MIC69301/2/3
Single Supply VIN, Low VIN, Low VOUT, 3A LDO
Features
General Description
• Input Voltage Range VIN: +1.65V to +5.5V
• Maximum Dropout (VIN – VOUT) of 500 mV over
Temperature
• Adjustable Output Voltage Down to 0.5V
• Stable with 10 µF Ceramic Output Capacitor
• Excellent Line and Load Regulation
• Logic Controlled Shutdown
• Thermal Shutdown and Current-Limit Protection
• Error Flag Output
• 5-Lead TO-263 Package
• 5-Lead S-PAK Package
• ePad SOIC-8 Package
• 12-Lead 4 mm x 4 mm DFN Package (MIC69303
Only)
• –40°C to +125°C Junction Temperature Range
The MIC69301, MIC69302, MIC69303 are the 3A
output current members of the MIC69xxx family of high
current, low voltage regulators that support currents of
1A, 1.5A, 3A, and 5A. This family operates from a
single low voltage supply and offers high precision and
ultra low dropout of 500 mV under worst case
conditions.
Applications
• Point-of-Load Applications
• Industrial Power
• Sensitive RF Applications
The MIC69301/2/3 operate from an input voltage of
1.65V to 5.5V. It is designed to drive digital circuits that
require low voltage at high currents (i.e., PLDs, DSP,
microcontroller, etc.). These regulators are available in
adjustable and fixed output voltages. The adjustable
version can support output voltages down to 0.5V.
The µCap design of the MIC69301/2/3 is optimized for
stability with low value, low-ESR ceramic output
capacitors.
Features of the MIC69301/2/3 include thermal
shutdown and current limit protection. Logic enable and
error flag pins are also available.
The MIC69301/2/3 are offered in TO-263, S-PAK, and
the ePad SOIC-8 packages. The MIC69303 is also
available in a 12-lead 4 mm x 4 mm DFN package. All
packages have an operating temperature range of
–40°C to +125°C.
Typical Application Circuits
ADJUSTABLE REGULATOR
(ERROR FLAG OUTPUT ON
MIC69303 ONLY)
FIXED 1.2V REGULATOR WITH
ERROR FLAG OUTPUT
MIC69301
VIN = 2.2V
CIN
IN
OUT
EN
FLG
VOUT = 1.2V
MIC69302/3
VIN = 2.5V
OUT
IN
N
COUT
GND
2021 Microchip Technology Inc. and its subsidiaries
CIN
FLG
EN
GND
ADJ
VOUT = 1.8V
N R1
10μF
R2
DS20006625A-page 1
MIC69301/2/3
Pin Configurations
MIC69301/2
5-Lead TO-263 (U)
Adjustable Voltage
ADJ
OUT
GND
IN
EN
5
4
3
2
1
ADJ
OUT
GND
IN
EN
1
EN
2
IN
IN
FLG
OUT
GND
IN
EN
MIC69301/3
8-Lead ePad SOIC (ME)
Fixed Voltage with Flag
MIC69301/3
8-Lead ePad SOIC (ME)
Adjustable Voltage
GND
FLG
OUT
GND
IN
EN
MIC69301/2
5-Lead S-PAK (R)
Fixed Voltage with Flag
MIC69301/2
5-Lead S-PAK (R)
Adjustable Voltage
5
4
3
2
1
5
4
3
2
1
TAB
TAB
5
4
3
2
1
MIC69301/2
5-Lead TO-263 (U)
Fixed Voltage with Flag
8 FLG
GND
1
7 ADJ
EN
2
3
6 OUT
IN
3
6 OUT
4
5 OUT
IN
4
5 OUT
EP
8 FLG
EP
7 SNS
MIC69303
12-Lead 4 mm x 4 mm DFN (ML)
Adjustable Voltage with Flag
GND
1
12 FLG
NC
2
11 ADJ
EN
3
IN 4
DS20006625A-page 2
10 NC
ePad
9 OUT
IN
5
8 NC
IN
6
7 OUT
2021 Microchip Technology Inc. and its subsidiaries
MIC69301/2/3
Functional Block Diagrams
MIC69302/3 ADJUSTABLE BLOCK DIAGRAM
IN
OUT
ENABLE
EN
0.5V
VREF
ADJ
GND
MIC69301 FIXED BLOCK DIAGRAM
IN
OUT
ENABLE
EN
0.5V
VREF
50mV
FLG
VREF
GND
2021 Microchip Technology Inc. and its subsidiaries
DS20006625A-page 3
MIC69301/2/3
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
Supply Input Voltage (VIN to GND)............................................................................................................... –0.3V to +6V
Logic Input Voltage (VEN to GND) ................................................................................................... –0.3V to (VIN + 0.3V)
Fault Flag (VFLG to GND) ............................................................................................................................. –0.3V to +6V
ESD Rating (Note 1)...................................................................................................................................................2 kV
Operating Ratings ††
Supply Voltage (VIN)................................................................................................................................ +1.65V to +5.5V
Enable Input Voltage (VEN) ................................................................................................................................ 0V to VIN
Power Dissipation (Note 2).....................................................................................................................Internally Limited
† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at those or any other conditions above those indicated
in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended
periods may affect device reliability.
