MIC69153
Single Supply VIN, LOW VIN, LOW VOUT, 1.5A LDO
Features
General Description
• Single Input Voltage Range: VIN 1.65V to 5.5V
• Maximum Dropout (VIN – VOUT) of 500 mV over
Temperature
• Adjustable Output Voltage Down to 0.5V
• Stable with 10 µF Ceramic Output Capacitor
• Excellent Line and Load Regulation Specifications
• Logic-Controlled Shutdown
• Thermal Shutdown and Current-Limit Protection
• 10-Pin 3 mm x 3 mm DFN Package
• ePAD SOIC-8 package
• –40°C to +125°C Junction Temperature Range
The MIC69153 is the 1.5A output current member of
the MIC69xxx family of high current, low voltage
regulators, that support currents of 1A, 1.5A, 3A, and
5A. The MIC69153 operates from a single low voltage
supply, yet offers high precision and ultra-low dropout
of 500 mV under worst case conditions.
Applications
• Point-of-Load Applications
• Industrial Power
• Sensitive RF Applications
The MIC69153 operates from an input voltage of 1.65V
to 5.5V. It is designed to drive digital circuits requiring
low voltage at high currents (i.e. PLDs, DSP,
microcontroller, etc.). These regulators are available
only in adjustable output voltage option and can
support output voltages down to 0.5V.
The µCap design of the MIC69153 is optimized for
stability with low value low ESR ceramic output
capacitors.
Features of the MIC69153 include thermal shutdown
and current-limit protection. Logic enable and error flag
pins are also available.
The MIC69153 is offered in a tiny 10-pin 3 mm x 3 mm
DFN package and an ePAD SOIC-8 package. Both
packages have an operating temperature range of
–40°C to +125°C.
Typical Application Circuit
MIC69153
VIN
VIN
CIN
VOUT
VEN
ADJ
GND
2018 Microchip Technology Inc.
VOUT
R1
FLG
COUT
R2
DS20006019A-page 1
MIC69153
Package Types
MIC69153
10-Pin 3 mm x 3 mm DFN (ML)
FLG
1
10 ADJ
NC
2
9
GND
3
NC
NC
MIC69153
8-Pin ePAD SOIC (ME)
GND
1
8 FLG
VOUT
EN
2
7 ADJ
8
NC
VIN
3
6 VOUT
4
7
VIN
VIN
4
5 VOUT
5
6
EN
Functional Block Diagram
IN
EN
OUT
ENABLE
VREF
ADJ
50mV
FLG
VREF
GND
DS20006019A-page 2
2018 Microchip Technology Inc.
MIC69153
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
Supply Input Voltage (VIN) ..........................................................................................................................................+6V
Logic Input Voltage (VEN)....................................................................................................................................0V to VIN
Power Dissipation (PD) (Note 1) ............................................................................................................ Internally Limited
Flag Pin (FLG) ............................................................................................................................................................+6V
ESD Rating (Note 2) .................................................................................................................................................. 2 kV
Operating Ratings ‡
Supply Voltage (VIN) ............................................................................................................................... +1.65V to +5.5V
Enable Input Voltage (VEN) .................................................................................................................................0V to VIN
† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at those or any other conditions above those indicated
in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended
periods may affect device reliability. Specifications are for packaged product only.
‡ Notice: The device is not guaranteed to function outside its operating ratings.
Note 1: The maximum allowable power dissipation of any TA (ambient temperature) is PD(max) = (TJ(max) – TA) / θJA.
Exceeding the maximum allowable power dissipation will result in excessive die temperature and the regulator will go into thermal shutdown.
2: Devices are ESD sensitive. Handling precautions are recommended. Human body model, 1.5 kΩ in series
with 100 pF
TABLE 1-1:
ELECTRICAL CHARACTERISTICS
Electrical Characteristics: TA = +25°C with VIN = VOUT + 1V; Bold values indicate –40°C ≤ TJ ≤ +125°C;
IOUT = 10 mA; COUT = 4.7 µF ceramic, unless otherwise noted.
