MIC5319-3.0BD5-TR

MIC5319 500 mA, µCap Ultra-Low Dropout Regulator with High PSRR Features General Description • Ultra-Low Dropout Voltage: 200 mV @ 500 mA • Input Voltage Range: 2.5V to 5.5V • Output Voltage: - Adjustable: VREF = 1.25V - Fixed: 1.3V, 1.8V, 1.85V, 2.5V, 2.6V, 2.7V, 2.8V, 2.85V, 2.9V, 3.0V, 3.3V • Stable with Low ESR Ceramic Output Capacitor • Low Output Noise: 40 µVRMS (10 Hz to 100 kHz Bandwidth) • Low Ground Current: 90 µA Typical • High PSRR, up to 70 dB @ 1 kHz • Fast Turn-On Time: 40 µs Typical • High Output Accuracy: - ±1.0% Initial Accuracy - ±2.0% Over Temperature • Thermal-Shutdown Protection • Current-Limit Protection • Logic-Controlled Enable Input Pin • Available Packages: - 2 mm x 2 mm DFN, 500 mA Continuous - SOT23-5, 500 mA Peak The MIC5319 is a high performance, 500 mA LDO regulator, with high PSRR and very low noise, with low ground current. Ideal for battery-operated applications, the MIC5319 features 1% accuracy, very low dropout voltage (typically 200 mV @ 500 mA), and low ground current at light load (typically 90 µA). Equipped with a logic-compatible enable pin, the MIC5319 can be set into a zero-off-mode current state, typically drawing only 0.5 µA current when disabled. The MIC5319 is a µCap design operating with very small ceramic output capacitors for stability, thereby reducing required board space and component cost. The MIC5319 is available in fixed-output voltages and adjustable output versions in the compact 2 mm x 2 mm DFN lead-less package or the thin SOT23-5 package. Applications • • • • • • Cellular Phones PDAs Fiber Optic Modules Portable Electronics Notebook PCs Audio Codec Power Supplies Package Types MIC5319-X.XYML (FIXED) 6-Lead DFN (ML) (Top View) 6 BYP EN 1 GND 2 VIN 3 EP 5 NC 4 VOUT MIC5319YML (ADJ.) 6-Lead DFN (ML) (Top View) 6 BYP EN 1 GND 2 VIN 3 EP MIC5319-X.XYD5 SOT23-5 (D5) (Top View) EN GND VIN 4 BYP  2018 Microchip Technology Inc. 1 KWxx 5 ADJ 4 VOUT 2 3 5 VOUT DS20005876B-page 1 MIC5319 Typical Application Circuit MIC5319 DFN-6 or SOT23-5 MIC5319-2.8 VIN 2.8V@500mA VOUT VIN VOUT 1μF EN BYP 0.1μF 2.2μF GND Functional Block Diagrams MIC5319 (Fixed Output Voltage) VIN VOUT EN QUICKSTART VREF ERROR AMP BYP THERMAL SHUTDOWN CURRENT LIMIT MIC5319 GND MIC5319 (Adjustable Output Voltage) VOUT VIN EN VREF QUICKSTART ERROR AMP BYP ADJ THERMAL SHUTDOWN CURRENT LIMIT MIC5319 GND DS20005876B-page 2  2018 Microchip Technology Inc. MIC5319 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings † Supply Input Voltage (VIN) ................................................................................................................................ 0V to +6V Enable Input Voltage (VEN) ............................................................................................................................... 0V to +6V Power Dissipation (PD) (Note 1) ............................................................................................................ Internally Limited ESD Rating (Note 2) ........................................................................................................................................ 3 kV, HBM Operating Ratings ‡ Supply Input Voltage (VIN) ........................................................................................................................ +2.5V to +5.5V Enable Input Voltage (VEN) .................................................................................................................................0V to VIN † Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended periods may affect device reliability. ‡ Notice: The device is not guaranteed to function outside its operating ratings. Note 1: The maximum allowable power dissipation of any TA (ambient temperature) is PD(MAX) = (TJ(MAX) – TA)/θJA. Exceeding the maximum allowable power dissipation will result in excessive die temperature, and the regulator may go into thermal shutdown. 2: Devices are ESD sensitive. Handling precautions recommended.  