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MIC5205-3.3BM5

MIC5205-3.3BM5

  • 厂商:

    ACTEL(微芯科技)

  • 封装:

    SOT23-5

  • 描述:

    MIC5205-3.3BM5

  • 数据手册
  • 价格&库存
MIC5205-3.3BM5 数据手册
MIC5205 150 mA Low-Noise LDO Regulator Features General Description • • • • • • • • • • • The MIC5205 is an efficient linear voltage regulator with ultra low-noise output, very low dropout voltage (typically 17 mV at light loads and 165 mV at 150 mA), and very low ground current (600 µA at 100 mA output). The MIC5205 offers better than 1% initial accuracy. Ultra-Low Noise Output High Output Voltage Accuracy Guaranteed 150 mA Output Low Quiescent Current Low Dropout Voltage Extremely Tight Load and Line Regulation Very Low Temperature Coefficient Current and Thermal Limiting Reverse-Battery Protection Zero Off-Mode Current Logic-Controlled Electronic Enable Applications • • • • • • • Cellular Telephones Laptop, Notebook, and Palmtop Computers Battery-Powered Equipment PCMCIA VCC and VPP Regulation/Switching Consumer/Personal Electronics SMPS Post-Regulator and DC/DC Modules High-Efficiency Linear Power Supplies Designed especially for hand-held, battery-powered devices, the MIC5205 includes a CMOS or TTL compatible enable/shutdown control input. When shut down, power consumption drops nearly to zero. Regulator ground current increases only slightly in dropout, further prolonging battery life. Key MIC5205 features include a reference bypass pin to improve its already excellent low-noise performance, reversed-battery protection, current limiting, and overtemperature shutdown. The MIC5205 is available in fixed and adjustable output voltage versions in a small SOT-23-5 package. For low-dropout regulators that are stable with ceramic output capacitors, see the µCap MIC5245/6/7 family. Package Type MIC5205 5-Lead SOT-23 (M5) EN GND IN 3 2 LBxx KBxx  2017 Microchip Technology Inc. EN GND IN 1 4 5 BYP OUT 3 Pb-Free Marking 2 1 Part Identification LBAA KBAA 4 5 ADJ OUT DS20005785A-page 1 MIC5205 Typical Application Circuit MIC5205 5-Lead SOT-23 VIN MIC5205-x.xYM5 1 5 2 3 Enable Shutdown 4 EN EN (pin 3) may be connected directly to IN (pin 1). VOUT COUT = 2.2μF tantalum Low-Noise Operation: CBYP CBYP = 470pF, COUT ≥ 2.2μF Basic Operation: CBYP = not used, COUT ≥ 1μF Functional Block Diagrams Ultra-Low Noise Fixed Regulator VIN OUT IN VOUT COUT BYP CBYP (optional) Bandgap Ref. V REF EN Current Limit Thermal Shutdown MIC5205-x.xYM5 GND Ultra-Low Noise Adjustable Regulator VIN OUT IN VOUT COUT ADJ R1 R2 Bandgap Ref. V REF CBYP (optional) EN VOUT = VREF (1 + R2/R1) Current Limit Thermal Shutdown MIC5205YM5 GND DS20005785A-page 2  2017 Microchip Technology Inc. MIC5205 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings † Supply Input Voltage (VIN) .......................................................................................................................... –20V to +20V Enable Input Voltage (VEN) ......................................................................................................................... –20V to +20V Power Dissipation (PD) (Note 1) ............................................................................................................ Internally Limited Operating Ratings ‡ Supply Input Voltage (VIN) ......................................................................................................................... +2.5V to +16V Enable Input Voltage (VEN) .................................................................................................................................0V to VIN † Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended periods may affect device reliability. ‡ Notice: The device