MIC5317-1.2YMT-T5

MIC5317 High Performance Single 150 mA LDO Features General Description • Tiny 1 mm x 1 mm UDFN, SOT23-5, and TSOT23-5 Packages • Wide 2.5V to 6V Operating Range • 150 mA Output Current • Stable with 1 μF Ceramic Output Capacitors • Low Dropout Voltage: 155 mV @ 150 mA • Excellent Load/Line Transient Response • Low Quiescent Current: 29 μA • High PSRR: 70 dB • Thermal-Shutdown and Current-Limit Protection The MIC5317 is a high performance 150 mA low dropout regulator that offers high power supply rejection (PSRR) in an ultra-small 1 mm x 1 mm package for stringent space requirements and demanding performance. The MIC5317 operates from an input voltage from 2.5V to 6.0V and is capable of providing the output voltages of 1.0V to 3.6V making it ideal for USB port or 6V AC adapter applications. Applications • • • • • • USB Dongles Wireless LANs PC Desktops, Laptops, and Tablets Battery-Powered Equipment Digital Still and Video Cameras 5V General Purpose The MIC5317 offers 2% initial accuracy, low dropout voltage (155 mV @ 150 mA), and low ground current (typically 29 μA). The MIC5317 can also be put into a zero off-mode current state, drawing virtually no current when disabled. The MIC5317 is available in several advanced packages including a lead-free (RoHS-compliant) 1 mm x 1 mm UDFN that occupies only 1 mm2 of PCB area, a 75% reduction in board area compared to SC-70 and 2 mm x 2 mm DFN packages. It is also available in a SOT23-5 and TSOT23-5 package. The MIC5317 has an operating junction temperature range of –40°C to 125°C. Package Types MIC5317 4-Lead 1 mm x 1 mm UDFN (MT) (Top View) VIN 4 EN 3 MIC5317 5-Lead SOT-23 (M5)/TSOT-23 (D5) (Top View) EN GND VIN 2 1 3 EP TOP VIEW 1 VOUT 2 GND  2019 Microchip Technology Inc. 4 NC 5 VOUT DS20006195B-page 1 MIC5317 Typical Application Circuit MIC5317-xxYMT VIN VOUT VOUT EN VBAT GND Functional Block Diagram VIN VOUT LDO EN REFERENCE GND DS20006195B-page 2  2019 Microchip Technology Inc. MIC5317 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings † Supply Voltage (VIN) ......................................................................................................................................... 0V to +7V Enable Voltage (VEN) ......................................................................................................................................... 0V to VIN Power Dissipation (PD) ............................................................................................................Internally Limited (Note 1) ESD Rating (HBM, Note 2) ........................................................................................................................................2 kV Operating Ratings †† Supply Voltage (VIN) .................................................................................................................................... +2.5V to +6V Enable Voltage (VEN) ......................................................................................................................................... 0V to VIN † Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended periods may affect device reliability. †† Notice: The device is not guaranteed to function outside its operating ratings. Note 1: The maximum allowable power dissipation of any TA (ambient temperature) is PD(MAX) = (TJ(MAX) – TA)/θJA. Exceeding the maximum allowable power dissipation will result in excessive die temperature and the regulator will go into thermal shutdown. 