ISO-CMOS
MT8816
8 x 16 Analog Switch Array
Data Sheet
Features
September 2011
•
Internal control latches and address decoder
•
Short set-up and hold times
•
Wide operating voltage: 4.5 V to 13.2 V
•
12Vpp analog signal capability
•
RON 65 max. @ VDD = 12 V, 25C
•
RON 10 @ VDD = 12 V, 25C
•
Full CMOS switch for low distortion
•
Minimum feedthrough and crosstalk
•
Separate analog and digital reference supplies
•
Low power consumption ISO-CMOS technology
Ordering Information
MT8816AP1
MT8816APR1
MT8816AE1
MT8816AF1
Key systems
•
PBX systems
•
Mobile radio
•
Test equipment/instrumentation
•
Analog/digital multiplexers
•
Audio/Video switching
CS
STROBE
Description
The Zarlink MT8816 is fabricated in Zarlink’s ISOCMOS technology providing low power dissipation and
high reliability. The device contains a 8 x 16 array of
crosspoint switches along with a 7 to 128 line decoder
and latch circuits. Any one of the 128 switches can be
addressed by selecting the appropriate seven address
bits. The selected switch can be turned on or off by
applying a logical one or zero to the DATA input. VSS is
the ground reference of the digital inputs. The range of
the analog signal is from VDD to VEE. Chip Select (CS)
allows the crosspoint array to be cascaded for matrix
expansion.
DATA RESET
VDD
1
AX0
VEE
VSS
1
7 to 128
Decoder
8 x 16
Switch
Array
Latches
AY0
AY1
AY2
128
128
•••••••••••••••••••
Yi I/O (i=0-7)
Figure 1 - Functional Block Diagram
1
Zarlink Semiconductor Inc.
Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc.
Copyright 1997-2011, Zarlink Semiconductor Inc. All Rights Reserved.
••••••••••••••••
AX1
AX2
AX3
Tubes
Tape & Reel
Tubes
Trays
-40C to +85C
Applications
•
44 Pin PLCC*
44 Pin PLCC*
40 Pin PDIP*
44 Pin TQFP*
* Pb Free Matte Tin
Xi I/O
(i=0-15)
MT8816
Data Sheet
Change Summary
Changes from the January 2010 issue to the September 2011 issue.
Change
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
VDD
Y2
DATA
Y1
CS
Y0
NC
X0
X1
X2
X3
X4
X5
X12
X13
AY1
AY0
AX2
AX1
Y4
X14
X15
X6
X7
X8
X9
X10
X11
NC
NC
Y7
6 5 4 3 2 1 44 43 42 41 40
7
39
8
38
9
37
10
36
11
35
12
34
13
33
14
32
15
31
16
30
29
17
18 19 20 21 22 23 24 25 26 27 28
VSS
Y6
STROBE
Y5
VEE
Y4
AX1
AX2
AY0
AY1
NC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
44 PIN PLCC
RESET
NC
AY2
Y3
VDD
Y2
DATA
Y1
CS
40 PIN PLASTIC DIP
AX0
AX3
Y3
AY2
RESET
AX3
AX0
X14
X15
X6
X7
X8
X9
X10
X11
NC
Y7
VSS
Y6
STROBE
Y5
VEE
Removed leaded packages as per PCN notice.
NC
AX0
Ordering Information
44 43 42 4140 39 38 37 36 3534
NC
X14
X15
X6
X7
X8
X9
X10
X11
Y7
NC
1
2
3
4
5
6
7
8
9
10
11
33
32
31
30
29
28
27
26
25
24
23
12 13 14 1516 17 18 19 20 2122
VSS
Y6
STROBE
Y5
VEE
Y4
AX1
AX2
AY0
AY1
NC
1
Item
AX3
RESET
AY2
Y3
VDD
Y2
DATA
Y1
CS
Page
44 PIN TQFP
Figure 2 - Pin Connections
2
Zarlink Semiconductor Inc.
NC
Y0
X0
X1
X2
X3
X4
X5
X12
X13
NC
Y0
NC
X0
X1
X2
X3
X4
X5
X12
X13
NC
MT8816
Data Sheet
Pin Description
Pin #
Name
Description
1
Y3
Y3 Analog (Input/Output): this is connected to the Y3 column of the
switch array.
