MIC5800/1
4/8-Bit Parallel-Input Latched Drivers
Features
General Description
•
•
•
•
The MIC5800 and MIC5801 latched drivers are
high-voltage,
high-current
integrated
circuits
comprised of four or eight CMOS data latches, a
bipolar Darlington transistor driver for each latch, and
CMOS control circuitry for the common CLEAR,
STROBE, and OUTPUT ENABLE functions.
4.4 MHz Minimum Data Input Rate
High-Voltage, High-Current Sink Outputs
Output Transient Protection
CMOS, PMOS, NMOS, and TTL Compatible
Inputs
• Internal Pull-Down Resistors
• Low-Power CMOS Latches
The bipolar/MOS combination provides an extremely
low-power latch with maximum interface flexibility.
MIC5800 contains four latched drivers; MIC5801
contains eight latched drivers.
Data input rates are greatly improved in these devices.
With a 5V supply, they will typically operate at better
than 5 MHz. With a 12V supply, significantly higher
speeds are obtained. The CMOS inputs are compatible
with standard CMOS, PMOS, and NMOS circuits. TTL
or DTL circuits may require the use of appropriate
pull-up resistors. The bipolar outputs are suitable for
use with relays, solenoids, stepping motors, LED or
incandescent displays, and other high-power loads.
Both units have open-collector outputs and integral
diodes for inductive load transient suppression. The
output transistors are capable of sinking 500 mA and
will sustain at least 50V in the OFF state. Because of
limitations on package power dissipation, the
simultaneous operation of all drivers at maximum rated
current can only be accomplished by a reduction in
duty cycle. Outputs may be connected in parallel for
higher load current capability.
Package Types
NC
24 VDD
23 NC
STROBE 3
22 OUT1
4
3
2
1
28 27 26
NC
OE 1
CLEAR 2
OE
OE
VDD
14
CLEAR
1
STROBE
CLEAR
MIC5801YV
28-Lead PLCC (V)
(Top View)
NC
MIC5801YWM
24-Lead SOIC (WM)
(Top View)
MIC5800YM
14-Lead SOIC (M)
(Top View)
VDD
IN1
3
12
OUT1
IN1 4
21 OUT2
IN1 5
25 OUT1
IN2
4
11
OUT2
IN2 5
20 OUT3
IN2 6
24 OUT2
IN3
5
10
OUT3
IN3 6
19 OUT4
COM
IN5 8
17 OUT6
IN6 10
20 OUT6
IN6 9
16 OUT7
IN7 11
19 OUT7
IN7 10
15 OUT8
12 13 14 15 16 17 18
IN8 11
14 NC
GND 12
2019 - 2022 Microchip Technology Inc.
21 OUT5
OUT8
8
IN5 9
COM
7
18 OUT5
NC
GND
22 OUT4
IN4 7
GND
OUT4
23 OUT3
NC
9
IN4 8
IN8
6
IN3 7
NC
IN4
LATCHES
13
LATCHES
2
STROBE
13 COM
DS20006184B-page 1
MIC5800/1
Typical Application Circuit
+30V
OUTPUT ENABLE
0.1μF
STROBE
IN1
μP
IN2
IN3
IN4
1
14
2
13
3
12
VDD
OUT1
4
5
LATCHES
CLEAR
OUT2
11
OUT3
STEPPER
MOTOR
10
OUT4
6
9
7
8
0.1μF
+30V
Functional Block Diagram
VDD
INn
COMMON
OUTn
STROBE
GND
CLEAR
OUT P U T
ENABLE
DS20006184B-page 2
COMMON MOS
CONTROL
TYPICAL MOS
LATCH
TYPICAL BIPOLAR
DRIVER
2019 - 2022 Microchip Technology Inc.
MIC5800/1
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
Output Voltage (VCE) ................................................................................................................................................+50V
Supply Voltage (VDD) ................................................................................................................................................+15V
Input Voltage Range (VIN).................................................................................................................–0.3V to VDD + 0.3V
Continuous Collector Current (IC) .........................................................................................................................500 mA
ESD Rating (Note 1) .................................................................................................................................. ESD Sensitive
Operating Ratings ††
Package Power Dissipation (PD)
MIC5800 SOIC..........................................................................................................................................................1.0W
Derate above TA = +25°C ................................................................................................................................8.5 mW/°C
MIC5801 PLCC .......................................................................................................................................................2.25W
Derate above TA = +25°C ..............................................................................................................................18.2 mW/°C
MIC5801 Wide SOIC ................................................................................................................................................1.4W
Derate above TA = +25°C ................................................................................................................................. 11 mW/°C
† Notice: Exceeding the absolute maximum ratings may damage the device.