2: Devices are ESD sensitive. Handling precautions are recommended. Human body model, 1.5 kΩ in series with 100 pF.  2019 Microchip Technology Inc. DS20006195B-page 3 MIC5317 ELECTRICAL CHARACTERISTICS Electrical Characteristics: VIN = VEN = VOUT + 1V; CIN = COUT = 1 μF; IOUT = 100 μA; TJ = +25°C, bold values valid for –40°C to +125°C, unless noted. Note 1 Parameter Sym. Output Voltage Accuracy Min. Typ. Max. –2.0 — 2.0 Units Conditions Variation from nominal VOUT % Variation from nominal VOUT: –40°C to +125°C –3.0 — 3.0 Line Regulation — 0.02 0.3 % VIN = VOUT +1V to 6V; IOUT = 100 μA Load Regulation (Note 2) — 10 25 mV IOUT = 100 μA to 150 mA — 55 110 — 155 310 — 60 135 — 180 380 Dropout Voltage (Note 3) VDO IOUT = 50 mA; VOUT ≥ 2.8V mV IOUT = 150 mA; VOUT ≥ 2.8V IOUT = 50 mA; VOUT < 2.8V IOUT = 150 mA; VOUT < 2.8V Ground Pin Current (Note 4) IGND — 29 39 μA IOUT = 0 mA Ground Pin Current in Shutdown ISHDN — 0.05 1 μA VEN = 0V Ripple Rejection PSRR — 80 — — 65 — Current Limit ILIM 200 325 550 Output Voltage Noise eN — 200 — — — 0.2 1.2 — — — 0.01 1 — 0.01 1 — 50 125 dB mA f = Up to 1 kHz; COUT = 1 μF f = 1 kHz to 10 kHz; COUT = 1 μF VOUT = 0V μVRMS COUT = 1 μF, 10 Hz to 100 kHz Enable Input Enable Input Voltage VEN Enable Input Current IEN Turn-On Time tON Note 1: 2: 3: 4: V μA μs Logic low Logic high VIL ≤ 0.2V VIH ≥ 1.2V COUT = 1 μF; IOUT = 150 mA Specification for packaged product only. Regulation is measured at constant junction temperature using low duty cycle pulse testing; changes in output voltage due to heating effects are covered by the thermal regulation specification. Dropout voltage is defined as the input-to-output differential at which the output voltage drops 2% below its nominal value measured at 1V differential. For outputs below 2.5V, dropout voltage is the input-to-output differential with the minimum input voltage 2.5V. Ground pin current is the regulator quiescent current. The total current drawn from the supply is the sum of the load current plus the ground pin current. DS20006195B-page 4  2019 Microchip Technology Inc. MIC5317 TEMPERATURE SPECIFICATIONS Parameters Sym. Min. Typ. Max. Units Conditions Max. Junction Temperature Range TJ –40 — +150 °C — Operating Junction Temperature Range TJ –40 — +125 °C — Storage Temperature Range TS –65 — +150 °C — Lead Temperature — — — +260 °C Soldering, 10 sec. Thermal Resistance, 1x1 4-Ld UDFN JA — 240 — °C/W — Thermal Resistance, SOT23-5 JA — 253 — °C/W — Thermal Resistance, TSOT23-5 JA — 253 — °C/W — Temperature Ranges Package Thermal Resistances Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.  2019 Microchip Technology Inc. DS20006195B-page 5 MIC5317 Note: TYPICAL PERFORMANCE CURVES The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. GROUND CURRENT (μA) 2.0 PSRR (dB) 100μA 75mA 0 10 150mA VOUT = VIN = 1V VOUT = 2.5V COUT = 1μF 100 1k 38 38 36 36 34 34 32 32 30 30 28 28 26 26 22 22 20 20 2.5 2.5 10k 100k VEN = VIN VOUT = 3.3V CIN = COUT = 1μF 24 24 1M 4.5 4.5 44 3.5 3.5 33 55 5.5 5.5 66 SUPPLY VOLTAGE (V) FREQUENCY (Hz) FIGURE 2-1: Ratio. Power Supply Rejection Ground Current vs. Supply 140 120 100 80 60 40 VOUT = 3.3V CIN = COUT = 1μF 20 0 0 25 50 75 GROUND CURRENT (μA) 40 160 DROPOUT VOLTAGE (mV) FIGURE 2-4: Voltage. 38 36 34 32 28 100 125 150 VIN = VEN = VOUT + 1V VOUT = 3.3V CIN = COUT = 1μF 30 0 LOAD CURRENT (mA) Dropout Voltage vs. Load 200 FIGURE 2-5: Current. 50 75 100 125 150 Ground Current vs. Load 40 VOUT = 3.3V CIN = COUT = 1μF 150mA 150 100 100mA 50mA 50 10mA 0 -40 -20 0 20 40 60 80 100 120 GROUND CURRENT (μA) DROPOUT VOLTAGE (mV) FIGURE 2-2: Current. 25 LOAD CURRENT (mA) 38 150mA 36 34 100mA 32 50mA 30 28 26 24 22 DS20006195B-page 6 Dropout Voltage vs. VIN = V EN = V OUT + 1V VOUT = 3.3V CIN = C OUT = 1μF 20 -40 -20 0 20 40 60 80 100 120 TEMPERATURE (°C) FIGURE 2-3: Temperature. 100μA TEMPERATURE (°C) FIGURE 2-6: Temperature. Ground Current vs.  2019 Microchip Technology Inc. MIC5317 400 CURRENT LIMIT (mA) OUTPUT VOLTAGE (V) 3.50 3.45 3.40 3.35 3.30 3.25 VIN = V EN = V OUT + 1V VOUT = 3.3V CIN = C OUT = 1μF 3.20 3.15 3.10 0 20 40 60 80 100 120 140 160 350 300 250 200 VOUT = 3.3V CIN = COUT = 1μF 3 3 LOAD CURRENT (mA) FIGURE 2-7: Current. 4 4.5 4.5 5 5 5.5 5.5 66 SUPPLY VOLTAGE (V) Output Voltage vs. Load FIGURE 2-10: Voltage. Current Limit vs. Supply 10 3.4 3.4 1mA 3.3 3.3 3.2 3.2 NOISE μV¥Hz OUTPUT VOLTAGE (V) OUTPUT VOLTAGE (V) 3.5 3.5 50mA 3.1 3.1 3 3 2.9 2.9 150mA 2.8 2.8 VEN = VIN VOUT = 3.3V CIN = COUT = 1μF 2.7 2.7 2.6 2.6 2.5 2.5 2.5 3 3.5 4 4.5 5 5.5 6 1 0.1 0.01 0.001 10 Output Voltage vs. Supply 100 1k 10k 100k 1M 10M FREQUENCY (Hz) SUPPLY VOLTAGE (V) FIGURE 2-8: Voltage. VIN = VEN = 4.5V VOUT = 2.8V CIN = COUT = 1μF NOISE (10Hz TO 100kHz) = 198.19μVRMS FIGURE 2-11: Density. Output Noise Spectral FIGURE 2-12: Enable Turn-On. OUTPUT VOLTAGE (V) 3.5 3.4 3.3 3.2 3.1 VIN = V OUT + 1V VOUT = 3.3V CIN = C OUT = 1μF IOUT = 150m A 3.0 -40 -20 0 20 40 60 80 100 120 TEMPERATURE (°C) FIGURE 2-9: Temperature. Output Voltage vs.  2019 Microchip Technology Inc. DS20006195B-page 7 MIC5317 FIGURE 2-13: Enable Turn-On. FIGURE 2-14: Load Transient. FIGURE 2-15: Load Transient. DS20006195B-page 8 FIGURE 2-16: Line Transient.  