MTCH6303
MTCH6303 Projected Capacitive Touch Controller Data Sheet
Description
Microchip’s MTCH6303 is an innovative turnkey projected capacitive touch controller that provides multi-touch coordinates
as well as a readymade multi-finger surface gesture suite. MTCH6303 brings modern user interface (UI) elements – such as
pinch and zoom, multi-finger scrolling, and swipes – to any embedded design, with minimal host requirements.
The MTCH6303’s advanced signal processing provides noise-avoidance techniques and predictive tracking for ten
fingers, typically at 100 Hz each for five touches. It also combines with Microchip’s MTCH652 High-voltage Line Driver
to achieve a superior signal-to-noise ratio (SNR) for outstanding touch performance in noisy environments (refer to
www.microchip.com/MTCH652). These capabilities are critical in demanding environments such as industrial controls,
home and office automation with security control panels, thermostat, printers and lighting controls, and various
consumer applications including exercise equipment and audio systems.
Features
Power Management
• Multi-Touch up to Ten Touches
• Five Touches Typically at 100 Hz+ Each
• 27RX x 19TX Channels Support Approximately 8"
Touch Screens (larger possible)
• Combines with MTCH652 High-Voltage Driver for
Superior Signal-to-Noise Ratio (SNR)
• Integrated Single and Multi-finger Gesture
Recognition Suite including Taps, Swipes,
Scrolling, Pinching and Zooming
• Advanced Processing Provides Noise Avoidance
Techniques
• USB and I2C™ Communication
• Supports 3D Gestures up to 20 cm when
Combined with the MGC3130 GestIC® Controller
Example:
TABLE 1:
• 27RX 19TX Sensor
- 27 mA full-scan rate
- 1 mA reduced-scan rate
Applications
• Touch screen designs and touch pads that require
cost effective, easy to integrate, fast time to
market PCAP touch solutions
• Perfect for touch screens over displays, control
panels, keypads and many other input devices
• Targeting the industrial, medical, home and office
automation, and consumer markets
MTCH6303 SOLUTION PART NUMBERS
Device
Pin Count
MTCH6303-I/PT
MTCH6303-I/RG
64
*MTCH652-I/SO
*MTCH652-I/SS
Package Types
10 x10 mm TQFP
9 x 9 mm QFN
Touch Channels
Features
Up to 27 RX
Multi-touch, up to 8” sensors
Up to 19 TX
1.8 – 5.5V input, 6V – 18V
configurable output
7.5 mm SOIC
28
*MTCH652-I/MV
5.3 mm SSOP
4 x 4 mm UQFN
Note:
*One MTCH652 high-voltage driver (boost) is required with MTCH6303.
Note:
The MTCH6303 devices are pre-programmed with a Library Loader (bootloader) only. Refer to
Section 8.0, Firmware update for more details.
2015 Microchip Technology Inc.
Preliminary
DS40001803A-page 1
MTCH6303
PIN DIAGRAM
MTCH6303 64-PIN DIAGRAM TQFP/QFN
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
IN24
IRQ
IN23
NC
NC
NC
NC
VDD
VCAP
NC
BOOSTLE1
NC
BOOSTOE1
IN22
BOOSTCLK
IN21
FIGURE 1:
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
MTCH6303
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
COMM_SEL
DNC
NC
BOOSTPWM
BOOSTDO
NC
NC
NC
VSS
OSC2
OSC1
VDD
D+
DVUSB3V3
VBUS
NC
IN11
IN12
AVDD
AVSS
IN13
IN14
IN15
IN16
VSS
VDD
IN17
IN18
IN19
IN20
SDA
SCL
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
IN0
IN1
IN2
IN3
IN4
IN5
RESET
IN6
VSS
VDD
IN7
IN8
IN9
IN10
IN25
IN26
DS40001803A-page 2
Preliminary
2015 Microchip Technology Inc.
MTCH6303
PIN ALLOCATION TABLE
TABLE 2:
Name
MTCH6303 PINOUT DESCRIPTION
Pin
IN0
1
IN1
2
IN2
3
IN3
4
IN4
5
IN5
6
RESET
7
Description
IN 0 – 5
Reset
IN6
8
IN 6
VSS
9
Ground
VDD
10
Power Supply Input
IN7
11
IN8
12
IN9
13
IN10
14
IN25
15
IN26
16
IN11
17
IN12
18
AVDD
19
Positive supply for analog modules. This pin must be connected at all times.
AVSS
20
Ground reference for analog modules
IN13
21
IN14
22
IN15
23
IN 7 – 10
IN 25 – 26
IN 11 – 12
IN 13 – 16
IN16
24
VSS
25
Ground
VDD
26
Power Supply Input
IN17
27
IN18
28
IN19
29
IN 17 – 20
IN20
30
SDA
31
I2C™ Data
SCL
32
I2C Clock
2015 Microchip Technology Inc.
Preliminary
DS40001803A-page 3
MTCH6303
TABLE 2:
MTCH6303 PINOUT DESCRIPTION (CONTINUED)
Name
Pin
Description
33
42
43
44
47
DNC
53
Do not connect any signal to these pins.
55
58
59
60
61
VBUS
34
USB Bus Power Monitor
VUSB3V3
35
USB internal transceiver supply. If the USB module is not used, this pin must be
connected to VDD.
D-
36
USB D-
D+
37
USB D+
VDD
38
Power Supply Input
OSC1
39
Oscillator Pin 1
OSC2
40
Oscillator Pin 2
VSS
41
Ground
BOOSTDO
45
MTCH652 DO output/DIN Input
BOOSTPWM
46
MTCH652 PWM Out/OSCIN input
COMM_SEL
48
Communication Select Pin (VDD = I2C™, VSS = USB)
IN21
49
IN 21
BOOSTCLK
50
MTCH652 CLK Output
IN22
51
IN 22
BOOSTOE1
52
MTCH652 OE Output 1
BOOSTLE1
54
MTCH652 LE Output 1
VCAP
56
Capacitor for Internal Voltage Regulator
VDD
57
Power Supply Input
IN23
62
IN 23
IRQ
63
I2C Interrupt
IN24
64
IN 24
MGC_TS
42
Gesture Transfer Status
MGC_SDA
43
Gesture I2C Data
MGC_SCL
44
Gesture I2C Clock
MGC_MCLR
61
Gesture Reset
MGC_MODE
60
Gesture Mode Control
MGC_SYNC
47
Gesture Sync
DS40001803A-page 4
Preliminary
2015 Microchip Technology Inc.
MTCH6303
Table of Contents
1.0 Device Overview .......................................................................................................................................................................... 6
2.0 Layout........................................................................................................................................................................................... 7
3.0 Communication ............................................................................................................................................................................ 9
4.0 Message Protocol....................................................................................................................................................................... 15
5.0 Parameters................................................................................................................................................................................. 18
6.0 Communication Examples.......................................................................................................................................................... 22
7.0 Sensor Design Considerations................................................................................................................................................... 26
8.0 Firmware update ........................................................................................................................................................................ 29
9.0 Operating Modes........................................................................................................................................................................ 33
10.0 Application Commands .............................................................................................................................................................. 38
11.0 Gesture Features and Parameters............................................................................................................................................. 44
12.0 Electrical Specifications.............................................................................................................................................................. 48
13.0 Ordering Information .................................................................................................................................................................. 57
14.0 Packaging Information................................................................................................................................................................ 58
Appendix A: “Revision History” ............................................................................................................................................................ 65
The Microchip Web Site ....................................................................................................................................................................... 66
Product Identification System .............................................................................................................................................................. 67
Customer Change Notification Service ................................................................................................................................................ 66
Customer Support ................................................................................................................................................................................ 66
TO OUR VALUED CUSTOMERS
It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip
products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and
enhanced as new volumes and updates are introduced.
If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via
E-mail at docerrors@microchip.com. We welcome your feedback.
Most Current Data Sheet
To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at:
http://www.microchip.com
You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page.
The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000).
Errata
An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current
devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision
of silicon and revision of document to which it applies.
To determine if an errata sheet exists for a particular device, please check with one of the following:
• Microchip’s Worldwide Web site; http://www.microchip.com
• Your local Microchip sales office (see last page)
When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are
using.
Customer Notification System
Register on our web site at www.microchip.com to receive the most current information on all of our products.
2015 Microchip Technology Inc.
Preliminary
DS40001803A-page 5
MTCH6303
1.0
DEVICE OVERVIEW
FIGURE 1-1:
MTCH6303 BLOCK DIAGRAM
MTCH652
19
MTCH652
(Boost)
(SPI)
Prediction
Module
TX Drive Control
Touch
Sensor
Acquisition
Module
27
RX Electrode
Measurement
Touch Tracking/
Decoding
I²C™
I2C™ Engine
Noise Detection
& Management
Communications
& Diagnostics
USB
USB Stack
Sensor Configuration/Calibration
DS40001803A-page 6
Preliminary
2015 Microchip Technology Inc.
MTCH6303
2.0
LAYOUT
FIGURE 2-1:
TYPICAL APPLICATION CIRCUIT
Diag 2
Diag 1
VDD
Tantalum or ceramic
10 μF ESR ≤ 3Ω
GND
1 μF 25V
VDD
GND
28
27
26
25
24
23
22
OUT6
OUT7
VPP
VDD
VSS
OUT8
OUT9
OUT5
OUT4
LC
OUT3
OUT2
OUT1
OUT0
GND GND
21
20
19
18
17
16
15
8
9
10
11
12
13
14
GND
MTCH652
OUT10
OUT11
OUT12
OUT13
OUT14
OUT15
OUT16
OUT18
OUT17
OSCIN
OE
LE
DIN
CLK
1 μF
VDD
IN11
IN12
AVDD
AVSS
IN13
IN14
IN15
IN16
VSS
VDD
IN17
IN18
IN19
IN20
SDA
SCL
GND
MTCH6303
1
2
3
4
5
6
7
2.2 μH
8 MHz
GND
GND
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
GND
150k
18 pF
10k
VDD
*See Comm
Select Note3
COMM_SEL 48
47
BOOSTPWM 46
BOOSTDO 45
44
43
MGC_TS 42
VSS 41
OSC2 40
OSC1 39
VDD 38
D+ 37
D- 36
VUSB3V3 35
VBUS 34
33
0.1 μF
VDD VDD
IN0
IN1
IN2
IN3
IN4
IN5
RESET
IN6
VSS
VDD
IN7
IN8
IN9
IN10
IN25
IN26
18 pF
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
IN24 64
IRQ 63
IN23 62
61
60
59
58
VDD 57
VCAP 56
55
BOOSTLE1 54
53
BOOSTOE1 52
IN22 51
BOOSTCLK 50
IN21 49
GND
3
RX Channels
Comm Select Note
D+
DVBUS
VDD
VDD
1k1
1
To USB Host2
VDD
VDD
2
GND
GND
ESD Protection per
User Requirements
4.7k
1.8k
Resistors (discrete or networks) placed on all RX
lines as close to the MTCH6303 as possible
IRQ
SCL
SDA
I²C™
Configuration
COMM_SEL
COMM_SEL
USB
Configuration
To I2C™ Host
GND
VDD
5x 0.1 μF
SENSOR
GND
TX Channels
FIGURE 2-2:
SENSOR CHANNEL NAMING
CONVENTION
Throughout this document, there are references to
signals such as IN, RX, OUT and TX. This is
deliberately done to avoid confusion between sensor
channels and physical pins on the controller. Refer to
Figure 2-2 for an example of channel numbers chosen
randomly.
MTCH6303
• When referring to a sensor, the channels are
labeled RX0-RXn and TX0-TXn.
• When referring to the MTCH6303 controller, the
INn pins connect to any RXn on the sensor.
• When referring to the MTCH652 boost converter,
the OUTn pins connect to any TXn on the sensor.
2015 Microchip Technology Inc.
EXAMPLE OF CHANNEL
NUMBERS CHOSEN AT
RANDOM
Preliminary
SENSOR
IN4
IN5
...
INn
RX0
RX1
...
RXn
TX0
TX1
...
TXn
2.1
MTCH652
OUT18
OUT17
...
OUTn
DS40001803A-page 7
MTCH6303
2.2
Decoupling Capacitors
The use of decoupling capacitors on power supply
pins, such as VDD, VSS, is required. Consider the
following criteria when using decoupling capacitors.
2.2.1
VALUE AND TYPE OF CAPACITOR
A value of 0.1 µF (100 nF), 10-20V is recommended.
The capacitor should be a low Equivalent Series
Resistance (low ESR) capacitor and have resonance
frequency in the range of 20 MHz and higher. It is
further recommended that ceramic capacitors be used.
2.2.2
PLACEMENT ON THE PRINTED
CIRCUIT BOARD
The decoupling capacitors should be placed as close to
the pins as possible. It is recommended that the
capacitors be placed on the same side of the board as
the device. If space is restricted, the capacitor can be
placed on another layer on the PCB; however, ensure
that the trace length from the pin to the capacitor is
within one-quarter of an inch (6 mm) in length.
2.2.3
HANDLING HIGH-FREQUENCY
NOISE
If the board is experiencing high-frequency noise,
upward of tens of MHz, add a second ceramic-type
capacitor in parallel to the above described decoupling
capacitor. The value of the second capacitor can be in
the range of 0.01 µF to 0.001 µF. Place this second
capacitor next to the primary decoupling capacitor. In
high-speed circuit designs, consider implementing a
decade pair of capacitances as close to the power and
ground pins as possible. For example, 0.1 µF in parallel
with 0.001 µF.
2.2.4
MAXIMIZING PERFORMANCE
On the board layout from the power supply circuit, run
the power and return traces to the decoupling
capacitors first, and then to the device pins. This
ensures that the decoupling capacitors are first in the
power chain. Equally important is to keep the trace
length between the capacitor and the power pins to a
minimum, thereby reducing PCB track inductance.
2.3
Bulk Capacitors
The use of a bulk capacitor is recommended to improve
power supply stability. Typical values range from 4.7 µF
to 47 µF. This capacitor should be located as close to
the device as possible.
DS40001803A-page 8
Preliminary
2015 Microchip Technology Inc.
MTCH6303
3.0
COMMUNICATION
3.1
USB/I2C™ Selection
Both types of data are available over either USB or I2C,
as shown in the Table 3-2 below.
The MTCH6303 can communicate over either USB or
I2C™. The decision of which protocol is selected is
made on start-up and persists until the controller is
reset.
Communications are selectable between USB/I2C
through the use of the COMM_SEL pin, which must be
permanently tied to either VSS or VDD as follows:
TABLE 3-1:
3.2
TABLE 3-2:
Data Type
COMMUNICATIONS
CATEGORIES
I2C™
USB
Touch Data
Digitizer
endpoint
Register-based
memory map
Streamed
Messaging
Generic HID
endpoint
Stream buffers
accessed via
I2C™ registers
COMM_SEL SETTINGS
Setting
Communications Type
VDD
I2C™
VSS
USB
Communications Overview
Communications with the MTCH6303 fall into two main
categories:
1.
Touch Data: Data representing the current state
of any contact points; this is the main function of
the touch controller.