is not guaranteed to function outside its operating ratings. Note 1: The maximum allowable power dissipation at any TA (ambient temperature) is PD(max) = (TJ(max) – TA)/JA. Exceeding the maximum allowable power dissipation will result in excessive die temperature, and the regulator will go into thermal shutdown. The JA of the MIC5205-xxYM5 (all versions) is 220°C/W mounted on a PC board. TABLE 1-1: ELECTRICAL CHARACTERISTICS Electrical Characteristics: VIN = VOUT +1V; IL = 100 µA; CL = 1.0 µF; VEN ≥ 2.0V; TJ = +25°C, bold values indicate –40°C < TJ < +125°C, unless noted. Parameter Output Voltage Accuracy Symbol VO Output Voltage Temperature Coefficient ∆VO/∆T Line Regulation ∆VO/VO Load Regulation ∆VO/VO Dropout Voltage, Note 3 Quiescent Current  2017 Microchip Technology Inc. VIN – VO IGND Min. Typ. Max. Units –1 — 1 –2 — 2 — 40 — — 0.004 0.012 — — 0.05 — 0.02 0.2 — — 0.5 — 10 50 mV — — 70 mV — 110 150 mV — — 230 mV — 140 250 mV — — 300 mV — 165 275 mV — — 350 mV — 0.01 1 µA VEN ≤ 0.4V (shutdown) — — 5 µA VEN ≤ 0.18V (shutdown) % ppm/°C %/V % Conditions Variation from specified VOUT Note 1 VIN = VOUT + 1V to 16V IL = 0.1 mA to 150 mA, Note 2 IL = 100 µA IL = 50 mA IL = 100 mA IL = 150 mA DS20005785A-page 3 MIC5205 TABLE 1-1: ELECTRICAL CHARACTERISTICS (CONTINUED) Electrical Characteristics: VIN = VOUT +1V; IL = 100 µA; CL = 1.0 µF; VEN ≥ 2.0V; TJ = +25°C, bold values indicate –40°C < TJ < +125°C, unless noted. Parameter Ground Pin Current, Note 4 Ripple Rejection Current Limit Thermal Regulation Output Noise Symbol IGND Min. Typ. Max. Units — 80 125 µA — — 150 µA — 350 600 µA — — 800 µA — 600 1000 µA — — 1500 µA Conditions VEN ≥ 2.0V, IL = 100 µA IL = 50 mA IL = 100 mA — 1300 1900 µA — — 2500 µA PSRR — 75 — dB Frequency = 100 Hz, IL = 100 µA VOUT = 0V ILIMIT — 320 500 mA ∆VO/∆PD — 0.05 — %/W eNO — 260 — nV/√Hz — — 0.4 — — 0.18 2.0 — — IL = 150 mA Note 5 IL = 50 mA, CL = 2.2 µF, 470 pF from BYP to GND ENABLE Input Enable Input Logic-Low Voltage VIL Enable Input Logic-High Voltage VIH IIL Enable Input Current IIH Note 1: 2: 3: 4: 5: — 0.01 –1 — — –2 2 5 20 — — 25 V Regulator shutdown V Regulator enabled VIL ≤ 0.4V µA VIL ≤ 0.18V VIL = 2.0V VIL = 2.0V Output voltage temperature coefficient is defined as the worst case voltage change divided by the total temperature range. Regulation is measured at constant junction temperature using low duty cycle pulse testing. Parts are tested for load regulation in the load range from 0.1 mA to 150 mA. Changes in output voltage due to heating effects are covered by the thermal regulation specification. Dropout Voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at 1V differential. Ground pin current is the regulator quiescent current plus pass transistor base current. The total current drawn from the supply is the sum of the load current plus the ground pin current. Thermal regulation is defined as the change in output voltage at a time “t” after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a 150 mA load pulse at VIN = 16V for t = 10 ms. DS20005785A-page 4  2017 Microchip Technology Inc. MIC5205 TEMPERATURE SPECIFICATIONS (Note 1) Parameters Sym. Min. Typ. Max. Units Conditions Junction Operating Temperature Range TJ –40 — +125 °C Storage Temperature Range TS –65 — +150 °C — Lead Temperature — — — +260 °C Soldering, 5s JA — 220 — °C/W Note 2 JC — 130 — °C/W — Temperature Ranges — Package Thermal Resistances Thermal Resistance SOT-23-5 Note 1: 2: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability. The maximum allowable power dissipation at any TA (ambient temperature) is PD(max) = (TJ(max) – TA)/JA. Exceeding the maximum allowable power dissipation will result in excessive die temperature, and the regulator will go into thermal shutdown. The JA of the MIC5205-xxYM5 (all versions) is 220°C/W mounted on a PC board.  