MICRF114
Low-Power Integrated Sub-GHz Wireless RF Transmitter
General Features
• Fully Integrated Low-Power Sub-GHz RF
Transmitter
• Single-Pin Crystal Oscillator with Integrated
Programmable Load Capacitor
• Wide Operating Voltage Range: 1.8V to 3.6V
• Industrial Temperature Range: -40°C to +85°C
• Low-Current Consumption: 0.2 µA in Sleep mode,
11.7 mA in +10 dBm Transmit mode
• Fast Turn-On and Turn-Off Times
• Small Footprint 6-pin SOT-23 Package
RF/Analog Features
• Fully Integrated VCO and PLL Loop Filter
• Single-Ended RF Output with Easy Antenna
Matching
• Wide Operating Frequency Range: 285 MHz to
445 MHz
• Transmit Power Programmable in 1 dB steps from
-2 dBm to +13 dBm
• Data Rate: Up to 115.2 kbps NRZ, 57.6 kbps
Manchester Encoded
• On-Off Keying (OOK) Modulation with Power
Ramp-Up Control
• Complies with US (FCC) and Canada (IC)
Standards
Pin Diagram
6-pin SOT-23
SCK
1
6
OSC
SDI
2
5
VSS
VDD
3
4
RFO
Digital Features
• Simple and Flexible 2-pin Proprietary
Microcontroller (MCU) Interface
• Supports Proprietary Remote Control Protocols
Applications
•
•
•
•
•
•
•
Remote Keyless Entry (RKE)
Garage Door Opener (GDO)
Alarm and Security Systems
Command and Control
Wireless Sensors
Industrial Sensing and Control
Smart Energy
2015 Microchip Technology Inc.
Preliminary
DS50002416A-page 1
MICRF114
Table of Contents
1.0 Hardware Description................................................................................................................................................................... 3
2.0 Functional Description.................................................................................................................................................................. 7
3.0 Typical Performance Curves .......................................................................................................................................................11
4.0 Application Circuit....................................................................................................................................................................... 19
5.0 Electrical Characteristics ............................................................................................................................................................ 23
6.0 Packaging Information................................................................................................................................................................ 27
Appendix A:Revision History................................................................................................................................................................ 30
The Microchip Web Site ....................................................................................................................................................................... 31
Customer Change Notification Service ................................................................................................................................................ 31
Customer Support ................................................................................................................................................................................ 31
Product Identification System............................................................................................................................................................... 32
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DS50002416A-page 2
Preliminary
2015 Microchip Technology Inc.
MICRF114
1.0
HARDWARE DESCRIPTION
1.1
Overview
The MICRF114 is optimized for battery-powered
applications. It features low-current consumption and
can operate over a wide supply voltage range. Internal
circuits sensitive to supply voltage variations run from
the on-chip Low Dropout (LDO) regulator. To reduce
pin count and system Bill of Materials (BOM), the LDO
regulator does not need an external capacitor for
stability, and the single-pin reference oscillator has a
integrated programmable crystal load capacitor. The
single-ended RF output enables easy matching to
monopole antennas with a minimal number of external
components.
The MICRF114 is a simple, low-cost OOK transmitter
with programmable output power. It is primarily
intended for command and control applications such as
RKE and GDO. The transmitter is synthesizer based
for high-frequency accuracy. It operates on a single
frequency that is determined by the frequency of the
crystal connected to the built-in reference oscillator.
This frequency can be selected from a wide range. The
more popular transmit frequencies require readily
available crystal frequencies. For example, a
433.92 MHz transmit frequency requires a 13.56 MHz
crystal. The RF performance of the transmitter is
compliant with FCC and IC regulations and with some
Japanese standards. European Telecommunications
Standards Institute (ETSI) requirements can be met at
low-radiated power.
1.2
A 2-wire proprietary MCU interface is used to program
the parameters of the MICRF114 to select its operating
mode and to input the transmit data packet. A built-in
self-calibration circuit ensures consistent performance
over the operating frequency range and against
temperature
variations.