2. Streamed
Messaging:
Packet-based
messaging protocol used to:
• Send controller commands
• Read/Write parameters
• Receive diagnostic reports (when enabled)
• Read 2D gesture data
• Read 3D gesture data (requires MGC3130)
FIGURE 3-1:
COMMUNICATIONS OVERVIEW DIAGRAM
MTCH6303
I2C
USB EP1
Digitizer
Touch Registers
Touch Data
I²C™
USB EP2
Generic HID
Streamed
Messaging
Message Stream
Buffer (Output)
Message Stream
Buffer (Input)
Message Stream
Access Registers
IRQ
I²C™ Master
USB Host
USB
IRQ Logic
2015 Microchip Technology Inc.
Preliminary
DS40001803A-page 9
MTCH6303
3.3
USB Protocol
3.3.1
HID DIGITIZER (EP 1, TOUCH DATA)
TABLE 3-3:
HID DIGITIZER
6
5
4
3
2
0
REPORT ID (0X01)
1
PADDING
0
IR
TS
IR
TS
TOUCH ID 0
3
X1 LSB
4
X1 MSB
5
Y1 LSB
6
Y1 MSB
7
PADDING
8
TOUCH ID 1
9
X2 LSB
10
X2 MSB
11
Y2 LSB
12
Y2 MSB
..
..
..
..
..
..
..
..
..
..
..
..
47
PADDING
48
..
IR
TS
TOUCH ID 9
49
X4 LSB
50
X4 MSB
51
Y4 LSB
52
Y4 MSB
53
#OF VALID TOUCHES
TS = Touch State
R
[reserved]
Sequence counter, increments on
every HID packet.
• Values range from 0-63
SEQ
• IN and OUT packets utilize
independent sequence
counters
I2C™ PROTOCOL
3.4.1
OVERVIEW
The MTCH6303 uses a standard register-based read/
write I2C™ protocol. This protocol is similar to many
other devices such as temperature sensors and serial
EEPROMs. Although data can be read at any time
(polling), a configurable interrupt pin (INT) is provided
for flexible integration options.
3.4.2
READING/WRITING REGISTERS
To access memory (both to read or write), the I2C
transaction must start by addressing the chip with the
WRITE bit set, then writing out a single byte of data
representing the memory address to be operated on.
After that, the host can choose to do either of the
following:
1.
2.
To write memory, continue writing “n” data bytes.
To read memory, restart the I2C transaction (via
either a Stop and Start or Restart), then address
the chip with the READ bit set. Continue to read
“n” data bytes.
I2C™ TRANSACTION
DIAGRAM
FIGURE 3-3:
HID GENERIC (EP 2, STREAMED
MESSAGES)
I2CADDR
S
This generic endpoint is used to send and receive one
or more messages within the payload.
W
REGADDR
...
DATAIN
P
DATAOUT
P
Write
DATAIN
Read
FIGURE 3-2:
Value/Description
During either of these transactions, multiple bytes may
be read or written due to the device’s address
auto-increment feature.
Legend: IR = In Range
3.3.2
SeqCntr
[5:0]
3.4
TOUCHES 3-9
..
Byte Name
SeqCntr
[7:6]
TOUCH 2
2
1
TOUCH 1
7
HID GENERIC
Report ID 0x05 0x05 (Constant)
TOUCH 10
Byte
TABLE 3-4:
HID GENERIC
SR
I2CADDR
DATAOUT
S
Start Condition
SR Restart Condition
P
Stop Condition
R
...
W Write Bit
R
Read Bit
I2CADDR I2C™ Device Address (7bit)
REGADDR
DS40001803A-page 10
Preliminary
Register Address
2015 Microchip Technology Inc.
MTCH6303
3.4.3
DEVICE ADDRESSING
The device’s 7-bit base address is 0x25. Each
transmission must be prefixed with this address, as
well as a bit signifying whether the transmission is a
MASTER WRITE (0) or MASTER READ (1). After
appending this read/write bit to the base address, this
first byte becomes either 0x4A (write) or 0x4B (read).
Note:
If this address conflicts with another in the
system, it may be possible to customize
the device. Contact Microchip support for
more information.
EXAMPLE I2C™ READ
TRANSACTION
FIGURE 3-4:
I2C™
S
0x25
W
ACK
Address
0x10
ACK
SR
0x25
R
Data
0x01
ACK
P
NK
INT
Note:
Reading one byte from address 0x10, byte value is
0x01.
EXAMPLE I2C™ WRITE
TRANSACTION
FIGURE 3-5:
I2C™
Note:
S
0x25
W
ACK
Address
0x04
ACK
Data
0x80
ACK
P
Writing one byte to address 0x04, value 0x80.
2015 Microchip Technology Inc.
Preliminary
DS40001803A-page 11
MTCH6303
TABLE 3-5:
ADDR
I2C™ MEMORY MAP
NAME
7
6
5
4
3
2
1
0
Description
TOUCH
0x00
TOUCHSTATUS
R
MGC
GST
STR
IR
0x01
0x02
0x03
0x04
TOUCH 0
ID = touch ID, 0-16
X1 LSB
Y1 LSB
Y1 MSB
IR
0x07
0x08
IR = In Range, TS = Touch State
X1 MSB
0x06
0x0A
TS
TOUCH ID 1
0x05
0x09
MGC = GestIC® data, GST = Gestures
Ready, STR = Stream Ready
NUMTOUCHES
TS
TOUCH ID 1
TOUCH 1
X1 LSB
X1 MSB
0x0B
Y1 LSB
0x0C
Y1 MSB
0x0D
(TOUCH 2)
...
0x13
(TOUCH 3)
...
0x19
(TOUCH 4)
...
0x1F
(TOUCH 5)
...
0x25
(TOUCH 6)
...
0x2B
(TOUCH 7)
...
0x31
(TOUCH 8)
...
0x37
(TOUCH 9)
...
(format follows from above)
0x42
—
[RESERVED]
0x7F
STREAM BUFFER
0xF0
—
[RESERVED]
0xFA
0xFB
RX Bytes
Ready
RXRDY
Space available (bytes) for writing into
RX buffer
0xFC
RX Buffer
RXBUFF
Pointer to RX Buffer
0xFD
TX Bytes Left
TXRDY
Bytes ready to be read from TX buffer
0xFE
TX Buffer
TXBUFF
Pointer to TX Buffer
DS40001803A-page 12
Preliminary
2015 Microchip Technology Inc.
MTCH6303
3.4.4
TOUCH REGISTERS
3.4.5
Touch data can be read out of the touch registers at
any time, and is ensured to represent the latest state
of the sensor. Use of the IRQ pin can improve
efficiency by letting the host controller only read data
when necessary. (See Section 6.0, Communication
Examples for more details.)
FIGURE 3-6:
MESSAGE STREAM ACCESS
For sending and receiving stream messages
(described further on in this document), register-based
access to the message stream is provided as shown in
Figure 3-6.
MESSAGE STREAM ACCESS
INPUT STREAM
BUFFER
[BUFFER LOAD]
I2C™ REGISTERS
From HOST
0xFB
0xFC
RXRDY
RXBUFF
To HOST
0xFD
0xFE
TXRDY
TXBUFF
# BYTES LEFT
(SPACE AVAIL.)
[BUFFER READ]
To
MTCH
OUTPUT STREAM
BUFFER
[BUFFER READ]
# BYTES RDY
[BUFFER LOAD]
3.4.5.1
Reading Stream Messages Over I2C
The host discovers that data is ready to be read from
the stream by reading a non-zero value from the
TXRDY register. This register should be queried after
one of the following events:
• IRQ activity
• STR bit of TOUCHSTATUS register is set
• Polled at a random interval (of the host’s choosing)
To read the data, an I2C register read should be started
at the address of TXBUFF. The host can choose to
read any amount of bytes (up to the value in TXRDY).
3.4.5.2
3.4.5.3
From
MTCH
Interrupt Pin
To alert the host that new data is ready, an interrupt pin
(IRQ) is provided. The IRQ is an ‘open-drain’ output
that is pulled to GND when asserted, and highimpedance (tri-state) when not asserted. A suitable
pull-up resistor should be used on this output.
The IRQ can be configured using the parameters in
Table 3-6 below (refer to Section 5.0, Parameters for
accessing).
Writing Stream Messages Over I2C
The host can write messages directly into the address
of RXBUFF. Before writing, the host should check the
amount of space available for writing by reading the
RXRDY register.
2015 Microchip Technology Inc.
Preliminary
DS40001803A-page 13
MTCH6303
TABLE 3-6:
IRQ CONFIGURATION PARAMETERS
Parameter
Default
Description
irqMode
1
Overall IRQ mode
0 = IRQ deactivated
1 = IRQ level maintained until data read
2 = IRQ pulsed for [irqPulseWidth] msec
irqPolarity
0
IRQ Polarity control
0 = Active-Low,
1 = Active-High
irqPulseWidth
5
Value (msec) to pulse IRQ when irqMode is set to ‘2’
irqTrigger
2
Event control for IRQ activity
0 = Off
1 = Every touch decoding frame
2 = Any touch is present
3 = Only when touch is changed
DS40001803A-page 14
Preliminary
2015 Microchip Technology Inc.
MTCH6303
4.0
MESSAGE PROTOCOL
4.1
Overview
The MTCH6303 messaging protocol is used to send
and receive streamed messages. Full or partial
(fragment) messages may be exchanged with this
protocol.
Messages are transmitted in an overall ‘block’ size of
64 and must be split up accordingly. Refer to
Section 6.0,
Communication
Examples
for
depictions of messages being fragmented.
FIGURE 4-1:
7
6
TABLE 4-1:
Name
MESSAGE PROTOCOL
5:0
MTCH6303 MESSAGE
FORMAT
Description
B5-0 SZ
Size of message fragment. If 63 (0x3f), the
fragment is incomplete and uses up ALL
of the parent transport layer packet
Status/
Size
B6 C
1 = Continued (from last fragment)
0 = Not continued (start of message)
B7 M
1 = More messages to follow in this block
0 = Last message
Command ID, only sent on first
CMD ID fragment of message. For fragments
after, this is a normal payload byte.
CMD
Data bytes of message fragment.
Payload
4.2
Message Definitions
Messages starting with REP are reports sent from the
MTCH6303 to the host. Messages starting with CMD
are commands sent from the host to the MTCH6303.
Messages that require further clarification are
expanded upon in the following section.
2015 Microchip Technology Inc.
Preliminary
DS40001803A-page 15
ID
MESSAGE DEFINITIONS
Name
Payload Description
(assume uint8 unless noted)
Payload size
Gated by NVDM(1)
Description
0x04
REP_Echo
[data]...[datan]
[NO GATE]
It will echo the exact payload of a received ‘echo’ command
0x17
REP_FlashContents
[data]...[datan]
[NO GATE]
Flash contents readback (invoked by CMD_ReadFlash)
Preliminary
0x60
REP_AdcDbg
132
[rx] [tx] [freq] [RSVD] [uint16 D0] [uint16 D1]...[uint16 Dn]
NVDM_ADC
Raw sample output from ADC
0x90
REP_Trace
2
[location][event]
NVDM_DIAG
—
0xA0
REP_Swipe
2
[flags][fingers]
NVDM_GESTURE
Swipe gesture
0xA1
REP_Scroll
8
[fingers][diamHI][uint16 diameter][uint16 centerx][uint16 centery] NVDM_GESTURE
Scroll gesture
0xA2
REP_Tap
2
[flags][fingers]
NVDM_GESTURE
Tap gesture
0xB0
REP_Noise
[subID][data]...[datan]
NVDM_NOISE
Noise messages (see below)
0xC3
REP_MutNormSection
2+2*nodes
[rx][tx][uint16 node0][uint16 node1]...[uint16 noden]
NVDM_MUTCACHE
Sends out a dynamic amount of nodes (from 1 to full RX electrode)
0xCF
REP_ParameterRead
2+len
[uint16 address][data] (up to ‘len’ bytes)
[NO GATE]
Parameter read response
0xF0
REP_Ack
1
[command ID]
[NO GATE]
Acknowledgment of receipt of command
0xF2
REP_TouchFiltered
5*i
[STATE/ID][uint16 X][uint16 Y]
NVDM_FINGERPOS
Filtered (but not scaled) touch coordinates
0xF3
REP_TouchPredict
9
[ID][uint16 X0][uint16 Y0][uint16 Xpred][uint16 Ypred]
NVDM_RAWPOS
Prediction value for a touch
0xF4
REP_TouchRaw
5*i
[STATE/ID][uint16 X][uint16 Y]
NVDM_RAWPOS
Raw touch report (pre-filter)
0xF5
REP_TouchPos16
5*i
[PEN/ID][uint16 X][uint16 Y]
NVDM_FINGERPOS
Final scaled touch report – first byte has touch status as bit 7
0xFA
REP_SelfRaw
2*numRXch
[uint16 self0][uint16 self1]...[uint16 selfn]
NVDM_SELFRAW
Self measurements (raw)
0xFD
REP_SelfNorm
2*numRXch
[uint16 self0][uint16 self1]...[uint16 selfn]
NVDM_SELFNORM
Self measurements (normalized)
0xFE
REP_ForwardGestIC
[data]...[datan]
NVDM_GESTIC
Packet from GestIC® (direct)
0xFF
REP_FwVersion
[fwVersionInfo]
[NO GATE]
Large array of bytes denoting all firmware information
0x04
CMD_Echo
[data]...[datan]
n/a
Firmware will echo back any payload sent
0x17
CMD_ReadFlash
6
[uin32 address][uint16 size]
n/a
Allows host to read Flash contents of device (fw dump)
0x55
CMD_EnterBootLoader
0
(none)
n/a
Commands firmware to enter the bootloader – ACK will be sent
before jumping
2015 Microchip Technology Inc.
0xE0
CMD_SetParameter
10
[uint16 address][uint8[4] data][uint8[4] mask]
n/a
Writes a parameter
0xE1
CMD_GetParameter
2
[uint16 address]
n/a
Reads a parameter
0xFB
CMD_ForceBaseline
0
(none)
n/a
Forces a baseline
0xFC
CMD_ResetGestIC
0
(none)
n/a
Resets GestIC immediately
0xFD
CMD_GestIC
(gestic command)
n/a
Sends packet directly on to GestIC
0xFF
CMD_QueryVersion
0
(none)
n/a
Requests all firmware version information – bytes 124:127
represent Rev[2].Minor.Major
Note:
Refer to parameter documentation for explanation of NVDM bitfields.
MTCH6303
DS40001803A-page 16
TABLE 4-2:
MTCH6303
4.2.1
SET PARAMETER COMMAND
FIGURE 4-2:
ADDRESS
SET PARAMETER
COMMAND
DATA
MASK
Address:
16bit address location of parameter to set
Data:
32bit (4 bytes) data value to write. For data sizes
smaller than 4 bytes, pad with 0x00
Mask:
32 bit (4 bytes) mask value to mask off bits that should
not be set. (usually set to 0xFFFFFFFF)
4.2.2
GET PARAMETER COMMAND
FIGURE 4-3:
GET PARAMETER
COMMAND
ADDRESS
Address:
16bit address location of parameter to retrieve
2015 Microchip Technology Inc.
Preliminary
DS40001803A-page 17
MTCH6303
5.0
PARAMETERS
5.2
5.1
Operation
Many parameters are tuned by the MTCH6303 Utility
itself, so descriptions are not provided. Table 5-1 is
provided for reference only.
Default parameters are loaded on start-up, as shown in
the parameter table section. These values can be
modified during runtime, but will not be restored on
Reset. To permanently modify parameters, the
MTCH6303 Utility should be used to export and Flash
a new configuration. Refer to the MTCH6303 Utility
documentation for more information.
