MIC5200
100 mA Low-Dropout Regulator
Features
General Description
•
•
•
•
•
•
•
•
•
•
•
The MIC5200 is an efficient linear voltage regulator
with very low dropout voltage (typically 17 mV at light
loads and 200 mV at 100 mA), and very low ground
current (1 mA at 100 mA output), offering better than
1% initial accuracy with a logic-compatible ON/OFF
switching input. Designed especially for hand-held
battery-powered devices, the MIC5200 is switched by
a CMOS- or TTL-compatible logic signal. The ENABLE
control may be tied directly to VIN if unneeded. When
disabled, power consumption drops nearly to zero. The
ground current of the MIC5200 increases only slightly
in dropout, further prolonging battery life. Key MIC5200
features include protection against reversed battery,
current limiting, and overtemperature shutdown.
High Output Voltage Accuracy
Variety of Output Voltages
Guaranteed 100 mA Output
Low Quiescent Current
Low Dropout Voltage
Extremely Tight Load and Line Regulation
Very Low Temperature Coefficient
Current and Thermal Limiting
Zero OFF Mode Current
Logic-Controlled Electronic Shutdown
Available in 8-Lead SOIC, 8-Lead MSOP, and
3-Lead SOT-223 Packages
Applications
•
•
•
•
•
•
•
The MIC5200 is available in several fixed voltages and
accuracy configurations. Other options are available;
contact Microchip for details.
Cellular Telephones
Laptop, Notebook, and Palmtop Computers
Battery-Powered Equipment
PCMCIA VCC and VPP Regulation/Switching
Barcode Scanners
SMPS Post-Regulator/DC-to-DC Modules
High Efficiency Linear Power Supplies
Typical Application Schematic
MIC5200-3.3
OUTPUT
1μF
ENABLE
2016 - 2022 Microchip Technology Inc. and its subsidiaries
DS20005578B-page 1
MIC5200
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
Input Supply Voltage ................................................................................................................................... –20V to +60V
Enable Input Voltage ................................................................................................................................... –20V to +60V
Power Dissipation...................................................................................................................................Internally Limited
Operating Ratings ‡
Input Voltage .............................................................................................................................................. +2.5V to +26V
Enable Input Voltage ...................................................................................................................................... –20V to VIN
† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at those or any other conditions above those indicated
in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended
periods may affect device reliability.
‡ Notice: The device is not guaranteed to function outside its operating ratings.
DS20005578B-page 2
2016 - 2022 Microchip Technology Inc. and its subsidiaries
MIC5200
ELECTRICAL CHARACTERISTICS
Electrical Characteristics: Limits in standard typeface are for TJ = +25°C and limits in boldface apply over the
junction temperature range of –40°C to +125°C. Unless otherwise specified, VIN = VOUT + 1V, IL = 1 mA, CL = 3.3 μF,
and VENABLE = VDD. (Note 1).
Parameters
Output Voltage Accuracy
Sym.
VO
Output Voltage Temperature
Coefficient
ΔVO/ΔT
Line Regulation
ΔVO/VIN
Load Regulation
ΔVO/VOUT
Dropout Voltage (Note 4)
Quiescent Current
Ground Pin Current
VIN – VO
IGND
IGND
Min.
Typ.
Max.
Units
–1
—
1
–2
—
2
—
40
150
—
0.004
0.10
—
—
0.40
—
0.04
0.16
—
—
0.30
—
17
—
IL = 100 µA
—
130
—
IL = 20 mA
—
150
—
—
190
—
IL = 50 mA
—
230
350
IL = 100 mA
—
0.01
10
—
130
—
—
270
350
—
330
—
—
500
—
IL = 50 mA
—
1000
1500
IL = 100 mA
%
Conditions
Variation from specified VOUT
ppm/°C Note 2
%
VIN = VOUT + 1V to 26V
%
IL = 0.1 mA to 100 mA (Note 3)
mV
µA
IL = 30 mA
VENABLE ≤ 0.7V (shutdown)
VENABLE = VDD, IL = 100 µA
IL = 20 mA
µA
IL = 30 mA
Ripple Rejection
PSRR
—
70
—
dB
—
Ground Pin Current at Dropout
IGNDDO
—
270
330
µA
VIN = 0.5V less than specified
VOUT, IL = 100 µA (Note 5)
ILIMIT
100
250
—
mA
VOUT = 0V
ΔVO/ΔPD
—
0.05
—
%/W
en
—
100
—
µV
Current Limit
Thermal Regulation
Output Noise
Note 1:
2:
3:
4:
5:
6:
Note 6
—
Specification for packaged product only.
