MSC70SM120JCU2

MSC70SM120JCU2

  • 厂商:

    ACTEL(微芯科技)

  • 封装:

    SOT227-4

  • 描述:

    TRANS SJT N-CH 1.2KV 89A SOT227

  • 详情介绍
  • 数据手册
  • 价格&库存
MSC70SM120JCU2 数据手册
. MSC70SM120JCU2 Datasheet Boost Chopper SiC MOSFET Power Module January 2020 Contents Contents Revision History....................................................................................................................................1 1.1 Revision 1.0.........................................................................................................................................................1 Product Overview.................................................................................................................................2 2.1 Features..............................................................................................................................................................3 2.2 Benefits...............................................................................................................................................................3 2.3 Applications........................................................................................................................................................3 Electrical Specifications........................................................................................................................4 3.1 SiC MOSFET Characteristics................................................................................................................................4 3.2 SiC Chopper Diode Ratings and Characteristics..................................................................................................6 3.3 Thermal and Package Characteristics.................................................................................................................6 3.4 SiC MOSFET Performance Curves.......................................................................................................................7 3.5 SiC Diode Performance Curves.........................................................................................................................10 4 Package Specifications.....................................................................................................................11 4.1 Package Outline Drawing..................................................................................................................................11 Microsemi Proprietary and Confidential MSC70SM120JCU2 Datasheet Revision 1.0 ii Revision History 1 Revision History The revision history describes the changes that were implemented in the document. The changes are listed by revision, starting with the most current publication. 1.1 Revision 1.0 Revision 1.0 was published in January 2020. It is the first publication of this document. Microsemi Proprietary and Confidential MSC70SM120JCU2 Datasheet Revision 1.0 1 Product Overview 2 Product Overview The MSC70SM120JCU2 device is a 1200 V, 89 A full Silicon Carbide power module. Figure 1 • Electrical Schematic of MSC70SM120JCU2 Device Figure 2 • SOT-227 Pinout Location All ratings at Tj = 25 °C, unless otherwise specified. Caution: These devices are sensitive to electrostatic discharge. Proper handling procedures should be followed. Microsemi Proprietary and Confidential MSC70SM120JCU2 Datasheet Revision 1.0 2 Product Overview 2.1 Features The following are the features of MSC70SM120JCU2 device: • SiC power MOSFET ◦ Low RDS(on) ◦ High temperature performance • SiC Schottky diode ◦ Zero reverse recovery ◦ Zero forward recovery ◦ Temperature independent switching behavior ◦ Positive temperature coefficient on VF 2.2 Benefits The following are the benefits of MSC70SM120JCU2 device: • High efficiency converter • Very low stray inductance • Outstanding performance at high frequency operation • Stable temperature behavior • Direct mounting to heatsink (isolated package) • Low junction-to-case thermal resistance • RoHS compliant 2.3 Applications The following are the applications of MSC70SM120JCU2 device: • AC and DC motor control • Switched mode power supplies • Power factor correction • Brake switch Microsemi Proprietary and Confidential MSC70SM120JCU2 Datasheet Revision 1.0 3 Electrical Specifications 3 Electrical Specifications This section provides the electrical specifications for the MSC70SM120JCU2 device. 3.1 SiC MOSFET Characteristics The following table shows the absolute maximum ratings of MSC70SM120JCU2 device. Table 1 • Absolute Maximum Ratings Symbol Parameters Maximum Ratings Unit VDSS Drain–source voltage 1200 V ID Continuous drain current TC = 25 °C 891 A TC = 80 °C 711 IDM Pulsed drain current 180 VGS Gate–source voltage –10/25 V RDSon Drain–source ON resistance 31 mΩ PD Power dissipation 395 W TC = 25 °C Note: 1. Specification of SiC MOSFET device but output current must be limited due to size of power connectors. The following table shows the electrical characteristics of MSC70SM120JCU2 device. Table 2 • Electrical Characteristics Symbol Characteristics Test Conditions IDSS Zero gate voltage drain current RDS(on) Drain–source on resistance Typ Max Unit VGS = 0 V ; VDS = 1200 V 10 100 μA VGS = 20 V TC = 25 °C 25 31 mΩ TC = 175 °C 40 ID = 40 A VGS(th) Gate threshold voltage VGS = VDS, ID = 1 mA IGSS Gate–source leakage current VGS = 20 V, VDS = 0 V Min 1.8 Microsemi Proprietary and Confidential MSC70SM120JCU2 Datasheet Revision 1.0 2.8 V 150 nA 4 Electrical Specifications The following table shows the dynamic characteristics of MSC70SM120JCU2 device. Table 3 • Dynamic Characteristics Symbol Characteristics Test Conditions Ciss Input capacitance VGS = 0 V Min Typ Max 3020 VDS = 1000 V Unit pF Coss Output capacitance 270 Crss Reverse transfer capacitance Qg Total gate charge Qgs Gate–source charge Qgd Gate–drain charge Td(on) Turn-on delay time Tr Rise time Td(off) Turn-off delay time Tf Fall time Eon Turn on energy Inductive Switching Tj = 150°C 0.99 mJ Eoff Turn off energy VGS = –5/20 V Tj = 150°C 0.66 mJ 0.88 Ω f = 1 MHz 25 VGS= –5/20 V 232 VBus = 800 V nC 41 ID = 40 A 50 VGS = –5/20 V 30 VBus = 600 V ns 30 ID = 50 A RGon = 8 Ω 50 RGoff = 4.7 Ω 25 VBus = 600 V ID = 50A RGon = 8 Ω RGoff = 4.7 Ω RGint Internal gate resistance RthJC Junction-to-case thermal resistance 0.38 °C/W The following table