MIC5210
Dual 150 mA LDO Regulator
Features
General Description
•
•
•
•
•
•
•
•
•
•
•
The MIC5210 is a dual linear voltage regulator with
very low dropout voltage (typically 10 mV at light loads
and 140 mV at 100 mA), very low ground current
(225 µA at 10 mA output), and better than 1% initial
accuracy. It also features individual logic-compatible
enable/shutdown control inputs.
Mini 8 MSOP Package
Up to 150 mA per Regulator Output
Low Quiescent Current
Low Dropout Voltage
Wide Selection of Output Voltages
Tight Load and Line Regulation
Low Temperature Coefficient
Current and Thermal Limiting
Reversed Input Polarity Protection
Zero Off-Mode Current
Logic-Controlled Electronic Enable
Both regulator outputs can supply up to 150 mA at the
same time as long as each regulator’s maximum
junction temperature is not exceeded.
Key features include a reference bypass pin to improve
its already low-noise performance, reversed-battery
protection, current limiting, and overtemperature
shutdown.
Applications
•
•
•
•
•
•
Designed especially for hand-held battery powered
devices, the MIC5210 can be switched by a CMOS or
TTL compatible logic signal, or the enable pin can be
connected to the supply input for 3-terminal operation.
When disabled, power consumption drops nearly to
zero. Dropout ground current is minimized to prolong
battery life.
Cellular Telephones
Laptop, Notebook, and Palmtop Computers
Battery-Powered Equipment
Barcode Scanners
SMPS Post-Regulator DC/DC Modules
High-Efficiency Linear Power Supplies
The MIC5210 is available in 2.7V, 2.8V, 3.0V, 3.3V,
3.6V, 4.0V, and 5.0V fixed voltage configurations. Other
voltages are available; contact Microchip for details.
Package Type
MIC5210
8-Lead MSOP (MM)
2019 Microchip Technology Inc.
OUTA
1
8
INA
GND
2
7
ENA
OUTB
3
6
INB
BYPB
4
5
ENB
DS20006096A-page 1
MIC5210
Typical Application Circuit
MIC5210
MSOP-8
1
Output A
1μF
tantalum
Output B
2.2μF
tantalum
MIC5210
8
2
7
3
6
4
5
CBYP
470pF
Enable A
Enable B
1μF
Enable may be connected to VIN
Functional Block Diagram
INA
OUTA
Bandgap
Ref.
V
REF
ENA
Current Limit
Thermal Shutdown
INB
OUTB
BYPB
CBYP
Bandgap
Ref.
V
REF
ENB
Current Limit
Thermal Shutdown
GND
DS20006096A-page 2
2019 Microchip Technology Inc.
MIC5210
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
Supply Input Voltage (VIN) .......................................................................................................................... –20V to +20V
Enable Input Voltage (VEN) ......................................................................................................................... –20V to +20V
Power Dissipation (PD) .......................................................................................................................... Internally Limited
Operating Ratings ‡
Supply Input Voltage (VIN) ......................................................................................................................... +2.5V to +16V
Enable Input Voltage (VEN) ............................................................................................................................. 0V to +16V
† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at those or any other conditions above those indicated
in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended
periods may affect device reliability.
‡ Notice: The device is not guaranteed to function outside its operating ratings.
TABLE 1-1:
ELECTRICAL CHARACTERISTICS
Electrical Characteristics: VIN = VOUT +1V; IL = 100 µA; CL = 1.0 µF; VEN ≥ 2.0V; TJ = +25°C, bold values indicate
–40°C < TJ < +125°C, unless noted.
Parameter
Output Voltage Accuracy
Output Voltage Temperature
Coefficient
Symbol
VO
∆VO/∆T
Line Regulation
∆VO/∆VO
Load Regulation
Dropout Voltage (Note 3)
Quiescent Current
Ground Pin Current (Note 4),
per regulator
Ripple Rejection
2019 Microchip Technology Inc.
VIN – VO
IGND
IGND
PSRR
Min.
Typ.
Max.
