MRF24WG0MB-I/RM

MRF24WG0MA/MB MRF24WG0MA/MB Data Sheet 2.4 GHz IEEE 802.11b/g™ Features: MAC/Baseband Features: • IEEE 802.11-compliant RF transceiver • Serialized unique MAC address • Data rate: 1 to 11 Mbps for 802.11b / 6 to 54 Mbps for 802.11g • Compatible with IEEE 802.11b/g/n networks • Small size: 21 mm x 31 mm 36-pin Surface Mount module • Integrated PCB antenna (MRF24WG0MA) • External antenna option (MRF24WG0MB) with ultra-miniature coaxial (U.FL) connector • Easy integration into final product – accelerates product development, provides quicker time to market • Radio regulation certification for United States (FCC), Canada (ISED) and Europe (RED) • Designed for use with Microchip microcontroller families (PIC18, PIC24, dsPIC33 and PIC32) with downloadable Microchip TCP/IP Stack • Hardware CSMA/CA access control, automatic ACK and FCS creation and checking • Automatic MAC packet retransmit • Hardware Security Engine for AES and RC4-based ciphers • Supports 802.1x, 802.1i security: WEP, WPA-PSK and WPA-2-PSK • Supports Infrastructure, Adhoc, Wi-Fi® Direct Client • Implements Wi-Fi Protected Setup (WPS) and SoftAP for easy product commissioning Operational: • Consumer Electronics: - Remote Control - Internet Radio - Home Security - Toys • • • • Single operating voltage: 2.8V to 3.6V (3.3V typical) Temperature range: -40°C to +85°C Simple, four-wire SPI interface with interrupt Low-current consumption: - RX mode – 156 mA (typical) - TX mode – 240 mA (+18 dBm typical) - PS mode – 4 mA (typical) - Hibernate mode – 0.1 mA (typical) RF/Analog Features: • • • • • • • • ISM Band 2.400 to 2.484 GHz operation Channels 1-11 DSSS/OFDM modulation Application throughput: 4500 kbps -95 dBm Typical sensitivity at 1 Mbps +18 dBm Typical 802.11b TX power with control +16 dBm Typical 802.11g TX power with control Integrated low phase noise VCO, RF frequency synthesizer, PLL loop filter and PA • Integrated RSSI ADC and I/Q DACs, RSSI readings available to host  2012-2021 Microchip Technology Inc. Applications: • Utility and Smart Energy: - Thermostats - Smart Meters - White Goods - HVAC • Industrial Controls: - Chemical Sensors - HVAC - Security Systems - M2M Communication • Remote Device Management: - Location and Asset Tracking - Automotive - Code Update • Retail: - POS Terminals - Wireless Price Tags - Digital Remote • Medical, Fitness and Health Care: - Glucose Meters - Fitness Equipment - Patient Asset Tracking DS70000686C-page 1 MRF24WG0MA/MB Pin Diagram Note: Antenna connector on MRF24WG0MB only. DS70000686C-page 2  2012-2021 Microchip Technology Inc. MRF24WG0MA/MB Table of Contents 1.0 Device Overview .......................................................................................................................................................................... 5 2.0 Circuit Description ...................................................................................................................................................................... 11 3.0 Regulatory Approval................................................................................................................................................................... 21 4.0 Electrical Characteristics ............................................................................................................................................................ 27 Appendix A: Revision History............................................................................................................................................................... 31 The Microchip Web Site ....................................................................................................................................................................... 33 Customer Change Notification Service ................................................................................................................................................ 33 Customer Support ................................................................................................................................................................................ 33 Reader Response ................................................................................................................................................................................ 34 Product Identification System .............................................................................................................................................................. 35 TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at docerrors@microchip.com or fax the Reader Response Form in the back of this data sheet to (480) 792-4150. We welcome your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000A is version A of document DS30000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following: • Microchip’s Worldwide Web site; http://www.microchip.com • Your local Microchip sales office (see last page) When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are using. Customer Notification System Register on our web site at www.microchip.com to receive the most current information on all of our products.  2012-2021 Microchip Technology Inc. DS70000686C-page 3 MRF24WG0MA/MB NOTES: DS70000686C-page 4  2012-2021 Microchip Technology Inc. MRF24WG0MA/MB 1.0 DEVICE OVERVIEW The MRF24WG0MA and MRF24WG0MB are lowpower, 2.4 GHz, IEEE 802.11-compliant, surface mount modules with all associated RF components – crystal oscillator, bypass and bias passives with integrated MAC, baseband, RF and power amplifier and built-in hardware support for AES and TKIP (WEP, WPA, WPA2 security). The modules also provide acceleration for hosts running WPA-EAP application security. The integrated module design frees the designer from RF and antenna design tasks and regulatory compliance testing, ultimately providing quicker time to market. The MRF24WG0MA module is approved for use with the integrated PCB meander antenna. The MRF24WG0MB module comes with an ultraminiature coaxial connector (U.FL) and is approved for use with a list of antenna types that are certified with the module. See Section 2.7 “External Antenna” for specific recommendations. The MRF24WG0MA/MB modules are designed to be used with Microchip’s TCP/IP software stack. The software stack has an integrated driver that implements the API that is used in the modules for command and control, and for management and data packet traffic. 