2017 Microchip Technology Inc. DS20005785A-page 5 MIC5205 2.0 Note: TYPICAL PERFORMANCE CURVES The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. 0 -40 -60 -80 -40 -60 -80 IOUT = 100μA COUT = 1μF Power Supply Rejection FIGURE 2-4: Ratio. -60 IOUT = 100μA COUT = 2.2μF CBYP = 0.01μF -80 -100 1E+1 1k 1E+4 10k 1E+5 1M 1E+7 10M 10 1E+2 100k 1E+6 100 1E+3 FREQUENCY (Hz) FIGURE 2-2: Ratio. Power Supply Rejection -40 -60 -100 1E+1 1k 1E+4 10k 1E+5 1M 1E+7 10M 10 1E+2 100k 1E+6 100 1E+3 FREQUENCY (Hz) FIGURE 2-5: Ratio. RIPPLE REJECTION (dB) RIPPLE REJECTION (dB) 50 1mA 10mA IOUT = 100mA 20 COUT = 1μF 10 0 0 0.1 0.2 0.3 VOLTAGE DROP (V) 0.4 FIGURE 2-3: Power Supply Ripple Rejection vs. Voltage Drop. DS20005785A-page 6 IOUT = 1mA COUT = 2.2μF CBYP = 0.01μF -80 60 30 VIN = 6V VOUT = 5V -20 PSRR (dB) PSRR (dB) VIN = 6V VOUT = 5V -40 40 Power Supply Rejection 0 0 -20 IOUT = 1mA COUT = 1μF -100 1E+1 1k 1E+4 10k 1E+5 1M 1E+7 10M 10 1E+2 100k 1E+6 100 1E+3 FREQUENCY (Hz) -100 1E+1 1k 1E+4 10k 1E+5 1M 1E+7 10M 10 1E+2 100k 1E+6 100 1E+3 FREQUENCY (Hz) FIGURE 2-1: Ratio. VIN = 6V VOUT = 5V -20 PSRR (dB) -20 PSRR (dB) 0 VIN = 6V VOUT = 5V Power Supply Rejection 100 90 80 1mA 70 60 IOUT = 100mA 50 40 10mA 30 20 10 0 COUT = 2.2μF CBYP = 0.01μF 0 0.1 0.2 0.3 VOLTAGE DROP (V) 0.4 FIGURE 2-6: Power Supply Ripple Rejection vs. Voltage Drop.  2017 Microchip Technology Inc. MIC5205 0 0 -40 -60 -80 -40 -60 Power Supply Rejection -100 1E+1 1k 1E+4 10k 1E+5 1M 1E+7 10M 10 1E+2 100k 1E+6 100 1E+3 FREQUENCY (Hz) FIGURE 2-10: Ratio. -60 IOUT = 10mA COUT = 2.2μF CBYP = 0.01μF -100 1E+1 1k 1E+4 10k 1E+5 1M 1E+7 10M 10 1E+2 100k 1E+6 100 1E+3 FREQUENCY (Hz) FIGURE 2-8: Ratio. Power Supply Rejection -40 -60 -100 1E+1 1k 1E+4 10k 1E+5 1M 1E+7 10M 10 1E+2 100k 1E+6 100 1E+3 FREQUENCY (Hz) FIGURE 2-11: Ratio. DROPOUT VOLTAGE (mV) TIME (μs) Power Supply Rejection 320 1000 100 FIGURE 2-9: Capacitance. IOUT = 100mA COUT = 2.2μF CBYP = 0.01μF -80 10000 10 10 VIN = 6V VOUT = 5V -20 PSRR (dB) PSRR (dB) VIN = 6V VOUT = 5V -40 -80 Power Supply Rejection 0 0 -20 IOUT = 100mA COUT = 1μF -80 IOUT = 10mA COUT = 1μF -100 1E+1 1k 1E+4 10k 1E+5 1M 1E+7 10M 10 1E+2 100k 1E+6 100 1E+3 FREQUENCY (Hz) FIGURE 2-7: Ratio. VIN = 6V VOUT = 5V -20 PSRR (dB) PSRR (dB) -20 VIN = 6V VOUT = 5V 280 200 120 –40°C 80 40 10000 Turn-On Time vs. Bypass  2017 Microchip Technology Inc. +25°C 160 0 100 1000 CAPACITANCE (pF) +125°C 240 FIGURE 2-12: Current. 0 40 80 120 160 OUTPUT CURRENT (mA) Dropout Voltage vs. Output DS20005785A-page 7 MIC5205 10 10 10mA, COUT = 1μF 0.1 0.01 1 NOISE (μV/√Hz) NOISE (μV/√Hz) 1 1mA COUT = 1μF CBYP = 10nF 0.001 VOUT = 5V 0.0001 1E+1 10 1E+2 1k 1E+4 100 1E+3 10k 1E+5 100k 1E+6 1M 1E+7 10M FREQUENCY (Hz) Noise Performance. FIGURE 2-13: FIGURE 2-16: 100mA Noise Performance. 10mA 0.1 0.01 VOUT = 5V COUT = 10μF electrolytic 1mA 0.0001 1k 1E+4 1E+1 10 1E+2 1M 1E+7 10k 1E+5 100k 1E+6 10M 100 1E+3 FREQUENCY (Hz) FIGURE 2-14: Noise Performance. 1 NOISE (μV/√Hz) NOISE (μV/√Hz) 0.01 10 1 VOUT = 5V COUT = 10μF electrolytic CBYP = 1nF 1mA FIGURE 2-17: Noise Performance. 1 VOUT = 5V COUT = 22μF 1mA 0.001 tantalum CBYP = 10nF 0.0001 1k 1E+4 1E+1 10 1E+2 1M 1E+7 10k 1E+5 100k 1E+6 10M 100 1E+3 FREQUENCY (Hz) Noise Performance. NOISE (μV/√Hz) 100mA 0.01 DS20005785A-page 8 0.01 10 10mA FIGURE 2-15: 100mA 0.0001 1k 1E+4 1E+1 10 1E+2 1M 1E+7 10k 1E+5 100k 1E+6 10M 100 1E+3 FREQUENCY (Hz) 1 0.1 10mA 0.1 0.001 10 NOISE (μV/√Hz) 0.1 1mA VOUT = 5V COUT = 10μF 0.001 electrolytic 10mA CBYP = 100pF 0.0001 1k 1E+4 1E+1 10 1E+2 1M 1E+7 10k 1E+5 100k 1E+6 10M 100 1E+3 FREQUENCY (Hz) 10 0.001 100mA 100mA 0.1 0.01 0.001 1mA VOUT = 5V COUT = 10μF electrolytic CBYP = 10nF 10mA 0.0001 1E+1 10 1E+2 10M 100 1E+3 1k 1E+4 10k 1E+5 100k 1E+6 1M 1E+7 FREQUENCY (Hz) FIGURE 2-18: Noise Performance.  