MIC5219-3.0BM5-TR

MIC5219 500 mA Peak Output LDO Regulator Features General Description • 500 mA Output Current Capability - SOT23-5 Package - 500 mA Peak - 2 mm x 2 mm x 0.9 mm VDFN Package 500 mA Continuous - 2 mm x 2 mm x 0.6 mm Thin DFN Package 500 mA Continuous - MSOP-8 Package - 500 mA Continuous • Low 500 mV Maximum Dropout Voltage at Full Load • Extremely Tight Load and Line Regulation • Tiny SOT-23-5 and Power MSOP-8 Package • Ultra-Low Noise Output • Low Temperature Coefficient • Current and Thermal Limiting • Reversed-Battery Protection • CMOS/TTL-Compatible Enable/Shutdown Control • Near-Zero Shutdown Current The MIC5219 is an efficient linear voltage regulator with high peak output current capability, very low dropout voltage, and better than 1% output voltage accuracy. Dropout is typically 10 mV at light loads and less than 500 mV at full load. Applications • Laptop, Notebook, and Palmtop Computers • Cellular Telephones and Battery-Powered Equipment • Consumer and Personal Electronics • PC Card VCC and VPP Regulation and Switching • SMPS Post-Regulator/DC-to-DC Modules • High-Efficiency Linear Power Supplies DS20006021A-page 1 The MIC5219 is designed to provide a peak output current for start-up conditions where higher inrush current is demanded. It features a 500 mA peak output rating. Continuous output current is limited only by package and layout. The MIC5219 can be enabled or shut down by a CMOS- or TTL-compatible signal. When disabled, power consumption drops nearly to zero. Dropout ground current is minimized to help prolong battery life. Other key features include reversed-battery protection, current limiting, overtemperature shutdown, and low noise performance with an ultra-low noise option. The MIC5219 is available in adjustable or fixed output voltages in the space-saving 6-pin (2 mm × 2 mm) VDFN, 6-pin (2 mm × 2 mm) Thin DFN, SOT23-5, and 8-pin power MSOP packages. For higher power requirements see the MIC5209 or MIC5237.  2018 Microchip Technology Inc. MIC5219 Package Types MIC5219YMM MSOP-8 (MM) Adjustable Voltages (Top View) MIC5219-x.xYMM MSOP-8 (MM) Fixed Voltages (Top View) EN 1 8 GND EN 1 8 GND IN 2 7 GND IN 2 7 GND OUT 3 6 GND OUT 3 6 GND BYP 4 5 GND BYP 4 5 GND MIC5219-x.xYML 6-Pin VDFN (ML) (Top View) 6 BYP EN 1 5 NC GND 2 MIC5219YMT 6-Pin TDFN (MT) (Top View) GND 2 5 ADJ IN 3 4 OUT 4 OUT IN 3 MIC5219-x.xYM5 SOT23-5 (M5) Fixed Voltages (Top View) E N GND IN 3 2 1 6 NC EN 1 MIC5219YM5 SOT23-5 (M5) Adjustable Voltage (Top View) E N GND IN 3 L Gx x 2 1 Part Identification LGAA 4 5 4 5 BYP OUT ADJ OUT DS20006021A-page 2  2018 Microchip Technology Inc. MIC5219 Typical Application Circuits MIC5219 3.3V Ultra-Low Noise Regulator MIC5219 5V Ultra-Low Noise Regulator MIC5219-5.0YMM ENABLE SHUTDOWN VIN 6V VOUT 5V 2.2μF tantalum MIC5219-3.3YM5 1 8 2 7 3 6 4 5 1 VIN 4V 5 VOUT 3.3V 2.2μF tantalum 2 4 3 ENABLE SHUTDOWN 470pF 470pF MIC5219 Ultra-Low Noise Regulator (Fixed) VIN ENABLE SHUTDOWN VOUT MIC5219-x.xYML EN 6 1 2 5 3 4 COUT CBYP (optional) MIC5219 Ultra-Low Noise Regulator (Adjustable) VIN ENABLE SHUTDOWN EN VOUT MIC5219YMT 1 6 2 5 3 4 R1 + 2.2μF R2 470pF  2018 Microchip Technology Inc. DS20006021A-page 3 MIC5219 Block Diagrams Ultra-Low Noise Fixed Regulator VIN OUT IN VOUT COUT BYP CB Y P (optional) Bandgap Ref. V REF EN Current-Limit Thermal Shutdown MIC5219-x.xYM5/YMM/YMT GND Ultra-Low Noise Adjustable Regulator VIN OUT IN R1 R2 Bandgap Ref. V REF VOUT COUT CB Y P (optional) EN Current-Limit Thermal Shutdown MIC5219YM5/YMM/YMT GND DS20006021A-page 4  2018 Microchip Technology Inc. MIC5219 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings † Supply Input Voltage (VIN) .......................................................................................................................... –20V to +20V Power Dissipation (PD) .......................................................................................................................... Internally Limited Operating Ratings †† Supply Input Voltage (VIN) ......................................................................................................................... +2.5V to +12V Enable Input Voltage (VEN) .................................................................................................................................0V to VIN † Notice: Absolute maximum ratings indicate limits beyond which damage to the component may occur. Electrical specifications do not apply when operating the device outside of its operating ratings. The maximum allowable power dissipation is a function of the maximum junction temperature, TJ(MAX), the junction-to-ambient thermal resistance, θJA, and the ambient temperature, TA. The maximum allowable power dissipation at any ambient temperature is calculated using: PD(MAX) = (TJ(MAX) – TA) ÷ θJA. Exceeding the maximum allowable power dissipation will result in excessive die temperature, and the regulator will go into thermal shutdown. See Table 4-1 and the Thermal Considerations section for details. †† Notice: The device is not guaranteed to function outside its operating rating. ELECTRICAL CHARACTERISTICS Electrical Characteristics: Unless otherwise indicated, VIN = VOUT + 1.0V; COUT = 4.7 μF, IOUT = 100 μA; TJ = +25°C, bold values indicate –40°C ≤ TJ ≤ +125°C. Parameters Sym. Output Voltage VOUT Output Voltage Temperature Coefficient ∆VOUT/∆T Line Regulation ∆VOUT/VOUT Load Regulation ∆VOUT/VOUT Note 1: 2: 3: 4: 5: 6: 7: Min. Typ. Max. Units –1 — 1 % –2 — 2 % — 40 — — 0.009 0.05 — — 0.1 — 0.05 0.5 — — 0.7 Conditions Variation from Nominal VOUT ppm/°C Note 1 %/V % VIN = VOUT + 1V to 12V IOUT = 100 µA to 500 mA, Note 2 Output voltage temperature coefficient is defined as the worst case voltage change divided by the total temperature range. Regulation is measured at constant junction temperature using low duty cycle pulse testing. Parts are tested for load regulation in the load range from 100 μA to 500 mA. Changes in output voltage due to heating effects are covered by the thermal regulation specification. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at 1V differential. Ground pin current is the regulator quiescent current plus pass transistor base current. The total current drawn from the supply is the sum of the load current plus the ground pin current. VEN is the voltage externally applied to devices with the EN (enable) input pin. Thermal regulation is defined as the change in output voltage at a time “t” after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a 500 mA load pulse at VIN = 12V for t = 10 ms. CBYP is an optional, external bypass capacitor connected to devices with a BYP (bypass) or ADJ (adjust) pin.  2018 Microchip Technology Inc. DS20006021A-page 5 MIC5219 ELECTRICAL CHARACTERISTICS (CONTINUED) Electrical Characteristics: Unless otherwise indicated, VIN = VOUT + 1.0V; COUT = 4.7 μF, IOUT = 100 μA; TJ = +25°C, bold values indicate –40°C ≤ TJ ≤ +125°C. Parameters Dropout Voltage (Note 3) Sym. VIN – VOUT Ground Pin Current (Note 4, 5) IGND Ground Pin Quiescent Current (Note 4) Min. Typ. Max. — 10 60 — — 80 — 115 175 — — 250 — 175 300 — — 400 — 350 500 — — 600 — 80 130 — — 170 — 350 650 — — 900 — 1.8 2.5 — — 3.0 — 12 20 — — 25 — 0.05 — Units Conditions mV IOUT = 100 μA mV IOUT = 50 mA mV IOUT = 150 mA mV IOUT = 500 mA μA VEN ≥ 