Initial
calibration
is
automatically performed
during Power-on Reset
(POR). Recalibration can be initiated by the MCU that
controls the application when required.
Block Diagram
Figure 1-1 shows the MICRF114 block diagram.
FIGURE 1-1:
MICRF114 ARCHITECTURE BLOCK DIAGRAM
POWER MANAGEMENT
VDD
VSS
LDO
BIAS
REFERENCE
POR
Regulated
Supply
SYNTHESIZER
OSC
PFD
VCO
CP
To Digital
Block
PA
RFO
1/32
TX Data
DIGITAL BLOCK
SDI
SCK
2015 Microchip Technology Inc.
MCU Interface
Operating mode control
Configuration register
Self-Calibration
Preliminary
DS50002416A-page 3
MICRF114
1.3
Pin Descriptions
Table 1-1 describes the MICRF114 pins.
TABLE 1-1:
1.4
MICRF114 PIN DESCRIPTIONS
Pin
Name
Type
Description
1
SCK
Digital Input
MCU interface serial clock input
2
SDI
Digital Input
MCU interface serial configuration or TX data input
3
VDD
Power
Positive supply voltage
4
RFO
Analog Output
RF TX output
5
VSS
Power
Ground reference
6
OSC
Analog Input
Reference crystal connection
Power Management
1.6
The MICRF114 has a single power pin and a single
ground pin. The sensitive analog blocks run from an
internal LDO, which does not need an external
capacitor. A bias and reference circuit provides
reference voltage to the LDO and bias currents to all
analog blocks.
The digital block runs from the unregulated supply. This
enables communication with the MCU even when most
of the blocks (including the LDO) are turned off to save
power. Additionally, the MICRF114 retains its selfcalibration result and user-programmable parameters
in this low-power state. To get the highest possible
efficiency, the RF Power Amplifier (PA) block runs
directly from the unregulated supply.
A POR circuit keeps the MICRF114 in a Reset state
until the supply voltage is sufficient for proper operation
of the digital block. The POR event resets the device
control state machine and the Configuration register to
their default state. A Reset is also triggered by
sufficiently large supply voltage glitches and brown-out.
1.5
MCU Interface
A proprietary 2-wire serial interface consisting of a
clock line and a data line is utilized to control the
operation of the MICRF114 and to input the transmit
data packet. Special start and stop conditions on these
two lines indicate the beginning and end of
communication with the MCU. Except during these
Start and Stop bits, the MCU must change the data
only when the clock is at logic low. Control and
Configuration bits are sent synchronously, and the
MICRF114 samples the data on the rising edge of the
clock. Transmit data is sent asynchronously with the
clock held low. During transmission, the serial data line
is connected directly to the RF modulator. The
assembly and timing of the data packet are the
responsibilities of the MCU.
DS50002416A-page 4
Device Control
Data transmission start and stop are always initiated by
the MCU. Programmable transmit parameters are
stored in a single 16-bit register. The value in this
register is kept as long as the supply voltage is present.
The MCU can rewrite the register at the beginning of
each transmission. Immediately after POR or at the
beginning of a transmission, an internal state machine
turns on the various blocks of the MICRF114 with the
required sequence and timing and then performs an
automatic calibration of the device when required. The
MCU must wait for these operations to be completed
before sending the transmit data packet.
An initial calibration is done after POR. The calibration
result is kept as long as the supply voltage is present.
Recalibration can be requested by the MCU when
required.
1.7
Crystal Oscillator
The reference frequency source is a single-pin crystal
oscillator. The transmit frequency is 32 times the
reference. Thus, the relative accuracy of the crystal
oscillator directly determines the accuracy of the
transmit frequency. The most popular transmit
frequencies require standard and off-the-shelf low-cost
crystals. The oscillator operates at parallel resonance.
The load capacitor that the crystal requires is
integrated to minimize the BOM. To accommodate
various crystal types and compensate for PCB parasitic
capacitances, the value of this load capacitor is
programmable by the MCU.