TABLE 5-1:
Parameter Table
PARAMETER TABLE
Module
Name
Address
Format
Default
Description
pub
mgc3130
0x0102
uint8_t
0
1 = MTC3130 is present
pub
numberOfRXChannels
0x0100
uint8_t
27
Number of RX channels currently in use
pub
numberOfTXChannels
0x0101
uint8_t
19
Number of TX channels currently in use
pub
diagMask
0x0080
uint16_t
[see NVDM]
[see NVDM]
pub
activeModules
0x0081
uint16_t
[see NVAM]
[see NVAM]
pub
streamingMode
0x0082
uint8_t
0
see Operating Modes
pub
swipeDistance
0x0501
uint16_t
4*256
See Gesture definition
pub
swipeTimeout
0x0500
uint32_t
msec2ticks(1500)(1)
See Gesture definition
pub
swipeBorder
n/a (struct)
n/a
See Gesture definition
pub
swipeBorder.left
0x0502
uint16_t
3*256
See Gesture definition
pub
swipeBorder.right
0x0503
uint16_t
24*256
See Gesture definition
pub
swipeBorder.top
0x0504
uint16_t
3*256
See Gesture definition
pub
swipeBorder.bottom
0x0505
uint16_t
16*256
See Gesture definition
n/a
See Gesture definition
uint16_t
2*256
See Gesture definition
pub
swipeExtBorder
n/a (struct)
pub
swipeExtBorder.left
0x0506
pub
swipeExtBorder.right
0x0507
uint16_t
25*256
See Gesture definition
pub
swipeExtBorder.top
0x0508
uint16_t
2*256
See Gesture definition
pub
swipeExtBorder.bottom
0x0509
uint16_t
17*256
See Gesture definition
pub
tapBorder
n/a (struct)
n/a
See Gesture definition
pub
tapBorder.left
0x0540
uint16_t
1*256
See Gesture definition
pub
tapBorder.right
0x0541
uint16_t
26*256
See Gesture definition
pub
tapBorder.top
0x0542
uint16_t
1*256
See Gesture definition
pub
tapBorder.bottom
0x0543
uint16_t
18*256
See Gesture definition
pub
tapTimeout
0x0544
uint32_t
mSec2Ticks(200)(1)
See Gesture definition
pub
dblTapTimeout
0x0545
uint32_t
mSec2Ticks(500) (1)
See Gesture definition
pub
commSelectMode
0x0584
uint8_t
0
0 = use COMMSEL pin, 1 = force I2C™,
2 = force USB
pub
irqPolarity
0x0581
uint8_t
0
0 = Active-Low, 1 = Active-High
pub
irqPulseWidth
0x0582
uint8_t
5
Value in msec to pulse (when mode 2)
pub
irqTrigger
0x0583
uint8_t
2
0 = Off, 1 = Set on frame, 2 = Set on
touch, 3 = Set on touch changed
pub
irqMode
0x0580
uint8_t
1
0 = Off, 1 = Level-trigger, 2 = Pulse-trigger
pub
idleTime2D
0x0103
uint16_t
100
Scan period while 2D is idle (in msec)
map
txSelfTape
0x02c0
uint16_t [66]
[see below]
map
rxPinMap
0x0200
uint8_t[27]
[see below]
map
rxPrechargePinMap
0x0240
uint8_t[27]
[see below]
map
txPinMap
0x0280
uint8_t[36]
[see below]
acq
baseUpdateTime
0x0802
uint32_t
mSec2Ticks(10000)
Calibration update rate
acq
selfScanPhase
0x0812
uint16_t[4]
{52,45,40,40}
Self measurement period
acq
selfScanISRPhase
0x0816
uint16_t[4]
{59,49,46,45}
Self measurement phase
acq
mutScanPeriode
0x0803
uint16_t[4]
{122,105,104,100}
Mutual measurement period
DS40001803A-page 18
Preliminary
(1)
2015 Microchip Technology Inc.
MTCH6303
TABLE 5-1:
PARAMETER TABLE (CONTINUED)
Module
Name
Address
Format
Default
Description
acq
mutScanPhase
0x0807
uint16_t[4]
{68,60,59,55}
Mutual measurement phase
acq
mutFreqHopping
0x080B
uint8_t
0
Frequency hopping control (0 =
enabled, 1-4 = lock to F0-F3)
acq
mutFreqHoppingLevel
0x080C
int8_t[4]
{0,0,0,0}
Linear gain to apply to results from each
frequency
acq
diagRxChannel
0x0800
uint8_t
0xff
acq
diagTxChannel
0x0801
uint8_t
0xff
acq
syncRxChannel
0x081A
uint8_t
0xff
acq
syncTxChannel
0x081B
uint8_t
0xff
acq
fullScanRxStart
0x081C
uint8_t
0
acq
fullScanRxStop
0x081D
uint8_t
27
acq
fullScanTxStart
0x081E
uint8_t
0
acq
fullScanTxStop
0x081F
uint8_t
19
dec
penDownTimer
0x0403
uint16_t
781
dec
penUpTimer
0x0404
uint16_t
781
dec
selfTouchThres
0x0400
uint8_t
60
dec
mutTouchThres
0x0401
uint8_t
60
dec
minCuspDelta
0x040b
uint8_t
25
dec
weightThreshold
0x0402
uint8_t
20
dec
minTouchDistance
0x040c
uint8_t
5*8
dec
fatThreshold
0x040d
uint8_t
95
dec
nbSampleSelf
0x0407
uint8_t
64
dec
touchActiveHysteresis2D
0x0409
uint16_t
1000
dec
touchActiveHysteresis2D3D
0x0401
uint16_t
50
rep
flipState
0x0041
uint8_t
0b010
rep
rxScale
n/a (struct)
rep
rxScale.shift
0x0042
uint8_t
7
rep
rxScale.divide
0x0043
uint8_t
27
rep
rxScale.offset
0x0044
uint16_t
rep
txScale
n/a (struct)
n/a
0
n/a
rep
txScale.shift
0x0045
uint8_t
7
rep
txScale.divide
0x0046
uint8_t
19
rep
txScale.offset
0x0047
uint16_t
0
mtc
mtch65x_active_config
none
uint32_t
0x27
10
mtc
mtch65x_periode_fast_rise
0x0900
uint16_t
mtc
mtch65x_periode_fast_rise_oc
0x0901
uint16_t
7
mtc
mtch65x_fast_rise_delay
0x0902
uint16_t
300
mtc
mtch65x_periode_self_measurement
0x090D
uint16_t[4]
{20,20,20,20}
mtc
mtch65x_periode_self_measurement_oc
0x0911
uint16_t[4]
{10,10,10,10}
mtc
mtch65x_periode_mutu_measurement
0x0905
uint16_t[4]
{66,60,59,58}
mtc
mtch65x_periode_mutu_measurement_oc
0x0909
uint16_t[4]
{16,15,14,14}
Note
1:
mSec2Ticks(ms) = (((ms) * 625 + 2) / 4)
2015 Microchip Technology Inc.
Preliminary
DS40001803A-page 19
MTCH6303
EXAMPLE 5-1:
COMPLICATED INITIALIZATIONS
rxPinMap = {(15), (14), (13), (12), (11), (10), (9), (8), (7), (6), (0), (1), (2), (3), (4), (5),
(19), (18), (17), (16), (27), (23), (22), (21), (20), (26), (24)}
rxPrechargePinMap = {(24), (24), (24), (24), (24), (24), (24), (24), (24), (24), (24), (24), (24),
(15), (15), (15), (15), (15), (15), (15), (15), (15), (15), (15), (15), (15), (15)}
txPinMap = {(0+ 17), (0+ 18), (0+ 0), (0+ 1), (0+ 2), (0+ 3), (0+ 4), (0+ 5), (0+ 6), (0+ 7), (0+
8), (0+ 9), (0+ 10), (0+ 11), (0+ 12), (0+ 13), (0+ 14), (0+ 15), (0+ 16)}
txSelfTape = {0x0000,
0x0F,0x0010,0x0010,0x7110,0x00,0x00,0x00,0x00,0x00,0x00,0x0F,0x0010,0x0310,0x8110,0x00,0x00,0x00
,0x00,0x00,0x00,0x0F,0x0010,0x1C10,0x0110,0x00,0x00,0x00,0x00,0x00,0x00,0x0F,0x0010,0xE010,0x011
0,0x00,0x00,0x00,0x00,0x00,0x00,0x0F,0x0F10,0x0010,0x0110,0x00,0x00,0x00,0x00,0x00,0x00,0x0C,0x0
000,0x0000,0,0,0,0,0,0,0,0,0,0,0,0}
5.3
Special Parameters
5.3.1
ACTIVE MODULES REGISTER
(NVAM)
REGISTER 5-1:
ACTIVE MODULES REGISTER (NVAM)
U-x
U-x
U-x
U-x
R/W-1
R/W-1
R/W-1
R/W-1
—
—
—
—
DECODE
DIGITIZER
AUTOBASE
BESTFREQ
bit 15
bit 8
R/W-0
R/W-0
R/W-0
U-x
U-x
R/W-0
U-x
R/W-1
AW_EVENT
SW_EVENT
FL_EVENT
—
—
FULLSCAN
—
GESTURE
bit 7
bit 0
Legend:
R = Readable bit
x = Bit is unknown
-n = Value after initialization (default)
W = Writable bit
U = Unimplemented bit
q = Conditional
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-12
Unused
bit 11
DECODE:
Turns touch decoding logic on or off
bit 10
DIGITIZER:
Turns digitizer/I2C™ register output on or off
bit 9
AUTOBASE: Turns on or off automatic baseline functionality
bit 8
BESTFREQ: Turns on or off bestfrequency selection algorithms
bit 7
AW_EVENT: Events related to GestIC airwheel
bit 6
SW_EVENT: Events related to GestIC swipes
bit 5
FL_EVENT:
bit 4-3
Unused
bit 2
FULLSCAN: Turns on full mutual scanning
bit 1
Unused
bit 0
GESTURE:
DS40001803A-page 20
Events related to GestIC flicks
Turns on 2d gesture recognition
Preliminary
2015 Microchip Technology Inc.
MTCH6303
5.3.2
DIAGNOSTIC MODULES REGISTER
(NVDM)
REGISTER 5-2:
ACTIVE DIAGNOSTICS MODULES REGISTER (NVDM)
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
GESTIC
DIAG
CUSTOM
GESTURE
FINGERPOS
RAWPOS
NOISE
TRACE
bit 15
bit 8
U-x
U-x
R/W-1
R/W-1
R/W-1
R/W-1
—
—
ADC_COR
ADC
MUTRAW
SELFRAW
R/W-1
R/W-1
MUTCACHE SELFNORM
bit 7
bit 0
Legend:
R = Readable bit
x = Bit is unknown
-n = Value after initialization (default)
W = Writable bit
U = Unimplemented bit
q = Conditional
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15
GESTIC:
Forward GestIC® packets to host, also packets from host to GestIC
bit 14
DIAG:
Diagnostic Messages
bit 13
CUSTOM:
Custom Messages
bit 12
GESTURE:
Gesture Messages
bit 11
FINGERPOS:
Filtered Touch Data
bit 10
RAWPOS:
Unfiltered Touch Data
bit 9
NOISE:
Noise Messages
bit 8
TRACE:
Trace Messages
bit 7-6
Unused
bit 5
ADC_COR:
Use ADC Offsets
bit 4
ADC:
ADC Messages
bit 3
MUTRAW:
Mutual Raw Data
bit 2
SELFRAW:
Self Raw Data
bit 1
MUTCACHE:
Mutual Normalized Data
bit 0
SELFNORM:
Self Normalized Data
2015 Microchip Technology Inc.
Preliminary
DS40001803A-page 21
MTCH6303
6.0
COMMUNICATION EXAMPLES
6.1.1
6.1
Reading Touch Data
Touch data is populated in the HID report (refer to
Section 3.3.2, HID Generic (EP 2, Streamed
Messages)).
The following examples show a frame of data
communicating three Touch ID contact points:
TABLE 6-1:
READING TOUCH DATA
Touch ID
5
READING TOUCH DATA (USB)
ID5
Contact at (2345,4657)
8
Contact at (9823,0023)
13
Touch Removed (last contact 7264,1893)
TABLE 6-2:
0
8
16
24
32
40
48
56
READING TOUCH DATA HID REPORT
0x01
0x03
0x05
0x29
0x09
0x31
0x12
0x03
REPID
0x08
STATUS0
ID0
XLSB0
XMSB0
YLSB0
YLSB0
STATUS1
0x5F
0x26
0x17
0x00
0x02
0x0D
0x60
ID1
XLSB1
XMSB1
YLSB1
YMSB1
STATUS2
ID2
XLSB2
0x1C
0x65
0x07
0x00
—
—
—
—
XMSB2
YLSB2
YMSB2
STATUS3
ID3
XLSB3
XMSB3
YLSB3
—
—
—
—
—
—
—
—
YMSB3
STATUS4
ID4
XLSB4
XMSB4
YLSB4
YMSB4
STATUS5
—
—
—
—
—
—
—
—
ID5
XLSB5
XMSB5
YLSB5
YMSB5
STATUS6
ID6
XLSB6
—
—
—
—
—
—
—
—
XMSB6
YLSB6
YMSB6
STATUS7
ID7
XLSB7
XMSB7
YLSB7
—
—
—
—
—
—
—
—
YMSB7
STATUS8
ID8
XLSB8
XMSB8
YLSB8
YMSB8
STATUS9
—
—
—
—
—
0x03
—
—
ID9
XLSB9
XMSB9
YLSB9
YMSB9
#VALID
—
—
DS40001803A-page 22
Preliminary
7
15
23
31
39
47
55
2015 Microchip Technology Inc.
MTCH6303
READING TOUCH DATA (I2C)
6.1.2
Reading touch data over I2C must be performed in one
single transaction to ensure the data is all from the
same frame.
READING TOUCH DATA (I2C™)
FIGURE 6-1:
0x25
S
0x00
W
0x25
RS
R
0x03
Touch 0
0x03
0x05
0x29
0x09
0x32
0x12
0x08
0x5F
0x26
0x17
0x00
0x0D
0x60
0x1C
0x65
0x07
Touch 1
0x03
Touch 2
0x02
Note:
6.2
P
The host could continue to read all 10 touches, but there is no need since the first byte indicates only
three touches are valid.
Message Send/Receive
In these examples, a message setting the current
number of RX channels is sent, and the response
received is shown. (including acknowledgment).
6.2.1
MESSAGE TO SEND
Message ID
0xE0 (CMD_SetParameter)
Payload (message specific)
Address: 0x0100
Data:
0x14
First, the message must be created according to the
message format in Figure 6-2.
FIGURE 6-2:
MESSAGE TO SEND
a
2
3
f
0x0B
b
0x14
0x00
0x01
e
0xE0
0x00
0x01
0x00
c
0x00
0x00
0x14
0xFF
0xFF
0xFF
0xFF
0xE0
0x00
0x01
0x00
0x00
0x00
0x14
0xFF
0xFF
0xFF
0xFF
1
2015 Microchip Technology Inc.
d
Preliminary
DS40001803A-page 23
MTCH6303
6.2.1.1
1.
2.
Steps
FIGURE 6-3:
Parameter address (a) and value to write (b)
Message ID is added (e).
Fill bytes are added to value to make it 32 bits (c).
1
Data mask is added (d) – note that since the parameter
is only one byte, only the last byte of the mask actually
affects the behavior.
2
3.
EXPECTED RESPONSE
Status byte is added:
- size is 11 (0x0B)
- “more messages” is set to 0
- “is continued” ID set to 0 (this is the start of
message)
6.2.2
a
0xE0
3
0x02
6.2.2.1
0xF0
0xE0
0xF0
0xE0
Steps
1.
