MIC5239-1.8YS

MIC5239 Low Quiescent Current 500 mA µCap LDO Regulator Features General Description • Ultra-Low Quiescent Current (IQ = 23 µA @ IO = 100 µA) • Continuous 500 mA Output Current • Wide Input Range: 2.3V to 30V • Low Dropout Voltage: 350 mV @ 500 mA • ±1.0% Initial Output Accuracy • Stable with Ceramic or Tantalum Output Capacitor • Logic Compatible Enable Input • Low Output Voltage Error Flag Indicator • Overcurrent Protection • Thermal Shutdown • Reverse-Leakage Protection • Reverse-Battery Protection • High-Power SOIC-8, MSOP-8, and SOT-223 Packages The MIC5239 is a low quiescent current, µCap low-dropout regulator. With a maximum operating input voltage of 30V and a quiescent current of 23 µA, it is ideal for supplying keep-alive power in systems with high voltage batteries. Applications Available in the thermally enhanced SOIC-8, MSOP-8, and SOT-223, the MIC5239 comes in fixed 1.5V, 1.8V, 2.5V, 3.0V, 3.3V, and 5.0V, and adjustable voltages. For other output voltages, contact Microchip. • USB Power Supply • Keep-Alive Supply in Notebook and Portable Personal Computers • Logic Supply from High Voltage Batteries • Automotive Electronics • Battery-Powered Systems Capable of 500 mA output, the MIC5239 has a dropout voltage of only 350 mV. It can provide high output current for applications such as USB. As a µCap LDO, the MIC5239 is stable with either a ceramic or a tantalum output capacitor. It only requires a 3.3 µF output capacitor for stability. The MIC5239 includes a logic compatible enable input and an undervoltage error flag indicator. Other features of the MIC5239 include thermal shutdown, current limit, overvoltage shutdown, reverse-leakage protection, and reverse-battery protection. Package Types MIC5239, Fixed 8-Lead SOIC (M) 8-Lead MSOP (MM) (Top View)  2021 Microchip Technology Inc. MIC5239 3-Lead SOT-223 (S) (Top View) MIC5239, Adj. 8-Lead SOIC (M) 8-Lead MSOP (MM) (Top View) DS20006544A-page 1 MIC5239 Typical Application Circuit VIN 30V MIC5239 IN OUT EN FLG GND VOUT 3.0V/100μA IGND = 23μA Functional Block Diagram MIC5239, Fixed MIC5239, Adj. DS20006544A-page 2  2021 Microchip Technology Inc. MIC5239 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings † Supply Voltage (VIN) ................................................................................................................................... –20V to +32V Enable Input Voltage (VEN) ........................................................................................................................ –0.3V to +32V Power Dissipation (PD) (Note 1) ............................................................................................................ Internally Limited ESD Rating (Note 2) (SOT-223)................................................................................................................................. 2 kV ESD Rating (Note 2) (8-Lead MSOP) ..................................................................................................................... 1.5 kV Operating Ratings ‡ Supply Voltage (VIN) .................................................................................................................................. +2.3V to +30V Enable Input Voltage (VEN) ............................................................................................................................. 0V to +30V † Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended periods may affect device reliability. ‡ Notice: The device is not guaranteed to function outside its operating ratings. Note 1: The maximum allowable power dissipation of any TA (ambient temperature) is PD(MAX) = (TJ(MAX) – TA) ÷ θJA. Exceeding the maximum allowable power dissipation will result in excessive die temperature, and the regulator will go into thermal shutdown. The θJA of the MIC5239-x.xYMM (all versions) is 80°C/W, the MIC5239-x.xYM (all versions) is 63°C/W, and the MIC5239-x.xYS (all versions) is 50°C/W mounted on a PC board, see “Thermal Characteristics” for further details. 