The other function of the crystal oscillator is to provide
a relatively accurate clock frequency for the automatic
calibration circuit. As the crystal frequency is
determined by the transmit frequency and can vary
over a wide range, the clock is generated by dividing
the crystal frequency by a programmable number that
must be properly set
to achieve the expected
performance.
Preliminary
2015 Microchip Technology Inc.
MICRF114
1.8
Frequency Synthesizer
The frequency synthesizer is a fully integrated PLL with
a fixed feedback division ratio. It operates on a single
frequency that is determined by the reference crystal.
The VCO within the PLL operates directly at the
transmit frequency to save power. The VCO also has a
wide tuning range to cover most of the popular
frequencies below 500 MHz.
1.9
Transmit Path
The main element of the transmit path is the RF Power
Amplifier (PA). Since typical applications use monopole
antennas, the output is single-ended. It must be biased
to VDD using an inductor. This configuration enables
high-voltage swing, thereby reducing the required
supply current for the specified output power. The
output power is programmable by the MCU in 1 dB
steps. This enables the current consumption and
transmit range to be optimized according to the
product requirements of the customers. Additionally,
compliance with the relevant regulations can be
ensured with different antenna gains.
To ease design-in and keep the BOM as low as
possible, the output capacitance of the PA is
programmable by the MCU. As a result, the impedance
matching circuit between the RF output and the
antenna requires fewer elements and is easier to
optimize. A modulator circuit is used to control the
slope of the output power ramping on and off. This is to
prevent steep supply current transients which may
result in a spectrum splatter.
2015 Microchip Technology Inc.
Preliminary
DS50002416A-page 5
MICRF114
NOTES:
DS50002416A-page 6
Preliminary
2015 Microchip Technology Inc.
MICRF114
2.0
FUNCTIONAL DESCRIPTION
2.1
Initialization
FIGURE 2-1:
RESET
After applying the supply voltage, the MICRF114 is
initialized by its built-in POR circuit. The POR is level
sensitive. It starts to generate a Reset pulse for the
internal logic when the rising supply voltage (VDD)
crosses a given threshold. The threshold level is
chosen so that the operation of the digital circuits is
already guaranteed at the beginning of the Reset
pulse.
Initialization first involves resetting all internal state
machines, setting the Configuration register to its
default value, and executing a calibration sequence to
guarantee proper operation of the frequency
synthesizer. Blocks needed for calibration are turned
on with the required sequence and timing. The result is
stored after calibration, and all blocks are turned off to
bring the MICRF114 into Sleep mode where it waits for
the MCU to initiate transmission. The calibration result
is kept as long as the supply voltage is present.
Figure 2-1 illustrates the simplified initialization
flowchart where the Reset due to VDD drops or brownout is not shown. Additionally, it is not shown that a
Reset condition in any state or during any sequence
immediately brings the MICRF114 into its Reset state.
One of the advantages of the level-sensitive Reset is
that the generation and length of the Reset pulse are
mostly independent of the slope of the rising VDD.
Another advantage is that it triggers a Brown-out Reset
(BOR) when VDD goes below the VTP threshold
voltage. Refer to Figure 2-2.
Abrupt drops of the VDD can disturb the operation of
digital circuits even if the VDD always stays above the
threshold level during such a transient. The POR block
also generates a Reset pulse after this kind of event if
the voltage drop exceeds the VTG threshold value.
FIGURE 2-2:
INITIALIZATION FLOWCHART
N
VDD>VTP?
Y
wake-up
sequence A
calibration
SLEEP
2.2
Operating Modes
The MICRF114 has two main operating modes:
• Sleep mode
• Transmit mode
In Sleep mode, all the blocks (except the POR and the
digital block) are powered down and wait to be woken
up by the MCU. The current consumption is minimal
because there is no activity within the digital block.
After the wake-up sequence and the associated delay,
MICRF114 enters Transmit mode. In Transmit mode,
all blocks become active and an RF signal, modulated
by the data stream sent by the MCU, is transmitted.