Parameter
Symbol
Min.
Typ.
Max.
VOUT
–2
—
+2
%
Overtemperature range
(The precision of the resistive
divider is not included)
Adjustable Feedback Voltage
VFB
0.49
0.5
0.51
V
—
Feedback Pin Current
IFB
—
0.25
1
µA
—
Output Voltage Line Regulation
(Note 1)
ΔVOUT/ΔVIN
—
±0.2
±0.3
%/V
Output Voltage Load Regulation
ΔVOUT/VOUT
—
±0.2
—
%
185
300
mV
IL = 1.0A
250
500
mV
IL = 1.5A
1.6
—
mA
IL = 10 mA
7.5
20
mA
IL = 0.5A
Output Voltage Accuracy
Units Conditions
VIN = VOUT +1.0V to 5.5V
For VOUT ≥ 0.65V, VIN = 1.65V
to 5.5V
IL = 10 mA to 1.5A
VIN – VOUT; Dropout Voltage
(Note 2)
VDO
—
Ground Pin Current
IGND
—
20
35
mA
IL = 1.5A
Ground Pin Current in Shutdown
ISHDN
—
1
—
µA
VEN = 0V
Current Limit
ILIM
1.7
2.6
—
A
VOUT = 0V
Start-Up Time
tSTART
—
10
150
µs
VEN = VIN
ThSHDN
—
165
—
°C
—
0.8
0.6
—
V
Regulator enable
—
—
0.2
V
Regulator shutdown
Thermal Shutdown
Enable Input
Enable Input Threshold
2018 Microchip Technology Inc.
VEN
DS20006019A-page 3
MIC69153
TABLE 1-1:
ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Characteristics: TA = +25°C with VIN = VOUT + 1V; Bold values indicate –40°C ≤ TJ ≤ +125°C;
IOUT = 10 mA; COUT = 4.7 µF ceramic, unless otherwise noted.
Parameter
Enable Pin Input Current
Symbol
Min.
Typ.
Max.
—
0.005
—
µA
VIL ≤ 0.2V (Regulator shutdown)
—
7
—
µA
VIH ≥ 0.8V (Regulator enable)
IFLG(LEAK)
—
0.05
—
µA
Flag off
VFLG(LO)
—
150
—
mV
IL = 5 mA
VFLG
7.5
10
14
%
% of VOUT below nominal
(falling)
—
—
2
—
%
—
IEN
Units Conditions
Flag Output
Flag Output Leakage Current
Output Logic-Low Voltage
(Undervoltage Condition)
Flag Threshold
Hysteresis
1:
2:
Minimum input for line regulation test is set to VOUT + 1V relative to the highest output voltage.
Dropout voltage is defined as the input-to-output differential at which the output voltage drops 2% below its
nominal value measured at 1V differential. For outputs below 1.65V, dropout voltage is considered the
input-to-output voltage differential with the minimum input voltage of 1.65V. Minimum input operating
voltage is 1.65V.
DS20006019A-page 4
2018 Microchip Technology Inc.
MIC69153
TEMPERATURE SPECIFICATIONS (Note 1)
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Storage Temperature Range
TS
–65
—
+125
°C
—
Junction Temperature Range
TJ
–40
—
+125
°C
—
Thermal Resistance DFN-10
JA
—
60
—
°C/W
—
Thermal Resistance ePAD SOIC-8
JA
—
41
—
°C/W
—
Temperature Ranges
Package Thermal Resistances
Note 1:
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.
2018 Microchip Technology Inc.
DS20006019A-page 5
MIC69153
2.0
Note:
TYPICAL PERFORMANCE CURVES
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
18
GROUND CURRENT (mA)
70
16
60
14
50
12
40
dB
10
30
20
VIN = 3.3V
10 VOUT = 1.8V
IOUT = 0.5A
0
100 1K 10K 100K
10
FREQUENCY (Hz)
FIGURE 2-1:
Ratio.
8
6
4
2
0
0
1M
Power Supply Rejection
FIGURE 2-4:
Current.