Output voltage temperature coefficient is defined as the worst case voltage change divided by the total
temperature range.
Regulation is measured at constant junction temperature using low duty cycle pulse testing. Parts are
tested for load regulation in the load range from 0.1 mA to 100 mA. Changes in output voltage due to
heating effects are covered by the thermal regulation specification.
Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its
nominal value measured at 1V differential.
Ground pin current is the regulator quiescent current plus pass transistor base current. The total current
drawn from the supply is the sum of the load current plus the ground pin current.
Thermal regulation is defined as the change in output voltage at a time (t) after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a 100 mA load pulse at VIN =
26V for t = 10 ms.
2016 - 2022 Microchip Technology Inc. and its subsidiaries
DS20005578B-page 3
MIC5200
ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Characteristics: Limits in standard typeface are for TJ = +25°C and limits in boldface apply over the
junction temperature range of –40°C to +125°C. Unless otherwise specified, VIN = VOUT + 1V, IL = 1 mA, CL = 3.3 μF,
and VENABLE = VDD. (Note 1).
Parameters
Sym.
Min.
Typ.
Max.
Input Voltage Level, Logic Low
VIL
—
—
0.7
Input Voltage Level, Logic High
VIH
2.0
—
—
IIL
—
0.01
1
IIH
—
15
50
Units
Conditions
ENABLE Input
Enable Input Current
Note 1:
2:
3:
4:
5:
6:
V
µA
OFF
ON
VIL ≤ 0.7V
VIH ≥ 2.0V
Specification for packaged product only.
Output voltage temperature coefficient is defined as the worst case voltage change divided by the total
temperature range.
Regulation is measured at constant junction temperature using low duty cycle pulse testing. Parts are
tested for load regulation in the load range from 0.1 mA to 100 mA. Changes in output voltage due to
heating effects are covered by the thermal regulation specification.
Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its
nominal value measured at 1V differential.
Ground pin current is the regulator quiescent current plus pass transistor base current. The total current
drawn from the supply is the sum of the load current plus the ground pin current.
Thermal regulation is defined as the change in output voltage at a time (t) after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a 100 mA load pulse at VIN =
26V for t = 10 ms.
TEMPERATURE SPECIFICATIONS
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Junction Operating Temperature
Range
TJ
–40
—
+125
°C
Note 1
Lead Temperature
—
—
—
+260
°C
Soldering, 5s
Thermal Resistance, SOT-223
JC
—
15
—
°C/W
—
Thermal Resistance, SOIC-8
JA
—
160
—
°C/W
Note 2
Temperature Ranges
Package Thermal Resistances
Note 1:
2:
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.
The maximum allowable power dissipation at any ambient temperature is calculated using: P(MAX) =
(TJ(MAX) – TA) ÷ θJA. Exceeding the maximum allowable power dissipation will result in excessive die temperature, and the regulator will go into thermal shutdown. The θJC of the MIC5200-x.xYS is 15°C/W and
θJA for the MIC5200YM is 160°C/W mounted on a PC board (see Thermal Considerations for further
details).
DS20005578B-page 4
2016 - 2022 Microchip Technology Inc. and its subsidiaries
MIC5200
2.0
Note:
TYPICAL PERFORMANCE CURVES
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
10
GROUND CURRENT (mA)
DROPOUT VOLTAGE (mV)
250
200
150
100
50
0
0.01
FIGURE 2-1:
Current.
0.1
0.01
0.1
1
10
100 1000
OUTPUT CURRENT (mA)
Dropout Voltage vs. Output
FIGURE 2-4:
Current.
0.3
IL = 100mA
0.2
0.1
IL = 1mA
0.0
-60 -30 0 30 60 90 120 150
TEMPERATURE (°C)
FIGURE 2-2:
Temperature.
Dropout Voltage vs.
1.2
IL = 100mA
1.0
0.8
0.6
0.4
IL = 1mA
0.2
0
FIGURE 2-5:
Voltage.