Expected payload for an ACK message is an
echo of the command being ACK’d – in this
case, 0xE0
2. Message ID is added
3. Status byte is added:
- Size = 2
- More messages = 0
- Continued = 0
EXPECTED RESPONSE
Every message sent to the controller also contains an
acknowledgment message back (ACK), which follows
this format:
Message ID
0xF0 (REP_Ack)
Payload
0xE0 (command received was CMD_SetParameter)
6.2.3
MESSAGE SEND/RECEIVE (USB)
FIGURE 6-4:
MESSAGE SEND/RECEIVE (USB)
1
a
0x05
2
b
0x23
0x0B
0xE0
0x00
0x01
0x00
0x00
0x00
0x14
0xFF
0xFF
0xFF
0xFF
0x0B
0xE0
0x00
0x01
0x00
0x00
0x00
0x14
0xFF
0xFF
0xFF
0xFF
0x02
0xF0
0xE0
d
0x05
c
0x32
0x02
0xF0
0xE0
3
4
6.2.3.1
1.
2.
3.
4.
Steps
FIGURE 6-5:
Message to send (from previous section)
Adding sequence ID (b), which was chosen at
random for this example. Adding reportID
(always 0x05)
Response expected (from previous section)
Adding sequence ID (c), which was chosen at
random for this example. Adding reportID
(always 0x05).
6.2.4
S
0x25
W
MESSAGE SEND/
RECEIVE (I2C™)
0xFB
RS
0x25
R
0xFF
P
MESSAGE SEND/RECEIVE (I2C)
First, the host must query the RXRDY buffer to ensure
there is enough space to write the command. In this
case, the controller is reporting that 255 bytes are
available for writing:
DS40001803A-page 24
Preliminary
2015 Microchip Technology Inc.
MTCH6303
Next, the host writes the command into the controller’s
RXBUFF register (Figure 6-6).
FIGURE 6-6:
0x25
S
HOST WRITE TO RXBUFF REGISTER
0xFC
W
0x0B
0xE0
0x00
0x01
0x00
0x00
0x00
0x14
0xFF
0xFF
0xFF
0xFF
P
The host may now query the TXRDY buffer to see if
the response is ready, either after a set amount of time
or by observing IRQ (Figure 6-7).
FIGURE 6-7:
S
0x25 w
HOST READ FROM
TXRDY REGISTER
0xFD
RS
0x25 R
0x03
P
Since there are three bytes ready to be read, the host
should now read those three bytes out of the TXBUFF
register (Figure 6-8).
FIGURE 6-8:
S
0x25
Note:
W
HOST READ FROM
TXBUFF REGISTER
0xFE
RS
0x25 R
0x02
P
The two previous steps could have been
completed in a single read by a host capable of
performing decisions during a read (based on
the value of TXRDY).
Reading address 0xFD auto-increments the address
pointer to 0xFE, the stream buffer. Further bytes read
will all be from within the stream buffer, maintaining the
0xFE address. The first byte read, 0x03, would indicate
that three more bytes are within the stream buffer and
may be read immediately.
2015 Microchip Technology Inc.
Preliminary
DS40001803A-page 25
MTCH6303
7.0
SENSOR DESIGN
CONSIDERATIONS
7.1
Sensor Patterns and PCB Layout
7.2
Sensor Layout Configuration
TABLE 7-1:
With regard to touch sensor patterns, refer to the
mTouch® Design Center (www.microchip.com/
mtouch) for additional information on designing and
laying out a touch sensor pattern, as well as using the
correct techniques for PCB trace routing.
7.1.1
PROTOTYPING DESIGNS
Touch sensor designs typically require a thorough
debugging phase to ensure a reliable product. If
possible, it is recommended that flexible prototyping
hardware be created with this in mind. A common
example is providing external access to the
communication lines for quick test and tuning while in
circuit.
7.1.2
SENSOR OVERLAY MATERIAL
To prevent saturation of sensor levels, a minimum
overlay of 0.5 mm plastic or glass is required for proper
operation of the device, even during a prototyping
phase. (Even if this value is different than the final
design.)
Note:
At no time should the device be expected
to respond correctly to a user touching a
bare PCB sensor.
Address
Name
NUMBEROFXCHANNELS
Number of
channels used for X
axis
0x0280
NUMBEROFYCHANNELS
Number of
channels used for Y
axis
The MTCH6303 is designed to work with sensors with
a minimum of 3 RX and 3 TX sensor channels, and a
maximum of 27 RX and 19 TX channels using a single
MTCH652.
7.3
Sensor Output Resolution
The MTCH6303 interpolates 256 discrete points
between each sensor channel and 128 points past the
centerline of each edge. These internal values are then
scaled over a default range of 0-32767 (0-0x7FFF) for
the default sensor configuration. If the number of TX or
RX channels is modified, then the related output
resolution values must also be updated.
7.3.1
MODIFYING OUTPUT RESOLUTION
OPERATION WITH AN LCD
The MTCH6303 has integrated algorithms to detect
and minimize the effects of noise, but proper care
should always be taken in selecting an LCD and
support components with a focus on reducing noise as
much as possible. Since the interaction between the
touch sensor and display is highly dependent upon the
physical arrangement of the components, proper
testing should always be executed with a fully
integrated device. Please reference your projected
capacitive touch screen manufacturer’s integration
guide for additional design considerations.
Description
0x0200
TABLE 7-2:
7.1.3
REGISTERS ASSOCIATED
WITH SENSORS LAYOUT
CONFIGURATION
OUTPUT RESOLUTION
REGISTERS
Address
0x0042
Name
RX Shift
0x0043
RX Divide
0x0044
RX Offset
0x0045
TX Shift
0x0046
TX Divide
0x0047
TX Offset
The X and Y resolution may be modified by changing
addresses 0x0042 through 0x0047. The firmware uses
the values in equation Equation 7-1.
EQUATION 7-1:
RESOLUTION CHANGE
Shift
Value 2
Final Value = ----------------------------------- + Offset
Divide
These values must be updated when changing the
number of TX or RX channels on the sensor if the
0-0x7FFF resolution is to be maintained.
DS40001803A-page 26
Preliminary
2015 Microchip Technology Inc.
MTCH6303
7.4
Sensor Orientation
TABLE 7-3:
Address
0x0041
SENSOR ORIENTATION
Name
Description
FLIPSTATE
REGISTER 7-1:
Determines X and Y flips,
as well as swaps
SENSOR ORIENTATION REGISTER
U-x
U-x
U-x
U-x
U-x
R/W-0
R/W-0
R/W-0
—
—
—
—
—
XYSWAP
TXFLIP
RXFLIP
bit 7
bit 0
Legend:
R = Readable bit
x = Bit is unknown
-n = Value after initialization (default)
W = Writable bit
U = Unimplemented bit
q = Conditional
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-3
Unused
bit 2
XYSWAP: Swap the TX and RX coordinates
bit 1
TXFLIP: Swap the coordinates along the TX axis
bit 0
RXFLIP: Swap the coordinates along the RX axis
To aid in PCB layout, the sensor can be oriented in any
direction, have either axis reversed or have the axis
swapped.
2015 Microchip Technology Inc.
Preliminary
DS40001803A-page 27
MTCH6303
FIGURE 7-1:
SENSOR ORIENTATION EXAMPLES
RX0
TX0
RXn
0, 0
xM ax , 0
SENSOR
TXn
0, yM a x
RX0
0, 0
xM ax , 0
0, yM a x
0, 0
xM ax , 0
0, yM a x
XYSWAP 0
TXFLIP 0
RXFLIP 1
xM ax , 0
SENSOR
DS40001803A-page 28
xM ax , yM a x
xM ax , 0
SENSOR
0, yM a x
XYSWAP 0
TXFLIP 1
RXFLIP 0
RXn
TXn
0, 0
xM ax , 0
0, yM a x
RXn
TX0
0, 0
xM ax , 0
SENSOR
RX0
Preliminary
0, yM a x
XYSWAP 1
TXFLIP 1
RXFLIP 0
xM ax , yM a x
TXn
XYSWAP 0
TXFLIP 1
RXFLIP 1
XYSWAP 1
TXFLIP 0
RXFLIP 1
xM ax, yM a x
SENSOR
RX0
RX0
0, 0
0, yM a x
RX0
TX0
0, 0
RXn
TX0
xM ax , yM a x
RXn
TX0
XYSWAP 1
TXFLIP 0
RXFLIP 0
xM ax, yM a x
TXn
RXn
SENSOR
TXn
xM ax , 0
SENSOR
xM ax , yM a x
RX0
TX0
0, 0
0, yM a x
Default Configuration
TXn
RX0
TXn
RXn
SENSOR
TXn
XYSWAP 0
TXFLIP 0
RXFLIP 0
xM ax , yM a x
RXn
TX0
TX0
XYSWAP 1
TXFLIP 1
RXFLIP 1
xM ax , yM a x
2015 Microchip Technology Inc.
MTCH6303
8.0
FIRMWARE UPDATE
8.1
Library Loader
8.3
The MTCH6303 devices are manufactured with a builtin Library Loader (bootloader) only. There will not be
any PCAP touch decoding library preloaded. The
library loader has interfaces for USB HID and I2C, so
that an MTCH6303 library can be uploaded to the
MTCH6303 Flash memory.
Bootloader Command Overview
The command interpreter within the bootloader
operates in a similar manner as the standard
MTCH6303 command interpreter. The bootloader
supports the following commands:
TABLE 8-1:
ID
BOOTLOADER COMMANDS
Name
Description
The latest MTCH6303 PCAP touch decoding library
can be found in the MTCH6303 Utility download which
can be accessed from the MTCH6303 device page.
0x10 EXIT_BOOTLOADER Exit Bootloader mode
There are three ways to upload the MTCH6303 library
to the MTCH6303 device, as listed in Sections 8.1.1. to
8.1.3 below.
0x12 ERASE_PAGE
Erase a ROM page
0x13 SET_ADDRESS
Write the Flash
address to operate on
8.1.1
0x14 LOAD_DATA
Load program data
into RAM
0x15 WRITE_PAGE
Latch program data
from RAM into ROM
0x16 VALIDATE_FW
Read from a section in
Flash
0x17 READ_FLASH
Read a section in
ROM
0xff
Read the bootloader
firmware revision
UPLOAD VIA THE MTCH6303
UTILITY
The MTCH6303 Utility can be used to perform the
update. For this option, USB connectivity to a PC with
the MTCH6303 Utility installed will be needed.
8.1.2
UPLOAD VIA EMBEDDED HOST
CONTROLLER
This option requires an embedded host controller
which performs the upload using the MTCH6303
Bootloader commands (refer to Table 8-1).
0x11 SETUP_SESSION
QUERY_VERSION
Setup and initiate a
bootloading session
Microchip pre-programmed MTCH6303 parts can be
ordered through the Microchip Programming Center.
Please
reference
www.microchipdirect.com/
programming for further information.
8.1.3
QUICK TIME PROGRAMMING (QTP)
For larger quantities of pre-programmed parts with
unique part numbers, contact your local Microchip
sales office.
8.2
Overview
The firmware update process involves a host device
transmitting a hex file to the MTCH6303 while in
Bootloader mode. The hex file should be parsed and
all data bytes extracted before being sent to the
MTCH6303. This can either be done by the host or by
software that utilizes the host as a bridge to send the
bytes to the MTCH6303.
When the MTCH6303 is in Bootloader mode, the host
has access to commands to read, erase and write
ROM pages that contain the touch application. An
outline of the update procedure is detailed in this
section.
2015 Microchip Technology Inc.
Preliminary
DS40001803A-page 29
MTCH6303
8.4
Update Procedure
FIGURE 8-1:
valid SETUP_SESSION command the bootloader will
not allow modifications to the ROM. Once a
SETUP_SESSION command is received, the
application firmware is identified as unstable and it is
no longer possible to exit the bootloader until a
firmware update sequence has been completed.
BOOTLOADER
FLOWCHART
8.4.3
PERFORM A SETADDRESS/ERASE/
WRITE CYCLE ON EACH ROM
PAGE
With a valid session in place the host can now begin
accessing the MTCH6303 device’s ROM to update the
firmware. The typical procedure is to update the device
one Flash page at a time, erasing and writing one page
before moving onto the next.
First, use SET_ADDRESS to configure the address of
the start of the ROM page to perform further operations
on. The address should be the start of a 4 Kb ROM
page.
Next, use ERASE_PAGE to erase the page starting at
the address selected using the SET_ADDRESS
command.
Once the page is erased, the host should send parsed
hex data to update the selected page. This process will
take several iterations of the LOAD_DATA command to
write all 4Kb of data. The LOAD_DATA command has
size and offset parameters that denote respectively the
size of the current LOAD_DATA packet and the offset
from the address defined by the SET_ADDRESS
command.
After all 4 Kb of data has been provided to the
controller, use the WRITE_PAGE command to write the
data into the selected page.
Continue
this
process
of
SET_ADDRESS,
ERASE_PAGE, LOAD_DATA(s), and WRITE_PAGE
for each 4Kb block of ROM until the entire update is
completed.
8.5
8.4.1
ENTER THE BOOTLOADER
The MTCH6303 normally runs in Application mode, so
the host must communicate to the MTCH6303 to enter
its Bootloader mode. To do this, issue the ‘Enter
bootloader’ command as seen in Section 10.5,
Command: ENTER_BOOTLOADER. If using USB,
the device will disconnect from the USB bus, then reattach as the bootloader. (VID 0x04D8, PID 0x09D5)
8.4.2
SETUP A FIRMWARE UPDATE
SESSION
Once the MTCH6303 is in Bootloader mode establish
an update session with the MTCH6303. The purpose of
this is to setup the ROM boundaries and other various
parameters for the update. Use the SETUP_SESSION
command to configure the session. Prior to receiving a
DS40001803A-page 30
Bootloader Commands
This section describes the bootloader commands. The
format for each command and its response are detailed
below.
8.5.1
COMMANDS
8.5.1.1
0X10 EXIT_BOOTLOADER
When called, this command will cause the bootloader
to exit, returning to the touch application if a valid
application is present. If not, the controller will remain
in Bootloader mode.
TABLE 8-2:
Cmd Size
0x01
Preliminary
EXIT BOOTLOADER
Cmd ID
0x10
Data
2015 Microchip Technology Inc.
MTCH6303
8.5.1.2
0x11 SETUP_SESSION
8.5.1.6
0x15 WRITE_PAGE
This will initiate a bootloading session, defining
session type, start address and end address.
Write loaded RAM data into ROM at the defined
address.
TABLE 8-3:
TABLE 8-7:
Cmd
Size
0x0A
SETUP SESSION
Cmd
ID
0x11
8.5.1.3
Cmd Size
Data
Start
Address
[32 bits]
End
Address
[32 bits]
This command will cause the currently set page to be
erased. The SET_ADDRESS command must be used
to define the address of the page to be erased prior to
calling ERASE_PAGE.
TABLE 8-4:
Cmd ID
8.5.1.4
8.5.1.5
0x01
8.5.1.9
Addr[23:1 Addr[3
6]
1:24]
8.5.2
Value
varies 0x14 [7:
0]
Note:
LOAD DATA
Data
progData[0]progData[n]**
[15:8 [7: [15: [0]
]
0] 8]
[n]**
Max length of progData is 54 bytes.
2015 Microchip Technology Inc.
0x17 READ_FLASH
READ FLASH
Cmd ID
0x17
Data
Size [7:0]
Size[15:8]
0xff QUERY_VERSION
QUERY VERSION
Cmd ID
0xff
Data
RESPONSES
TABLE 8-11:
Load application data from the host into RAM.
Offset
Read the bootloader firmware version.