2017 Microchip Technology Inc. MIC5205 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE Pin Number Fixed Version Pin Number Adj. Version Pin Name 1 1 IN 2 2 GND 3 3 EN Enable/Shutdown (Input): CMOS compatible input. Logic-high = enable, logic-low or open = shutdown 4 — BYP Reference Bypass: Connect external 470 pF capacitor to GND to reduce output noise. May be left open. — 4 ADJ Adjust (Input): Adjustable regulator feedback input. Connect to resistor voltage divider. 5 5 OUT Regulator Output  2017 Microchip Technology Inc. Description Supply Input Ground DS20005785A-page 9 MIC5205 4.0 APPLICATION INFORMATION 4.1 Enable/Shutdown Forcing EN (enable/shutdown) high (greater than 2V) enables the regulator. EN is compatible with CMOS logic gates. If the enable/shutdown feature is not required, connect EN (pin 3) to IN (supply input, pin 1). See Figure 4-1. 4.2 Input Capacitor A 1 µF capacitor should be placed from IN to GND if there are more than 10 inches of wire between the input and the AC filter capacitor or if a battery is used as the input. 4.3 Reference Bypass Capacitor BYP (reference bypass) is connected to the internal voltage reference. A 470 pF capacitor (CBYP) connected from BYP to GND quiets this reference, providing a significant reduction in output noise. CBYP reduces the regulator phase margin; when using CBYP, output capacitors of 2.2 µF or greater are generally required to maintain stability. The start-up speed of the MIC5205 is inversely proportional to the size of the reference bypass capacitor. Applications requiring a slow ramp-up of output voltage should consider larger values of CBYP. Likewise, if rapid turn-on is necessary, consider omitting CBYP. If output noise is not a major concern, omit CBYP and leave BYP open. 4.4 Output Capacitor An output capacitor is required between OUT and GND to prevent oscillation. The minimum size of the output capacitor is dependent upon whether a reference bypass capacitor is used. 1.0 µF minimum is recommended when CBYP is not used (see Figure 4-2). 2.2 µF minimum is recommended when CBYP is 470 pF (see Figure 4-1). Larger values improve the regulator’s transient response. The output capacitor value may be increased without limit. The output capacitor should have an ESR (effective series resistance) of about 5Ω or less and a resonant frequency above 1 MHz. Ultra-low-ESR capacitors can cause a low amplitude oscillation on the output and/or underdamped transient response. Most tantalum or aluminum electrolytic capacitors are adequate; film types will work, but are more expensive. Because many aluminum electrolytics have electrolytes that freeze at about –30°C, solid tantalums are recommended for operation below –25°C. DS20005785A-page 10 At lower values of output current, less output capacitance is required for output stability. The capacitor can be reduced to 0.47 µF for current below 10 mA or 0.33 µF for currents below 1 mA. 4.5 No-Load Stability The MIC5205 will remain stable and in regulation with no load (other than the internal voltage divider) unlike many other voltage regulators. This is especially important in CMOS RAM keep-alive applications. 