†† Notice: The device is not guaranteed to function outside its operating ratings.
Note 1: Specification for packaged product only.
2: The maximum allowable power dissipation of any TA (ambient temperature) is PD(MAX) = (TJ(MAX) – TA) ÷
θJA. Exceeding the maximum allowable power dissipation will result in excessive die temperature, and the
regulator will go into thermal shutdown.
ELECTRICAL CHARACTERISTICS
Electrical Characteristics: TA = +25°C with VIN = VOUT + 1V; bold values indicate –40°C < TJ < +125°C;
IOUT = 10 mA; COUT = 10 µF ceramic, unless noted. Note 1
Parameter
Sym.
Min.
Typ.
Max.
Units
Conditions
VIN
1.65
—
5.5
V
—
1.2
5
mA
IOUT = 10 mA
—
12
30
mA
IOUT = 1.5 A
—
32
75
mA
IOUT = 3 A
—
—
1
—
µA
VEN = 0V; VIN = 2.0V; VOUT = 0V
VOUT
VR –
2.0
—
VR +
2.0
V
Note 2
Load Regulation
—
—
±0.3
—
%
IOUT = 10 mA to 3A
Line Regulation (Note 3)
—
—
0.2
0.3
%/V
Power Input Supply
Input Voltage Range
Ground Pin Current
Ground Pin Current in
Shutdown
IGND
—
Output Voltage
Output Voltage (Fixed)
Note 1:
2:
3:
4:
VIN = (VOUT + 1.0V) to 5.5V
Specification for packaged product only.
VR is the nominal regulator output voltage when the input voltage is VIN = VOUT + 1V or VIN = 1.65V
(whichever is greater).
Minimum input for line regulation test is set to VOUT + 1V relative to the highest output voltage.
Dropout voltage is defined as the input-to-output differential at which the output voltage drops 2% below
its nominal value measured at 1V differential. For outputs below 1.65V, dropout voltage is considered the
input-to-output voltage differential with the minimum input voltage of 1.65V. Minimum input operating voltage is 1.65V.
DS20006625A-page 4
2021 Microchip Technology Inc. and its subsidiaries
MIC69301/2/3
ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Characteristics: TA = +25°C with VIN = VOUT + 1V; bold values indicate –40°C < TJ < +125°C;
IOUT = 10 mA; COUT = 10 µF ceramic, unless noted. Note 1
Parameter
Sym.
Min.
Typ.
Max.
Units
Conditions
Feedback Reference Voltage
(ADJ Pin)
—
0.490
0.5
0.510
V
±2.0%
Feedback Bias Current
—
—
0.25
1.0
µA
VADJ = 0.5V
ILIM
3.3
5.2
—
A
VOUT = 0V
VIN –
VOUT
—
200
300
mV
IOUT = 1.5A
—
275
500
mV
IOUT = 3A
0.8
0.57
—
—
—
0.2
—
0.0
—
—
7.0
—
Reference (Adjustable)
Current Limit
Current Limit
Power Dropout Voltage
Dropout Voltage (Note 4)
Enable Input
V
Regulator Enabled
Enable Input Threshold
—
Enable Pin Bias Current
—
Turn-On Time
tON
—
10
150
µs
90% of typical VOUT; VEN = VIN
Fault Threshold Voltage
—
7.5
10
14
%
% of VOUT below nominal output
(VOUT Falling)
Fault Hysteresis
—
—
2.0
—
%
—
Fault Output Low Voltage
—
—
150
—
mV
IFLG = 250 μA (sinking), VEN = 0V
Fault Leakage Current
—
—
0.05
—
µA
VFLG = 5.0V; VEN = 0V
Overtemperature Shutdown
—
—
165
—
°C
TJ rising
Overtemperature Shutdown
Hysteresis
—
—
10
—
°C
—
µA
Regulator Shut Down
VEN ≤ 0.2V (Regulator Shutdown)
VEN ≥ 0.8V (Regulator Enabled)
Fault Output
Thermal Protection
Note 1:
2:
3:
4:
Specification for packaged product only.