0x01
0x14 LOAD_DATA
Cmd Cmd
Size
ID Size
Data
0x16
8.5.1.8
Cmd Size
Data
TABLE 8-6:
Cmd ID
TABLE 8-10:
SET ADDRESS
0x05 0x13 Addr[7: Addr[15:
0]
8]
VALIDATE FW
Cmd Size
0x03
This command defines the start address of the page of
ROM to perform further operations upon. This address
MUST be the start of one of the 4 Kb ROM pages.
Cmd Cmd
Size ID
Read from a section in Flash.
Cmd Size
0x13 SET_ADDRESS
TABLE 8-5:
0x16 VALIDATE_FW
TABLE 8-9:
Data
0x12
8.5.1.7
Read a section in ROM.
ERASE PAGE
Cmd Size
Data
0x15
TABLE 8-8:
0x12 ERASE_PAGE
0x01
Cmd ID
0x01
Session
Type [8 bits]
WRITE PAGE
BOOTLOAD COMMAND
RESPONSE ID
Description
0x00
Successful operation
0x07
Checksum mismatch
0x08
Flash read/erase/write failure
0x0a
Out-of-Range address
0x0b
No session data
0x0c
Unrecognized command ID
0x0d
Invalid number of bytes for this command
0x0e
Error exiting Bootloader mode
Preliminary
DS40001803A-page 31
MTCH6303
TABLE 8-12:
Byte
BOOTLOADER COMMAND
RESPONSE
Value
Description
1
0x02
Length, number of
bytes to follow
2
varies
Echo Command ID
3
See Table 8-11 for
values
Response Status
DS40001803A-page 32
Preliminary
2015 Microchip Technology Inc.
MTCH6303
9.0
OPERATING MODES
The MTCH6303 allows enabling and disabling
individual modules within the controller by modifying
the active Modules (NVAM) register. Node control is
from the NVAM in conjunction with the Streaming
Modes register.
REGISTER 9-1:
U-x
STREAMING MODE REGISTER (STREAMINGMODE)
U-x
U-x
U-x
U-x
U-x
U-x
U-x
MODE
bit 7
bit 0
Legend:
R = Readable bit
x = Bit is unknown
-n = Value after initialization (default)
W = Writable bit
U = Unimplemented bit
q = Conditional
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-0
MODE: Mode Selection – See Section 9.2, Controller State Machine for more information.
0: 2D3D
1: PCAP_ONLY
2: GESTIC_BRIDGE
4: ACTIVE_STANDBY
5: 2D_SLEEP_MODE
0xFF: INVALID
2015 Microchip Technology Inc.
Preliminary
DS40001803A-page 33
MTCH6303
9.1
Active Modules Register (NVAM)
REGISTER 9-2:
ACTIVE MODULES REGISTER (NVAM)
U-x
U-x
U-x
U-x
R/W-1
R/W-1
R/W-1
R/W-1
—
—
—
—
DECODE
DIGITIZER
AUTOBASE
BESTFREQ
bit 15
bit 8
R/W-0
R/W-0
R/W-0
U-x
U-x
R/W-0
U-x
R/W-1
AW_EVENT
SW_EVENT
FL_EVENT
—
—
FULLSCAN
—
GESTURE
bit 7
bit 0
Legend:
R = Readable bit
x = Bit is unknown
-n = Value after initialization (default)
W = Writable bit
U = Unimplemented bit
q = Conditional
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-12
Unused
bit 11
DECODE: Turns touch decoding logic on or off
bit 10
DIGITIZER: Turns digitizer/I2C register output on or off
bit 9
AUTOBASE: Turns on or off automatic baseline functionality
bit 8
BESTFREQ: Turns on or off bestfrequency selection algorithms
bit 7
AW_EVENT: Events related to GestIC® airwheel
bit 6
SW_EVENT: Events related to GestIC® swipes
bit 5
FL_EVENT: Events related to GestIC® flicks
bit 4-3
Unused
bit 2
FULLSCAN: Turns on full mutual scanning
bit 1
Unused
bit 0
GESTURE: Turns on 2D gesture recognition
9.2
Controller State Machine
Using the Active Modules Register there are numerous
different operating modes for the MTCH6303. The
streaming Mode register (address 0x0082) can be
used to configure the overall operational mode of the
controller. Please contact Microchip for further
information on using the MTCH6303 in combination
with an MGC3130 GestIC® controller for 3D gestures.
DS40001803A-page 34
Preliminary
2015 Microchip Technology Inc.
MTCH6303
FIGURE 9-1:
Host
STANDARD CONTROLLER OPERATION STATE MACHINE
touch
touch
Scan rate:
Host
2D
Active
120 Hz
Active
Standby
2D sleep
2D
Self
2D
Recent
Disabled state
3D
Gesture
Reachable state
Sleep
Power
Saving
FIGURE 9-2:
3D
Approach
Starting state of MTCH6303
2D ONLY MODE
touch
touch
2D
Active
2D
Self
2D
Recent
3D
Gesture
Proxi
detected
Timer
wakeup
3D
Approach
Sleep
Note:
Set to 2D mode only
CMD: 0x82, 1
2015 Microchip Technology Inc.
Preliminary
DS40001803A-page 35
MTCH6303
FIGURE 9-3:
DISABLE AUTO-SLEEP
touch
touch
2D
Active
2D
Self
2D
Recent
3D
Gesture
Proxi
detected
Timer
wakeup
3D
Approach
Sleep
Note:
Disable Auto-sleep
CMD: bit12 (NVAM)
The PCAP does not return to sleep
FIGURE 9-4:
DISABLE AUTO-WAKE-UP
touch
touch
2D
Active
2D
Self
2D
Recent
3D
Gesture
Proxi
detected
Timer
wakeup
3D
Approach
Sleep
Note:
Disable Auto-Wake-up
CMD: bit13 (NVAM)
The PCAP does not return to Active mode.
The Sleep time can be set with idleTime2D parameter
CMD: 0x103, 64 (data in ms, max 420 ms)
DS40001803A-page 36
Preliminary
2015 Microchip Technology Inc.
MTCH6303
FIGURE 9-5:
ACTIVE STANDBY MODE
touch
Host
touch
2D
Active
Active
Standby
2D
Self
2D
Recent
3D
Gesture
Proxi
detected
Timer
wakeup
3D
Approach
Sleep
Note:
Set to Active Standby mode
CMD: 0x82, 4
Safe mode to change multiple parameters without having any side effect on the code. No running code
in this mode.
FIGURE 9-6:
2D SLEEP MODE
Host
touch
touch
2D
Active
2D Sleep
2D
Self
2D
Recent
3D
Gesture
Proxi
detected
Timer
wakeup
3D
Approach
Sleep
Note:
Set to 2D Sleep mode
CMD: 0x82, 5
2015 Microchip Technology Inc.
Preliminary
DS40001803A-page 37
MTCH6303
10.0
APPLICATION COMMANDS
TABLE 10-1:
APPLICATION COMMANDS
CMD ID
Name
Description
0x04
ECHO
Echo back the received packet
0xfb
FORCE_BASELINE
Force the touch sensor to update its baseline measurements
0xff
QUERY_VERSION
Read the MTCH6303 firmware and application revisions
0x17
READ_FLASH
Read from a section in ROM
0x55
ENTER_BOOTLOADER
Enter Bootloader mode
0xfc
GESTIC_BRIDGE
Pass information through to an MGC3130
0xe0
SET_PARAMETER
Write a value to a register
0xe1
GET_PARAMETER
Read a value from a register
10.1
Command: ECHO
Host command to test communication. Host sends
, and the controller will respond
with the exact same packet . Any
bytes following the 0x04 ID byte will not be processed
by the controller, and should only be used to verify
communication is working properly.
TABLE 10-2:
Byte
Byte
COMMAND:
FORCE_BASELINE
Value
Description
1
0x01
Length, # of bytes to follow
2
0Xfb
Command ID
TABLE 10-5:
COMMAND: ECHO
Value
TABLE 10-4:
COMMAND RESPONSE:
FORCE_BASELINE
Description
Byte
Value
Description
1
n+1
Length, # of bytes to
follow
1
0x02
2
0X04
Command ID
2
0Xf0
Acknowledge CMD ID
0xfb
Repeat FORCE_BASELINE
Command ID
3-n
Packet[0]:Packet[n]
Test packet
information for
confirmation
3
TABLE 10-6:
TABLE 10-3:
Byte
COMMAND RESPONSE:
ECHO
Value
FORCE_BASELINE EXAMPLE
SEND
Description
1
n+1
Length, # of bytes to
follow
2
0X04
Command ID
3-n
Packet[0]:Packet[n]
Identical test packet for
confirmation
10.2
Length, # of bytes to follow
0x01
0xfb
Length
CMD ID
RECEIVE
0x02
0xf0
0xfb
Length
ACK CMD ID
Repeat
FORCE_BASELINE
ID
Command: FORCE_BASELINE
Forces the controller to update touch sensor baseline
measurements.
DS40001803A-page 38
Preliminary
2015 Microchip Technology Inc.
MTCH6303
10.3
Command: QUERY_VERSION
The QUERY_VERSION command will read the
MTCH6303 firmware and application revisions.
Sending a QUERY_VERSION command while in
Application mode will prompt two packets to be
returned from the MTCH6303. The first packet will
contain the 128 bytes of version data, and the second
packet
is
the
acknowledgment
of
the
QUERY_VERSION command.
TABLE 10-7:
Byte
COMMAND:
QUERY_VERSION
Value
Description
1
0x01
Length, # of bytes to follow
2
0Xff
Command ID
TABLE 10-10: COMMAND RESPONSE:
READ_FLASH
Byte
Byte
Length, # of bytes to follow
2
0x17
Command ID
3-[size] Data
[size] number of bytes of data, as
requested in command, starting
at Start address
1
0x02
Length, # of bytes to follow
2
0Xf0
Acknowledge CMD ID
0x17
Repeat GET_REGISTER CMD
ID
3
1
COMMAND RESPONSE:
QUERY_VERSION
Value
Description
0x80
128 bytes of version information
130
1
0x02
Length, # of bytes to follow
2
0Xf0
Acknowledge CMD ID
3
0xff
Repeat QUERY_VERSION
Command ID
10.4
Value
Description
1
0x01
Length, # of bytes to follow
2
0X55
Command ID
Byte
Read from a section in ROM. When used as an
application command, the controller will respond with
two packets: one containing the read data, and a
second acknowledgment packet.
Byte
Byte
TABLE 10-12: COMMAND RESPONSE:
ENTER_BOOTLOADER
Command: READ_FLASH
TABLE 10-9:
Command:
ENTER_BOOTLOADER
TABLE 10-11: COMMAND:
ENTER_BOOTLOADER
Length, # of bytes to follow
2
Description
0x05
10.5
TABLE 10-8:
Value
1
Value
Description
1
0x02
Length, # of bytes to follow
2
0Xf0
Acknowledge CMD ID
3
0x55
Repeat ENTER_BOOTLOADER
command ID
COMMAND: READ_FLASH
Value
1
0x07
Length, # of bytes to follow
2
0x17
Command ID
3
addr[7:0]
4
addr[15:8]
5
addr[23:16]
6
addr[31:24]
7
size[7:0]
8
size[15:8]
10.6
Description
Use GESTIC_BRIDGE to pass information through the
MTCH6303 to the MGC3130 controller.
4-byte (32-bit) Start address
Length of Flash block to read,
in Bytes
2015 Microchip Technology Inc.
Command: GESTIC_BRIDGE
TABLE 10-13: COMMAND: GESTIC_BRIDGE
Byte
Value
Description
1
n+1
Length, # of bytes to follow
2
0Xfc
Command ID
3-n
Packet[0]:P
acket[n]
Packets to send to MGC3130
Preliminary
DS40001803A-page 39
MTCH6303
TABLE 10-14: COMMAND RESPONSE:
GESTIC_BRIDGE
Byte
Value
TABLE 10-16: COMMAND: SET_REGISTER
RESPONSE
Description
Byte
Value
Description
1
n+1
Length, # of bytes to follow
1
0x02
Length, # of bytes to follow
2
0Xf0
Acknowledge CMD ID
2
0Xf0
Acknowledge CMD ID
3-n
Packet[0]:
Packet[n]
Packets to send to MGC3130
3
0xe0
Repeat SET_REGISTER
Command ID
10.7
Register Commands
There are a number of parameter registers that can be
configured to modify the performance of the
MTCH6303. Table details a list of all modifiable registers.
TABLE 10-15: COMMAND: SET_REGISTER
Byte
Value
Description
1
0x0b
Length, # of bytes to follow
2
0xe0
Command ID
3
addr[7:0]
4
addr[15:8]
2-byte (16-bit) Register
Address
5
value[7:0]
6
value[15:8]
7
value[23:16]
8
value[31:24]
9
mask[7:0]
10
mask[15:8]
11
mask[23:16]
12
mask[31:24]
4-byte (32-bit) register value
to be written
4-byte (32-bit) value to mask
register value to be written
TABLE 10-17: SET_REGISTER 0X0004 TO VALUE 0XAABBCCDD EXAMPLE
SEND
0x0b
0xe0
Length
CMD ID Register 0x0004
0x04
0x00
0xdd
0xcc
0xbb
0xaa
New Register Value 0xaabbccdd
0xff
0xff
0xff
0xff
Register Bit Mask
RECEIVE
0x02
0xf0
0xe0
Length
ACK CMD ID
Repeat SET_REGISTER ID
DS40001803A-page 40
Preliminary
2015 Microchip Technology Inc.
MTCH6303
10.8
Command: GET_REGISTER
The MTCH6303 will respond with two packets when
issued the GET_REGISTER command. The first
packet will contain the data, and the second packet is
the acknowledgment of the GET_REGISTER
command.