2
2
AY2
Y2 Address Line (Input).
42
3
3
RESET
43,44
4,5
4,5
AX3,AX0 X3 and X0 Address Lines (Inputs).
2, 3
6,7
7,8
X14, X15 X14 and X15 Analog (Inputs/Outputs): these are connected to the
X14 and X15 rows of the switch array.
4-9
8-13
9-14
X6-X11
41,1,11
14
6,15,16
NC
No Connection
10
15
17
Y7
Y7 Analog (Input/Output): this is connected to the Y7 column of the
switch array.
12
16
18
VSS
Digital Ground Reference.
13
17
19
Y6
Y6 Analog (Input/Output): this is connected to the Y6 column of the
switch array.
14
18
20
15
19
21
Y5
Y5 Analog (Input/Output): this is connected to the Y5 column of the
switch array.
16
20
22
VEE
Negative Power Supply.
17
21
23
Y4
Y4 Analog (Input/Output): this is connected to the Y4 column of the
switch array.
18,19
22, 23
24,25
AX1,AX2 X1 and X2 Address Lines (Inputs).
20,21
24, 25
26,27
AY0,AY1 Y0 and Y1 Address Lines (Inputs).
24,25
26, 27
30,31
X13, X12 X13 and X12 Analog (Inputs/Outputs): these are connected to the
X13 and X12 rows of the switch array.
26-31
28 - 33
32-37
X5-X0
22,23,33
34
28,29,
38
NC
No Connection.
32
35
39
Y0
Y0 Analog (Input/Output): this is connected to the Y0 column of the
switch array.
34
36
40
CS
Chip Select (Input): this is used to select the device. Active High.
TQFP
PDIP
PLCC
39
1
40
Master RESET (Input): this is used to turn off all switches regardless
of the condition of CS. Active High.
X6-X11 Analog (Inputs/Outputs): these are connected to the X6X11 rows of the switch array.
STROBE STROBE (Input): enables function selected by address and data.
Address must be stable before STROBE goes high and DATA must
be stable on the falling edge of the STROBE. Active High.
X5-X0 Analog (Inputs/Outputs): these are connected to the X5-X0
rows of the switch array.
3
Zarlink Semiconductor Inc.
MT8816
Data Sheet
Pin Description (continued)
Pin #
Name
Description
41
Y1
Y1 Analog (Input/Output): this is connected to the Y1 column of the
switch array.
38
42
DATA
DATA (Input): a logic high input will turn on the selected switch and a
logic low will turn off the selected switch. Active High.
37
39
43
Y2
Y2 Analog (Input/Output): this is connected to the Y2 column of the
switch array.
38
40
44
VDD
TQFP
PDIP
PLCC
35
37
36
Positive Power Supply.
4
Zarlink Semiconductor Inc.
MT8816
Data Sheet
Functional Description
The MT8816 is an analog switch matrix with an array size of 8 x 16. The switch array is arranged such that there
are 8 columns by 16 rows. The columns are referred to as the Y inputs/outputs and the rows are the X
inputs/outputs. The crosspoint analog switch array will interconnect any X I/O with any Y I/O when turned on and
provide a high degree of isolation when turned off. The control memory consists of a 128 bit write only RAM in
which the bits are selected by the address inputs (AY0-AY2, AX0-AX3). Data is presented to the memory on the
DATA input. Data is asynchronously written into memory whenever both the CS (Chip Select) and STROBE inputs
are high and are latched on the falling edge of STROBE. A logical “1” written into a memory cell turns the
corresponding crosspoint switch on and a logical “0” turns the crosspoint off. Only the crosspoint switches
corresponding to the addressed memory location are altered when data is written into memory. The remaining
switches retain their previous states. Any combination of X and Y inputs/outputs can be interconnected by
establishing appropriate patterns in the control memory. A logical “1” on the RESET input will asynchronously return
all memory locations to logical “0” turning off all crosspoint switches regardless of whether CS is high or low.
Two voltage reference pins (VSS and VEE) are provided for the MT8816 to enable switching of negative analog
signals. The range for digital signals is from VDD to VSS while the range for analog signals is from VDD to VEE. VSS
and VEE pins can be tied together if a single voltage reference is needed.