1.1 Interface Description The block diagram in Figure 1-1 represents a MRF24WG0MA/MB module. It interfaces to Microchip PIC18, PIC24, dsPIC33 or PIC32 microcontrollers through a four-wire serial client SPI interface – interrupt, hibernate, reset, power and ground signals. The module runs on a single supply voltage of nominally 3.3V. The serial trace port operates at 3.3V and requires a level shifter for operation with RS-232 devices. This port provides a serial output of module status messages and is helpful for debugging purposes. Figure 1-2 shows a simplified example connection between a Microchip PIC® MCU and the module. Table 1-1 lists the pin descriptions. Data communications with the MRF24WG0MA/MB are through the SPI interface that is detailed in Section 2.0 “Circuit Description”. The Microchip PIC microcontroller communicates with the module through a command API from within the Microchip TCP/IP stack. The command API is detailed in the Microchip TCP/IP stack online Help that is included in the free Microchip Application Libraries download. The Microchip TCP/IP software stack is available in the free Microchip Application Libraries download (including example applications and source code) from the Microchip web site, http://www.microchip.com/ wireless. The combination of the module and a PIC running the TCP/IP stack results in support for IEEE Standard 802.11 and IP services. For example, this allows the immediate implementation of a wireless web server and e-mail clients. The MRF24WG0MA/MB modules have received regulatory approvals for modular devices in the United States (FCC), Canada (ISED) and Europe (RED). The modular approval removes the need for expensive RF and antenna design, and allows the end user to place the modules inside a finished product and not require regulatory testing for an intentional radiator (RF transmitter). See Section 3.0 “Regulatory Approval” for the specific requirements that should be adhered to by the integrator.  2012-2021 Microchip Technology Inc. DS70000686C-page 5 MRF24WG0MA/MB FIGURE 1-1: MRF24WG0MA/MB BLOCK DIAGRAM MRF24WG0MA/MB 2.4 GHz IEEE 802.11b/g Module AES, TKIP Encryption WPA Engine SPI Flash IEEE 802.11b/g MAC/LLC 2.4 GHz Transceiver/PA IEEE 802.11b/g PHY PCB Antenna MRF24WG0MA FIGURE 1-2: Matching Circuitry Interface Client SPI Interrupt Internal Regulators Power Hibernate RAM Trace Reset 802.1x (EAP) Accelerator ROM MICROCONTROLLER TO MRF24WG0MA/MB INTERFACE PIC® Microcontroller MRF24WG0Mx External Antenna (MRF24WG0MB) CS SDI I/O SDO SDO SDI SCK SCK INT INTx +3.3V (Typ) VDD HIBERNATE I/O GND GND WP I/O RESET I/O DS70000686C-page 6  2012-2021 Microchip Technology Inc. MRF24WG0MA/MB TABLE 1-1: Pin Description Pin Symbol Type Description 1 GND P 2 NC* NC* No connect(3) 3 NC* NC* No connect(3) 4 NC* NC* No connect(4) 5 NC* NC* No connect(3) 6 NC* NC* No connect(3) 7 RESET I: Constant(1) Ground Module Reset input 8 NC NC Do not connect 9 NC* NC* No connect(3) 10 GND P 11 NC NC Do not connect 12 NC NC Do not connect 13 NC NC Do not connect 14 NC NC Do not connect 15 NC NC Do not connect (2) Ground I Write protect (this pin is used to enable FLASH update) 17 VDD P Power 18 GND P Ground 19 GND P Ground 20 HIBERNATE I 21 NC* NC* No connect(3) 22 NC NC Do not connect 16 WP I: Constant(1) Hibernate mode enable (high input will disable the module) 23 CS 24 NC NC SPI Chip Select input, constant drive or pull-up required 25 GND P Ground 26 DEBUGRX I Serial debug port input (see Section 2.0 “Circuit Description”) 27 DEBUGTX O Serial debug port output (see Section 2.0 “Circuit Description”) 28 GND P Ground Do not connect 29 VDD P Power 30 GND P Ground 31 NC NC 32 SDO O 33 INT O Interrupt output (open drain – requires a pull-up) 34 SCK I SPI clock input Do not connect SPI data out 35 SDI I SPI data in 36 GND P Ground Legend: Pin type abbreviation: P = Power Input, I = Input, O = Output, NC = Do Not Connect, NC* = No Connect Note 1: 2: 3: 4: Signals of Type “I: Constant” must either be constantly driven by the host or have a pull-up or pull-down (in case the host is likely to tri-state the signal during power down modes). The constant drive is used to ensure defined operation of the part and to minimize leakage current during low power modes. WP is used as write-protect for the internal module SPI Flash. For production use, this pin should be pulled low. This pin can be controlled by the host microcontroller to enable in field Flash updates. Signals of Type “NC*” were JTAG function pins on previous family devices. Signals on these pins will have no functional affect and will not impact the operation of this device. This signal should be left floating or pulled high only to support lowest 802.11PS power mode.  2012-2021 Microchip Technology Inc. DS70000686C-page 7 MRF24WG0MA/MB 1.2 Mounting Details The MRF24WG0MA/MB is a surface mountable module. Module dimensions are shown in Figure 1-3. The module Printed Circuit Board (PCB) is 1 mm thick with castellated mounting points on two sides. FIGURE 1-3: MRF24WG0MA/MB MODULE PHYSICAL DIMENSIONS Note: DS70000686C-page 8 Antenna connector on MRF24WG0MB only.  2012-2021 Microchip Technology Inc. MRF24WG0MA/MB Figure 1-4 shows the recommended host PCB footprint for the module. The MRF24WG0MA has an integrated PCB antenna. For best performance, follow the mounting details shown in Figure 1-4. FIGURE 1-4: For best performance, mount the module on the PCB without metal obstructions in the keep out area of Figure 1-4. The antenna is tuned to have FR4 PCB material underneath the module. Do not “cut-out” host PCB material under the antenna. RECOMMENDED HOST PCB FOOTPRINT Note 1: The “Note 1” demarcation specifies the host PCB copper plane keep-out area on underlying board layers. It is permissible to route surface escape traces in this area.  2012-2021 Microchip Technology Inc. DS70000686C-page 9 MRF24WG0MA/MB Figure 1-5 illustrates the module reflow profile that is recommended for mounting the device onto the host PCB. FIGURE 1-5: PRELIMINARY MODULE REFLOW PROFILE AND SETPOINTS Zones 2 1 3 4 5 6 7 8 300 Temperature (°C) 250 200 150 100 50 0 0 50 100 150 200 250 300 Time (Seconds) TABLE 1-2: MODULE REFLOW PROFILE(1) Zone Temperature (°C) Note 1: 1 2 3 4 5 6 7 8 180° 180° 200° 200° 200° 220° 265° 270° Conveyor Speed: 90 cm/min DS70000686C-page 10  2012-2021 Microchip Technology Inc.  2012-2021 Microchip Technology Inc. 2.0 CIRCUIT DESCRIPTION The MRF24WG0MA/MB interfaces to Microchip PIC18, PIC24, dsPIC33 and PIC32 microprocessors with a minimal of external components through digitalonly connections. This section details use of the module, starting with an example host connection as shown in Figure 2-1. 