MIC860
Ultra-Low Power Op Amp
Features
General Description
•
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The MIC860 is a rail-to-rail output, operational amplifier
in the SC70 package. The MIC860 provides 4 MHz
gain-bandwidth product while consuming an incredibly
low 30 μA supply current.
5-Lead SC70 Packaging
4 MHz Gain-Bandwidth Product
30 μA Supply Current
Rail-to-Rail Output
Ground Sensing at Input Common Mode to GND
Common Mode to GND
Drives Large Capacitive Loads
Applications
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The SC70 packaging achieves significant board space
savings over devices packaged in SOT-23 or MSOP-8
packaging.
The SC70 occupies approximately half the board area
of an SOT-23 package.
Portable Equipment
Sensor Conditioning
Analog Filters
Mobile Phones
Consumer Electronics
Package Type
MIC860
5-Lead SC70 (C5)
(Top View)
IN3
V2
IN+
1
PART
IDENTIFICATION
Functional Pinout
IN3
V2
IN+
1
A32
4
OUT
5
V+
2020 Microchip Technology Inc.
4
OUT
5
V+
DS20006338A-page 1
MIC860
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
Supply Voltage (VV+ – VV–) ..................................................................................................................................... +6.0V
Differential Input Voltage (|VIN+ – VIN–|) (Note 1) .................................................................................................... +6.0V
Input Voltage (VIN+ – VIN–) ............................................................................................................... V+ + 0.3V, V– – 0.3V
Output Short-Circuit Duration ............................................................................................................................. Indefinite
ESD Rating (Note 2)...................................................................................................................................ESD Sensitive
Operating Ratings ‡
Supply Voltage (VV+ – VV–) ...................................................................................................................+2.43V to +5.25V
† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at those or any other conditions above those indicated
in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended
periods may affect device reliability.
‡ Notice: The device is not guaranteed to function outside its operating ratings. Final test on outgoing product is
performed at TA = +25°C.
Note 1: Exceeding the maximum differential input voltage will damage the input stage and degrade performance. In
particular, input bias current is likely to increase.
2: Devices are ESD sensitive. Handling precautions are recommended. Human body model, 1.5 kΩ in series
with 100 pF. Pin 4 is ESD sensitive.
DS20006338A-page 2
2020 Microchip Technology Inc.
MIC860
ELECTRICAL CHARACTERISTICS (2.7V)
Electrical Characteristics: V+ = +2.7V, V– = 0V, VCM = V+/2; RL = 500 kΩ to V+/2; TA = +25°C, unless otherwise
noted.
Parameters
Symbol
Min.
Typ.
Max.