–1
—
1
–2
—
2
—
40
—
—
0.004
0.012
—
—
0.05
—
0.02
0.2
—
—
0.5
—
10
50
—
—
70
—
110
150
—
—
230
—
140
250
—
—
300
—
165
275
—
—
350
—
0.01
1
—
—
5
—
80
125
—
—
150
—
350
600
—
—
800
—
600
1000
—
—
1500
—
1300
1900
—
—
2500
—
75
—
Units
%
ppm/°C
%/V
%
Conditions
Variation from specified VOUT
Note 1
VIN = VOUT +1V to +16V
IL = 0.1 mA to 150 mA (Note 2)
mV
IL = 100 µA
mV
IL = 50 mA
mV
IL = 100 mA
mV
IL = 150 mA
µA
VEN ≤ 0.4V (shutdown)
VEN ≤ 0.18V (shutdown)
µA
VEN ≥ 2.0V, IL = 100 µA
µA
IL = 50 mA
µA
IL = 100 mA
µA
IL = 150 mA
dB
Frequency = 100 Hz, IL = 100 µA
DS20006096A-page 3
MIC5210
TABLE 1-1:
ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Characteristics: VIN = VOUT +1V; IL = 100 µA; CL = 1.0 µF; VEN ≥ 2.0V; TJ = +25°C, bold values indicate
–40°C < TJ < +125°C, unless noted.
Parameter
Current Limit
Thermal Regulation
Symbol
Min.
Typ.
Max.
Units
Conditions
ILIMIT
—
320
500
mA
VOUT = 0V
∆VO/∆PD
—
0.05
—
%/W
Output Noise (Regulator B
only)
eno
—
260
—
nV/√Hz
Enable Input Logic-Low
Voltage
VIL
—
—
0.4
—
—
0.18
Enable Input Logic-High
Voltage
VIH
2.0
—
—
—
0.01
–1
—
—
–2
—
5
20
—
—
25
IIL
Enable Input Current
IIH
Note 1:
2:
3:
4:
5:
Note 5
IL = 50 mA, CL = 2.2 µF,
470 pF from BYPB to GND
V
Regulator shutdown
V
Regulator enabled
µA
µA
VIL ≤ 0.4V
VIL ≤ 0.18V
VIH ≥ 2.0V
VIH ≥ 2.0V
Output voltage temperature coefficient is defined as the worst case voltage change divided by the total
temperature range.
Regulation is measured at constant junction temperature using low duty cycle pulse testing. Parts are
tested for load regulation in the load range from 0.1 mA to 150 mA. Changes in output voltage due to heating effects are covered by the thermal regulation specification.
Dropout Voltage is defined as the input to output differential at which the output voltage drops 2% below its
nominal value measured at 1V differential.
Ground pin current is the regulator quiescent current plus pass transistor base current. The total current
drawn from the supply is the sum of the load current plus the ground pin current.
Thermal regulation is defined as the change in output voltage at a time “t” after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a 150 mA load pulse at VIN =
16V for t = 10 ms.
DS20006096A-page 4
2019 Microchip Technology Inc.
MIC5210
TEMPERATURE SPECIFICATIONS (Note 1)
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Junction Operating Temperature
Range
TJ
–40
—
+85
°C
Storage Temperature Range
TS
–60
—
+150
°C
—
Lead Temperature
—
—
—
+260
°C
Soldering, 5s
JA
—
200
—
°C/W
Temperature Ranges
—
Package Thermal Resistances
Thermal Resistance MSOP-8
Note 1:
2:
Note 2
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +85°C rating. Sustained junction temperatures above +85°C can impact the device reliability.
Absolute maximum ratings indicate limits beyond which damage to the component may occur. Electrical
specifications do not apply when operating the device outside of its operating ratings. The maximum
allowable power dissipation is a function of the maximum junction temperature, TJ(max), the junction-to-ambient thermal resistance, θJA, and the ambient temperature, TA. The maximum allowable power
dissipation at any ambient temperature is calculated using: PD(max) = (TJ(max) – TA)/θJA. Exceeding the
maximum allowable power dissipation will result in excessive die temperature, and the regulator will go
into thermal shutdown. The θJA of the 8-pin MSOP (MM) is 200°C/W mounted on a PC board (see “Thermal Considerations” section for further details).
2019 Microchip Technology Inc.
DS20006096A-page 5
MIC5210
2.0
Note:
TYPICAL PERFORMANCE CURVES
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
FIGURE 2-1:
Ratio.
Power Supply Rejection
FIGURE 2-4:
Ratio.
Power Supply Rejection
FIGURE 2-2:
Ratio.
Power Supply Rejection
FIGURE 2-5:
Ratio.
Power Supply Rejection
FIGURE 2-3:
Ratio.
Power Supply Rejection
FIGURE 2-6:
Ratio.
