MSCSM120AM31CT1AG

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MSCSM120AM31CT1AG Datasheet Phase Leg SiC MOSFET Power Module January 2020 Contents Contents 1 Revision History.................................................................................................................................1 1.1 Revision 1.0.........................................................................................................................................................1 2 Product Overview..............................................................................................................................2 2.1 Features..............................................................................................................................................................3 2.2 Benefits...............................................................................................................................................................3 2.3 Application..........................................................................................................................................................3 3 Electrical Specifications.....................................................................................................................4 3.1 SiC MOSFET Characteristics (Per MOSFET).........................................................................................................4 3.2 Reverse SiC Diode Ratings and Characteristics (Per SiC Diode)..........................................................................6 3.3 Thermal and Package Characteristics.................................................................................................................6 3.4 Typical SiC MOSFET Performance Curves...........................................................................................................8 3.5 Typical SiC Diode Performance Curves.............................................................................................................11 4 Package Specifications.....................................................................................................................12 Microsemi Proprietary and Confidential MSCSM120AM31CT1AG Datasheet Revision 1.0 ii Tables Tables Table 1 • Absolute Maximum Ratings..................................................................................................................................4 Table 2 • Electrical Characteristics........................................................................................................................................4 Table 3 • Dynamic Characteristics........................................................................................................................................5 Table 4 • Body Diode Ratings and Characteristics................................................................................................................5 Table 5 • Reverse SiC Diode Characteristics.........................................................................................................................6 Table 6 • Package Characteristics.........................................................................................................................................6 Table 7 • Temperature Sensor NTC1.....................................................................................................................................7 Microsemi Proprietary and Confidential MSCSM120AM31CT1AG Datasheet Revision 1.0 iii Figures Figures Figure 1 • MSCSM120AM31CT1AG Electrical Schematic.....................................................................................................2 Figure 2 • MSCSM120AM31CT1AG Pinout Location............................................................................................................2 Figure 3 • Maximum Thermal Impedance............................................................................................................................8 Figure 4 • Output Characteristics, TJ = 25 °C........................................................................................................................8 Figure 5 • Output Characteristics, TJ = 175 °C......................................................................................................................8 Figure 6 • Normalized RDS(on) vs. Temperature..................................................................................................................8 Figure 7 • Transfer Characteristics........................................................................................................................................8 Figure 8 • Switching Energy vs. Rg........................................................................................................................................9 Figure 9 • Switching Energy vs. Current...............................................................................................................................9 