Units
–20
–5
15
mV
–25
—
20
mV
—
20
—
μV/°C
IB
—
20
—
pA
—
Input Offset Current
IOS
—
10
—
pA
—
Input Voltage Range
VCM
1
1.8
—
V
CMRR > 60 dB,
–40°C ≤ TA ≤ +85°C
Common Mode
Rejection Ratio
CMRR
38
76
—
dB
0V < VCM < 1.35V,
–40°C ≤ TA ≤ +85°C
Power Supply
Rejection Ratio
PSRR
40
78
—
dB
Supply voltage change of 3V,
–40°C ≤ TA ≤ +85°C
50
66
—
dB
RL = 5 kΩ, VOUT = 2 VPP,
–40°C ≤ TA ≤ +85°C
66
81
—
dB
RL = 100 kΩ, VOUT = 2 VPP,
–40°C ≤ TA ≤ +85°C
76
91
—
dB
RL = 500 kΩ, VOUT = 2 VPP,
–40°C ≤ TA ≤ +85°C
V±70mV
V±34mV
—
V
RL = 5 kΩ, –40°C ≤ TA ≤ +85°C
V±2mV
V±0.7mV
—
V
RL = 500 kΩ, –40°C ≤ TA ≤
+85°C
—
V±11mV
V±50mV
mV
RL = 5 kΩ, –40°C ≤ TA ≤ +85°C
—
V±0.2mV
V±2mV
mV
RL = 500 kΩ, –40°C ≤ TA ≤
+85°C
Input Offset Voltage
Input Offset Voltage
Temp. Coefficient
VOS
Input Bias Current
Large-Signal Voltage
Gain
AVOL
Conditions
—
Maximum Output
Voltage Swing
VOUT
Minimum Output
Voltage Swing
VOUT
Gain Bandwidth
Product
GBW
—
4
—
MHz
—
Slew Rate
SR
—
3
—
V/μs
—
Short-Circuit Output
Current
ISC
4.5
6
—
mA
Source, –40°C ≤ TA ≤ +85°C
10
16
—
mA
Sink, –40°C ≤ TA ≤ +85°C
Supply Current
IS
—
30
50
μA
No Load
2020 Microchip Technology Inc.
DS20006338A-page 3
MIC860
ELECTRICAL CHARACTERISTICS (5.0V)
Electrical Characteristics: V+ = +5V, V– = 0V, VCM = V+/2; RL = 500 kΩ to V+/2; TA = +25°C, unless otherwise
noted.
Parameters
Symbol
Input Offset Voltage
VOS
Input Offset Voltage
Temp Coefficient
Min.
Typ.
Max.
Units
Conditions
–20
–5
20
mV
—
—
20
—
μV/°C
—
IB
—
20
—
pA
—
Input Offset Current
IOS
—
10
—
pA
—
Input Voltage Range
VCM
3.5
4.2
—
V
CMRR > 60 dB,
–40°C ≤ TA ≤ +85°C
Common Mode
Rejection Ratio
CMRR
44
77
—
dB
0V < VCM < 3.5V,
–40°C ≤ TA ≤ +85°C
Power Supply
Rejection Ratio
PSRR
40
79
—
dB
Supply voltage change of 1V,
–40°C ≤ TA ≤ +85°C
52
66
—
dB
RL = 5 kΩ, VOUT = 4.8 VPP,
–40°C ≤ TA ≤ +85°C
67
80
—
dB
RL = 100 kΩ, VOUT = 4.8 VPP,
–40°C ≤ TA ≤ +85°C
75
90
—
dB
RL = 500 kΩ, VOUT = 4.8 VPP,
–40°C ≤ TA ≤ +85°C
V±75mV
V±37mV
—
V
RL = 5 kΩ, –40°C ≤ TA ≤ +85°C
V±35mV
V±4mV
—
V
RL = 500 kΩ,
–40°C ≤ TA ≤ +85°C
—
V±14mV
V±40mV
mV
RL = 5 kΩ, –40°C ≤ TA ≤ +85°C
—
V±0.4mV
V±5mV
mV
RL = 500 kΩ,
–40°C ≤ TA ≤ +85°C
Input Bias Current
Large Signal Voltage
Gain
AVOL
Maximum Output
Voltage Swing
VOUT
Minimum Output
Voltage Swing
VOUT
Gain Bandwidth
Product
GBW
—
4
—
MHz
—
Slew Rate
SR
—
3
—
V/μs
—
Short-Circuit Output
Current
ISC
Supply Current
IS
15
23
—
mA
Source, –40°C ≤ TA ≤ +85°C
30
47
—
mA
Sink, –40°C ≤ TA ≤ +85°C
—
33
55
μA
No Load, –40°C ≤ TA ≤ +85°C
TEMPERATURE SPECIFICATIONS
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Temperature Ranges
Storage Temperature
TS
—
—
+150
°C
—
Ambient Temperature Range
TA
–40
—
+85
°C
—
Lead Temperature Soldering
—
—
—
+260
°C
Soldering, 5 sec.
JA
—
450
—
°C/W
Package Thermal Resistances
5-Lead SC70
DS20006338A-page 4
—
2020 Microchip Technology Inc.
MIC860
2.0
TEST CIRCUITS
20K
200K
V+
V+
0.1μF
10μF
10μF
0.1μF
10μF
20K
RF
20K
MIC860
MIC860
FET
PROBE
50
50
RF
FET
PROBE
0.1μF
0.1μF
50
10μF
FET
PROBE
V-
FIGURE 2-4:
Test Circuit 4, AV = –1.
V-
FIGURE 2-1:
FET
PROBE
Test Circuit 1, AV = 10.
V+
10 μF
20K
100μF
V+
0.1μF
10μF
50
BNC
20K
0.1 μF
INPUT
MIC860
10 μF
RF
170k
48K
FET
PROBE
0.1μF
50
10μF
RL
5K
FET
PROBE
10K
OUTPUT
50
V-
FIGURE 2-2:
10K
BNC
MIC860
Test Circuit 2, AV = 2.