14
250
12
200
100
50
VOUT = 1.8V
COUT = 10μF
0
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
OUTPUT CURRENT (A)
Dropout Voltage vs. Output
350
IOUT=1.5A
250
IOUT=750mA
100
50
VIN = 3.3V
VOUT = 1.8V
0
-40 -20 0 20 40 60 80 100 120
TEMPERATURE (°C)
FIGURE 2-3:
Temperature.
DS20006019A-page 6
0.5A
4 V =V
IN
OUT +1
2 VOUT = 1.8V
COUT = 10μF
0
-40 -20 0 20 40 60 80 100 120
TEMPERATURE (°C)
FIGURE 2-5:
Temperature.
1.2
1.0
200
150
6
2.0
1.8
1.6
1.4
400
300
8
OUTPUT VOLTAGE (V)
FIGURE 2-2:
Current.
1A
10
150
DROPOUT VOLTAGE (mV)
Ground Current vs. Output
16
GROUND CURRENT (mA)
DROPOUT VOLTAGE (mV)
300
VIN = 3V
VOUT = 1.8V
COUT = 10μF
400
800
1200 1600
OUTPUT CURRENT (mA)
Dropout Voltage vs.
0.8
0.6
0.4
0.2
0
0
FIGURE 2-6:
Voltage.
Ground Current vs.
750mA
1A
VOUT = 1.8V
COUT = 10μF
0.5 1.0 1.5 2.0 2.5
INPUT VOLTAGE (V)
3.0
Output Voltage vs. Input
2018 Microchip Technology Inc.
MIC69153
1.90
1.88
ENABLE THRESHOLD (V)
OUTPUT VOLTAGE (V)
1.0
0.9
1.86
1.84
0.8
0.7
1.82
1.80
1.78
0.6
0.5
0.4
1.76
1.74
OFF
0.3 VIN = 2.8V
V
= 1.8V
0.2 OUT
COUT = 10μF
0.1 I
OUT = 100mA
0
-40 -20 0 20 40 60 80 100 120
TEMPERATURE (°C)
VIN = 3.3V
VOUT = 1.8V
IOUT = 10mA
1.72
1.70
-40 -20 0 20 40 60 80 100 120
TEMPERATURE (°C)
CURRENT LIMIT (A)
2.8
2.7
2.6
2.5
2.4
2.3
2.2
2.1
2.0
VIN = 3.3V
1.9
VOUT = 1.8V
1.8
-40 -20 0 20 40 60 80 100 120
TEMPERATURE (°C)
FIGURE 2-8:
Temperature.
Current-Limit vs.
FIGURE 2-10:
Temperature.
Enable Threshold vs.
INPUT VOLTAGE
(2V/div)
Output Voltage vs.
OUTPUT VOLTAGE
(10mV/div)
FIGURE 2-7:
Temperature.
ON
VOUT = 1.8V
COUT = 10μF
IOUT = 750mA
Time (400μs/div)
FIGURE 2-11:
Line Transient.
OUTPUT VOLTAGE (V)
1.800
1.798
1.796
1.794
1.792
1.790
VIN = 3V
1.788 VOUT = 1.8V
COUT = 10μF
1.786
0 0.25 0.5 0.75 1.0 1.25 1.5
OUTPUT CURRENT (A)
FIGURE 2-9:
Load Regulation.
2018 Microchip Technology Inc.
OUTPUT CURRENT
(1A/div)
OUTPUT VOLTAGE
(20mV/div)
1.802
VIN = 4V
VOUT = 1.8V
COUT = 10μF
IOUT = 20mA - 1.5A
Time (200μs/div)
FIGURE 2-12:
Load Transient.
DS20006019A-page 7
OUTPUT VOLTAGE
(500mV/div)
ENABLE
(2V/div)
MIC69153
FIGURE 2-13:
DS20006019A-page 8
VIN = 4V
VOUT = 1.8V
IOUT = 1A
Time (2μs/div)
Enable Turn-On.