3.0V, IOUT = 100 μA μA VEN ≥ 3.0V, IOUT = 50 mA mA VEN ≥ 3.0V, IOUT = 150 mA mA VEN ≥ 3.0V, IOUT = 500 mA 3 μA VEN ≤ 0.4V 0.10 8 μA VEN ≤ 0.18V Ripple Rejection PSRR — 75 — dB f = 120 Hz Current Limit ILIMIT — 700 1000 mA VOUT = 0V ∆VOUT/∆PD — 0.05 — %/W — 500 — = 50 mA, I nV/√ Hz OUT COUT = 2.2 μF, CBYP = 0 — 300 — I = 50 mA, COUT = nV/√ Hz OUT 2.2 μF, CBYP = 470 pF Thermal Regulation (Note 3) Output Noise (Note 7) Note 1: 2: 3: 4: 5: 6: 7: eno Note 6 Output voltage temperature coefficient is defined as the worst case voltage change divided by the total temperature range. Regulation is measured at constant junction temperature using low duty cycle pulse testing. Parts are tested for load regulation in the load range from 100 μA to 500 mA. Changes in output voltage due to heating effects are covered by the thermal regulation specification. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at 1V differential. Ground pin current is the regulator quiescent current plus pass transistor base current. The total current drawn from the supply is the sum of the load current plus the ground pin current. VEN is the voltage externally applied to devices with the EN (enable) input pin. Thermal regulation is defined as the change in output voltage at a time “t” after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a 500 mA load pulse at VIN = 12V for t = 10 ms. CBYP is an optional, external bypass capacitor connected to devices with a BYP (bypass) or ADJ (adjust) pin. DS20006021A-page 6  2018 Microchip Technology Inc. MIC5219 ELECTRICAL CHARACTERISTICS (CONTINUED) Electrical Characteristics: Unless otherwise indicated, VIN = VOUT + 1.0V; COUT = 4.7 μF, IOUT = 100 μA; TJ = +25°C, bold values indicate –40°C ≤ TJ ≤ +125°C. Parameters Sym. Min. Typ. Max. — — 0.4 — — 0.18 2.0 — — — 0.01 –1 — 0.01 –2 2 5 20 — — 25 Units Conditions ENABLE Input Enable Input Logic-Low Voltage VENL IENL Enable Input Current IENH Note 1: 2: 3: 4: 5: 6: 7: V VEN = logic low (regulator shutdown) V VEN = logic high (regulator enabled) μA μA VENL ≤ 0.4V VENL ≤ 0.18V VENH ≥ 2.0V Output voltage temperature coefficient is defined as the worst case voltage change divided by the total temperature range. Regulation is measured at constant junction temperature using low duty cycle pulse testing. Parts are tested for load regulation in the load range from 100 μA to 500 mA. Changes in output voltage due to heating effects are covered by the thermal regulation specification. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at 1V differential. Ground pin current is the regulator quiescent current plus pass transistor base current. The total current drawn from the supply is the sum of the load current plus the ground pin current. VEN is the voltage externally applied to devices with the EN (enable) input pin. Thermal regulation is defined as the change in output voltage at a time “t” after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a 500 mA load pulse at VIN = 12V for t = 10 ms. CBYP is an optional, external bypass capacitor connected to devices with a BYP (bypass) or ADJ (adjust) pin.  2018 Microchip Technology Inc. DS20006021A-page 7 MIC5219 TEMPERATURE SPECIFICATIONS (Note 1) Parameters Sym. Min. Typ. Max. Units Conditions TA –40 — +125 °C — Maximum Junction Temperature Range TJ –40 — +125 °C — Storage Temperature Range TS –65 — +150 °C — Lead Temperature — — 260 — °C Soldering, 5 sec. Thermal Resistance, MSOP-8Ld JA — 160 — °C/W Minimum footprint area. Thermal Resistance, SOT23-5Ld JA — 220 — °C/W Minimum footprint area. Thermal Resistance, VDFN-6Ld JA — 90 — °C/W Minimum footprint area. Thermal Resistance, TDFN-6Ld JA — 90 — °C/W