Address Decode
The seven address inputs along with the STROBE and CS (Chip Select) are logically ANDed to form an enable
signal for the resettable transparent latches. The DATA input is buffered and is used as the input to all latches. To
write to a location, RESET must be low and CS must go high while the address and data are set up. Then the
STROBE input is set high and then low causing the data to be latched. The data can be changed while STROBE is
high, however, the corresponding switch will turn on and off in accordance with the DATA input. DATA must be
stable on the falling edge of STROBE in order for correct data to be written to the latch.
Applications
Figure 3 shows a typical Operating Circuit of a video surveillance system using analog crosspoint switches which
allow multiple video sources switched to multiple output devices, e.g., video monitor, video recorder etc.
Quad Video Drivers
Analog Crosspoint Switch
Quad Video Amplifiers
NTSC
/ PAL
Cameras
Figure 3 - Typical Video Surveillance System
5
Zarlink Semiconductor Inc.
Video
Monitors
MT8816
Data Sheet
Figure 4 illustrates the major components of a video surveillance system. In the center is the MT8816, a 16 x 8
analog cross-point IC. At the left are 16 video input buffers CLC2005 from Cadeka Microcircuits. At the right hand
side are 8 video output buffers CLC2005 and each buffer is capable of driving a 75 ohm video load directly. BNC
connectors are provided for all video inputs and video outputs.
A FT245R USB FIFO from Future Technology Devices International (FTDI) provides a standard USB interface for a
PC. Through this USB connection the PC controls the switching of the video signals.
MT8816
Cadeka Output Buffers
16 x 8
Switch
matrix
Control and I/O
FTDI FT245R
USB
From
PC
Cadeka Input Buffers
Video In
(1 of 16)
Video Out
(1 of 8)
Figure 4 - Functional Block Diagram for a 16 x 8 Video Surveillance System using MT8816
6
Zarlink Semiconductor Inc.
MT8816
Data Sheet
Absolute Maximum Ratings*- Voltages are with respect to VEE unless otherwise stated.
Parameter
Symbol
Min.
Max.
Units
1
Supply Voltage
VDD
VSS
-0.3
-0.3
16.0
VDD+0.3
V
V
2
Analog Input Voltage
VINA
-0.3
VDD+0.3
V
3
Digital Input Voltage
VIN
VSS-0.3
VDD+0.3
V
4
Current on any I/O Pin
15
mA
5
Storage Temperature
+150
C
0.6
W
I
-65
TS
6 Package Power Dissipation
PLASTIC DIP
PD
* Exceeding these values may cause permanent damage. Functional operation under these conditions is not implied.
Recommended Operating Conditions - Voltages are with respect to VEE unless otherwise stated.
Characteristics
Sym.
Min.
Typ.
Max.
Units
TO
-40
25
85
C
1
Operating Temperature
2
Supply Voltage
VDD
VSS
4.5
VEE
13.2
VDD-4.5
V
V
3
Analog Input Voltage
VINA
VEE
VDD
V
4
Digital Input Voltage
VIN
VSS
VDD
V
Test Conditions
DC Electrical Characteristics†- Voltages are with respect to VEE = VSS = 0 V, VDD =12 V unless otherwise stated.
Characteristics
1
Quiescent Supply Current
Sym.
Min.
Typ.‡
Max.
Units
Test Conditions
1
100
A
All digital inputs at VIN=VSS or
VDD
0.4
1.5
mA
All digital inputs at VIN=2.4V +
VSS; VSS=7.0 V
5
15
mA
All digital inputs at VIN=3.4 V
1
500
nA
IVXi - VYjI = VDD - VEE
See Appendix, Fig. A.1
0.8+VS
V
VSS=7.5V; VEE=0 V
VSS=6.5V; VEE=0 V
IDD
2
Off-state Leakage Current
(See G.9 in Appendix)
IOFF
3
Input Logic “0” level
VIL
S
4
Input Logic “1” level
VIH
2.0+VSS
V
5
Input Logic “1” level
VIH
3.3
V
6
Input Leakage (digital pins)
ILEAK
0.1
10
A
All digital inputs at VIN = VSS
or VDD
† DC Electrical Characteristics are over recommended temperature range.
‡ Typical figures are at 25C and are for design aid only; not guaranteed and not subject to production testing.
7
Zarlink Semiconductor Inc.