2: Devices are inherently ESD sensitive. Handling precautions required. Human body model: 1.5 kΩ in series with 100 pF. ELECTRICAL CHARACTERISTICS Electrical Characteristics: VIN = VOUT + 1V; VEN ≥ 2.0V; IOUT = 100 µA; TJ = +25°C, bold values valid for –40°C ≤ TJ ≤ +125°C; unless noted. (Note 1) Parameter Symbol Output Voltage Accuracy VOUT Min. Typ. Max. –1 — 1 –2 — 2 Units % Variation from nominal VOUT VIN = VOUT + 1V to 30V Line Regulation ΔVOUT/ VOUT — 0.06 0.5 % Load Regulation ΔVOUT/ VOUT — 15 30 mV 50 — — 260 350 — — 400 — 350 — — 23 40 — — 45 — 1.3 5 — 8.5 15 IGND(SHDN) — 0.1 1 µA ISC — 850 1200 mA ΔV Ground Pin Current Ground Pin Shutdown Current IGND Short-Circuit Current Output Noise  2021 Microchip Technology Inc. en — 160 — IOUT = 100 µA to 500 mA, Note 2 IOUT = 100 µA — Dropout Voltage, Note 3 Conditions mV IOUT = 150 mA IOUT = 500 mA µA mA µVRMS VEN ≥ 2.0V, IOUT = 100 µA VEN ≥ 2.0V, IOUT = 150 mA VEN ≥ 2.0V, IOUT = 500 mA VEN ≤ 0.6V, VIN = 30V VOUT = 0V 10 Hz to 100 kHz, VOUT = 3.0V, CL = 3.3 µF DS20006544A-page 3 MIC5239 ELECTRICAL CHARACTERISTICS (CONTINUED) Electrical Characteristics: VIN = VOUT + 1V; VEN ≥ 2.0V; IOUT = 100 µA; TJ = +25°C, bold values valid for –40°C ≤ TJ ≤ +125°C; unless noted. (Note 1) Parameter Symbol Min. Typ. Max. — 94 — — 95 — Units Conditions FLAG Output Low Threshold High Threshold VFLG % % of VOUT FLAG Output Low Voltage VOL — 150 — mV VIN = VOUT(NOM) – 0.12VOUT, IOL = 200 µA FLAG Output Leakage Current ILEAK — 0.1 — µA VOH = 30V Enable Input Input Low Voltage VIL — — 0.6 V Regulator off Input High Voltage VIH 2.0 — — V Regulator on –1.0 Enable Input Current Note 1: 2: 3: IIN 1.0 –2.0 0.01 2.0 — 0.15 1.0 — — 2.0 — 0.5 2.5 — — 5.0 VEN = 0.6V, regulator off µA VEN = 2.0V, regulator on VEN = 30V, regulator on Specification for packaged product only. Regulation is measured at constant junction temperature using pulse testing with a low duty-cycle. Changes in output voltage due to heating effects are covered by the specification for thermal regulation. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at 1.0V differential. TEMPERATURE SPECIFICATIONS (Note 1) Parameters Sym. Min. Typ. Max. Units Conditions Temperature Ranges Junction Temperature Range TJ –40 — +125 °C — Storage Temperature Range TS –65 — +150 °C — Lead Temperature — — — +260 °C Soldering, 5 sec. Thermal Resistance, MSOP 8-Ld θJA — 80 — °C/W — Thermal Resistance, SOT-223 3-Ld θJA — 50 — °C/W — Package Thermal Resistance Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability. DS20006544A-page 4  2021 Microchip Technology Inc. MIC5239 2.0 TYPICAL PERFORMANCE CURVES Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. VOUT = 3V FIGURE 2-1: Ratio. Power Supply Rejection FIGURE 2-4: Dropout Characteristics. FIGURE 2-2: Current. Dropout Voltage vs. Output FIGURE 2-5: Output Current. Ground Pin Current vs. FIGURE 2-3: Temperature. Dropout Voltage vs. FIGURE 2-6: Output Current. Ground Pin Current vs.  2021 Microchip Technology Inc. DS20006544A-page 5 MIC5239 FIGURE 2-7: Temperature. Ground Pin Current vs. FIGURE 2-10: Input Voltage. Ground Pin Current vs. FIGURE 2-8: Temperature. Ground Pin Current vs. FIGURE 2-11: Input Voltage. Ground Pin Current vs. FIGURE 2-9: Temperature. Ground Pin Current vs. FIGURE 2-12: Input Voltage. Ground Pin Current vs. DS20006544A-page 6  2021 Microchip Technology Inc. MIC5239 FIGURE 2-13: Input Current. FIGURE 2-16: Load Transient Response. FIGURE 2-14: Temperature. Output Voltage vs. FIGURE 2-17: Enable Turn-On. FIGURE 2-15: Short-Circuit Current.  2021 Microchip Technology Inc. DS20006544A-page 7 MIC5239 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE Pin Number MSOP/SOIC Pin Number SOT-223 Pin Name Description 2 (Fixed) — FLG Error FLAG (Output): Open-collector output is active low when the output is out of regulation due to insufficient input voltage or excessive load. An external pull-up resistor is required. 2 (Adj.) — ADJ Adjustable Feedback Input: Connect to voltage divider network. 