2018 Microchip Technology Inc.
MIC69153
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
Pin Number
DFN-10
PIN FUNCTION TABLE
Pin Number
Pin Name
ePAD SOIC-8
Description
1
8
FLG
Error Flag (Output): Open collector output. Active-low indicates an
output fault condition.
2, 4, 5, 8
—
NC
Not internally connected.
3 (EP)
1
GND
6
2
EN
Enable (Input): CMOS compatible input. Logic-high = enable,
logic-low = shutdown. Do not leave pin floating.
Input voltage that supplies current to the output power device.
7
3, 4
VIN
9
5, 6
VOUT
10
7
ADJ
2018 Microchip Technology Inc.
Ground (exposed pad is recommended to connect to ground on DFN).
Regulator Output.
Adjustable regulator feedback input. Connect to resistor voltage divider.
DS20006019A-page 9
MIC69153
4.0
APPLICATION INFORMATION
The MIC69153 is an ultra-high performance low
dropout linear regulator designed for high current
applications that require a fast transient response. It
utilizes a single input supply, perfect for low voltage
DC-to-DC conversion. The MIC69153 requires a
minimum number of external components. The
MIC69153 regulator is fully protected from damage due
to fault conditions offering constant current limiting and
thermal shutdown.
4.1
Input Supply Voltage
VIN provides a high current to the collector of the pass
transistor. The minimum input voltage is 1.65V allowing
conversion from low voltage supplies.
4.4
Minimum Load Current
The MIC69153 regulator is specified between finite
loads. If the output current is too small, leakage
currents dominate and the output voltage rises. A
minimum 10 mA load current is necessary for proper
operation.
4.5
Adjustable Regulator Design
The MIC69153 adjustable version allows programming
the output voltage anywhere between 0.5V and 5.5V
with two resistors. The resistor value between VOUT
and the adjust pin should not exceed 10 kΩ. Larger
values can cause instability. The resistor values are
calculated by:
EQUATION 4-1:
4.2
Input Capacitor
An input capacitor of 1 µF or greater is recommended
when the device is more than 4 inches away from the
bulk AC supply capacitance or when the supply is a
battery. Small, surface mount, ceramic chip capacitors
can be used for bypassing. The capacitor should be
placed within 1 inch of the device for optimal
performance. Larger values will help to improve ripple
rejection by bypassing the input to the regulator, further
improving the integrity of the output voltage.
4.3
Output Capacitor
The MIC69153 requires a minimum of output
capacitance to maintain stability. However, proper
capacitor selection is important to ensure desired
transient response. The MIC69153 is specifically
designed to be stable with low ESR ceramic chip
capacitors. A 4.7 µF ceramic chip capacitor should
satisfy most applications. Output capacitor can be
increased without bound. See Section 2.0 “Typical
Performance Curves” for examples of load transient
response.
X7R dielectric ceramic capacitors are recommended
because of their temperature performance. X7R-type
capacitors change capacitance by only 15% over their
operating temperature range and are the most stable
type of ceramic capacitors. Z5U and Y5V dielectric
capacitors change value by as much as 50% and 60%,
respectively over their operating temperature ranges.
To use a ceramic chip capacitor with Y5V dielectric the
value must be much higher than an X7R ceramic or a
tantalum capacitor to ensure the same capacitance
value over the operating temperature range. Tantalum
capacitors have a very stable dielectric (10% over their
operating temperature range) and can also be used
with this device.
DS20006019A-page 10
V OUT = 0.5 R1
------- + 1
R2
Where:
VOUT is the desired output voltage
4.6
Enable
The MIC69153 features an active high enable input
(EN) that allows on-off control of the regulator. Current
drain reduces to near “zero” when the device is
shutdown, with only microamperes of leakage current.
EN may be directly tied to VIN and pulled up to the
maximum supply voltage.