MT8816
Data Sheet
DC Electrical Characteristics- Switch Resistance - VDC is the external DC offset applied at the analog I/O pins.
Characteristics
Sym.
25C
70C
Typ.
Max.
Typ.
85C
Max.
Typ.
Units
Test Conditions
Max.
1
On-state
VDD=12V
Resistance VDD=10V
VDD= 5V
(See G.1, G.2, G.3 in
Appendix)
RON
45
55
120
65
75
185
75
85
215
80
90
225
VSS=VEE=0 V,VDC=VDD/2,
IVXi-VYjI = 0.4 V
See Appendix, Fig. A.2
2
Difference in on-state
resistance between
two switches
(See G.4 in Appendix)
RON
5
10
10
10
VDD=12V, VSS=VEE=0,
VDC=VDD/2,
IVXi-VYjI = 0.4 V
See Appendix, Fig. A.2
AC Electrical Characteristics† - Crosspoint Performance-Voltages are with respect to VDD= 5 V, VSS= 0 V, VEE= -7 V, unless
otherwise stated.
Characteristics
Sym.
Typ.‡
Min.
Max.
Units
Test Conditions
1
Switch I/O Capacitance
CS
20
pF
f=1 MHz
2
Feedthrough Capacitance
CF
0.2
pF
f=1 MHz
3
Frequency Response
Channel “ON”
20LOG(VOUT/VXi)=-3 dB
F3dB
45
MHz
Switch is “ON”; VINA = 2Vpp
sinewave; RL = 1 k
See Appendix, Fig. A.3
4
Total Harmonic Distortion
(See G.5, G.6 in Appendix)
THD
0.01
%
Switch is “ON”; VINA = 2Vpp
sinewave f= 1 kHz; RL=1 k
5
Feedthrough
Channel “OFF”
Feed.=20LOG (VOUT/VXi)
(See G.8 in Appendix)
FDT
-95
dB
All Switches “OFF”; VINA=
2Vpp sinewave f= 1 kHz;
RL= 1 k.
See Appendix, Fig. A.4
6
Crosstalk between any two
channels for switches Xi-Yi and
Xj-Yj.
Xtalk
-45
dB
VINA=2Vpp sinewave
f= 10 MHz; RL = 75 .
-90
dB
VINA=2Vpp sinewave
f= 10 kHz; RL = 600 .
-85
dB
VINA=2Vpp sinewave
f= 10 kHz; RL = 1 k.
-80
dB
VINA=2Vpp sinewave
f= 1 kHz; RL = 10 k.
Refer to Appendix, Fig. A.5
for test circuit.
ns
RL=1 k; CL=50 pF
Xtalk=20LOG (VYj/VXi).
(See G.7 in Appendix).
7
Propagation delay through
switch
tPS
30
† Timing is over recommended temperature range. See Fig. 3 for control and I/O timing details.
‡ Typical figures are at 25C and are for design aid only; not guaranteed and not subject to production testing.
Crosstalk measurements are for Plastic DIPS only, crosstalk values for PLCC packages are approximately 5 dB better.
8
Zarlink Semiconductor Inc.
MT8816
Data Sheet
AC Electrical Characteristics† - Control and I/O Timings- Voltages are with respect to VDD = 5 V, VSS = 0 V, VEE = -7V, unless
otherwise stated.
Typ.‡
Characteristics
Sym.
Min.
Max.
1
Control Input crosstalk to switch
(for CS, DATA, STROBE,
Address)
CXtalk
30
mVpp
2
Digital Input Capacitance
CDI
10
pF
3
Switching Frequency
FO
4
Setup Time DATA to STROBE
tDS
10
ns
RL= 1 k,
CL=50 pF
¿
5
Hold Time DATA to STROBE
tDH
10
ns
RL= 1 k,
CL=50 pF
¿
6
Setup Time Address to
STROBE
tAS
10
ns
RL= 1 k,
CL= 50pF
¿
7
Hold Time Address to STROBE
tAH
10
ns
RL= 1 k,
CL=50 pF
¿
8
Setup Time CS to STROBE
tCSS
10
ns
RL= 1 k,
CL=50 pF
¿
9
Hold Time CS to STROBE
tCSH
10
ns
RL= 1 k,
CL=50 pF
¿
10
STROBE Pulse Width
tSPW
20
ns
RL= 1 k,
CL=50 pF
¿
11
RESET Pulse Width
tRPW
40
ns
RL= 1 k,
CL=50 pF
¿
12
STROBE to Switch Status Delay
tS
40
100
ns
RL= 1 k,
CL=50 pF
¿
13
DATA to Switch Status Delay
tD
50
100
ns
RL= 1 k,
CL=50 pF
¿
14
RESET to Switch Status Delay
tR
35
100
ns
RL= 1 k,
CL=50 pF
¿
20
Units
Test Conditions
VIN=3 V squarewave;
RIN=1 k, RL=10 k.