3 1 IN 4 3 OUT 1 — EN 5, 6, 7, 8 2 GND DS20006544A-page 8 Power Supply Input. Regulated Output. Enable (input): Logic low = shutdown; logic high = enabled. Ground: Pins 5, 6, 7, and 8 are internally connected in common via the leadframe.  2021 Microchip Technology Inc. MIC5239 4.0 APPLICATIONS INFORMATION The MIC5239 provides all of the advantages of the MIC2950: wide input voltage range, and reversed-battery protection, with the added advantages of reduced quiescent current and smaller package. Additionally, when disabled, quiescent current is reduced to 0.1 µA. 4.1 Enable A low on the enable pin disables the part, forcing the quiescent current to less than 0.1 µA. Thermal shutdown and the error flag are not functional while the device is disabled. The maximum enable bias current is 2 µA for a 2.0V input. An open-collector pull-up resistor tied to the input voltage should be set low enough to maintain 2V on the enable input. Figure 4-1 shows an open-collector output driving the enable pin through a 200 kΩ pull-up resistor tied to the input voltage. In order to avoid output oscillations, slow transitions from low-to-high should be avoided. FIGURE 4-1: 4.2 Remote Enable. Input Capacitor FIGURE 4-2: 4.4 Output Capacitor ESR. Error Detection Comparator Output The FLAG pin is an open-collector output which goes low when the output voltage drops 5% below its internally programmed level. It senses conditions such as excessive load (current limit), low input voltage, and overtemperature conditions. Once the part is disabled via the enable input, the error flag output is not valid. Overvoltage conditions are not reflected in the error flag output. The error flag output is also not valid for input voltages less than 2.3V. The error output has a low voltage of 400 mV at a current of 200 µA. In order to minimize the drain on the source used for the pull-up, a value of 200 kΩ to 1 MΩ is suggested for the error flag pull-up. This will guarantee a maximum low voltage of 0.4V for a 30V pull-up potential. An unused error flag can be left unconnected. An input capacitor may be required when the device is not near the source power supply or when supplied by a battery. Small, surface mount ceramic capacitors can be used for bypassing. Larger values may be required if the source supply has high ripple. 4.3 Output Capacitor The MIC5239 has been designed to minimize the effect of the output capacitor ESR on the closed loop stability. As a result, ceramic or film capacitors can be used at the output. Figure 4-2 displays a range of ESR values for a 10 µF capacitor. Virtually any 10 µF capacitor with an ESR less than 3.4Ω is sufficient for stability over the entire input voltage range. Stability can also be maintained throughout the specified load and line conditions with 4.7 µF film or ceramic capacitors.  2021 Microchip Technology Inc. FIGURE 4-3: 4.5 Error FLAG Output Timing. Thermal Shutdown The MIC5239 has integrated thermal protection. This feature is only for protection purposes. The device should never be intentionally operated near this temperature as this may have detrimental effects on the life of the device. The thermal shutdown may become inactive while the enable input is transitioning DS20006544A-page 9 MIC5239 from a high to a low. When disabling the device via the enable pin, transition from a high to low quickly. This will insure that the output remains disabled in the event of a thermal shutdown. 4.6 ambient air and it includes θCS (case-to-sink thermal resistance) and θSA (sink-to-ambient thermal resistance). Current Limit Figure 4-4 displays a method for reducing the steady state short-circuit current. The duration that the supply delivers current is set by the time required for the error flag output to discharge the 4.7 µF capacitor tied to the enable pin. The off time is set by the 200 kΩ resistor as it recharges the 4.7 µF capacitor, enabling the regulator. This circuit reduces the short-circuit current from 800 mA to 40 mA while allowing for regulator restart once the short is removed. FIGURE 4-5: FIGURE 4-4: Remote Enable with Short-Circuit Current Foldback. 