MIC5252-1.5BMLTR

MIC5252 150 mA High PSRR, Low Noise μCap CMOS LDO Features General Description • • • • • • The MIC5252 is an efficient, precise CMOS voltage regulator optimized for ultra low-noise applications. It offers 1% initial accuracy, extremely low dropout voltage (135 mV at 150 mA) and low ground current (typically 90μA). The MIC5252 provides a very low-noise output, ideal for RF applications where a clean voltage source is required. The MIC5252 has a high PSRR even at low supply voltages, critical for battery operated electronics. A noise bypass pin is also available for further reduction of output noise. • • • • • Input Voltage Range: 2.7V to 6.0V PSRR = 50 dB @ VO + 0.3V Ultra-Low Output Noise: 30 μVRMS Stability with Ceramic Output Capacitors Ultra-Low Dropout: 135 mV @ 150 mA High Output Accuracy: - 1.0% Initial Accuracy - 2.0% over Temperature Low Quiescent Current: 90μA Tight Load and Line Regulation TTL Logic-Controlled Enable Input “Zero” Off-Mode Current Thermal Shutdown and Current Limit Protection Applications • • • • • Cellular Phones and Pagers Cellular Accessories Battery-Powered Equipment Laptop, Notebook, and Palmtop Computers Consumer/Personal Electronics Designed specifically for handheld and batterypowered devices, the MIC5252 provides a TTL logic-compatible enable pin. When disabled, power consumption drops nearly to zero. The MIC5252 also works with low-ESR ceramic capacitors, reducing the amount of board space necessary for power applications, which is critical in handheld wireless devices. Key features include current limit, thermal shutdown, faster transient response, and an active clamp to speed up device turn-off. The MIC5252 is available in the 6-lead 2 mm × 2 mm VDFN package and the 5-Lead SOT-23 package in a wide range of output voltages. Package Types MIC5252-x.xYM5 MIC5252-x.xYML 5-Lead SOT-23 (Top View) 6-Lead VDFN (Top View)  2021 - 2022 Microchip Technology Inc. DS20006579B-page 1 MIC5252 Typical Application Circuits MIC5252-x.xYM5 Ultra-Low-Noise Regulator Application Functional Block Diagram DS20006579B-page 2  2021 - 2022 Microchip Technology Inc. MIC5252 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings † Supply Input Voltage (VIN) ............................................................................................. ...................................0V to +7V Enable Input Voltage (VEN) ............................................................................................... ................................0V to +7V Power Dissipation (PD) ..................................................................................... .......................Internally Limited (Note 1) ESD Rating (Note 2) ......................................................................................... ........................................................ 2 kV Operating Ratings ‡ Input Voltage (VIN) .................................................................................................... .................................. +2.7V to +6V Enable Input Voltage (VEN) .................................................................................................................................0V to VIN † Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended periods may affect device reliability. ‡ Notice: The device is not guaranteed to function outside its operating ratings. Note 1: The maximum allowable power dissipation of any TA (ambient temperature) is PD(MAX) = (TJ(MAX) – TA)/θJA. Exceeding the maximum allowable power dissipation will result in excessive die temperature, and the regulator will go into thermal shutdown. The θJA of the MIC5252-x.xYM5 (all versions) is 235°C/W on a PC board. See Section 4.7 “Thermal Considerations” for further details. 2: Devices are ESD sensitive. Handling precautions recommended. ELECTRICAL CHARACTERISTICS VIN = VOUT + 1V, VEN = VIN; IOUT = 100 μA; TJ = 25°C, bold values indicate –40°C ≤ TJ ≤ +125°C; unless noted. (Note 1) Parameter Symbol Output Voltage Accuracy VO Line Regulation ΔVLNR Load Regulation Dropout Voltage (Note 3) Ripple Rejection; IOUT = 150 mA Current Limit Output Voltage Noise  2021 - 2022 Microchip Technology Inc. Max. Units Conditions –1 — 1 % –3 — 3 % — 0.02 0.2 % VIN = VOUT + 1V to 6V 1.5 % IOUT = 0.1 mA to 150 mA (Note 2) IOUT = 100 μA 0.6 — 0.1 5 mV IOUT = 100 μA — 90 150 mV IOUT = 100 mA — 135 200 mV — 250 IOUT = 150 mA — mV — 0.2 1 IOUT = 150 mA μA 90 150 VEN ≤ 0.4V (shutdown) — μA — 117 200 IOUT = 0 mA μA IOUT = 150 mA — 63 — dB f = 10 Hz, COUT = 1.0 μF, CBYP = 0.01 μF — 48 — dB f = 10 Hz, VIN = VOUT + 0.3V — 48 — dB f = 10 kHz, VIN = VOUT + 0.3V ILIM 250 425 — mA VOUT = 0V en — 30 — μVRMS VIN – VOUT Ground Pin Current (Note 4) Typ. — ΔVLDR Quiescent Current Min. IQ IGND PSRR COUT = 1.0 μF, CBYP = 0.01 μF, f = 10 Hz to 100 kHz DS20006579B-page 3 MIC5252 ELECTRICAL CHARACTERISTICS (CONTINUED) VIN = VOUT + 1V, VEN = VIN; IOUT = 100 μA; TJ = 25°C, bold values indicate –40°C ≤ TJ ≤ +125°C; unless noted. (Note 1) Parameter Symbol Min. Typ. Max. Units Conditions Enable Input Logic-Low Voltage VIL — — 0.4 V VIN = 2.7V to 5.5V, regulator shutdown Enable Input Logic-High Voltage VIH 1.6 — — V VIN = 2.7V to 5.5V, regulator enabled — 0.01 1 μA VIL ≤ 0.4V, regulator shutdown — 0.01 1 μA VIH ≥ 1.6V, regulator enabled — — 500 — Ω — Thermal Shutdown Temperature — — 150 — °C — Thermal Shutdown Hysteresis — — 10 — °C — Enable Input Enable Input Current IEN Shutdown Resistance Discharge Thermal Protection Note 1: 2: 3: 4: Specification for packaged product only. Regulation is measured at constant junction temperature using low duty cycle pulse testing. Parts are tested for load regulation in the load range from 0.1 mA to 150 mA. Changes in output voltage due to heating effects are covered by the thermal regulation specification. Dropout Voltage is defined as the input-to-output differential at which the output voltage drops 2% below its nominal value measured at 1V differential. For outputs below 2.7V, dropout voltage is the input-to-output voltage differential with the minimum input voltage 2.7V. Minimum input operating voltage is 2.7V. Ground pin current is the regulator quiescent current. The total current drawn from the supply is the sum of the load current plus the ground pin current. TEMPERATURE SPECIFICATIONS (Note 1) Parameters Sym. Min. Typ. Max. Units Conditions TJ –40 — +125 °C — TJ(MAX) –40 — +125 °C — Temperature Ranges Junction Temperature Range Maximum Junction Temperature Lead Temperature — — — +260 °C Soldering, 5 seconds Storage Temperature TS –65 — +150 °C — Thermal Resistance, SOT-23 θJA — 235 — °C/W — Thermal Resistance, 2x2 VDFN θJA — 90 — °C/W — Package Thermal Resistance Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum rating. Sustained junction temperatures above that maximum can impact device reliability. DS20006579B-page 4  2021 - 2022 Microchip Technology Inc. MIC5252 2.0 Note: TYPICAL PERFORMANCE CURVES The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. FIGURE 2-1: PSRR with Bypass Variation (VIN = VOUT + 0.3V ). FIGURE 2-4: PSRR at 100 Hz. FIGURE 2-2: PSRR with Bypass Cap Variation (VIN = VOUT + 1V ). FIGURE 2-5: Current. Output Voltage vs. Load FIGURE 2-3: FIGURE 2-6: Temperature. Output Voltage vs. PSRR with Load Variation.  2021 - 2022 Microchip Technology Inc. DS20006579B-page 5 MIC5252 FIGURE 2-7: Current. Ground Current vs. Output FIGURE 2-10: Voltage. Ground Current vs. Supply FIGURE 2-8: Temperature. Ground Current vs. FIGURE 2-11: Dropout Characteristics. FIGURE 2-9: Voltage. Ground Current vs. Supply FIGURE 2-12: Dropout vs. Temperature. DS20006579B-page 6  2021 - 2022 Microchip Technology Inc. MIC5252 FIGURE 2-13: Dropout vs. Output Current. FIGURE 2-16: Short Circuit Current vs. Input Supply Voltage. FIGURE 2-14: Supply Voltage. Enable Threshold vs. FIGURE 2-17: Enable Pin Delay. FIGURE 2-15: Temperature. Enable Threshold vs. FIGURE 2-18: Load Transient Response.  2021 - 2022 Microchip Technology Inc. DS20006579B-page 7 MIC5252 FIGURE 2-19: DS20006579B-page 8 Line Transient Response.  2021 - 2022 Microchip Technology Inc. MIC5252 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE 5-Lead SOT-23 Pin Number 6-Lead VDFN Pin Number Pin Name 1 3 IN 2 2 GND 3 1 EN 4 6 BYP Reference Bypass: Connect external 0.01 μF ≤ CBYP ≤ 1.0 μF capacitor to GND to reduce output noise. May be left open. Regulator Output. 5 4 OUT — 5 NC — EP GND  2021 - 2022 Microchip Technology Inc. Description Supply Input. Ground. Enable/Shutdown (Input): CMOS compatible input. Logic high = enable; logic low = shutdown. Do not leave open. No Internal Connection. Ground: Internally connected to the exposed pad. Connect externally to GND pin. DS20006579B-page 9 MIC5252 4.0 APPLICATION INFORMATION 4.1 Enable Shutdown The MIC5252 comes with an active-high enable pin that allows the regulator to be disabled. Forcing the enable pin low disables the regulator and sends it into a “zero” off-mode-current state. In this state, current consumed by the regulator goes nearly to zero. Forcing the enable pin high enables the output voltage. This part is CMOS and the enable pin cannot be left floating; a floating enable pin may cause an indeterminate state on the output. 