shows the body diode ratings and characteristics of MSC70SM120JCU2 device. Table 4 • Body Diode Ratings and Characteristics Symbol Characteristics Test Conditions VSD Diode forward voltage VGS = 0 V Min Typ 4 Max Unit V ISD = 40 A VGS = –5 V 4.2 ISD = 40 A trr Reverse recovery time Qrr Reverse recovery charge Irr Reverse recovery current ISD = 40 A VGS = –5 V VR = 800 V diF/dt = 1000 A/μs 90 ns 550 nC 13.5 A Microsemi Proprietary and Confidential MSC70SM120JCU2 Datasheet Revision 1.0 5 Electrical Specifications 3.2 SiC Chopper Diode Ratings and Characteristics The following table shows the SiC chopper diode ratings and characteristics of MSC70SM120JCU2 device. Table 5 • SiC Chopper Diode Ratings and Characteristics Symbol Characteristics VRRM Peak repetitive reverse voltage IRM Reverse leakage current IF DC forward current VF Diode forward voltage VR=1200 V IF = 50 A Min Typ TJ = 25 °C 15 TJ = 175 °C 250 TC = 100 °C 50 TJ = 25 °C 1.5 TJ = 175 °C 2.1 Max Unit 1200 V 400 μA A 1.8 V QC Total capacitive charge VR = 600 V 224 nC C Total capacitance f = 1 MHz, VR = 400 V 246 pF f = 1 MHz, VR = 800 V 182 RthJC 3.3 Test Conditions Junction-to-case thermal resistance 0.56 °C/W Thermal and Package Characteristics The following table shows the thermal and package characteristics of MSC70SM120JCU2 device. Table 6 • Thermal and Package Characteristics Symbol Characteristics Min Typ Max VISOL RMS isolation voltage, any terminal to case t =1 min, 50/60 Hz 2500 TSTG Storage temperature range –55 175 TJ Operating junction temperature range –55 175 TJOP Recommended junction temperature under switching conditions –55 TJmax–25 Torque Terminals and mounting screws Wt Package weight Unit V 1.1 29.2 Microsemi Proprietary and Confidential MSC70SM120JCU2 Datasheet Revision 1.0 °C N.m g 6 Electrical Specifications 3.4 SiC MOSFET Performance Curves The following images show the SiC MOSFET performance curves of the MSC70SM120JCU2 device. Figure 3 • Maximum Thermal Impedance Figure 4 • Output Characteristics, TJ=25 °C Figure 5 • Output Characteristics, TJ=175 °C Figure 6 • Normalized RDS(on) vs. Temperature Figure 7 • Transfer Characteristics Microsemi Proprietary and Confidential MSC70SM120JCU2 Datasheet Revision 1.0 7 Electrical Specifications Figure 8 • Switching Energy vs. Rg Figure 9 • Switching Energy vs. Current Figure 10 • Capacitance vs. Drain Source Voltage Figure 11 • Gate Charge vs. Gate Source Voltage Figure 12 • Body Diode Characteristics, TJ=25 °C Figure 13 • 3rd Quadrant Characteristics, TJ=25 °C Microsemi Proprietary and Confidential MSC70SM120JCU2 Datasheet Revision 1.0 8 Electrical Specifications Figure 14 • Body Diode Characteristics, TJ=175 °C Figure 15 • 3rd Quadrant Characteristics, TJ=175 °C Figure 16 • Operating Frequency vs. Drain Current Microsemi Proprietary and Confidential MSC70SM120JCU2 Datasheet Revision 1.0 9 Electrical Specifications 3.5 SiC Diode Performance Curves The following images show the SiC diode performance curves of MSC70SM120JCU2 device. Figure 17 • Maximum Thermal Impedance Figure 18 • Forward Characteristics Figure 19 • Capacitance vs. Reverse Voltage Microsemi Proprietary and Confidential MSC70SM120JCU2 Datasheet Revision 1.0 10 Package Specifications 4 Package Specifications The following section shows the package specification of MSC70SM120JCU2 device. 4.1 Package Outline Drawing The following image illustrates the package outline drawing of MSC70SM120JCU2 device. The dimensions are in millimeters and (inches). Figure 20 • Package Outline Drawing Microsemi Proprietary and Confidential MSC70SM120JCU2 Datasheet Revision 1.0 11 Legal Microsemi 2355 W. Chandler Blvd. Chandler, AZ 85224 USA Within the USA: +1 (480) 792-7200 Fax: +1 (480) 792-7277 www.microsemi.com © 2020 Microsemi and its corporate affiliates. All rights reserved. Microsemi and the Microsemi logo are trademarks of Microsemi Corporation and its corporate affiliates. All other trademarks and service marks are the property of their respective owners. Microsemi's product warranty is set forth in Microsemi's Sales Order Terms and Conditions. Information contained in this publication is provided for the sole purpose of designing with and using Microsemi products. Information regarding device applications and the like is provided only for your convenience and may be superseded by updates. Buyer shall not rely on any data and performance specifications or parameters provided by Microsemi. It is your responsibility to ensure that your application meets with your specifications. THIS INFORMATION IS PROVIDED "AS IS." MICROSEMI MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, NON-INFRINGEMENT, MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. IN NO EVENT WILL MICROSEMI BE LIABLE FOR ANY INDIRECT, SPECIAL, PUNITIVE, INCIDENTAL OR CONSEQUENTIAL LOSS, DAMAGE, COST OR EXPENSE WHATSOEVER RELATED TO THIS INFORMATION OR ITS USE, HOWEVER CAUSED, EVEN IF MICROSEMI HAS BEEN ADVISED OF THE POSSIBILITY OR THE DAMAGES ARE FORESEEABLE. TO THE FULLEST EXTENT ALLOWED BY LAW, MICROSEMI’S TOTAL LIABILITY ON ALL CLAIMS IN RELATED TO THIS INFORMATION OR ITS USE WILL NOT EXCEED THE AMOUNT OF FEES, IF ANY, YOU PAID DIRECTLY TO MICROSEMI FOR THIS INFORMATION. Use of Microsemi devices in life support, mission-critical equipment or applications, and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend and indemnify Microsemi from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microsemi intellectual property rights unless otherwise stated. Microsemi Corporation, a subsidiary of Microchip Technology Inc. (Nasdaq: MCHP), and its corporate affiliates are leading providers of smart, connected and secure embedded control solutions. Their easy-to-use development tools and comprehensive product portfolio enable customers to create optimal designs which reduce risk while lowering total system cost and time to market. These solutions serve more than 120,000 customers across the industrial, automotive, consumer, aerospace and defense, communications and computing markets. Headquartered in Chandler, Arizona, the company offers outstanding technical support along with dependable delivery and quality. Learn more at www.microsemi.com. MSCC-0344-DS-01050-1.0-0120 Microsemi Proprietary and Confidential MSC70SM120JCU2 Datasheet Revision 1.0 12
MSC70SM120JCU2
物料型号:MSC70SM120JCU2