2.1 Schematic FIGURE 2-1: MRF24WG0MA/MB EXAMPLE APPLICATION SCHEMATIC +3.3V 4x 4.7 K U1 MRF24WG0MA To System Reset Controller R2 4.7 K To Host Microcontroller +3.3V R4 4.7 K GND NC NC* NC* NC* NC* RESET NC NC* GND NC NC NC NC NC WP VDD GND GND SDI SCK INT SDO NC GND VDD GND DEBUG_TX DEBUG_RX GND NC CS NC NC* HIBERNATE GND 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 NC + 3.3V To Host Microcontroller NC NC C1 10µF NC NC* DS70000686C-page 11 C2 10µF Note: The example application schematic is for suggested design purposes. Please refer to Table 1-1 in Section 1.0 “Device Overview” for the module pin descriptions. MRF24WG0MA/MB 1 2 3 4 5 6 7 8 NC 9 NC* 10 NC 11 NC 12 NC 13 NC 14 NC 15 NC 16 17 18 NC NC* NC* NC* NC* MRF24WG0MA/MB 2.2 Power-On Sequence The internal regulators for the digital and analog core power supplies are disabled by driving the HIBERNATE pin high. Figure 2-2 shows the power up sequence for the MRF24WG0MA/MB. There is an internal Power-on-Reset (POR) circuit which keeps the module in reset until VDD is within specification. The Hibernate and Reset signals are also used to control startup. In Figure 2-2, section A is controlled by the internal POR and section B is an FIGURE 2-2: allowance for the SPI bus to stabilize when the module supplies are enabled. Once Hibernate is disabled, the host software provides 1mS of startup to allow the SPI to stabilize. This time is pre-programmed into the host driver, and may need to be increased if sufficient initial drive current is not provided to the MRF24WG0MA/MB module. Section C is the driver controlled release from Reset period. This takes approximately 300 mS and is monitored by the stack driver. No additional time needs to be provided by user software for startup. MRF24WG0MA/MB POWER-ON SEQUENCE TIMING POR A 1 ms SPI Stabilize B Host driver auto-timed boot, approximately 50-300 ms after Reset Ready C VDD 2.7V Time DS70000686C-page 12  2012-2021 Microchip Technology Inc. MRF24WG0MA/MB 2.3 Power States 2.3.2 The MRF24WG0MA/MB has several power states. These are Hibernate, Sleep and Active (two substates), as shown in Figure 2-3. The selection of power state directly affects system behavior, and overall power consumption or battery life. There is also a “Stand-by” state that is not user-controlled. 2.3.1 HIBERNATE STATE An “Off” state is defined as no power applied to the device. The Hibernate mode is the closest to controlled off that the module can approach. It is controlled through the HIBERNATE pin (high input puts the module into Hibernate). When in Hibernate, the module only consumes leakage current, but does not maintain state. Hibernate has to be fully controlled by the PIC MCU. The module contains about 70 µF of internal bulk capacitance. Supplies should be provisioned to supply sufficient charge on release of hibernate for desired start time or sufficient delay must be provided in software after hibernate release and before releasing reset. This state provides the best battery life for embedded products. Entering Hibernate for intervals of less than 1 minute is not likely to save power. POWER SAVE (PS) MODE The PS mode is a low-power dynamic state that automatically implements the 802.11 Power Save feature. In this mode, if enabled, the module will enter PS mode when all activity is complete. The module will wake autonomously to any PIC intervention so it can check DTIM beacons from the Access Point. If any traffic is listed as queued for the module, then it will awake and get the data from the Access Point on the next possible opportunity. When data is acquired, the module will interrupt the PIC microcontroller on a normal “data available” indication. If no data is available on a DTIM check, the module reenters the Power Save state until the next DTIM. The DTIM interval is programmed at the Access Point. This state can provide “as if on” behavior of the radio with a significant power savings versus “always on”. The battery life expectation of this mode is several days to several weeks. This mode is characterized by a very low latency (as low as 200 ms) to begin data transfer from the state. 2.3.3 ACTIVE STATE The Active state is identified as one of two states where the radio circuitry is fully on. The two active states are the Receive state (RX ON) and the Transmit state (TX ON). 2.3.4 STAND-BY STATE The Stand-by state is not user-controlled but is noted as it helps identify and track certain operations of the module during power tracing. TABLE 2-1: MRF24WG0MA/MB POWER STATE DEFINITIONS State VDD CS Description Off 0V 0V Power is completely disconnected Hibernate 3.3V 3.3V Power Save 3.3V 0V Enabled by TCP/IP driver RX ON 3.3V 0V Receive circuits are on and receiving TX ON 3.3V 0V Transmit circuits are on and transmitting Stand-by 3.3V 0V State machine transition state only – not user controlled  2012-2021 Microchip Technology Inc. All internal power regulators are OFF – enabled by HIBERNATE pin DS70000686C-page 13 MRF24WG0MA/MB FIGURE 2-3: MRF24WG0MA/MB POWER-STATE DIAGRAM 10 µs Off RX On TX On Note 1 200 µs Hibernate Stand-by Note 1 200 µs Power Save Note 1: See Section 2.2 “Power-On Sequence”. DS70000686C-page 14  2012-2021 Microchip Technology Inc. MRF24WG0MA/MB 2.4 Serial Trace Port Interface The MRF24WG0MA/MB incorporates a Transmit Data pin (DEBUGTX) and a Receive Data pin (DEBUGRX) for serial debugging purposes. These pins can be connected to commercially available RS-232 line drivers/ receivers with appropriate external level shifters. The serial interface operates at 19200 (baud rate), 8 (data), N (parity), 1 (stop bit), N (flow control). 