†† Notice: The device is not guaranteed to function outside its operating ratings.
Note 1: Microchip CMOS devices have input-static protection, but are susceptible to damage when exposed to
extremely high static electrical charges.
ELECTRICAL CHARACTERISTICS
Electrical Characteristics: VDD = 5V, TA = +25°C, VA ≤ +85°C unless otherwise noted. Note 1
Parameter
Output Leakage Current
Sym.
ICEX
Collector-Emitter
Saturation Voltage
VCE(SAT)
Input Voltage (Low)
VIN(0)
Input Voltage (High)
Input Resistance
VIN(1)
RIN
Supply Current ON (Each
Stage)
IDD(ON)
Supply Current OFF
(Total)
IDD(OFF)
Note 1:
2:
Min.
Typ.
Max.
Units
—
—
50
—
—
100
—
0.9
1.1
—
1.1
1.3
—
1.3
1.6
—
—
1.0
10.5
—
—
8.5
—
—
3.5
—
—
VDD = 5V, Note 2
50
200
—
VDD = 12V
50
300
—
50
600
—
VDD = 5V
—
1.0
2.0
VDD = 12V, Outputs Open
—
0.9
1.7
—
0.7
1.0
—
—
200
—
50
100
µA
Conditions
VCE = 50V, TA = +25°C
VCE = 50V, TA = +70°C
IC = 100 mA
V
IC = 200 mA
IC = 350 mA, VDD = 7.0V
V
—
VDD = 12V
V
kΩ
mA
VDD = 10V
VDD = 10V
VDD = 10V, Outputs Open
VDD = 5V, Outputs Open
µA
VDD = 12V, Outputs Open, Inputs = 0V
VDD = 5V, Outputs Open, Inputs = 0V
Specification for packaged product only.
Operation of these devices with standard TTL or DTL may require the use of appropriate pull-up resistors
to ensure a minimum logic “1”.
2019 - 2022 Microchip Technology Inc.
DS20006184B-page 3
MIC5800/1
ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Characteristics: VDD = 5V, TA = +25°C, VA ≤ +85°C unless otherwise noted. Note 1
Parameter
Sym.
Clamp Diode Leakage
Current
IR
Clamp Diode Forward
Voltage
VF
Note 1:
2:
Min.
Typ.
Max.
—
—
50
—
—
100
—
1.7
2.0
Units
µA
V
Conditions
VR = 50V, TA = +25°C
VR = 50V, TA = +70°C
IF = 350 mA
Specification for packaged product only.
Operation of these devices with standard TTL or DTL may require the use of appropriate pull-up resistors
to ensure a minimum logic “1”.
TRUTH TABLE
INN
Strobe
Clear
/OE
0
1
0
OUTN
t–1
t
0
X
OFF
1
1
0
0
X
ON
X
X
1
X
X
OFF
X
X
X
1
X
OFF
X
0
0
0
ON
ON
X
0
0
0
OFF
OFF
Legend: X = Irrelevant; t – 1 = Previous output state; t = Present output state.
Information present at an input is transferred to its latch when the STROBE is high. A high CLEAR input will set all
latches to the output OFF condition regardless of the data or STROBE input levels. A high /OE will set all outputs to the
off condition, regardless of any other input conditions. When the /OE is low, the outputs depend on the state of their
respective latches.
TEMPERATURE SPECIFICATIONS
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Storage Temperature Range
TS
–65
—
+125
°C
—
Operating Temperature Range
TA
–40
—
+85
°C
—
Temperature Ranges
Note 1:
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.
DS20006184B-page 4
2019 - 2022 Microchip Technology Inc.
MIC5800/1
2.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1 and Table 2-2.
TABLE 2-1:
MIC5800 PIN FUNCTION TABLE
Pin Number
Pin Name
1
CLEAR
2
STROBE
3, 4, 5, 6
INN
Description
Resets all latches and turns all outputs OFF (open).
Input strobe pin. Loads output latches when high.
Parallel inputs, 1 through 4.
7
GND
Logic and Output Ground pin.