4.6 Thermal Considerations The MIC5205 is designed to provide 150 mA of continuous current in a very small package. Maximum power dissipation can be calculated based on the output current and the voltage drop across the part. To determine the maximum power dissipation of the package, use the junction-to-ambient thermal resistance of the device and the following basic equation: EQUATION 4-1:  T J  MAX  – T A  P D  MAX  = ----------------------------------- JA TJ(MAX) is the maximum junction temperature of the die, 125°C, and TA is the ambient operating temperature. θJA is layout dependent; Table 4-1 shows examples of junction-to-ambient thermal resistance for the MIC5205. TABLE 4-1: Package SOT-23-5 THERMAL RESISTANCE θJA Rec. Min. Footprint θJA Square Copper Clad θJC SOT-23-5 220°C/W 170°C/W 130°C/W (M5) The actual power dissipation of the regulator circuit can be determined using the equation: EQUATION 4-2: P D =  V IN – V OUT   I OUT + V IN  I GND Substituting PD(MAX) for PD and solving for the operating conditions that are critical to the application will give the maximum operating conditions for the  2017 Microchip Technology Inc. MIC5205 regulator circuit. For example, when operating the MIC5205-3.3YM5 at room temperature with a minimum footprint layout, the maximum input voltage for a set output current can be determined as follows: EQUATION 4-3: 4.7 Fixed Regulator Applications Figure 4-1 includes a 470 pF capacitor for low-noise operation and shows EN (pin 3) connected to IN (pin 1) for an application where enable/shutdown is not required. COUT = 2.2 µF minimum. VIN 125C – 25C - = 455mW P D  MAX  = --------------------------------------220C/W MIC5205-x.xYM5 1 VOUT 5 2 2.2μF 3 4 470pF The junction-to-ambient thermal resistance for the minimum footprint is 220°C/W, from Table 4-1. The maximum power dissipation must not be exceeded for proper operation. Using the output voltage of 3.3V and an output current of 150 mA, the maximum input voltage can be determined. From the Electrical Characteristics table, the maximum ground current for 150 mA output current is 2500 µA or 2.5 mA. FIGURE 4-1: Ultra-Low Noise Fixed Voltage Application. Figure 4-2 is an example of a low-noise configuration where CBYP is not required. COUT = 1 µF minimum. VIN MIC5205-x.xYM5 VOUT 1 EQUATION 4-4: 5 2 3 Enable Shutdown 1.0μF 4 EN 455mW =  V IN – 3.3V   150mA + V IN  2.5mA FIGURE 4-2: Application. 4.8 EQUATION 4-5: 455mW = V IN  150mA – 495mW + V IN  2.5mA Low Noise Fixed Voltage Adjustable Regulator Applications The MIC5205YM5 can be adjusted to a specific output voltage by using two external resistors (Figure 4-3). The resistors set the output voltage based on the following equation: EQUATION 4-7: EQUATION 4-6: V OUT = 1.242V   R2 ------- + 1  R1  950mW = V IN  152.5mA VIN(MAX) then equates out to 6.23V. Therefore, a 3.3V application at 150 mA of output current can accept a maximum input voltage of 6.2V in a SOT-23-5 package. For a full discussion of heat sinking and thermal effects on voltage regulators, refer to the Regulator Thermals section of Microchip’s Designing with Low-Dropout Voltage Regulators handbook.  2017 Microchip Technology Inc. This equation is correct due to the configuration of the bandgap reference. The bandgap voltage is relative to the output, as seen in the block diagram. Traditional regulators normally have the reference voltage relative to ground and have a different VOUT equation. Resistor values are not critical because ADJ (adjust) has a high input impedance, but for best results use resistors of 470 kΩ or less. A capacitor from ADJ to ground provides greatly improved noise performance. DS20005785A-page 11 MIC5205 VIN MIC5205YM5 1 R1 3 2.2μF 4 470pF FIGURE 4-3: 4.9 VOUT 5 2 R2 Ultra-Low Noise. Adjustable Voltage Application Figure 4-3 includes the optional 470 pF noise bypass capacitor from ADJ to GND to reduce output noise. 