2018-2022 Microchip Technology Inc. and its subsidiaries
1
10
100
1000
10000
FREQUENCY N+]
TEMPERATURE (°C)
FIGURE 2-15:
Temperature.
0.1
FIGURE 2-18:
Output Noise.
DS20006050D-page 9
MIC47050
FIGURE 2-19:
Enabled into Short-Circuit.
FIGURE 2-22:
Enable Turn-Off Time.
FIGURE 2-20:
Load Transient Response.
FIGURE 2-23:
Input Line Transient.
FIGURE 2-21:
Enable Turn-On Time.
FIGURE 2-24:
Bias Line Transient.
DS20006050D-page 10
2018-2022 Microchip Technology Inc. and its subsidiaries
MIC47050
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
Pin Number
(Fixed)
Pin Number
(Adjustable)
Pin Name
Description
1
1
BIAS
Bias Supply. The bias supply is the power supply for the internal circuitry
of the regulator.
2
2
GND
Ground. Ground pins and exposed pad must be connected externally.
3
3
IN
Input Supply. Drain of NMOS pass transistor, which is the power input
voltage for regulator. The NMOS pass transistor steps down this input
voltage to create the output voltage.
4
4
OUT
Output. Output voltage of regulator.
Power Good Output. Open-drain output. Output is driven low when the
output voltage is less than the power good threshold of its programmed
nominal output voltage. When the output goes above the power good
threshold, the open-drain output goes high impedance, allowing it to be
pulled up to a fixed voltage.
5
—
PGOOD
—
5
ADJ
Adjust Input. Connect external resistor divider to program the output
voltage.
6
6
EN
Enable: TTL/CMOS compatible input. Logic-high = enable,
Logic-low = shutdown. Do not leave floating.
ePAD
ePAD
GND
Exposed thermal pad. Connect to the ground plane to maximize thermal
performance.
2018-2022 Microchip Technology Inc. and its subsidiaries
DS20006050D-page 11
MIC47050
4.0
FUNCTIONAL DESCRIPTION
The MIC47050 is a high speed, ultra-low dropout, dual
supply NMOS ULDO designed to take advantage of
point-of-load applications that use multiple supply rails
to generate a low voltage, high-current power supply.
The MIC47050 can source 0.5A of output current while
only requiring a 1 µF ceramic output capacitor for
stability. The MIC47050 regulator is fully protected from
damage due to fault conditions, offering linear current
limiting and thermal shutdown.
4.1
Bias Supply Voltage
VBIAS, requiring relatively light current, provides power
to the control portion of the MIC47050. Bypassing on
the bias pin is recommended to improve performance
of the regulator during line and load transients. Small
0.1 µF ceramic capacitors from VBIAS to ground help
reduce high frequency noise from being injected into
the control circuitry from the bias rail and are good
design practice.
4.2
Input Supply Voltage
VIN provides the supply to power the LDO. The
minimum input voltage is 1.0V. This allows conversion
from low voltage supplies to reduce the power
dissipation in the pass element.
4.3
Input Capacitor
The MIC47050 is a high-performance, high bandwidth
device. Therefore, it requires a well bypassed input
supply for optimal performance. A 1 µF capacitor is the
minimum required for stability. A 10 µF ceramic
capacitor is recommended for most applications,
especially if the LDO’s headroom (VIN - VOUT) is small
and/or if large load transients are present. Fast load
transient and low headroom requires a larger input filter
capacitor to ensure that the regulator does not drop out
of regulation. A 10 µF will better attenuate any voltage
glitches from exceeding the maximum voltage rating of
the part.
Additional high frequency capacitors, such as small
valued NPO dielectric type capacitors, help filter out
high frequency noise and are good practice in any RF
based circuit.
X7R and X5R dielectric ceramic capacitors are
recommended because of their temperature
performance. X7R type capacitors change capacitance
by 15% over their operating temperature range and are
the most stable type of ceramic capacitors. Z5U and
Y5V dielectric capacitors are not recommended since
they change value by as much as 50% and 60%
respectively over their operating temperature ranges.
To use a ceramic chip capacitor with Y5V dielectric, the
DS20006050D-page 12
value must be much higher than an X7R ceramic or a
tantalum capacitor to ensure the same capacitance
value over the operating temperature range.