VR is the nominal regulator output voltage when the input voltage is VIN = VOUT + 1V or VIN = 1.65V
(whichever is greater).
Minimum input for line regulation test is set to VOUT + 1V relative to the highest output voltage.
Dropout voltage is defined as the input-to-output differential at which the output voltage drops 2% below
its nominal value measured at 1V differential. For outputs below 1.65V, dropout voltage is considered the
input-to-output voltage differential with the minimum input voltage of 1.65V. Minimum input operating voltage is 1.65V.
2021 Microchip Technology Inc. and its subsidiaries
DS20006625A-page 5
MIC69301/2/3
TEMPERATURE SPECIFICATIONS
Parameters
Sym.
Min.
Typ.
Max.
Units
TJ
–40
—
+125
°C
Conditions
Temperature Ranges
Operating Junction Temperature
Range
Note 1
TS
–65
—
+125
°C
—
TLEAD
—
—
+260
°C
—
θJC
—
2
—
°C/W
—
Thermal Resistance, S-PAK 5-Ld
θJA
—
38
—
°C/W
—
Thermal Resistance, TO-263 5-Ld
θJC
—
2
—
°C/W
—
Thermal Resistance, ePad SOIC 8-Ld
θJA
—
41
—
°C/W
—
Thermal Resistance, DFN 12-Ld
θJA
—
60
—
°C/W
—
Storage Temperature Range
Lead Temperature
Package Thermal Resistance
Thermal Resistance, S-PAK 5-Ld
Note 1:
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.
DS20006625A-page 6
2021 Microchip Technology Inc. and its subsidiaries
MIC69301/2/3
2.0
Note:
TYPICAL PERFORMANCE CURVES
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
400
DROPOUT VOLTAGE (mV)
70
350
60
300
50
250
dB
40
200
30
150
20
VIN = 3.3V
10 VOUT = 1.8V
IOUT = 0.5A
0
100 1K 10K 100K
10
FREQUENCY (Hz)
FIGURE 2-1:
Ratio.
IOUT = 1.5A
100
VOUT = 1.2V
COUT = 10μF
0
-40 -20 0 20 40 60 80 100 120
TEMPERATURE (°C)
50
1M
Power Supply Rejection
FIGURE 2-4:
Temperature.
300
Dropout Voltage vs.
35
GROUND CURRENT (mA)
DROPOUT VOLTAGE (mV)
IOUT = 3A
30
250
25
200
20
150
15
100
10
50
FIGURE 2-2:
Current.
0.5 1.0 1.5 2.0 2.5
OUTPUT CURRENT (A)
OUTPUT VOLTAGE (V)
40
35
30
500mA
1.5A
3A
0.4
0
0
FIGURE 2-3:
Voltage.
3
Ground Current vs. Output
IOUT = 3A
25
20
0.6
0.2
0.5 1.0 1.5 2.0 2.5
OUTPUT CURRENT (A)
45
1.2
0.8
FIGURE 2-5:
Current.
VIN = 2.2V
VOUT = 1.2V
COUT = 10μF
50
1.4
1.0
0
0
3.0
Dropout Voltage vs. Output
5
GROUND CURRENT (mA)
0
0
VOUT = 1.2V
COUT = 10μF
VOUT = 1.2V
COUT = 10μF
0.5
1.0
1.5
2.0
INPUT VOLTAGE (V)
2.5
Dropout Voltage vs. Input
2021 Microchip Technology Inc. and its subsidiaries
15
IOUT = 1.5A
10 VIN = 2.2V
5 VOUT = 1.2V
COUT = 10μF
0
-40 -20 0 20 40 60 80 100 120
TEMPERATURE (°C)
FIGURE 2-6:
Temperature.
Ground Current vs.
DS20006625A-page 7
MIC69301/2/3
1.220
1.0
0.9
OUTPUT VOLTAGE (V)
1.215
0.8
0.7
1.210
1.205
0.6
0.5
0.4
1.200
1.195
VIN = 2.2V
VOUT = 1.2V
IOUT = 10mA
1.185
COUT = 10μF
1.180
-40 -20 0 20 40 60 80 100 120
TEMPERATURE (°C)
FIGURE 2-10:
Temperature.