Transmission can be terminated by the MCU without
any time-out delay when required and the MICRF114
immediately goes back to Sleep mode.
Section 2.3 “Communication with the MCU” shows
the main operating mode flowchart and the associated
activity on the MCU interface.
POR OPERATION
VDD
VTG
VTP
t
0
PORn
tDP
tDP
VHI
VLO
t
Note: VHI follows VDD
2015 Microchip Technology Inc.
Preliminary
DS50002416A-page 7
MICRF114
2.3
Communication with the MCU
The communication between the MCU and the
MICRF114 is one-directional and it is always initiated
by the MCU. It uses a proprietary protocol that supports
switching between the two operating modes, optional
request for recalibration, reprogramming of the
operating parameters (as needed), and transmit data
input. The logic is active-high.
The communications protocol requires both the lines of
Serial Clock (SCK) and Serial Data Input (SDI) to idle
high. However, this is not the state with the lowest
current consumption because the SCK input of the
MICRF114 has an internal pull-down resistor to avoid
unwanted clock transitions during the power-on
process. In Sleep mode, the clock line can be pulled
low to minimize the overall supply current.
FIGURE 2-3:
Control and Configuration bits are sent synchronously
after the Start bit. The two control bits, CAL and CFG,
must always be present. If CAL is high, recalibration is
performed before transmission. In this case, the wakeup time from Sleep mode to Transmit mode is longer. If
CFG is high, the MCU must send 17 additional
Configuration bits. The first 16 bits updates the 16-bit
Transmit Parameter register within the MICRF114. The
Most Significant bit (MSb) is sent first. The last bit must
always be ‘0’. Figure 2-3 shows the two methods of
starting transmission.
The wake-up sequence from Sleep mode to Transmit
mode starts at the rising edge of the last clock pulse.
This is the second or 19th clock, depending on the CFG
bit setting.
COMMUNICATION PROTOCOL
Transmit with quick-start using the default or previously loaded configuration settings.
Recalibration (CAL=1) is not normally needed.
Wake-up
Sleep
Sleep
Transmit
tWK + cal * tCL
Start
CAL
CFG
Asynchronous TX Data
Stop
(MCU Waits)
SDI
SCK
Transmit start with configuration settings update.
Recalibration is always needed in case of frequency setting change.
Wake-up
Sleep
Start
CAL
CFG
16 Configuration (Config) bits
0
SDI
SCK
DS50002416A-page 8
Preliminary
2015 Microchip Technology Inc.
MICRF114
2.4
After the wake-up delay, the MICRF114 starts to
automatically transmit. Since the exact timing of this is
unknown by the MCU, keep the transmit data input low
until the maximum specified wake-up time passes.
Although the MICRF114 wakes up earlier, it transmits
‘0’, that is, no carrier. Transmit data is asynchronous
and directly modulates the RF carrier. The MCU takes
care of all timing and coding of the data in software.
This is feasible due to the typical low-data rates and is
necessary due to the great variety of proprietary
protocols. The flowchart in Figure 2-4 shows the
MICRF114 states during a normal operation cycle.
FIGURE 2-4:
Parameter Selection
All transmit parameters of the MICRF114 are stored in
a single 16-bit register. This is loaded with default
values at POR. The MCU can modify these values
before sending the transmit data. There are four
distinct parameter fields in the register as shown in
Table 2-1. To keep the MCU interface simple, only the
complete register as a whole can be updated. Fields
that need to remain unchanged must be reloaded with
the same value. For example, the new register value is
retained in Sleep mode until the next POR event.
TOP FLOWCHART
SLEEP
N
N
Start?
CAL = 1?
Y
N
Y
Read
Control Bits
Calibration
CFG = 1?
Wake-up
Sequence B
Y
Read
Config Bits
TRANSMIT
N
Wake-up
Sequence A
TABLE 2-1:
Bit Range
Stop?