Tantalum capacitors have a very stable dielectric (10%
over their operating temperature range) and can also
be used with this device. See Section 2.0 “Typical
Performance Curves” for examples of load transient
response.
4.4
Output Capacitor
The MIC47050 requires an output capacitor of 1 µF or
greater to maintain stability. The design is optimized for
use with low ESR ceramic chip capacitors. High ESR
capacitors may cause high frequency oscillation. The
output capacitor can be increased, but performance
has been optimized for a 1 µF ceramic output capacitor
and does not improve significantly with larger
capacitance.
The output capacitor type and placement criteria are
the same as the input capacitor. See the Section 4.3
“Input Capacitor” for a detailed description.
4.5
Minimum Load Current
The MIC47050, unlike most other regulators, does not
require a minimum load to maintain output voltage
regulation.
4.6
Adjustable Regulator Design
The MIC47050 adjustable version allows programming
the output voltage from 0.4V to 2.0V. Two external
resistors are required. The R1 resistor value between
VOUT and the ADJ pin should not exceed 10 kΩ, as
larger values can cause instability. R2 connects
between the ADJ pin and ground. The resistor values
are calculated as follows:
EQUATION 4-1:
Where:
V OUT
R1 = R2 ------------– 1
V REF
VOUT =
The desired output voltage
VREF =
The internal reference voltage
VREF =
0.4V
4.7
Enable/Shutdown
The MIC47050 comes with a single active-high enable
pin that allows the regulator to be disabled. Forcing the
enable pin low disables the regulator and sends it into
a “zero” off mode current state. In this state, current
2018-2022 Microchip Technology Inc. and its subsidiaries
MIC47050
consumed by the regulator goes nearly to zero. Forcing
the enable pin high enables the output voltage. The
active-high enable pin uses CMOS technology and the
enable pin cannot be left floating. A floating enable pin
may cause an indeterminate state on the output.
4.8
EQUATION 4-3:
P D = 1.8V – 1.2V 0.5A = 0.3W
Power Good (PGOOD)
The Power Good (PGOOD) pin is an open-drain output
that goes low when the output voltage (fixed version)
drops below the PGOOD threshold voltage.
The pull-up resistor value should be large enough to
guarantee a proper low voltage when the PGOOD pin
pulls low. The PGOOD low voltage is typically 0.1V at
250 µA current. A 10 kΩ resistor or greater is
recommended when pulling up to 3.3V bias.
To determine the maximum ambient operating
temperature
of
the
package,
use
the
junction-to-ambient thermal resistance of the device
and the following basic equation:
EQUATION 4-4:
If the PGOOD function is not required, the PGOOD pin
may be left unconnected.
4.9
T J MAX – T A
P D MAX = ------------------------------- JA
Thermal Shutdown
The MIC47050 has an internal overtemperature
protection feature. This feature is for protection only.
The device should never be intentionally operated near
this temperature as this may reduce long term
reliability. The device will turn off when the
overtemperature threshold is exceeded. A 20°C
hysteresis is built in to allow the device to cool before
turning back on.
Where:
4.10
Table 4-1
shows
junction-to-ambient
thermal
resistance for the MIC47050 in the DFN or TDFN
packages.
Thermal Considerations
The MIC47050 is designed to provide 0.5A of
continuous current in a very small package. Maximum
ambient operating temperature can be calculated
based on the output current and the voltage drop
across the part. Given that the input voltage is 1.8V, the
output voltage is 1.2V and the output current is 0.5A.
The actual power dissipation of the regulator circuit can
be determined using Equation 4-2:
EQUATION 4-2:
P D = V IN – V OUT I OUT + V IN I GND +
V BIAS I BIAS
Because this device is CMOS, the ground current is
insignificant for power dissipation and can be ignored
for this calculation.
2018-2022 Microchip Technology Inc. and its subsidiaries
TJ(MAX) = 125°C, the maximum junction temperature of the die
JA =
90°C/W, the thermal resistance
TABLE 4-1:
THERMAL RESISTANCE
Package
JA Recommended
Min. Footprint
JC
6-Pin 2 mm x 2 mm
DFN
90°C/W
45°C/W
6-Pin 2 mm x 2 mm
TDFN
90°C/W
45°C/W
Substituting PD for PD(max) and solving for the ambient
operating temperature will give the maximum operating
conditions
for
the
regulator
circuit.