2019 Microchip Technology Inc. MIC5317 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE Pin Number Pin Name UDFN-4 Pin Name SOT23-5 Pin Name TSOT23-5 1 VOUT — — Description Output voltage. 1 — VIN VIN Supply input. 2 GND GND GND Ground. 3 EN EN EN Enable Input: Active-High. High = ON; Low = OFF. Do not leave floating. 4 VIN — — Supply input. 4 — NC NC 5 — VOUT VOUT EP ePAD N/A N/A  2019 Microchip Technology Inc. No connect. Not internally connected. Output voltage. Exposed heat sink pad. Connect to ground. DS20006195B-page 9 MIC5317 4.0 APPLICATION INFORMATION MIC5317 is a low-noise 150 mA LDO. The MIC5317 regulator is fully protected from damage due to fault conditions, offering linear current limiting and thermal shutdown. The MIC5317 is not suitable for RF transmitter systems. 4.1 Input Capacitor The MIC5317 is a high-performance, high-bandwidth device. An input capacitor of 1 μF is required from the input to ground to provide stability. Low-ESR ceramic capacitors provide optimal performance at a minimum of space. Additional high-frequency capacitors, such as small-valued NPO dielectric-type capacitors, help filter out high-frequency noise and are good practice in any RF-based circuit. X5R or X7R dielectrics are recommended for the input capacitor. Y5V dielectrics lose most of their capacitance over temperature and are therefore, not recommended. 4.2 X7R/X5R dielectric-type ceramic capacitors are recommended because of their temperature performance. X7R-type capacitors change capacitance by 15% over their operating temperature range and are the most stable type of ceramic capacitors. Z5U and Y5V dielectric capacitors change value by as much as 50% and 60%, respectively, over their operating temperature ranges. To use a ceramic-chip capacitor with Y5V dielectric, the value must be much higher than an X7R ceramic capacitor to ensure the same minimum capacitance over the equivalent operating temperature range. No-Load Stability Unlike many other voltage regulators, the MIC5317 will remain stable and in regulation with no load. This is especially important in CMOS RAM keep-alive applications. 4.4 4.5 Thermal Considerations The MIC5317 is designed to provide 150 mA of continuous current in a very small package. Maximum ambient operating temperature can be calculated based on the output current and the voltage drop across the part. For example if the input voltage is 3.6V, the output voltage is 2.8V, and the output current = 150 mA. The actual power dissipation of the regulator circuit can be determined using Equation 4-1. EQUATION 4-1: P D =  V IN – V OUT 1   I OUT + V IN  I GND Output Capacitor The MIC5317 requires an output capacitor of 1 μF or greater to maintain stability. The design is optimized for use with low-ESR ceramic chip capacitors. High-ESR capacitors are not recommended because they may cause high-frequency oscillation. The output capacitor can be increased, but performance has been optimized for a 1 μF ceramic output capacitor and does not improve significantly with larger capacitance. 4.3 active-high enable pin uses CMOS technology and the enable pin cannot be left floating. A floating enable pin may cause an indeterminate state on the output. Enable/Shutdown The MIC5317 comes with an active-high enable pin that allows the regulator to be disabled. Forcing the enable pin low disables the regulator and sends it into a “zero” off-mode current state. In this state, current consumed by the regulator goes nearly to zero. Forcing the enable pin high enables the output voltage. The DS20006195B-page 10 Because this device is CMOS and the ground current is typically