Power Supply Rejection
DS20006096A-page 6
2019 Microchip Technology Inc.
MIC5210
FIGURE 2-7:
Ratio.
Power Supply Rejection
FIGURE 2-10:
Power Supply Ripple
Rejection vs. Voltage Drop.
FIGURE 2-8:
Capacitance.
Turn-On Time vs. Bypass
FIGURE 2-11:
Ratio.
Power Supply Rejection
FIGURE 2-12:
Noise Performance.
FIGURE 2-9:
Power Supply Ripple
Rejection vs. Voltage Drop.
2019 Microchip Technology Inc.
DS20006096A-page 7
MIC5210
FIGURE 2-13:
Noise Performance.
FIGURE 2-16:
(Regulator B).
Noise Performance
FIGURE 2-14:
(Regulator B).
Noise Performance
FIGURE 2-17:
(Regulator B).
Noise Performance
FIGURE 2-15:
(Regulator B).
Noise Performance
FIGURE 2-18:
Current.
Dropout Voltage vs. Output
DS20006096A-page 8
2019 Microchip Technology Inc.
MIC5210
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
Pin Number
Pin Name
1
OUTA
Regulator Output A
2
GND
Ground
3
OUTB
Regulator Output B
4
BYPB
Reference Bypass B: Connect external 470 pF capacitor to GND to reduce output
noise in regulator “B”. May be left open.
5
ENB
Enable/Shutdown B (Input): CMOS-compatible input. Logic-high = enable, logic-low =
shutdown. Do not leave floating.
6
INB
Supply Input B
7
ENA
Enable/Shutdown A (Input): CMOS-compatible input. Logic-high = enable, logic-low =
shutdown. Do not leave floating.
8
INA
Supply Input A
2019 Microchip Technology Inc.
Description
DS20006096A-page 9
MIC5210
4.0
APPLICATION INFORMATION
4.1
Enable/Shutdown
Forcing EN (enable/shutdown) high (greater than 2V)
enables the regulator. EN is compatible with CMOS
and TTL logic gates.
If the enable/shutdown feature is not required, connect
EN to IN (supply input).
4.2
Input Capacitor
At lower values of output current, less output
capacitance is required for output stability. The
capacitor can be reduced to 0.47 µF for current below
10 mA or 0.33 µF for currents below 1 mA.
4.5
The MIC5210 will remain stable and in regulation with
no load (other than the internal voltage divider) unlike
many other voltage regulators. This is especially
important in CMOS RAM keep-alive applications.
A 1 µF capacitor should be placed from IN to GND if
there is more than 10 inches of wire between the input
and the AC filter capacitor or if a battery is used as the
input.
4.6
4.3
4.7
Reference Bypass Capacitor
No-Load Stability
Dual-Supply Operation
When used in dual supply systems where the regulator
load is returned to a negative supply, the output voltage
must be diode clamped to ground.
Thermal Considerations
BYPB (reference bypass) is connected to the internal
voltage reference of regulator B. A 470 pF capacitor
(CBYP) connected from BYPB to GND quiets this
reference, providing a significant reduction in output
noise. CBYP reduces the regulator phase margin; when
using CBYP, output capacitors of 2.2 µF or greater are
generally required to maintain stability.
Multilayer boards having a ground plane, wide traces
near the pads, and large supply bus lines provide better
thermal conductivity.
The start-up speed of the MIC5210 is inversely
proportional to the size of the reference bypass
capacitor. Applications requiring a slow ramp-up of
output voltage should consider larger values of CBYP.
Likewise, if rapid turn-on is necessary, consider
omitting CBYP.
For additional heat sink characteristics, please refer to
Application Hint 17, “Designing P.C. Board Heat Sinks.”
If output noise is not a major concern, omit CBYP and
leave BYPB open.
4.4
The MIC5210-xxYMM (8-pin MSOP) has a thermal
resistance of 200°C/W when mounted on a FR4 board
with minimum trace widths and no ground plane.
4.7.1
THERMAL EVALUATION
EXAMPLES
For example, at 50°C ambient temperature, the
maximum package power dissipation is:
EQUATION 4-1:
Output Capacitor
An output capacitor is required between OUT and GND
to prevent oscillation. The minimum size of the output
capacitor is dependent upon whether a reference
bypass capacitor is used. 1.0 µF minimum is
recommended when CBYP is not used. 2.2 µF
minimum is recommended when CBYP is 470 pF (see
Typical Application Circuit). Larger values improve the
regulator’s transient response. The output capacitor
value may be increased without limit.