4.7 Thermal Characteristics The MIC5239 is a high input voltage device, intended to provide 500 mA of continuous output current in two very small profile packages. The power MSOP-8 allows the device to dissipate about 50% more power than their standard equivalents. 4.7.1 POWER MSOP-8 THERMAL CHARACTERISTICS Thermal Resistance. Using the power MSOP-8 reduces the θJC dramatically and allows the user to reduce θCA. The total thermal (junction-to-ambient thermal resistance, θJA resistance) is the limiting factor in calculating the maximum power dissipation capability of the device. Typically, the power MSOP-8 has a θJC of 80°C/W. This is significantly lower than the standard MSOP-8, which is typically 200°C/W. θCA is reduced because pins 5 through 8 can now be soldered directly to a ground plane that significantly reduces the case-to-sink thermal resistance and sink to ambient thermal resistance. Low-dropout linear regulators from Microchip are rated to a maximum junction temperature of 125°C. It is important not to exceed this maximum junction temperature during operation of the device. To prevent this maximum junction temperature from being exceeded, the appropriate ground plane heatsink must be used. One of the secrets of the MIC5239’s performance is its power MSOP-8 package featuring half the thermal resistance of a standard MSOP-8 package. Lower thermal resistance means more output current or higher input voltage for a given package size. Lower thermal resistance is achieved by joining the four ground leads with the die attach paddle to create a single piece electrical and thermal conductor. This concept has been used by MOSFET manufacturers for years, proving very reliable and cost effective for the user. Thermal resistance consists of two main elements, θJC (junction-to-case thermal resistance) and θCA (case-to-ambient thermal resistance). See Figure 4-5. θJC is the resistance from the die to the leads of the package. θCA is the resistance from the leads to the DS20006544A-page 10 FIGURE 4-6: Copper Area vs. Power-MSOP Power Dissipation (ΔθJA).  2021 Microchip Technology Inc. MIC5239 Figure 4-6 shows copper area versus power dissipation with each trace corresponding to a different temperature rise above ambient. From these curves, the minimum area of copper necessary for the part to operate safely can be determined. The maximum allowable temperature rise must be calculated to determine operation along which curve. EQUATION 4-1: T = T J  MAX  – T A  MAX  Where: TJ(MAX) = 125°C TA(MAX) = Maximum ambient operating temperature. 4.7.2 QUICK METHOD Determine the power dissipation requirements for the design along with the maximum ambient temperature at which the device will be operated. Refer to Figure 4-7, which shows safe operating curves for three different ambient temperatures: 25°C, 50°C, and 85°C. From these curves, the minimum amount of copper can be determined by knowing the maximum power dissipation required. If the maximum ambient temperature is 50°C and the power dissipation is 632 mW, the curve in Figure 4-7 shows that the required area of copper is 110 mm2. The θJA of this package is ideally 80°C/W, but it will vary depending upon the availability of copper ground plane to which it is attached. For example, the maximum ambient temperature is 50°C, the ΔT is determined as follows: EQUATION 4-2: T = 125C – 50C = 75C Using Figure 4-6, the minimum amount of required copper can be determined based on the required power dissipation. Power dissipation in a linear regulator is calculated as follows: FIGURE 4-7: Copper Area vs. Power-MSOP Power Dissipation (TA). EQUATION 4-3: P D =  V IN – V OUT   I OUT + V IN  I GND If we use a 3V output device and a 28V input at moderate output current of 25 mA, then the power dissipation is as follows: EQUATION 4-4: FIGURE 4-8: Copper Area vs. Power-SOIC Power Dissipation (ΔθJA). P D =  28V – 3V   25mA + 28V  250A P D = 625mW + 7mW = 632mW From Figure 4-6, the minimum amount of copper required to operate this application at a ∆T of 75°C is 110 mm2.  