0.1μF
V+
0.1μF
ALL RESISTORS:
1% METAL FILM
10μF
10μF
MIC860
V—
RF
FET
PROBE
0.1μF
50
100μF
10μF
RL
5K
FET
PROBE
FIGURE 2-5:
Test Circuit 5, Positive
Power Supply Rejection Ratio Measurement.
V-
FIGURE 2-3:
Test Circuit 3, AV = 1.
2020 Microchip Technology Inc.
DS20006338A-page 5
MIC860
Note:
TYPICAL PERFORMANCE CURVES
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
SUPPLY CURRENT (mA)
39
37
35
V + = 5V
-20
-30
31
V + = 2.7V
25
-40 -20 0 20 40 60 80 100
TEMPERATURE (°C)
Supply Current vs.
-60
-40 -20 0 20 40 60 80 100
TEMPERATURE (°C)
FIGURE 3-4:
vs. Temperature.
-4.5
V + = 2.7V
-5.5
SUPPLY CURRENT (μA)
OFFSET VOLTAGE (mV)
V + = 5V
-4
-5
25
V + = 5V
20
15
10
V + = 2.7V
5
0
-40 -20 0 20 40 60 80 100
TEMPERATURE (°C)
FIGURE 3-3:
Short-Circuit Current
(Source) vs. Temperature.
DS20006338A-page 6
37
-40°C
35
33
31 +25°C
29
27 +85°C
V + = 5V
1
1.5
2
2.5
3
SUPPLY VOLTAGE (±V)
FIGURE 3-5:
Voltage.
Supply Current vs. Supply
5
4.5
4
-40°C
3.5
3
2.5
2
+25°C
1.5
1
0.5 V + = 5V
+85°C
0
0
5
10 15 20 25 30
OUTPUT CURRENT (mA)
OUTPUT VOLTAGE (V)
SHORT CIRCUIT CURRENT (mA)
Offset Voltage vs.
39
25
0.5
-6
-40 -20 0 20 40 60 80 100
TEMPERATURE (°C)
FIGURE 3-2:
Temperature.
Short-Circuit Current (Sink)
41
-3
-3.5
V + = 5V
-40
-50
27
FIGURE 3-1:
Temperature.
V + = 2.7V
-10
33
29
0
SHORT CIRCUIT CURRENT (mA)
3.0
FIGURE 3-6:
Current (Source).
Output Voltage vs. Output
2020 Microchip Technology Inc.
MIC860
2.5
6
OUTPUT VOLTAGE (V)
5
-40°C
OFFSET VOLTAGE (mV)
+85°C
+25°C
4
1.5
3
2
1
-40°C
+25°C
+85°C
0.5
1
FIGURE 3-7:
Current (Sink).
V + = 5V
10 20 30 40 50
OUTPUT CURRENT (mA)
0
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5
COMMON-MODE VOLTAGE (V)
60
Output Voltage vs. Output
30
+25°C
15
+85°C
10
5
0
0
V + = 5V
0.5
1
1.5
2
2.5
SUPPLY VOLTAGE (±V)
3
FIGURE 3-8:
Short-Circuit Current vs.
Supply Voltage (Source).
OUTPUT CURRENT (mA)
60
OUTPUT VOLTAGE (V)
+85°C
20
10
V + = 5V
0.5
1
1.5
2
2.5
SUPPLY VOLTAGE (±V)
3
FIGURE 3-9:
Short-Circuit Current vs.
Supply Voltage (Sink).
2020 Microchip Technology Inc.
Offset Voltage vs. Common
4.5
+25°C
30
0
0
FIGURE 3-11:
Mode Voltage.
-40°C
50
40
Offset Voltage vs. Common
2.2
2.0
1.8
-40°C
1.6
1.4
1.2
+25°C
1.0
0.8
+85°C
0.6
0.4
0.2 V + = 2.7V
0
0
0.54 1.08 1.62 2.16 2.7
COMMON-MODE VOLTAGE (V)
-40°C
25
20
FIGURE 3-10:
Mode Voltage.
OFFSET VOLTAGE (mV)
0
0
OUTPUT CURRENT (mA)
V + = 5V
2
4
3.5
3
2.5
V + = 5V
2
1.5
1
0.5
0
V + = 2.7V
-0.5
0.1
1
10
100 1000 10000
RESISTIVE LOAD (k)
FIGURE 3-12:
Output Voltage Swing vs.