TABLE 10-18: COMMAND: GET_RESGISTER
Byte
Value
Description
1
0x03
Length, # of bytes
to follow
2
0xe1
Command ID
3
addr[7:0]
2-byte (16-bit)
Register Address
TABLE 10-19: COMMAND: GET_REGISTER
RESPONSE
Byte
Value
Description
1
0x05, 0x06, or 0x07
Length, # of bytes
to follow
2
0xe1
Command ID
3
addr[7:0]
4
addr[15:8]
2-byte (16-bit)
Register Address
5
value[7:0]
6
value[15:8]
7
value[23:16]
8
value[31:24]
1
0x02
Length, # of bytes
to follow
2
0Xf0
Acknowledge
CMD ID
3
0xe1
Repeat
GET_REGISTER
CMD ID
Up to 4 bytes
(32bit) of value
data, depending
on register
TABLE 10-20: GET_REGISTER VALUE 0X00CC AT 0X0004 EXAMPLE
SEND
0x03
0xe1
0x04
Length
CMD ID
Register 0x0004
0x00
0x05
0xe1
0x04
Length
CMD ID
Register 0x0004
RECEIVE
2015 Microchip Technology Inc.
0x00
0xcc
0x00
Data
Preliminary
0x02
0xf0
0xe1
Length
ACK
CMD ID
Repeat
GET_REGISTER
CMD ID
DS40001803A-page 41
MTCH6303
TABLE 10-21: MTCH6303 PARAMETER REGISTERS
Register #
Name
0x0040
numOfAvg
0x0041
flipState
Description
Default Value
bit 0 = X flip, bit 1 = Y flip, bit 2 = X/Y
swap
0x0080
diagMask
0x0081
activeModules
0x0082
streamingMode
0x0100
numberOfXChannels
Number of RX Channels along long/
wide axis of touch screen
0x0101
numberOfYChannels
Number of TX Channels along short/
narrow axis of touch screen
0x0200 - 0x021a
rxPinMap[0] - rxPinMap[26]
0x0280 - 0x02a3
txPinMap[0] - txPinMap[35]
0x0400
selfTouchThres
0x0401
mutTouchThres
0x0402
weightThreshold
0x0403
penDownTimer
0x0404
penUpTimer
0x0405
largeActThres
0x0480
minCuspDelta
0x0500
swipeTimeout
0x0501
swipeDistance
0x0502
swipeBorder.left
0x0503
swipeBorder.right
0x0504
swipeBorder.top
0x0505
swipeBorder.bottom
0x0540
tapBorder.left
0x0541
tapBorder.right
0x0542
tapBorder.top
0x0543
tapBorder.bottom
0x0800
diagRxChannel
0x0801
diagTxChannel
0x0802
baseUpdateTime
0x0803 - 0x0806
mutScanPeriode[0] mutScanPeriode[3]
DS40001803A-page 42
Limits the max distance a touch can
travel between frames before
assigning a new ID (native position
units)
Slope value must be above this to
determine that a ‘peak’ has been
found
Stopwatch time for baseline counter,
no touch for this duration will engage
a recalibration
Preliminary
2015 Microchip Technology Inc.
MTCH6303
TABLE 10-21: MTCH6303 PARAMETER REGISTERS (CONTINUED)
Register #
Name
Description
0x0807 - 0x080a
mutScanPhase[0] mutScanPhase[3]
0x080b
mutFreqHopping
If >0, selects Fixed Frequency mode
(indexed by this value). If 0, all
frequencies are in use
0x080c - 0x080f
mutFreqHoppingLevel[0] mutFreqHoppingLevel[3]
Provides a software gain for
frequencies that provide smaller
amplitude than normal. (0 = none)
0x0810
selfSampleTime
0x0811
mutSampleTime
0x0812 - 0x0815
selfScanPhase[0] selfScanPhase[3]
0x0816 - 0x0819
selfScanISRPhase[0] selfScanISRPhase[3]
0x081a
syncRxChannel
0x081b
syncTxChannel
0x081c
fullScanRxStart
0x081d
fullScanRxStop
0x081e
fullScanTxStart
0x081f
fullScanTxStop
0x0900
mtch65x_periode_fast_rise
Period for TMR2 (pwm for 652)
0x0901
mtch65x_periode_fast_rise_oc
Sets OC1 for TMR2 duty cycle divide “fast_rise” by this number to
calculate DC
0x0902
mtch65x_fast_rise_delay
TMR1 counts to wait until full boost is
established
0x0905 - 0x0908
mtch65x_periode_mutu_measurement[0] - mtch65x_periode_mutu_measurement[3]
0x0909 - 0x090c
mtch65x_periode_mutu_measurement_oc[0] mtch65x_periode_mutu_measurement_oc[3]
0x090d - 0x0910
mtch65x_periode_self_measurement[0] - mtch65x_periode_self_measurement[3]
0x0911 - 0x0914
mtch65x_periode_self_measurement_oc[0] mtch65x_periode_self_measurement_oc[3]
2015 Microchip Technology Inc.
Preliminary
Default Value
DS40001803A-page 43
MTCH6303
11.0
GESTURE FEATURES AND
PARAMETERS
2.
To simplify touch-based application development the
controller already includes the capability to recognize a
fixed set of touch gestures. The gesture recognizer
supports the following kinds of gestures:
• Swipe-Gestures
• Scroll-Gestures
• Tap-Gestures
The gesture recognizer in the MTCH6303 is generic in
that it supports those gestures for any number of
fingers greater or equal to one. In practice, the
maximum number of fingers is still limited because of
the following two other factors:
1.
The number of concurrent finger contacts the
touch digitizer stages of the MTCH6303 is able
to trace. This is currently internally limited to 10
although HID only reports a maximum of 5.
FIGURE 11-1:
Ergonomic considerations also play a role: e.g.,
on a 3.7-inch touch surface the user would be
hard pressed to correctly perform a five finger
gesture.
In order for gestures to be recognized, the gesture
recognition module has to be enabled and in order to
output results the gesture bit has to be set in the
diagnostic mask (see Section 7.0, Sensor Design
Considerations).
11.1
Swipe Gestures
The MTCH6303 can detect two different types of
swipes: swipes starting from the edge and then going
towards the center of the touch surface and swipes
within the central area of the sensor. The criteria used
to decide when a user’s movement should be
considered an edge swipe are illustrated in Figure 11-1
below.
SWIPE GESTURES
centerSwipeDistance
CenterSwipeMaxWidth
SwipeExtBorder
SwipeExtBorder
SwipeBorder
1.
The user starts touching the surface with “n”
fingers, where n is any number greater than
zero. In the illustration above the user touches
the surface with three fingers on the northern
edge of the device.
2. The gesture recognizer checks if all fingers
started on the same edge of the device. It does
so in a tolerant way: i.e., if two fingers were on
the northern edge, but a third finger was in the
north-east corner, it would consider it to be on
the northern edge. If all fingers did not start on
the same edge, the gesture recognizer will abort
the swipe detection at this stage.
3. To distinguish between the edge and the inner
area of the surface the gesture recognizer uses
two
parameters:
SwipeBorder
and
SwipeExtBorder. The two parameters are
necessary for the following reasons:
• In order to avoid the user accidentally starting a
swipe gesture it is desirable to make the border
area as narrow as possible.
• However when touching with multiple fingers it is
hard for the user to align all of them sufficiently
DS40001803A-page 44
SwipeBorder
within a narrow band. Typically the contact points,
when touching with multiple fingers, would be on
a slight curve, not a straight line.
• To resolve this dilemma, between having narrow
border area to avoid accidental swipes and having
a wider one to allow for easier use with multiple
fingers, the recognizer utilizes two border areas.
One, SwipeBorder, having smaller borders and
another one, SwipeExtBorder, with bigger
borders, which is inside of it. The recognizer then
only requires one finger to start within the
narrower borders described by SwipeBorder, all
the other fingers are allowed to start within the
wider borders from SwipeExtBorder to be
considered on an edge.
4. If the controller determines that the start position
is not within the edge, the recognizer checks for
a center swipe to have occurred. If all fingers
have moved beyond a certain distance (parameter centerSwipeDistance) and stayed within a
certain range of horizontal or vertical (parameter
centerSwipeMaxWidth), then a center swipe
message is generated.
Preliminary
2015 Microchip Technology Inc.
MTCH6303
5.
If the edge criteria have been fulfilled, the user
has to move all fingers towards the center. The
recognizer checks if all fingers have moved
beyond a certain distance (parameter
SwipeDistance) within a specific timeout
(parameter SwipeTimeout). For swipes starting
from the northern or the southern edge, only the
vertical distance is considered, while for swipes
starting from the western or eastern edge only
the horizontal distance is considered. Once the
user has moved all touching fingers beyond the
distance threshold, a swipe is reported, unless
the timeout has expired. The gesture recognizer
then stops the swipe detection until the user has
removed all fingers from the surface and starts
touching again.
TABLE 11-1:
ID
ID: A0
Payload:
uint8 flags; // flags describing the swipe
uint8 fingers; // number of fingers which
participated in the swipe.
Flags is a bitmask. It contains currently only one of the
following values (in theory they are logically or-ed
together, but practically a swipe is only from one edge,
so they are mutually exclusive).
EDGE_N 0x01 // swipe started at northern
edge
EDGE_E 0x02 // … eastern…
EDGE_S 0x04 // … southern…
EDGE_W 0x08 // … western…
PARAMETERS ASSOCIATED
WITH SWIPE GESTURES
SWIPE_SOUTH 0x10 // center swipe moving
south
Default
(Sensor:
10137_100h)
SWIPE_WEST 0x20 // center swipe moving
west
Name
0x0500 SwipeTimeout
0x0501 SwipeDistance
Type
uint32 234375
(1.5s)
SWIPE_EAST 0x80 // center swipe moving
east
uint16 1024
0x0502 SwipeBorder.Left
uint16 768
0x0503 SwipeBorder.Right
uint16 4352
0x0504 SwipeBorder.Top
uint16 768
0x0505 SwipeBorder.Bottom
uint16 8448
Note:
11.2
0x0506 SwipeExtBorder.Left uint16 1536
0x0507 SwipeExtBorder.Right
SWIPE_NORTH 0x40 // center swipe moving
north
0x0508 SwipeExtBorder.Top uint16 1536
uint16 7680
0x050A centerSwipeDistance
uint16 1024
0x050B centerSwipeMaxWidth
uint16 512
Scroll Gestures
The gesture recognizer takes the incoming data of the
moving fingers and derives additional data from them
which can be used in an application to generate
responses such as scroll, zoom and other gestures
which depend on sliding fingers. As soon as the user
touches the surface with n fingers, with n being any
number greater than zero, the gesture recognizer
continuously calculates the center of the touching
points as well as the length of the diagonal of the
bounding box around those points, as illustrated by the
following drawing.
uint16 3484
0x0509 SwipeExtBorder.Bottom
Edge swipes are named by the edge the
swipe starts from. Center swipes are
named by the direction of travel.
The unit for the timeout is in 1s/156250, so a value of
234375 corresponds to 1.5 seconds.
Distance and border are in units of internal digitizer
resolution, without any coordinate transformation such
as scaling or flipping applied.
TABLE 11-2:
MESSAGE OUTPUT FOR
SWIPE GESTURES
ID
Payload
0xA0
Flags
Fingers
byte
Uint8
Uint8
2015 Microchip Technology Inc.
Preliminary
DS40001803A-page 45
MTCH6303
FIGURE 11-2:
SCROLL GESTURES
FIGURE 11-3:
TAP RECOGNIZER
As can be seen, the bounding box is orthogonal to the
coordinate system of the surface, the edges being
horizontal and vertical. There is no attempt to find a
smaller bounding box for the surface contact points,
which would be rotated against the surface. For two
fingers the length of the diagonal of the bounding box
is incidentally equal to the distance between those two
fingers and the center of gravity would equal the
midpoint between the two. For three or more fingers no
such obvious interpretation is available, but since the
bounding box circumscribes all touching fingers the
behavior of the diagonal measure when spreading out
those fingers on the surface or contracting them is
often quite usable, depending on the application. The
computation also runs when the user touches with only
a single finger.
Once the user contacts the surface a timer starts
running. If the user does not lift their finger(s) from the
surface before TapTimeout has expired (as in part A of
the drawing), the tap is considered aborted and the
recognizer stops further processing. If the user lifts the
finger without exceeding the timeout (as in part B and
C), the recognizer considers it a tap.
There are no parameters associated with scroll
gestures.
FIGURE 11-4:
TABLE 11-3:
If the gesture recognizer has recognized a tap a
second timeout, which is used to distinguish repeated
taps from single taps and is called RepeatTimeout,
starts running. If the user does not touch the surface
before the timer has expired (part B), the next tap will
not be considered a repeated tap. Otherwise, if he does
touch the surface while the timeout has not expired, the
following touch will be indicated as a repeated tap.
TAPBOARDER
PARAMETER
MESSAGE OUTPUT FOR
SCROLL GESTURES
ID
Payload
0xA1
Fingers diamHi Diam
byte
Uint8
Uint8
centerX center
Uint16 Uint16
Uint16
ID: 0xA1
Payload:
uint8 fingers; // number of fingers touching
uint8 diamHi; // bits 16 to 23 of diameter
uint16 diam; // bits 0 to 15 of diameter
uint16 centerX; // x of center of gravity
uint16 centerY; // y of center of gravity
Currently diamHi can be ignored. It is here for future
compatibility.
11.3
Tap Gestures
There is also support in the gesture recognizer to
detect short taps on the surface. The implemented
algorithm also supports detection of repeated taps as
well as taps with multiple fingers.
DS40001803A-page 46
At least one finger has to be inside the area enclosed
by TapBorder to start tap recognition, while the other
fingers may be either outside or inside. So for a one
finger tap the finger has to be inside, while for a two
finger tap, one finger must be inside, while the second
can be either inside or outside.
This is done because a user moving around at the
edges of the surface might enter and leave the actual
area where touch is detected for very short moments
and thereby trigger accidental tap events. By requiring
at least one finger to be inside a smaller area, this can
be prevented.
Preliminary
2015 Microchip Technology Inc.
MTCH6303
TABLE 11-4:
ID
PARAMETERS ASSOCIATED
WITH THE TAP RECOGNIZER
Name
Type
Default
(Sensor:
10137_100h)
0x0540 TapBorder.Left
uint16 256
0x0541 TapBorder.Right
uint16 4864
0x0542 TapBorder.Top
uint16 256
0x0543 TapBorder.Bottom
uint16 8960
0x0544 TapTimeout
uint32
31250
(200ms)
0x0545 RepeatTimeout
uint32
78125
(500ms)
The EQFINGERS flag indicates that the previous tap
was performed with the same number of fingers
touching the surface than the current one.
Having all those flags allows the user to decide whether
to distinguish between repeated taps and single
isolated taps or not to do so by either looking at the
REPEAT/NOREPEAT flags or by ignoring them.
Likewise, the user may decide if a repeated tap should
only be considered a repeated tap if it was performed
with the same number of fingers as the previous tap by
simply looking at the EQFINGERS field in addition to
the REPEAT field. If the user instead does not care if a
repeated tap has been performed with a different
number of fingers, he can ignore the EQFINGERS flag.
That way the user can chose the behavior which fits the
application best.
The unit for the timeouts is 1s/156250, so a value of
31250 corresponds to 200 milliseconds and a value of
78125 to 500 milliseconds.
The border is in units of internal digitizer resolution,
without any coordinate transformation such as scaling
or flipping applied.
TABLE 11-5:
MESSAGE OUTPUT FOR
SWIPE GESTURES
ID
Payload
0xA2
Flags
Fingers
byte
Uint8
Uint8
ID: A2
Payload:
uint8 flags; // flags with details about the tap
uint8 fingers; // number of fingers for this tap.
The flags field is a bitmask where the following values
could be logically or-ed together:
TAPPED 0x01
ABORTED 0x02
NOREPEAT 0x04
REPEAT 0x08
EQFINGERS 0x10
If TAPPED is set it means that a tap has occurred, in
that case the “fingers” field contains the number of
fingers used for this tap.
The ABORTED flag is set if tap recognition has been
aborted because TapTimeout has expired (part A of
previous drawing). In this case the “fingers” field is not
valid.
The REPEAT/NOREPEAT flags can be used to
distinguish between taps which happened within a
timespan of RepeatTimeout from the previous tap, or
from which the previous tap has been a longer while
back.
2015 Microchip Technology Inc.
Preliminary
DS40001803A-page 47
MTCH6303
12.0
ELECTRICAL SPECIFICATIONS
Absolute Maximum Ratings for the MTCH6303 devices
are listed below. Stresses above those listed under the
Absolute Maximum Ratings may cause permanent
damage to the device. This is a stress rating only and
functional operation of the device at those or any other
conditions, above those indicated in the operation
listings of this specification, is not implied. Exposure to
maximum rating conditions for extended periods may
affect device reliability.