Output Voltage vs.
OFF
0.3 V = 2.2V
IN
0.2 VOUT = 1.2V
I
0.1 OUT = 100mA
COUT = 10μF
0
20 40 60 80
TEMPERATURE (°C)
1.190
FIGURE 2-7:
Temperature.
ON
Enable Threshold vs.
7
5
4
3
2
VIN = 2.2V
VOUT = 1.2V
COUT = 10μF
0
-40 -20 0 20 40 60 80 100 120
TEMPERATURE (°C)
1
FIGURE 2-8:
Temperature.
VOUT = 1.8V
COUT = 10μF
CIN = 10μF
IOUT = 1.7A
Time (400μs/div)
FIGURE 2-11:
Line Transient.
OUTPUT VOLTAGE
(10mV/div)
Current Limit vs.
1.300
1.275
OUTPUT VOLTAGE (V)
OUTPUT VOLTAGE
(20mV/div)
CURRENT LIMIT (A)
INPUT VOLTAGE
(2V/div)
6
1.250
1.225
1.200
1.150
VIN = 2.2V
VOUT = 1.2V
COUT = 10μF
1.125
1.100
0
FIGURE 2-9:
0.5 1.0 1.5 2.0 2.5
OUTPUT CURRENT (A)
DS20006625A-page 8
Load Regulation.
3.0
OUTPUT CURRENT
(500mA/div)
1.175
FIGURE 2-12:
VIN = 5V
VOUT = 1.8V
COUT = 10μF
IOUT = 30mA - 1A
Time (200μs/div)
Load Transient.
2021 Microchip Technology Inc. and its subsidiaries
OUTPUT VOLTAGE
(500mV/div)
ENABLE
(2V/div)
MIC69301/2/3
FIGURE 2-13:
VIN = 5V
VOUT = 1.8V
IOUT = 1.7A
Time (2μs/div)
Enable Turn-On.
2021 Microchip Technology Inc. and its subsidiaries
DS20006625A-page 9
MIC69301/2/3
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
Pin Number Pin Number
Pin Number Pin Number Pin Number
(Adj.)
(Fixed)
(Fixed)
(Adj.)
(Adj.)
S-PAK,
S-PAK,
ePad SOIC ePad SOIC ePad DFN
TO-263
TO-263
Pin Name
Description
1
1
2
2
3
EN
Enable (Input): CMOS compatible input. Logic high =
enable, logic low = shutdown.
Do not leave pin floating.
2
2
3, 4
3, 4
4, 5, 6
IN
Input voltage that supplies current to the output power
device.
3, TAB
3, TAB
1
1
1
GND
Ground (TAB is connected to
ground on S-PAK and
TO-263).
4
4
5, 6
5, 6
7, 9
OUT
Regulator Output.
—
—
7
—
—
SNS
Output voltage sense. Connect to output voltage.
—
5
—
7
11
ADJ
Adjustable regulator feedback
input. Connect to resistor voltage divider.
5
—
8
8
12
FLG
Error Flag (Output): Open collector output. Active-low indicates an output fault condition.
—
—
EP
EP
EP
EP
Exposed pad. Connect to
GND.
—
—
—
—
2, 8, 10
NC
No Connect. Not internally
connected.
DS20006625A-page 10
2021 Microchip Technology Inc. and its subsidiaries
MIC69301/2/3
4.0
FUNCTIONAL DESCRIPTION
4.4
Minimum Load Current
The MIC69301/2/3 are ultra-high performance low
dropout linear regulators designed for high current
applications that require a fast transient response. It
utilizes a single input supply and has a very low dropout
voltage that is perfect for low-voltage DC-to-DC
conversions. The MIC69301/2/3 require a minimum
number of external components.
The MIC69301/2/3 regulator is specified between finite
loads. If the output current is too small, leakage
currents dominate and the output voltage rises. A
10 mA minimum load current is necessary for proper
operation.
The MIC69301/2/3 regulators are fully protected from
damage due to fault conditions offering constant
current limiting and thermal shutdown.
The MIC69302 and MIC69303 adjustable version
allows programming the output voltage anywhere
between 0.5V and 5.0V with two resistors. The resistor
value between VOUT and the adjust pin should not
exceed 10 kΩ. Larger values can cause instability. The
resistor values are calculated by:
4.1
Input Supply Voltage
VIN provides a high current to the collector of the pass
transistor. The minimum input voltage is 1.65V,
allowing conversion from low voltage supplies.