The output capacitor should have an ESR (effective
series resistance) of about 5Ω or less and a resonant
frequency above 1 MHz. Ultralow-ESR capacitors may
cause a low-amplitude oscillation and/or underdamped
transient response. Most tantalum or aluminum
electrolytic capacitors are adequate; film types will
work, but are more expensive. Because many
aluminum electrolytic capacitors have electrolytes that
freeze at about –30°C, solid tantalum capacitors are
recommended for operation below –25°C.
DS20006096A-page 10
P D MAX = 125C – 50C 200C/W = 375mW
If the intent is to operate the 5V version from a 6V
supply at the full 150mA load for both outputs in a 50°C
maximum ambient temperature, make the following
calculation:
EQUATION 4-2:
P D EACHREG = V IN – V OUT I OUT + V IN I GND
2019 Microchip Technology Inc.
MIC5210
EQUATION 4-3:
P D EACHREG = 6V – 5V 150mA + 6V 2.5mA
= 165mW
EQUATION 4-4:
P D BOTHREG = 2Regulators 165mW = 330mW
The actual total power dissipation of 330 mW is below
the 375 mW package maximum; therefore, the
regulator can be used.
Note that both regulators cannot always be used at
their maximum current rating. For example, in a 5V
input to 3.3V output application at +50°C, if one
regulator supplies 150 mA, the other regulator is limited
to a much lower current. The first regulator dissipates:
EQUATION 4-5:
P D = 5V – 3.3V 150mA + 5V 2.5mA
= 267.5mW
Then, the load that the remaining regulator can
dissipate must not exceed 375 mW – 267.5 mW =
107.5 mW.
This means, using the same 5V input and 3.3V output
voltage, the second regulator is limited to about 60 mA.
Taking advantage of the extremely low-dropout voltage
characteristics of the MIC5210, power dissipation can
be reduced by using the lowest possible input voltage
to minimize the input-to-output voltage drop.
2019 Microchip Technology Inc.
DS20006096A-page 11
MIC5210
5.0
PACKAGING INFORMATION
5.1
Package Marking Information
8-Lead MSOP*
XXXX
X.XX
Legend: XX...X
Y
YY
WW
NNN
e3
*
Example
5210
3.3Y
Product code or customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle
mark).
Note:
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information. Package may or may not include
the corporate logo.
Underbar (_) and/or Overbar (⎯) symbol may not be to scale.
DS20006096A-page 12
2019 Microchip Technology Inc.
MIC5210
8-Lead MSOP Package Outline and Recommended Land Pattern
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
2019 Microchip Technology Inc.
DS20006096A-page 13
MIC5210
NOTES:
DS20006096A-page 14
2019 Microchip Technology Inc.
MIC5210
APPENDIX A:
REVISION HISTORY
Revision A (March 2019)
• Converted Micrel document MIC5210 to Microchip data sheet DS20006096A.
• Minor text changes throughout.
2019 Microchip Technology Inc.
DS20006096A-page 15
MIC5210
NOTES:
DS20006096A-page 16
2019 Microchip Technology Inc.
MIC5210
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
PART NO.
Device
–X.X
X
XX
–XX
Examples:
a) MIC5210-2.8YMM:
Dual 150 mA LDO Regulator,
2.8V, –40°C to +125°C, 8-Lead
MSOP, 100/Tube
b) MIC5210-3.0YMM:
Dual 150 mA LDO Regulator,
3.0V, –40°C to +125°C, 8-Lead
MSOP, 100/Tube
c) MIC5210-3.3YMM:
Dual 150 mA LDO Regulator,
3.3V, –40°C to +125°C, 8-Lead
MSOP, 100/Tube
d) MIC5210-5.0YMM:
Dual 150 mA LDO Regulator,
5.0V, –40°C to +125°C, 8-Lead
MSOP, 100/Tube
e) MIC5210-2.8YMM-TR:
Dual 150 mA LDO Regulator,
2.8V, –40°C to +125°C, 8-Lead
MSOP, 2,500/Reel
f) MIC5210-3.0YMM-TR:
Dual 150 mA LDO Regulator,
3.0V, –40°C to +125°C, 8-Lead
MSOP, 2,500/Reel
g) MIC5210-3.3YMM-TR:
Dual 150 mA LDO Regulator,
3.3V, –40°C to +125°C, 8-Lead
MSOP, 2,500/Reel
h) MIC5210-5.0YMM-TR:
Dual 150 mA LDO Regulator,
5.0V, –40°C to +125°C, 8-Lead
MSOP, 2,500/Reel
Voltage Temperature Package Media Type
Device:
MIC5210:
Dual 150 mA LDO Regulator
Voltage:
2.8
3.0
3.3
5.0
=
=
=
=
2.8V
3.0V
3.3V
5.0V
Temperature:
Y
=
–40°C to +125°C
Package:
MM =
Media Type:
= 100/Tube
TR =
2,500/Reel
8-Lead MSOP
Note 1:
