MIC5236-3.3BM-TR

MIC5236 Low Quiescent Current μCap LDO Regulator Features General Description • Ultra-Low Quiescent Current (IQ = 20 μA @ IO = 100 μA) • Wide Input Range: 2.3V to 30V • Low Dropout: - 230 mV @ 50 mA - 300 mV @ 150 mA • Fixed 2.5V, 3.0V, 3.3V, 5.0V and Adjustable Outputs • ±1.0% Initial Output Accuracy • Stable with Ceramic or Tantalum Output Capacitor • Load Dump Protection: –20V to +60V Input Transient Survivability • Logic Compatible Enable Input • Low Output Flag Indicator • Overcurrent Protection • Thermal Shutdown • Reverse-Leakage Protection • Reverse-Battery Protection • High-Power SOIC-8 and MSOP-8 Package Options The MIC5236 is a low quiescent current, μCap low-dropout regulator. With a maximum operating input voltage of 30V and a quiescent current of 20 μA, it is ideal for supplying keep-alive power in systems with high-voltage batteries. Applications Package Types • Keep-Alive Supply in Notebook and Portable Personal Computers • Logic Supply from High-Voltage Batteries • Automotive Electronics • Battery-Powered Systems Capable of 150 mA output, the MIC5236 has a dropout voltage of only 300 mV. It can also survive an input transient of -20V to +60V. As a μCap LDO, the MIC5236 is stable with either a ceramic or a tantalum output capacitor. It only requires a 1.0 μF output capacitor for stability. The MIC5236 includes a logic-compatible enable input and an undervoltage error flag indicator. Other features of the MIC5236 include thermal shutdown, current-limit, overvoltage shutdown, load-dump protection, reverse leakage protections, and reverse battery protection. Available in the thermally-enhanced SOIC-8 and MSOP-8, the MIC5236 comes in fixed 2.5V, 3.0V, 3.3V, 5.0V and adjustable voltages. For other output voltages, contact Microchip. 8-Lead SOIC (M) 8-Lead MSOP (MM) Fixed Voltage Adjustable Voltage  2021-2022 Microchip Technology Inc. and its subsidiaries DS20006574B-page 1 MIC5236 Typical Application Circuits Regulator with Low IO and Low IQ VIN 30V MIC5236 IN OUT VOUT 3.0V/100μA EN ERR IGND = 20μA Regulator with Error Output GND Regulator with Adjustable Output Functional Block Diagram DS20006574B-page 2  2021-2022 Microchip Technology Inc. and its subsidiaries MIC5236 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings † Supply Voltage (VIN), Note 1........................................................................................................................ -20V to +60V Power Dissipation (PD), Note 2.............................................................................................................. Internally Limited ESD Rating, Note 3 Operating Ratings ‡ Supply Voltage (VIN) ................................................................................................................................. +2.3V to +30V † Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended periods may affect device reliability. ‡ Notice: The device is not guaranteed to function outside its operating ratings. Note 1: The absolute maximum positive supply voltage (60V) must be of limited duration (≤100 ms) and duty cycle (≤1%). The maximum continuous supply voltage is 30V. 2: The maximum allowable power dissipation of any TA (ambient temperature) is PD(MAX) = (TJ(MAX) – TA) ÷ JA. Exceeding the maximum allowable power dissipation will result in excessive die temperature, and the regulator will go into thermal shutdown. The JA of the MIC5236-x.xYM (all versions) is 63°C/W, and the MIC5236-x.xYMM (all versions) is 80°C/W, mounted on a PC board (see Package Thermal Resistance for further details). 