Resistive Load (Sink).
DS20006338A-page 7
MIC860
FIGURE 3-13:
Output Voltage Swing vs.
Resistive Load (Source).
100
VCC = 5.0V
VCC = 2.7V
Gain Frequency Response.
25
225
20
15
180
135
10
5
90
45
0
-5
0
-45
VCC = 5V
-10 R = 5k
L
-15 C = 2pF
L
-20 A = 1
V
-25
FIGURE 3-14:
Resistive Load.
Open Loop Gain vs.
225
180
135
90
45
10
5
90
45
0
-45
0
-5
0
-45
40
30
180
135
20
10
0
-10
-180
-225
1x107
2x107
1x106
-90
-135
1x105
1x104
DS20006338A-page 8
Unity Gain Frequency
20
15
225
FIGURE 3-15:
Margin.
-180
-225
25
50
VCC = 5V
-20 A = 10
V
-30 R = 1M
L
-40 C = 2pF
L
-50
FIGURE 3-17:
Response.
1x105
10
100
1000 10000
5(6,67,9(/2$' N
-90
-135
Gain Bandwidth and Phase
VCC = 2.7V
-10 R = 5k
L
-15 C = 2pF
L
-20 A = 1
V
-25
FIGURE 3-18:
Response.
1x105
60
1
FIGURE 3-16:
-180
-225
-90
-135
-180
-225
1x107
2x107
80
-90
-135
1x107
2x107
1
10
100 1000 10000
RESISTIVE LOAD (k)
VCC = 5V
-10 A = 2
V
-15 C = 2pF
L
-20 R = 5k
L
-25
1x104
-0.5
0.1
0
-45
1x107
2x107
0.5
0
-5
1x106
1.5
90
45
1x106
V + = 2.7V
10
5
1x106
2.5
180
135
1x105
3.5
225
20
15
1x104
V + = 5V
4.5
25
1x104
OUTPUT VOLTAGE (V)
5.5
Unity Gain Frequency
2020 Microchip Technology Inc.
MIC860
4
AV = 1
V+ = 2.7V
CL = 2 pF
RL N
VCC = 5.0V
3.5
3
2.5
2 VCC = 2.7V
OUTPUT
(50mV/div)
1.5
Note: To drive
capacitive load,
a 500 series
resistor would
help stablize
the circuit
1
0.5
0
1
10
100
1000
CAPACITIVE LOAD (pF)
FIGURE 3-19:
Capacitive Load.
Gain Bandwidth vs.
TIME (500ns/div)
FIGURE 3-22:
Circuit 3: AV = 1.
Small Signal Response Test
90
AV = 1
V+ = 5V
CL = 2 pF
RL N
80
70
60
50
40
OUTPUT
(50mV/div)
30
20
1x106
1x105
1x104
1x103
1x102
1x100
0
1x101
10 VCC = 2.7V
FREQUENCY (Hz)
FIGURE 3-20:
TIME (500ns/div)
PSRR vs. Frequency.
FIGURE 3-23:
Circuit 3: AV = 1.
Small Signal Response Test
90
AV = 1
V+ = 2.7V
CL = 50pF
RL N
80
70
60
50
40
OUTPUT
(50mV/div)
30
20
1x106
1x105
1x104
1x103
1x102
1x100
0
1x101
10 VCC = 5V
FREQUENCY (Hz)
FIGURE 3-21:
PSRR vs. Frequency.
2020 Microchip Technology Inc.
TIME (500ns/div)
FIGURE 3-24:
Circuit 3: AV = 1.
Small Signal Response Test
DS20006338A-page 9
MIC860
AV = 1
V+ = 5V
CL = 50pF
RL N
AV = 1
V+ = 2.7V
CL = 2pF
RL 0
OUTPUT
(50mV/div)
OUTPUT
(50mV/div)
TIME (500ns/div)
FIGURE 3-25:
Circuit 3: AV = 1.
Small Signal Response Test
TIME (500ns/div)
FIGURE 3-28:
Circuit 3: AV = 1.
AV = 1
V+ = 2.7V
CL = 50pF
RL
Small Signal Response Test
V+
OUTPUT
(50mV/div)
RL
V—
CL
TIME (500ns/div)
FIGURE 3-26:
Circuit 3: AV = 1.
Small Signal Response Test
FIGURE 3-29:
the Output.