2.5 SPI Interface The client Serial Peripheral Interface (SPI) is used to interface with the host PIC microcontroller. The client SPI interface works with the Interrupt line (INT). When data is available for the PIC microcontroller during operation, the INT line is asserted (logic low) by the MRF24WG0MA/MB module. The INT line is deasserted (logic high) by the MRF24WG0MA/MB after the data is transferred to the host PIC microcontroller. The SPI SCK frequency can be up to 25 MHz. The client SPI interface implements the [CPOL = 0; CPHA = 0] and [CPOL = 1; CPHA = 1] modes (0 and 3) of operation. That is, data is clocked in on the first rising edge of the clock after Chip Select (CS) is asserted. Data is placed on the bus with most significant bit (MSb) first. The CS pin must be toggled with transfer blocks and cannot be held low permanently. The falling edge of CS is used to indicate the start of a transfer. The rising edge of CS is used to indicate the completion of a transfer. 2.6 PCB Antenna For the MRF24WG0MA, the PCB antenna is fabricated on the top copper layer and covered in solder mask. The layers below the antenna have no copper trace. It is recommended that the module be mounted on the edge of the host PCB. It is permitted for PCB material to be below the antenna structure of the module as long as no copper traces or planes are on the host PCB in that area. For best performance, place the module on the host PCB according to the details shown in Figure 1-4 in Section 1.0 “Device Overview”. The antenna patterns shown in the following plots are simulated results of the PCB antenna. Figure 2-4 illustrates the simulation drawing and Figure 2-5 and Figure 2-6 illustrate the two-dimensional (2D) and three-dimensional (3D) radiation patterns. The calculated average of the radiated field is shown in Figure 2-5, highlighted in yellow. The radiation pattern for the XZ plane is shown in red, and the YZ plane is shown in black. As shown, the most powerful radiation occurs in the XY plane (the red pattern). Figure 2-6 shows the relative position of the 3D radiation “donut” with reference to the module orientation. This is a very useful guide for placement of the module to obtain the maximum range. Figure 2-7 shows the 3D radiation pattern with the colored distribution of the radiation magnitude. The values range from -9 dB to +0.3 dB. This is very useful in interpreting the 2D radiation pattern. Figure 4-1 in Section 4.0 “Electrical Characteristics” shows the SPI timing diagram. Table 4-7 details the SPI timing AC characteristics.  2012-2021 Microchip Technology Inc. DS70000686C-page 15 MRF24WG0MA/MB FIGURE 2-4: DS70000686C-page 16 PCB ANTENNA SIMULATION DRAWING  2012-2021 Microchip Technology Inc. MRF24WG0MA/MB FIGURE 2-5: SIMULATED TWO-DIMENSIONAL RADIATION PATTERN Name Theta Angle Mag. m1 -60.0000 -60.0000 0.6323 m2 -20.0000 -20.0000 0.3962 m3 30.0000 30.0000 -0.1038 m4 100.0000 100.0000 -0.9490 m5 170.0000 170.0000 -0.1414 Curve Information Average db(GainTotal) Setup 1: LastAdaptive Freq. = “2.44 GHz” Phi = “0 deg” 0.0097 dB(GainTotal) Setup 2: LastAdaptive Freq. = “2.44 GHz” Phi = “0 deg” -3.2020 Radiation Pattern 1 Two-dimensional (2D) pattern, including the average on main radiation planes (Phi = 0 and 90 degrees).  2012-2021 Microchip Technology Inc. DS70000686C-page 17 MRF24WG0MA/MB FIGURE 2-6: SIMULATED THREE-DIMENSIONAL RADIATION PATTERN Radiation pattern against the module dimensions DS70000686C-page 18  2012-2021 Microchip Technology Inc.  2012-2021 Microchip Technology Inc. FIGURE 2-7: SIMULATED THREE-DIMENSIONAL RADIATION PATTERN MRF24WG0MA/MB DS70000686C-page 19 Three-dimensional (3D) pattern and magnitude distribution MRF24WG0MA/MB 2.7 External Antenna The MRF24WG0MB module has a 50 ultra-miniature coaxial (U.FL) connector to connect to an external 2.4 GHz antenna. Caution: The U.FL connector is fragile and can only tolerate a very limited number of insertions. The choice of antenna is limited to the antenna types the module has been tested with. Refer to the respective country in Section 3.0 “Regulatory Approval” for a list of tested and approved antenna types that may be used with the MRF24WG0MB module. A list of antennas approved for use with the module is provided in Table 2-2. TABLE 2-2: Type APPROVED EXTERNAL ANTENNA TYPES Manufacturer Part Number Gain Dipole Aristotle RFA-02-C2M2-D034 2 dBi PCB Aristotle RFA-02-P33-D034 1 dBi PCB Aristotle RFA-02-P05-D034 2 dBi PIFA Aristotle RFA-02-G03-D034 0 dBi DS70000686C-page 20  2012-2021 Microchip Technology Inc. MRF24WG0MA/MB 3.0 REGULATORY APPROVAL The MRF24WG0MA/MB module has received regulatory approvals for modular devices in the United States and Canada. Modular approval allows the end user to place the MRF24WG0MA/MB module inside a finished product and not require regulatory testing for an intentional radiator (RF transmitter), provided no changes or modifications are made to the module circuitry. Changes or modifications could void the user’s authority to operate the equipment. The end user must comply with all of the instructions provided by the Grantee, which indicate installation and/or operating conditions necessary for compliance. The MRF24WG0MA/MB module has been tested and conforms to EN 300 328 V1.7.1 (2006-10), European Standards. The module tests can be applied toward final product certification and Declaration of Conformity (DoC). Additional testing may be required depending on the end application. The integrator may still be responsible for testing the end product for any additional compliance requirements that become necessary with this module installed (for example, digital device emission, PC peripheral requirements, etc.) in the specific country that the end device will be marketed. For more information on regulatory compliance, refer to the specific country radio regulations in the following sections. 