Minimum footprint area. Temperature Ranges Operating Ambient Temperature Range Package Thermal Resistances Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability. DS20006021A-page 8  2018 Microchip Technology Inc. MIC5219 2.0 Note: TYPICAL PERFORMANCE CURVES The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. FIGURE 2-1: Ratio. Power Supply Rejection FIGURE 2-4: Ratio. Power Supply Rejection FIGURE 2-2: Ratio. Power Supply Rejection FIGURE 2-5: Ratio. Power Supply Rejection FIGURE 2-3: Ratio. Power Supply Rejection FIGURE 2-6: Power Supply Ripple Rejection vs. Voltage Drop.  2018 Microchip Technology Inc. DS20006021A-page 9 MIC5219 . FIGURE 2-7: Power Supply Ripple Rejection vs. Voltage Drop. FIGURE 2-10: Noise Performance. FIGURE 2-8: Noise Performance. FIGURE 2-11: Current. Dropout Voltage vs. Output FIGURE 2-9: Noise Performance. FIGURE 2-12: Dropout Characteristics. DS20006021A-page 10  2018 Microchip Technology Inc. MIC5219 FIGURE 2-13: Current. Ground Current vs. Output FIGURE 2-14: Voltage. Ground Current vs. Supply FIGURE 2-15: Voltage. Ground Current vs. Supply  2018 Microchip Technology Inc. DS20006021A-page 11 MIC5219 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. TABLE 3-1: Pin Number VDFN-6 TDFN-6 PIN FUNCTION TABLE Pin Number MSOP-8 Pin Number SOT23-5 3 2 1 IN 2 5-8 2 GND 4 3 5 OUT 1 1 3 EN 6 4 (FIXED) 4 (FIXED) BYP Reference bypass: Connect an external 470 pF capacitor to GND to reduce output noise. May be left open. 5 (NC) 4 (ADJ) 4 (ADJ) ADJ Adjust (input): Feedback input. Connect to resistive voltage-divider network. EP — — GND Ground: Internally connected to the exposed pad. Connect externally to GND pin. DS20006021A-page 12 Pin Name Description Supply input. Ground: MSOP-8 pins 5 through 8 are internally connected. Regulator output. Enable (input): CMOS-compatible control input. Logic-high = enable; logic-low or open = shutdown.  2018 Microchip Technology Inc. MIC5219 4.0 APPLICATION INFORMATION 4.5 Reference Bypass Capacitor Forcing EN (enable/shutdown) high (>2V) enables the regulator. EN is compatible with CMOS logic. If the enable/shutdown feature is not required, connect EN to IN (supply input). See Figure 4-5. BYP is connected to the internal voltage reference. A 470 pF capacitor (CBYP) connected from BYP to GND quiets this reference, providing a significant reduction in output noise (ultra-low noise performance). CBYP reduces the regulator phase margin; when using CBYP, output capacitors of 2.2 μF or greater are generally required to maintain stability. The start-up speed of the MIC5219 is inversely proportional to the size of the reference bypass capacitor. Applications requiring a slow ramp-up of output voltage should consider larger values of CBYP. Likewise, if rapid turn-on is necessary, consider omitting CBYP. 4.2 4.6 The MIC5219 is designed for 150 mA to 200 mA output current applications where a high-current spike (500 mA) is needed for short, start-up conditions. Basic application of the device will be discussed initially followed by a more detailed discussion of higher current applications. 4.1 Enable/Shutdown Input Capacitor A 1 μF capacitor should be placed from IN to GND if there is more than 10 inches of wire between the input and the AC filter capacitor or if a battery is used as the input. 4.3 Output Capacitor An output capacitor is required between OUT and GND to prevent oscillation. The minimum size of the output capacitor is dependent upon whether a reference bypass capacitor is used. 1 μF minimum is recommended when CBYP is not used (see Figure 4-5). 2.2 μF minimum is recommended when CBYP is 470 pF (see Figure 4-6). For applications