4.7
Thermal Design
Linear regulators are simple to use. The most
complicated design parameters to consider are thermal
characteristics. Thermal design requires the following
application-specific parameters:
•
•
•
•
•
Maximum ambient temperature (TA)
Output current (IOUT)
Output voltage (VOUT)
Input voltage (VIN)
Ground current (IGND)
First, calculate the power dissipation of the regulator
from these numbers and the device parameters from
this data sheet.
2018 Microchip Technology Inc.
MIC69153
EQUATION 4-2:
P D = V IN – V OUT I OUT + V IN I GND
In Equation 4-2, the ground current is approximated by
using numbers from the Section 1.0 “Electrical
Characteristics”
or
Section 2.0
“Typical
Performance Curves” sections. The maximum
allowable power dissipation of any TA (ambient
temperature) is PD(MAX) = (TJ(MAX) – TA) / θJA.
Exceeding the maximum allowable power dissipation
will result in excessive die temperature and the
regulator will go into thermal shutdown.
Refer to Application Note 9 for further details and
examples on thermal design and heat sink
applications.
2018 Microchip Technology Inc.
DS20006019A-page 11
MIC69153
5.0
PACKAGING INFORMATION
5.1
Package Marking Information
8-Lead ePAD SOIC*
Example
XXX
XXXXXXXX
MIC
69153YME
1897
WNNN
10-Lead DFN*
X
XXXXX
NNN
Legend: XX...X
Y
YY
WW
NNN
e3
*
Example
Y
69153
916
Product code or customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle
mark).
Note:
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information. Package may or may not include
the corporate logo.
Underbar (_) and/or Overbar (‾) symbol may not be to scale.
DS20006019A-page 12
2018 Microchip Technology Inc.
MIC69153
10-Lead 3 mm x 3 mm DFN Package Outline and Recommended Land Pattern
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
2018 Microchip Technology Inc.
DS20006019A-page 13
MIC69153
10-Lead 3mm x 3 mm DFN Package Outline and Recommended Land Pattern
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
DS20006019A-page 14
2018 Microchip Technology Inc.
MIC69153
8-Lead SOICN ePAD Package Outline and Recommended Land Pattern
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
2018 Microchip Technology Inc.
DS20006019A-page 15
MIC69153
NOTES:
DS20006019A-page 16
2018 Microchip Technology Inc.
MIC69153
APPENDIX A:
REVISION HISTORY
Revision A (May 2018)
• Converted Micrel document MIC69153 to Microchip data sheet DS20006019A.
• All references to the MIC69151 have been
removed from the data sheet as the part is
discontinued.
• Minor text changes throughout.
2018 Microchip Technology Inc.
DS20006019A-page 17
MIC69153
NOTES:
DS20006019A-page 18
2018 Microchip Technology Inc.
MIC69153
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
PART NO.
Device
–X
XX
X
–XX
Output
Package Media Type
Junction
Voltage Temperature
Range
Device:
MIC69153: Single Supply VIN, LOW VIN, LOW VOUT,
1.5A LDO (Adjustable)
Output Voltage:
= Adjustable
Junction
Temperature Range:
Y
=
–40°C to +125°C, Extended Industrial,
Pb-Free, RoHS Compliant
Package:
ML =
ME =
10-Lead DFN 3 mm x 3 mm x 0.9 mm
8-Lead ePAD SOIC
Media Type:
TR
TR
Examples:
a) MIC69153YME-TR:
Single Supply VIN, Low VIN, Low
VOUT, 1.5A LDO, Adjustable
Output Voltage,
–40°C to +125°C Junction
Temperature Range, 8-Lead
SOIC Package, 2500/Reel
b) MIC69153YML-TR:
Single Supply VIN, Low VIN, Low
VOUT, 1.5A LDO, Adjustable
Output Voltage,
–40°C to +125°C Junction
Temperature Range, 10-Lead
DFN, 5,000/Reel
= 2500/Reel (ME, ePAD SOIC)
= 5000/Reel (ML, DFN)
Note 1:
2018 Microchip Technology Inc.
Tape and Reel identifier only appears in the
catalog part number description. This identifier is
used for ordering purposes and is not printed on
the device package. Check with your Microchip
Sales Office for package availability with the
Tape and Reel option.