3.1 United States The MRF24WG0MA/MB has received Federal Communications Commission (FCC) CFR47 Telecommunications, Part 15 Subpart C “Intentional Radiators” 15.247 and modular approval in accordance with Part 15.212 Modular Transmitter approval. The MRF24WG0MA/MB module can be integrated into a finished product without obtaining subsequent and separate FCC approvals for intentional radiation. The MRF24WG0MA/MB module has been labeled with its own FCC ID number, and if the FCC ID is not visible when the module is installed inside another device, then the outside of the finished product into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording as follows: Contains Transmitter Module FCC ID: W7OMRF24WG0MAMB or Contains FCC ID: W7OMRF24WG0MAMB This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. A user’s manual for the product should include the following statement: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy, and if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: • Reorient or relocate the receiving antenna. • Increase the separation between the equipment and receiver. • Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. • Consult the dealer or an experienced radio/TV technician for help.  2012-2021 Microchip Technology Inc. DS70000686C-page 21 MRF24WG0MA/MB 3.1.1 RF EXPOSURE 3.2 Canada All transmitters regulated by FCC must comply with RF exposure requirements. OET Bulletin 65, Evaluating Compliance with FCC Guidelines for Human Exposure to Radio Frequency Electromagnetic Fields, provides assistance in determining whether proposed or existing transmitting facilities, operations or devices comply with limits for human exposure to Radio Frequency (RF) fields adopted by the Federal Communications Commission (FCC). The bulletin offers guidelines and suggestions for evaluating compliance. The MRF24WG0MA/MB module has been certified for use in Canada under Innovation, Science and Economic Development Canada (ISED, formerly Industry Canada) Radio Standards Specification (RSS) RSS-210 and RSSGen. Modular approval permits the installation of a module in a host device without the need to recertify the device. If appropriate, compliance with exposure guidelines for mobile and unlicensed devices can be accomplished by the use of warning labels and by providing users with information concerning minimum separation distances from transmitting structures and proper installation of antennas. Labeling Requirements for the Host Device (from RSP100, Issue 12, Section 5): The host device shall be properly labeled to identify the module within the host device. The following statement must be included as a CAUTION statement in manuals and OEM products to alert users of FCC RF exposure compliance: To satisfy FCC RF Exposure requirements for mobile and base station transmission devices, a separation distance of 20 cm or more should be maintained between the antenna of this device and persons during operation. To ensure compliance, operation at closer than this distance is not recommended. The antenna(s) used for this transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. 3.2.1 LABELING AND USER INFORMATION REQUIREMENTS The Industry Canada certification label of a module shall be clearly visible at all times when installed in the host device, otherwise the host device must be labeled to display the Industry Canada certification number of the module, preceded by the words “Contains transmitter module”, or the word “Contains”, or similar wording expressing the same meaning, as follows: Contains transmitter module IC: 7693A-24WG0MAMB User Manual Notice for License-Exempt Radio Apparatus (from Section 8.4 RSS-Gen, Issue 5, March 2019): User manuals for license-exempt radio apparatus shall contain the following or equivalent notice in a conspicuous location in the user manual or alternatively on the device or both: If the MRF24WG0MA/MB module is used in a portable application (i.e., the antenna is less than 20 cm from persons during operation), the integrator is responsible for performing Specific Absorption Rate (SAR) testing in accordance with FCC rules 2.1091. This device contains license-exempt transmitter(s)/ receiver(s) that comply with Innovation, Science and Economic Development Canada’s licenseexempt RSS(s). Operation is subject to the following two conditions: 3.1.2 1. This device may not cause interference; APPROVED EXTERNAL ANTENNA TYPES To maintain modular approval in the United States, only the antenna types that have been tested shall be used. It is permissible to use different antenna manufacturer provided the same antenna type and antenna gain (equal to or less than) is used. Testing of the MRF24WG0MB module was performed with the antenna types listed in Table 2-2 in Section 2.0 “Circuit Description”. 3.1.3 HELPFUL WEB SITES Federal Communications Commission (FCC): http://www.fcc.gov. 2. This device must accept any interference, including interference that may cause undesired operation of the device. L’émetteur/récepteur exempt de licence contenu dans le présent appareil est conforme aux CNR d’Innovation, Sciences et Développement économique Canada applicables aux appareils radio exempts de licence. L’exploitation est autorisée aux deux conditions suivantes: 1. L’appareil ne doit pas produire de brouillage; 2. L’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d’en compromettre le fonctionnement. DS70000686C-page 22  2012-2021 Microchip Technology Inc. MRF24WG0MA/MB Transmitter Antenna (From Section 6.8 RSS-GEN, Issue 5, March 2019): User manuals, for transmitters shall display the following notice in a conspicuous location: This radio transmitter [IC:7693A-24WG0MAMB] has been approved by Innovation, Science and Economic Development Canada to operate with the antenna types listed below, with the maximum permissible gain indicated. Antenna types not included in this list that have a gain greater than the maximum gain indicated for any type listed are strictly prohibited for use with this device. watts, the total antenna gain shall be added to the measured RF output power to demonstrate compliance to the specified radiated power limits. Approved external antenna types for the MR24WB0MA/MRF24WB0MB module are listed in Table 2-2. 3.2.4 HELPFUL WEB SITES Industry Canada: http://www.ic.gc.ca/ Le présent émetteur radio [IC:7693A-24WG0MAMB] a été approuvé par Innovation, Sciences et Développement économique Canadapour fonctionner avec les types d'antenne énumérés cidessous et ayant un gain admissible maximal. Les types d'antenne non inclus dans cette liste, et dont le gain est supérieur au gain maximal indiqué pour tout type figurant sur la liste, sont strictement interdits pour l'exploitation de l'émetteur. Immediately following the above notice, the manufacturer shall provide a list of all antenna types approved for use with the transmitter, indicating the maximum permissible antenna gain (in dBi) and required impedance for each. 3.2.2 RF EXPOSURE All transmitters regulated by ISED must comply with RF exposure requirements listed in RSS-102 - Radio Frequency (RF) Exposure Compliance of Radiocommunication Apparatus (All Frequency Bands). 