8
COM
Transient suppression diode common cathode pin.
9, 10, 11, 12
OUTN
Parallel outputs, 4 through 1.
13
VDD
Logic Supply Voltage.
14
/OE
Output Enable. When low, outputs are active. When high, outputs are inactive and
device is reset from a fault condition. An undervoltage condition emulates a high OE
input.
TABLE 2-2:
MIC5801 PIN FUNCTION TABLE
Pin Number
SOIC
Pin Number
PLCC
Pin Name
Description
1
28
/OE
Output Enable. When low, outputs are active. When high, outputs
are inactive and device is reset from a fault condition. An
undervoltage condition emulates a high OE input.
2
1
CLEAR
Resets all latches and turns all outputs OFF (open).
3
3
STROBE
4, 5, 6, 7, 8, 9,
10, 11
5, 6, 7, 8, 9,
10, 11, 12
Input strobe pin. Loads output latches when high.
INN
12
15
GND
Logic and Output Ground pin.
13
17
COM
Transient suppression diode common cathode pin.
14, 23
2, 4, 13, 14,
16, 26
NC
15, 16, 17, 18,
19, 20, 21, 22
18, 19, 20, 21,
22, 23, 24, 25
OUTN
Parallel outputs, 8 through 1.
24
27
VDD
Logic Supply Voltage.
Parallel inputs, 1 through 8.
No Connection. Leave floating.
VDD
IN
FIGURE 2-1:
Typical Input.
2019 - 2022 Microchip Technology Inc.
DS20006184B-page 5
MIC5800/1
3.0
TIMING
CLEAR
F
STROBE
C
A
OUTPUT
ENABLE
INN
C
B
B
C
A
G
B
G
D
E
E
OUTN
FIGURE 3-1:
TABLE 3-1:
Timing Diagram.
TIMING CONDITIONS
Characteristics: TA = +25°C; Logic levels are VDD and Ground; VDD = 5V.
Condition
A. Minimum data active time before strobe enabled (data set-up time)
Min.
Typ.
Max.
50 ns
—
—
B. Minimum data active time after strobe disabled (data hold time)
50 ns
—
—
C. Minimum strobe pulse width
125 ns
—
—
D. Typical time between strobe activation and output on to off transition
—
500 ns
—
E. Typical time between strobe activation and output off to on transition
—
500 ns
—
F. Minimum clear pulse width
300 ns
—
—
G. Minimum data pulse width
225 ns
—
—
DS20006184B-page 6
2019 - 2022 Microchip Technology Inc.
MIC5800/1
4.0
TYPICAL APPLICATIONS
+30V
OUTPUT ENABLE
0.1μF
STROBE
IN1
μP
IN2
IN3
IN4
1
14
2
13
3
12
VDD
OUT1
4
5
LATCHES
CLEAR
OUT2
11
OUT3
STEPPER
MOTOR
10
OUT4
6
9
7
8
0.1μF
+30V
FIGURE 4-1:
MIC5800 Unipolar Stepper-Motor Drive.
STROBE
STROBE
IN1
IN1
IN2
IN2
IN3
IN3
IN4
IN4
OUT1
OUT1
OUT2
OUT2
OUT3
OUT3
OUT4
OUT4
FIGURE 4-2:
Unipolar Wave Drive.
2019 - 2022 Microchip Technology Inc.
FIGURE 4-3:
Unipolar 2-Phase Drive.
DS20006184B-page 7
MIC5800/1
+12V
+5V
0.1μF
22μF
+
1
24
2
23
STROBE
3
22
INPUT 1
4
21
INPUT 2
5
20
INPUT 3
6
INPUT 4
7
INPUT 5
8
17
INPUT 6
9
16
INPUT 7
10
15
11
14
12
13
CLEAR
K1
K2
K3
LATCHES
K4
19
K5
18
K6
K7
K8
INPUT 8
Relays: Guardian Electric 1725-1C-12D
FIGURE 4-4:
MIC5801 Relay Driver.
+5V
0.1μF
14
2
13
INPUT 1
3
12
INPUT 2
4
INPUT 3
5
INPUT 4
6
9
7
8
LATCHES
1
+24V
22μF
+
11
10
Note: Lamp inrush current is approximately 10× lamp operating current.
FIGURE 4-5:
DS20006184B-page 8
MIC5800 Incandescent/Halogen Lamp Driver.