4.2 Input Capacitor The MIC5252 is a high performance, high bandwidth device. Therefore, it requires a well-bypassed input supply for optimal performance. A 1 μF capacitor is required from the input to ground to provide stability. Low-ESR ceramic capacitors provide optimal performance at a minimum of space. Additional high-frequency capacitors, such as small valued NPO dielectric type capacitors, help filter out high frequency noise and are good practice in any RF based circuit. 4.3 Output Capacitor The MIC5252 requires an output capacitor for stability. The design requires 1 μF or greater on the output to maintain stability. The design is optimized for use with low-ESR ceramic chip capacitors. High ESR capacitors may cause high frequency oscillation. The maximum recommended ESR is 300 mΩ. The output capacitor can be increased, but performance has been optimized for a 1 μF ceramic output capacitor and does not improve significantly with larger capacitance. X7R/X5R dielectric-type ceramic capacitors are recommended because of their temperature performance. X7R-type capacitors change capacitance by 15% over their operating temperature range and are the most stable type of ceramic capacitors. Z5U and Y5V dielectric capacitors change value by as much as 50% and 60%, respectively, over their operating temperature ranges. To use a ceramic chip capacitor with Y5V dielectric, the value must be much higher than an X7R ceramic capacitor to ensure the same minimum capacitance over the equivalent operating temperature range. 4.4 Bypass Capacitor A capacitor is required from the noise bypass pin to ground to reduce output voltage noise. The capacitor bypasses the internal reference. A 0.01 μF capacitor is recommended for applications that require low-noise outputs. The bypass capacitor can be increased, further reducing noise and improving PSRR. Turn-on time increases slightly with respect to bypass capacitance. A unique quick-start circuit allows the DS20006579B-page 10 MIC5252 to drive a large capacitor on the bypass pin without significantly slowing turn-on time. Refer to the Typical Performance Curves section for performance with different bypass capacitors. 4.5 Active Shutdown The MIC5252 also features an active shutdown clamp, which is an N-Channel MOSFET that turns on when the device is disabled. This allows the output capacitor and load to discharge, de-energizing the load. 4.6 No-Load Stability The MIC5252 will remain stable and in regulation with no load unlike many other voltage regulators. This is especially important in CMOS RAM keep-alive applications. 4.7 Thermal Considerations The MIC5252 is designed to provide 150 mA of continuous current in a very small package. Maximum power dissipation can be calculated based on the output current and the voltage drop across the part. To determine the maximum power dissipation of the package, use the junction-to-ambient thermal resistance of the device and the following basic equation: EQUATION 4-1: T J  MAX  – T A P D  MAX  =  --------------------------------    JA TJ(MAX) is the maximum junction temperature of the die, 125°C, and TA is the ambient operating temperature. θJA is layout-dependent; Table 4-1 shows examples of junction-to-ambient thermal resistance for the MIC5252. TABLE 4-1: SOT-23-5 THERMAL RESISTANCE θJA Recommended Package Minimum Footprint θJA 1” Square Copper Clad θJC SOT-23-5 (M5 or D5) 185°C/W 145°C/W 235°C/W The actual power dissipation of the regulator circuit can be determined using the equation:  2021 - 2022 Microchip Technology Inc. MIC5252 EQUATION 4-2: P D =   V IN – V OUT   I OUT  + V IN I GND Substituting PD(MAX) for PD and solving for the operating conditions that are critical to the application will give the maximum operating conditions for the regulator circuit. For example, when operating the MIC5252-2.8YM5 at 50°C with a minimum footprint layout, the maximum input voltage for a set output current can be determined as follows: EQUATION 4-3: 125C – 50C P D  MAX  =  -----------------------------------  235C/W  Where: PD(MAX) = 315 mW The junction-to-ambient thermal resistance for the minimum footprint is 235°C/W, from Table 4-1. The maximum power dissipation must not be exceeded for proper operation. Using the output voltage of 2.8V and an output current of 150 mA, the maximum input voltage can be determined. Because this device is CMOS and the ground current is typically 100 μA over the load range, the power dissipation contributed by the ground current is