The
junction-to-ambient thermal resistance for the
minimum footprint is 90°C/W. The maximum power
dissipation must not be exceeded for proper operation.
For example, when operating the MIC47050-1.2YML at
an input voltage of 1.8V and a 0.5A load with a
minimum footprint layout, the maximum ambient
operating temperature TA can be determined as
follows:
DS20006050D-page 13
MIC47050
EQUATION 4-5:
T A = T J MAX – JA P D MAX
T A = 125C – 90C/W 0.3W
T A = 98C
Therefore, a 1.2V application with 0.5A of output
current can accept an ambient operating temperature
of 98°C in a 2 mm x 2 mm DFN or TDFN package.
4.11
Thermal Measurements
Measuring the IC’s case temperature is recommended
to insure it is within its operating limits. Although this
might seem like a very elementary task, it is easy to get
erroneous results. The most common mistake is to use
the standard thermal couple that comes with a thermal
meter. This thermal couple wire gauge is large, typically
22 gauge, and behaves like a heat sink, resulting in a
lower case measurement.
Two methods of temperature measurement are using a
smaller thermal couple wire or an infrared
thermometer. If a thermal couple wire is used, it must
be constructed of 36 gauge wire or higher (smaller wire
size) to minimize the wire heat sinking effect.
In addition, the thermal couple tip must be covered in
either thermal grease or thermal glue to make sure that
the thermal couple junction is making good contact with
the case of the IC. Omega brand thermal couple
(5SC-TT-K-36-36) is adequate for most applications.
Wherever possible, an infrared thermometer is
recommended. The measurement spot size of most
infrared thermometers is too large for an accurate
reading on a small form factor ICs. However, a IR
thermometer from Optris has a 1 mm spot size, which
makes it a good choice for the 2 mm x 2 mm DFN or
TDFN package. An optional stand makes it easy to hold
the beam on the IC for long periods of time.
For a full discussion of heat sinking and thermal effects
of voltage regulators, refer to the "Regulator Thermals"
section of Designing with Low-Dropout Voltage
Regulators handbook.
DS20006050D-page 14
2018-2022 Microchip Technology Inc. and its subsidiaries
MIC47050
5.0
PACKAGING INFORMATION
5.1
Package Marking Information
6-Lead UDFN (2 x 2 x 0.6 mm)
Example
Part Number
MIC47050YMT-TR
XXX
NNN
Note:
Code
ZGA
The content of this table applies
to 6-Lead UDFN.
6-Lead VDFN (2 x 2 x 0.9 mm)
Example
Part Number
XXX
NNN
e3
*
Code
MIC47050YML-TR(VAO)
ZGA
MIC47050-1.2YML-TR(VAO)
ZG4
MIC47050-1.8YML-TR(VAO)
ZGG
Note:
Legend: XX...X
Y
YY
WW
NNN
ZGA
XXX
256
NNN
ZG4
XXX
256
NNN
The content of this table applies to
6-Lead VDFN.
Product code or customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits MIC2132of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle
mark).
Note:
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information. Package may or may not include
the corporate logo.
Underbar (_) and/or Overbar (‾) symbol may not be to scale.
2018-2022 Microchip Technology Inc. and its subsidiaries
DS20006050D-page 15
MIC47050
6-Lead 2 mm x 2 mm VDFN Package Outline and Recommended Land Pattern
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
DS20006050D-page 16
2018-2022 Microchip Technology Inc. and its subsidiaries
MIC47050
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
2018-2022 Microchip Technology Inc. and its subsidiaries
DS20006050D-page 17
MIC47050
6-Lead 2 mm x 2 mm UDFN Package Outline and Recommended Land Pattern
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
DS20006050D-page 18
2018-2022 Microchip Technology Inc. and its subsidiaries
MIC47050
APPENDIX A:
REVISION HISTORY
Revision D (January 2022)
• Minor editorial and layout corrections
• Updated Packaging Information
• Updated the Product Identification System with
automotive information and examples
Revision C (February 2019)
• Updated the Electrical Characteristics table
Revision B (September 2018)
• Updated images for Figure 2-3, Figure 2-6,
Figure 2-9, Figure 2-11, Figure 2-14 and
Figure 2-15
Revision A (July 2018)
• Converted Micrel document MIC47050 to
Microchip Data Sheet DS20006050D
• Added Automotive feature AEC-Q100 Qualified
and PPAP Capable in the Features section
• Updated images for Figure 2-10,
Figure 2-11, Figure 2-18, Figure 2-19 through
Figure 2-24
2018-2022 Microchip Technology Inc. and its subsidiaries
DS20006050D-page 19
MIC47050
NOTES:
DS20006050D-page 20
2018-2022 Microchip Technology Inc.