2
4
6
8
SUPPLY VOLTAGE (V)
10
Ground Current vs. Supply
3.5
3.0
OUTPUT VOLTAGE (V)
OUTPUT VOLTAGE (V)
Ground Current vs. Output
1.4
0.0
3.5
IL = 100mA
2.5
2.0
1.5
1.0
IL = 100μA, 1mA
0.5
FIGURE 2-3:
0.1
1
10
100
OUTPUT CURRENT (mA)
1.6
GROUND CURRENT (mA)
DROPOUT VOLTAGE (V)
0.4
0.0
1
0
2
4
6
8
INPUT VOLTAGE (V)
10
Dropout Characteristics.
2016 - 2022 Microchip Technology Inc. and its subsidiaries
3.0
2.5
2.0
CIN = 2.2μF
COUT = 4.7μF
1.5
1.0
0.5
0.0
0.0
FIGURE 2-6:
Current.
0.1
0.2
OUTPUT CURRENT (A)
0.3
Output Voltage vs. Output
DS20005578B-page 5
MIC5200
3.6
ILOAD = 100μA
CIN = 2.2μF
COUT = 4.7μF
0.25
OUTPUT VOLTAGE (V)
GROUND CURRENT (mA)
0.30
0.20
0.15
-60 -30 0 30 60 90 120 150
TEMPERATURE (°C)
FIGURE 2-7:
Temperature.
Ground Current vs.
1.2
1.1
1.0
-50
0
50
100
TEMPERATURE (°C)
Δ OUTPUT (mV)
FIGURE 2-8:
Temperature.
LOAD (mA)
OUTPUT CURRENT (mA)
1.3
0
CL = 4.7 μF
-50
200
100
0
-100
-5
0
FIGURE 2-9:
Version).
DS20005578B-page 6
5
10 15 20 25 30 35
TIME (ms)
Thermal Regulation (3.3V
3.2
3 DEVICES:
HI / AVG / LO
3.1
CURVES APPLICABLE
AT 100μA AND 100mA
300
280
260
240
220
200
180
160
140
120
FIGURE 2-11:
Temperature.
100
50
3.3
VOUT = 3.3V
VOUT = 0V
(SHORT CIRCUIT)
100
-60 -30 0 30 60 90 120 150
TEMPERATURE (°C)
150
Ground Current vs.
3.4
FIGURE 2-10:
Output Voltage vs.
Temperature (3.3V Version).
MIN. INPUT VOLTAGE (V)
GROUND CURRENT (mA)
ILOAD = 100mA
CIN = 2.2μF
COUT = 4.7μF
CIN = 2.2μF
COUT = 4.7μF
3.0
-60 -30 0 30 60 90 120 150
TEMPERATURE (°C)
1.5
1.4
3.5
Output Current vs.
3.30
3.29
3.28
3.27
3.26
3.25
CIN = 2.2μF
COUT = 4.7μF
ILOAD = 1mA
3.24
3.23
3.22
3.21
3.20
-60 -30 0 30 60 90 120 150
TEMPERATURE (°C)
FIGURE 2-12:
Temperature.
Minimum Input Voltage vs.
2016 - 2022 Microchip Technology Inc. and its subsidiaries
120
250
200
150
CIN = 2.2μF
COUT = 4.7μF
VOUT = 3.3V
100
50
0
1
2
3
4
5
6
INPUT VOLTAGE (V)
Short Circuit Current vs.
0
CL = 4.7μF
-30
300
200
100
0
-2
0
FIGURE 2-14:
2
4
6
TIME (ms)
8
0
CL = 47μF
200
100
FIGURE 2-15:
10
20
TIME (ms)
30
RL = 33Ω
20
0 1 2 3 4 5 6 7 8 9 10
SUPPLY VOLTAGE (V)
10
CL = 1 μF
IL = 1mA
5
0
-5
-10
8
6
4
2
-0.2
INPUT (V)
-30
300
0
40
0
FIGURE 2-17:
20
10
0
-10
60
FIGURE 2-16:
Supply Current vs. Supply
Voltage (3.3V Version).
10
Load Transient.
-10
-20
80
0
Δ OUTPUT (mV)
20
10
-10
-20
100
7
INPUT (V)
OUTPUT (mA) Δ OUTPUT (mV)
FIGURE 2-13:
Input Voltage.
OUTPUT (mA) Δ OUTPUT (mV)
SUPPLY CURRENT (mA)
300
Δ OUTPUT (mV)
SHORT CIRCUIT CURRENT (mA)
MIC5200
40
Load Transient.