Y
TRANSMIT PARAMETERS OF MICRF114
Parameter
Field
Symbol
Default
Setting
Value
425-445 MHz
Transmit Frequency
F
fTX
0x7
Crystal Load Capacitor
X
CXT
0x16
18 pF
RF Transmit Power
P
PTX
0xC
+10 dBm
RF Output Tuning Capacitor
R
CTX
0x0
0 pF
2015 Microchip Technology Inc.
Preliminary
DS50002416A-page 9
MICRF114
Select the transmit frequency parameter to ensure that
the actual operating frequency, which is determined by
the selected crystal, falls into the frequency range
defined by the parameter. Refer to Table 2-2.
TABLE 2-2:
FREQUENCY RANGE
fTX range (MHz)
F
Min
Max
285
305
0
305
325
1
325
345
2
345
365
3
365
385
4
385
405
5
405
425
6
425
445
7
Equation 2-1 through Equation 2-1 show that the rest
of the programmable parameters can be calculated
from the Control bit fields.
EQUATION 2-1:
2.5
Transmitting
The MICRF114 is normally in Sleep mode. The MCU
always initiates entry into Transmit mode by sending a
Start bit, the compulsory Control bits, and the optional
Configuration bits to the MICRF114, which starts its
wake-up sequence. After the wake-up delay, it
transmits the data present on its SDI pin. The MCU
holds the SDI pin low for the maximum specified wakeup time. If calibration is requested, the maximum
specified calibration time must be added to the wakeup time.
Transmit parameters are not usually changed on the
fly, and recalibration is not necessary. Therefore, the
MCU can use the quick-start transmit sequence as
described in Section 2.3 “Communication with the
MCU”. However, except in the rare case that all default
parameter settings are acceptable for the application,
the first transmission after a POR event must include
sending the required Configuration bits. Recalibration
is always needed when the transmit frequency is in a
band that is different from the default value.
The MICRF114 stays in Transmit mode until the MCU
sends a Stop bit and then reverts to Sleep mode
without any time-out delay.
CRYSTAL LOAD
CAPACITOR
Crystal Load Capacitor:
CXT = 7 pF + X * 0.5 pF
EQUATION 2-2:
RF TRANSMIT POWER
RF Transmit Power:
PTX = -2 dBm + P dBm
EQUATION 2-3:
RF OUTPUT TUNING
CAPACITOR
RF Output Tuning Capacitor:
CTX = 0 pF + R * 0.2 pF
The operating frequency, the crystal load capacitor,
and the RF output tuning capacitor settings depend on
the selection of external components and, to a lesser
extent, PCB layout. If these parameters are different
from the default values, it must be set only once during
the first transmission after a POR event.
DS50002416A-page 10
Preliminary
2015 Microchip Technology Inc.
MICRF114
3.0
TYPICAL PERFORMANCE
CURVES
3.1
Characterization Setup
Harmonic filtering is omitted. The measured power
levels are calculated back to the RFO pin of the
MICRF114, taking into account the losses of the
characterization setup. Component values that are
valid for the two frequencies are listed in Table 3-1.
The MICRF114 is characterized at the two most
popular frequencies, 315 MHz and 433.92 MHz, over
the whole operating temperature and supply voltage
range. The results shown in Section 3.2 “315 MHz
Results” and Section 3.3 “433 MHz results” are the
average values taken from three devices, each coming
from a typical wafer lot. The RF output of the
MICRF114 is matched to 50 ohms to facilitate
connection to a spectrum analyzer. Refer to Figure 3-1.
FIGURE 3-1:
MATCHING CIRCUIT
SCHEMATIC
RFO
L2
C2
C1
2015 Microchip Technology Inc.
50 ohm
MICRF114
L1
SMA Connector
VDD
TABLE 3-1:
Component
COMPONENT VALUES
Frequency
315 MHz
433 MHz
L1
360 nH
330 nH
L2
39 nH
22 nH
C1
6.8 pF
5.6 pF
C2
9.1 pF
5.6 pF
Current consumption is measured with a 50% dutycycle OOK modulation at 115.2 kbps data rate. Output
power is measured in unmodulated, Continuous Wave
(CW) mode. The reference spur level and the phase
noise are also measured in CW mode at +10 dBm
(nominal) output power setting. The phase noise is
measured at 1 MHz offset from the carrier.