3: Devices are ESD sensitive. Handling precautions are recommended. Human body model, 1.5 kΩ in series with 100 pF. ELECTRICAL CHARACTERISTICS Electrical Characteristics: VIN = 6.0V; VEN = 2.0V; COUT = 4.7 μF, IOUT = 100 μA; TJ = 25°C. Bold values indicate -40°C ≤ TJ ≤ +125°C; unless noted. Parameter Symbol Min. Typ. Max. Units Conditions VOUT -1 — 1 % Variation from nominal VOUT ΔVOUT/ΔT — 50 — ppm/°C Line Regulation ΔVOUT/VOUT — 0.2 0.5 % VIN = VOUT + 1V to 30V Load Regulation ΔVOUT/VOUT — 0.15 0.3 % — 0.3 0.6 % IOUT = 100 μA to 50 mA, Note 2 — 50 100 mV — 230 400 mV IOUT = 50 mA — 270 — mV IOUT = 100 mA — 300 500 mV IOUT = 150 mA Output Voltage Accuracy Output Voltage Temperature Coefficient Dropout Voltage, Note 3 Ground Pin Current Ground Pin in Shutdown ΔV IGND Note 1 IOUT = 100 μA — 20 30 μA VEN ≥ 2.0V, IOUT = 100 μA — 0.5 0.8 mA VEN ≥ 2.0V, IOUT = 50 mA VEN ≥ 2.0V, IOUT = 100 mA — 1.5 — mA — 2.8 4.0 mA — — 5.0 mA VEN ≥ 2.0V, IOUT = 150 mA IGND(SHDN) — 0.1 1 μA VEN ≤ 0.6V, VIN = 3 Short Circuit Current ISC — 260 350 mA VOUT = 0V Output Noise en — 160 — μVrms  2021-2022 Microchip Technology Inc. and its subsidiaries 10 Hz to 100 kHz, VOUT = 3.0V, CL = 1.0 μF DS20006574B-page 3 MIC5236 ELECTRICAL CHARACTERISTICS (CONTINUED) Electrical Characteristics: VIN = 6.0V; VEN = 2.0V; COUT = 4.7 μF, IOUT = 100 μA; TJ = 25°C. Bold values indicate -40°C ≤ TJ ≤ +125°C; unless noted. Parameter Symbol Min. Typ. Max. Units 90 94 — % — 95 98 % Conditions /ERR Output Low Threshold High Threshold V/ERR /ERR Output Low Voltage VOL /ERR Output Leakage ILEAK % of VOUT — 150 250 mV — — 400 mV — 0.1 1 μA — — 2 μA — 0.6 V Regulator off Regulator on VIN = VOUT(nom) – 0.12VOUT, IOL = 200 μA VOH = 30V Enable Input Input Low Voltage VIL — Input High Voltage VIH 2.0 — — V — 0.01 1.0 μA — — 2.0 μA — 0.15 1.0 μA — — 2.0 μA — 0.5 2.5 μA — — 5.0 μA Enable Input Current Note 1: 2: 3: IIN VEN = 0.6V, regulator off VEN = 2.0V, regulator on VEN = 30V, regulator on Output voltage temperature coefficient is defined as the worst-case voltage change divided by the total temperature range. Regulation is measured at constant junction temperature using pulse testing with a low duty-cycle. Changes in output voltage due to heating effects are covered by the specification for thermal regulation. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at 1.0V differential. TEMPERATURE SPECIFICATIONS (Note 1) Parameters Sym. Min. Typ. Max. Units Conditions TJ -40 — +125 °C — TJ(MAX) — — +150 °C — Temperature Ranges Junction Temperature Range Maximum Junction Temperature Lead Temperature — — — +260 °C Soldering, 5 seconds Storage Temperature TS -65 — +150 °C — Thermal Resistance, SOIC-8 JA — 63 — °C/W — Thermal Resistance, MSOP-8 JA — 80 — °C/W — Package Thermal Resistance Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability. DS20006574B-page 4  2021-2022 Microchip Technology Inc. and its subsidiaries MIC5236 2.0 Note: TYPICAL PERFORMANCE CURVES The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. FIGURE 2-1: Current. Dropout Voltage vs. Output FIGURE 2-4: Current. Ground Current vs. Output FIGURE 2-2: Dropout Characteristics. FIGURE 2-5: Output Current. Ground Pin Current vs. FIGURE 2-3: Temperature. Dropout Voltage vs. FIGURE 2-6: Voltage. Ground Current vs. Supply  2021-2022 Microchip Technology Inc. and its subsidiaries DS20006574B-page 5 MIC5236 FIGURE 2-7: Voltage. Ground Current vs. Supply FIGURE 2-10: Temperature. Ground Current vs. FIGURE 2-8: Temperature. Ground Current vs. FIGURE 2-11: Temperature. Output Voltage vs. FIGURE 2-9: Temperature. Ground Current vs. FIGURE 2-12: Temperature. Short Circuit Current vs. DS20006574B-page 6  2021-2022 Microchip Technology Inc. and its subsidiaries MIC5236 FIGURE 2-13: Line Regulation. FIGURE 2-16: Input Current. FIGURE 2-14: Temperature. Overvoltage Threshold vs. FIGURE 2-17: Dropout Induced Error Flag. FIGURE 2-15: Voltage. Current Limit vs. Output FIGURE 2-18: Flag. Current Limit Induced Error  2021-2022 Microchip Technology Inc. and its subsidiaries DS20006574B-page 7 MIC5236 Note 10 FIGURE 2-19: Input). FIGURE 2-22: Load Transient Response. Reverse Current (Open Note 11 FIGURE 2-20: Input). Reverse Current (Grounded FIGURE 2-21: Enable Transient Response. DS20006574B-page 8  2021-2022 Microchip Technology Inc. and its subsidiaries MIC5236 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE Pin Number Pin Name Description 1 /ERR Error (Output): Open-collector output is active-low when the output is out of regulation due to insufficient input voltage or excessive load. An external pull-up resistor is required. 