器件简介: - 该设备是一个1200V、89A的全碳化硅功率模块。 - 电气原理图和SOT-227引脚位置图在文档中有详细说明。

引脚分配: - 引脚分配图显示了SOT-227封装的引脚位置。

参数特性: - 绝对最大额定值:例如漏源电压(Vpss)为1200V,连续漏源电流(IDM)为180A。 - 电气特性:例如零门极电压漏源电流(Ipss)、漏源导通电阻(Rds(on))、门极阈值电压(Vgsth)等。 - 动态特性:例如输入电容(Ciss)、输出电容(Coss)、反向传输电容(Crss)、总门极电荷(Qg)等。

功能详解: - 该设备具有碳化硅功率MOSFET和碳化硅肖特基二极管的特性,如低RDS(on)、高温性能、零反向恢复、零正向恢复等。 - 该设备的优点包括高效率转换器、非常低的杂散电感、高频操作时的卓越性能、稳定的温度行为、直接安装到散热器(隔离封装)、低结壳热阻等。

应用信息: - 应用领域包括交流和直流电机控制、开关模式电源、功率因数校正、制动开关等。

封装信息: - 封装规格包括封装外形图、尺寸和重量等信息。 - 热和封装特性:例如RMS隔离电压、存储温度范围、工作结温范围、推荐的开关条件下的结温等。
MSC70SM120JCU2 价格&库存

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