2019 - 2022 Microchip Technology Inc.
MIC5800/1
5.0
PACKAGING INFORMATION
5.1
Package Marking Information
14-Lead SOIC*
Example
XXXXXX
XXXXXXXXX
WNNN
MICREL
MIC5800YM
2923
24-Lead SOICW*
28-Lead PLCC*
Example
XXXXXX
XXXXXXXXX
WNNN
MICREL
MIC5801YV
3122
Example
XXXXXX
XXXXXXXXXX
WNNN
MICREL
MIC5801YWM
4624
Legend: XX...X
Y
YY
WW
NNN
e3
*
14-Lead PDIP*
XXXXXX
XXXXXXXXX
WNNN
Example
MICREL
MIC5801YN
1622
Product code or customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle
mark).
Note:
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information. Package may or may not include
the corporate logo.
Underbar (_) and/or Overbar (‾) symbol may not be to scale.
Note:
If the full seven-character YYWWNNN code cannot fit on the package, the following truncated codes
are used based on the available marking space:
6 Characters = YWWNNN; 5 Characters = WWNNN; 4 Characters = WNNN; 3 Characters = NNN;
2 Characters = NN; 1 Character = N
2019 - 2022 Microchip Technology Inc.
DS20006184B-page 9
MIC5800/1
14-Lead Plastic Small Outline SOIC Package Outline and Recommended Land Pattern
14-Lead Plastic Small Outline (D3X, UEB, M5B, UEB) - Narrow, 3.90 mm Body [SOIC]
Atmel Legacy Global Package Code SVQ
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2X
0.10 C A–B
D
A
NOTE 5
D
N
E
2
E2
2
E1
E
2X
0.10 C D
NOTE 1
1
2
2X N/2 TIPS
0.20 C
3
e
NX b
B
0.25
NOTE 5
C A–B D
TOP VIEW
0.10 C
C
A A2
SEATING
PLANE
14X
h
0.10 C
SIDE VIEW
A1
h
R0.13
H
R0.13
c
SEE VIEW C
L
VIEW A–A
(L1)
VIEW C
Microchip Technology Drawing No. C04-065-D3X Rev D
DS20006184B-page 10
2019 - 2022 Microchip Technology Inc.
MIC5800/1
14-Lead Plastic Small Outline (D3X, UEB, M5B, UEB) - Narrow, 3.90 mm Body [SOIC]
Atmel Legacy Global Package Code SVQ
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
Dimension Limits
Number of Pins
N
e
Pitch
Overall Height
A
Molded Package Thickness
A2
Standoff
§
A1
Overall Width
E
Molded Package Width
E1
Overall Length
D
Chamfer (Optional)
h
Foot Length
L
Footprint
L1
Lead Angle
Foot Angle
c
Lead Thickness
Lead Width
b
Mold Draft Angle Top
Mold Draft Angle Bottom
MIN
1.25
0.10
0.25
0.40
0°
0°
0.10
0.31
5°
5°
MILLIMETERS
NOM
14
1.27 BSC
6.00 BSC
3.90 BSC
8.65 BSC
1.04 REF
-
MAX
1.75
0.25
0.50
1.27
8°
0.25
0.51
15°
15°
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic
3. Dimension D does not include mold flash, protrusions or gate burrs, which shall
not exceed 0.15 mm per end. Dimension E1 does not include interlead flash
or protrusion, which shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
5. Datums A & B to be determined at Datum H.
Microchip Technology Drawing No. C04-065-D3X Rev D Sheet 2 of 2
2019 - 2022 Microchip Technology Inc.
DS20006184B-page 11
MIC5800/1
14-Lead Plastic Small Outline (D3X, UEB, M5B, UEB) - Narrow, 3.90 mm Body [SOIC]
Atmel Legacy Global Package Code SVQ
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
14
SILK SCREEN
C
Y
1
2
X
E
RECOMMENDED LAND PATTERN
Units
Dimension Limits
Contact Pitch
E
Contact Pad Spacing
C
Contact Pad Width (X14)
X
Contact Pad Length (X14)
Y
MIN
MILLIMETERS
NOM
1.27 BSC
5.40
MAX
0.60
1.55
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing No. C04-2065-D3X Rev D
DS20006184B-page 12
2019 - 2022 Microchip Technology Inc.