1 ADJ Adjustable Feedback Input. Connect to voltage divider network. 2 IN 3 OUT 4 EN 5-8 GND Power Supply Input. Regulated Output. Enable (Input): Logic low = shutdown; logic high = enabled. Ground: Pins 5, 6, 7, and 8 are internally connected in common via the leadframe.  2021-2022 Microchip Technology Inc. and its subsidiaries DS20006574B-page 9 MIC5236 4.0 APPLICATION INFORMATION The MIC5236 provides all of the advantages of the MIC2950: wide input voltage range, load dump (positive transients up to 60V), and reversed-battery protection, with the added advantages of reduced quiescent current and smaller package. Additionally, when disabled, quiescent current is reduced to 0.1 μA. 4.1 Enable A low on the enable pin disables the part, forcing the quiescent current to less than 0.1 μA. Thermal shutdown and the error flag are not functional while the device is disabled. The maximum enable bias current is 2 μA for a 2.0V input. An open collector pull-up resistor tied to the input voltage should be set low enough to maintain 2V on the enable input. Figure 4-1 shows an open collector output driving the enable pin through a 200-kΩ pull-up resistor tied to the input voltage. In order to avoid output oscillations, slow transitions from low to high should be avoided. FIGURE 4-1: 4.2 Remote Enable. FIGURE 4-2: 4.4 Output Capacitor ESR. Error Detection Comparator Output The ERR pin is an open collector output which goes low when the output voltage drops 5% below its internally programmed level. It senses conditions such as excessive load (current limit), low input voltage, and overtemperature conditions. Once the part is disabled via the enable input, the error flag output is not valid. Overvoltage conditions are not reflected in the error flag output. The error flag output is also not valid for input voltages less than 2.3V. The error output has a low voltage of 400 mV at a current of 200 μA. In order to minimize the drain on the source used for the pull-up, a value of 200 kΩ to 1 MΩ is suggested for the error flag pull-up. This will guarantee a maximum low voltage of 0.4V for a 30V pull-up potential. An unused error flag can be left unconnected. Input Capacitor An input capacitor may be required when the device is not near the source power supply or when supplied by a battery. Small, surface mount, ceramic capacitors can be used for bypassing. Larger values may be required if the source supply has high ripple. 4.3 Output Capacitor The MIC5236 was designed to minimize the effect of the output capacitor ESR on the closed loop stability. As a result, ceramic or film capacitors can be used at the output. Figure 4-2 displays a range of ESR values for a 10 μF capacitor. Virtually any 10 μF capacitor with an ESR less than 3.4Ω is sufficient for stability over the entire input voltage range. Stability can also be maintained throughout the specified load and line conditions with 1-μF film or ceramic capacitors. DS20006574B-page 10 FIGURE 4-3: 4.5 Error Output Timing. Reverse Current Protection The MIC5236 is designed to limit the reverse current flow from output to input in the event that the MIC5236 output was tied to the output of another power supply. See Figure 2-19 and Figure 2-20 detailing the reverse current flow with the input grounded and open.  2021-2022 Microchip Technology Inc. and its subsidiaries MIC5236 4.6 Thermal Shutdown The MIC5236 has integrated thermal protection. This feature is only for protection purposes. The device should never be intentionally operated near this temperature as this may have detrimental effects on the life of the device. The thermal shutdown may become inactive while the enable input is transitioning a high to a low. When disabling the device via the enable pin, transition from a high to low quickly. This will ensure that the output remains disabled in the event of a thermal shutdown. 