2018 Microchip Technology Inc. DS20005876B-page 3 MIC5319 TABLE 1-1: ELECTRICAL CHARACTERISTICS Electrical Characteristics: VIN = VOUT + 1.0V; COUT = 2.2 µF; IOUT = 100 µA; TA = +25°C, bold values are available for the –40°C to +125°C junction temperature range, unless otherwise noted. (Note 1) Parameter Output Voltage Accuracy Feedback Voltage (Adj. Option) Symbol ∆VOUT VADJ Min. Typ. Max. –1.0 — 1.0 –2.0 — 2.0 1.2375 1.25 1.2625 1.225 1.25 1.275 Units Conditions Variation from nominal VOUT % Variation from nominal VOUT, IOUT = 100 µA to 500 mA V — Line Regulation ∆VOUT/( VOUT x ∆VIN) — 0.04 0.3 %/V Load Regulation (Note 2) ∆VOUT/ VOUT — 0.1 0.5 % Dropout Voltage (Note 3, Note 4) VDO Ground Pin Current (Note 5) Ground Pin Current in Shutdown Mode VIN = VOUT +1V to +5.5V IL = 100 µA to 500 mA — 20 40 — 200 400 IGND — 90 150 µA IOUT = 0 mA to 500 mA ISHDN — 0.5 — µA VEN ≤ 0.2V — 70 — dB f = up to 1 kHz; COUT = 2.2 µF ceramic; CBYP = 0.1 µF — 60 — dB f = 10 kHz; COUT = 2.2 µF ceramic; CBYP = 0.1 µF VOUT = 0V mV IOUT = 50 mA IOUT = 500 mA Power Supply Ripple Rejection PSRR Current Limit ILIMIT 600 700 — mA Output Voltage Noise eN — 40 — µVRMS COUT = 2.2 µF; CBYP = 0.1 µF; 10 Hz to 100 kHz Turn-On Time tON — 40 100 µs COUT = 2.2 µF; CBYP = 0.1 µF — — 0.2 1.2 — — — 0.01 1 — 0.01 1 Enable Input Voltage VENABLE Enable Input Current IENABLE Note 1: 2: 3: 4: 5: V µA Logic Low (Regulator Shutdown) Logic High (Regulator Enabled) VIL = ≤ 0.2V (Regulator Shutdown) VIH = ≥ 1.0V (Regulator Shutdown) Specification for packaged product only. Regulation is measured at constant junction temperature using low duty cycle pulse testing. Dropout voltage is defined as the input-to-output differential at which the output voltage drops 2% below its nominal VOUT. For outputs below 2.5V, dropout voltage spec does not apply, as the part is limited by minimum VIN spec of 2.5V. There may be some typical dropout degradation at VOUT < 3V. For Adjustable option, VOUT = 3V for dropout specification. Ground pin current is the regulator quiescent current. The total current drawn from the supply is the sum of the load current plus the ground pin current. DS20005876B-page 4  2018 Microchip Technology Inc. MIC5319 TEMPERATURE SPECIFICATIONS (Note 1) Parameters Sym. Min. Typ. Max. Units Conditions Junction Operating Temperature Range TJ –40 — +125 °C Storage Temperature Range TS –65 — +150 °C — Lead Temperature — — — +260 °C Soldering, 5s Thermal Resistance DFN-6 JA — 93 — °C/W — Thermal Resistance Thin SOT23-5 JA — 235 — °C/W — Temperature Ranges — Package Thermal Resistances Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.  2018 Microchip Technology Inc. DS20005876B-page 5 MIC5319 2.0 Note: TYPICAL PERFORMANCE CURVES The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. FIGURE 2-1: PSRR (Bypass Pin Capacitor = 0.1 µF). FIGURE 2-4: Temperature. Ground Current vs. FIGURE 2-2: PSRR (Bypass Pin Capacitor = 0.01 µF). FIGURE 2-5: Temperature. Ground Current vs. FIGURE 2-3: Current. FIGURE 2-6: Temperature. Ground Current vs. DS20005876B-page 6 Ground Current vs. Output  2018 Microchip Technology Inc. MIC5319 FIGURE 2-7: Temperature. Ground Current vs. FIGURE 2-10: Voltage. Ground Current vs. Input FIGURE 2-8: Voltage. Ground Current vs. Input FIGURE 2-11: Dropout Characteristics. FIGURE 2-9: Voltage. Ground Current vs. Input FIGURE 2-12: Temperature. Dropout Voltage vs.  2018 Microchip Technology Inc. DS20005876B-page 7 MIC5319 FIGURE 2-13: Temperature. Dropout Voltage vs. FIGURE 2-16: Input Voltage. Short-Circuit Current vs. FIGURE 2-14: Temperature. Dropout Voltage vs. FIGURE 2-17: Temperature. Output Voltage vs. FIGURE 2-15: Current. Dropout Voltage vs. Load FIGURE 2-18: Temperature. Enable Threshold vs. DS20005876B-page 8  2018 Microchip Technology Inc. MIC5319 FIGURE 2-19: Density. Output Noise Spectral FIGURE 2-20: Line Transient Response (3.0V Fixed Output Version). FIGURE 2-22: Enable Pin Delay (3.0V Fixed Output Version). FIGURE 2-23: Output Version). Shutdown Delay (3.0V Fixed FIGURE 2-21: Load Transient Response (3.0V Fixed Output Version).  2018 Microchip Technology Inc. DS20005876B-page 9 MIC5319 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE Pin Number DFN-6, Fixed Pin Number DFN-6, Adj. Pin Number SOT23-5 Pin Name Description 1 1 3 EN Enable Input: Active-High. High = Regulator ON, Low = Regulator OFF. Do not leave floating. 2 2 2 GND 3 3 1 VIN 4 4 5 VOUT — 5 — ADJ Adjustable Input: Connect to the external resistor voltage divider network to set the desired output voltage. 5 — — NC Not connected for the DFN fixed output voltage version. 