AV = 1
V+ = 5V
CL = 50pF
RL
AV = -1
V+ = 2.7V
CL = 2pF
RL 0
OUTPUT
(50mV/div)
OUTPUT
(50mV/div)
TIME (500ns/div)
FIGURE 3-27:
Circuit 3: AV = 1.
DS20006338A-page 10
Connection of RL and CL to
Small Signal Response Test
TIME (500ns/div)
FIGURE 3-30:
Circuit 4: AV = –1.
Small Signal Response Test
2020 Microchip Technology Inc.
MIC860
OUTPUT
2V/div
AV = -1
V+ = 2.7V
CL = 2pF
RL N
OUTPUT
(50mV/div)
AV = 2
V+ = 5V
CL = 2pF
RL = 1MΩ
TIME 250μs/div
TIME (500ns/div)
FIGURE 3-31:
Circuit 4: AV = –1.
Small Signal Response Test
FIGURE 3-34:
Rail-to-Rail Output
Operation Test Circuit 2: AV = 2.
AV = -1
V+ = 2.7V
CL = 2pF
RL 0
OUTPUT
(50mV/div)
OUTPUT
(1V/div)
TIME (250μs/div)
TIME (500ns/div)
FIGURE 3-32:
Circuit 4: AV = –1.
Small Signal Response Test
AV = 2
V+ = 2.7V
CL = 2 pF
RL N
FIGURE 3-35:
Rail-to-Rail Output
Operation Test Circuit 2: AV = 2.
AV = -1
V+ = 5V
CL = 2pF
RL N
OUTPUT
(50mV/div)
OUTPUT
(2V/div)
TIME (500ns/div)
FIGURE 3-33:
Circuit 4: AV = –1.
Small Signal Response Test
2020 Microchip Technology Inc.
AV = 2
V+ = 5V
CL = 2 pF
RL N
TIME (250μs/div)
FIGURE 3-36:
Rail-to-Rail Output
Operation Test Circuit 2: AV = 2.
DS20006338A-page 11
MIC860
¨9P-P = 5V
OUTPUT
(1V/div)
AV = 2
V+ = 5V
CL = 2 pF
RL 0
TIME (250μs/div)
FIGURE 3-37:
Rail-to-Rail Output
Operation Test Circuit 2: AV = 2.
AV = 1
V+ = 5V
CL = 2pF
RL N
¨V = 2.84V
¨t = 700ns
OUTPUT
(50mV/div)
Rise Slew Rate = 4.1V/μs
Fall Slew Rate = 2.9V/μs
TIME (5μs/div)
FIGURE 3-38:
Large Signal Pulse
Response Test Circuit 3: AV = 1.
AV = 1
V+ = 2.7V
CL = 50pF
RL N
¨V = 730mV
¨t = 300ns
OUTPUT
(50mV/div)
Rise Slew Rate = 2.4V/μs
Fall Slew Rate = 4.7V/μs
TIME (5μs/div)
FIGURE 3-39:
Large Signal Pulse
Response Test Circuit 3: AV = 1.
DS20006338A-page 12
2020 Microchip Technology Inc.
MIC860
4.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 4-1.
TABLE 4-1:
PIN FUNCTION TABLE
Pin Number
Symbol
1
IN+
Non-inverting input.
2
V–
Negative power supply connection. Connect a 10 μF and 0.1 μF capacitor in
parallel to this pin for power supply bypassing.
3
IN–
Inverting input.
4
OUT
Output of operational amplifier.
5
V+
2020 Microchip Technology Inc.
Description
Positive power supply input. Connect a 10 μF and 0.1 μF capacitor in parallel to
this pin for power supply bypassing.
DS20006338A-page 13
MIC860
5.0
APPLICATION INFORMATION
5.1
Power Supply Bypassing
Regular
supply
bypassing
techniques
are
recommended. A 10 μF capacitor in parallel with a
0.1 μF capacitor on both the positive and negative
supplies are ideal. For best performance all bypassing
capacitors should be located as close to the op amp as
possible and all capacitors should be low ESI
(equivalent series inductance), ESR (equivalent series
resistance). Surface-mount ceramic capacitors are
ideal.
5.2
Supply and Loading
Considerations
The MIC860 is intended for single supply applications
configured with a grounded load. It is not advisable to
operate the MIC860 with either:
• A grounded load and split supplies (±V) or
• A single supply where the load is terminated
above ground.
