MIC5208-3.8YMM

March 3, 2014 PPCN #140003 PROCESS/ PRODUCT CHANGE NOTIFICATION This is to inform you that Micrel Inc has qualified MSOP-8L and MSOP-10L packages at STARS Microelectronics, Thailand as an alternative assembly site. This manufacturing subcontractor is in addition to the current Unisem, Malaysia as qualified assembly locations for these products. This change adds more capacity and provides for the flexibility of assembly processing locations. This will enable Micrel to continue to make on-time deliveries to our growing end customers. If you have any questions concerning this change, please contact: NAME: Hank Chou EMAIL: hank.chou@micrel.com PHONE: +1-408-435-2422 TYPE OF CHANGE We are adding STARS as an assembly source in addition to the current Unisem. The package type, form, fit and function will not be affected. These products will be shipped with the same packing and shipment format. EFFECTIVITY Starting June 1st, 2014, Micrel will begin to deliver the listed devices from STARS. After June 1st, 2014, the products shipped to customers could be either assembled from UNISEM or STARS. In order to make on-time deliveries to our growing end customers, we will reserve the flexibility to deliver certain part numbers at earlier date if un-expected material or capacity shortage occurs at UNISEM in the future. PRODUCT ID (DESCRIPTION) See the product list in the attached Excel file “PPCN 140003 part list add STARS additional assembly site for MSOP” for Micrel’s products that would be assembled at UNISEM or STARS site. DESCRIPTION OF CHANGE Micrel has qualified STARS, Thailand for assembly of the listed Micrel products. This will provide additional capacity for assembly of these products. FORM #18-7146 REV. A PPCN#140003 p1/5 NOTE: PER JESD46, LACK OF ACKNOWLEDGEMENT OF THE PPCN WITHIN 30 DAYS OF THE NOTIFICATION DATE CONSTITUTES CUSTOMER’S ACCEPTANCE OF THE CHANGE. EFFECT OF CHANGE There is no change in form, fit or function of the product. There is no change in the die, testing, or assembly materials, except the die attach epoxy material. The Epoxy is changed from Ablestik ABLEBOND 8290 (UNISEM) to Ablestik ABLEBOND 841LMISR4 (STARS). 84-1LMISR4 has higher thermal conductivity than ABLEBOND 8290. The land pattern, lead finish, lead layout, naming, and lead count are the same. There is no change in moisture sensitivity rating. QUALIFICATION STARS is Micrel’s qualified assembly subcontractor. STARS is already qualified and manufacturing SOIC, SC70, SOT143, SOT-23, and TSOT packages in high volume production. Traceability is maintained by date code and lot number, and country of origin (CO) for all products. The parts made at Unisem Ipoh will have a “MY” country of origin mark, and the parts made at STARS will have a “TH” country of origin mark. We attach a representative reliability report for qualifying products assembled at STARS, Thailand. FORM #18-7146 REV. A PPCN#140003 p2/5 NOTE: PER JESD46, LACK OF ACKNOWLEDGEMENT OF THE PPCN WITHIN 30 DAYS OF THE NOTIFICATION DATE CONSTITUTES CUSTOMER’S ACCEPTANCE OF THE CHANGE. RELIABILITY REPORT DATE: 1/07/2014 QUALITY ENG: PURPOSE: SY88903ALKG_MICRF112YMM_MIC2124YMM H. Grimm TO QUALIFY STARS MICROELECTRONICS, THAILAND TO ASSEMBLE MSOP PACKAGE ASSEMBLY PACKAGE TYPE : MSL MOLD COMP. DIE ATTACH LOT # DATE CODE FAB PROCESS STARS ELECTRONICS, THAILAND MSOP-10L RoHS NiPdAu Plating PPF-ASM LEVEL 1 SUMITOMO EMEG600 HALOGEN FREE ABLESTICK 84-1LMISR4 PC38075.1MQA 1319 CMOS 0.35 BA42508MQB 1320 BCD 0.5 BA41353MQB 1324 ASSET 1.2 QUALIFICATION RESULTS : TEST