Figure 10 • Capacitance vs. Drain Source Voltage................................................................................................................9 Figure 11 • Gate Charge vs. Gate Source Voltage.................................................................................................................9 Figure 12 • Body Diode Characteristics, TJ = 25 °C...............................................................................................................9 Figure 13 • 3rd Quadrant Characteristics, TJ = 25 °C............................................................................................................9 Figure 14 • Body Diode Characteristics, TJ = 175 °C...........................................................................................................10 Figure 15 • 3rd Quadrant Characteristics, TJ = 175 °C........................................................................................................10 Figure 16 • Operating Frequency vs. Drain Current...........................................................................................................10 Figure 17 • Maximum Thermal Impedance........................................................................................................................11 Figure 18 • Forward Characteristics...................................................................................................................................11 Figure 19 • Capacitance vs. Reverse Voltage......................................................................................................................11 Figure 20 • Package Outline...............................................................................................................................................12 Microsemi Proprietary and Confidential MSCSM120AM31CT1AG Datasheet Revision 1.0 iv Revision History 1 Revision History The revision history describes the changes that were implemented in the document. The changes are listed by revision, starting with the most current publication. 1.1 Revision 1.0 Revision 1.0 is the first publication of this document, published in January 2020. Microsemi Proprietary and Confidential MSCSM120AM31CT1AG Datasheet Revision 1.0 1 Product Overview 2 Product Overview The MSCSM120AM31CT1AG is a phase leg 1200 V/89 A full Silicon Carbide power module. Figure 1 • MSCSM120AM31CT1AG Electrical Schematic Figure 2 • MSCSM120AM31CT1AG Pinout Location All ratings at TJ = 25 °C unless otherwise specified. Caution: These devices are sensitive to electrostatic discharge. Proper handling procedures should be followed. Microsemi Proprietary and Confidential MSCSM120AM31CT1AG Datasheet Revision 1.0 2 Product Overview 2.1 Features The following are key features of the MSCSM120AM31CT1AG device: • SiC Power MOSFET ◦ Low RDS(on) ◦ High temperature performance • Silicon carbide (SiC) Schottky diode ◦ Zero reverse recovery ◦ Zero forward recovery ◦ Temperature-independent switching behavior ◦ Positive temperature coefficient on VF • Very low stray inductance • Internal thermistor for temperature monitoring • Aluminum nitride (AlN) substrate for improved thermal performance 2.2 Benefits The following are benefits of the MSCSM120AM31CT1AG device: • High power and efficiency converters and inverters • Outstanding performance at high frequency operation • Direct mounting to heatsink (isolated package) • Low junction-to-case thermal resistance • Solderable terminals both for power and signal for easy PCB mounting • Low profile • RoHS Compliant 2.3 Application The MSCSM120AM31CT1AG device is designed for the following applications: • Welding converters • Switched Mode Power Supplies • Uninterruptible Power Supplies • EV motor and traction drive Microsemi Proprietary and Confidential MSCSM120AM31CT1AG Datasheet Revision 1.0 3 Electrical Specifications 3 Electrical Specifications This section shows the electrical specifications of the MSCSM120AM31CT1AG device. 3.1 SiC MOSFET Characteristics (Per MOSFET) This section describes the electrical characteristics of the MSCSM120AM31CT1AG device. Table 1 • Absolute Maximum Ratings Symbol Parameter Maximum Ratings Unit VDSS Drain-source voltage 1200 V ID Continuous drain current TC = 25 °C 89 A TC = 80 °C 71 IDM Pulsed drain current 180 VGS Gate-source voltage –10/25 V RDSon Drain-source ON resistance 31 mΩ PD Power dissipation TC = 25 °C 395 W Table 2 • Electrical Characteristics Symbol Characteristic Test Conditions IDSS Zero gate voltage drain current VGS = 0 V; VDS = 1200 V RDSon Drain–source on resistance VGS = 20 V ID = 40 A VGS(th) Gate threshold voltage VGS = VDS, ID = 1 mA IGSS Gate–source leakage current VGS = 20 V, VDS = 0 V Min Typ Max Unit 10 100 μA TJ = 25 °C 25 31 mΩ TJ = 175 °C 40 1.8 Microsemi Proprietary and Confidential MSCSM120AM31CT1AG Datasheet Revision 1.0 2.8 V 150 nA 4 Electrical Specifications Table 3 • Dynamic Characteristics Symbol Characteristic Test Conditions