MIC5800/1
14-Lead PDIP Package Outline and Recommended Land Pattern
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
2019 - 2022 Microchip Technology Inc.
DS20006184B-page 13
MIC5800/1
28-Lead PLCC Package Outline and Recommended Land Pattern
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
DS20006184B-page 14
2019 - 2022 Microchip Technology Inc.
MIC5800/1
24-Lead SOICW Package Outline and Recommended Land Pattern
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
2019 - 2022 Microchip Technology Inc.
DS20006184B-page 15
MIC5800/1
NOTES:
DS20006184B-page 16
2019 - 2022 Microchip Technology Inc.
MIC5800/1
APPENDIX A:
REVISION HISTORY
Revision A (April 2019)
• Converted Micrel document MIC5800/1 to Microchip data sheet template DS20006184A.
• Minor grammatical text changes throughout.
Revision B (February 2022)
• Corrected the device marking specification in
section 5.1 “Package Marking Information”.
2019 - 2022 Microchip Technology Inc.
DS20006184B-page 17
MIC5800/1
NOTES:
DS20006184B-page 18
2019 - 2022 Microchip Technology Inc.
MIC5800/1
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
Device
X
XX
-XX
Part No.
Junction Temp.
Range
Package
Media Type
MIC5800:
Device:
MIC5801:
4-Bit Parallel-Input, High-Voltage, HighCurrent Latched Driver
8-Bit Parallel-Input, High-Voltage, HighCurrent Latched Driver
Examples:
a) MIC5800YM:
MIC5800, –40°C to +85°C
Temperature Range, 14-Lead
SOIC, 54/Tube
b) MIC5800YM-TR:
MIC5800, –40°C to +85°C
Temperature Range, 14-Lead
SOIC, 2,500/Reel
c) MIC5800YN:
MIC5800, –40°C to +85°C
Temperature Range, 14-Lead
PDIP, 25/Tube
Junction
Temperature
Range:
Y
=
–40°C to +85°C, Industrial
d) MIC5801YV:
MIC5801, –40°C to +85°C
Temperature Range, 28-Lead
PLCC, 38/Tube
M
N
V
WM
=
=
=
=
14-Lead SOIC (MIC5800)
14-Lead PDIP (MIC5800)
28-Lead PLCC (MIC5801)
24-Lead Wide SOIC (MIC5801)
e) MIC5801YV-TR:
Package:
MIC5801, –40°C to +85°C
Temperature Range, 28-Lead
PLCC, 750/Reel
f) MIC5801YWM:
MIC5801, –40°C to +85°C
Temperature Range, 24-Lead
Wide SOIC, 31/Tube
g) MIC5801YWM-TR:
MIC5801, –40°C to +85°C
Temperature Range, 24-Lead
Wide SOIC, 1,000/Reel
Media Type:
=
=
=
=
TR =
TR =
TR =
54/Tube (M, MIC5800)
25/Tube (N, MIC5800)
38/Tube (V, MIC5801)
31/Tube (WM, MIC5801)
750/Reel (V, MIC5801)
1,000/Reel (WM, MIC5801)
2,500/Reel (M, MIC5800)
2019 - 2022 Microchip Technology Inc.
Note 1:
Tape and Reel identifier only appears in the
catalog part number description. This identifier is
used for ordering purposes and is not printed on
the device package. Check with your Microchip
Sales Office for package availability with the
Tape and Reel option.
DS20006184B-page 19
MIC5800/1
NOTES:
DS20006184B-page 20
2019 - 2022 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip products:
•
Microchip products meet the specifications contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is secure when used in the intended manner, within operating specifications, and
under normal conditions.
•
Microchip values and aggressively protects its intellectual property rights. Attempts to breach the code protection features of
Microchip product is strictly prohibited and may violate the Digital Millennium Copyright Act.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code. Code protection does not
mean that we are guaranteeing the product is “unbreakable”. Code protection is constantly evolving. Microchip is committed to
continuously improving the code protection features of our products.
This publication and the information herein may be used only
with Microchip products, including to design, test, and integrate
Microchip products with your application. Use of this information in any other manner violates these terms. Information
regarding device applications is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your
specifications. Contact your local Microchip sales office for
additional support or, obtain additional support at https://
www.microchip.com/en-us/support/design-help/client-supportservices.
THIS INFORMATION IS PROVIDED BY MICROCHIP "AS IS".
MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED,
WRITTEN OR ORAL, STATUTORY OR OTHERWISE,
RELATED TO THE INFORMATION INCLUDING BUT NOT
LIMITED TO ANY IMPLIED WARRANTIES OF NONINFRINGEMENT, MERCHANTABILITY, AND FITNESS FOR A
PARTICULAR PURPOSE, OR WARRANTIES RELATED TO
ITS CONDITION, QUALITY, OR PERFORMANCE.
IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT, SPECIAL, PUNITIVE, INCIDENTAL, OR CONSEQUENTIAL LOSS, DAMAGE, COST, OR EXPENSE OF ANY
KIND WHATSOEVER RELATED TO THE INFORMATION OR
ITS USE, HOWEVER CAUSED, EVEN IF MICROCHIP HAS
BEEN ADVISED OF THE POSSIBILITY OR THE DAMAGES
ARE FORESEEABLE. TO THE FULLEST EXTENT
ALLOWED BY LAW, MICROCHIP'S TOTAL LIABILITY ON
ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION
OR ITS USE WILL NOT EXCEED THE AMOUNT OF FEES, IF
ANY, THAT YOU HAVE PAID DIRECTLY TO MICROCHIP
FOR THE INFORMATION.
Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to
defend, indemnify and hold harmless Microchip from any and
all damages, claims, suits, or expenses resulting from such
use. No licenses are conveyed, implicitly or otherwise, under
any Microchip intellectual property rights unless otherwise
stated.
Trademarks
The Microchip name and logo, the Microchip logo, Adaptec,
AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud,
CryptoMemory, CryptoRF, dsPIC, flexPWR, HELDO, IGLOO,
JukeBlox, KeeLoq, Kleer, LANCheck, LinkMD, maXStylus,
maXTouch, MediaLB, megaAVR, Microsemi, Microsemi logo,
MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower,
PICSTART, PIC32 logo, PolarFire, Prochip Designer, QTouch,
SAM-BA, SenGenuity, SpyNIC, SST, SST Logo, SuperFlash,
Symmetricom, SyncServer, Tachyon, TimeSource, tinyAVR, UNI/O,
Vectron, and XMEGA are registered trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
AgileSwitch, APT, ClockWorks, The Embedded Control Solutions
Company, EtherSynch, Flashtec, Hyper Speed Control, HyperLight
Load, IntelliMOS, Libero, motorBench, mTouch, Powermite 3,
Precision Edge, ProASIC, ProASIC Plus, ProASIC Plus logo, QuietWire, SmartFusion, SyncWorld, Temux, TimeCesium, TimeHub,
TimePictra, TimeProvider, TrueTime, WinPath, and ZL are
registered trademarks of Microchip Technology Incorporated in the
U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, Augmented Switching, BlueSky,
BodyCom, CodeGuard, CryptoAuthentication, CryptoAutomotive,
CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net,
Dynamic Average Matching, DAM, ECAN, Espresso T1S,
EtherGREEN, GridTime, IdealBridge, In-Circuit Serial
Programming, ICSP, INICnet, Intelligent Paralleling, Inter-Chip
Connectivity, JitterBlocker, Knob-on-Display, maxCrypto, maxView,
memBrain, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo,
MPLIB, MPLINK, MultiTRAK, NetDetach, NVM Express, NVMe,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple
Blocker, RTAX, RTG4, SAM-ICE, Serial Quad I/O, simpleMAP,
SimpliPHY, SmartBuffer, SmartHLS, SMART-I.S., storClad, SQI,
SuperSwitcher, SuperSwitcher II, Switchtec, SynchroPHY, Total
Endurance, TSHARC, USBCheck, VariSense, VectorBlox, VeriPHY,
ViewSpan, WiperLock, XpressConnect, and ZENA are trademarks
of Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
The Adaptec logo, Frequency on Demand, Silicon Storage
Technology, Symmcom, and Trusted Time are registered
trademarks of Microchip Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology Germany
II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in
other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2019 - 2022, Microchip Technology Incorporated and its subsidiaries.
All Rights Reserved.
For information regarding Microchip’s Quality Management Systems,
please visit www.microchip.com/quality.
2019 - 2022 Microchip Technology Inc. and its subsidiaries.
ISBN: 978-1-5224-9831-5
DS20006184B-page 21
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