Preliminary
DS50002416A-page 11
MICRF114
3.2
315 MHz Results
Figure 3-2 through Figure 3-7 show the average values measured at 315 MHz.
FIGURE 3-2:
CURRENT CONSUMPTION, 0 dBm POWER SETTING
FIGURE 3-3:
OUTPUT POWER, 0 dBm POWER SETTING
DS50002416A-page 12
Preliminary
2015 Microchip Technology Inc.
MICRF114
FIGURE 3-4:
CURRENT CONSUMPTION, +10 dBm POWER SETTING
FIGURE 3-5:
OUTPUT POWER, +10 dBm POWER SETTING
2015 Microchip Technology Inc.
Preliminary
DS50002416A-page 13
MICRF114
FIGURE 3-6:
REFERENCE SPUR LEVEL
FIGURE 3-7:
PHASE NOISE
DS50002416A-page 14
Preliminary
2015 Microchip Technology Inc.
MICRF114
3.3
433 MHz results
Figure 3-8 through Figure 3-13 show the average values measured at 433 MHz.
FIGURE 3-8:
CURRENT CONSUMPTION, 0 dBm POWER SETTING
FIGURE 3-9:
OUTPUT POWER, 0 dBm POWER SETTING
2015 Microchip Technology Inc.
Preliminary
DS50002416A-page 15
MICRF114
FIGURE 3-10:
CURRENT CONSUMPTION, +10 dBm POWER SETTING
FIGURE 3-11:
OUTPUT POWER, +10 dBm POWER SETTING
DS50002416A-page 16
Preliminary
2015 Microchip Technology Inc.
MICRF114
FIGURE 3-12:
REFERENCE SPUR LEVEL
FIGURE 3-13:
PHASE NOISE
2015 Microchip Technology Inc.
Preliminary
DS50002416A-page 17
MICRF114
NOTES:
DS50002416A-page 18
Preliminary
2015 Microchip Technology Inc.
MICRF114
4.0
APPLICATION CIRCUIT
4.1
50-ohm Matching Example
Table 4-1 shows the values of the frequencydependent components for the two most popular
frequencies. Except for L1, it is recommended to use
0402 SMD components in the matching and filter
network.
Figure 4-1 shows the RF section of the MICRF114
application circuit. The VSS pin potential is the ground
reference for the whole circuit. The supply voltage
(1.8V to 3.6V) is connected to the VDD pin. Capacitors
C5 and C6 provide supply bypass (filtering). In every
application, the MICRF114 has to be controlled by an
MCU via the proprietary serial interface (SDI and SCK
pins). The quartz crystal (X1) connected to the OSC pin
determines the operating frequency which is 32 times
the crystal resonance frequency.
TABLE 4-1:
SDI
SCK
C5
C6
4.7 nF
470 pF
MICRF114
VDD
Note:
315 MHz
433 MHz
X1
9.84375 MHz
13.56 MHz
L2
39 nH
22 nH
C1
9.1 pF
6.8 pF
C2
9.1 pF
5.6 pF
C3
12 pF
8.2 pF
L3
27 nH
18 nH
C4
12 pF
8.2 pF
SCHEMATIC DIAGRAM
Supply
From MCU
Frequency
Component
The matching network (L1, L2, C1, and C2) provides
optimum power transfer from the MICRF114 to the
antenna. The filter stage (L3, C3, and C4) removes the
unwanted harmonics. The required harmonic
suppression depends on the operating frequency,
antenna characteristics, and regional regulations. This
means the order of the filter (the number of
components) may be different in an actual application
with an integrated antenna.