4.10 Dual-Supply Operation When used in dual supply systems where the regulator load is returned to a negative supply, the output voltage must be diode clamped to ground. DS20005785A-page 12  2017 Microchip Technology Inc. MIC5205 5.0 PACKAGING INFORMATION 5.1 Package Marking Information 5-Lead SOT-23* (Fixed) XXXX NNN 5-Lead SOT-23* (Adjustable) XXXX NNN Legend: XX...X Y YY WW NNN e3 * Example KB33 943 Example KBAA 102 Product code or customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC® designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. ●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle mark). Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. Package may or may not include the corporate logo. Underbar (_) and/or Overbar (⎯) symbol may not be to scale.  2017 Microchip Technology Inc. DS20005785A-page 13 MIC5205 5-Lead SOT-23 Package Outline and Recommended Land Pattern Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging. DS20005785A-page 14  2017 Microchip Technology Inc. MIC5205 APPENDIX A: REVISION HISTORY Revision A (May 2017) • Converted Micrel document MIC5205 to Microchip data sheet DS20005785A. • Minor text changes throughout.  2017 Microchip Technology Inc. DS20005785A-page 15 MIC5205 DS20005785A-page 16  2017 Microchip Technology Inc. MIC5205 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office. PART NO. Device –X.X X XX –XX Examples: a) MIC5205YM5-TX: 150 mA Low-Noise LDO Regulator, Adjustable Voltage, –40°C to +125°C, 5-Lead SOT-23, 3k/Reel (Rev. Pin 1) b) MIC5205-3.0YM5-TR: 150 mA Low-Noise LDO Regulator, 3.0V, –40°C to +125°C, 5-Lead SOT-23, 3k/Reel c) MIC5205-2.8YM5-TX: 150 mA Low-Noise LDO Regulator, 2.8V, –40°C to +125°C, 5-Lead SOT-23, 3k/Reel (Rev. Pin 1) d) MIC5205-4.0YM5-TR: 150 mA Low-Noise LDO Regulator, 4.0V, –40°C to +125°C, 5-Lead SOT-23, 3k/Reel e) MIC5205-2.5YM5-TX: 150 mA Low-Noise LDO Regulator, 2.5V, –40°C to +125°C, 5-Lead SOT-23, 3k/Reel (Rev. Pin 1) Voltage Temperature Package Media Type Device: MIC5205: 150 mA Low-Noise LDO Regulator Voltage: = 2.5 = 2.5 = 2.8 = 2.85 = 2.9 = 3.0 = 3.1 = 3.2 = 3.3 = 3.6 = 3.8 = 4.0 = 5.0 = Adjustable 2.5V 2.7V 2.8V 2.85V 2.9V 3.0V 3.1V 3.2V 3.3V 3.6V 3.8V 4.0V 5.0V Temperature: Y = –40°C to +125°C Package: M5 = 5-Lead SOT-23 Media Type: TX TR = = 3,000/Reel (Reverse Pin 1) 3,000/Reel  2017 Microchip Technology Inc. Note 1: Tape and Reel identifier only appears in the catalog part number description. This identifier is used for ordering purposes and is not printed on the device package. Check with your Microchip Sales Office for package availability with the Tape and Reel option. DS20005785A-page 17 MIC5205 NOTES: DS20005785A-page 18  2017 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV Trademarks The Microchip name and logo, the Microchip logo, AnyRate, AVR, AVR logo, AVR Freaks, BeaconThings, BitCloud, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KEELOQ, KEELOQ logo, Kleer, LANCheck, LINK MD, maXStylus, maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip Designer, QTouch, RightTouch, SAM-BA, SpyNIC, SST, SST Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. ClockWorks, The Embedded Control Solutions Company, EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS, mTouch, Precision Edge, and Quiet-Wire are registered trademarks of Microchip Technology Incorporated in the U.S.A. Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo, CodeGuard, CryptoAuthentication, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, Mindi, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PureSilicon, QMatrix, RightTouch logo, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2017, Microchip Technology Incorporated, All Rights Reserved. ISBN: 978-1-5224-1767-5 == ISO/TS 16949 ==  2017 Microchip Technology Inc. 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