Absolute Maximum Ratings(†)
Ambient temperature under bias ......................................................................................................... -40°C to +85°C
Storage temperature ........................................................................................................................ -65°C to +150°C
Voltage on pins with respect to VSS
on VDD pin................................................................................................................................. -0.3V to +4.0V
on any pin that is not 5V tolerant(2) ................................................................................ -0.3V to (VDD + 0.3V)
on any 5V tolerant pin when VDD 2.3V(2) .............................................................................. -0.3V to +6.0V
on any 5V tolerant pin when VDD 2.3V(2) .............................................................................. -0.3V to +3.6V
Voltage on D+ or D- pin with respect to VUSB3V3 ............................................................. -0.3V to (VUSB3V3 + 0.3V)
Voltage on VBUS with respect to VSS .................................................................................................. -0.3V to + 5.5V
Maximum current
out of VSS pin(s)................................................................................................................................... 200 mA
into VDD pin(s)(1) .................................................................................................................................. 200 mA
Maximum output current
sourced/sunk by any 4x I/O pin ............................................................................................................. 15 mA
sourced/sunk by any 8x I/O pin ............................................................................................................. 25 mA
Maximum current sunk by all ports ................................................................................................................. 150 mA
Maximum current sourced by all ports(1) ......................................................................................................... 150 mA
Note 1:
2:
Maximum allowable current is a function of device maximum power dissipation (see Table 12-2)
See the Pin Diagram section for the 5V tolerant pins.
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
This device is sensitive to ESD damage and must be handled appropriately. Failure to properly handle and protect
the device in an application may cause partial to complete failure of the device.
12.1
DC Characteristics: MTCH6303
Rating
Supply Voltage
DS40001803A-page 48
Min.
Typ.†
Max.
Units
2.3
—
3.6
V
Preliminary
Conditions
2015 Microchip Technology Inc.
MTCH6303
TABLE 12-1:
THERMAL OPERATING CONDITIONS
Rating
Symbol
Min.
Typical
Max.
Unit
Operating Junction Temperature Range
TJ
-40
—
+125
°C
Operating Ambient Temperature Range
TA
-40
—
+85
°C
Industrial Temperature Devices
Power Dissipation:
Internal Chip Power Dissipation:
PINT = VDD x (IDD – S IOH)
PD
PINT + PI/O
W
PDMAX
(TJ – TA)/JA
W
I/O Pin Power Dissipation:
I/O = S (({VDD – VOH} x IOH) + S (VOL x IOL))
Maximum Allowed Power Dissipation
TABLE 12-2:
THERMAL PACKAGING CHARACTERISTICS
Characteristics
Symbol
Typical
Max.
Unit
Package Thermal Resistance, 64-pin QFN (9x9x0.9 mm)(1)
JA
28
—
°C/W
Package Thermal Resistance, 64-pin TQFP (10x10x1 mm)(1)
JA
47
—
°C/W
Note 1:
Junction to ambient thermal resistance, Theta-JA (JA) numbers are achieved by package simulations.
TABLE 12-3:
DC TEMPERATURE AND VOLTAGE SPECIFICATIONS
Standard Operating Conditions:
(unless otherwise stated)
2.3V to 3.6V
Operating temperature -40°C TA +85°C for Industrial
DC CHARACTERISTICS
Param.
Symbol
No.
Characteristics
Min.
Typical
Max.
Units
Conditions
Operating Voltage
DC10
VDD
Supply Voltage
2.3
—
3.6
V
—
DC12
VDR
RAM Data Retention Voltage
(Note 1)
1.75
—
—
V
—
DC16
VPOR
VDD Start Voltage
to Ensure Internal
Power-on Reset Signal
1.75
—
2.1
V
—
DC17
SVDD
VDD Rise Rate
to Ensure Internal
Power-on Reset Signal
0.00005
—
0.115
V/s
—
Note 1:
This is the limit to which VDD can be lowered without losing RAM data.
2015 Microchip Technology Inc.
Preliminary
DS40001803A-page 49
MTCH6303
TABLE 12-4:
DC CHARACTERISTICS: I/O PIN INPUT SPECIFICATIONS
DC CHARACTERISTICS
Param.
Symb.
No.
Standard Operating Conditions:
(unless otherwise stated)
2.3V to 3.6V
Operating temperature
-40°C TA +85°C for Industrial
Min.
Typ.(1)
Max.
Units
I/O Pins
VSS
—
0.2 VDD
V
SDAx, SCLx
VSS
—
0.3 VDD
V
SDAx, SCLx
VSS
—
0.8
V
0.25 VDD + 0.8V
—
5.5
V
I/O Pins 5V-tolerant(4)
0.65 VDD
—
5.5
V
SDAx, SCLx
0.65 VDD
—
5.5
V
SDAx, SCLx
2.1
—
5.5
V
I/O Ports
—
—
+1
A
VSS VPIN VDD,
Pin at high-impedance
Analog Input Pins
—
—
+1
A
VSS VPIN VDD,
Pin at high-impedance
MCLR(2)
—
—
+1
A
VSS VPIN VDD
Characteristics
Conditions
Input Low Voltage
DI18
VIL
DI19
Input High Voltage
I/O Pins 5V-tolerant with
PMP(4)
VIH
DI28
DI29
(Note 5)
Input Leakage Current(3)
DI50
IIL
DI51
DI55
Note 1:
2:
3:
4:
5:
6:
7:
8:
9:
Data in “Typical” column is at 3.3V, 25°C unless otherwise stated. Parameters are for design guidance
only and are not tested.
The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified
levels represent normal operating conditions. Higher leakage current may be measured at different input
voltages.
Negative current is defined as current sourced by the pin.
See the Pin Diagram section for the 5V tolerant pins.
The VIH specifications are only in relation to externally applied inputs, and not with respect to the
user-selectable internal pull-ups. External open-drain input signals utilizing the internal pull-ups of the
PIC32 device are ensured to be recognized only as a logic “high” internally to the PIC32 device,
provided that the external load does not exceed the minimum value of ICNPU. For External “input” logic
inputs that require a pull-up source, to ensure the minimum VIH of those components, it is recommended to use an external pull-up resistor rather than the internal pull-ups of the PIC32 device.
VIH source > (VDD + 0.3) for non-5V tolerant pins only.
Digital 5V tolerant pins do not have an internal high side diode to VDD, and therefore, cannot tolerate any
“positive” input injection current.
Injection currents > | 0 | can affect the ADC results by approximately 4 to 6 counts (i.e., VIH Source > (VDD
+ 0.3) or VIL source < (VSS - 0.3)).
Any number and/or combination of I/O pins not excluded under IICL or IICH conditions are permitted
provided the “absolute instantaneous” sum of the input injection currents from all pins do not exceed the
specified limit. If Note 7, IICL = (((Vss - 0.3) - VIL source) / Rs). If Note 8, IICH = ((IICH source - (VDD + 0.3))
/ RS). RS = Resistance between input source voltage and device pin. If (VSS - 0.3) VSOURCE (VDD +
0.3), injection current = 0.
DS40001803A-page 50
Preliminary
2015 Microchip Technology Inc.
MTCH6303
TABLE 12-4:
DC CHARACTERISTICS: I/O PIN INPUT SPECIFICATIONS (CONTINUED)
DC CHARACTERISTICS
Param.
Symb.
No.
Characteristics
Standard Operating Conditions:
(unless otherwise stated)
2.3V to 3.6V
Operating temperature
-40°C TA +85°C for Industrial
Min.
Typ.(1)
Max.
Units
Conditions
Pins with Analog
functions. Exceptions:
[N/A] = 0 mA max
DI60a
IICL
Input Low Injection
Current
0
—
-5
(6,9)
mA
Digital 5V tolerant designated pins. Exceptions:
[N/A] = 0 mA max
Digital non-5V tolerant
designated pins.
Exceptions:
[N/A] = 0 mA max
Note 1:
2:
3:
4:
5:
6:
7:
8:
9:
Data in “Typical” column is at 3.3V, 25°C unless otherwise stated. Parameters are for design guidance
only and are not tested.
The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified
levels represent normal operating conditions. Higher leakage current may be measured at different input
voltages.
Negative current is defined as current sourced by the pin.
See the Pin Diagram section for the 5V tolerant pins.
The VIH specifications are only in relation to externally applied inputs, and not with respect to the
user-selectable internal pull-ups. External open-drain input signals utilizing the internal pull-ups of the
PIC32 device are ensured to be recognized only as a logic “high” internally to the PIC32 device,
provided that the external load does not exceed the minimum value of ICNPU. For External “input” logic
inputs that require a pull-up source, to ensure the minimum VIH of those components, it is recommended to use an external pull-up resistor rather than the internal pull-ups of the PIC32 device.
VIH source > (VDD + 0.3) for non-5V tolerant pins only.
Digital 5V tolerant pins do not have an internal high side diode to VDD, and therefore, cannot tolerate any
“positive” input injection current.
Injection currents > | 0 | can affect the ADC results by approximately 4 to 6 counts (i.e., VIH Source > (VDD
+ 0.3) or VIL source < (VSS - 0.3)).
Any number and/or combination of I/O pins not excluded under IICL or IICH conditions are permitted
provided the “absolute instantaneous” sum of the input injection currents from all pins do not exceed the
specified limit. If Note 7, IICL = (((Vss - 0.3) - VIL source) / Rs). If Note 8, IICH = ((IICH source - (VDD + 0.3))
/ RS). RS = Resistance between input source voltage and device pin. If (VSS - 0.3) VSOURCE (VDD +
0.3), injection current = 0.
2015 Microchip Technology Inc.
Preliminary
DS40001803A-page 51
MTCH6303
TABLE 12-4:
DC CHARACTERISTICS: I/O PIN INPUT SPECIFICATIONS (CONTINUED)
DC CHARACTERISTICS
Param.
Symb.
No.
Characteristics
Standard Operating Conditions:
(unless otherwise stated)
2.3V to 3.6V
Operating temperature
-40°C TA +85°C for Industrial
Min.
Typ.(1)
Max.
Units
Conditions
Pins with Analog
functions. Exceptions:
[SOSCI] = 0 mA max.
DI60b
IICH
Input High Injection
Current
0
—
+5(7,8,9)
mA
Digital 5V tolerant designated pins (VIH < 5.5V)(8).
Exceptions: [All] = 0 mA
max.
Digital non-5V tolerant
designated pins.
Exceptions:
[N/A] = 0 mA max.
IICT
DI60c
Note 1:
2:
3:
4:
5:
6:
7:
8:
9:
Total Input Injection
Current (sum of all I/O
and control pins)
-20(11)
—
+20(9)
mA
Absolute instantaneous
sum of all ± input injection
currents from all I/O pins
( | IICL + | IICH | ) IICT
Data in “Typical” column is at 3.3V, 25°C unless otherwise stated. Parameters are for design guidance
only and are not tested.
The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified
levels represent normal operating conditions. Higher leakage current may be measured at different input
voltages.
Negative current is defined as current sourced by the pin.
See the Pin Diagram section for the 5V tolerant pins.
The VIH specifications are only in relation to externally applied inputs, and not with respect to the
user-selectable internal pull-ups. External open-drain input signals utilizing the internal pull-ups of the
PIC32 device are ensured to be recognized only as a logic “high” internally to the PIC32 device,
provided that the external load does not exceed the minimum value of ICNPU. For External “input” logic
inputs that require a pull-up source, to ensure the minimum VIH of those components, it is recommended to use an external pull-up resistor rather than the internal pull-ups of the PIC32 device.
VIH source > (VDD + 0.3) for non-5V tolerant pins only.
Digital 5V tolerant pins do not have an internal high side diode to VDD, and therefore, cannot tolerate any
“positive” input injection current.
Injection currents > | 0 | can affect the ADC results by approximately 4 to 6 counts (i.e., VIH Source > (VDD
+ 0.3) or VIL source < (VSS - 0.3)).
Any number and/or combination of I/O pins not excluded under IICL or IICH conditions are permitted
provided the “absolute instantaneous” sum of the input injection currents from all pins do not exceed the
specified limit. If Note 7, IICL = (((Vss - 0.3) - VIL source) / Rs). If Note 8, IICH = ((IICH source - (VDD + 0.3))
/ RS). RS = Resistance between input source voltage and device pin. If (VSS - 0.3) VSOURCE (VDD +
0.3), injection current = 0.
DS40001803A-page 52
Preliminary
2015 Microchip Technology Inc.
MTCH6303
TABLE 12-5:
DC CHARACTERISTICS: I/O PIN OUTPUT SPECIFICATIONS
Standard Operating Conditions:
(unless otherwise stated)
2.3V to 3.6V
Operating temperature -40°C TA +85°C for Industrial
DC CHARACTERISTICS
Param. Symbol
DO10
DO20
VOL
VOH
DO20A VOH1
Note 1:
Characteristic
Min.
Typ.
Max.
Units
Conditions
Output Low Voltage
I/O Pins:
4x Sink Driver Pins – All I/O
output pins not defined as 8x
Sink Driver pins
—
—
0.4
V
IOL 9 mA, VDD = 3.3V
Output Low Voltage
I/O Pins:
8x Sink Driver Pins – RC15,
RD2, RD10, RF6, RG6
—
—
0.4
V
IOL 15 mA, VDD = 3.3V
Output High Voltage
I/O Pins:
4x Source Driver Pins – All I/O
output pins not defined as 8x
Source Driver pins
2.4
—
—
V
IOH -10 mA, VDD = 3.3V
Output High Voltage
I/O Pins:
8x Source Driver Pins – RC15,
RD2, RD10, RF6, RG6
2.4
—
—
V
IOH -15 mA, VDD = 3.3V
Output High Voltage
I/O Pins:
4x Source Driver Pins – All I/O
output pins not defined as 8x
Sink Driver pins
1.5(1)
—
—
2.0(1)
—
—
3.0(1)
—
—
IOH -7 mA, VDD = 3.3V
Output High Voltage
I/O Pins:
8x Source Driver Pins – RC15,
RD2, RD10, RF6, RG6
1.5(1)
—
—
IOH -22 mA, VDD = 3.3V
2.0(1)
—
—
3.0(1)
—
—
Note 1:
IOH -18 mA, VDD = 3.3V
V
IOH -10 mA, VDD = 3.3V
ELECTRICAL CHARACTERISTICS: BOR
Standard Operating Conditions:
(unless otherwise stated)
2.3V to 3.6V
Operating temperature -40°C TA +85°C for Industrial
DC CHARACTERISTICS
BO10
IOH -12 mA, VDD = 3.3V
V
Parameters are characterized, but not tested.
TABLE 12-6:
Param.
No.
IOH -14 mA, VDD = 3.3V
Symbol
VBOR
Characteristics
BOR Event on VDD transition
high-to-low
Min.(1)
Typical
Max.
Units
Conditions
2.0
—
2.3
V
—
Parameters are for design guidance only and are not tested in manufacturing.
2015 Microchip Technology Inc.
Preliminary
DS40001803A-page 53
MTCH6303
12.2
AC Characteristics and Timing
Parameters
The information contained in this section defines
MTCH6303 AC characteristics and timing parameters.
FIGURE 12-1:
LOAD CONDITIONS FOR DEVICE TIMING SPECIFICATIONS
Load Condition 1 – for all pins except OSC2
Load Condition 2 – for OSC2
VDD/2
CL
Pin
RL
VSS
CL
Pin
RL = 464
CL = 50 pF for all pins
50 pF for OSC2 pin (EC mode)
VSS
TABLE 12-7:
CAPACITIVE LOADING REQUIREMENTS ON OUTPUT PINS
AC CHARACTERISTICS
Standard Operating Conditions:
(unless otherwise stated)
2.3V to 3.6V
Operating temperature -40°C TA +85°C for Industrial
Param.
Symbol
No.
Min.
Typical(1)
Max.