4.7 Thermal resistance consists of two main elements, JC (junction-to-case thermal resistance) and CA (case-to-ambient thermal resistance). See Figure 4-5. JC is the resistance from the die to the leads of the package. CA is the resistance from the leads to the ambient air, and it includes CS (case-to-sink thermal resistance) and SA (sink-to-ambient thermal resistance). Current Limit Figure 4-4 displays a method for reducing the steady state short circuit current. The duration that the supply delivers current is set by the time required for the error flag output to discharge the 4.7-μF capacitor tied to the enable pin. The off time is set by the 200-kΩ resistor as it recharges the 4.7-μF capacitor, enabling the regulator. This circuit reduces the short circuit current from 280 mA to 15 mA while allowing for regulator restart once the short is removed. FIGURE 4-5: FIGURE 4-4: Remote Enable with Short Circuit Current Foldback. 4.8 Thermal Characteristics The MIC5236 is a high input voltage device, intended to provide 150 mA of continuous output current in two very small profile packages. The power SOIC-8 and power MSOP-8 allow the device to dissipate about 50% more power than their standard equivalents. 4.8.1 POWER SOIC-8 THERMAL CHARACTERISTICS Thermal Resistance. Using the power SOIC-8 reduces the JC dramatically and allows the user to reduce CA. The total thermal resistance, JA (junction-to-ambient thermal resistance) is the limiting factor in calculating the maximum power dissipation capability of the device. Typically, the power SOIC-8 has a JC of 20°C/W, this is significantly lower than the standard SOIC-8, which is typically 75°C/W. CA is reduced because pins 5 through 8 can now be soldered directly to a ground plane, which significantly reduces the case-to-sink thermal resistance and sink to ambient thermal resistance. Low-dropout linear regulators from Microchip are rated to a maximum junction temperature of 125°C. It is important not to exceed this maximum junction temperature during operation of the device. To prevent this maximum junction temperature from being exceeded, the appropriate ground plane heat sink must be used. SOIC-8 package featuring half the thermal resistance of a standard SOIC-8 package. Lower thermal resistance means more output current or higher input voltage for a given package size. Lower thermal resistance is achieved by joining the four ground leads with the die attach paddle to create a single-piece electrical and thermal conductor. This concept has been used by MOSFET manufacturers for years, proving very reliable and cost effective for the user.  2021-2022 Microchip Technology Inc. and its subsidiaries DS20006574B-page 11 MIC5236 EQUATION 4-4: P D =  28V – 3V   25mA + 28V  250A P D = 625mW + 7mW = 632mW From Figure 4-6, the minimum amount of copper required to operate this application at a ΔT of 75°C is 25 mm2. 4.8.2 FIGURE 4-6: Copper Area vs. Power-SOIC Power Dissipation (ΔTJA). Figure 4-6 shows copper area versus power dissipation with each trace corresponding to a different temperature rise above ambient. From these curves, the minimum area of copper necessary for the part to operate safely can be determined. The maximum allowable temperature rise must be calculated to determine operation along which curve. EQUATION 4-1: T = T J  MAX  – T A  MAX  QUICK METHOD Determine the power dissipation requirements for the design along with the maximum ambient temperature at which the device will be operated. Refer to Figure 4-7, which shows safe operating curves for three different ambient temperatures: 25°C, 50°C and 85°C. From these curves, the minimum amount of copper can be determined by knowing the maximum power