DS20006019A-page 19
MIC69153
NOTES:
DS20006019A-page 20
2018 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
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Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, PureSilicon, QMatrix, RightTouch logo, REAL ICE, Ripple
Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI,
SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC,
USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and
ZENA are trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
Silicon Storage Technology is a registered trademark of Microchip
Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip Technology
Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2018, Microchip Technology Incorporated, All Rights Reserved.
ISBN: 978-1-5224-3085-8
== ISO/TS 16949 ==
2018 Microchip Technology Inc.
DS20006019A-page 21
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
Australia - Sydney
Tel: 61-2-9868-6733
India - Bangalore
Tel: 91-80-3090-4444
China - Beijing
Tel: 86-10-8569-7000
India - New Delhi
Tel: 91-11-4160-8631
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
China - Chengdu
Tel: 86-28-8665-5511
India - Pune
Tel: 91-20-4121-0141
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
China - Chongqing
Tel: 86-23-8980-9588
Japan - Osaka
Tel: 81-6-6152-7160
Finland - Espoo
Tel: 358-9-4520-820
China - Dongguan
Tel: 86-769-8702-9880
Japan - Tokyo
Tel: 81-3-6880- 3770
China - Guangzhou
Tel: 86-20-8755-8029
Korea - Daegu
Tel: 82-53-744-4301
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
China - Hangzhou
Tel: 86-571-8792-8115
Korea - Seoul
Tel: 82-2-554-7200
China - Hong Kong SAR
Tel: 852-2943-5100
Malaysia - Kuala Lumpur
Tel: 60-3-7651-7906
China - Nanjing
Tel: 86-25-8473-2460
Malaysia - Penang
Tel: 60-4-227-8870
China - Qingdao
Tel: 86-532-8502-7355
Philippines - Manila
Tel: 63-2-634-9065
China - Shanghai
Tel: 86-21-3326-8000
Singapore
Tel: 65-6334-8870
China - Shenyang
Tel: 86-24-2334-2829
Taiwan - Hsin Chu
Tel: 886-3-577-8366
China - Shenzhen
Tel: 86-755-8864-2200
Taiwan - Kaohsiung
Tel: 886-7-213-7830
Israel - Ra’anana
Tel: 972-9-744-7705
China - Suzhou
Tel: 86-186-6233-1526
Taiwan - Taipei
Tel: 886-2-2508-8600
China - Wuhan
Tel: 86-27-5980-5300
Thailand - Bangkok
Tel: 66-2-694-1351
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
China - Xian
Tel: 86-29-8833-7252
Vietnam - Ho Chi Minh
Tel: 84-28-5448-2100
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Austin, TX
Tel: 512-257-3370
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Novi, MI
Tel: 248-848-4000
Houston, TX
Tel: 281-894-5983
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Tel: 317-536-2380
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Tel: 951-273-7800
Raleigh, NC
Tel: 919-844-7510
New York, NY
Tel: 631-435-6000
San Jose, CA
Tel: 408-735-9110
Tel: 408-436-4270
Canada - Toronto
Tel: 905-695-1980
Fax: 905-695-2078
DS20006019A-page 22
China - Xiamen
Tel: 86-592-2388138
China - Zhuhai
Tel: 86-756-3210040
Germany - Garching
Tel: 49-8931-9700
Germany - Haan
Tel: 49-2129-3766400
Germany - Heilbronn
Tel: 49-7131-67-3636
Germany - Karlsruhe
Tel: 49-721-625370
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Germany - Rosenheim
Tel: 49-8031-354-560
Italy - Padova
Tel: 39-049-7625286
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Norway - Trondheim
Tel: 47-7289-7561
Poland - Warsaw
Tel: 48-22-3325737
Romania - Bucharest
Tel: 40-21-407-87-50
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Sweden - Gothenberg
Tel: 46-31-704-60-40
Sweden - Stockholm
Tel: 46-8-5090-4654
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
2018 Microchip Technology Inc.
10/25/17