2021 Microchip Technology Inc. DS20006544A-page 11 MIC5239 4.9 Adjustable Regulator Application The MIC5239YM can be adjusted from 1.24V to 20V by using two external resistors (Figure 4-10). The resistors set the output voltage based on the following equation: EQUATION 4-5: R1 V OUT = V REF   1 + ------- R2 Where: VREF = 1.23V FIGURE 4-9: Copper Area vs. Power-SOIC Power Dissipation (TA). Feedback resistor R2 should be no larger than 300 kΩ. The same method of determining the heatsink area used for the power MSOP-8 can be applied directly to the power SOIC-8. The same two curves showing power dissipation versus copper area are reproduced for the power SOIC-8 and they can be applied identically. 4.8 Power SOIC-8 Thermal Characteristics The power SOIC-8 package follows the same idea as the power MSOP-8 package, using four ground leads with the die attach paddle to create a single-piece electrical and thermal conductor, reducing thermal resistance and increasing power dissipation capability. 4.8.1 FIGURE 4-10: Application. Adjustable Voltage QUICK METHOD Determine the power dissipation requirements for the design along with the maximum ambient temperature at which the device will be operated. Refer to Figure 4-9, which shows safe operating curves for three different ambient temperatures, 25°C, 50°C, and 85°C. From these curves, the minimum amount of copper can be determined by knowing the maximum power dissipation required. If the maximum ambient temperature is 50°C, and the power dissipation is 632 mW, the curve in Figure 4-9 shows that the required area of copper is less than 100 mm2, when using the power SOIC-8. DS20006544A-page 12  2021 Microchip Technology Inc. MIC5239 5.0 PACKAGING INFORMATION 5.1 Package Marking Information 8-Lead SOIC, Adj.* Example MIC 5239YM 3516 XXX XXXXXX WNNN 8-Lead SOIC, Fixed* Example 5239 -1.8YM 9327 XXXX -X.XXX WNNN 8-Lead MSOP, Adj.* Example 8-Lead MSOP, Fixed* Example XXXX YXX 5239 YMM XXXX -X.XY 5239 -2.5Y 3-Lead SOT-223* XXXX XXXXNNNP Legend: XX...X Y YY WW NNN e3 * Example 5239 30YS088P Product code or customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC® designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. ●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle mark). Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. Package may or may not include the corporate logo. Underbar (_) and/or Overbar (‾) symbol may not be to scale.  2021 Microchip Technology Inc. DS20006544A-page 13 MIC5239 8-Lead SOIC Package Outline and Recommended Land Pattern Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging. DS20006544A-page 14  2021 Microchip Technology Inc. MIC5239 8-Lead MSOP Package Outline and Recommended Land Pattern Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging.  2021 Microchip Technology Inc. DS20006544A-page 15 MIC5239 3-Lead SOT-223 Package Outline and Recommended Land Pattern Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging. DS20006544A-page 16  2021 Microchip Technology Inc. MIC5239 APPENDIX A: REVISION HISTORY Revision A (June 2021) • Converted Micrel document MIC5239 to Microchip data sheet DS20006544A. • Minor text changes throughout.  2021 Microchip Technology Inc. DS20006544A-page 17 MIC5239 NOTES: DS20006544A-page 18  2021 Microchip Technology Inc. MIC5239 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office. PART No. -X.X X X -XX Device Output Voltage Junction Temp. Range Package Media Type Device: MIC5239: Low Quiescent Current 500 mA µCap LDO Regulator 1.5 = 1.8 = 2.5 = 3.0 = 3.3 = 5.0 = = 1.5V 1.8V 2.5V 3.0V 3.3V 5.0V Adjustable (Not applicable to SOT-223 option) Junction Temperature Range: Y –40°C to +125°C Package: M = MM = S = Output Voltage: Media Type: = TR = 8-Lead SOIC 8-Lead MSOP 3-Lead SOT-223 = 78/Tube (SOT-223 Only) = 95/Tube (SOIC Only) = 100/Tube (MSOP Only) 2,500/Reel (All package options)  2021 Microchip Technology