MIC47050
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
PART NO.
XX
X
–X
–XX
XXX
Device Output
Junction Package Media Type Qualification
Voltage Temperature
Range
Device:
MIC47050:
500 mA ULDO with Low Input and Low
Output Voltage
1.2
1.8
= 1.2V Fixed
= 1.8V Fixed
= Adjustable
Junction
Temperature Range:
Y
= -40°C to +125°C, RoHS Compliant
Package:
ML
MT
= 6-Lead 2 mm x 2 mm x 0.9 mm VDFN
= 6-Lead 2 mm x 2 mm x 0.6 mm UDFN
Tape and Reel Option:
TR
= 5000/Reel
Qualification:
VAO
= Standard Part
= Automotive AEC-Q100 Qualified
Output Voltage:
Examples:
a) MIC47050YML-TR:
500 mA ULDO with Low Input
and Low Output Voltage,
Adjustable Output Voltage,
-40°C to +125°C Temperature
Range, 6LD VDFN Package,
5000/Reel
b) MIC47050-1.2YML-TR:
500 mA ULDO with Low Input
and Low Output Voltage, 1.2V
Fixed Output Voltage,
-40°C to +125°C Temperature
Range, 6LD VDFN Package,
5000/Reel
c) MIC47050-1.8YML-TR:
500 mA ULDO with Low Input
and Low Output Voltage, 1.8V
Fixed Output Voltage, -40°C
to +125°C Temperature
Range, 6LD VDFN Package,
5000/Reel
d) MIC47050YMT-TR:
500 mA ULDO with Low Input
and Low Output Voltage,
Adjustable Output Voltage,
-40°C to +125°C Temperature
Range, 6LD UDFN Package,
5000/Reel
e) MIC47050YML-TRVAO:
500 mA ULDO with Low Input
and Low Output Voltage,
Adjustable Output Voltage,
-40°C to +125°C Temperature
Range, 6LD VDFN Package,
Automotive Qualified,
5000/Reel
f) MIC47050-1.2YML-TRVAO:
500 mA ULDO with Low Input
and Low Output Voltage, 1.2V
Fixed Output Voltage, -40°C
to +125°C Temperature
Range, 6LD VDFN Package,
Automotive Qualified,
5000/Reel
g) MIC47050-1.8YML-TRVAO: 500 mA ULDO with Low Input
and Low Output Voltage, 1.8V
Fixed Output Voltage,
-40°C to +125°C Temperature
Range, 6LD VDFN Package,
Automotive Qualified,
5000/Reel
Note 1:
2018-2022 Microchip Technology Inc. and its subsidiaries
Tape and Reel identifier only appears in the catalog
part number description. This identifier is used for
ordering purposes and is not printed on the device
package. Check with your Microchip Sales Office for
package availability with the Tape and Reel option.
DS20006050D-page 21
MIC47050
NOTES:
DS20006050D-page 22
2018-2022 Microchip Technology Inc. and its subsidiaries
Note the following details of the code protection feature on Microchip products:
•
Microchip products meet the specifications contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is secure when used in the intended manner, within operating specifications, and
under normal conditions.
•
Microchip values and aggressively protects its intellectual property rights. Attempts to breach the code protection features of
Microchip product is strictly prohibited and may violate the Digital Millennium Copyright Act.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code. Code protection does not
mean that we are guaranteeing the product is “unbreakable”. Code protection is constantly evolving. Microchip is committed to
continuously improving the code protection features of our products.
This publication and the information herein may be used only
with Microchip products, including to design, test, and integrate
Microchip products with your application. Use of this information in any other manner violates these terms. Information
regarding device applications is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your
specifications. Contact your local Microchip sales office for
additional support or, obtain additional support at https://
www.microchip.com/en-us/support/design-help/client-supportservices.