Under the above conditions, if the load is less than
20 kΩ and the output swing is greater than 1V (peak),
there may be some instability when the output is
sinking current.
DS20006338A-page 14
2020 Microchip Technology Inc.
MIC860
6.0
PACKAGING INFORMATION
6.1
Package Marking Information
5-Lead SC70*
(Front)
XXX
e3
*
A32
5-Lead SC70*
Example
NNN
408
(Back)
Legend: XX...X
Y
YY
WW
NNN
Example
Product code or customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle
mark).
Note:
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information. Package may or may not include
the corporate logo.
Underbar (_) and/or Overbar (‾) symbol may not be to scale.
2020 Microchip Technology Inc.
DS20006338A-page 15
MIC860
5-Lead SC70 Package Outline and Recommended Land Pattern
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
DS20006338A-page 16
2020 Microchip Technology Inc.
MIC860
APPENDIX A:
REVISION HISTORY
Revision A (April 2020)
• Converted Micrel data sheet MIC860 to Microchip
data sheet DS20006338A.
• Minor grammatical corrections throughout.
2020 Microchip Technology Inc.
DS20006338A-page 17
MIC860
NOTES:
DS20006338A-page 18
2020 Microchip Technology Inc.
MIC860
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
PART NO.
Device
X
XX
-XX
Temp. Package Media
Type
Device:
MIC860:
Temperature:
Y
=
–40°C to +85°C
Package:
C5
=
5-Lead SC70
Media Type
TR
=
3,000/Reel
Examples:
a) MIC860YC5-TR: Ultra-Low Power Op Amp
–40°C to +85°C Temperature Range,
5-Lead SC70 Package, 3,000/Reel
Ultra-Low Power Op Amp
2020 Microchip Technology Inc.
Note 1:
Tape and Reel identifier only appears in the
catalog part number description. This identifier is
used for ordering purposes and is not printed on
the device package. Check with your Microchip
Sales Office for package availability with the
Tape and Reel option.
DS20006338A-page 19
MIC860
NOTES:
DS20006338A-page 20
2020 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, Adaptec,
AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud, chipKIT,
chipKIT logo, CryptoMemory, CryptoRF, dsPIC, FlashFlex,
flexPWR, HELDO, IGLOO, JukeBlox, KeeLoq, Kleer, LANCheck,
LinkMD, maXStylus, maXTouch, MediaLB, megaAVR, Microsemi,
Microsemi logo, MOST, MOST logo, MPLAB, OptoLyzer,
PackeTime, PIC, picoPower, PICSTART, PIC32 logo, PolarFire,
Prochip Designer, QTouch, SAM-BA, SenGenuity, SpyNIC, SST,
SST Logo, SuperFlash, Symmetricom, SyncServer, Tachyon,
TempTrackr, TimeSource, tinyAVR, UNI/O, Vectron, and XMEGA
are registered trademarks of Microchip Technology Incorporated in
the U.S.A. and other countries.
APT, ClockWorks, The Embedded Control Solutions Company,
EtherSynch, FlashTec, Hyper Speed Control, HyperLight Load,
IntelliMOS, Libero, motorBench, mTouch, Powermite 3, Precision
Edge, ProASIC, ProASIC Plus, ProASIC Plus logo, Quiet-Wire,
SmartFusion, SyncWorld, Temux, TimeCesium, TimeHub,
TimePictra, TimeProvider, Vite, WinPath, and ZL are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, BlueSky, BodyCom, CodeGuard,
CryptoAuthentication, CryptoAutomotive, CryptoCompanion,
CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average
Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial
Programming, ICSP, INICnet, Inter-Chip Connectivity, JitterBlocker,
KleerNet, KleerNet logo, memBrain, Mindi, MiWi, MPASM, MPF,
MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple
Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI,
SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC,
USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and
ZENA are trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
The Adaptec logo, Frequency on Demand, Silicon Storage
Technology, and Symmcom are registered trademarks of Microchip
Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology Germany
II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in
other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2020, Microchip Technology Incorporated, All Rights Reserved.
For information regarding Microchip’s Quality Management Systems,
please visit www.microchip.com/quality.
2020 Microchip Technology Inc.
ISBN: 978-1-5224-6005-3
DS20006338A-page 21
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DS20006338A-page 22
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2020 Microchip Technology Inc.
02/28/20
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