4.2
X7R dielectric ceramic capacitors are recommended
because of their temperature performance. X7R-type
capacitors change capacitance by only 15% over their
operating temperature range and are the most stable
type of ceramic capacitors. Z5U and Y5V dielectric
capacitors change value by as much as 50% and 60%,
respectively over their operating temperature ranges.
To use a ceramic chip capacitor with Y5V dielectric the
value must be much higher than an X7R ceramic or a
tantalum capacitor to ensure the same capacitance
value over the operating temperature range. Tantalum
capacitors have a very stable dielectric (10% over their
operating temperature range) and can also be used
with this device.
Input Capacitor
An input capacitor of 1 µF or greater is recommended
when the device is more than 4 inches away from the
bulk supply capacitance or when the supply is a battery.
Small, surface mount, ceramic chip capacitors can be
used for the bypassing. The capacitor should be placed
within 1 inch of the device for optimal performance.
Larger values will help to improve ripple rejection by
bypassing the input to the regulator further improving
the integrity of the output voltage.
2021 Microchip Technology Inc. and its subsidiaries
Adjustable Regulator Design
EQUATION 4-1:
Output Capacitor
The MIC69301/2/3 require a minimum of output
capacitance to maintain stability. However, proper
capacitor selection is important to ensure desired
transient response. The MIC69301/2/3 are specifically
designed to be stable with low-ESR ceramic chip
capacitors. A 10 µF ceramic chip capacitor should
satisfy most applications. Output capacitance can be
increased without bound. See the Typical Performance
Curves for examples of load transient response.
4.3
4.5
V OUT = 0.5 R1
------- + 1
R2
Where:
VOUT = Desired output voltage.
4.6
Enable
The fixed output voltage versions of the MIC69301
feature an active-high enable input (EN) that allows
on-off control of the regulator. Current drain reduces to
near zero when the device is shutdown, with only
microamperes of leakage current. EN may be directly
tied to VIN and pulled up to the maximum supply
voltage.
4.7
Thermal Design
Linear regulators are simple to use. The most
complicated design parameters to consider are thermal
characteristics. Thermal design requires the following
application-specific parameters:
•
•
•
•
•
Maximum ambient temperature (TA)
Output current (IOUT)
Output voltage (VOUT)
Input voltage (VIN)
Ground current (IGND)
First, calculate the power dissipation of the regulator
from these numbers and the device parameters from
this data sheet.
EQUATION 4-2:
P D = V IN – V OUT I OUT + V IN I GND
DS20006625A-page 11
MIC69301/2/3
The ground current is approximated by using numbers
from the Electrical Characteristics table or Typical
Performance Curves section. The heat sink thermal
resistance is then determined with this formula:
EQUATION 4-3:
T J MAX – T A
SA = -------------------------------- – JC + CS
PD
Where:
TJ(MAX) ≤ 125°C.
θCS = Between 0°C/W and 2°C/W.
The heat sink may be significantly reduced in
applications where the minimum input voltage is known
and is large compared with the dropout voltage. Use a
series input resistor to drop excessive voltage and
distribute the heat between this resistor and the
regulator. The low dropout properties of Microchip
Super ßeta PNP regulators allow significant reductions
in regulator power dissipation and the associated heat
sink without compromising performance. When this
technique is employed, a capacitor of at least 1.0 µF is
needed directly between the input and regulator
ground.
Refer to Application Note 9 for further details and
examples on thermal design and heat sink
applications.
DS20006625A-page 12
2021 Microchip Technology Inc. and its subsidiaries
MIC69301/2/3
5.0
PACKAGING INFORMATION
5.1
Package Marking Information
5-Lead Adj. TO-263*
Example
69302
WU
6524P
XXXXX
XX
WNNNP
5-Lead Fixed TO-263*
Example
69301
-1.2WU
5246P
XXXXX
-X.XXX
WNNNP
5-Lead Adj. S-PAK*
Example
69302
WR
6524 USA
XXXXX
XX
WNNN XXX
5-Lead Fixed S-PAK*
8-Lead Adj. SOIC*
Example
XXX
XXXXXXXX
WNNN
MIC
69303YME
3719
8-Lead Fixed SOIC*
Example
XXXXX
-X.XXXX
WNNN
12-Lead DFN*
69301
-1.2YME
9371
Example
Y
69303
6270
X
XXXXX
WNNN
Example
69301
-1.2WR
5246 USA
XXXXX
-X.XXX
WNNN XXX
Legend: XX...X
Y
YY
WW
NNN
e3
*
Product code or customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle
mark).