3.2.3 APPROVED EXTERNAL ANTENNA TYPES Transmitter Antenna (from Section 7.1.2 RSS-Gen, Issue 3, December 2010): The MRF24WG0MA/MB module can only be sold or operated with antennas with which it was approved. Transmitter may be approved with multiple antenna types. An antenna type comprises antennas having similar in-band and out-of-band radiation patterns. Testing shall be performed using the highest gain antenna of each combination of transmitter and antenna type for which approval is being sought, with the transmitter output power set at the maximum level. Any antenna of the same type having equal or lesser gain as an antenna that had been successfully tested with the transmitter, will also be considered approved with the transmitter, and may be used and marketed with the transmitter. When a measurement at the antenna connector is used to determine RF output power, the effective gain of the device's antenna shall be stated, based on measurement or on data from the antenna manufacturer. For transmitters of output power greater than 10 milli-  2012-2021 Microchip Technology Inc. DS70000686C-page 23 MRF24WG0MA/MB 3.3 Europe 3.3.2.1 The MRF24WG0MA/MB module is Radio Equipment Directive (RED) assessed, CE marked, and have been manufactured and tested with the intention of being integrated into a final product. The MRF24WG0MA/MB module has been tested to RED 2014/53/EU Essential Requirements mentioned in the following European Compliance table. TABLE 3-1: EUROPEAN COMPLIANCE Certification Standards Safety EN 62368 Health EN 62311 Electro Magnetic Compatibility (EMC) EN 301 489-1 Radio EN300 328 Article 3.3.1 Hereby, Microchip Technology Inc. declares that the radio equipment type MRF24WG0MA/MB is in compliance with Directive 2014/53/EU. The full text of the EU declaration of conformity for this product is available at https://www.microchip.com/MRF24WG0MA (available under Documents > Certifications). 3.3.3 APPROVED ANTENNAS 3.1a For MRF24WG0MA/MB, the approval is received using the antenna shown in Table 2-2. 3.1b 3.3.4 EN 301 489-17 3.2 The ETSI provides guidance on modular devices in “Guide to the application of harmonised standards covering Article 3.1b and Article 3.2 of the Directive 2014/ 53/EU RED to multi-radio and combined radio and nonradio equipment” document available at http:// www.etsi.org/deliver/etsi_eg/203300_203399/203367/ 01.01.01_60/eg_203367v010101p.pdf. Note: SIMPLIFIED EU DECLARATION OF CONFORMITY To maintain conformance to the standards listed in the preceding European Compliance table, the module shall be installed in accordance with the installation instructions in this data sheet and shall not be modified. When integrating a radio module into a completed product, the integrator becomes the manufacturer of the final product and is therefore responsible for demonstrating compliance of the final product with the essential requirements against the RED. HELPFUL WEB SITES A document that can be used as a starting point in understanding the use of Short Range Devices (SRD) in Europe is the European Radio Communications Committee (ERC) Recommendation 70-03 E, which can be downloaded from the European Radio Communications Committee (ECC) at: http://www.ecodocdb.dk/. Additional helpful web sites are: • Radio Equipment Directive (2014/53/EU): https:// ec.europa.eu/growth/single-market/europeanstandards/harmonised-standards/red_en • European Conference of Postal and Telecommunications Administrations (CEPT): http://www.cept.org • European Telecommunications Standards Institute (ETSI): http://www.etsi.org The Radio Equipment Directive Compliance Association (REDCA): http://www.redca.eu/ LABELING AND USER INFORMATION REQUIREMENTS The label on the final product which contains the MRF24WG0MA/MB module must follow CE marking requirements. 3.3.2 CONFORMITY ASSESSMENT From ETSI Guidance Note EG 203367, section 6.1 Non-radio products are combined with a radio product: If the manufacturer of the combined equipment installs the radio product in a host non-radio product in equivalent assessment conditions (i.e. host equivalent to the one used for the assessment of the radio product) and according to the installation instructions for the radio product, then no additional assessment of the combined equipment against article 3.2 of the RED is required. DS70000686C-page 24  2012-2021 Microchip Technology Inc. MRF24WG0MA/MB 3.4 Other Regulatory Jurisdictions Should other regulatory jurisdiction certification be required by the customer, or the customer need to recertify the module for other reasons, a certification utility is available. The utility runs on a Window's PC and utilizes a USB to SPI converter to interface to the MRF24WG0MA/MB module. In order to use the utility, the MRF24WG0MA/MB module must be out of reset and not accessed by the system host. That is, the SPI signals to the MRF24WG0MA/MB module must be tristate, with Reset and Hibernate deasserted. The following signals will need to be brought from the MRF24WG0MA/MB module for connection to the PC (through the USB adapter): • • • • • • SDO SDI CS SCK INT GND For further regulatory Certification Utility and documentation, contact your local Microchip salesperson. 3.5 Wi-Fi® Alliance Wi-Fi Alliance Certification focuses on interoperability testing of devices based on 802.11 standards. Historically, when the certification process and programs were developed by Wi-Fi Alliance members, the vast majority of the 802.11 clients were PC-centric, and certification testing adequately addressed those types of devices. In subsequent years, the number of Wi-Fi devices that are not PC-centric has grown significantly. These non-standard devices, as a class of products, have been dubbed Application Specific Devices (ASDs) by the Wi-Fi Alliance. ASDs are 802.11 devices, for example clients or access points (APs), which cannot be tested under a standard Alliance test plan because they do not comply with the standard test configuration and/or because they are designed to perform a specific application. Examples include, but are not limited to: bar code scanners, pagers, recording devices, monitoring equipment, and cable modems. The APs or clients that are used to validate ASD compliance (from the standard test bed) will meet all of the requirements specified in the applicable System Interoperability Test Plans (referred to as the “standard test plan”), unless specifically exempted. The MRF24WG0MA/MB modules are in the ASD category. The modules are certified under Wi-Fi 802.11 with ASD Model Test Plan with Test Engine For IEEE 802.11a, b, and g Devices (Version 1.0).  