2016 - 2022 Microchip Technology Inc. and its subsidiaries
0.2
0.4
TIME (ms)
0.6
0.8
Line Transient.
15
10
CL = 10 μF
IL = 1mA
5
0
-5
8
6
4
2
-0.1
FIGURE 2-18:
0
0.1 0.2 0.3 0.4 0.5 0.6
TIME (ms)
Line Transient.
DS20005578B-page 7
MIC5200
1000
7
OUTPUT (V)
ENABLE (V)
CL = 4.7 μF
IL = 1mA
2
0
0
OUTPUT (V)
FIGURE 2-20:
Version).
Output Impedance.
30
25
CIN = 2.2μF
COUT = 4.7μF
20
15
VEN = 5V
10
5
0
VEN = 2V
-5
-60 -30 0 30 60 90 120 150
TEMPERATURE (°C)
50 100 150 200 250 300
TIME (μs)
Enable Transient (3.3V
5
4
3
2
1
0
-1
4
FIGURE 2-23:
vs. Temperature.
Enable Current Threshold
1.6
CL = 4.7 μF
IL = 100mA
2
0
-2
-50
FREQUENCY (Hz)
FIGURE 2-22:
35
5
4
3
2
1
0
-1
4
-2
-50
IL = 100mA
1x106
1
2
3
4
5
6
SUPPLY VOLTAGE (V)
1x100
0
FIGURE 2-19:
Supply Current vs. Supply
Voltage (3.3V Version).
ENABLE (V)
0.01
0.001
ENABLE CURRENT (μA)
0
0.1
100x103
10
IL = 1mA
1
10x103
RL = 66Ω
20
10
1x103
30
IL = 100μA
100x100
40
100
10x100
OUTPUT IMPEDANCE (Ω)
50
0
FIGURE 2-21:
Version).
DS20005578B-page 8
50 100 150 200 250 300
TIME (μs)
Enable Transient (3.3V
ENABLE VOLTAGE (V)
SUPPLY CURRENT (mA)
60
1.4
1.2
CIN = 2.2μF
COUT = 4.7μF
1
0.8
ON
OFF
0.6
0.4
-60 -30 0 30 60 90 120 150
TEMPERATURE (°C)
FIGURE 2-24:
vs. Temperature.
Enable Voltage Threshold
2016 - 2022 Microchip Technology Inc. and its subsidiaries
MIC5200
80
IL = 100μA
60
40
1x106
100x103
10x103
10x100
0
1x103
20
100x100
RIPPLE VOLTAGE (dB)
100
FREQUENCY (Hz)
FIGURE 2-25:
Ripple vs. Frequency.
80
IL = 1mA
60
40
1x106
100x103
10x103
10x100
0
1x103
20
100x100
RIPPLE VOLTAGE (dB)
100
FREQUENCY (Hz)
FIGURE 2-26:
Ripple vs. Frequency.
80
IL = 100mA
60
40
1x106
100x103
10x103
10x100
0
1x103
20
100x100
RIPPLE VOLTAGE (dB)
100
FREQUENCY (Hz)
FIGURE 2-27:
Ripple vs. Frequency.
2016 - 2022 Microchip Technology Inc. and its subsidiaries
DS20005578B-page 9
MIC5200
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
Package Types
MIC5200-x.xYS
SOT-223 (S)
(Top View)
1
IN
TABLE 3-1:
MIC5200-x.xYM
SOIC-8 (M)
MIC5200-x.xYMM
MSOP-8 (MM)
(Top View)
OUT
OUT
NC
GND
2
3
GND OUT
IN
IN
NC
EN
PIN FUNCTION TABLE
Pin Number
SOT-223
Pin Number
SOIC-8,
MSOP-8
Pin Name
3
1, 2
OUT
Output: Pins 1 and 2 (SOIC-8, MSOP-8 packages) must be
externally connected together.
—
3, 6
NC
Not internally connected. Connect to ground place for lowest
thermal resistance.
2, TAB
4
GND
—
5
EN
Enable/Shutdown (Input): TTL-compatible. High = enabled; low =
shutdown.
1
7, 8
IN
Supply Input: Pins 7 and 8 (SOIC-8, MSOP-8 packages) must be
externally connected together.