Note:
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information. Package may or may not include
the corporate logo.
Underbar (_) and/or Overbar (‾) symbol may not be to scale.
2021 Microchip Technology Inc. and its subsidiaries
DS20006625A-page 13
MIC69301/2/3
5-Lead TO-263 Package Outline and Recommended Land Pattern
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
DS20006625A-page 14
2021 Microchip Technology Inc. and its subsidiaries
MIC69301/2/3
5-Lead S-PAK Package Outline and Recommended Land Pattern
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
2021 Microchip Technology Inc. and its subsidiaries
DS20006625A-page 15
MIC69301/2/3
8-Lead SOIC Package Outline and Recommended Land Pattern
8-Lead Small Outline Integrated Circuit Package (EQA) - 3.90 mm (1.50 In) Body [SOIC]
With 3.10x2.41 mm Exposed Pad
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2X
8X
0.10 C
0.09 C A-B
D
A
D
SEE
DETAIL A
2X
0.09 C D
E
2
E1
2
E1
E
NOTE 1
h
2X
0.18 C
e
h
B
A1
TOP VIEW
A2
0.10 C
A
SEATING
C
PLANE
END VIEW
SIDE VIEW
D1
E2
BOTTOM VIEW
Microchip Technology Drawing C04-1136 Rev A Sheet 1 of 2
DS20006625A-page 16
2021 Microchip Technology Inc. and its subsidiaries
MIC69301/2/3
8-Lead Small Outline Integrated Circuit Package (EQA) - 3.90 mm (1.50 In) Body [SOIC]
With 3.10x2.41 mm Exposed Pad
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
R1
R2
C
C
SEATING
PLANE
ڧ
L
(L1)
DETAIL A
Units
Dimension Limits
Number of Terminals
N
e
Pitch
A
Overall Height
Standoff
A1
Molded Package Thickness
A2
Overall Length
D
Exposed Pad Length
D1
E
Overall Width
Molded Package Width
E1
E2
Exposed Pad Width
b
Terminal Width
c
Lead Thickness
L
Terminal Length
Terminal-to-Exposed-Pad
L1
Foot Angle
ڧ
Lead Bend Radius
R1
Terminal Length
R2
Mold Draft Angle
Mold Draft Angle
MIN
1.43
0.00
1.25
-
0.35
0.19
0.41
0°
0.07
0.07
5°
5°
MILLIMETERS
NOM
8
1.27 BSC
1.55
0.05
4.89 BSC
3.10
6.02 BSC
3.90 BSC
2.41
0.41
0.20
0.64
1.04 REF
5°
-
MAX
1.68
0.10
-
0.49
0.25
0.89
8°
15°
15°
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-1136 Rev A Sheet 2 of 2
2021 Microchip Technology Inc. and its subsidiaries
DS20006625A-page 17
MIC69301/2/3
8-Lead Small Outline Integrated Circuit Package (EQA) - 3.90 mm (1.50 In) Body [SOIC]
With 3.10x2.41 mm Exposed Pad
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
X2
EV
8
SILK SCREEN
ØV
C
Y2
EV
G1
Y1
1
2
X1
G2
E
RECOMMENDED LAND PATTERN
Units
Dimension Limits
Contact Pitch
E
Optional Center Pad Width
X2
Optional Center Pad Length
Y2
Contact Pad Spacing
C
Contact Pad Width (X8)
X1
Contact Pad Length (X8)
Y1
Contact Pad to Center Pad (X8)
G1
Contact Pad to Contact Pad (X6)
G2
Thermal Via Diameter
V
Thermal Via Pitch
EV
MIN
MILLIMETERS
NOM
1.27 BSC
MAX
3.15
2.45
5.40
0.60
1.60
0.68
0.67
0.30
1.00
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
2. For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
Microchip Technology Drawing C04-1136 Rev A
DS20006625A-page 18
2021 Microchip Technology Inc. and its subsidiaries
MIC69301/2/3
12-Lead DFN 4 mm x 4 mm Package Outline and Recommended Land Pattern
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
2021 Microchip Technology Inc. and its subsidiaries
DS20006625A-page 19
MIC69301/2/3
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
DS20006625A-page 20
2021 Microchip Technology Inc. and its subsidiaries
MIC69301/2/3
APPENDIX A:
REVISION HISTORY
Revision A (December 2021)
• Converted Micrel document MIC69301/2/3 to
Microchip data sheet template DS20006625A.
• Minor grammatical text changes throughout.