dissipation required. If the maximum ambient temperature is 50°C and the power dissipation is as above, 632 mW, the curve in Figure 4-7 shows that the required area of copper is 25 mm2. The JA of this package is ideally 63°C/W, but it will vary depending upon the availability of copper ground plane to which it is attached. Where: TJ(MAX) = 125°C TA(MAX) = Maximum ambient operating temperature For example, the maximum ambient temperature is 50°C, the ΔT is determined as follows: EQUATION 4-2: T = 125C – 50C T = 75C FIGURE 4-7: Copper Area vs. Power-SOIC Power Dissipation (TA). Using Figure 4-6, the minimum amount of required copper can be determined based on the required power dissipation. Power dissipation in a linear regulator is calculated as follows: EQUATION 4-3: P D =  V IN – V OUT I OUT + V IN  I GND If we use a 3V output device and a 28V input at moderate output current of 25 mA, then our power dissipation is as follows: DS20006574B-page 12 FIGURE 4-8: Copper Area vs. Power-MSOP Power Dissipation (ΔTJA).  2021-2022 Microchip Technology Inc. and its subsidiaries MIC5236 The same method of determining the heat sink area used for the power SOIC-8 can be applied directly to the power MSOP-8. The same two curves showing power dissipation versus copper area are reproduced for the power MSOP-8 and they can be applied identically, see Figure 4-8 and Figure 4-9. 4.10 Adjustable Regulator Application MIC5236YM/MM FIGURE 4-10: Application. Adjustable Voltage The MIC5236YM and MIC5236YMM can be adjusted from 1.24V to 20V by using two external resistors (Figure 4-10). The resistors set the output voltage based on the following equation: FIGURE 4-9: Copper Area vs. Power-MSOP Power Dissipation (TA). EQUATION 4-5: 4.9 Where: VREF = 1.23V Power MSOP-8 Thermal Characteristics V OUT = V REF +  1 + R1 -------  R2 The power MSOP-8 package follows the same idea as the power SOIC-8 package, using four ground leads with the die attach paddle to create a single-piece electrical and thermal conductor, reducing thermal resistance and increasing power dissipation capability. 4.9.1 QUICK METHOD Determine the power dissipation requirements for the design along with the maximum ambient temperature at which the device will be operated. Refer to Figure 4-9, which shows safe operating curves for three different ambient temperatures: 25°C, 50°C and 85°C. From these curves, the minimum amount of copper can be determined by knowing the maximum power dissipation required. If the maximum ambient temperature is 50°C, and the power dissipation is 639 mW, the curve in Figure 4-9 shows that the required area of copper is 110 mm2, when using the power MSOP-8.  2021-2022 Microchip Technology Inc. and its subsidiaries DS20006574B-page 13 MIC5236 5.0 PACKAGING INFORMATION 5.1 Package Marking Information 8-Lead MSOP* Example XXXX XXX 5236 YMM 8-Lead SOIC* Example XXX XXXXXX WNNN Legend: XX...X Y YY WW NNN e3 * MIC 5236YM 1256 1624 Product code or customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC® designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. ●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle mark). Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. Package may or may not include the corporate logo. Underbar (_) and/or Overbar (‾) symbol may not be to scale. DS20006574B-page 14  2021-2022 Microchip Technology Inc. and its subsidiaries MIC5236 8-Lead SOIC Package Outline and Recommended Land Pattern Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging.  2021-2022 Microchip Technology Inc. and its subsidiaries DS20006574B-page 15 MIC5236 8-Lead MSOP Package Outline and Recommended Land Pattern Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging. DS20006574B-page 16  2021-2022 Microchip Technology Inc. and its subsidiaries MIC5236 APPENDIX A: REVISION HISTORY Revision B (February 2022) • Updated Section “Package Thermal Resistance”. • Updated Section 5.1 “Package Marking Information”. • Minor text and format changes throughout. Revision A (August 2021) • Converted Micrel document MIC5236 to Microchip data sheet DS20006574A. • Minor text changes throughout.  