2012-2021 Microchip Technology Inc. DS70000686C-page 25 MRF24WG0MA/MB NOTES: DS70000686C-page 26  2012-2021 Microchip Technology Inc. MRF24WG0MA/MB 4.0 ELECTRICAL CHARACTERISTICS TABLE 4-1: DIGITAL ELECTRICAL CHARACTERISTICS (NOMINAL CONDITIONS: 25ºC, VDD = 3.3V) Parameters Min Typ Max Units VIL (Input low voltage) -0.3 — 0.8 V VIH (Input high voltage) 2 — 5.5 V VOL (Output low voltage) — — 0.4 V VOH (Output high voltage) 2.4 — — V IOL (Output low level current at VOL Max) — 8.5 — mA IOH (Output high level current at VOH Min) — 15.4 — mA TABLE 4-2: ABSOLUTE MAXIMUM RATINGS(1) Parameters Storage Temperature Min Max -40ºC +125ºC — 0V 3.60V — VDD Notes -0.3V 3.60V — VIN on SDI, CS, SCK Note 1: The listed Absolute Maximum Ratings are not meant for functional operation. Operation exceeding these levels is not guaranteed, and may reduce the operating life of the component. TABLE 4-3: RECOMMENDED OPERATING CONDITIONS Parameters Min Typ Max Units Ambient Temperature -40 — +85 Degrees Celsius VDD – for USA and Canada 2.80 3.3 3.60 Volts VDD – for Europe 3.0 3.3 3.60 Volts TABLE 4-4: CURRENT CONSUMPTION(1) (NOMINAL CONDITIONS: 25ºC, VDD = 3.3V) Parameters IDD, Hibernate = 3.3V Min Typ Max Units Conditions — 0.1 — mA — — mA — IDD, Power Save (software enabled) — 4(2) IDD, RX on, Receive @ -91 dBm with 1 Mbps modulated signal at antenna port — 156 — mA — IDD, TX on, 802.11b, +18 dBm — 237 — mA Measured at 11 Mbps IDD, TX on, 802.11g, +16 dBm — 226 — mA Measured at 6 Mbps Note 1: Current Consumption values represent Typical Peak currents, and the measured current conditions were done with 85% duty cycle modulated signal. Wi-Fi applications typically operate at less than 85% TX duty cycle. TX current is dependent on such criteria as transmit power setting, and transmit data rate and bandwidth being used. RX current is affected by connection distance. 2: Power Save current is current consumed during periods of “stand-by” between DTIM beacons. The module will awake 2 ms before a DTIM and turn on its receiver, and possibly its transmitter (if data is available).  2012-2021 Microchip Technology Inc. DS70000686C-page 27 MRF24WG0MA/MB TABLE 4-5: RECEIVER AC CHARACTERISTICS(1) Parameters Min Flo Typ Max Units 2412 — 2484 MHz RX Min Input Level Sensitivity, 1 Mbps, 8% PER — -95 — dBm RX Min Input Level Sensitivity, 2 Mbps, 8% PER — -88 — dBm RX Max Input Level (Power), 1 Mbps, 8% PER — -4 — dBm RX Max Input Level (Power), 2 Mbps, 8% PER — -4 — Note 1: Nominal conditions: 25ºC, VDD = 3.3V, Flo = 2437 MHz, measurements at antenna port. TABLE 4-6: dBm TRANSMITTER AC CHARACTERISTICS(1) Parameters Min Typ Max Units Flo 2412 — 2484 MHz Average POUT (transmit spectrum mask compliant) — +18 — dBm Average POUT gain step resolution from +5 to +10 dBm(2) — 0.5 — dB Max.(2) Average POUT gain step resolution from -5 to — 1.0 — dB Note 1: Nominal conditions: 25ºC, VDD = 3.3V, Flo = 2437 MHz, 2 Mbps. modulated signal measured at antenna port. 2: Gain step control is not calibrated. Steps are shown for planning purposes only. DS70000686C-page 28  2012-2021 Microchip Technology Inc. MRF24WG0MA/MB FIGURE 4-1: SPI INPUT TIMING TCSD TSCK CS(1) TCSH TCSS SCK TSU SI THD MSb In LSb In High-Impedance SO Note 1: CS must be toggled for each SPI block transfer. FIGURE 4-2: SPI OUTPUT TIMING CS TSCK SCK TV SO TV TDIS MSb Out LSb Out Don’t Care SI LSb In TABLE 4-7: SPI INTERFACE AC CHARACTERISTICS Symbol Parameters Min Max Units TSCK SCK Period 40 — ns TCSD CS High time 50 — ns TCSS CS Setup time 50 — ns TCSH CS Hold time 50 — ns TSU SDI Setup time 10 — ns THD SDI Hold time 10 — ns TV SDO Valid time — 15 ns  2012-2021 Microchip Technology Inc. DS70000686C-page 29 MRF24WG0MA/MB NOTES: DS70000686C-page 30  2012-2021 Microchip Technology Inc. MRF24WG0MA/MB APPENDIX A: REVISION HISTORY Revision A (August 2012) This is the initial released version of the document. Revision B (October 2012) This revision includes the following updates: • TABLE 1-1: “Pin Description” is updated and new note added • FIGURE 2-1: “MRF24WG0MA/MB Example Application Schematic” is updated • Updated the section 2.3.1 “Hibernate State” Revision C (May 2021) • Updated Section 3.3 “Europe” • Updated with the new terminologies. For more details, see the below note. Note: Microchip is aware that some terminologies used in the technical documents and existing software codes of this product are outdated and unsuitable. This document may use these new terminologies, which may or may not reflect on the source codes, software GUIs and the documents referenced within this document. The following table shows the relevant terminology changes made in this document. TABLE 1: TERMINOLOGY RELATED CHANGES Old Terminology New Terminology Slave Client  2012-2021 Microchip Technology Inc. Description • Section 1.1 “Interface Description” is updated with the new terminology. • Figure 1-1 is updated with the new terminology. • Section 2.5 “SPI Interface” is updated with the new terminology. DS70000686C-page 31 MRF24WG0MA/MB NOTES: DS70000686C-page 32  2012-2021 Microchip Technology Inc. MRF24WG0MA/MB PRODUCT IDENTIFICATION SYSTEM To order parts, including industrial, or obtain information, for e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. M X T -X Device Module Module Type Tape and Reel Temperature Range Device MRF24WG0MA/MB; VDD range 2.8V to 3.60V Temperature Range I = -40C to +85C (Industrial Temperature)  2012-2021 Microchip Technology Inc. Examples: a) MRF24WG0MA-I/RM = Industrial Temp DS70000686C-page 33 MRF24WG0MA/MB NOTES: DS70000686C-page 34  2012-2021 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specifications contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is secure when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods being used in attempts to breach the code protection features of the Microchip devices. We believe that these methods require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Attempts to breach these code protection features, most likely, cannot be accomplished without violating Microchip's intellectual property rights. • Microchip is willing to work with any customer who is concerned about the integrity of its code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code. Code protection does not mean that we are guaranteeing the product is "unbreakable." Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication is provided for the sole purpose of designing with and using Microchip products. Information regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. THIS INFORMATION IS PROVIDED BY MICROCHIP "AS IS". MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIED WARRANTIES OF NONINFRINGEMENT, MERCHANTABILITY, AND FITNESS FOR A PARTICULAR PURPOSE OR WARRANTIES RELATED TO ITS CONDITION, QUALITY, OR PERFORMANCE. IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT, SPECIAL, PUNITIVE, INCIDENTAL OR CONSEQUENTIAL LOSS, DAMAGE, COST OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THE INFORMATION OR ITS USE, HOWEVER CAUSED, EVEN IF MICROCHIP HAS BEEN ADVISED OF THE POSSIBILITY OR THE DAMAGES ARE FORESEEABLE. TO THE FULLEST EXTENT ALLOWED BY LAW, MICROCHIP'S TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USE WILL NOT EXCEED THE AMOUNT OF FEES, IF ANY, THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FOR THE INFORMATION. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Trademarks The Microchip name and logo, the Microchip logo, Adaptec, AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud, chipKIT, chipKIT logo, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, HELDO, IGLOO, JukeBlox, KeeLoq, Kleer, LANCheck, LinkMD, maXStylus, maXTouch, MediaLB, megaAVR, Microsemi, Microsemi logo, MOST, MOST logo, MPLAB, OptoLyzer, PackeTime, PIC, picoPower, PICSTART, PIC32 logo, PolarFire, Prochip Designer, QTouch, SAM-BA, SenGenuity, SpyNIC, SST, SST Logo, SuperFlash, Symmetricom, SyncServer, Tachyon, TimeSource, tinyAVR, UNI/O, Vectron, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. 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Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, Augmented Switching, BlueSky, BodyCom, CodeGuard, CryptoAuthentication, CryptoAutomotive, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, Espresso T1S, EtherGREEN, IdealBridge, In-Circuit Serial Programming, ICSP, INICnet, Intelligent Paralleling, Inter-Chip Connectivity, JitterBlocker, maxCrypto, maxView, memBrain, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple Blocker, RTAX, RTG4, SAM-ICE, Serial Quad I/O, simpleMAP, SimpliPHY, SmartBuffer, SMART-I.S., storClad, SQI, SuperSwitcher, SuperSwitcher II, Switchtec, SynchroPHY, Total Endurance, TSHARC, USBCheck, VariSense, VectorBlox, VeriPHY, ViewSpan, WiperLock, XpressConnect, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. The Adaptec logo, Frequency on Demand, Silicon Storage Technology, and Symmcom are registered trademarks of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2012-2021, Microchip Technology Incorporated, All Rights Reserved. For information regarding Microchip’s Quality Management Systems, please visit www.microchip.com/quality.  2012-2021 Microchip Technology Inc. ISBN: 978-1-5224-8055-6 DS70000686C-page 35 Worldwide Sales and Service AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://www.microchip.com/ support Web Address: www.microchip.com Australia - Sydney Tel: 61-2-9868-6733 India - Bangalore Tel: 91-80-3090-4444 China - Beijing Tel: 86-10-8569-7000 India - New Delhi Tel: 91-11-4160-8631 Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 China - Chengdu Tel: 86-28-8665-5511 India - Pune Tel: 91-20-4121-0141 Denmark - Copenhagen Tel: 45-4485-5910 Fax: 45-4485-2829 China - Chongqing Tel: 86-23-8980-9588 Japan - Osaka Tel: 81-6-6152-7160 Finland - Espoo Tel: 358-9-4520-820 China - Dongguan Tel: 86-769-8702-9880 Japan - Tokyo Tel: 81-3-6880- 3770 China - Guangzhou Tel: 86-20-8755-8029 Korea - Daegu Tel: 82-53-744-4301 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 China - Hangzhou Tel: 86-571-8792-8115 Korea - Seoul Tel: 82-2-554-7200 China - Hong Kong SAR Tel: 852-2943-5100 Malaysia - Kuala Lumpur Tel: 60-3-7651-7906 China - Nanjing Tel: 86-25-8473-2460 Malaysia - Penang Tel: 60-4-227-8870 China - Qingdao Tel: 86-532-8502-7355 Philippines - Manila Tel: 63-2-634-9065 China - Shanghai Tel: 86-21-3326-8000 Singapore Tel: 65-6334-8870 China - Shenyang Tel: 86-24-2334-2829 Taiwan - Hsin Chu Tel: 886-3-577-8366 China - Shenzhen Tel: 86-755-8864-2200 Taiwan - Kaohsiung Tel: 886-7-213-7830 Israel - Ra’anana Tel: 972-9-744-7705 China - Suzhou Tel: 86-186-6233-1526 Taiwan - Taipei Tel: 886-2-2508-8600 China - Wuhan Tel: 86-27-5980-5300 Thailand - Bangkok Tel: 66-2-694-1351 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 China - Xian Tel: 86-29-8833-7252 Vietnam - Ho Chi Minh Tel: 84-28-5448-2100 Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Austin, TX Tel: 512-257-3370 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Novi, MI Tel: 248-848-4000 Houston, TX Tel: 281-894-5983 Indianapolis Noblesville, IN Tel: 317-773-8323 Fax: 317-773-5453 Tel: 317-536-2380 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 Tel: 951-273-7800 Raleigh, NC Tel: 919-844-7510 New York, NY Tel: 631-435-6000 San Jose, CA Tel: 408-735-9110 Tel: 408-436-4270 Canada - Toronto Tel: 905-695-1980 Fax: 905-695-2078 DS70000686C-page 36 China - Xiamen Tel: 86-592-2388138 China - Zhuhai Tel: 86-756-3210040 Germany - Garching Tel: 49-8931-9700 Germany - Haan Tel: 49-2129-3766400 Germany - Heilbronn Tel: 49-7131-72400 Germany - Karlsruhe Tel: 49-721-625370 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Germany - Rosenheim Tel: 49-8031-354-560 Italy - Padova Tel: 39-049-7625286 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Norway - Trondheim Tel: 47-7288-4388 Poland - Warsaw Tel: 48-22-3325737 Romania - Bucharest Tel: 40-21-407-87-50 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 Sweden - Gothenberg Tel: 46-31-704-60-40 Sweden - Stockholm Tel: 46-8-5090-4654 UK - Wokingham Tel: 44-118-921-5800 Fax: 44-118-921-5820  2012-2021 Microchip Technology Inc. 02/28/20