6 6 4 BYP Reference Bypass: Connect external 0.1 µF to GND for reduced output noise. May be left open. EP EP — EP DS20005876B-page 10 Ground. Input Voltage. Output Voltage. Exposed Pad connected to ground internally. Must be connected to the ground plane of the application board for optimal heat dissipation.  2018 Microchip Technology Inc. MIC5319 4.0 APPLICATION INFORMATION 4.1 Enable/Shutdown The MIC5319 features an active-high enable pin that allows the regulator to be disabled. Forcing the enable pin low disables the regulator and sends it into a “zero” off-mode current state. In this state, the current consumed by the regulator is typically only 0.5 µA. Forcing the enable pin high enables the output voltage. The active-high enable pin uses CMOS technology and the enable pin cannot be left floating, as this may cause an undetermined state on the output. 4.2 Input Capacitor The MIC5319 is a high-performance, high bandwidth device. Therefore, it requires a well-bypassed input supply for optimal performance. A minimum 1 µF capacitor is required from the input-to-ground to provide stability. Low-ESR ceramic capacitors provide optimal performance at a minimum of space. Additional high-frequency capacitors, such as small-valued NPO dielectric-type capacitors, help filter out high-frequency noise and are good design practice in any RF-based circuit. 4.3 Output Capacitor The MIC5319 requires an output capacitor of 2.2 µF or greater to maintain stability. The design is optimized for use with low-ESR ceramic chip capacitors. High ESR capacitors may cause high-frequency oscillation. The output capacitor can be increased, but performance has been optimized for a 2.2 µF ceramic output capacitor and does not improve significantly with larger capacitance. X7R/X5R dielectric-type ceramic capacitors are recommended because of their temperature performance. X7R-type capacitors change capacitance by 15% over their operating temperature range and are the most stable type of ceramic capacitors. Z5U and Y5V dielectric capacitors change value by as much as 50% and 60%, respectively, over their operating temperature ranges. To use a ceramic chip capacitor with Y5V dielectric, the value must be much higher than an X7R ceramic capacitor to ensure the same minimum capacitance over the equivalent operating temperature range. 4.4 Bypass Capacitor A capacitor can be placed from the bypass pin-to-ground to reduce output voltage noise. The capacitor bypasses the internal reference. A 0.1 µF capacitor is recommended for applications that require low-noise outputs. The bypass capacitor can be increased, further reducing noise and improving PSRR. Turn-on time increases slightly with respect to bypass capacitance.  2018 Microchip Technology Inc. A unique, quick-start circuit allows the MIC5319 to drive a large capacitor on the bypass pin without significantly slowing turn-on time. 4.5 No-Load Stability Unlike many other voltage regulators, the MIC5319 will remain stable and in regulation with no load. This is especially important in CMOS RAM keep-alive applications. 4.6 Adjustable Regulator Application Adjustable regulators use a two-resistor divider to multiply the reference voltage and to produce the desired output voltage. The MIC5319 output voltage can be adjusted from 1.25V to 5.5V by using two external resistors (Figure 4-1). The resistors set the output voltage based on the following equation: EQUATION 4-1: R1 V OUT = V REF  1 + -------  R2 Where: = 1.25V VREF MIC5319YML VIN 1μF FIGURE 4-1: Application. 4.7 VOUT VIN VOUT EN R1 BYP ADJ GND R2 2.2μF Adjustable Voltage Typical Thermal Considerations The MIC5319 is designed to provide 500 mA of continuous current in a very small DFN package. Maximum ambient operating temperature can be calculated based on the output current and the voltage drop across the part. Given an input voltage of 3.3V, output voltage of 2.8V, and output current of 500 mA, the actual power dissipation of the regulator circuit can be determined using the equation: DS20005876B-page 11 MIC5319 EQUATION 4-2: P D =  V IN – V OUT   I OUT + V IN  I GND Therefore, a 2.8V application at 500 mA of output current can accept an ambient operating temperature of 101.75°C in a 2 mm x 2 mm DFN package. For a full discussion of heat sinking and thermal effects on voltage regulators, refer to the “Regulator Thermals” section of Microchip’s Designing with Low-Dropout Voltage Regulators handbook. Because this device is CMOS and the ground current is typically