2021 Microchip Technology Inc. and its subsidiaries
DS20006625A-page 21
MIC69301/2/3
NOTES:
DS20006625A-page 22
2021 Microchip Technology Inc. and its subsidiaries
MIC69301/2/3
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
Device
-X.X
X
XX
-XX
Part No.
Output
Voltage
Junction
Temp. Range
Package
Media Type
MIC69301:
Device:
MIC69302:
MIC69303:
Single Supply VIN, Low VIN, Low VOUT, 3A
LDO with Error Flag Output
Single Supply VIN, Low VIN, Low VOUT, 3A
LDO
Single Supply VIN, Low VIN, Low VOUT, 3A
LDO with Error Flag Output
Examples:
a) MIC69301-1.2WU:
MIC69301, 1.2V Output
Voltage, –40°C to +125°C
Temperature Range,
5-Lead TO-263, 50/Tube
b) MIC69301-1.2WU-TR: MIC69301, 1.2V Output
Voltage, –40°C to +125°C
Temperature Range,
5-Lead TO-263, 750/Reel
c) MIC69301-1.2WR:
MIC69301, 1.2V Output
Voltage, –40°C to +125°C
Temperature Range,
5-Lead S-PAK, 48/Tube
Output Voltage:
= Adjustable
1.2 =
1.2V
Junction
Temperature
Range:
d) MIC69301-1.2WR-TR: MIC69301, 1.2V Output
Voltage, –40°C to +125°C
Temperature Range,
5-Lead S-PAK, 750/Reel
Y
=
–40°C to +125°C, RoHS-Compliant
Package:
WU
WR
ME
ML
=
=
=
=
5-Lead TO-263
5-Lead S-PAK
8-Lead ePad SOIC
12-Lead 4 mm x 4 mm DFN
e) MIC69301-1.2YME-TR:MIC69301, 1.2V Output
Voltage, –40°C to +125°C
Temperature Range,
8-Lead SOIC, 2,500/Reel
Media Type:
=
=
TR =
TR =
TR =
48/Tube (WR Package option)
50/Tube (WU Package option)
750/Reel (WR & WU Package options)
2,500/Reel (ME Package option)
5,000/Reel (ML Package option)
f) MIC69302WU:
MIC69302, Adjustable Output
Voltage, –40°C to +125°C
Temperature Range,
5-Lead TO-263, 50/Tube
g) MIC69302WU-TR:
MIC69302, Adjustable Output
Voltage, –40°C to +125°C
Temperature Range,
5-Lead TO-263, 750/Reel
h) MIC69302WR:
MIC69302, Adjustable Output
Voltage, –40°C to +125°C
Temperature Range,
5-Lead S-PAK, 48/Tube
i) MIC69302WR-TR:
MIC69302, Adjustable Output
Voltage, –40°C to +125°C
Temperature Range,
5-Lead S-PAK, 750/Reel
j) MIC69303YME-TR:
MIC69303, Adjustable Output
Voltage, –40°C to +125°C
Temperature Range,
8-Lead SOIC, 2,500/Reel
k) MIC69303YML-TR:
MIC69303, Adjustable Output
Voltage, –40°C to +125°C
Temperature Range,
12-Lead DFN, 5,000/Reel
Note 1:
2021 Microchip Technology Inc. and its subsidiaries
Tape and Reel identifier only appears in the
catalog part number description. This identifier is
used for ordering purposes and is not printed on
the device package. Check with your Microchip
Sales Office for package availability with the
Tape and Reel option.
DS20006625A-page 23
MIC69301/2/3
NOTES:
DS20006625A-page 24
2021 Microchip Technology Inc. and its subsidiaries
Note the following details of the code protection feature on Microchip products:
•
Microchip products meet the specifications contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is secure when used in the intended manner, within operating specifications, and
under normal conditions.
•
Microchip values and aggressively protects its intellectual property rights. Attempts to breach the code protection features of
Microchip product is strictly prohibited and may violate the Digital Millennium Copyright Act.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code. Code protection does not
mean that we are guaranteeing the product is “unbreakable”. Code protection is constantly evolving. Microchip is committed to
continuously improving the code protection features of our products.
This publication and the information herein may be used only
with Microchip products, including to design, test, and integrate
Microchip products with your application. Use of this information in any other manner violates these terms. Information
regarding device applications is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your
specifications. Contact your local Microchip sales office for
additional support or, obtain additional support at https://
www.microchip.com/en-us/support/design-help/client-supportservices.