THIS INFORMATION IS PROVIDED BY MICROCHIP "AS IS".
MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED,
WRITTEN OR ORAL, STATUTORY OR OTHERWISE,
RELATED TO THE INFORMATION INCLUDING BUT NOT
LIMITED TO ANY IMPLIED WARRANTIES OF NONINFRINGEMENT, MERCHANTABILITY, AND FITNESS FOR A
PARTICULAR PURPOSE, OR WARRANTIES RELATED TO
ITS CONDITION, QUALITY, OR PERFORMANCE.
IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT, SPECIAL, PUNITIVE, INCIDENTAL, OR CONSEQUENTIAL LOSS, DAMAGE, COST, OR EXPENSE OF ANY
KIND WHATSOEVER RELATED TO THE INFORMATION OR
ITS USE, HOWEVER CAUSED, EVEN IF MICROCHIP HAS
BEEN ADVISED OF THE POSSIBILITY OR THE DAMAGES
ARE FORESEEABLE. TO THE FULLEST EXTENT
ALLOWED BY LAW, MICROCHIP'S TOTAL LIABILITY ON
ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION
OR ITS USE WILL NOT EXCEED THE AMOUNT OF FEES, IF
ANY, THAT YOU HAVE PAID DIRECTLY TO MICROCHIP
FOR THE INFORMATION.
Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to
defend, indemnify and hold harmless Microchip from any and
all damages, claims, suits, or expenses resulting from such
use. No licenses are conveyed, implicitly or otherwise, under
any Microchip intellectual property rights unless otherwise
stated.
Trademarks
The Microchip name and logo, the Microchip logo, Adaptec,
AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud,
CryptoMemory, CryptoRF, dsPIC, flexPWR, HELDO, IGLOO,
JukeBlox, KeeLoq, Kleer, LANCheck, LinkMD, maXStylus,
maXTouch, MediaLB, megaAVR, Microsemi, Microsemi logo,
MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower,
PICSTART, PIC32 logo, PolarFire, Prochip Designer, QTouch,
SAM-BA, SenGenuity, SpyNIC, SST, SST Logo, SuperFlash,
Symmetricom, SyncServer, Tachyon, TimeSource, tinyAVR, UNI/O,
Vectron, and XMEGA are registered trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
AgileSwitch, APT, ClockWorks, The Embedded Control Solutions
Company, EtherSynch, Flashtec, Hyper Speed Control, HyperLight
Load, IntelliMOS, Libero, motorBench, mTouch, Powermite 3,
Precision Edge, ProASIC, ProASIC Plus, ProASIC Plus logo, QuietWire, SmartFusion, SyncWorld, Temux, TimeCesium, TimeHub,
TimePictra, TimeProvider, TrueTime, WinPath, and ZL are
registered trademarks of Microchip Technology Incorporated in the
U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, Augmented Switching, BlueSky,
BodyCom, CodeGuard, CryptoAuthentication, CryptoAutomotive,
CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net,
Dynamic Average Matching, DAM, ECAN, Espresso T1S,
EtherGREEN, GridTime, IdealBridge, In-Circuit Serial
Programming, ICSP, INICnet, Intelligent Paralleling, Inter-Chip
Connectivity, JitterBlocker, Knob-on-Display, maxCrypto, maxView,
memBrain, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo,
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Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
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Blocker, RTAX, RTG4, SAM-ICE, Serial Quad I/O, simpleMAP,
SimpliPHY, SmartBuffer, SmartHLS, SMART-I.S., storClad, SQI,
SuperSwitcher, SuperSwitcher II, Switchtec, SynchroPHY, Total
Endurance, TSHARC, USBCheck, VariSense, VectorBlox, VeriPHY,
ViewSpan, WiperLock, XpressConnect, and ZENA are trademarks
of Microchip Technology Incorporated in the U.S.A. and other
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SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
The Adaptec logo, Frequency on Demand, Silicon Storage
Technology, Symmcom, and Trusted Time are registered
trademarks of Microchip Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology Germany
II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in
other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2018-2022, Microchip Technology Incorporated and its subsidiaries.
All Rights Reserved.
For information regarding Microchip’s Quality Management Systems,
please visit www.microchip.com/quality.
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ISBN: 978-1-5224-9307-5
DS20006050D-page 23
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DS20006050D-page 24
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