DS20005578B-page 10
Description
Ground: Ground pin and TAB (SOT-223 package) are internally
connected.
2016 - 2022 Microchip Technology Inc. and its subsidiaries
MIC5200
4.0
APPLICATION INFORMATION
4.1
External Capacitors
A 1 μF capacitor is recommended between the
MIC5200 output and ground to prevent oscillations due
to instability. Larger values serve to improve the
regulator's transient response. Most types of tantalum
or aluminum electrolytics will be adequate; film types
will work, but are costly and therefore not
recommended. Many aluminum electrolytics have
electrolytes that freeze at about –30°C, so solid
tantalum capacitors are recommended for operation
below –25°C. The important parameters of the
capacitor are an effective series resistance of about 5Ω
or less and a resonant frequency above 500 kHz. The
value of this capacitor may be increased without limit.
At lower values of output current, less output
capacitance is required for output stability. The
capacitor can be reduced to 0.47 μF for current below
10 mA or 0.33 μF for currents below 1 mA. A 1 μF
capacitor should be placed from the MIC5200 input to
ground if there is more than 10 inches of wire between
the input and the AC filter capacitor or if a battery is
used as the input.
The MIC5200 will remain stable and in regulation with
no load in addition to the internal voltage divider, unlike
many other voltage regulators. This is especially
important in CMOS RAM keep-alive applications.
When used in dual supply systems where the regulator
load is returned to a negative supply, the output voltage
must be diode clamped to ground.
4.2
ENABLE Input
The MIC5200 features nearly zero OFF mode current.
When the ENABLE input is held below 0.7V, all internal
circuitry is powered off. Pulling this pin high (over 2.0V)
re-enables the device and allows operation. The
ENABLE pin requires a small amount of current,
typically 15 μA. While the logic threshold is TTL/CMOS
compatible, ENABLE may be pulled as high as 30V,
independent of the voltage on VIN.
2016 - 2022 Microchip Technology Inc. and its subsidiaries
DS20005578B-page 11
MIC5200
5.0
THERMAL CONSIDERATIONS
5.1
Layout
The MIC5200-x.xYM (8-lead surface mount package)
has the following thermal characteristics when
mounted on a single-layer copper-clad printed circuit
board.
PC Board Dielectric
JA
FR4
160°C/W
Ceramic
120°C/W
Multi-layer boards having a ground plane, wide traces
near the pads, and large supply bus lines provide better
thermal conductivity.
The "worst case" value of 160°C/W assumes no
ground plane, minimum trace widths, and a FR4
material board.
5.2
Nominal Power Dissipation and
Die Temperature
The MIC5200-x.xYM at a 25°C ambient temperature
will operate reliably at up to 625 mW power dissipation
when mounted in the "worst case" manner described
above. At an ambient temperature of 55°C, the device
may safely dissipate 440 mW. These power levels are
equivalent to a die temperature of 125°C, the
recommended maximum temperature for non-military
grade silicon integrated circuits.
For MIC5200-x.xYS (SOT-223 package) heat sink
characteristics, please refer to Application Hint 17,
“Calculating P.C. Board Heat Sink Area for Surface
Mount Packages”.
DS20005578B-page 12
2016 - 2022 Microchip Technology Inc. and its subsidiaries
MIC5200
6.0
PACKAGING INFORMATION
6.1
Package Marking Information
8-Lead SOIC*
Example
XXXX
XXXX
WNNNC
3-Lead SOT-223*
5200
33YM
3CM1C
XXXX
X.XXXNNNP
Example
5200
4.8YS23KP
8-Lead MSOP*
(Front)
Example
8-Lead MSOP*
(Back)
Example
XXXX
X.XY
5200
5.0Y
WNNN
745G
Legend: XX...X
Y
YY
WW
NNN
e3
*
Product code or customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle
mark).
Note:
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information. Package may or may not include
the corporate logo.
Underbar (_) symbol may not be to scale.