THIS INFORMATION IS PROVIDED BY MICROCHIP "AS IS".
MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED,
WRITTEN OR ORAL, STATUTORY OR OTHERWISE,
RELATED TO THE INFORMATION INCLUDING BUT NOT
LIMITED TO ANY IMPLIED WARRANTIES OF NONINFRINGEMENT, MERCHANTABILITY, AND FITNESS FOR A
PARTICULAR PURPOSE, OR WARRANTIES RELATED TO
ITS CONDITION, QUALITY, OR PERFORMANCE.
IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT, SPECIAL, PUNITIVE, INCIDENTAL, OR CONSEQUENTIAL LOSS, DAMAGE, COST, OR EXPENSE OF ANY
KIND WHATSOEVER RELATED TO THE INFORMATION OR
ITS USE, HOWEVER CAUSED, EVEN IF MICROCHIP HAS
BEEN ADVISED OF THE POSSIBILITY OR THE DAMAGES
ARE FORESEEABLE. TO THE FULLEST EXTENT
ALLOWED BY LAW, MICROCHIP'S TOTAL LIABILITY ON
ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION
OR ITS USE WILL NOT EXCEED THE AMOUNT OF FEES, IF
ANY, THAT YOU HAVE PAID DIRECTLY TO MICROCHIP
FOR THE INFORMATION.
Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to
defend, indemnify and hold harmless Microchip from any and
all damages, claims, suits, or expenses resulting from such
use. No licenses are conveyed, implicitly or otherwise, under
any Microchip intellectual property rights unless otherwise
stated.
Trademarks
The Microchip name and logo, the Microchip logo, Adaptec,
AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud,
CryptoMemory, CryptoRF, dsPIC, flexPWR, HELDO, IGLOO,
JukeBlox, KeeLoq, Kleer, LANCheck, LinkMD, maXStylus,
maXTouch, MediaLB, megaAVR, Microsemi, Microsemi logo,
MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower,
PICSTART, PIC32 logo, PolarFire, Prochip Designer, QTouch,
SAM-BA, SenGenuity, SpyNIC, SST, SST Logo, SuperFlash,
Symmetricom, SyncServer, Tachyon, TimeSource, tinyAVR, UNI/O,
Vectron, and XMEGA are registered trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
AgileSwitch, APT, ClockWorks, The Embedded Control Solutions
Company, EtherSynch, Flashtec, Hyper Speed Control, HyperLight
Load, IntelliMOS, Libero, motorBench, mTouch, Powermite 3,
Precision Edge, ProASIC, ProASIC Plus, ProASIC Plus logo, QuietWire, SmartFusion, SyncWorld, Temux, TimeCesium, TimeHub,
TimePictra, TimeProvider, TrueTime, WinPath, and ZL are
registered trademarks of Microchip Technology Incorporated in the
U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, Augmented Switching, BlueSky,
BodyCom, CodeGuard, CryptoAuthentication, CryptoAutomotive,
CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net,
Dynamic Average Matching, DAM, ECAN, Espresso T1S,
EtherGREEN, GridTime, IdealBridge, In-Circuit Serial
Programming, ICSP, INICnet, Intelligent Paralleling, Inter-Chip
Connectivity, JitterBlocker, Knob-on-Display, maxCrypto, maxView,
memBrain, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo,
MPLIB, MPLINK, MultiTRAK, NetDetach, NVM Express, NVMe,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple
Blocker, RTAX, RTG4, SAM-ICE, Serial Quad I/O, simpleMAP,
SimpliPHY, SmartBuffer, SmartHLS, SMART-I.S., storClad, SQI,
SuperSwitcher, SuperSwitcher II, Switchtec, SynchroPHY, Total
Endurance, TSHARC, USBCheck, VariSense, VectorBlox, VeriPHY,
ViewSpan, WiperLock, XpressConnect, and ZENA are trademarks
of Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
The Adaptec logo, Frequency on Demand, Silicon Storage
Technology, Symmcom, and Trusted Time are registered
trademarks of Microchip Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology Germany
II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in
other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2021, Microchip Technology Incorporated and its subsidiaries.
All Rights Reserved.
For information regarding Microchip’s Quality Management Systems,
please visit www.microchip.com/quality.
2021 Microchip Technology Inc. and its subsidiaries
ISBN: 978-1-5224-9435-5
DS20006625A-page 25
Worldwide Sales and Service
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support
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DS20006625A-page 26
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2021 Microchip Technology Inc. and its subsidiaries
09/14/21
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