DESCRIPTION HTOL High Temperature Operating Life Test METHOD/CONDITIONS LOT # DATE CODE 168 HR Rej/pass 1000 HR Rej/pass COMMENTS JESD-22, Method A108 PC38075.1MQA 1319 0/77 0/77 VCC = +3.6V TA= + 125°C BA42508MQB 1320 0/77 0/77 VCC = +5.5V VCC = OPERATING MAX BA41353MQB 1324 0/77 0/77 VCC = +5.5V LOT # DATE CODE 96 HR Rej/pass JESD22-A102 PC38075.1MQA 1319 0/45 Ta = +121°C/100%RH BA42508MQB 1320 0/45 15 PSIG BA41353MQB 1324 0/45 LOT # DATE CODE 1000cyc Rej/pass PC38075.1MQA 1319 0/45 BA42508MQB 1320 0/45 BA41353MQB 1324 0/45 LOT # DATE CODE 1000 HR Rej/pass With Level 1 Preconditioning Tpeak + 260°C 3X Reflow TEST DESCRIPTION PRESSURE POT With Level 1 conditioning Pre- Tpeak + 260°C 3X Reflow METHOD/CONDITIONS TEST DESCRIPTION JESD22-A104 TEMP CYCLE With Level 1 conditioning METHOD/CONDITIONS Pre- Ta = -65°C/+150°C Tpeak + 260°C 3X Reflow TEST DESCRIPTION FORM #18-7146 REV. A METHOD/CONDITIONS COMMENTS COMMENTS COMMENTS PPCN#140003 p3/5 NOTE: PER JESD46, LACK OF ACKNOWLEDGEMENT OF THE PPCN WITHIN 30 DAYS OF THE NOTIFICATION DATE CONSTITUTES CUSTOMER’S ACCEPTANCE OF THE CHANGE. HTSL High Temperature Storage Life With Level 1 Preconditioning Tpeak + 260°C 3X Reflow TEST DESCRIPTION HAST With Level 1 Pre-conditioning Tpeak + 260°C 3X Reflow JESD22-A103 PC38075.1MQA 1319 0/76 Ta = +150°C BA42508MQB 1320 0/76 BA41353MQB 1324 0/76 LOT # DATE CODE 96HR Rej/pass PC38075.1MQA 1319 0/45 PC38075.1MQA 1319 0/45 BA42508MQB 1320 0/45 BA41353MQB 1324 0/45 LOT # DATE CODE P/F PC38075.1MQA 1319 PASS BA42508MQB 1320 PASS BA41353MQB 1324 PASS LOT # DATE CODE P/F MIL STD 883 PC38075.1MQA 1319 30 / 0 SS= 30/LOT BA42508MQB 1320 30 / 0 Cpk >1.66 BA41353MQB 1324 30 / 0 LOT # DATE CODE P/F COMMENTS PC38075.1MQA 1319 5/0 PASS BA42508MQB 1320 5/0 PASS BA41353MQB 1324 5/0 PASS LOT # DATE CODE MIN PC38075.1MQA 1319 9.11 11.02 9.96 4.45 ASTM F-1269-89 BA42508MQB 1320 8.25 10.69 9.55 4.25 MIC-100-1010 BA41353MQB 1324 14.65 19.04 17.23 3.33 METHOD/CONDITIONS Ta= +131°C/85%RH COMMENTS JESD22-A110 Vcc = 3.6v HAST With Level 1 Pre-conditioning Tpeak + 260°C 3X Reflow Ta= +131°C/85%RH JESD22-A118 TEST DESCRIPTION METHOD/CONDITIONS CSAM INSPECTION IPC/JEDEC JSTD-020 Pre/Post L1 TEST DESCRIPTION PHYSICAL DIMENSIONS TEST DESCRIPTION RADIOGRAPHIC X-RAY METHOD/CONDITIONS METHOD/CONDITIONS MIL STD 883 TM2010 TEST DESCRIPTION METHOD/CONDITIONS WIRE PULL 1.0 mil MIL STD 883 TM2011 1.0 mil 1.3 mil FORM #18-7146 REV. A COMMENTS COMMENTS MAX AVE PPCN#140003 p4/5 NOTE: PER JESD46, LACK OF ACKNOWLEDGEMENT OF THE PPCN WITHIN 30 DAYS OF THE NOTIFICATION DATE CONSTITUTES CUSTOMER’S ACCEPTANCE OF THE CHANGE. CpK MIL STD 883 TM2011 BALL SHEAR 1.0 mil PC38075.1MQA 1319 31.94 44.44 37.59 2.03 1.0 mil ASTM F-1269-89 BA42508MQB 1320 34.22 43.55 38.80 2.01 1.3 mil MIC-100-1010 BA41353MQB 1324 39.01 49.72 43.45 2.20 LOT # DATE CODE SAC+245C Sn+245C Sn+215C PC38075.1MQA 1319 PASS 0/5 0/5 0/5 BA42508MQB 1320 PASS 0/5 0/5 0/5 BA41353MQB 1324 PASS 0/5 0/5 0/5 TEST DESCRIPTION SOLDERABILITY METHOD/CONDITIONS JESD22-B102 PPF - NiPdAu FLAMMABILITY UL-94V-0 Certified All mold compounds used by Micrel meet this standard. See the UL website on-line list of material flammability certifications. Micrel requires a Certificate of Compliance from the assembly house and we verify the certifications on the web. Conclusion: STARS has passed the Package Reliability Tests required for production release. FORM #18-7146 REV. A PPCN#140003 p5/5 NOTE: PER JESD46, LACK OF ACKNOWLEDGEMENT OF THE PPCN WITHIN 30 DAYS OF THE NOTIFICATION DATE CONSTITUTES CUSTOMER’S ACCEPTANCE OF THE CHANGE.