FIGURE 4-1:
COMPONENT VALUES
L1
220 nH
L2
RFO
Filtering
C2
C1
VSS
OSC
Matching
L3
C3
C4
50 ohm
RF Output
X1
This is a suggested schematic diagram only. Component values for C1 to C4 and L2 to L3 vary according
to operating frequency, antenna characteristics, and regional regulations. Certain components can be
removed.
2015 Microchip Technology Inc.
Preliminary
DS50002416A-page 19
MICRF114
4.2
Measurement Results
The important parameters for regulatory standard compliance are measured on PICtail™ boards for the two
most popular operating frequencies using the frequency-dependent components listed in Table 4-1. The
MICRF114 operates in CW mode. Harmonics and
spurs are measured at +10 dBm output power setting.
Matching network, cable, and connector losses are not
compensated to ensure that the actual power readings
on the spectrum analyzer are slightly less.
FIGURE 4-2:
HARMONIC LEVELS AT 315 MHZ
FIGURE 4-3:
SPURIOUS LEVELS AT 315 MHZ
DS50002416A-page 20
Measurement results are shown in Figure 4-2 through
Figure 4-7. Note that the regulations limit the radiated
field strength at a given distance. The maximum usable
power setting at a given frequency and geographic
region can be determined only if the antenna gain is
known. The level of the fundamental carrier signal and
all possible out-of-band signals – harmonics, spurs,
and integrated phase noise – must be taken into
account. The filter network can be simplified at lowradiated power.
Preliminary
2015 Microchip Technology Inc.
MICRF114
FIGURE 4-4:
PHASE NOISE AT 315 MHZ
FIGURE 4-5:
HARMONIC LEVELS AT 433 MHZ
2015 Microchip Technology Inc.
Preliminary
DS50002416A-page 21
MICRF114
FIGURE 4-6:
SPURIOUS LEVELS AT 433 MHZ
FIGURE 4-7:
PHASE NOISE AT 433 MHZ
DS50002416A-page 22
Preliminary
2015 Microchip Technology Inc.
MICRF114
5.0
ELECTRICAL CHARACTERISTICS
In Table 5-1 and Table 5-2, all voltages are referenced to the potential on the VSS pin.
TABLE 5-1:
Symbol
ABSOLUTE MAXIMUM RATINGS
Parameter
Min
Typ
Max
Unit
Conditions/Notes
VDD
Supply Voltage
-0.3
—
4.0
V
On VDD pin
VIN
Voltage on any pin
-0.3
—
VDD+0.3
V
Except VDD and RFO pins
VRF
Voltage on RFO pin
-0.3
—
9
V
RF peak values
VESD
Any pin combinations, HBM
Electrostatic Discharge
—
—
2000
V
IIN
Current into any pin
-25
—
25
mA
—
TST
Storage Temperature
-55
—
+125
°C
—
TLD
Lead Temperature
—
—
+260
°C
Soldering, for max 10s
TABLE 5-2:
Symbol
RECOMMENDED OPERATING CONDITIONS
Parameter
Min
Typ
Max
Unit
Conditions/Notes
VDD
Supply Voltage
1.8
2.7
3.6
V
On VDD pin
Except VDD and RFO pins
VIN
Voltage on any pin
0.0
—
VDD
V
VRF
Voltage on RFO pin
0.2
—
7.2
V
RF peak values
TOP
Operating Temperature
-40
+27
+85
°C
Ambient
Typical parameter values in Table 5-3 through Table 5-6 are valid at typical VDD and TOP except where indicated
otherwise.
TABLE 5-3:
Symbol
DC CHARACTERISTICS
Parameter
IDD
Supply Current
Min
Typ
Max
Unit
—
0.2
—
µA
Sleep mode
Conditions/Notes
—
11.7
—
mA
Transmit mode(1)
VTP
POR Level Threshold
—
1.2
—
V
VDD < VTP needed for POR
VTG
POR Glitch Threshold
—
0.8
—
V
Larger glitch generates POR
VIL
Digital in Low Level
—
—
0.35 x VDD
V
—
VIH
Digital in High Level
0.65 x VDD
—
—
V
—
RPD
Input Pull Down
—
134
—
k
Note 1:
On SCK pin
OOK transmission with +10 dBm power and 50% duty cycle.