Units
OSC2 pin
—
—
15
pF
In XT and HS modes when an
external crystal is used to drive
OSC1
DO50a CSOSC
SOSCI/SOSCO pins
—
33
—
pF
Epson P/N: MC-306
32.7680K-A0:ROHS
DO56
CIO
All I/O pins and OSC2
—
—
50
pF
EC mode
DO58
CB
SCLx, SDAx
—
—
400
pF
In I2C™ mode
DO50
COSCO
Note 1:
Characteristics
Conditions
Data in “Typical” column is at 3.3V, 25°C unless otherwise stated. Parameters are for design guidance only
and are not tested.
FIGURE 12-2:
EXTERNAL CLOCK TIMING
OS20
OS30
OS31
OSC1
OS30
DS40001803A-page 54
Preliminary
OS31
2015 Microchip Technology Inc.
MTCH6303
TABLE 12-8:
EXTERNAL CLOCK TIMING REQUIREMENTS
Standard Operating Conditions:
(unless otherwise stated)
2.3V to 3.6V
Operating temperature -40°C TA +85°C for Industrial
AC CHARACTERISTICS
Param.
No.
Symbol
Characteristics
Min.
Typical(1)
Max.
Units
Conditions
OS11
FOSC
Oscillator Crystal Frequency
—
8
—
MHz
OS20
TOSC
TOSC = 1/FOSC = TCY (1)
—
—
—
—
See parameter
OS10 for FOSC
value
OS41
TFSCM
Primary Clock Fail Safe
Time-out Period
—
2
—
ms
(Note)
OS42
GM
External Oscillator
Transconductance (Primary
Oscillator only)
—
12
—
mA/V
Note 1:
The external clock is required for USB operation and not needed for I2C™ operation.
FIGURE 12-3:
XT (Note)
VDD = 3.3V,
TA = +25°C
(Note)
I2C™ BUS START/STOP BITS TIMING CHARACTERISTICS
SCLx
IS34
IS31
IS30
IS33
SDAx
Stop
Condition
Start
Condition
Note: Refer to Figure 12-1 for load conditions.
FIGURE 12-4:
I2C™ BUS DATA TIMING CHARACTERISTICS
IS20
IS21
IS11
IS10
SCLx
IS30
IS26
IS31
IS25
IS33
SDAx
In
IS40
IS40
IS45
SDAx
Out
Note: Refer to Figure 12-1 for load conditions.
2015 Microchip Technology Inc.
Preliminary
DS40001803A-page 55
MTCH6303
TABLE 12-9:
I2C™ BUS DATA TIMING REQUIREMENTS
Standard Operating Conditions:
(unless otherwise stated)
2.3V to 3.6V
Operating temperature -40°C TA +85°C for Industrial
AC CHARACTERISTICS
Param.
No.
IS10
Symbol
TLO:SCL
Characteristics
Clock Low Time
Min.
Max.
Units
Conditions
100 kHz mode
4.7
—
s
PBCLK must operate at a
minimum of 800 kHz
400 kHz mode
1.3
—
s
PBCLK must operate at a
minimum of 3.2 MHz
100 kHz mode
4.0
—
s
PBCLK must operate at a
minimum of 800 kHz
400 kHz mode
0.6
—
s
PBCLK must operate at a
minimum of 3.2 MHz
CB is specified to be from
10 to 400 pF
IS11
THI:SCL
Clock High Time
IS20
TF:SCL
SDAx and SCLx
Fall Time
100 kHz mode
—
300
ns
400 kHz mode
20 + 0.1 CB
300
ns
IS21
TR:SCL
SDAx and SCLx
Rise Time
100 kHz mode
—
1000
ns
400 kHz mode
20 + 0.1 CB
300
ns
IS25
TSU:DAT
Data Input
Setup Time
100 kHz mode
250
—
ns
400 kHz mode
100
—
ns
IS26
THD:DAT
Data Input
Hold Time
100 kHz mode
0
—
ns
400 kHz mode
0
0.9
s
—
IS30
TSU:STA
Start Condition
Setup Time
100 kHz mode
4700
—
ns
400 kHz mode
600
—
ns
Only relevant for Repeated
Start condition
IS31
THD:STA
Start Condition
Hold Time
100 kHz mode
4000
—
ns
400 kHz mode
600
—
ns
IS33
TSU:STO
Stop Condition
Setup Time
100 kHz mode
4000
—
ns
400 kHz mode
600
—
ns
IS34
THD:STO
Stop Condition
Hold Time
100 kHz mode
4000
—
ns
400 kHz mode
600
—
ns
IS40
TAA:SCL
Output Valid from 100 kHz mode
Clock
400 kHz mode
0
3500
ns
0
1000
ns
100 kHz mode
4.7
—
s
IS45
TBF:SDA
Bus Free Time
400 kHz mode
1.3
—
s
The amount of time the bus
must be free before a new
transmission can start
IS50
CB
Bus Capacitive Loading
—
400
pF
—
DS40001803A-page 56
Preliminary
CB is specified to be from
10 to 400 pF
—
After this period, the first
clock pulse is generated
—
—
—
2015 Microchip Technology Inc.
MTCH6303
13.0
ORDERING INFORMATION
TABLE 13-1:
ORDERING INFORMATION
Part Number
Pin Package
Packing
MTCH6303-I/PT
64-Lead TQFP (10x10mm)
Tray
MTCH6303-I/RG
64-Lead QFN (9x9mm)
Tube
MTCH6303T-I/PT
64-Lead TQFP (10x10mm)
T/R
MTCH6303T-I/RG
64-Lead QFN (9x9mm)
T/R
2015 Microchip Technology Inc.
Preliminary
DS40001803A-page 57
MTCH6303
14.0
PACKAGING INFORMATION
14.1
Package Marking Information
64-Lead QFN (9x9x0.9 mm)
Example
PIN 1
PIN 1
XXXXXXXXXXX
XXXXXXXXXXX
XXXXXXXXXXX
YYWWNNN
MTCH6303
1524017
64-Lead TQFP (10x10x1 mm)
Example
XXXXXXXXXX
XXXXXXXXXX
XXXXXXXXXX
YYWWNNN
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
DS40001803A-page 58
MTCH6303
1524017
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC® designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
Preliminary
2015 Microchip Technology Inc.
MTCH6303
14.2
Package Details
The following sections give the technical details of the packages.
64-Terminal Plastic Quad Flat Pack, No Lead (RG) 9x9x0.9 mm Body [QFN]
Saw Singulated
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
A
B
N
1
2
NOTE 1
E
(DATUM B)
(DATUM A)
2X
0.20 C
2X
TOP VIEW
0.20 C
DETAIL A
0.10 C
C
SEATING PLANE
(A3)
A
SIDE VIEW
0.10
D2
C A B
0.10
C A B
E2
e
2
NOTE 1
64X (K)
2
1
N
64X L
e
BOTTOM VIEW
64X b
0.10
0.05
C A B
C
Microchip Technology Drawing C04-260A Sheet 1 of 2
2015 Microchip Technology Inc.
Preliminary
DS40001803A-page 59
MTCH6303
64-Terminal Plastic Quad Flat Pack, No Lead (RG) 9x9x0.9 mm Body [QFN]
Saw Singulated
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
C
A1
SEATING PLANE
64X
0.08 C
DETAIL A
Units
Dimension Limits
N
Number of Terminals
e
Pitch
Overall Height
A
Standoff
A1
Standoff
A3
E
Overall Width
E2
Exposed Pad Width
Overall Length
D
D2
Exposed Pad Length
Terminal Width
b
L
Terminal Length
K
Terminal-to-Exposed-Pad
MIN
0.80
0.00
4.60
4.60
0.15
0.30
MILLIMETERS
NOM
64
0.50 BSC
0.85
0.02
0.20 REF
9.00 BSC
4.70
9.00 BSC
4.70
0.20
0.40
1.755 REF
MAX
0.90
0.05
4.80
4.80
0.25
0.50
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-260A Sheet 2 of 2
DS40001803A-page 60
Preliminary
2015 Microchip Technology Inc.
MTCH6303
64-Lead Very Thin Plastic Quad Flat, No Lead Package (RG) - 9x9x1.0 mm Body [QFN]
4.7x4.7 mm Exposed Pad
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
C1
X2
C2
Y2
(G1)
Y1
Y1
SILK SCREEN
E
RECOMMENDED LAND PATTERN
Units
Dimension Limits
E
Contact Pitch
Optional Center Pad Width
X2
Optional Center Pad Length
Y2
Contact Pad Spacing
C1
Contact Pad Spacing
C2
Contact Pad Width (X64)
X1
Contact Pad Length (X64)
Y1
Contact Pad to Center Pad (X64)
G1
MIN
MILLIMETERS
NOM
0.50 BSC
MAX
4.80
4.80
8.90
8.90
0.25
0.85
1.625 REF
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-2260A
2015 Microchip Technology Inc.
Preliminary
DS40001803A-page 61
MTCH6303
64-Lead Plastic Thin Quad Flatpack (PT)-10x10x1 mm Body, 2.00 mm Footprint [TQFP]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
D1
D1/2
D
NOTE 2
A
B
E1/2
E1
A
E
A
SEE DETAIL 1
N
4X N/4 TIPS
0.20 C A-B D
1 3
2
4X
NOTE 1
0.20 H A-B D
TOP VIEW
A2
A
0.05
C
SEATING
PLANE
0.08 C
64 X b
0.08
e
A1
C A-B D
SIDE VIEW
Microchip Technology Drawing C04-085C Sheet 1 of 2
DS40001803A-page 62
Preliminary
2015 Microchip Technology Inc.
MTCH6303
64-Lead Plastic Thin Quad Flatpack (PT)-10x10x1 mm Body, 2.00 mm Footprint [TQFP]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
H
c
E
L
(L1)
T
X=A—B OR D
X
SECTION A-A
e/2
DETAIL 1
Notes:
Units
Dimension Limits
Number of Leads
N
e
Lead Pitch
Overall Height
A
Molded Package Thickness
A2
Standoff
A1
Foot Length
L
Footprint
L1
I
Foot Angle
Overall Width
E
Overall Length
D
Molded Package Width
E1
Molded Package Length
D1
c
Lead Thickness
b
Lead Width
D
Mold Draft Angle Top
E
Mold Draft Angle Bottom
MIN
0.95
0.05
0.45
0°
0.09
0.17
11°
11°
MILLIMETERS
NOM
64
0.50 BSC
1.00
0.60
1.00 REF
3.5°
12.00 BSC
12.00 BSC
10.00 BSC
10.00 BSC
0.22
12°
12°
MAX
1.20
1.05
0.15
0.75
7°
0.20
0.27
13°
13°
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or
protrusions shall not exceed 0.25mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-085C Sheet 2 of 2
2015 Microchip Technology Inc.
Preliminary
DS40001803A-page 63
MTCH6303
64-Lead Plastic Thin Quad Flatpack (PT)-10x10x1 mm Body, 2.00 mm Footprint [TQFP]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
C1
E
C2
G
Y1
X1
RECOMMENDED LAND PATTERN
Units
Dimension Limits
E
Contact Pitch
Contact Pad Spacing
C1
Contact Pad Spacing
C2
Contact Pad Width (X28)
X1
Contact Pad Length (X28)
Y1
Distance Between Pads
G
MIN
MILLIMETERS
NOM
0.50 BSC
11.40
11.40
MAX
0.30
1.50
0.20
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-2085B Sheet 1 of 1
DS40001803A-page 64
Preliminary
2015 Microchip Technology Inc.
MTCH6303
APPENDIX A:
REVISION HISTORY
Revision A (06/2015)
Initial release of this document.
2015 Microchip Technology Inc.
Preliminary
DS40001803A-page 65
MTCH6303
THE MICROCHIP WEB SITE
CUSTOMER SUPPORT
Microchip provides online support via our web site at
www.microchip.com. This web site is used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the web site contains the following
information:
Users of Microchip products can receive assistance
through several channels:
• Product Support – Data sheets and errata,
application notes and sample programs, design
resources, user’s guides and hardware support
documents, latest software releases and archived
software
• General Technical Support – Frequently Asked
Questions (FAQ), technical support requests,
online discussion groups, Microchip consultant
program member listing
• Business of Microchip – Product selector and
ordering guides, latest Microchip press releases,
listing of seminars and events, listings of
Microchip sales offices, distributors and factory
representatives
•
•
•
•
Distributor or Representative
Local Sales Office
Field Application Engineer (FAE)
Technical Support
Customers
should
contact
their
distributor,
representative or Field Application Engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.
Technical support is available through the web site
at: http://www.microchip.com/support
CUSTOMER CHANGE NOTIFICATION
SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specified product family or development tool of interest.
To register, access the Microchip web site at
www.microchip.com. Under “Support”, click on
“Customer Change Notification” and follow the
registration instructions.
DS40001803A-page 66
Preliminary
2015 Microchip Technology Inc.
MTCH6303
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
[X](1)
X
/XX
XXX
Tape and Reel
Option
Temperature
Range
Package
Pattern
PART NO.
Device
Device:
MTCH6303
Tape and Reel
Option:
Blank
T
= Standard packaging (tube or tray)
= Tape and Reel(1)
Temperature
Range:
I
= -40C to
RG
PT
=
=
Package:
+85C
Examples:
a)
MTCH6303-I/PT = Industrial Temp TQFP
package.
(Industrial)
QFN
TQFP
Note 1:
Pattern:
QTP, SQTP, Code or Special Requirements
(blank otherwise)
2015 Microchip Technology Inc.
Preliminary
Tape and Reel identifier only appears in the
catalog part number description. This
identifier is used for ordering purposes and
is not printed on the device package. Check
with your Microchip Sales Office for package
availability with the Tape and Reel option.
DS40001803A-page 67
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer,
LANCheck, MediaLB, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC,
SST, SST Logo, SuperFlash and UNI/O are registered
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
The Embedded Control Solutions Company and mTouch are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo,
CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit
Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet,
KleerNet logo, MiWi, MPASM, MPF, MPLAB Certified logo,
MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code
Generation, PICDEM, PICDEM.net, PICkit, PICtail,
RightTouch logo, REAL ICE, SQI, Serial Quad I/O, Total
Endurance, TSHARC, USBCheck, VariSense, ViewSpan,
WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2015, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
ISBN: 978-1-63277-531-3
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
DS40001803A-page 68
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
Preliminary
2015 Microchip Technology Inc.
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2943-5100
Fax: 852-2401-3431
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
Germany - Dusseldorf
Tel: 49-2129-3766400
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
Austin, TX
Tel: 512-257-3370
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
India - Pune
Tel: 91-20-3019-1500
Japan - Osaka
Tel: 81-6-6152-7160
Fax: 81-6-6152-9310
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
Japan - Tokyo
Tel: 81-3-6880- 3770
Fax: 81-3-6880-3771
China - Dongguan
Tel: 86-769-8702-9880
China - Hangzhou
Tel: 86-571-8792-8115
Fax: 86-571-8792-8116
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Detroit
Novi, MI
Tel: 248-848-4000
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
Houston, TX
Tel: 281-894-5983
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Kaohsiung
Tel: 886-7-213-7828
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
New York, NY
Tel: 631-435-6000
San Jose, CA
Tel: 408-735-9110
Canada - Toronto
Tel: 905-673-0699
Fax: 905-673-6509
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Germany - Pforzheim
Tel: 49-7231-424750
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Italy - Venice
Tel: 39-049-7625286
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Poland - Warsaw
Tel: 48-22-3325737
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Sweden - Stockholm
Tel: 46-8-5090-4654
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
01/27/15
2015 Microchip Technology Inc.
Preliminary
DS40001803A-page 69
工商网监
湘ICP备2023018690号