2021-2022 Microchip Technology Inc. and its subsidiaries DS20006574B-page 17 MIC5236 NOTES: DS20006574B-page 18  2021-2022 Microchip Technology Inc. and its subsidiaries MIC5236 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office. PART No. -X.X X XX -XX Device Output Voltage Junction Temp. Range Package Media Type Device: MIC5236: Low Quiescent Current μCap LDO Regulator Output Voltage: -2.5 -3.0 -3.3 -5.0 = = = = = Adjustable 2.5V 3.0V 3.3V 5.0V Junction Temperature Range: Y = –40°C to +125°C Package: M MM = = 8-Lead SOIC 8-Lead MSOP Media Type: -TR = = = 95/Tube (SOIC option only) 100/Tube (MSOP option only) 2500/Reel  2021-2022 Microchip Technology Inc. and its subsidiaries Examples: a) MIC5236-2.5YM: MIC5236, 2.5V Output Voltage, -40°C to +125°C Temperature Range, 8-Lead SOIC, 95/Tube b) MIC5236-3.0YM-TR: MIC5236, 3.0V Output Voltage, -40°C to +125°C Temperature Range, 8-Lead SOIC, 2500/Reel c) MIC5236-3.3YMM: MIC5236, 3.3V Output Voltage, -40°C to +125°C Temperature Range, 8-Lead MSOP, 100/Tube d) MIC5236-5.0YMM-TR: MIC5236, 5.0V Output Voltage, -40°C to +125°C Temperature Range, 8-Lead MSOP, 2500/Reel e) MIC5236YMM: Note 1: MIC5236, Adjustable Output Voltage, -40°C to +125°C Temperature Range, 8-Lead MSOP, 100/Tube Tape and Reel identifier only appears in the catalog part number description. This identifier is used for ordering purposes and is not printed on the device package. Check with your Microchip Sales Office for package availability with the Tape and Reel option. DS20006574B-page 19 MIC5236 NOTES: DS20006574B-page 20  2021-2022 Microchip Technology Inc. and its subsidiaries Note the following details of the code protection feature on Microchip products: • Microchip products meet the specifications contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is secure when used in the intended manner, within operating specifications, and under normal conditions. • Microchip values and aggressively protects its intellectual property rights. Attempts to breach the code protection features of Microchip product is strictly prohibited and may violate the Digital Millennium Copyright Act. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code. Code protection does not mean that we are guaranteeing the product is “unbreakable”. Code protection is constantly evolving. Microchip is committed to continuously improving the code protection features of our products. This publication and the information herein may be used only with Microchip products, including to design, test, and integrate Microchip products with your application. Use of this information in any other manner violates these terms. Information regarding device applications is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. Contact your local Microchip sales office for additional support or, obtain additional support at https:// www.microchip.com/en-us/support/design-help/client-supportservices. THIS INFORMATION IS PROVIDED BY MICROCHIP "AS IS". MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIED WARRANTIES OF NONINFRINGEMENT, MERCHANTABILITY, AND FITNESS FOR A PARTICULAR PURPOSE, OR WARRANTIES RELATED TO ITS CONDITION, QUALITY, OR PERFORMANCE. IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT, SPECIAL, PUNITIVE, INCIDENTAL, OR CONSEQUENTIAL LOSS, DAMAGE, COST, OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THE INFORMATION OR ITS USE, HOWEVER CAUSED, EVEN IF MICROCHIP HAS BEEN ADVISED OF THE POSSIBILITY OR THE DAMAGES ARE FORESEEABLE. TO THE FULLEST EXTENT ALLOWED BY LAW, MICROCHIP'S TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USE WILL NOT EXCEED THE AMOUNT OF FEES, IF ANY, THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FOR THE INFORMATION. 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