2015 Microchip Technology Inc.
Preliminary
DS50002416A-page 23
MICRF114
TABLE 5-4:
Symbol
AC CHARACTERISTICS
Parameter
fTX
Transmit Frequency
CTX
Output Capacitance
PTX
PSP
LOUT
ZOUT
DR
hMOD
SRVDD
CXT
RXT
Note 1:
2:
Output Power
Spurious Emission
Phase Noise
RF Output Impedance(2)
Modulation Data Rate
Typ
Max
Unit
285
—
445
MHz
Conditions/Notes
32 times the crystal frequency
0
—
3
pF
—
+13
—
dBm
Maximum setting(1)
Selectable with 0.2 pF steps
Typical control range
-2
—
+13
dBm
—
1
—
dB
Power control step
—
—
-45
dBc
Excluding harmonics
—
—
-76
dBc/Hz
100 kHz from carrier
—
—
-92
dBc/Hz
—
7.5-j50.9
—
—
6.0-j32.2
—
0
—
115.2
kbps
0
—
57.6
kbps
Modulation Depth
—
60
—
dB
VDD Slew Rate
1 MHz from carrier
At 315 MHz
At 433 MHz
NRZ
Manchester encoded
—
0.1
—
—
V/ms
Crystal Load Capacitor
7
—
22.5
pF
Selectable with 0.5 pF steps
For proper POR operation
Crystal Loss Resistance
—
—
80
—
Valid with optimum matching circuit at TOP = 27°C and VDD = 2.7V to 3.3V
The RF output impedance varies with the operating frequency, the output power setting PTX (which is not
necessarily equal to the actual output power) and the output tuning capacitance setting CTX. The values
given: PTX = +10 dBm and CTX = 0 pF.
TABLE 5-5:
Symbol
Min
TIMING CHARACTERISTICS
Parameter
Min
Typ
Max
Unit
—
—
20
ms
Conditions/Notes
tDP
POR Delay Time
tWK
Wake-up Time
—
—
3
ms
Without calibration
tCL
Calibration Time
—
—
2
ms
—
DS50002416A-page 24
Preliminary
—
2015 Microchip Technology Inc.
MICRF114
TABLE 5-6:
MCU INTERFACE TIMING
Symbol
Parameter
Min
Typ
Max
Unit
Conditions/Notes
tCHI
Clock High Time
30
—
—
ns
VSCK > VIH(1)
tCLO
Clock Low Time
30
—
—
ns
VSCK < VIL(1)
tCS
Clock Setup Time
15
—
—
ns
tCH
Clock Hold Time
15
—
—
ns
tDHI
Data High Time
100
—
—
ns
Before and after start or stop edge
Between stop and start edges
tDS
Data Setup Time
15
—
—
ns
—
tDH
Data Hold Time
15
—
—
ns
—
tFI
Input Signal Fall Time
—
—
500
ns
tRI
Input Signal Rise Time
—
—
500
ns
Note 1:
Between VIL and VIH
For the definition of VIL and VIH see Table 5-3.
FIGURE 5-1:
MCU INTERFACE TIMING
SDI
tDHI
SCK
tDS
tDH
2015 Microchip Technology Inc.
tCHI
tCLO
Preliminary
tCS
tCH
tCS
tCH
DS50002416A-page 25
MICRF114
NOTES:
DS50002416A-page 26
Preliminary
2015 Microchip Technology Inc.
MICRF114
6.0
PACKAGING INFORMATION
6.1
Package Marking Information
Example
6-Lead SOT-23
F1145
03XYZ
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
2015 Microchip Technology Inc.
Preliminary
DS50002416A-page 27
MICRF114
6.2
Package Details
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