Note:
If the full seven-character YYWWNNN code cannot fit on the package, the following truncated codes are
used based on the available marking space:
6 Characters = YWWNNN; 5 Characters = WWNNN; 4 Characters = WNNN; 3 Characters = NNN;
2 Characters = NN; 1 Character = N
2016 - 2022 Microchip Technology Inc. and its subsidiaries
DS20005578B-page 13
MIC5200
3-Lead SOT-223 Package Outline and Recommended Land Pattern
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
DS20005578B-page 14
2016 - 2022 Microchip Technology Inc. and its subsidiaries
MIC5200
8-Lead MSOP Package Outline and Recommended Land Pattern
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
2016 - 2022 Microchip Technology Inc. and its subsidiaries
DS20005578B-page 15
MIC5200
8-Lead SOIC Package Outline and Recommended Land Pattern
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
DS20005578B-page 16
2016 - 2022 Microchip Technology Inc. and its subsidiaries
MIC5200
APPENDIX A:
REVISION HISTORY
Revision A (July 2016)
• Converted Micrel document MIC5200 to Microchip data sheet DS20005578A.
• Minor text changes throughout.
Revision B (February 2022)
• Updated the Package Marking Information with
the most current marking information.
• Updated the Product Identification System with
current Media Type values.
• Minor grammar and stylistic changes throughout.
2016 - 2022 Microchip Technology Inc. and its subsidiaries
DS20005578B-page 17
MIC5200
NOTES:
DS20005578B-page 18
2016 - 2022 Microchip Technology Inc. and its subsidiaries
MIC5200
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
Part Number
-X.X
X
XX
-XX
Device
Voltage
Temperature
Range
Package
Media Type
Device:
MIC5200:
Voltage:
(Note 1)
3.0
3.3
4.8
5.0
=
=
=
=
100 mA Low-Dropout Regulator
3.0V
3.3V
4.8V
5.0V
Temperature
Range:
Y
=
–40°C to +125°C
Package:
M
=
MM =
S
=
8-Lead SOIC
8-Lead MSOP
3-Lead SOT-223
Media Type:
TR =
=
=
=
2,500/Reel
100/Tube (MSOP option)
95/Tube (SOIC option)
78/Tube (SOT-223 option)
Note
1:
The 8-Lead MSOP package (MM) is only available in 3.3V and
5.0V options.
Examples:
a) MIC5200-3.3YMM-TR:
MIC5200, 3.3V Voltage,
–40°C to +125°C Temp.
Range, 8-Lead MSOP,
2500/Reel
b) MIC5200-3.0YM:
MIC5200, 3.0V Voltage,
–40°C to +125°C Temp.
Range, 8-Lead SOIC,
95/Tube
c) MIC5200-4.8YS:
MIC5200, 4.8V Voltage,
–40°C to +125°C Temp.
Range, 3-Lead SOT-223,
78/Tube
d) MIC5200-5.0YMM:
MIC5200, 5.0V Voltage,
–40°C to +125°C Temp.
Range, 8-Lead MSOP,
100/Tube
e) MIC5200-4.8YM-TR:
MIC5200, 4.8V Voltage,
–40°C to +125°C Temp.
Range, 8-Lead SOIC,
2500/Reel
f) MIC5200-3.3YS-TR:
MIC5200, 3.3V Voltage,
–40°C to +125°C Temp.
Range, 3-Lead SOT-223,
2500/Reel
Note 1:
2016 - 2022 Microchip Technology Inc. and its subsidiaries
Tape and Reel identifier only appears in the
catalog part number description. This identifier is
used for ordering purposes and is not printed on
the device package. Check with your Microchip
Sales Office for package availability with the Tape
and Reel option.
DS20005578B-page 19
MIC5200
NOTES:
DS20005578B-page 20
2016 - 2022 Microchip Technology Inc. and its subsidiaries
Note the following details of the code protection feature on Microchip products:
•
Microchip products meet the specifications contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is secure when used in the intended manner, within operating specifications, and
under normal conditions.
•
Microchip values and aggressively protects its intellectual property rights. Attempts to breach the code protection features of
Microchip product is strictly prohibited and may violate the Digital Millennium Copyright Act.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code. Code protection does not
mean that we are guaranteeing the product is “unbreakable”. Code protection is constantly evolving. Microchip is committed to
continuously improving the code protection features of our products.
This publication and the information herein may be used only
with Microchip products, including to design, test, and integrate
Microchip products with your application. Use of this information in any other manner violates these terms. Information
regarding device applications is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your
specifications. Contact your local Microchip sales office for
additional support or, obtain additional support at https://
www.microchip.com/en-us/support/design-help/client-supportservices.
THIS INFORMATION IS PROVIDED BY MICROCHIP "AS IS".
MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED,
WRITTEN OR ORAL, STATUTORY OR OTHERWISE,
RELATED TO THE INFORMATION INCLUDING BUT NOT
LIMITED TO ANY IMPLIED WARRANTIES OF NONINFRINGEMENT, MERCHANTABILITY, AND FITNESS FOR A
PARTICULAR PURPOSE, OR WARRANTIES RELATED TO
ITS CONDITION, QUALITY, OR PERFORMANCE.
IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT, SPECIAL, PUNITIVE, INCIDENTAL, OR CONSEQUENTIAL LOSS, DAMAGE, COST, OR EXPENSE OF ANY
KIND WHATSOEVER RELATED TO THE INFORMATION OR
ITS USE, HOWEVER CAUSED, EVEN IF MICROCHIP HAS
BEEN ADVISED OF THE POSSIBILITY OR THE DAMAGES
ARE FORESEEABLE. TO THE FULLEST EXTENT
ALLOWED BY LAW, MICROCHIP'S TOTAL LIABILITY ON
ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION
OR ITS USE WILL NOT EXCEED THE AMOUNT OF FEES, IF
ANY, THAT YOU HAVE PAID DIRECTLY TO MICROCHIP
FOR THE INFORMATION.
Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to
defend, indemnify and hold harmless Microchip from any and
all damages, claims, suits, or expenses resulting from such
use. No licenses are conveyed, implicitly or otherwise, under
any Microchip intellectual property rights unless otherwise
stated.
Trademarks
The Microchip name and logo, the Microchip logo, Adaptec,
AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud,
CryptoMemory, CryptoRF, dsPIC, flexPWR, HELDO, IGLOO,
JukeBlox, KeeLoq, Kleer, LANCheck, LinkMD, maXStylus,
maXTouch, MediaLB, megaAVR, Microsemi, Microsemi logo,
MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower,
PICSTART, PIC32 logo, PolarFire, Prochip Designer, QTouch,
SAM-BA, SenGenuity, SpyNIC, SST, SST Logo, SuperFlash,
Symmetricom, SyncServer, Tachyon, TimeSource, tinyAVR, UNI/O,
Vectron, and XMEGA are registered trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
AgileSwitch, APT, ClockWorks, The Embedded Control Solutions
Company, EtherSynch, Flashtec, Hyper Speed Control, HyperLight
Load, IntelliMOS, Libero, motorBench, mTouch, Powermite 3,
Precision Edge, ProASIC, ProASIC Plus, ProASIC Plus logo, QuietWire, SmartFusion, SyncWorld, Temux, TimeCesium, TimeHub,
TimePictra, TimeProvider, TrueTime, WinPath, and ZL are
registered trademarks of Microchip Technology Incorporated in the
U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, Augmented Switching, BlueSky,
BodyCom, CodeGuard, CryptoAuthentication, CryptoAutomotive,
CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net,
Dynamic Average Matching, DAM, ECAN, Espresso T1S,
EtherGREEN, GridTime, IdealBridge, In-Circuit Serial
Programming, ICSP, INICnet, Intelligent Paralleling, Inter-Chip
Connectivity, JitterBlocker, Knob-on-Display, maxCrypto, maxView,
memBrain, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo,
MPLIB, MPLINK, MultiTRAK, NetDetach, NVM Express, NVMe,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple
Blocker, RTAX, RTG4, SAM-ICE, Serial Quad I/O, simpleMAP,
SimpliPHY, SmartBuffer, SmartHLS, SMART-I.S., storClad, SQI,
SuperSwitcher, SuperSwitcher II, Switchtec, SynchroPHY, Total
Endurance, TSHARC, USBCheck, VariSense, VectorBlox, VeriPHY,
ViewSpan, WiperLock, XpressConnect, and ZENA are trademarks
of Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
The Adaptec logo, Frequency on Demand, Silicon Storage
Technology, Symmcom, and Trusted Time are registered
trademarks of Microchip Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology Germany
II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in
other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2016 - 2022, Microchip Technology Incorporated and its subsidiaries.
All Rights Reserved.
For information regarding Microchip’s Quality Management Systems,
please visit www.microchip.com/quality.
2016 - 2022 Microchip Technology Inc. and its subsidiaries
ISBN: 978-1-5224-9874-2
DS20005578B-page 21
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DS20005578B-page 22
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09/14/21
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