Inc. Examples: a) MIC5239-5.0YMM-TR: MIC5239, 5.0V Output Voltage, –40°C to +125°C Temperature Range, 8-Lead MSOP, 2,500/Reel b) MIC5239YM: MIC5239, Adj. Output Voltage, –40°C to +125°C Temperature Range, 8-Lead SOIC, 95/Tube c) MIC5239-1.8YS: MIC5239, 1.8V Output Voltage, –40°C to +125°C Temperature Range, 3-Lead SOT-223, 78/Tube d) MIC5239YMM-TR: MIC5239, Adj. Output Voltage, –40°C to +125°C Temperature Range, 8-Lead MSOP, 100/Tube e) MIC5239-3.0YM-TR: MIC5239, 3.0V Output Voltage, –40°C to +125°C Temperature Range, 8-Lead SOIC, 2,500/Reel f) MIC5239, 2.5V Output Voltage, –40°C to +125°C Temperature Range, 3-Lead SOT-223, 2,500/Reel MIC5239-2.5YS-TR: Note 1: Tape and Reel identifier only appears in the catalog part number description. This identifier is used for ordering purposes and is not printed on the device package. Check with your Microchip Sales Office for package availability with the Tape and Reel option. DS20006544A-page 19 MIC5239 NOTES: DS20006544A-page 20  2021 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specifications contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is secure when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods being used in attempts to breach the code protection features of the Microchip devices. We believe that these methods require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Attempts to breach these code protection features, most likely, cannot be accomplished without violating Microchip's intellectual property rights. • Microchip is willing to work with any customer who is concerned about the integrity of its code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code. Code protection does not mean that we are guaranteeing the product is "unbreakable." Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication is provided for the sole purpose of designing with and using Microchip products. Information regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. THIS INFORMATION IS PROVIDED BY MICROCHIP "AS IS". MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIED WARRANTIES OF NONINFRINGEMENT, MERCHANTABILITY, AND FITNESS FOR A PARTICULAR PURPOSE OR WARRANTIES RELATED TO ITS CONDITION, QUALITY, OR PERFORMANCE. IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT, SPECIAL, PUNITIVE, INCIDENTAL OR CONSEQUENTIAL LOSS, DAMAGE, COST OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THE INFORMATION OR ITS USE, HOWEVER CAUSED, EVEN IF MICROCHIP HAS BEEN ADVISED OF THE POSSIBILITY OR THE DAMAGES ARE FORESEEABLE. TO THE FULLEST EXTENT ALLOWED BY LAW, MICROCHIP'S TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USE WILL NOT EXCEED THE AMOUNT OF FEES, IF ANY, THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FOR THE INFORMATION. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. 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Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, Augmented Switching, BlueSky, BodyCom, CodeGuard, CryptoAuthentication, CryptoAutomotive, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, Espresso T1S, EtherGREEN, IdealBridge, In-Circuit Serial Programming, ICSP, INICnet, Intelligent Paralleling, Inter-Chip Connectivity, JitterBlocker, maxCrypto, maxView, memBrain, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple Blocker, RTAX, RTG4, SAM-ICE, Serial Quad I/O, simpleMAP, SimpliPHY, SmartBuffer, SMART-I.S., storClad, SQI, SuperSwitcher, SuperSwitcher II, Switchtec, SynchroPHY, Total Endurance, TSHARC, USBCheck, VariSense, VectorBlox, VeriPHY, ViewSpan, WiperLock, XpressConnect, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. The Adaptec logo, Frequency on Demand, Silicon Storage Technology, and Symmcom are registered trademarks of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2021, Microchip Technology Incorporated, All Rights Reserved. For information regarding Microchip’s Quality Management Systems, please visit www.microchip.com/quality.  2021 Microchip Technology Inc. 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