Ciss Input capacitance VGS = 0 V Coss Output capacitance Crss Reverse transfer capacitance Qg Total gate charge Qgs Gate–source charge Qgd Gate–drain charge Td(on) Turn-on delay time Tr Rise time Td(off) Turn-off delay time Tf Fall time Eon Turn on energy Eoff Turn off energy Min Typ Max 3020 VDS = 1000 V Unit pF 270 f = 1 MHz 25 VGS= –5/20 V 232 VBus = 800 V nC 41 ID = 40 A 50 VGS = –5/20 V 30 VBus = 800 V ns 30 ID = 50 A RGon = 8Ω; RGoff = 4.7Ω 50 25 Inductive Switching TJ = 150 °C 0.99 mJ TJ = 150 °C 0.66 mJ 0.88 Ω VGS = –5/20 V VBus = 600 V ID = 50 A RGon = 8Ω RGoff = 4.7Ω RGint Internal gate resistance RthJC Junction-to-case thermal resistance 0.38 °C/W Max Unit Table 4 • Body Diode Ratings and Characteristics Symbol Characteristic Test Conditions Min Typ VSD Diode forward voltage VGS = 0 V; ISD = 40 A 4 VGS = –5 V; ISD = 40 A 4.2 ISD = 40 A; VGS = –5 V; VR = 800 V; diF/dt = 1000 A/μs 90 ns V trr Reverse recovery time Qrr Reverse recovery charge 550 nC Irr Reverse recovery current 13.5 A Microsemi Proprietary and Confidential MSCSM120AM31CT1AG Datasheet Revision 1.0 5 Electrical Specifications 3.2 Reverse SiC Diode Ratings and Characteristics (Per SiC Diode) The following section shows the reverse SiC diode ratings and characteristics per diode of the device. Table 5 • Reverse SiC Diode Characteristics Symbol Characteristic VRRM Peak repetitive reverse voltage IRRM Reverse leakage current IF DC forward current VF Diode forward voltage VR = 1200 V IF = 30 A Min Typ TJ = 25 °C 10 TJ = 175 °C 150 TC = 100 °C 30 TJ = 25 °C 1.5 TJ = 175 °C 2.1 Max Unit 1200 V 200 μA A 1.8 V QC Total capacitive charge VR = 600 V 130 nC C Total capacitance f = 1 MHz, VR = 400 V 141 pF f = 1 MHz, VR = 800 V 105 RthJC 3.3 Test Conditions Junction-to-case thermal resistance 0.9 °C/W Thermal and Package Characteristics This section shows the thermal and package characteristics of the device. Table 6 • Package Characteristics Symbol Characteristic Min VISOL RMS isolation voltage, any terminal to case t = 1 min, 50/60Hz 4000 TJ Operating junction temperature range –40 175 °C TJOP Recommended junction temperature under switching conditions –40 TJmax –25 °C TSTG Storage temperature range –40 125 °C TC Operating case temperature –40 125 °C Torque Mounting torque 2 3 N.m Wt Package weight 80 g To heatsink M4 Microsemi Proprietary and Confidential MSCSM120AM31CT1AG Datasheet Revision 1.0 Max Unit V 6 Electrical Specifications Table 7 • Temperature Sensor NTC1 Symbol Characteristic R25 Resistance at 25 °C Min ΔR25/R25 B25/85 T25 = 298.15 K ΔB/B TC= 100 °C Typ Max Unit 50 kΩ 5 % 3952 K 4 % Note: 1. See application note APT0406 on www.microsemi.com. Microsemi Proprietary and Confidential MSCSM120AM31CT1AG Datasheet Revision 1.0 7 Electrical Specifications 3.4 Typical SiC MOSFET Performance Curves This section shows the typical performance curves of the MSCSM120AM31CT1AG SiC MOSFET. Figure 3 • Maximum Thermal Impedance Figure 4 • Output Characteristics, TJ = 25 °C Figure 5 • Output Characteristics, TJ = 175 °C Figure 6 • Normalized RDS(on) vs. Temperature Figure 7 • Transfer Characteristics Microsemi Proprietary and Confidential MSCSM120AM31CT1AG Datasheet Revision 1.0 8 Electrical Specifications Figure 8 • Switching Energy vs. Rg Figure 9 • Switching Energy vs. Current Figure 10 • Capacitance vs. Drain Source Voltage Figure 11 • Gate Charge vs. Gate Source Voltage Figure 12 • Body Diode Characteristics, TJ = 25 °C Figure 13 • 3rd Quadrant Characteristics, TJ = 25 °C Microsemi Proprietary and Confidential MSCSM120AM31CT1AG Datasheet Revision 1.0 9 Electrical Specifications Figure 14 • Body Diode Characteristics, TJ = 175 °C Figure 15 • 3rd Quadrant Characteristics, TJ = 175 °C Figure 16 • Operating Frequency vs. Drain Current Microsemi Proprietary and Confidential MSCSM120AM31CT1AG Datasheet Revision 1.0 10 Electrical Specifications 3.5 Typical SiC Diode Performance Curves This section shows the typical performance curves of the MSCSM120AM31CT1AG SiC diode. Figure 17 • Maximum Thermal Impedance Figure 18 • Forward Characteristics Figure 19 • Capacitance vs. Reverse Voltage Microsemi Proprietary and Confidential MSCSM120AM31CT1AG Datasheet Revision 1.0 11 Package Specifications 4 Package Specifications This section shows the package outline of the MSCSM120AM31CT1AG device. All dimensions are in millimeters. Figure 20 • Package Outline Microsemi Proprietary and Confidential MSCSM120AM31CT1AG Datasheet Revision 1.0 12 Legal Microsemi 2355 W. Chandler Blvd. Chandler, AZ 85224 USA Within the USA: +1 (480) 792-7200 Fax: +1 (480) 792-7277 www.microsemi.com © 2020 Microsemi and its corporate affiliates. All rights reserved. Microsemi and the Microsemi logo are trademarks of Microsemi Corporation and its corporate affiliates. All other trademarks and service marks are the property of their respective owners. Microsemi's product warranty is set forth in Microsemi's Sales Order Terms and Conditions. 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