2019 Microchip Technology Inc.
Tape and Reel identifier only appears in the
catalog part number description. This identifier is
used for ordering purposes and is not printed on
the device package. Check with your Microchip
Sales Office for package availability with the
Tape and Reel option.
DS20006096A-page 17
MIC5210
NOTES:
DS20006096A-page 18
2019 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
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are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
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SQTP is a service mark of Microchip Technology Incorporated in
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The Microchip name and logo, the Microchip logo, AnyRate, AVR,
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© 2019, Microchip Technology Incorporated, All Rights Reserved.
ISBN: 978-1-5224-4272-1
== ISO/TS 16949 ==
2019 Microchip Technology Inc.
DS20006096A-page 19
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Japan - Osaka
Tel: 81-6-6152-7160
Finland - Espoo
Tel: 358-9-4520-820
China - Dongguan
Tel: 86-769-8702-9880
Japan - Tokyo
Tel: 81-3-6880- 3770
China - Guangzhou
Tel: 86-20-8755-8029
Korea - Daegu
Tel: 82-53-744-4301
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
China - Hangzhou
Tel: 86-571-8792-8115
Korea - Seoul
Tel: 82-2-554-7200
China - Hong Kong SAR
Tel: 852-2943-5100
Malaysia - Kuala Lumpur
Tel: 60-3-7651-7906
China - Nanjing
Tel: 86-25-8473-2460
Malaysia - Penang
Tel: 60-4-227-8870
China - Qingdao
Tel: 86-532-8502-7355
Philippines - Manila
Tel: 63-2-634-9065
China - Shanghai
Tel: 86-21-3326-8000
Singapore
Tel: 65-6334-8870
China - Shenyang
Tel: 86-24-2334-2829
Taiwan - Hsin Chu
Tel: 886-3-577-8366
China - Shenzhen
Tel: 86-755-8864-2200
Taiwan - Kaohsiung
Tel: 886-7-213-7830
Israel - Ra’anana
Tel: 972-9-744-7705
China - Suzhou
Tel: 86-186-6233-1526
Taiwan - Taipei
Tel: 886-2-2508-8600
China - Wuhan
Tel: 86-27-5980-5300
Thailand - Bangkok
Tel: 66-2-694-1351
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
China - Xian
Tel: 86-29-8833-7252
Vietnam - Ho Chi Minh
Tel: 84-28-5448-2100
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Austin, TX
Tel: 512-257-3370
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Novi, MI
Tel: 248-848-4000
Houston, TX
Tel: 281-894-5983
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Tel: 317-536-2380
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Tel: 951-273-7800
Raleigh, NC
Tel: 919-844-7510
New York, NY
Tel: 631-435-6000
San Jose, CA
Tel: 408-735-9110
Tel: 408-436-4270
Canada - Toronto
Tel: 905-695-1980
Fax: 905-695-2078
DS20006096A-page 20
China - Xiamen
Tel: 86-592-2388138
China - Zhuhai
Tel: 86-756-3210040
Germany - Garching
Tel: 49-8931-9700
Germany - Haan
Tel: 49-2129-3766400
Germany - Heilbronn
Tel: 49-7131-67-3636
Germany - Karlsruhe
Tel: 49-721-625370
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Germany - Rosenheim
Tel: 49-8031-354-560
Italy - Padova
Tel: 39-049-7625286
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Norway - Trondheim
Tel: 47-7288-4388
Poland - Warsaw
Tel: 48-22-3325737
Romania - Bucharest
Tel: 40-21-407-87-50
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Sweden - Gothenberg
Tel: 46-31-704-60-40
Sweden - Stockholm
Tel: 46-8-5090-4654
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
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08/15/18
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