See Appendix, Fig. A.6
f=1 MHz
MHz
† Timing is over recommended temperature range. See Fig. 3 for control and I/O timing details.
Digital Input rise time (tr) and fall time (tf) = 5 ns.
‡ Typical figures are at 25C and are for design aid only; not guaranteed and not subject to production testing.
¿ Refer to Appendix, Fig. A.7 for test circuit.
9
Zarlink Semiconductor Inc.
MT8816
tCSS
Data Sheet
tCSH
50%
50%
tRPW
CS
50%
RESET
50%
tSPW
50%
STROBE
50%
50%
tAS
50%
ADDRESS
50%
tAH
50%
DATA
50%
tDS
tDH
ON
SWITCH*
OFF
tS
tD
Figure 5 - Control Memory Timing Diagram
* See Appendix, Fig. A.7 for switching waveform
10
Zarlink Semiconductor Inc.
tR
tR
MT8816
Data Sheet
AX0
AX1
AX2
AX3
AY0
AY1
AY2
Connection*
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
X0-Y0
X1-Y0
X2-Y0
X3-Y0
X4-Y0
X5-Y0
X12-Y0
X13-Y0
X6-Y0
X7-Y0
X8-Y0
X9-Y0
X10-Y0
X11-Y0
X14-Y0
X15-Y0
0
0
0
0
1
0
0
X0-Y1
1
1
1
1
1
0
0
X15-Y1
0
0
0
0
0
1
0
X0-Y2
1
1
1
1
0
1
0
X15-Y2
0
0
0
0
1
1
0
X0-Y3
1
1
1
1
1
1
0
X15-Y3
0
0
0
0
0
0
1
X0-Y4
1
1
1
1
0
0
1
X15-Y4
0
0
0
0
1
0
1
X0-Y5
1
1
1
1
1
0
1
X15-Y5
0
0
0
0
0
1
1
X0-Y6
1
1
1
1
0
1
1
X15-Y6
0
0
0
0
1
1
1
X0-Y7
1
1
1
1
1
1
1
X15-Y7
Table 1 - Address Decode Truth Table
* Switch connections are not in ascending order
11
Zarlink Semiconductor Inc.
MT8816
44 Pin TQFP
12
Zarlink Semiconductor Inc.
Data Sheet
For more information about all Zarlink products
visit our Web Site at
www.zarlink.com
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However, Zarlink assumes no liability for errors that may appear in this publication, or for liability otherwise arising from the application or use of any such
information, product or service or for any infringement of patents or other intellectual property rights owned by third parties which may result from such application or
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This publication is issued to provide information only and (unless agreed by Zarlink in writing) may not be used, applied or reproduced for any purpose nor form part
of any order or contract nor to be regarded as a representation relating to the products or services concerned. The products, their specifications, services and other
information appearing in this publication are subject to change by Zarlink without notice. No warranty or guarantee express or implied is made regarding the
capability, performance or suitability of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute
any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user’s responsibility to fully determine the performance and
suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. Manufacturing does
not necessarily include testing of all functions or parameters. These products are not suitable for use in any medical products whose failure to perform may result in
significant injury or death to the user. All products and materials are sold and services provided subject to Zarlink’s conditions of sale which are available on request.
Purchase of Zarlink’s I2C components conveys a license under the Philips I2C Patent rights to use these components in an I2C System, provided that the system
conforms to the I2C Standard Specification as defined by Philips.
Zarlink, ZL, the Zarlink Semiconductor logo and the Legerity logo and combinations thereof, VoiceEdge, VoicePort, SLAC, ISLIC, ISLAC and VoicePath are
trademarks of Zarlink Semiconductor Inc.
TECHNICAL DOCUMENTATION - NOT FOR RESALE